| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 029833000 | By utilizing optical sighting device | 7 |
| 20090007423 | Methods of Providing Semiconductor Components within Sockets - The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs. | 01-08-2009 |
| 20100325884 | MOUNTING APPARATUS AND MOUNTING METHOD - A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera. | 12-30-2010 |
| 20140130348 | COMPONENT MOUNTER, NOZZLE, AND COMPONENT MOUNTING POSITION CORRECTING METHOD - A component mounter includes: a nozzle having a nozzle main body and a reflecting part provided behind the main nozzle body and reflecting light from front, the nozzle main body including a greatest outer periphery section provided to a front section of the main nozzle body, and the greatest outer periphery section of an outer periphery of the nozzle main body provided in front on the reflecting part; a first illuminating unit provided in front of the reflecting part and illuminating the reflecting part from front with light; and an imaging unit provided in front of the nozzle and capturing the greatest outer periphery section positioned in front of the nozzle main body, using the light from the first illuminating light and reflected off the reflecting part. | 05-15-2014 |
| 20140283380 | PLACEMENT APPARATUS FOR OPTICAL COMPONENT, SUCTION NOZZLE FOR OPTICAL COMPONENT, AND A METHOD OF PRODUCING ELECTRONIC DEVICE - A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes. | 09-25-2014 |
| 20150013154 | METHOD FOR MOUNTING ELECTRONIC COMPONENT AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT - A mid-operation instruction action mode is set when an operation for producing a printed circuit board starts, an offset value with respect to the center of rotation of a mounting head is determined in an interval according to the set mid-operation instruction action mode, and an instruction for saving the offset value in a memory of a control microcomputer is made. If the requisite accuracy is delivered as a result of the instructions being performed a plurality of times in continuation, the control microcomputer performs a control so that the instructions are performed over a greater interval than the interval according to the mid-operation instruction action mode. If the requisite accuracy is not delivered even if the instructions are performed over an interval greater than the interval, the control microcomputer performs a control so that the instructions are performed over an interval according to the set mid-operation instruction action mode. | 01-15-2015 |
| 20150026974 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - A control unit of an electronic component mounting apparatus controls a component imaging unit so as to image an electronic component that is held by the holding unit when the holding unit is subjected to an acceleration movement or a deceleration movement by a movement mechanism unit. | 01-29-2015 |
| 20150325969 | DEVICE AND METHOD FOR SEPARATION OF A CRIMPED WIRE TERMINAL FROM A TAPE TERMINAL CARRIER STRIP - Devices and methods to facilitate separation of a crimped wire terminal from a tape terminal carrier strip. The devices and methods weaken the attachment between the crimped wire terminal and the tape terminal carrier strip to facilitate effective, efficient, and reliable removal of the crimped wire terminal from the tape terminal carrier strip. | 11-12-2015 |
