| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 029840000 | By metal fusion | 47 |
| 20080235941 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING FEATURES - An integrated circuit package system is provided including providing a substrate having a contact pad, forming a first conductor having a first melting point over the contact pad, forming a second conductor having a second melting point over the first conductor with the first melting point higher than the second melting point, and mounting a first device over the second conductor. | 10-02-2008 |
| 20080244900 | Flux for Soldering and Soldering Process - There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. | 10-09-2008 |
| 20080244901 | MANUFACTURING METHOD OF TAPE CARRIER FOR TAB - Positioning marks are formed on both sides of each printing block on a tape carrier for TAB. A long-sized circuit board is transported by a roll-to-roll system in screen printing. When an optical sensor detects a positioning mark, transportation of the long-sized circuit board is stopped. Thereafter, the screen printing of a solder resist is performed to the printing block of the long-sized circuit board by a screen printing device. | 10-09-2008 |
| 20080289175 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data. | 11-27-2008 |
| 20080295329 | MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED INTERPOSER WITH THROUGH-SILICON-VIAS - The formation of electronic assemblies, including assemblies having an interposer, are described. In one embodiment, a method includes providing a body and forming a first metal pad layer on a first surface thereof. A second metal pad layer is formed in contact with the first patterned metal pad layer, the second metal pad layer having a denser pitch between adjacent pads than the first metal pad layer. A dielectric layer is formed between the adjacent metal pads in the first and second metal pad layers. After the forming the first and second metal pad layers and the dielectric layer, the method includes forming a plurality of vias extending through the body from a second surface thereof, the vias extending through a thickness of the body and exposing the first metal pad layer. The method also includes forming an insulating layer on sidewalls of the vias and on the second surface, and forming an electrically conductive layer on the insulating layer and on the exposed surface of the first metal layer. The method also includes coupling a plurality of elements to the second metal pad layer and coupling the electrically conductive layer to a substrate, the body being positioned between the elements and the substrate. Other embodiments are described and claimed. | 12-04-2008 |
| 20080313894 | METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS - A method is provided for making an interconnect structure. The method includes applying a low-temperature removable layer and adhesive layer to an electronic device or to a base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer. | 12-25-2008 |
| 20090007424 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity. | 01-08-2009 |
| 20090199400 | Electronic apparatus and method of manufacturing the same - An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process. | 08-13-2009 |
| 20090205203 | METHOD OF MOUNTING ELECTRONIC COMPONENTS - An electronic component mounting method for mounting a electronic component on a board, in which an Au bump provided at an electronic component is joined to a joining terminal formed on a board by using solder made of Sn or solder containing Sn and the electronic component is adhered to the board by means of thermosetting resin thereby to mount the electronic component on the board. The applied thermosetting resin is flown toward the outside by the lower surface of the electronic component, then a part of the solder particles contained within the thermosetting resin are made in contact with the side surfaces of the Au bumps which are heated to the temperature higher than the melting point of the solder and also another part of the solder particles are molten in a state of being sandwiched between the Au bumps and the electrodes. Thus, the diffusion of Sn into the Au bumps from the outside is promoted and so the density of Sn within the Au bumps can be increased. Further, the diffusion of Sn into the Au bump from a solder joining portion can be suppressed and so the generation of Kirkendall voids can be suppressed. | 08-20-2009 |
| 20090217519 | METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FIXATION OF THE COMPONENTS, AND CORRESPONDING PRODUCTION LINE - The invention relates to a method for producing an electronic module ( | 09-03-2009 |
| 20090260229 | METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE - The method for manufacturing an electronic parts module includes an adhesive layer forming process forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first land part and the second land part; a passive element mounting process positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer; an active element mounting process, after the passive element mounting process, positioning a terminal of the active element on the second land part and sticking the active element to the base wiring layer through the adhesive layer; a pressing process solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface so as to form the resin sealing layer. | 10-22-2009 |
