| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 029834000 | With component orienting | 40 |
| 20080244899 | Component-Mounting Apparatus and Component-Positioning Unit - A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device that holds a component and moves horizontally and a positioning device having a sloped portion for positioning the component held by the holding device when the component comes into contact with the sloped portion. | 10-09-2008 |
| 20080250636 | Component Mounting Method and Apparatus - Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed. | 10-16-2008 |
| 20090000115 | SURFACE MOUNTING APPARATUS AND METHOD - An exemplary method for surface mounting an electronic component onto a pad of a printed circuit board is provided. The electronic component and the printed circuit board are located onto a platform. An outline image of the electronic component is captured using a first image sensing device. Coordinates of a geometrical center of the electronic component are determined using a central processing device. An outline image of the pad is captured using a second image sensing device. Coordinates of a geometrical center of the pad are determined using the central processing device. The electronic component is moved onto the pad using a picking-up/placing device according to the coordinate of the geometrical center of the electronic component and the coordinate of the geometrical center of the pad. The electronic component can be registered with the pad exactly using the method. | 01-01-2009 |
| 20090019691 | MICRO-ELECTROMECHANICAL SUB-ASSEMBLY HAVING AN ON-CHIP TRANSFER MECHANISM | 01-22-2009 |
| 20090205202 | METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor. | 08-20-2009 |
| 20090211087 | METHOD AND SYSTEM FOR IMPROVING ALIGNMENT PRECISION OF PARTS IN MEMS - A method and system for improving alignment precision of MEMS parts during manufacturing are disclosed. According to the invention at least one of the MEMS parts comprises a cavity wherein a sphere or bearing is centered and preferably temporary blocked with a temperature dissipative material. When MEMS parts are in contact of the sphere or bearing, the temperature dissipative material is evaporated, offering a very low friction against two facing MEMS parts moving in different directions, enabling a very precise positioning. | 08-27-2009 |
| 20090249620 | METHOD AND DEVICE FOR APPLYING AN ELECTRONIC COMPONENT - The invention relates to a method for applying an electronic component ( | 10-08-2009 |
| 20100018049 | MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate. | 01-28-2010 |
| 20100064512 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7. | 03-18-2010 |
| 20100122456 | Integrated Alignment and Bonding System - A method for bonding includes providing a first die and a second die; scanning at least one of the first die and the second die to determine thickness variations of the at least one of the first die and the second die; placing the second die facing the first die with a first surface of the first die facing a second surface of the second die; aligning the first surface and the second surface parallel to each other using the thickness variations; and bonding the second die onto the first die. The step of aligning the first surface and the second surface includes tilting one of the first die and the second die. | 05-20-2010 |
| 20100170086 | DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEMBLING OF CHIP-SCALE, AND NANO AND MICRO-SCALE COMPONENTS ONTO A SUBSTRATE - A magnetically-assisted chip assembly unit for assembling at least one chip having a mounting surface and an attachment surface, wherein the attachment surface supports a magnetisable layer thereon and opposes said mounting surface, onto a substrate that has a corresponding chip mounting surface. The unit comprises a template wafer having at least one recess adapted to accommodate therein said chip; and a master wafer having at least one magnetisable element; wherein the template wafer is mounted on the master wafer and said magnetisable element is located at least proximate to the at least one recess such that the magnetisable element is capable of manipulating the chip into the recess, via its magnetisable layer when the magnetisable element is magnetized and generates a magnetic field. Once in the recess, the attachment surface of the chip faces at least a portion of the recess and the mounting surface of the chip faces an opening of the recess. | 07-08-2010 |
| 20120090171 | METHOD FOR MANUFACTURING A RADIATION IMAGING PANEL COMPRISING IMAGING TILES - An automatic or semiautomatic method of assembly of radiation digital imaging tiles to form a one or two dimensional imaging panel whereby the imaging tiles are provided with alignment mark(s), inherent or specific, and a mother board or substrate is also provide with alignment mark(s) and the imaging tiles are mounted on the mother board by means of mechanical pick and place mechanism, whereby the distances of corresponding alignment mark are set to predetermined values, programmed in the automatic machine. | 04-19-2012 |
| 20120117798 | METHOD OF ARRANGING COMPONENTS OF CIRCUIT BOARD FOR OPTIMAL HEAT DISSIPATION AND CIRCUIT APPARATUS HAVING COMPONENTS ARRANGED BY PERFORMING THE METHOD - A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit. | 05-17-2012 |
