Class / Patent application number | Description | Number of patent applications / Date published |
029831000 | Assembling formed circuit to base | 35 |
20080209718 | Method of manufacturing multi-layered printed circuit board - The present invention relates to a method of manufacturing a multi-layered printed circuit board which can decrease the cost and time required to produce the printed circuit board and can improve heat radiation characteristics and bending strength. | 09-04-2008 |
20080235939 | Manufacturing Method For Micro-SD Flash Memory Card - A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCB regions arranged in parallel rows. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded layer is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The panel is then singulated using one of a laser cutting method, an abrasive water jet cutting method, and a mechanical grinding method such that the resulting PCB substrate and plastic housing have the width, height and length specified by MicroSD specifications. A front edge chamfer process is then performed. | 10-02-2008 |
20080276455 | METHOD OF MAKING AN ELECTROCHEMICAL SENSOR - A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes forming channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line. | 11-13-2008 |
20090013525 | Manufacturing method for printed circuit board - A manufacturing method for a printed circuit board is disclosed. The method includes: forming a first circuit pattern on a metal layer of a conductive carrier, which has the metal layer stacked on one side, pressing the conductive carrier and a first insulation layer together with the first circuit pattern facing the first insulation layer, forming a via by selectively removing the conductive carrier, and removing the metal layer. Using this method, a high-density thin package can be manufactured with increased reliability, and the productivity of the manufacturing process can also be improved. | 01-15-2009 |
20090193652 | SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS - A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at the bottom of the stack. A cooling channel is optionally provided between each pair of modules. Each module is re-workable because all integrated circuit attachments within the module employ re-workable flip chip connectors. Also, defective modules can be removed from the stack by directing hot inert gas at externally accessible solder connections. | 08-06-2009 |
20090300910 | Method for Applying Electrical Conductor Patterns to a Target Component of Plastic - The invention relates to a method for applying electrical conductor patterns ( | 12-10-2009 |
20090300911 | METHOD OF MANUFACTURING WIRING SUBSTRATE AND CHIP TRAY - A method of manufacturing a wiring substrate comprises the steps of attaching a semiconductor chip to a chip positioning plate of a chip tray formed of silicon, executing wiring formation processing using the semiconductor chip attached to the chip positioning plate as a base point, and detaching the wiring-formed wiring substrate from the chip positioning plate. The chip positioning plate comprises a receiving part for receiving the semiconductor chip, and elastic members respectively disposed in two adjacent surfaces of four surfaces constructing an inside surface of the receiving part, and each of these elastic members exerts pressing force toward directions of opposite surfaces, and the semiconductor chip is pinched between each of the opposite surfaces corresponding to each of the elastic members. | 12-10-2009 |
20100000083 | METAL-CONTAINING RESIN PARTICLE, RESIN PARTICLE, ELECTRONIC CIRCUIT SUBSTRATE, AND METHOD OF PRODUCING ELECTRONIC CIRCUIT - According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided. | 01-07-2010 |
20100005652 | Method of manufacturing a wiring substrate, method of manufacturing a tape package and method of manufacturing a display device - Disclosed is a method of manufacturing a wiring substrate, a tape package using the wiring substrate, and a display device using the wiring substrate. In a method of manufacturing a wiring substrate, a screen may be disposed on a base plate, the screen having openings for forming wirings. A conductive paste may be coated in the openings of the screen. A substrate may be on the screen, the conductive paste being coated in the openings of the screen. The conductive paste may be hardened to be adhered to the substrate. The base plate and the screen may be removed from the substrate to form wirings on the substrate. Because the wirings may be formed using a glass substrate having heat-resisting properties by simplified processes, thermal deflections of the substrate and dimension variations in manufacturing processes may be reduced or minimized. | 01-14-2010 |
20100043222 | CONFORMING, ELECTRO-MAGNETIC INTERFERENCE REDUCING COVER FOR CIRCUIT COMPONENTS - An electronic circuit component is provided with shielding for electromagnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied. | 02-25-2010 |
20100083490 | MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer circuit board comprises core layers | 04-08-2010 |