| 20090260230 | METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE - The manufacturing method for an electronic parts module includes forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first and the second land parts, positioning a terminal of the active element on the second land part, sticking the active element to the base wiring layer through the adhesive layer by heating and pressing the active element onto the base wiring layer with a thermally pressing tool, and releasing the heating and pressing with the thermally pressing tool while the adhesive layer is semi-solidified, thereafter positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer, and solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface to form the resin sealing layer. | 10-22-2009 |
| 20090277005 | Small Form Factor PCBA Process Carrier - A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base plate has an upper surface including a recessed area sized to receive a panelized group of printed circuit board substrates and a lower surface. The first top plate is coupleable to the upper surface of the base plate during a first manufacturing process. The first top plate includes a plurality of connected rails configured to secure the panelized group of printed circuit board substrates. The second top plate is coupleable to the upper surface of the base plate during a second manufacturing process. The second top plate is configured to cover the panelized group of printed circuit board substrates. | 11-12-2009 |
| 20090293272 | METHOD FOR MANUFACTURING NONRECIPROCAL CIRCUIT DEVICE AND METHOD FOR MANUFACTURING COMPOSITE ELECTRONIC COMPONENT - A method for manufacturing a nonreciprocal circuit device in which a ferrite-magnet device including ferrite having first and second center electrodes arranged to intersect and be electrically insulated from each other and a pair of permanent magnets fixed to both principal surfaces of the ferrite so as to apply a direct current magnetic field to the ferrite is solder-bonded to a surface of a substrate. The ferrite-magnet device is solder-bonded to the surface of the substrate while a magnetic plate is disposed on a back surface of the substrate. | 12-03-2009 |
| 20100000084 | CHIP MOUNTER AND METHOD FOR RECOGNIZING BGA PACKAGE THROUGH CHIP MOUNTER - Provided are a chip mounter and a method for recognizing a Ball Grid Array (BGA) package through a chip mounter. The chip mounter includes a BGA package recognition apparatus which includes an image acquisition unit which acquires image information of a BGA package which includes a plurality of solder balls having n patterns (n≧1), a pattern recognition unit which analyzes the image information and outputs information about the BGA package, and a storage unit which stores the information about the BGA package, wherein the pattern recognition unit recognizes the n patterns, selects n seeds respectively corresponding to the n patterns and performs a seed growing operation which groups solder balls which are continuously located adjacent to the seed and have the same pattern as the seed into the same group as the seed, with respect to each of the n seeds. | 01-07-2010 |
| 20100077607 | Assembly Techniques for Electronic Devices Having Compact Housing - Improve techniques for assembling electronic devices within housings are disclosed. The improved techniques enable distinct electrical components of an assembly to be separately inserted into a tightly constrained enclosure. After the separate electrical components have been inserted into the housing, the separate electrical components can be electrically connected. Advantageously, the improved techniques enable electrical components of an assembly to be separately inserted into a tightly constrained enclosure when a sub-assembly of such products prior to insertion is not practicable or feasible. | 04-01-2010 |
| 20100088886 | PACKAGING METHOD FOR ASSEMBLING CAPTIVE SCREW TO PRINTED CIRCUIT BOARD - A packaging method for assembling a captive screw to a printed circuit board (PCB) includes the steps of providing a captive screw having a screw head, a threaded shank and a sleeve; pressing a fixture toward the screw head for a part of the threaded shank to exposed from a distal end of the sleeve, and then clamping the fixture on the sleeve; providing a PCB having through holes and a layer of solder provided thereon; using a tool to pick up the fixture and the captive screw and align the threaded shank with one through hole on the PCB; releasing the fixture and the captive screw from the tool for a flange at the distal end of the sleeve to extend into the through hole; heating, melting and then cooling to harden the solder layer, so that the sleeve is fixedly held to the PCB; and removing the fixture. | 04-15-2010 |