| 20120159781 | ROTARY MOUNTING HEAD UNIT, AND METHOD AND APPARATUS FOR MOUNTING COMPONENT - A component mounting apparatus including: plural spindles respectively including nozzles, each spindle rotating about a first pivot and each nozzle picking up a component; a head body rotating about a second pivot substantially parallel to a first pivot and rotatably supporting the spindles; and a controller controlling the spindles and the head body to perform: a pickup operation in which the spindle rotates about the first pivot from an initial orientation to a pickup orientation, the nozzle picks up the component, and the spindle rotates from the pickup orientation to the initial orientation so that the component is oriented to a mounting orientation at which the component is to be mounted on a substrate; and a mounting operation in which the picked-up component is transferred to a mounting position of the substrate during which each spindle is retained at the initial orientation. | 06-28-2012 |
| 20120159782 | OPTICAL ALIGNMENT MODULE UTILIZING TRANSPARENT RETICLE TO FACILITATE TOOL CALIBRATION DURING HIGH TEMPERATURE PROCESS - An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligns with the substrate alignment element to position one or more components at a specified location on the substrate. | 06-28-2012 |
| 20120246929 | COMPONENT MOUNTING DEVICE AND SUBSTRATE MANUFACTURING METHOD - A component mounting device which is provided with a transport unit which has a transport region and transports a substrate in the transport region; a plurality of supply regions which are lined up along the transport direction of the substrate due to the transport unit and are able to supply each component; a control unit which sets a mounting region which is a region where the component is mounted in the transport region of the transport unit according to the disposing of the supply region of the component which is necessary for the substrate out of the plurality of supply regions; and a mounting unit which takes out the component which is necessary for the substrate from at least one supply region out of the plurality of supply regions and performs mounting the component on the substrate in the mounting region which has been set. | 10-04-2012 |
| 20120279059 | MICROELECTRONIC PACKAGE AND METHOD FOR A COMPRESSION-BASED MID-LEVEL INTERCONNECT - A microelectronic package includes first substrate ( | 11-08-2012 |
| 20130074332 | METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT - A method of manufacturing a component-built-in wiring substrate which exhibits excellent reliability, through improvement of adhesion between a resin filler and a core substrate, is provided. In some embodiments the method comprises a core substrate preparation step for preparing a core substrate, an accommodation-hole forming step for forming an accommodation hole in the core substrate, and a through-hole forming step for forming through-holes. In a plating-layer forming step, a plating layer is formed on an inner wall surface of the accommodation hole and plating layers are formed on the inner wall surfaces of the through-holes, which become through-hole conductors each having a hollow. In an accommodation step, a component is accommodated in the accommodation hole. In a resin charging step, a resin filler is filled into a gap between component side-surfaces and the inner wall surface of the accommodation hole and into the hollows. | 03-28-2013 |
| 20130104395 | SOCKET FOR SURFACE MOUNT MODULE | 05-02-2013 |
| 20130125392 | Mounting of Components Using Solder Paste Fiducials - A printed circuit board may have patterned traces. Components may be mounted to the printed circuit board using solder. Solder paste may be printed onto the printed circuit board using a stencil. Following reflow operations, the solder paste may form solder bumps that connect component leads to traces on the printed circuit board. Misalignment between the mounted components and printed circuit board traces can be minimized by forming fiducials from solder paste. During the process of printing solder paste patterns on the printed circuit board, solder paste printing equipment may form the solder paste fiducials. Component mounting equipment may use cameras or other imaging equipment to gather information on the location of the solder paste fiducials. The component mounting equipment may then mount the components on the printed circuit using the information on the location of the solder paste fiducials. | 05-23-2013 |
| 20140115886 | METHOD AND SYSTEM FOR MARKING SUBSTRATE AND PLACING COMPONENTS FOR HIGH ACCURACY - A method and system for pre-marking a substrate to provide a visual reference enabling repetitive and accurate component placement on one or more substrates. The method for marking includes determining a first location on a substrate for placing a component relative to a cut outline of the substrate. The method includes placing a fiducial at a second location on the substrate to provide a known dimensional reference to the first location, such that the fiducial and the first location are configured to be in a field-of-view of a component placement machine. | 05-01-2014 |
| 20140237815 | STIFFENER FRAME FIXTURE - Methods and apparatus for coupling a stiffener frame to a circuit board are disclosed. In one aspect, an apparatus for engaging a stiffener frame and a circuit board positioned in a fixture is provided. The stiffener frame includes an edge. The apparatus includes an alignment plate that has a shoulder to engage the edge of the stiffener frame. The alignment plate includes a first opening with a peripheral wall to restrain movement of a circuit board relative to the stiffener frame. | 08-28-2014 |
