Class / Patent application number | Description | Number of patent applications / Date published |
029830000 | Assembling bases | 80 |
20080209717 | Thermal bonding structure and manufacture process of flexible printed circuit board - A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first insulating layer with a solder pad area and showing parts of a first conductive layer, the first conductive layer, a second insulating layer, a second conductive layer, and a third insulating layer with a bonding area such that a part of the second conductive layer is exposed, and at least a through hole passing through the first conductive layer to the second conductive layer for propagating heat energy to fuse a solder. Accordingly, the reduction of heat energy lost in the third insulating layer improves the bonding quality, shortens the bonding period, and maintains the material stability under high temperature resulted from high heat energy. | 09-04-2008 |
20080244898 | Non-Planar Circuit Board and a Method for Fabricating the Same - A method for forming a circuit board is provided. The method includes forming a circuit board substrate ( | 10-09-2008 |
20080250634 | MULTI-LAYER BOARD MANUFACTURING METHOD THEREOF - A base material ( | 10-16-2008 |
20080289174 | Process for the Collective Fabrication of 3D Electronic Modules - The invention relates to the collective fabrication of n 3D modules. It comprises a step of fabricating a batch of n wafers I on one and the same plate, this step being repeated K times, then a step of stacking the K plates, a step of forming plated-through holes in the thickness of the stack, these holes being intended for connecting the slices together, and then a step of cutting the stack in order to obtain the n 3D modules. | 11-27-2008 |
20080295325 | MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED INTERPOSER WITH THROUGH-SILICON-VIAS - The formation of electronic assemblies, including assemblies having an interposer, are described. In one embodiment, a method includes forming a plurality of vias extending partially through a body, the vias including sidewalls defined by the body. An insulating layer is formed on the sidewalls and on an upper surface of the body. An electrically conductive layer is formed on the insulating layer in the vias and on the upper surface of the body, the electrically conductive layer defining a first metal pad layer on the upper surface and a second metal pad layer in contact with the first metal pad layer, the second metal pad layer having a denser pitch between adjacent pads than the first metal pad layer. The method also includes forming a dielectric layer between the adjacent metal pads in the first and second pad layers. The method also includes coupling a plurality of elements to the second metal pad layer. After the coupling the elements, the method includes thinning the body through a lower surface and exposing the electrically insulating layer in the vias. The method also includes removing a portion of the electrically insulating layer in the vias, and coupling the electrically conductive layer to a substrate, wherein the body is positioned between the elements and the substrate. Other embodiments are described and claimed. | 12-04-2008 |
20080301933 | Method of providing a printed circuit board with an edge connection portion - A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector. | 12-11-2008 |
20080313893 | METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD - A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the electronic circuit is formed, a step of specifying positions and defect types of defects on the main surface of the glass substrate, a step of calculating reference point coordinates on the main surface of the glass substrate and correcting the coordinates, a step of extracting respective defects from an image around the defects and specifying a defect to be corrected in the extracted defects by referring to a defect existing range registered in advance for each defect type, and a step of cutting the specified defect. By this method, a foreign material adhering to the glass substrate is not erroneously judged as short-circuit defect causing short-circuit on the electronic circuit, and only defect actually requiring correction can be removed. | 12-25-2008 |
20090031561 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening. | 02-05-2009 |
20090044403 | SYSTEM AND METHOD FOR IMPROVING POWER DISTRIBUTION CURRENT MEASUREMENT ON PRINTED CIRCUIT BOARDS - A method and system for improving power distribution and/or current measurement on a printed circuit board is disclosed. According to the invention, a first power plane adapted for current measurement includes a first segment to which a current source is connected and a second segment to which other devices may be connected, forming the current load. A third segment is used to measure the current between the first segment and the second segment through two vias that link two points of the third segment to, preferably, two pads of the external layer. In a preferred embodiment, vias are connected to the first segment so that current flow in the third segment is linear, to improve and simplify current determination. The resistivity between the pair of vias may be computed or estimated using calibrated currents. | 02-19-2009 |
