| Entries |
| Document | Title | Date |
|---|
| 20080201948 | Method For Producing A Heat Exchanger - The invention relates to a method of manufacturing a heat exchanger ( | 08-28-2008 |
| 20080216317 | Production Method for Radiators - An improved method of producing radiators, for heating plants, comprising a vertical tube ( | 09-11-2008 |
| 20080229580 | Method of manufacturing a brazed micro-channel cold plate heat exchanger assembly - The invention relates to a method of making a brazed micro-channel cold plate assembly for cooling a heat producing electronic component. The primary components of a cold plate assembly are a base plate, a manifold cover, and inlet/outlet pipes; wherein the individual components are assembled and brazed into an integral unit. The joining surfaces of the individual components have novel features that provide for permanent bonding of the joints by brazing and a hermetic seal along the joint seams. The novel features also forestall excess braze alloy from contaminating the interior surfaces of the assembled cold plate and obstructing the engineered flow channels. | 09-25-2008 |
| 20080301941 | Method of manufacturing a cold plate heat exchanger assembly having a metallic compliant gasket - The subject invention provides a method of manufacturing an all-metal cold plate heat exchanger assembly for removing excess heat from a heat generating electronic component. The cold plate assembly includes a base plate having micro-channels and associated micro-fins, a manifold plate having alternating channels, and a manifold cover, wherein the manifold plate cooperates with the micro-channels to form an engineered pathway for coolant flow. This method assures a tight interface sealing between the contact surfaces of the alternating channels of the manifold plate and the coplanar surfaces of the micro-fins that would prevent coolant by-pass flow, but without clogging or jeopardizing the flow through the micro-channels. This method utilizes a layer of recast metallic particulates, which is a natural by-product of laser machining, as a compliant gasket material between the coplanar edges of the alternating channels and the coplanar edges of the micro-fins. | 12-11-2008 |
| 20080307649 | HEAT PIPE APPARATUS AND METHOD - In one embodiment, a thermal protection device for dissipating heat includes a shell having an outer shell surface and an inner shell surface defining a hollow inner shell chamber. A plurality of porous wick structures are disposed against each other within the hollow inner shell chamber. Each porous wick structure comprises an outer wick surface which is disposed at least one of against and near the inner shell surface and a porous inner wick surface defining a hollow inner wick chamber. A plurality of porous wick lid members are provided. The porous wick lid members are disposed between the porous wick structures within the hollow inner shell chamber of the shell. A cooling substance is disposed within the plurality of porous wick structures. | 12-18-2008 |
| 20080307650 | Method of manufacturing heat exchanger and apparatus for manufacturing heat exchanger - In a method of manufacturing a heat exchanger, a liquid resin is applied to an outer surface of the heat exchanger, and then surplus liquid resin is removed from the outer surface. In removing the surplus liquid resin, before a first air having a first velocity is directed to the heat exchanger for blowing the surplus liquid resin off the heat exchanger, a second air having a second velocity lower than the first velocity is directed to the heat exchanger to remove the surplus liquid resin from the heat exchanger by moving the surplus liquid resin along the outer surface of the heat exchanger. The second air is directed toward the heat exchanger by a second blower before the first air is directed toward the heat exchanger by a first blower. | 12-18-2008 |
| 20080313902 | Method for fabricating heat-dissipating base structure - A method for fabricating a heat-dissipating base structure is disclosed. The method includes (1) providing a plurality of heat-dissipating fins arranged in parallel, each having at least a first through hole and a second through hole corresponding to the first through hole formed thereon at corresponding positions; (2) providing at least a U-shaped heat-dissipating tube having two tube foot portions and a bending portion, wherein the diameter of the two tube foot portions is smaller than that of the first and second through holes and the two tube foot portions are inserted into the first and second through holes respectively; (3) performing a dispensing process by penetrating a dispensing tip into the spacing between the U-shaped heat-dissipating tube and the first and second through holes of the heat-dissipating fins; (4) providing a base having a surface for dispensing and mounting the parallel-aligned heat-dissipating fins on the dispensed surface of the base; (5) using at least a clamp tool to tighten the base, the heat-dissipating fins and the U-shaped heat-dissipating tube to be placed in an oven for heating and the subsequent soldering process; and (6) removing the heat-dissipating base from the oven after the heating process and removing the clamp tool after the heat-dissipating base cools off and is fixedly assembled. | 12-25-2008 |
| 20080313903 | Heat Exchanger, Method for Manufacturing the Heat Exchanger, and Method for Manufacturing Heart-Lung Machine - A heat exchange module | 12-25-2008 |
| 20090025222 | Method for manufacturing heat radiator having plate-shaped fins - A gouging tool ( | 01-29-2009 |
| 20090025223 | HEAT EXCHANGER WITH ANGLED SECONDARY FINS EXTENDING FROM PRIMARY FINS - A heat exchanger, method of fabrication and cooled electronics system employing the heat exchanger are provided. The heat exchanger, which in one embodiment cools air provided to heat generating components of a computer system, is disposed at an angle with respect to a direction of airflow. The heat exchanger includes a plurality of primary fins oriented parallel, and at least one plurality of secondary fins extending from at least one of a leading edge and a trailing edge of the plurality of primary fins. Each secondary fin extends from a respective primary fin at an angle other than 0° to facilitate airflow through the heat exchanger. Additionally, the secondary fins are fixedly positioned relative to and integral with the primary fins, thereby providing an increased heat transfer surface area. | 01-29-2009 |
| 20090038153 | THERMAL SPREADER USING THERMAL CONDUITS - A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material. | 02-12-2009 |
| 20090038154 | THERMAL SPREADER USING THERMAL CONDUITS - A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material. | 02-12-2009 |
| 20090044407 | THERMAL CONTACT ARRANGEMENT - A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal contact arrangement may include a first zone formed on a first area of the heat sink and a second zone formed on a second area of the heat sink. The processor may overlap or overlie the first zone, with the second zone generally outside the footprint of the processor and optionally surrounding the processor's footprint. The first zone may have a generally smooth surface, while the second zone may have a surface rougher than the first zone. The first zone may be finished to a specific smoothness while the second zone may be finished to second particular smoothness that is generally less than the first zone. | 02-19-2009 |