20100162561 | SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS - A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms. | 07-01-2010 |
20110041331 | Method for Compensating For Crosstalk - An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation. | 02-24-2011 |
20110126408 | Method of making high density interposer and electronic package utilizing same - A method of making an electronic package designed for interconnecting high density patterns of conductors of an electronic device (e.g., semiconductor chip) and less dense patterns of conductors of hosting circuitized substrates (e.g., chip carriers, PCBs). In one embodiment, the method includes bonding a chip to a single dielectric layer, forming a high density pattern of conductors on one surface of the layer, forming openings in the layer and then depositing metallurgy to form a desired circuit pattern which is then adapted for engaging and being electrically coupled to a corresponding pattern on yet another hosting substrate. According to another embodiment of the invention, an electronic package using a dual layered interposer is provided. Also provided are methods of making circuitized substrate assemblies using the electronic packages made using the invention's teachings. | 06-02-2011 |
20110277319 | LIQUID EJECTION HEAD AND IMAGE FORMING APPARAUTS INCLUDING LIQUID EJECTION HEAD - The liquid ejection head for ejecting liquid from nozzles includes: pressure chambers connecting to the nozzles; a common liquid chamber which is connected to the pressure chambers, is arranged across the pressure chambers from the nozzles, and is defined by at least a multi-layer wiring substrate which has a recess-shaped structure including a base section forming one of a ceiling and a floor of the common liquid chamber and a projecting section forming a side wall of the common liquid chamber; electrical wires which are formed at least partially inside the multi-layer wiring substrate; and a connection electrode which is provided in a top of the projecting section of the multi-layer wiring substrate. | 11-17-2011 |
20120124828 | ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened. | 05-24-2012 |
20120151760 | NON-PLANAR DISPLAY GLASS FOR MOBILE DEVICE - A method of manufacturing a touch screen display may include heating a substantially planar glass sheet to a working temperature. The planar glass sheet may be bent into a non-planar configuration to include a curved inside surface and a curved outside surface. The curved inside surface may be ground to form a substantially planar inside surface. A touch screen assembly may be mounted to the substantially planar inside surface. | 06-21-2012 |
20120210576 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced. | 08-23-2012 |
20120246926 | Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module - A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board. | 10-04-2012 |
20120317801 | Reusable electronic circuit assembling and testing system and uses thereof - A reusable electronic circuit assembling system facilitates assembly and testing of electronic circuits. The system has at least one baseboard and one or more assembling blocks magnetically or mechanically attached to the baseboard. Each assembling block has at least two electrically connected conductive clips located separately in the opening holes of the assembly block. Discrete electronic components are connected by selectively inserting the electrodes of the to-be-connected electronic components into the clips of the assembling blocks. A complete circuit is constructed by attaching the above block-component assemblies on the baseboard and connecting them in accordance with the desired circuit diagram. | 12-20-2012 |
20130283606 | MAKING STORAGE SYSTEM HAVING ENVIRONMENTALLY-MODIFIABLE CONDUCTOR - A method of making an electronic storage system includes receiving a substrate with a detection region. A transceiver formed on a transceiver substrate separate from the substrate is affixed to the substrate. A code circuit separate from the transceiver is disposed over the substrate. The code circuit includes a conductor disposed over the substrate at least partly in the detection region. The conductor has an electrical state that changes in response to an environmental factor. The transceiver is electrically connected to the code circuit so that the transceiver can detect the electrical state of the conductor. The transceiver includes an interface adapted to selectively transmit an uplink signal representing the electrical state of the conductor. | 10-31-2013 |
20140000106 | CIRCUIT BOARD MODULE AND METHOD OF MAKING THE SAME | 01-02-2014 |
20140007425 | MANUFACTURING METHOD OF ELECTRONIC PACKAGING - A manufacturing method of electronic packaging includes the steps of preparing a metallic plate having an array of cover portions, soldering the metallic plate to a circuit board having encapsulated areas corresponding to the cover portions and employing a cutting process to obtain multiple electronic packages. Thus, the invention has the advantages of low cost and high efficiency | 01-09-2014 |