20090241333 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD HAVING DIFFERENT THICKNESSES IN DIFFERENT AREAS - A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material. | 10-01-2009 |
20090260228 | PROCESS FOR THE VERTICAL INTERCONNECTION OF 3D ELECTRONIC MODULES BY VIAS - The present invention relates to a process for the vertical interconnection of 3D electronic modules ( | 10-22-2009 |
20090271979 | CIRCUITRY FOR PRINTER - A printing system includes a print head to deliver ink to an image receptor and at least one ink reservoir to deliver ink to the print head. Driving circuitry provides signals to the print head to control delivery of the ink and a flexible circuit interposed between the print head and the ink reservoirs connects the driving circuitry to the print head. The flexible circuit may include a heater to provide heat to the ink reservoirs. Alternatively, the flexible circuit may be replaced with a rigid substrate having a heater within its layers. | 11-05-2009 |
20100005651 | Conductive elastomeric and mechanical pin and contact system - A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector ( | 01-14-2010 |
20100058584 | SYSTEM AND METHOD FOR MANUFACTURING LAMINATED CIRCUIT BOARDS - The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation. | 03-11-2010 |
20100107409 | Method for Pulling and Cutting a Z-Axis Electrical Interconnector - A connection portion of a z-axis interconnector is assembled into contact with a plurality of aligned vias in a corresponding plurality of stacked printed circuit boards by gripping and pulling a leader portion of the interconnector connected to the connection portion, to move the interconnector into the final position with the connection portion contacting the aligned vias. The leader portion is severed from the connection portion after the interconnector is moved into the final position. A single pulling and cutting tool which accomplishes these functions preferably does so by a single pinch and cut device having opposing blades which partially penetrate into the leader portion to grip the leader portion, which fully penetrated through the leader portion to sever the leader portion, and which are moved toward and away from the plurality of stacked printed circuit boards to pull the interconnector and to reposition for severing the leader portion. | 05-06-2010 |
20100115766 | FABRICATION METHOD FOR MULTI-PIECE BOARD - A fabrication method for a multi-piece board having a frame part and multi piece parts each having a printed wiring board includes producing the frame part having a first coupling portion, and the multi-piece parts including piece parts each having a second coupling portion coupled to the first coupling portion at a production panel with at least the frame part and the piece parts being separated from each other, separating the frame part and the multi-piece parts from the production panel, and coupling the first coupling portion to the second coupling portion to couple the frame part and the piece parts and combine the frame part and the multi piece parts so as to yield the multi-piece board. | 05-13-2010 |
20100139087 | Microwave Device for Rapid Prototyping - A system of rapid prototyping, having: a plurality of thin sheets of low loss dielectric film, each sheet having a different metallization pattern formed thereon; and a base onto which each of the plurality of thin sheets of low loss dielectric film can be received, wherein the base comprises a metallization pattern formed thereon, and wherein placement of each of the plurality of thin sheets of low loss dielectric film onto the base results in a different circuit being formed across the thin sheet and the base. | 06-10-2010 |
20100192371 | Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same - A wiring board is provided with an external connection terminal to which an electrode terminal of an electronic component is to be connected. The external connection terminal is formed so that a portion thereof is electrically connected to a pad portion exposed from an outermost insulating layer on an electronic component mounting surface of a wiring board body and so that an air gap is kept between a portion of the external connection terminal, to which the electrode terminal of the electronic component is to be connected, and the insulating layer. | 08-05-2010 |
20100251541 | WIRING BOARD RECEIVING PLATE, AND DEVICE AND METHOD FOR CONNECTION OF WIRING BOARD USING THE SAME - Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head | 10-07-2010 |
20100263208 | CIRCUIT CONNECTING METHOD - The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection. | 10-21-2010 |
20100299917 | Method for Manufacturing A Printed Circuit Board - A method for manufacturing a printed circuit board is disclosed. The method comprises the steps of: providing a base board, wherein the base board comprises a first surface layer; performing a first patterning process to the base board to form a bottom circuit on the first surface layer; forming a metal protection layer on the bottom circuit; performing a second patterning process to the metal protection layer to form a patterned metal protection layer; performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer; performing a third patterning process to the first built-up layer to form a first built-up layer circuit; performing a laser manufacturing process to the first built-up layer to form a cavity structure; and clearing the patterned metal protection layer. | 12-02-2010 |