| 20090049691 | METHOD FOR EMBEDDING HEAT PIPE INTO HEAT-CONDUCTING SEAT - A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe. | 02-26-2009 |
| 20090113711 | HEAT EXCHANGER AND METHOD FOR MANUFACTURING THE SAME - There is provided a method of manufacturing a heat exchanger, including a first step of mounting an end part of flat tube to a header, assembling the flat tube and fins, and sealing a part where the header and the end part is attached, and a second step of increasing an internal pressure of the flat tube to expand other part of flat tubes aside from the end parts with respect to the end part of the tube in order to make the fins and the other part of the flat tube in contact each other. According to this method of manufacturing, in the second step, the other part of the flat tube that passes through the fins is expanded, so that it is possible to mechanically join the flat tube and the fins, and a plate fin-type heat exchanger with high strength and heat exchange efficiency can be easily provided. | 05-07-2009 |
| 20090126192 | Heat pipe fin stack with extruded base - A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the base plate forming a structural column for air heat exchange fins. The channel in the base plate is parallel to an edge. An additional channel or ridge is provided, also parallel to the edge, for receiving a clamp or spring clip to urge the base plate against the heat source. The base plate is inexpensively extruded with the parallel channels, ridges, etc., extending across the width of the base plate parallel to the edge. The heat sink has a minimum number of inexpensive parts yet is highly thermally efficient. | 05-21-2009 |
| 20090133257 | Cooling tower with direct and indirect cooling sections - A mechanical draft cooling tower includes an air inlet and an air outlet. A liquid spray assembly is provided below the air outlet. A fill shell assembly is provided below the liquid spray assembly such that liquid can be sprayed onto the fill sheet assembly. An indirect heat exchange assembly is mounted beneath the fill sheet assembly. The indirect assembly usually comprises a series of coils through which a fluid to be cooled is circulated. A first air inlet is provided beneath the fill sheet assembly and includes a closing assembly. A second air inlet is provided beneath a top surface of the indirect assembly and includes a closing assembly. | 05-28-2009 |
| 20090139088 | Method of manufacturing heat radiating fin - In a method of manufacturing heat radiating fin, the technique of plastic working, such as stamping, is employed to apply an external force against a sheet metal material serving as a raw material for forming the heat radiating fin, so that the sheet metal material generates plastic deformation to form a plurality of recessed portions on a front side thereof. Meanwhile, a plurality of protruded portions is correspondingly formed on a rear side of the sheet metal material behind the recessed portions. Any two heat radiating fins so manufactured may be easily stacked and connected together with the protruded portions on a rear or higher heat radiating fin partially extended into the recessed portions on a front or lower heat radiating fin. | 06-04-2009 |
| 20090217526 | METHOD FOR PRODUCING AN ADSORPTION HEAT EXCHANGER - The invention relates to a method for producing an adsorption heat exchanger, which is characterized by the following Steps: producing a heat exchanger structure; forming an adhesive layer ( | 09-03-2009 |
| 20090241340 | METHOD OF MANUFACTURING HEAT SINK FOR MEMORY MODULE - A method of manufacturing a heat sink for a memory module is provided to remarkably improve its productivity by treating a plurality of heat sinks, which are arranged at a pre-determined interval, as a single body in detaching, painting and adhesive pad adhering steps to reduce a manufacturing cost, and improve its merchantability by interrupting direct contact between the heat sinks to prevent scratch of the heat sinks. The method of manufacturing a heat sink for a memory module comprises cutting and detaching the heat sink from a metal plate coil by using a press device. The heat sinks are connected to a heat sink molded sheet at a pre-determined interval through a bridge, and are detached from the heat sink molded sheet by the press device. After the cutting and detaching steps, the heat sink molded sheet ( | 10-01-2009 |
| 20090249624 | METHOD OF MAKING HEAT SINK - A method of making a heat sink ( | 10-08-2009 |
| 20090313827 | METHOD AND A TOOL FOR MANUFACTURING HEAT RADIATOR - A method and a tool for manufacturing heat radiators are used to assemble a plurality of radiating fins to a heat transferring base. The method includes the steps of putting the radiating fins on the heat transferring base, putting blades between the radiating fins from at least one side of the heat transferring base, and pressing the blades to deform the heat transferring base to make the heat transferring base tightly fitted with the radiating fins. The tool includes a group of cutters and a pressing part. The cutter has blades having edges and pressing portions opposite to the edges. When the radiating fins are connected to the heat transferring base, the cutter may move between the radiating fins in a direction parallel to the heat transferring base. The pressing part is used for pressing the pressing portion to make the edges deform the heat transferring base, which forces the heat transferring base to be tightly fitted with the radiating fins. | 12-24-2009 |
| 20100031505 | Cross-counterflow heat exchanger assembly - A manifold for use in a heat exchanger assembly and a method of forming the manifold is disclosed herein. The method starts with the step of separately forming a first member at least partially defining an interior and having a spaced set of first tube slots and a second member having a wall positioned against the first tube slots and dividing the interior into a plurality of chambers. The method is finalized with the step of permanently fixing the first member to the second member to define an first manifold after the separately forming step. | 02-11-2010 |
| 20100037461 | PATTERNED STRUCTURE FOR A THERMAL INTERFACE - A method for producing a plate with a first face with protrusions confined by first and second grooves includes steps of: etching recessed zones into a plate; depositing a photoresist layer on the plate; forming a passivation layer over the photoresist layer; removing the passivation layer at the bottom of the recessed zones; electroplating metal in the recessed zones; removing the passivation layer; removing the photoresist layer; and removing the semiconductor material to expose the first and second grooves. | 02-18-2010 |
| 20100083500 | LEVELING METHOD FOR BURYING EVAPORATING SECTION OF HEAT PIPE INTO THERMALLY CONDUCTIVE SEAT - A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die. | 04-08-2010 |