| 20100139089 | METHOD AND A DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-FORMING MASS - In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured. | 06-10-2010 |
| 20100175247 | Functional element-mounted module and a method for producing the same - A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away. | 07-15-2010 |
| 20100175248 | System and method of using a compliant lead interposer - The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board. | 07-15-2010 |
| 20100229383 | WAFER LEVEL TEST PROBE CARD - A probe card for wafer level testing of a plurality of semiconductor devices simultaneously. The probe card may include a circuit board including wafer level testing circuitry, a partially flexible silicon substrate, a plurality of test probes disposed at least partially in the substrate for engaging a plurality of corresponding electrical contacts in a wafer under test, and a compressible underfill coupling the substrate to the circuit board. The probe card may be used for wafer level burn-in testing. In some embodiments, the probe card may include active test control circuitry embedded in the silicon substrate for conducting wafer level high frequency testing. | 09-16-2010 |
| 20100269334 | ELECTRONIC COMPONENT FOR AN ELECTRONIC CARRIER SUBSTRATE - Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material. | 10-28-2010 |
| 20110072655 | METHOD OF SOLDERING AN ELECTRONIC COMPONENT - A soldering method of an electronic component includes inserting pins of the electronic component into through-holes provided in a printed circuit board; preheating interiors of the through-holes with an inert fluid; and bonding the pins to the through-holes by exposing molten solder to the preheated through-holes. | 03-31-2011 |
| 20110107595 | SEMICONDUCTOR DEVICE - A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip attached to the carrier, the chip having a copper contact pad that faces away from the carrier, extending a copper electrical connector between the contact pins and the contact pad, and diffusion soldering the copper electrical connector to the active area with a solder material including tin to form a solder connection including a contiguous bronze coating disposed between and in direct contact with both the copper electrical connector and the contact pad. | 05-12-2011 |
| 20110154659 | OPTIMIZING PCB POWER AND GROUND CONNECTIONS FOR LEAD FREE SOLDER PROCESSES - Apparatuses and methods that provide for enhanced connections between PTHs of multi-layer PCBs and electronic component leads, pins or the like. The apparatuses and methods improve the likelihood that the PTHs are completely filled with solder thereby advantageously allowing the PCBs to exhibit high mechanical and electrical reliability. Complete filling of PTHs is achieved by configuring the electrically conductive layers within the multi-layer PCB stack in a manner that reduces the heat sinking effects of the layers during the soldering process. In this regard, the PTHs may not directly contact all of the internal ground or power planes, so the heat sinking or heat transfer effects are reduced. This feature enables molten solder to substantially or completely fill an entire PTH before freezing. | 06-30-2011 |
| 20110167628 | COMPONENT BONDING USING A CAPILLARY EFFECT - A method of attaching a component to a substrate, including providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component, attaching a first solder pad to the component, inserting the component into the guide cavity, providing a second solder pad, offset from the first solder pad and near the cavity, and inserting the component, the component guide and the substrate into an oven heating the solder pads, wherein the component is drawn further into the guide cavity by a capillary effect of the heated solder pads. | 07-14-2011 |
| 20110173808 | Layout Method For Electronic Components Of Double-Sided Surface Mount Circuit Board - A layout method for electronic components of a double-sided surface mount circuit board is presented, which includes the following steps. At least one first electronic component is fixed on a first side surface of a circuit board through a reflow soldering process. At least one second electronic component is inserted on the first side surface of the circuit board. The other first electronic component is placed on a second side surface of the circuit board, and the other second electronic component is inserted on the second side surface of the circuit board. Finally, a reflow soldering process is performed on the circuit board disposed with the first electronic components and the second electronic components, thereby completing a layout process for the electronic components on the two side surfaces of the circuit board at the same time. | 07-21-2011 |