20110010932 | WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD - The present disclosure relates to a method of manufacturing a wiring board. The method includes: (a) preparing a first board having a pad; (b) providing an insulating member on the first board, wherein a size of the insulating member is larger than that of the first board, when viewed from the top; (c) forming a via in the insulating member such that the via is directly connected to the pad; and (d) repeatedly forming a wiring layer and an insulating layer on the insulating member in which the via is formed, thereby forming a second board. | 01-20-2011 |
20110041329 | ROOM TEMPERATURE METAL DIRECT BONDING - A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed. | 02-24-2011 |
20110041330 | METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO VIAS - A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate. | 02-24-2011 |
20110061231 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer. | 03-17-2011 |
20110067232 | METHOD AND APPARATUS FOR ASSEMBLY OF CIRCUIT BOARDS - A circuit board assembly fixture is used in assembling a circuit board assembly. The fixture includes supporting surfaces each including a first side and an opposite second side, wherein each first side receives at least one of the fixed circuits to be coupled together using at least one flexible circuit. The fixture also includes at least one hinge to couple the supporting surfaces together, wherein the hinge enables the supporting surfaces to be folded into a desired alignment relative to each other and provides structural support for the assembly. Moreover, the fixture includes at least one fastening mechanism extending from the surface first side to retain the fixed circuits in position relative to the supporting surfaces. Further, the fixture includes at least one retainer coupled to at least one of the supporting surfaces to retain an alignment of each of the supporting surfaces relative to each other. | 03-24-2011 |
20110131803 | Method of manufacturing a hollow surface mount type electronic component - A method of manufacturing a hollow surface mount type electronic component has a preparing step, a gluing step and a cutting step. The preparing step includes preparing a baseboard, a clapboard and a cover board, mounting multiple circuit segments and conducting points on two opposite faces of the baseboard at intervals and boring multiple through holes on the clapboard corresponding to the circuit segments. The gluing step includes mounting multiple electronic elements on the baseboard to connected with the circuit segments, gelatinizing glue on the boards to mount the clapboard between the baseboard and the cover board and pressing the boards by a pressing machine. The cutting step includes cutting the boards by a cutting machine to produce multiple single SDM electronic components. | 06-09-2011 |
20110131804 | Substrate treating apparatus and method for manufacturing semiconductor device - A support section ( | 06-09-2011 |
20110138619 | Methods for Constructing Millimeter-Wave Laminate Structures and Chip Interfaces - A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity. | 06-16-2011 |
20110214285 | CARBON NANOTUBE AND METAL THERMAL INTERFACE MATERIAL, PROCESS OF MAKING SAME, PACKAGES CONTAINING SAME, AND SYSTEMS CONTAINING SAME - A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on the substrate to form the CNT array by growing. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used. | 09-08-2011 |
20110225817 | PRINTED CIRCUIT BOARD - A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component. | 09-22-2011 |
20110232084 | METHOD OF ASSEMBLING A CIRCUIT BOARD ASSEMBLY - A circuit board assembly fixture is used in assembling a circuit board assembly. The fixture includes supporting surfaces each including a first side and an opposite second side, wherein each first side receives at least one of the fixed circuits to be coupled together using at least one flexible circuit. The fixture also includes at least one hinge to couple the supporting surfaces together, wherein the hinge enables the supporting surfaces to be folded into a desired alignment relative to each other and provides structural support for the assembly. Moreover, the fixture includes at least one fastening mechanism extending from the surface first side to retain the fixed circuits in position relative to the supporting surfaces. Further, the fixture includes at least one retainer coupled to at least one of the supporting surfaces to retain an alignment of each of the supporting surfaces relative to each other. | 09-29-2011 |
20110247207 | METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit being created so as to align with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas. | 10-13-2011 |
20110247208 | MULTILAYERED PRINTED WIRING BOARD - A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material. | 10-13-2011 |
20110247209 | METHOD OF MAKING CONTACT PROBE - [Problem] To provide a contact probe which can easily be connected with a measurement apparatus electrically, can measure a high speed and high frequency signal with a fine pitch easily and correctly, and can easily cope with signal measurement for a plurality of channels, and a method of making the contact probe. | 10-13-2011 |
