| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 029837000 | By inserting component lead or terminal into base aperture | 34 |
| 20080201943 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method - An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode. | 08-28-2008 |
| 20080301934 | Simultaneous and selective partitioning of via structures using plating resist - Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with plating resist deposited in varying locations are laminated to form a PCB stackup of a desired PCB design. Through-holes are drilled through the PCB stackup through conductive layers, dielectric layers and through the plating resist. Thus, the PCB panel has multiple through-holes that can then be plated simultaneously by placing the PCB panel into a seed bath, followed by immersion in an electroless copper bath. Such partitioned vias increase wiring density and limit stub formation in via structures. Such partitioned vias allow a plurality of electrical signals to traverse each electrically isolated portion without interference from each other. | 12-11-2008 |
| 20090049686 | Method of manufacturing component-embedded printed circuit board - A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first insulation layer stacked over a first metal layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers. | 02-26-2009 |
| 20100218372 | METHOD OF SOLDERING COMPONENTS ON CIRCUIT BOARDS AND CORRESPONDING CIRCUIT BOARD - A method of mounting on a circuit board a component having at least one pin extending therefrom for insertion into a respective hole provided in said circuit board, wherein said component has a coating extending over the proximal end of said at least one pin, said extension of the coating having a circular cross-section is provided. The method may include forming said respective hole as a non noncircular hole. | 09-02-2010 |
| 20100223783 | System and Method for Assembly of a Processor and Socket on an Information Handling System Printed Circuit Board - A grid array socket pin field is protected during manufacture of an information handling system with a dust cap having first and second attachment devices. The first attachment device secures the cap to the socket during assembly of the socket in the computer. The second attachment device secures the cap to a load mechanism assemble proximate the socket. Engagement of the second attachment device to the cap automatically releases the cap from the socket to allow removal of the cap from the socket by actuation of the load mechanism to an open position. The second attachment device secures the cap to the load mechanism until a processor is placed in the socket. | 09-09-2010 |
| 20100236064 | ADAPTER APPARATUS WITH CONDUCTIVE ELEMENTS MOUNTED USING CURABLE MATERIAL AND METHODS REGARDING SAME - An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a curable material. | 09-23-2010 |
| 20100257731 | Device Suitable for Placing a Component on a Substrate, as well as Such a Method - A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa, as well as a global measuring system for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate, which local measuring system is located closer to the substrate carrier than the global measuring system. | 10-14-2010 |
| 20110041332 | CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING BLOCKS - The invention relates to a component comprising, on one face, a set of conductive inserts to be electrically connected to conductive buried regions of another component, said inserts resting on conductive blocks, advantageously produced from a deformable material and positioned at the surface of the component. The surface of the block, which is to come into contact with the insert, has at least one dimension larger than that of the buried region. | 02-24-2011 |
| 20110314668 | MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered. | 12-29-2011 |
| 20120005891 | WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE ENVIRONMENTS - A circuit assembly ( | 01-12-2012 |
| 20120005892 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD INCLUDING A COMPONENT LOCATED IN A VIA - A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board. | 01-12-2012 |
| 20120110842 | LED PACKAGE WITH STEPPED APERTURE - A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed. | 05-10-2012 |
| 20120180311 | ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF - Provided is an electronic device of high reliability having an exposed functional portion. An electronic device | 07-19-2012 |
| 20120311858 | APPARATUS FOR CONDITIONING SEMICONDUCTOR CHIPS AND TEST METHOD USING THE APPARATUS - The present invention provides a device for conditioning semiconductor chips and a corresponding test method. The device comprises a chip temperature control means for receiving a semiconductor chip or a plurality of semiconductor chips and comprises a base body which can be flushed with a fluid for temperature control and which comprises a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip bonding pedestals which are inserted, in thermal contact with the base body, into the recesses which comprise a chip receiving region on the front face and a wiring means on the inside which is constructed for supplying electrical signals from and/or to the semiconductor chip inserted in the respective chip receiving region; and a motherboard attached to the rear face in such a way that the wiring means of the chip bonding pedestals is electrically connected to a wiring means of the motherboard. | 12-13-2012 |