| 20100088891 | METHOD FOR MAKING BRAZED HEAT EXCHANGER AND APPARATUS - Disclosed is a heat exchanger comprising a boiling passage and cooling passage defined by opposite sides of metal walls. Layers of brazing material between the metal walls and a spacer member bond components of the heat exchanger together. An enhanced boiling layer (EBL) comprising metal particles bonded to each other and to a boiling side of the metal wall provides nucleate boiling pores to improve heat transfer. The EBL has a melting temperature that is higher than the melting temperature of the brazing material. Also disclosed is a process for assembling the heat exchanger. | 04-15-2010 |
| 20100101088 | Method of manufacturing a heat sink pedestal device with interface medium chamber - A heat sink pedestal device allows for the use of generic thermal units such as heat sinks. An interposer configured to fit a specific device under test is mounted to a retainer. The retainer firmly holds the interposer in position. In addition, the retainer may be mounted to a thermal unit. An interface sealant with a diameter less than that of the interposer, creating the perimeter of an interface medium chamber, is positioned at the periphery of the interposer between the interposer and the thermal unit. Interface material, having high thermal conductive properties, is positioned within the interface sealant. The interface medium chamber provides a high thermally conductive interface between the interposer and the thermal unit. In addition, the heat sink pedestal device minimizes customization because it allows a single heat sink or thermal unit assembly to be used to accommodate a wide range of unit sizes. | 04-29-2010 |
| 20100242282 | METHODS OF MAKING ENERGY EFFICIENT COOKWARE - Techniques for designing and creating energy efficient cookware are provided. In accordance with the techniques cookware can include a cookware base having a cooking surface and heating surface. The heating surface can have a pattern of fins forming heat exchange channels. The fins can effectively increase surface area and the channels can guide thermal energy to the perimeter of the cookware base while the fins absorb the thermal energy. The channel fins can improve energy transfer while providing even distribution throughout the cooking surface. The use of fins can also improve the mechanical strength to the cookware. Methods of making the energy efficient cookware are provided. A piece of cookware with a thick base can be provided by casting and by bonding a metal plate to the cookware body. Within the base, heat exchange channels are created by manufacturing processes such as casting or cutting to improve heat transfer. | 09-30-2010 |
| 20100251547 | METHOD OF MANUFACTURING A HEAT TRANSPORT DEVICE, HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND CAULKING PIN - A method of manufacturing a heat transport device includes injecting a working fluid that transports heat by a phase change into a casing through an injection opening of the casing under reduced pressure, sealing an injection path by caulking under the reduced pressure, the injection path being provided in the casing into which the working fluid is injected and causing the injection opening and an action area in which the phase change of the working fluid occurs to communicate with each other, contacting a peripheral area of the injection opening of the casing with an inner surface of the injection path by caulking the peripheral area, the peripheral area including the injection opening, and sealing the injection opening by welding a part of the casing contacted. | 10-07-2010 |
| 20100257734 | RADIATOR MANUFACTURING METHOD AND ALIGNING-AND-MOVING MECHANISM THEREOF - A method for manufacturing a radiator including preparing, aligning, punching, bending, shearing and riveting, rotating, and removing processes is provided. The shearing, riveting, and rotating processes are repeated. A sheet metal is continuously punched to form a plurality of heat dissipation fins in a manufacturing machine, the heat dissipation fins are then orderly sheared, inserted into the metal base, and further fixed with the metal base by two-direction riveting. The radiator can thus be obtained in an automatic and faster process without unnecessary assembling steps with higher yield and reduced costs. | 10-14-2010 |
| 20100269341 | Green sink - It is an object of this invention to provide a method of maintaining a constant or variable water temperature in kitchen sinks, bathroom sinks, bathtubs, baby tubs, pet dishes (stop from freezing in the winter) and a wide variety of liquid containers such as cattle and horse water troughs, banquet food warmers (to replace sterno heat source) commercial sinks an portable liquid containers. For example, keeping the water warm or hot enough to do more dishes without draining the sink of cold water in order to replace it with warm or hot water, could potentially save millions of gallons of water across the country every day. | 10-28-2010 |
| 20100269342 | METHOD OF MAKING RADIAL DESIGN OXYGENATOR WITH HEAT EXCHANGER - Described is a method of making an apparatus for oxygenating and controlling the temperature of blood in an extracorporeal circuit, the steps comprising: providing a core through which blood can be supplied to the apparatus from a patient; providing a heat exchanger about the core such that blood from the core can move radially outward through the heat exchanger; providing an oxygenator about the heat exchanger such that blood from the heat exchanger can move radially outward through the oxygenator; and placing the core, heat exchanger and oxygenator in a housing that includes an inlet in communication with the core and an outlet that is located radially outward from the inlet in order to define a flowpath for blood through the apparatus. | 10-28-2010 |
| 20100269343 | Method for Manufacture of Integrated Ridge Vent and Heat Exchanger - A flexible heat exchanger is incorporated into a ridge vent to form an assembly. The heat exchanger operates by collecting thermal energy (heat) from heated air exhausting from the attic space via the ridge vent. Air in the attic space is typically heated by the solar energy falling on the roof. Heat from this air is transferred through the wall of heat exchange tubes integrated into the ridge vent. The flow of heated air around the outside of the tubes is driven by the column of heated air that forms in the attic space, similar to the draft in a chimney. The chimney effect in the attic space circulates the flow of outside air into the soffit vents through the attic space where it is heated and then exhausted out the ridge vent, passing by and around the tubes before it exits. | 10-28-2010 |
| 20100275444 | WATER HEATER BASE - A method of making a circular support base for a water heater in which a sheet of material having two ends is formed with corrugations such that the corrugations are progressively more pronounced towards one longitudinal edge thereby creating a generally circular shape out of the formerly straight sheet material, the two ends are connected to form an unbroken circular shape, the corrugated material is shaped to form a lip at an inner circumferential region, and the circular lip intersects with an outer circumferential region of the support base to form a circular trough for supporting and positioning a water tank of the water heater. | 11-04-2010 |