20110271523 | BALL GRID ARRAY STACK - The invention discloses a device comprising a stack of at least two layers, which may comprise active or passive discrete components, TSOP and/or ball grid array packages, flip chip or wire bonded bare die or the like, which layers are stacked and . interconnected to define an integral module. A first and second layer comprise an electrically conductive trace with one or more electronic components in electrical connection therewith. The electrically conductive traces terminate at a lateral surface of each of the layers to define an access lead. An interposer structure is disposed between the layers and provides an interposer lateral surface upon which a conductive layer interconnect trace is defined to create an electrical connection between predetermined access leads on each of the layers. | 11-10-2011 |
20110296679 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A method of manufacturing a wiring board including forming a first wiring board, the forming of the first board including forming a substrate, forming a first insulation layer on a surface of the substrate and a second insulating layer on the opposite surface of the substrate, forming a via in one of the layers, and cutting the first layer in a first area and cutting the second layer in a second area offset from the first area to form a first substrate laminated to a second substrate with the substrate interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond edge of the second substrate, connecting a pliable member to the substrate, and connecting the member to a second wiring board to connect the first and second boards. One or more insulation layers are a non-pliable layer. | 12-08-2011 |
20120005890 | Method of manufacturing printed circuit board for optical waveguides - A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed. | 01-12-2012 |
20120023744 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - In a method for manufacturing multilayer PCBs having n circuit layers, a double-sided flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising m segments, wherein m=n/2 if n represents an even integer, and m=(n+1)/2 if n represents an odd integer. Each segment includes two foil portions. In a reel to reel process, the strip is treated to form n−2 foil portions of each PCB unit into traces, further remove one foil portion if n represents an odd integer. The other two foil portions are left untreated. Then the strip is cut to separate the PCB units from each other. The PCB unit is folded in such a manner that the traces are arranged between the other two foil portions. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two foil portions. | 02-02-2012 |
20120110839 | METHOD OF MANUFACTURING WIRING BOARD - Disclosed is a manufacturing method of a wiring board with at least one conduction layer and at least one resin insulation layer. The manufacturing method includes an opening forming step of forming openings in the resin insulation layer and a paste filling step of filling a copper paste into the openings to form the conduction layer from the copper paste. | 05-10-2012 |
20120137514 | METHODS FOR FABRICATING AN OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING - According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component. | 06-07-2012 |
20120159778 | Method for Connecting a Plurality of Unpackaged Substrates - A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks. | 06-28-2012 |
20120159779 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURE - A packaging architecture for an integrated circuit is provided. The architecture includes a printed circuit board and a package substrate disposed on the printed circuit board. A first integrated circuit is disposed on a first surface of the package substrate. The package substrate is capable of supporting a second integrated circuit. The second integrated circuit is in electrical communication with a plurality of pads disposed on the first surface of the package substrate. Each of the plurality of pads is in electrical communication with the printed circuit board without communicating with the first integrated circuit. | 06-28-2012 |
20120186078 | ACCURATE ALIGNMENT FOR STACKED SUBSTRATES - Using developed photo-resist materials at the side walls of silicon substrates, the preferred embodiments of the present invention improve alignment accuracy of stacked substrates. Such alignment accuracy improves the area efficiency of side-wall connections as well as through-hole connections. The parasitic impedances of stacked substrate connections are also improved. | 07-26-2012 |
20120210575 | ELECTRIC CONTACT FOR A CONNECTOR - An electric contact for a connector, the contact including a first end for connecting to another contact; and a second end opposite from the first end along a longitudinal axis of the contact; wherein the contact includes at least two distinct arms forming the first end and a middle portion arranged between the first and second ends and configured to enable the arms to move apart and/or towards each other, and wherein each arm is such that the two arms slope apart from each other on moving along the projection of an arm onto the plane perpendicular to the longitudinal axis of the contact. | 08-23-2012 |