| 20110239456 | In system reflow of low temperature eutectic bond balls - Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond balls melt. After melting, the bond balls solidify, and the device is operated with the bond balls solidified. In one example, one of the two structures is a semiconductor substrate, and the other structure is a printed circuit board. The integrated circuit is a die mounted to the semiconductor substrate. The bond balls include at least five percent indium, and the integrated circuit is an FPGA loaded with a bit stream. The bit stream configures the FPGA such that the FPGA has increased power dissipation, which melts the balls. After the melting, a second bit stream is loaded into the FPGA and the FPGA is operated in a normal user-mode using the second bit stream. | 10-06-2011 |
| 20110296680 | VENT BLOCKING ON VENTED BALL GRID ARRAYS TO PROVIDE A CLEANER SOLUTION BARRIER - A vented BGA package is reconfigured by first applying a continuous bead of adhesive around the perimeter of the package to seal the gap between the lid and substrate. The continuous bead defines a channel through the pressure relief vents to a polarity through-hole in the lid. The BGA package is reflow soldered to a PWB at an elevated temperature using solder flux, clean or no-clean. The IC die achieves elevated temperature pressure relief through the pressure relief vents along the channel and out the polarity through-hole. After reflow a seal is applied to plug the polarity through-hole. The PWB is washed in an aqueous cleaner solution to remove flux residue. The continuous bead of adhesive and the seal form a cleaner solution barrier that prevents the solution from contacting conductors inside the package. The seal may be removed or left intact depending on the operating environment. | 12-08-2011 |
| 20120266461 | METHOD FOR CONDUCTIVELY CONNECTING A COMPONENT ON A TRANSPARENT SUBSTRATE - The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established. | 10-25-2012 |
| 20120297616 | METHOD FOR APPLYING SOFT SOLDER TO A MOUNTING SURFACE OF A COMPONENT - The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface. | 11-29-2012 |
| 20130000115 | MANUFACTURING METHOD FOR LENS DRIVE DEVICE - A manufacturing method for a lens drive device provided with a lens drive module having a movable body, a fixed body and a drive mechanism for driving the movable body, and a circuit board on which the lens drive module is mounted may include a module assembling step in which the lens drive module is assembled, a module mounting step in which the lens drive module is soldered by a reflow method after the module assembling step to be mounted on the circuit board, and a magnetizing step in which a drive magnet of the drive mechanism is magnetized after the module mounting step so that a magnetic pole of one end face and a magnetic pole of the other end face in the optical axis direction are different from each other. | 01-03-2013 |
| 20130081266 | STACKABLE ELECTRONIC COMPONENT - An embodiment of an electronic component includes a circuit element disposed within a package, which includes a surface and at least one standoff protruding from the surface. For example, where the circuit element is an inductor in a power supply, the standoff may allow one to mount the inductor component over another component, such as a transistor component. Therefore, the layout area of such a power supply may be smaller than the layout area of a power supply in which the inductor and transistor components are mounted side by side. | 04-04-2013 |
| 20130125393 | FLIP CHIP PACKAGE FOR MONOLITHIC SWITCHING REGULATOR - Methods and apparatuses related to packaging a monolithic voltage regulator are disclosed. In one embodiment, an apparatus includes: (i) a monolithic voltage regulator with a transistor arranged as parallel transistor devices; (ii) bumps on the monolithic voltage regulator to form connections to source and drain terminals of the transistor; (iii) a single layer lead frame with a plurality of interleaving lead fingers coupled to the monolithic voltage regulator via the bumps, where the single layer lead frame includes first and second surfaces, where the first surface includes a first pattern to form connections to the bumps, and where the second surface includes a second pattern that is different from the first pattern; and (iv) a flip-chip package encapsulating the monolithic voltage regulator, the bumps, and the single layer lead frame, where the flip-chip package has external connectors of the monolithic voltage regulator at the second surface of the single layer lead frame. | 05-23-2013 |
| 20130133193 | SURFACE MOUNT TECHNOLOGY PROCESS FOR ADVANCED QUAD FLAT NO-LEAD PACKAGE PROCESS AND STENCIL USED THEREWITH - The invention provides a surface mount technology process for an advanced quad flat no-lead package process and a stencil used therewith. The surface mount technology process for an advanced quad flat no-lead package includes providing a printed circuit board. A stencil with first openings is mounted over the printed circuit board. A solder paste is printed passing the first openings to form first solder paste patterns. The stencil is taken off. A component placement process is performed to place the advanced quad flat no-lead package comprising a die pad on the printed circuit board, wherein the first solder paste patterns contact a lower surface of the die pad, and an area ratio of the first openings to the lower surface of the die pad is between 1:2 and 1:10. A reflow process is performed to melt the first solder paste patterns to surround a sidewall of the die pad. | 05-30-2013 |