| 20100293788 | ZIRCONIUM PHOSPHATING OF METAL COMPONENTS, IN PARTICULAR IRON - The present invention relates to a method for the corrosion-protective pretreatment of metal components, which at least partially comprise metal surfaces made of iron, using a chromium-free aqueous treatment solution, which contains fluoro-complexes of zirconium and/or titanium and phosphate ions in a specific ratio range to one another, and a metal component which is pretreated accordingly, and the use thereof for the application of further corrosion-protective coatings and/or lacquer systems. The method is suitable in particular as a pretreatment for electrophoretic painting of metal components, which are provided in the form of non-closed hollow bodies. | 11-25-2010 |
| 20110030217 | METHOD OF MANUFACTURING A HEAT EXCHANGER - A method of manufacturing a heat exchanger is disclosed. The heat exchanger comprises a plurality of fin members including a plurality of fins that is arranged in parallel and protrudes from a flat-plate base so that slit portions are formed on both side ends in a width direction of the base, the fin members being arranged so that respective bases abut on each other in a frame. Specifically, the method comprises: an extrusion molding operation of extrusion-molding a long fin member; a fin cutting operation of cutting the long fin member having just been extrusion-molded to cut the long fin member by a predetermined width; and a base cutting operation of cutting a long base in a long-fin cutting region made in the fin cutting operation so that slit portions are formed. | 02-10-2011 |
| 20110041338 | Method For Making A Vane And Device For Implementing Said Method - The invention relates to a method for manufacturing a fin ( | 02-24-2011 |
| 20110119916 | METHOD OF MAKING A REFRIGERATION SYSTEM HAVING A HEAT EXCHANGER - A complete refrigeration system (CRS) including at least one heat exchanger which is designed to occupy an irregular volume to reduce the overall profile of the CRS. The heat exchanger may be a condenser or an evaporator, and includes a substantially solid body made of a thermally conductive metal, plastic, or other material. A plurality of fluid and refrigerant passageways are defined substantially within the solid body for conducing fluid and refrigerant, respectively, through the solid body and facilitating the transfer of heat between the fluid and refrigerant. Also disclosed is a method wherein the spatial orientation of each passageway is optimized with respect to all of the other passageways and the walls of the solid body by determining the relative distance of each passageway from all of the other passageways and the walls of the solid body at a plurality of points along each passageway, followed by adjusting the spatial orientation of the passageway accordingly. | 05-26-2011 |
| 20110138627 | HEAT SINK MATERIAL, MANUFACTURING METHOD FOR THE SAME, AND SEMICONDUCTOR LASER DEVICE - Provided are a heat sink material made of an alloy or a composite material including two or more types of elements which has an end surface that makes possible formation of an edge portion on which at least a laser element is mounted, a manufacturing method for the same, and a semiconductor laser device including the heat sink material. A heat sink material ( | 06-16-2011 |
| 20110173813 | METHOD FOR PRODUCING A HEAT EXCHANGER SYSTEM, PREFERABLY OF THE EXCHANGER/REACTOR TYPE - The invention relates to a method for producing a heat exchanger system comprising at least one module ( | 07-21-2011 |
| 20110185573 | HEAT SINK - An improved heat sink comprises a plurality of wire fins mounted on a heat sink base. Each wire fin comprises a coil made up of a plurality of contiguous loops of wire. A wire fin can be manufactured by deforming a helical wire member to an elongate, relatively compact shape. Several such wire fins can then be mounted to a heat sink base in order to form a pin-fin type heat sink. | 08-04-2011 |
| 20110185574 | METHOD FOR MANUFACTURING A BENT HEAT EXCHANGER - An improved bending apparatus for bending a radiused corner at a window in a brazed heat exchanger core where no tubes and fins are located. A cylindrical mandrel and sliding pressure die are designed to completely surround the manifold in the areas of the window and provide a continuous, rolling contact area or profile support around the manifold as the bending moment is applied. | 08-04-2011 |
| 20110192026 | PRESS FITTING METHOD FOR HEAT PIPE AND HEAT SINK - A press fitting method for heat pipe and heat sink includes the following steps. a) At least a heat pipe and a heat sink conducting heat to the heat pipe are provided. The heat sink is one of a heat conducting plate or a fin module. The heat sink has a groove for receiving the heat pipe. b) The heat pipe is placed into the groove. c) An end of the heat pipe or the heat pipe under the fins is pressed by a press mold so as to be deformed and fit to the groove as one. Through the above steps, an efficient and quick method is provided and the heat pipe will be tightly fitted to the heat sink so as to achieve a better heat dissipation. | 08-11-2011 |
| 20110192027 | THERMALLY CONDUCTIVE COMPOSITE INTERFACE, COOLED ELECTRONIC ASSEMBLIES EMPLOYING THE SAME, AND METHODS OF FABRICATION THEREOF - A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to he cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly. | 08-11-2011 |
| 20110203111 | HEAT EXCHANGER, METHOD FOR MANUFACTURING THE HEAT EXCHANGER, AND METHOD FOR MANUFACTURING HEART-LUNG MACHINE - A heat exchange module | 08-25-2011 |
| 20110289775 | METHOD AND APPARATUS FOR BENDING A MICRO-CHANNEL HEAT EXCHANGER - An improved corner bending apparatus and method for a bent head exchanger includes a first step of providing a tube edge clearance to at least the inner core face edges of those few tubes encompassed by the area of the core to be bent. A series of elongated braces, able to flex relative to one another, is placed into the tube edge clearance prior to bending. The braces actively maintain the tube edges (and tubes) in a parallel, undeformed orientation during the bend, which may be done by otherwise conventional apparatus. | 12-01-2011 |
| 20110302782 | Method of separating heat exchanger tubes and an apparatus for same - A method and apparatus of producing tubes for use in a heat exchanger, in which a tube is moved along a production line in a direction, predetermined breaking points are created in the tube, and in which the tube is severed at the predetermined breaking points to form individual tubes with a tearing-off device having a first clamp and a second clamp. The first clamp can be reciprocated along the direction, and the tube can be moved substantially continuously along the production line in the direction through the tearing-off device. Also, the second clamp can be reciprocated along the direction substantially simultaneously with the first clamp. | 12-15-2011 |
| 20120131796 | APPARATUS AND METHOD FOR EQUALIZING HOT FLUID EXIT PLANE PLATE TEMPERATURES IN HEAT EXCHANGERS - An apparatus and method for minimizing cold spots on plates of a plate-type fluid-to-fluid heat exchanger averages the plate temperature at a hot-fluid exit plane of the heat exchanger. The heat exchanger matrix is constructed to internally vary the flow patterns of opposing hot and cold fluid streams so that the heat transfer coefficient values of one or both fluid streams, designated as h, are optimized so the hot fluid value is a greater value than that of a cold fluid value. Plate variable flow structures are arranged in a manner that allows higher velocity hot fluid flow and possible lower velocity cold fluid flow in areas where the plate temperatures are coolest and the opposite configuration where plate temperatures are hottest. | 05-31-2012 |
