Class / Patent application number | Description | Number of patent applications / Date published |
034402000 | Gas or vapor pressure varies during treatment | 12 |
20090199426 | Method for the Treatment of Wood or Wood Products - A method for the treatment of wood or wood products, in which method moist wood or wood products ( | 08-13-2009 |
20130061492 | SUPERCRITICAL DRYING METHOD AND SUPERCRITICAL DRYING APPARATUS FOR SEMICONDUCTOR SUBSTRATE - According to one embodiment, a supercritical drying apparatus comprises a chamber being hermetically sealable and configured to store a semiconductor substrate, a heater configured to heat an inner side of the chamber, a supply unit configured to supply carbon dioxide to the chamber, a discharge unit configured to discharge carbon dioxide from the chamber, and a rotation unit configured to rotate the chamber by an angle equal to or greater than 90 degrees and equal to or smaller than 180 degrees with respect to the horizontal direction. | 03-14-2013 |
034403000 | Including subatmospheric pressure | 10 |
20080301972 | EVACUATION METHOD AND STORAGE MEDIUM - An evacuation method which can reduce evacuation time without causing moisture-related problems. In a vacuum processing apparatus including a vacuum processing chamber, during the evacuation for the vacuum processing chamber, the pressure in the vacuum processing chamber is maintained at a pressure lower than or equal to the atmospheric pressure but higher than or equal to 6.7×10 | 12-11-2008 |
20100313441 | APPARATUS AND METHOD FOR DRYING AND STERILIZING OBJECTS IN A LOAD - The removal of moisture from an object to be sterilized is provided through at least the steps of placing the load in the chamber, reducing the pressure within the chamber to increase the rate of evaporation of moisture from the load, monitoring over a predetermined period of time the increase in the quantity of vapor within the chamber resulting from evaporation of moisture from the load, admitting gas into the chamber and repeating the steps following placing the load into the chamber. | 12-16-2010 |
20100319211 | Device and Methods for Rapid Drying of Porous Materials - An apparatus and method for quickly drying porous materials. A sealable chamber is connected to a cold trap which is connected to a vacuum pump. A sample is placed inside the sealable chamber. The vacuum pump is turned on and air is evacuated through the cold trap to the vacuum pump. Because evaporation may lower the temperature inside the sealable chamber, an infrared lamp may be used to heat the chamber and sample therein directly or heated air may be allowed to enter the sealable chamber in response to the vacuum created by the vacuum pump. Air may be drawn directly from the sealable chamber to the vacuum pump bypassing the cold trap. A load cell may be placed in the bottom of the sealable chamber to monitor the weight of a sample to determine if the drying process is complete. Other parameters could be used, including the degree of vacuum achieved in the chamber. The cold trap extracts moisture from the system, which eliminates the possibility of damage to the vacuum and creates an added pressure gradient for removal of air from the sealable chamber. Heating the chamber either by introducing heated air or by direct use of infrared heat facilitates drying of the sample and shortens the drying process. | 12-23-2010 |
20120131813 | Methods and Systems for Drying Materials and Inducing Controlled Phase Changes in Substances - Methods and systems are disclosed for drying a material or, more generally, flash evaporating a target substance having a vapor pressure threshold. The methods and systems include a conveyor conduit that receives material. The material moves through the conveyor and is expelled into a pressure drop zone created by one or more venturi nozzles. As the material encounters the pressure drop zone, the targeted substance in the material experiences a rapid and extreme pressure drop and simultaneously a rapid temperature increase. This causes the target substance in the material to flash evaporate virtually immediately. The resulting vapor is separated from the remaining material and the now dry material is collected for further processing or use. The vapor can be collected, condensed, exhausted, or otherwise treated depending upon the goals of a particular installation or process. | 05-31-2012 |
20130192083 | METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES - Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat. Other embodiments include a desiccator for removing moisture from the air being evacuated from the electronic device prior to the air reaching an evacuation pump. Further embodiments detect humidity within the low-pressure chamber and determine when to increase and/or decrease pressure based on the humidity. Still further embodiments determine that the device is sufficiently dry to restore proper function based on the detected humidity, and in some embodiments based on the changes in humidity while pressure is being increased and/or decreased. Still further alternate embodiments automatically control some or all aspects of the drying of the electronic device. Additional embodiment disinfect the electronic device. | 08-01-2013 |
20140259730 | METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES - Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device. | 09-18-2014 |
20140310975 | LIQUID COALESCENCE AND VACUUM CHAMBER DRYER SYSTEM AND METHOD - A coalescing dryer passes air downwardly through items to be dried in a container. The air can be diverted to change direction following passage of the air through the items to be dried. The moving air causes liquid on the surface of items to be dried to coalesce and travel downwardly and from the items being dried. A vacuum dryer applies a vacuum to the container of items to be dried when placed in a vacuum chamber after pre-drying by the coalescing dryer so as to evaporate liquid in the items to be dried that has not been removed by the coalescing dryer. | 10-23-2014 |
034404000 | With addition of treating agent | 3 |
20120102778 | METHOD OF PRIMING AND DRYING SUBSTRATES - A method of priming and drying substrates having high-aspect ratio trenches. In one aspect, the method comprises: a) supporting at least one substrate having high-aspect ratio trenches in a process chamber having a gaseous atmosphere; b) sealing the process chamber; c) vacuuming the process chamber to achieve a first sub-atmospheric pressure within the process chamber; d) introducing a wetting solution into the process chamber while maintaining the process chamber at a second sub-atmospheric pressure until the substrate is immersed in the wetting solution; e) restoring the process chamber to atmospheric pressure while the substrate remains immersed in the wetting solution; and f) removing the substrate from the wetting solution. | 05-03-2012 |
20150135549 | SUPERCRITICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE - According to one embodiment, a supercritical drying method for a semiconductor substrate comprises introducing a semiconductor substrate, a surface of the semiconductor substrate being wet with a water-soluble organic solvent, to the inside of a chamber, hermetically sealing the chamber and increasing a temperature inside the chamber to not lower than a critical temperature of the water-soluble organic solvent, thereby bringing the water-soluble organic solvent into a supercritical state, decreasing a pressure inside the chamber and changing the water-soluble organic solvent in the supercritical state to a gas, thereby discharging the water-soluble organic solvent from the chamber, starting a supply of an inert gas into the chamber as the pressure inside the chamber decreases to atmospheric pressure, and cooling the semiconductor substrate in a state where the inert gas exists inside the chamber. | 05-21-2015 |
20160025410 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - A substrate treatment apparatus includes a processing chamber configured to be capable of storing a substrate; a substrate holder disposed in the processing chamber and configured to be capable of holding the substrate; a sublimation removing unit configured to remove, by sublimation, a sublimating material filled between structures formed on a surface of a substrate held by the substrate holder, and a sublimation status detecting unit configured to detect a progress or an end point of sublimation removal of the sublimating material. | 01-28-2016 |