| 20130111745 | PROCESS FOR PROVIDING ELECTRICAL CONNECTIONS WITH REDUCED VIA CAPACITANCE ON CIRCUIT BOARDS - The present invention relates to circuit boards and, more specifically, a process for providing electrical connections with reduced via capacitance on circuit boards. In one embodiment, the present invention provides a method for providing an electrical connection between traces disposed on different layers of a circuit board, the method comprising forming in the circuit board a via hole that interconnects a first electrically conductive trace and a second electrically conductive trace. The via hole includes electrically conductive material thereon. The method further comprises removing a portion of the electrically conductive material from the via hole. | 05-09-2013 |
| 20130291379 | ELECTRONIC COMPONENT MOUNTING DEVICE, ELECTRONIC COMPONENT MOUNTING METHOD, AND METHOD FOR CHANGING ARRANGEMENT OF BOTTOM RECEPTION PIN MODULE - A bottom reception pin module | 11-07-2013 |
| 20130312257 | CONNECTING AN ELECTRONIC COMPONENT TO A PRINTED CIRCUIT BOARD - An electronic component is connected to a circuit board by forming a connector pin on the electronic component, the connector pin having a proximate end secured to the electronic component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through-hole is formed on a circuit board having a circuit board thickness greater than a length of the connector pin, with a first portion that is narrower than each of the compliant portion and the fork lock and extends partially through the circuit board and a second portion that extends beyond the first portion and is wider than the first portion. The connector pin is inserted into the first portion of the through-hole and the fork lock is moved beyond the first portion into the second portion of the through-hole. | 11-28-2013 |
| 20140000107 | METHODS OF MANUFACTURING AN IMPLANTABLE PULSE GENERATOR | 01-02-2014 |
| 20140082936 | METHOD OF MANUFACTURING A WIRING SUBSTRATE - A wiring substrate includes: a substrate having a first surface and a second surface; a first insulating layer stacked on the first surface; a pad electrode stacked on the first insulating layer; a through electrode connected to the pad electrode; and a second insulating layer disposed between the substrate and the through electrode and between the first insulating layer and the through electrode, wherein a diameter of the through electrode in a connection section between the pad electrode and the through electrode is smaller than a diameter of the through electrode on the second surface side, the first insulating layer, the second insulating layer and the through electrode overlap with each other in a peripheral area of the connection section, when seen from a plan view, and the thickness of the first insulating layer in the area is thinner than the thickness of the first insulating layer in other areas. | 03-27-2014 |
| 20140237816 | Extrusion Process for Manufacturing a Z-Directed Component for a Printed Circuit Board - A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material. | 08-28-2014 |
| 20140283381 | METHOD OF MOUNTING ELECTRONIC COMPONENT - A method of mounting an electronic component includes applying solder paste to a through-hole of a printed board on which an electronic component is mounted, placing the electronic component on the printed board with a restricting member that restricts a terminal of the electronic component from entering the through-hole, the restricting member being sandwiched between the electronic component and the printed board, performing reflow at a temperature at which the restricting member melts, and welding the terminal in the through-hole with the solder paste. | 09-25-2014 |
| 20140298648 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Embodiments of the invention provide a method of manufacturing an electronic component-embedded printed circuit board. The method includes the steps of providing a base plate, which has a cavity formed in a thickness direction thereof and to one side of which tape is adhered, and disposing an electronic component in the cavity, such that an active surface of the electronic component is flush with one side of the base plate. The method further includes forming an insulating material layer on the other side of the base plate to bury the electronic component, and removing the tape from the one side of the base plate and then forming a first circuit layer including connection patterns coming into contact with connecting terminals of the electronic component on the one side of the base plate. | 10-09-2014 |
| 20140298649 | COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING SYSTEM - There is provided a component mounting method for fitting a component including downwardly-extending insertion pins on a substrate by sucking the component by a suction nozzle and moving the suction nozzle such that the insertion pins of the sucked component are inserted into pin insertion holes formed in a substrate. The component mounting method includes: positioning the insertion pins and the pin insertion holes, and then pushing the component against the substrate by the suction nozzle, thereby fitting the component on the substrate such that the insertion pins are inserted into the pin insertion holes; and pushing again the component against the substrate after the component is fitted on the substrate, so as to push the insertion pins into the pin insertion holes. | 10-09-2014 |