| 20120137517 | METHOD FOR MARKING TUBES IN A SHELL AND TUBE HEAT EXCHANGER - A method for marking a specific tube in a shell and tube heat exchanger includes inserting a marker into a second tube adjacent to the tube to be marked and directing a directional pointer on the marker toward the tube to be marked. | 06-07-2012 |
| 20120137518 | METHOD FOR ASSEMBLING FINS-TYPE HEAT SINK - A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die. | 06-07-2012 |
| 20120210581 | MANUFACTURING HEAT EXCHANGER FROM POROUS MEDIUM AND CONDUITS - The present invention relates to a method for producing a heat exchanger. The heat exchanger comprising at least one heat conducting conduit for passage of a first medium and at least one block of an open cell porous medium for passage of a second medium. The method comprises providing at least one groove in the open cell porous medium. Thereafter, the porous medium is bent in a direction such that at least part of the grooves are opened and heat conducting conduits are applied in this at least one opened groove. Thereafter, the porous medium is rebend such that the heat conducting conduits are locked in said open cell porous medium. | 08-23-2012 |
| 20120240401 | MANUFACTURING METHOD OF A HEAT SINK - A manufacturing method of a heat sink is disclosed. A board having a first width is transported to a machine tool. The board is punched to form multiple sheet bodies. A bent part is formed on a terminal end of each sheet body having a second width. A first combined part protrudes from the bent part. A second combined part is hollowly disposed on the edge of the bent part as an indentation corresponding to the first combined part. The bent part is bent to stand correspondingly to each of the sheet bodies. Each sheet body is cut to form multiple heat dissipation fins. The second width is equal to the first width. When the heat dissipation fins overlap with each other, the first combined part of one heat dissipation fin is connected to the second combined part of another dissipation fin. | 09-27-2012 |
| 20120317811 | METHOD FOR MANUFACTURING HEAT DISSIPATING APPARATUS - An exemplary method for manufacturing a heat dissipation apparatus includes, firstly, providing a fin assembly including a stack of fins spaced from each other. Each fin defines a through hole therein, and includes a collar formed at an edge of the through hole. Then a heat pipe is provided, and inserted in the through holes of the fins. Next, two opposing punching tools are provided. Each punching tool defines a series of recesses. The subassembly of the heat pipe and fins is positioned between the two punching tools, with the collar of each fin located between two corresponding recesses of the two punching tools. The two punching tools punch the collars of the fins from two opposite sides of the collars. Thereby, the collars shrink inwardly and press the heat pipe to deform until the heat pipe is fittedly mounted in the collars of the fins. | 12-20-2012 |
| 20130019478 | Heat Exchange Device and Method for Producing a Heat Exchange Element for a Heat Exchange Device - The invention relates to a heat exchange device, in particular a vehicle radiator, for indirect exchange of heat between a first medium and a second medium, with a first guide section ( | 01-24-2013 |
| 20130055569 | SEAL PACKING ASSEMBLY APPARATUS AND METHOD OF ASSEMBLY OF SEAL PACKING - A seal packing assembly apparatus which assembles a seal packing into a core plate used as a component of a heat exchanger, which apparatus is provided with rollers which push a seal packing into a groove of a core plate while moving by rolling along the groove and guide members which abut against the core plate, the rollers being supported so as to displace matching the shape of the core plate by the reaction force which the guide members receive from the core plate, whereby the reliably of assembly of the seal packing is improved. | 03-07-2013 |
| 20130061474 | SYSTEM AND METHOD FOR MANUFACTURING A HEAT EXCHANGER - A method for manufacturing a heat exchanger includes joining a first conductive sheet to a second conductive sheet to define a plurality of separate volumes in a blank envelope, creating an aperture in each separate volume in the blank envelope, and heating the blank envelope. The method further includes pressurizing each separate volume through the apertures, hot plastic forming the blank envelope into a formed envelope, and assembling a plurality of formed envelopes into a heat exchanger core, wherein the heat exchanger core includes a fluid passage outside of the formed envelopes, wherein the fluid passage is defined by adjacent formed envelopes, and wherein the fluid passage extends across a dimension of the heat exchanger core. | 03-14-2013 |
| 20130074339 | Overmolded Dual In-Line Memory Module Cooling Structure - Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph. | 03-28-2013 |
| 20130074340 | METHOD OF MANUFACTURING HEAT EXCHANGER - A method of manufacturing a heat exchanger includes forming elongated holes in two connection walls among a plurality of connection walls to be laminated, and forming paired notches on a claw forming portion of the remaining connection wall facing the elongated holes. A longitudinally intermediate portion of the claw forming portion is pressed toward the other end to break the claw forming portion at the longitudinal center and bend the claw forming portion at the notches to thereby form two claws forming pieces and form bent portions at the distal ends of the claws forming pieces. The claws forming pieces are bent at the notches to form claws. Distal end portions of the claws are bent outward to form fold-back portions, which are engaged with the outer surface of the connection wall at the other end, whereby all the connection walls are provisionally fixed together. | 03-28-2013 |
| 20130091706 | COMBINED POWER AND COOLING RACK SUPPORTING AN ELECTRONICS RACK(S) - A method is provided for facilitating powering and cooling of one or more electronics racks. The method includes: providing a frame; associating at least one bulk power assembly with the frame, the at least one bulk power assembly being configured to provide power to the electronics rack(s), wherein the frame with the associated one or more bulk power assemblies is distinct from the electronics rack(s); and associating one or more heat exchange assemblies with the frame, the heat exchange assembly(ies) being configured to cool system coolant provided to the electronics rack(s). In operation, heat is transferred by the heat exchange assembly(ies) from the system coolant to a facility coolant, and the frame with the associated bulk power assembly(ies) and associated heat exchange assembly(ies) provides both power and cooling to the electronics rack(s). | 04-18-2013 |
| 20130097862 | DRY-COOLING UNIT WITH GRAVITY-ASSISTED COOLANT FLOW - A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure. | 04-25-2013 |