20120246925 | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing a core substrate having a first surface and a second surface on the opposite side of the first surface, forming on the first-surface side of the substrate a first opening portion tapering from the first toward second surface, forming on the second-surface side of the substrate a second opening portion tapering from the second toward first surface, forming a third opening portion such that a penetrating hole formed of the first opening portion, the second opening portion and the third opening portion connecting the first and second opening portions is formed in the substrate, forming a first conductor on the first surface of the substrate, forming a second conductor on the second surface of the substrate, and filling a conductive material in the penetrating hole such that a through-hole conductor connecting the first and second conductors is formed. | 10-04-2012 |
20130000113 | Connecting Film, and Joined Structure and Method for Producing the Same - A method for producing a joined structure involving pressure-bonding a first circuit member and a second circuit member together via a connecting film while the circuit members are being heated, to thereby join the circuit members with each other, wherein the connecting film is defined and includes first and second layers wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than the minimum melt viscosity of the insulating organic resin layer. | 01-03-2013 |
20130008022 | ELECTRICAL CURRENT SENSOR DEVICE - An electrical current sensor device includes a first printed circuit board assembly, a second printed circuit board assembly positioned opposite to the first printed circuit board assembly, and a holder holding the first and second printed circuit board assemblies and providing a passage to allow an electrical conductor to pass through. The first printed circuit board assembly includes a first sensing circuit having a first element pair that includes two magnetoresistive elements with a first pinning direction, the second printed circuit board assembly comprises a second sensing circuit with a second element pair that includes having two magnetoresistive elements with a second pinning direction that is opposite to the first pinning direction, and the first and second pinning directions are perpendicular to a current direction of a current passing through the electrical conductor, the first sensing circuit electrically connects with the second sensing circuit to form a Wheatstone bridge circuit. | 01-10-2013 |
20130061469 | IN SITU FLEXIBLE CIRCUIT EMBOSSING TO FORM AN ELECTRICAL INTERCONNECT - A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit. | 03-14-2013 |
20130255078 | INFORMATION CARRYING CARD COMPRISING A CROSS-LINKED POLYMER COMPOSITION, AND METHOD OF MAKING THE SAME - The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof. | 10-03-2013 |
20130269183 | PRINTED CIRCUIT BOARD INTERCONNECT ASSEMBLY AND METHOD - Some embodiments of the invention provide a method of fabricating an interconnect comprising aligning and stacking a plurality of printed circuit boards with at least one adhesive component, laminating the printed circuit boards and the adhesive component, preparing bonded pair holes, depositing a copper seed layer, forming a copper plate image, electroplating a copper layer, removing a plate resist and depositing an insulator layer. | 10-17-2013 |
20130312256 | STRETCHABLE CIRCUIT ASSEMBLIES - A stretchable circuit assembly includes first and second printed circuit boards, discrete conductive wires or flexible circuits including ends connected to the first and second printed circuit boards, and a stretchable interconnect in which the discrete conductive wires or flexible circuits and a portion of the first and second printed circuit boards are embedded. Main surfaces of the flexible circuits are perpendicular or substantially perpendicular to main surfaces of the stretchable interconnect. A method of making a stretchable circuit assembly includes the steps of providing electrical interconnects, a first printed circuit board, and a second printed circuit board, shaping the electrical interconnects to have an oscillating configuration, and forming a stretchable interconnect such that the electrical interconnects, a portion of the first printed circuit board, and a portion of the second printed circuit board are embedded within the stretchable interconnect. | 11-28-2013 |
20140075749 | IMPLEMENTING HIGH-SPEED SIGNALING VIA DEDICATED PRINTED CIRCUIT-BOARD MEDIA - Some embodiments of the inventive subject matter are directed to forming, on a first circuit board, first pins that connect to first leads of a first electronic component; forming, on the first circuit board, second pins that connect to second leads of a second electronic component; affixing the first circuit board to a second circuit board having a first layer with first wires; and forming second wires on a second layer of the second circuit board, wherein said forming the second wires creates an electrical connection on the second circuit board between a portion of the first pins and a portion of the second pins. In some embodiments, the second circuit board is smaller than the first circuit board, and the second layer of the second circuit board is, in length, approximately equivalent to a distance between the first electronic component and the second electronic component. | 03-20-2014 |