| 20140345124 | METHOD FOR SOLDERLESS ELECTRICAL PRESS-FIT CONTACTING OF ELECTRICALLY CONDUCTIVE PRESS-FIT PINS IN CIRCUIT BOARDS - A method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards include: providing a circuit board having a thickness, at least one electrical conductor path, and a contacting opening guided perpendicularly through the circuit board and having a metallized inner wall; providing an electrically conductive press-fit pin having a longitudinal axis and having a press-fit region suitable for press-fitting into the contacting opening and having a substantially round cross section; and press-fitting the press-fit pin into the contacting opening by applying onto the press-fit pin a force acting along the longitudinal axis of the press-fit pin, press-fitting being assisted by the application of ultrasound acting on the press-fit pin. | 11-27-2014 |
| 20150052746 | ELECTROCHEMICAL TEST SENSOR AND METHOD OF MAKING THE SAME - An electrochemical test sensor being adapted to assist in determining information relating to an analyte in a fluid sample and includes a base and a second layer. The base includes a plurality of electrodes, a working conductive lead and a counter conductive lead thereon. The electrodes include a working electrode and a counter electrode. The second layer assists in forming a channel in which the channel includes a reagent therein. Auto-calibration information of the test sensor is performed by a plurality of auto-calibration segments connected to one of the following: the working conductive lead, the counter conductive lead, or neither of the conductive leads, at least one of the plurality of auto-calibration segments being connected to the working conductive lead and at least one of the plurality of auto-calibration segments being connected to the counter conductive lead. | 02-26-2015 |
| 20150082627 | ELECTRONIC COMPONENT RETAINERS - According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests. | 03-26-2015 |
| 20150128410 | APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a chuck unit which chucks one of the plurality of leads of the electronic component to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board. | 05-14-2015 |
| 20150128411 | APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board. | 05-14-2015 |
| 20160044794 | METHOD FOR PRODUCING A CIRCUIT BOARD ELEMENT - The invention relates to a method for producing a circuit board element having at least one electronic component, which component has a connection side defined by electrical contacts or a conductive layer and is connected to a temporary carrier for positioning and embedded in an insulating material; the component is attached in a specified position directly to a plastic film as a temporary carrier, whereupon a composite layer having at least a carrier and an electrical conductor, preferably also having an insulating material, is attached on the side of the component opposite the plastic film, with the carrier facing away from the component, and thereafter the plastic film is removed; then the component is embedded in insulating material, After the embedding of the component in the insulating material, an additional composite layer is preferably attached to the component and the embedding of the component on the side opposite the first composite layer. | 02-11-2016 |
| 20160077130 | PROBES FOR TESTING INTEGRATED ELECTRONIC CIRCUITS AND CORRESPONDING PRODUCTION METHOD - Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe. | 03-17-2016 |
| 029838000 | With deforming of lead or terminal | 4 |
| 029839000 | Including metal fusion | 4 |
| 20080307643 | Method of assembly to achieve thermal bondline with minimal lead bending - An improved process for assembling a plurality of power packages and a thermal heat sink to a printed circuit board involves securing the power packages to the heat sink before soldering the electrical leads of the power packages to the printed circuit board. The improved process allows the electrical leads of the power packages to move freely in lead holes in the printed circuit board as intimate planar surface to planar surface contact between the heat sink and the power packages is achieved, thereby eliminating or at least substantially reducing lead bending that occurs in conventional processes wherein attachment of the heat sink to the power packages occurs after the leads of the power packages have been soldered to the printed circuit board. | 12-18-2008 |
| 20090049687 | Electronic Component Mounting Method and Electronic Component Mounting Device - [Problem] To improve productivity and reliability in mounting an electronic component. | 02-26-2009 |
| 20100083495 | METHOD FOR MANUFACTURING SUBSTRATE HAVING BUILT-IN COMPONENTS - A method for manufacturing a substrate having built-in components prevents a short circuit caused by the spread of solder or conductive adhesive. Land regions to connect a circuit component and a wetting prevention region surrounding the land regions are formed on one primary surface of a metal foil. Terminal electrodes of the circuit component are electrically connected to the land regions using solder, and an uncured resin is disposed on and pressure bonded to the metal foil and the circuit component, so that a resin layer in which the circuit component is embedded is formed. Subsequently, a wiring pattern is formed by processing the metal foil. The wetting prevention region is a region obtained by roughening or oxidizing one primary surface of the metal foil so as to reduce solder wettability. | 04-08-2010 |
| 20110061233 | RIB REINFORCEMENT OF PLATED THRU-HOLES - Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB. | 03-17-2011 |