| 20130111754 | METHOD OF MANUFACTURING HEAT SINK FRAMES - A method of manufacturing heat sink frames comprises the steps of: extruding an aluminum material to form a heat sink model; shearing multiple portions on a length of the heat sink model where are desired to be bent to form a plurality of shearing notches according to required dimension specification; bending the heat sink model at the shearing notches to form a plurality of bend angles through respectively connecting edges of each of the shearing notches; and fastening a front end of the heat sink model to a rear end of the heat sink model to form a frame. Through extruding, shearing and bending processes, fabrication is simpler and material and labor hours can be saved to enhance heat conduction efficiency and reduce production cost. | 05-09-2013 |
| 20130152392 | METHODS FOR FORMING A HEAT EXCHANGER AND PORTIONS THEREOF - Methods of forming a heat exchanger from a metal body made from a material having a melting temperature greater than 660° C. with the metal body having opposing first and second surfaces and at least one fluid passageway formed in the metal body so that fluid may be passed through the fluid passageway and heat from the fluid may be dissipated through a plurality of fins. | 06-20-2013 |
| 20130167376 | HEAT EXCHANGER FIN WITH RIBBED HEM - A serpentine fin for assembly between tubes in a heat exchanger core, and a method of making same from a metal strip. The strip edges have a hem comprising a double thickness of the strip material extending inward from the edge. The metal strip has folds extending across the strip width such that the strip forms a serpentine shape, with the folds being adapted to contact the tubes in the heat exchanger core. Multiple rows of split louvers are disposed between adjacent folds. Each row of split louvers comprises louvers having openings extending in the direction of the strip length and formed in a-pair of adjacent, spaced louver banks. Ribs are disposed parallel to the louver openings adjacent the strip edges and in at least one center portion of the strip between the strip edges, and extend across the pair of louver bank. | 07-04-2013 |
| 20130174421 | DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE - A method is provided for fabricating a cooling apparatus for cooling an electronics rack, which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures, and a tube. The heat exchanger is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of coolant-carrying tube sections, each tube section having a coolant inlet and outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure. | 07-11-2013 |
| 20130263450 | HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK - An air-cooling method is provided which includes providing a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door. | 10-10-2013 |
| 20130291383 | REACTOR INSTALLATION AND REMOVAL TOOLS - A reactor installation tool and method for installing a reactor unit in a reactor tube. A reactor installation tool including a movable assembly and a fixed assembly linked together such that the movable assembly can be adjusted relative to the fixed assembly. The movable assembly including a reactor sleeve attachment means for releasably securing a reactor sleeve loaded with a reactor unit to the tool. The fixed assembly including an expandable clamping unit for releasably securing the tool to a reactor tube. A reactor unit can be installed in the reactor tube by adjusting the movable assembly to extract the reactor unit from the reactor sleeve as the fixed assembly is rigidly secured to the reactor tube. The fixed assembly can be released from the reactor tube and the reactor installation tool can be removed from the reactor tube. | 11-07-2013 |
| 20130333216 | METHOD FOR MANUFACTURING HEAT DISSIPATION DEVICE - An exemplary method for manufacturing a heat dissipation device includes the following steps. First, providing fins spaced from each other. Then, providing an electric conductor extending through the fins and being electrically connected to the fins. Next, immersing the combination of the fins and the electric conductor into an electrolyte of an electrolytic cell. After that, connecting an anode of the electrolytic cell with the electric conductor in an electric conductive relationship. Finally, providing the anode with electrical power to form metal oxide films over surfaces of the fins and the electric conductor. | 12-19-2013 |
| 20140020248 | Thermal Module and Manufacturing Method Thereof - A thermal module and a manufacturing method thereof. The thermal module includes a retainer member and at least one heat conduction member. The retainer has a first clamping arm and a second clamping arm opposite to the first clamping arm. The heat conduction member is disposed and fixedly clamped between the first and second clamping arms. The retainer member is formed by means of punching and integrally connected with the heat conduction member also by means of punching so that the manufacturing cost of the thermal module is lowered and the heat dissipation efficiency of the thermal module is enhanced. | 01-23-2014 |
| 20140026417 | METHOD OF ASSEMBLING THERMAL MODULE - A method of assembling thermal module includes steps of providing a first heat dissipation member and a second heat dissipation member, and aiming a section of the first heat dissipation member at a section of the second heat dissipation member, which section of the first heat dissipation member is to be assembled with the section of the second heat dissipation member and driving the first heat dissipation member to connect with the second heat dissipation member by means of striking the first heat dissipation member into the second heat dissipation member. By means of the method, the thermal module can be assembled at higher efficiency. Moreover, the manufacturing process of the thermal module is simplified. | 01-30-2014 |
| 20140068941 | RADIATING FIN, THERMAL MODULE FORMED WITH THE SAME, AND METHOD OF MANUFACTURING THE SAME - A radiating fin and a method of manufacturing the same are disclosed. The radiating fin includes a main body having a first side and an opposite second side, and being provided with at least one through hole to extend between the first and the second side for a heat pipe to extend therethrough; and at least one extension being formed on at least one of the first and the second side of the main body to locate around the at least one through hole and axially project from the main body. The extension is crimped to form a plurality of circumferentially alternate ridge portions and valley portions for tightly pressing against an outer surface of the heat pipe, so as to firmly bind the radiating fin to the heat pipe. A thermal module can be formed by sequentially binding a plurality of the radiating fins to the heat pipe. | 03-13-2014 |
| 20140082942 | WICKING AND COUPLING ELEMENT(S) FACILITATING EVAPORATIVE COOLING OF COMPONENT(S) - A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component. | 03-27-2014 |
| 20140096386 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 04-10-2014 |
| 20140096387 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 04-10-2014 |
| 20140123492 | PUMP-ENHANCED, SUB-COOLING OF IMMERSION-COOLING FLUID - A method of fabricating a cooling apparatus is provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment. | 05-08-2014 |