20140033526 | FABRICATING METHOD OF EMBEDDED PACKAGE STRUCTURE - A fabricating method of an embedded package structure includes following steps. First and second boards are combined to form an integrated panel. First and second circuit structures are respectively formed on the first and second boards that are then separated. An embedded element is electrically disposed on the first circuit structure. First and second conductive bumps are respectively formed on a conductive circuit substrate and the second circuit structure. First and second semi-cured films are provided; a laminating process is performed to laminate the first circuit structure on the first board, the first and second semi-cured films, the conductive circuit substrate, and the second circuit structure on the second board. The first and second semi-cured films encapsulate the embedded element. The first and second conductive bumps respectively pierce through the first and second semi-cured films and are electrically connected to the first circuit structure and the conductive circuit substrate, respectively. | 02-06-2014 |
20140075750 | TOUCH SCREEN PANEL AND METHOD OF PREPARING THE SAME - A touch screen panel and a method for preparing the same, and more specifically, a touch screen panel includes a window plate | 03-20-2014 |
20140290053 | METHOD OF MANUFACTURING SPACE TRANSFORMER FOR PROBE CARD - A method of manufacturing a space transformer for a probe card includes the steps of mounting and electrically connecting second substrates on a first substrate, forming an insulated layer with through holes on each of the second substrates, and forming electrically conductive blocks in the through holes, respectively. Because the electrically conductive blocks are formed after the second substrates are mounted to the first substrate, any unexpected relative displacement of the first and second substrates during mounting is uninfluential to positions of the electrically conductive blocks. Besides, a step of planarizing the electrically conductive blocks can be further carried out. Therefore, the positions and flatness of probe needles may not need to be adjusted after the probe needles are connected with the electrically conductive blocks of the space transformer thus obtained. | 10-02-2014 |
20150026971 | WAFER LEVEL CAMERA MODULE AND METHOD OF MANUFACTURE - A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps. | 01-29-2015 |
20150033553 | ASSEMBLY METHOD OF DIRECT-DOCKING PROBING DEVICE - An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate. | 02-05-2015 |
20150033554 | ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS - Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An EMI shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material. | 02-05-2015 |
20150135525 | METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS - A method for selectively transferring active components from a source substrate to a destination substrate includes providing a source substrate having a process side including active components and a back side opposite the process side, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces and facing the back side; pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; pressing a second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars, wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars; and pressing the second stamp including the active components on the second pillars thereof against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate. | 05-21-2015 |
20150342470 | Method of Manufacturing Implantable Wireless Sensor for Pressure Measurement - A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation. | 12-03-2015 |
20150351206 | Computer Lighting Control - The present invention relates to a method and system that provides independent control over lighting within a computer case. Each inverter module is provided with its own switch to facilitate independent control of illumination. Preferably, the switches are located in a bus that fits within a drive bay and the inverter is directly mounted onto the housing that contains the switch. In another embodiment, the inverter is integrated in a printed circuit board that is inserted into the card slots (e.g. ISA, VESA, PCI, and PCI-Express card slot) on the mother board of the computer. Therefore, the on and off of CCFL inverter can be controlled by software application through the ISA, VESA, PCI, or PCI-Express bus. | 12-03-2015 |
20160091523 | Speed Sensor Assembly - A robust and compact speed sensor assembly that includes a Hall effect sensor with protective circuitry in a compact housing that can be attached to the wheel of a motorcycle in the vicinity of the brake rotor to present the sensor Hall plate in a proper transverse-to-target orientation to detect passing targets, such as the brake rotor mounting bolts or magnets. | 03-31-2016 |
20160118760 | PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS - Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package. | 04-28-2016 |
20160128207 | BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS - A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed. | 05-05-2016 |