| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 029850000 | By using wire as conductive path | 15 |
| 20080222886 | Method For Manufacturing Carrier Substrate - A carrier substrate and a method for manufacturing the carrier substrate are disclosed herein. The method includes the steps of: providing a core substrate; forming a build-up material layer on the core substrate; forming a via in the build-up material layer; forming a patterned photoresist layer on the build-up material layer covering a portion of the via and exposing an opening from uncovered portion of the via, and a wiring slot connected to the opening; and forming a metal-electroplated layer on the via and the wiring slot. In forming a trace according to the present invention, the metal-electroplated layer is formed as the trace and directly connected to the via, striding or not striding over the via. Additionally, in the carrier substrate structure, there is no need an annular ring to connect the trace to the via, and thus the wiring space is increased. | 09-18-2008 |
| 20090113704 | Producing method of wired circuit board - A producing method of a wired circuit board includes the steps of preparing an insulating base layer, forming a wire on the insulating base layer, forming an insulating cover layer on the insulating base layer so as to cover the wire, and irradiating the insulating cover layer with light with a wavelength of more than 700 nm and less than 950 nm to inspect for foreign substance with a reflected light from the insulating cover layer. | 05-07-2009 |
| 20100095523 | MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD - A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes. | 04-22-2010 |
| 20100242275 | METHOD OF MANUFACTURING AN INSPECTION APPARATUS FOR INSPECTING AN ELECTRONIC DEVICE - In a method of manufacturing an inspection apparatus for inspecting an electronic device, a sacrificial substrate is formed into a substrate pattern including a through-hole. A principal substrate including an internal wiring penetrating from a first surface to a second surface thereof is combined with the substrate pattern in such a configuration that the through-hole is positioned over the internal wiring, thereby forming a combined structure. A filling structure is formed in the through-hole of the substrate pattern, and the filling structure is electrically connected to the internal wiring of the principal substrate. The substrate pattern is removed from the combined structure, and thus the filling structure is formed into a probe structure on the principal substrate. The probe structure may be connected to the principal substrate without any adhesives such as a solder, to thereby prevent electrical resistance increase and excessive thermal stress. | 09-30-2010 |
| 20120005895 | METHOD FOR MAKING CIRCUIT BOARD - A method for making a circuit board includes separating a plurality of versatile circuit boards from a collective board by cutting a connecting portion of the collective board, the plurality of versatile circuit boards being connected each other via the connecting portion, and cutting a part of a wiring formed on each of the plurality of versatile circuit boards to produce the circuit board. The cutting of the part of the wiring is conducted within the separating of the plurality of versatile circuit boards. | 01-12-2012 |
| 20120304460 | MODULE MANUFACTURING METHOD - In a method for manufacturing a module, a substrate is placed above a resin bath while a electronic component is directed downward. In addition, a resin thrown into the resin bath is softened until it becomes flowable. Then, a first surface of the substrate is brought into contact with a liquid surface of the softened resin. The softened resin is allowed to flow forcibly into a gap between the substrate and the electronic component. Then, the resin cures, and a resin portion is formed. Further, a metal thin film is formed on the surface of the resin portion by sputtering to form the shield metal film. | 12-06-2012 |
| 20130318785 | METHOD FOR MANUFACTURING IC SUBSTRATE - A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units. | 12-05-2013 |
| 20140026411 | TECHNIQUES FOR EFFICIENT WIRE ROUTING IN A DEVICE - Techniques for efficient routing of wires and electrical components within a device are disclosed. A wire can be routed, for example, in the space between two battery cells (or other components/structures) with the use of a bracket inserted between the cells to provide structural support. The electrical tape surrounding a battery may be cut or otherwise breached in order to expose the cavity between distinct battery cells. In some embodiments, multiple brackets may be inserted between the battery cells, creating a trough through which a wire or other component may be routed. After routing a wire through the trough, another electrical part or housing may be fixed above the battery cells. | 01-30-2014 |
| 20140173894 | METHOD OF COATING A REAR GLASS SUBSTRATE FOR AN ELECTROCHROMIC MIRROR REFLECTIVE ELEMENT - A method of coating a rear glass substrate for an electrochromic reflective element includes providing a fixture having a recess and a masking element extending from a perimeter region of the recess over a portion of the recess. The masking element includes a disc portion and an arm portion extending between the disc portion and the perimeter region of the recess of the fixture. A rear glass substrate is positioned in the recess and the masking element extends over and is spaced from the surface of the glass substrate. The glass substrate surface is coated with a mirror reflector coating. The masking element is shaped such that the mirror reflector coating is deposited at the surface behind the arm portion but is substantially not deposited behind the disc portion so as to establish a window region through the mirror reflector coating at the glass substrate surface. | 06-26-2014 |
| 20140352144 | METHODS FOR IMPROVING ELECTRICAL ISOLATION OF PATTERNED TRANSPARENT CONDUCTIVE FILMS - Claimed methods reduce leakage currents in transparent conductive films comprising conductive nanostructures without substantially impairing the films' optical properties or physical integrity. Imposition of electrical stimuli to separate conductive regions leads to reduced conductivity of the intervening lesser conductive regions. | 12-04-2014 |
| 20150107102 | METHOD FOR MANUFACTURING SPACE TRANSFORMER BY USING CARRIER SUBSTRATE MADE FOR CHIP PACKAGE AND PROVIDED WITH ELONGATED CONTACTS - A space transformer includes a carrier substrate made for a chip package, an insulated layer disposed on the carrier substrate, and a conductive block. The carrier substrate is provided with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer has a hole corresponding in position to the elongated contact. The conductive block has an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column and connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle. The method for manufacturing the space transformer is also disclosed. | 04-23-2015 |
| 20150113802 | METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE - A method of manufacturing a resin multilayer substrate with a cavity, includes stacking insulation substrates including thermoplastic resins and thermocompression-bonding the insulation substrates. At least one of the insulation substrates is formed by affixing a peelable carrier film to one main surface of the insulation substrate, making a cut in the insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the insulation substrate in a thickness direction and not penetrating the carrier film in a thickness direction, and removing the carrier film and a portion of the insulation substrate that is cut out by the cut. | 04-30-2015 |
| 20150305138 | WRAP-AROUND MICRO-WIRE CIRCUIT METHOD - A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side. | 10-22-2015 |
| 20160057867 | METHOD OF PRODUCING SUSPENSION BOARD WITH CIRCUIT - A method of producing a suspension board with circuit includes the steps of preparing a metal supporting layer; forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer, curing the curable insulating layer to form an insulating layer, subjecting the metal supporting layer exposed from the opening to microwave plasma treatment, and forming a metal conducting portion on the metal supporting layer exposed from the opening. | 02-25-2016 |
| 20160157357 | REDUCED-WARPAGE LAMINATE STRUCTURE | 06-02-2016 |