| 20140373348 | RETROFIT LED BILLBOARD ILLUMINATION SYSTEM - A method for retrofitting a billboard system illuminated by an arc lamp which includes a reflector with reflector features and an output lens includes the steps of removing the lens from the arc lamp housing, mapping the light pattern output of the arc lamp, and then removing the arc lamp and reflector from the housing. Next, a plurality of LEDs is mounted on an LED circuit board in a pattern so that light output by the LEDs replicates the light pattern of the arc lamp, including the reflected light. The circuit board is then installed inside the housing, and the lens is reattached. Preferably, the LEDs include a central LED cluster of densely packed LEDs to replicate the original output of the arc and a pair of LED groups of less densely packed LEDs, located on either side of the LED cluster, to replicate the output from the reflector. If desired, some of the LEDs may be oriented at an angle relative to the circuit board to help replicate more precisely the original output of the arc lamp which may include light that is reflected by interior surfaces of the arc lamp housing and not directly emitted from the arc or reflector. | 12-25-2014 |
| 20150082626 | MOUNTING ARRANGEMENT AND METHOD FOR LIGHT EMITTING DIODES - A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules. | 03-26-2015 |
| 20150359149 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - An electronic component mounting system includes: a printing apparatus; a plurality of electronic component mounting apparatuses; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic component mounting apparatuses. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for each of the electronic component mounting apparatuses by referring to the mounting information. | 12-10-2015 |
| 20150382522 | COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD - A component mounting device which mounts on a board electronic components including a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board. The component mounting device includes a moving and mounting head which holds and takes out the fitting component by a holding unit from a component supply part to move and mount the fitting component on the to-be-attached part of the board, and a pressing head which presses the fitting component that is moved and mounted on the to-be-attached part by a pressing unit to attach the fitting component to the to-be-attached part. | 12-31-2015 |
| 20160007511 | INTERNAL PCI ADAPTER CARD CARRIER - According to one embodiment, a method for placing an adapter card on a system board of a computer system includes, aligning a tool having an adapter card secured therewith to a slot on a system board of a computer system using a positioning member, and seating the adapter card into the slot on the system board. The tool includes a carrier for supporting the adapter card, at least one lower retaining member extending from a lower portion of the carrier for securing the adapter card to the carrier, at least one upper retaining member extending from an upper portion of the carrier for securing the adapter card to the carrier, and the positioning member coupled to the carrier. | 01-07-2016 |
| 20160029521 | COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD - A component mounting apparatus includes a component supply device that intermittently feeds a carrier tape, in which components are stored in a plurality of pockets formed with a uniform pitch, based on a predetermined feed pitch to supply the components stored in the pockets to a component suction position, and picks up the components supplied to the component suction position to mount the components onto a board, an imaging unit that images the pockets, and a control unit that measures a formation pitch of the pockets based on obtained image data, and changes a feed pitch of the carrier tape from the predetermined feed pitch to the formation pitch of the pockets when the measured formation pitch of the pockets and the predetermined feed pitch are different from each other, and the component supply device intermittently feeds the carrier tape based on the changed feed pitch. | 01-28-2016 |
| 20160105974 | INTEGRATED ASSEMBLY FOR INSTALLING INTEGRATED CIRCUIT DEVICES ON A SUBSTRATE - In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described. | 04-14-2016 |
| 20160255752 | COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING APPARATUS | 09-01-2016 |
| 20170236773 | DEVICE WITH TOP-SIDE BASE PLATE | 08-17-2017 |
| 029835000 | And shaping, e.g., cutting or bending, etc. | 2 |
| 20080295328 | Method of manufacturing electronic component package - In a method of manufacturing an electronic component package, first, a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages are formed by plating on a top surface of a substrate to thereby fabricate a wafer. The wafer includes a plurality of pre-base portions that will be separated from one another later to become bases of the respective electronic component packages. Next, at least one electronic component chip is bonded to each of the pre-base portions of the wafer. Next, electrodes of the electronic component chip are connected to the external connecting terminals. Next, the electronic component chip is sealed. Next, the wafer is cut so that the pre-base portions are separated from one another and the plurality of bases are thereby formed. | 12-04-2008 |
| 20090013526 | INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS AND METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS USING THE SAME - An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards. | 01-15-2009 |
| 029836000 | Different components | 7 |