| 20140123493 | SECTIONED MANIFOLDS FACILITATING PUMPED IMMERSION-COOLING OF ELECTRONIC COMPONENTS - Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section. | 05-08-2014 |
| 20140165399 | MANUFACTURING METHOD OF LIQUID-COOLED JACKET - Provided is a method of producing a liquid-cooled jacket wherein deformation of a seal body can be minimized. A method of producing a liquid-cooled jacket constituted by fixing a seal body which seals the opening of a recess, by friction stir welding, to a jacket body having a partially opening recess through which heat transport fluid for transporting heat generated by a heat generating body to the outside flows, wherein the seal body is mounted on a supporting surface which is formed at the peripheral edge of the opening of the recess in the jacket body and consists of the bottom surface of a step lower than the surface of the jacket body, the side surface of the step of the jacket body and the outer circumferential surface of the seal body are butted each other, a plasticized region is formed by making one round of a rotary tool which is equipped with a stir pin having a length greater than the thickness of the seal body round along the butting portion of the side surface of the step of the jacket body and the outer circumferential surface of the seal body, and then the seal body is welded to the jacket body. | 06-19-2014 |
| 20140165400 | HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit includes a base, at least one heat pipe, and a locating structure. The base has a first face, on which at least one channel is provided. A coupling section is formed on the first face at joints between the at least one channel and the first face. The heat pipe is set in the channel, and the locating structure is correspondingly fitted in the coupling section. In a method of manufacturing the heat-dissipation unit, the locating structure is molded between the at least one heat pipe and the base through a mechanical process, so that the at least one heat pipe is firmly held to the base in a highly efficient assembling manner with largely reduced time and labor to thereby enable reduced manufacturing cost. | 06-19-2014 |
| 20140182132 | METHOD OF MANUFACTURING A VAPOR CHAMBER STRUCTURE - A vapor chamber structure includes an integrally formed main body defining a chamber and having radiating fins. The radiating fins are outward extended from one side of the main body in a direction opposite to the chamber; the chamber is internally provided with a wick structure and filled with a working fluid. A method of manufacturing a vapor chamber structure is also disclosed, which includes the steps of using an extrusion process to manufacture a main body having a plurality of radiating fins and a chamber; forming at least one wick structure on inner walls of the chamber after the main body has been manufactured; and sealing two ends of the main body, and evacuating the chamber before filling it with a working fluid. With the method, the vapor chamber structure can be manufactured with reduced material and labor costs and shortened manufacturing time. | 07-03-2014 |
| 20140196285 | HEAT SIPHON HEAT COLUMN AND METHOD FOR MAKING THE SAME - A method for making a heat column includes a step of preparing a section of a metal object; a step of forging the section of the metal object to be a hollow column which has a flat bottom, a guide surface being formed in the inner periphery of the hollow column, the hollow column having a flat bottom which has a heat-exchange surface; a step of making a neck on one end of the hollow column, and a step of sealing the neck by way of welding when the interior of the hollow column is sucked to be substantial vacuum status, liquid high heat transmission agent being introduced into the interior of the hollow column. The flat bottom is integral formed when the hollow column is formed and the flat bottom is in contact with the heat source. | 07-17-2014 |
| 20140237822 | HEAT DISSIPATION UNIT AND MANUFACTURING METHOD THEREOF AND THERMAL MODULE THEREOF - A heat dissipation unit and a manufacturing method thereof and a thermal module thereof. The heat dissipation unit includes a metal main body having a chamber, an oxide coating and a working fluid. The oxide coating is coated on wall surface of the chamber instead of capillary structure. The oxide coating serves to enhance vapor/liquid circulation efficiency of the working fluid in the chamber of the heat dissipation unit so as to increase heat dissipation efficiency. | 08-28-2014 |
| 20140298652 | METHOD OF MANUFACTURING A REFRACTORY PANEL FOR A FIREPLACE - A method of manufacturing a refractory panel. The method comprises forming a textured surface of interconnected subpanels. Adjacent ones of the sub-panels are partially separated from each other by gaps located between edges of the adjacent subpanels. | 10-09-2014 |
| 20140317928 | HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit includes a base and a plurality of radiating fins. The base has a plurality of grooves formed thereon, and each of the grooves has an open top and closed bottom. The radiating fins respectively have a heat-radiating zone and a bent zone. When a pressure is applied onto the bent zones, the bent zones respectively form an assembling section in the grooves to tightly fit therein. With the above arrangements, the radiating fins can be firmly locked to the base without the need of welding, so that the manufacturing cost is reduced and the problem of a damaged base due to assembling can be avoided. A method of manufacturing the above-described heat-dissipation unit is also disclosed. | 10-30-2014 |
| 20140325844 | EMBEDDED HEAT EXCHANGER FOR HEATING, VENTILATION, AND AIR CONDITIONING (HVAC) SYSTEMS AND METHODS - A zone-control unit for use in a heating, ventilation, and air conditioning (HVAC) system, the zone-control unit includes a heat exchanger, an inlet piping assembly coupled with the heat exchanger for supplying fluid to the heat exchanger, an outlet piping assembly coupled with the heat exchanger for receiving fluid from the heat exchanger, a bracket that maintains the inlet piping assembly and the outlet piping assembly in positional relationship, and an ancillary component coupled with the heat exchanger. | 11-06-2014 |
| 20140345136 | HEAT DISSIPATING FIN, HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion. | 11-27-2014 |
| 20140352149 | Heat Exchanger for Electronic Assemblies - A liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger. The exchanger has a solid metal body in the form of an elongated flat plate to which the electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly. The elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Transverse passages are drilled to intersect the extruded longitudinal passages. The longitudinal passages and transverse passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger. | 12-04-2014 |
| 20150052753 | SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE - Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure. | 02-26-2015 |