| 20130160289 | ONE-PACK TYPE EPOXY RESIN COMPOSITION AND USE THEREOF - Disclosed is a one-pack type epoxy resin composition containing an epoxy resin, dicyandiamide, an epoxy resin adduct compound, and a non-latent imidazole compound. The one-pack type epoxy resin composition is capable of being cured at a low temperature, while having excellent heat resistance and sealing properties. Also disclosed is use of the one-pack type epoxy resin composition. | 06-27-2013 |
| 20130263445 | Reflow Soldering Apparatus and Method - The apparatus of the present application reduces poor soldering having gas loft there at when soldering. In a reflow soldering apparatus for soldering electronic components mounted on a board by heated atmospheric gas while transferring the printed circuit board with the electronic components within preheating chambers and reflow chambers. Reflow chamber in order within a furnace, a pressure reducing chamber capable of reducing a pressure of the atmospheric gas is installed in the reflow chamber where the heated atmospheric gas circulates in the chamber, and gas involved in a heated and melted soldering part on the printed circuit board is removed at the pressure reducing chamber. | 10-10-2013 |
| 20130263446 | FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS - A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5. | 10-10-2013 |
| 20140053398 | ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTING METHOD - Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. | 02-27-2014 |
| 20140201991 | METHOD FOR CONNECTING PLATES OF A SUBSTRATE DEVICE - An approach is provided for a method for connecting multiple plates of a substrate device, the substrate device at least comprises a conductive layer and a plate has at least one hollowed hole that is used to directly transfer the heat from a high power electrical chip to the conductive layer, the method comprises acts of forming a first cupper layer on a top surface of the plate and forming a second cupper layer on a bottom surface of the plate, printing a circuit on the first cupper layer, and soldering the second cupper layer on the conductive layer with a soldering paste. | 07-24-2014 |
| 20140215817 | METHOD FOR MANUFACTURING A COMPONENT INTERCONNECT BOARD - There is provided a method for manufacturing a component interconnect board ( | 08-07-2014 |
| 20140259656 | DATA LOGGER SENSOR COMPONENT ASSEMBLY AND TEST PROCESS - An process for assembling a data logger for logging a sensed condition of an environment includes the steps of (1) reflow soldering a partially complete data logger printed circuit board; (2) assembling a sensor component to the printed circuit board via a molded socket that utilizes elastomeric contacts to cause an electrical connection between leads of the sensor component and the conductors on the printed circuit board; and (3) performing a sensor component specific post assembly process that results in the sensor component meeting a plurality of operational specifications, wherein the sensor component specific process takes less than two hours to complete. | 09-18-2014 |
| 20150040390 | METHOD OF MANUFACTURING LASER DIODE UNIT UTILIZING SUBMOUNT BAR - A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member. | 02-12-2015 |
| 20150089805 | CHIP JOINING BY INDUCTION HEATING - Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate. | 04-02-2015 |
| 20150121692 | ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING LINE - Provided is an electronic component mounting method including the steps of: placing an electronic component having a primary surface on which a first electrode is formed, on a circuit member having a primary surface on which a second electrode corresponding to the first electrode is formed, with solder and a bonding material including a thermosetting resin interposed between the first and second electrodes; subjecting the thermosetting resin to a first heating at a temperature lower than the melting point of the solder and thus causing the resin to cure, while pressing the electronic component against the circuit member, and then releasing pressure applied for the pressing; and subjecting the solder interposed between the first and second electrodes to a second heating with the pressure released, and thus melting the solder to electrically connect the first and second electrodes. | 05-07-2015 |
| 20160029494 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD - An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality. | 01-28-2016 |
| 20160044798 | METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE - A method of manufacturing a resin multilayer substrate is provided in which a component ( | 02-11-2016 |