| 20090183365 | METHOD FOR ASSEMBLING LENS MODULE WITH IMAGE SENSOR - A method for assembling a lens module with an image sensor, includes providing a holder having first and second receiving spaces, disposing the image sensor in the second receiving space, locating lens barrel at a first position in the first receiving space, casting a light beam on the lens module to allow the lens module to converge the light beam into a light spot on the image sensor, determining if the light spot is at its smallest to determine if a distance between the lens module at the first position and the image sensor is equal to a focal length of the lens module, moving the lens module to a second position in the first receiving space to achieve a predetermined distance from the first position, and positioning the lens module at the second position. | 07-23-2009 |
| 20100011572 | ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP AND PROCESS FOR PRODUCING THE SAME - A process for producing an electronic component assembly, comprising the steps of: (1) preparing a first electronic component whose surface (A) is provided with a plurality of electrodes (a) and a second electronic component whose surface (B) is provided with a plurality of electrodes (b) wherein at least one concave portion is formed in the surface (A) (except for a surface region on which the electrodes (a) are provided) and/or the surface (B) (except for a surface region on which the electrodes (b) are provided); (2) supplying a resin that comprises a solder powder onto the surface (A) of the first electronic component; (3) bringing the second electronic component into contact with a surface of the resin such that the plurality of electrodes (a) of the first electronic component are opposed to the plurality of electrodes (b) of the second electronic component; and (4) heating the first electronic component and/or the second electronic component, and thereby forming solder connections from the solder powder, the solder connections serving to electrically interconnect the electrodes (a) and (b), wherein, upon the heating step (4), gas bubbles are generated within the resin such that the bubble generation originates at least from the concave portion, and the generated bubbles cause the solder powder to move and congregate onto the electrodes (a) and (b). | 01-21-2010 |
| 20110167627 | METHOD OF MOUNTING ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS - A method of mounting electronic components on a PCB, includes following steps. The PCB is placed with a first side of the PCB facing upwards. A plurality of solder is applied on bonding pads of the first side. A plurality of electronic components is stuck on the bonding pads of the first side. The PCB is turned over with a second side of the PCB facing upwards and the first side of the PCB facing downwards. A plurality of solder is applied on bonding pads of the second side. A plurality of electronic components is stuck on the bonding pads of the second side. The PCB is placed in a reflow oven to weld the electronic components on the first side and the second side of the PCB. | 07-14-2011 |
| 20130118008 | THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING - Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board. | 05-16-2013 |
| 20130205588 | Method and System for Improving Alignment Precision of Parts in MEMS - Methods for improving alignment precision of two parts of an electronic device are disclosed. Two parts are stacked with an intervening rolling element having a first diameter. One part can pivot relative to the other part about the rolling element to bring the two parts into alignment. The pivoting can be achieved by imposing a z-direction force on the parts, such as a magnetic force. The aligned parts can be locked by solidification of solder. Prior to the pivoting step, the one rolling element can be held on one of said two parts using a thermally dissipative material that comprises glycerol. | 08-15-2013 |
| 20140082935 | METHOD FOR PASSIVE ALIGNMENT OF OPTICAL COMPONENTS TO A SUBSTRATE - A method for placing components on a substrate, the method comprising determining a reference point of a mechanical holding jig based upon a plurality of mechanical features of the mechanical holding jig and placing the substrate into the jig such that mechanical features on the substrate align with the mechanical features on the mechanical holding jig. A location of the substrate is determined with the reference point of the mechanical holding jig. The method continues by installing a plurality of first components onto the substrate aligned to the mechanical holding jig. The substrate is removed from the mechanical holding jig and a second component is placed onto the substrate to cover the plurality of first components. The second component is placed onto the substrate to align a plurality of references points of the second component to the mechanical features on the substrate. The second component is secured to the substrate. | 03-27-2014 |
| 20150293020 | INTEGRATED SMOKE CELL - A method includes forming a housing having a ceiling portion and a smoke permeable wall portion. The ceiling portion of the housing has a first aperture and a second aperture. The method includes mounting a circuit board to the housing so that the housing and the circuit board collectively define a smoke chamber that is bounded by the ceiling portion, the smoke permeable wall portion and the circuit board. The method includes placing an emitter in the first aperture and placing a detector in the second aperture. The emitter defines an emitting region in the smoke chamber and the detector defines a detecting region in the smoke chamber. In a typical implementation, the detecting region at least partially intersects the emitting region in the smoke chamber, and the emitter and the detector are disposed substantially outside the smoke chamber. | 10-15-2015 |