| 20150052754 | FABRICATING THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FOR COOLING ELECTRONICS CARD(S) - Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided which include: coupling a thermal transfer structure configured to one or more sides of an electronics card having one or more electronic components to be cooled, the thermal transfer structure including a thermal spreader coupled to the one side of the electronics card; and disposing a coolant-cooled structure adjacent to the socket of the electronic system, the coolant-cooled structure including one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket, and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s). | 02-26-2015 |
| 20150075000 | COOLING SYSTEM FOR ELECTRONICS - A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel. | 03-19-2015 |
| 20150113806 | METHOD FOR FILLING A HEAT STORAGE TANK WITH SOLID ELEMENTS - Method for filling a heat storage tank with solid elements having at least one first particle size greater than at least one second particle size, the method includingthe following steps: a) pouring a first quantity of solid elements of the first particle size into the tank, b) levelling said first quantity of solid elements of the first particle size so as to form a layer of a substantially constant height, c) pouring a second given quantity of solid elements of the second particle size over the layer of solid elements of the first particle size such that the solid elements of the second particle size flow between the solid elements of the first particle size and such that the elements of the second particle size are flush with the layer of the solid elements of the first particle size and so as to form an intermediate layer. | 04-30-2015 |
| 20150360334 | COMPACTION APPARATUS AND METHOD FOR HEAT EXCHANGE UNIT - A module defining a plurality of cavities adapted to receive adsorbent material and movable from a loading station to a compaction station and to a transfer station, a plurality of rams at the compaction station for exerting pressure on the adsorbent material to compact it and rams at the transfer station to extract the compacted adsorbent material from said cavities. | 12-17-2015 |
| 20150367460 | METHODS OF FORMING COOLING CHANNELS USING BACKSTRIKE PROTECTION - A method of forming cooling channels in a component is provided. The component has a substrate having outer and inner surfaces. The inner surface defines at least one interior space, and a core is disposed within each interior space. The method includes forming at least one access hole in the substrate, while the core is disposed within the respective interior space, removing the core from the respective interior space, and forming at least one groove in the outer substrate surface (before or after the core is removed). Each access hole connects the groove in fluid communication with the respective interior space. The method further includes disposing a coating over at least a portion of the outer substrate surface, where the coating includes at least a structural coating that extends over the groove(s), such that the groove(s) and the structural coating together define one or more channels configured to convey a coolant from the respective interior space(s) for cooling the component. | 12-24-2015 |
| 20160039056 | METHOD FOR MANUFACTURING HEAT EXCHANGER, AND HEAT EXCHANGER - A method for manufacturing a heat exchanger includes: assembling a plurality of heat exchanger components in an assembly step; and forming a film on surfaces of the heat exchanger components using a chemical vapor deposition method in a film formation step after the assembly step. The film can restrict a formation of a through hole due to corrosion. The film can be restricted from being damaged at a delivery or assembling time, because the film formation step is provided after the assembly step. An occurrence of clogging can be restricted at a minute portion inside of the heat exchanger in the film formation step, because the film is formed using the chemical vapor deposition method. | 02-11-2016 |
| 20160074978 | FURNACE BURNER BOX - An HVAC burner box includes a burner bank, a manifold and an air director located within an enclosure. The burner bank is oriented such that an outlet end of the burner bank is directed toward a first end of the enclosure. The manifold is located within the enclosure and adjacent an inlet end of the burner bank. The air director has a diffuser that is coupled to a side of the enclosure. The diffuser includes a plurality of openings located therethrough. The diffuser is configured to direct a first portion of a received airstream through the opening and toward the burner bank. The diffuser is further configured to send a second portion of the received airstream toward the manifold. | 03-17-2016 |
| 20160143126 | METHOD OF FABRICATING HEAT DISSIPATING BOARD - A method of fabricating a heat dissipating board according to the present invention, includes: a substrate intermediate forming step of forming a substrate intermediate with an insulating layer made of an insulating resin material and a conducting layer made of a conductive material formed on the insulating layer; a through hole forming step of forming a through hole having an approximately cylindrical shape, the through hole penetrating through the substrate intermediate; an inserting step of inserting a heat conducting member to be disposed in the through hole, the heat conducting member being made of a metal and having an approximately cylindrical shape; and a plastically deforming step of plastically deforming the heat conducting member to be secured in the through hole. Prior to the inserting step, an annealing step of annealing the heat conducting member is performed. | 05-19-2016 |
| 20160144467 | HEAT EXCHANGE REACTOR USING THIN PLATE PROVIDED WITH FLOW PATH THEREIN AND METHOD OF MANUFACTURING THE SAME - Disclosed are a heat exchange reactor and a method of manufacturing the same, and a method of manufacturing a heat exchange reactor includes: preparing lateral plates provided with a plurality of slits formed in parallel in a longitudinal direction; disposing two lateral plates to be spaced apart from each other while facing each other in a vertical direction; forming a plurality of flow path channels by inserting flow path partition plates into one or more slits of the two lateral plates in a horizontal direction; forming a plurality of flow path channels by inserting printed circuit heat exchange plates, which autonomously include one or more heat exchange flow paths therein, into one or more slits of the two lateral plates in a horizontal direction; and bonding the lateral plates, the flow path partition plates, and the printed circuit heat exchange plates. | 05-26-2016 |
| 20160158825 | PIN FIN FORMING METHOD - A pin fin forming method is a method of forming a plurality of pin fins on a surface of a metal plate by subjecting the metal plate to extrusion using a die having a plurality of through-holes and a roll. The pin fin forming method includes placing the metal plate between the die and the roll, and pressing the metal plate from a first end of the metal plate to a second end of the metal plate, by moving the roll relative to the die. The metal plate is pressed from the first end of the metal plate to the second end of the metal plate, in a state where a side surface of the second end of the metal plate and an upper surface of the second end of the metal plate are fixed. | 06-09-2016 |