20140096377 | METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - A method of manufacturing a rigid-flexible printed circuit board in accordance with an embodiment of the present invention includes: providing a pair of rigid boards and a flexible substrate inserted in between the pair of rigid boards and having one end thereof extended outside the pair of rigid boards; mounting a cover film on an extended area of the flexible substrate; providing a pair of pressing jigs disposed, respectively, above and below the rigid boards and the flexible substrate, having a protruded part formed on each thereof corresponding to a step difference between the rigid boards and the flexible substrate, and configured to press the pair of rigid boards and the flexible substrate and press the flexible substrate and the cover film mounted thereon; and pressing the rigid boards, the flexible substrate and the cover film with the pressing jigs. | 04-10-2014 |
20140109402 | METHOD OF MANUFACTURING METAL CORE INSERTED PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing two PCBs through a single process by attaching a foam tape to each of a first copper clad laminate (CCL) and a second CCL including copper clad layers having differnet thicknesses, the method of manufacturing a metal core inserted PCB, the method including: preparing a first CCL and a second CCL including copper clad layers having different thicknesses; bonding the first CCL and the second CCL through a bonding member; forming grooves by etching an upper surface of th first CCL and a lower surface of the second CCL; and separating the first CCL and the second CCL from the bonding memebr at a previously set temperature as a first PCB and a second PCB having metal cores. | 04-24-2014 |
20140109403 | Complex Circuit Board and Fabrication Method Thereof - A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced. | 04-24-2014 |
20140150253 | TOUCH SCREEN AND MANUFACTURING METHOD - A touch screen comprises a first substrate, a second substrate and a third substrate sequentially stacked. A first sensing layer is provided on a first surface of the second substrate opposing to the third substrate, and a second sensing layer is provided on a surface of the third substrate opposing to the second substrate. The second substrate provided with the first sensing layer and the third substrate provided with the second sensing layer constitute a touch unit for sensing a touch signal, and the second substrate and the first substrate constitute a display unit for displaying. | 06-05-2014 |
20140290052 | Apparatus For Coupling Circuit Boards - An apparatus for connecting two or more circuit boards, the apparatus comprising: a first circuit board comprising a first surface and a second surface, the second surface having a first conductive pad; a second circuit board comprising a third surface and a fourth surface, the third surface having a second conductive pad; a fixing means configured to engage with the first circuit board and the second circuit board to couple the first circuit board to the second circuit board, wherein, when coupled, the fixing means is electrically isolated from one of the first circuit board and the second circuit board; and an electrically conductive spacer configured to electrically couple the first conductive pad and the second conductive pad. | 10-02-2014 |
20140304987 | COATING LIQUID FOR PHOTOVOLTAIC DEVICE AND METHOD FOR USING THE SAME - A photovoltaic device and a method of making a photovoltaic device that includes a stack of layers, including a substrate and an electrode layer. The photovoltaic device includes a semiconductor light absorption layer that is formed on the stack by a coating liquid that includes a plurality of semiconducting particles. The coating liquid may also include a solvent and a plurality of additive molecules. The photovoltaic device also includes a transparent conducting layer disposed on the semiconductor light absorption layer and a grid electrode disposed on the transparent conducting layer. | 10-16-2014 |
20140317918 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME - Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture. | 10-30-2014 |
20140345123 | MANUFACTURING A PRODUCT USING A SOLDERING PROCESS - Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path. Heating at least one of the solder paste beads by an electrical resistive heating, wherein the electrical resistive heating is generated by an electrical current flowing through the electrical conducting path, wherein the solder paste bead undergoes a soldering process facilitated by the electrical resistive heating, wherein a temperature of the solder paste bead is being evaluated, wherein the electrical resistive heating is adjusted according to the temperature of the solder paste bead. | 11-27-2014 |
20140360013 | INTEGRATION OF ELECTRONIC CHIPS ONTO A PHOTONIC CHIP - Methods, structures, apparatus, devices, and materials to facilitate the integration of electronic integrated circuits (chips) including drivers, amplifiers, microcontrollers, etc., onto/into photonic integrated circuits (chips) using recessed windows exhibiting controlled depths onto/into the photonic chip. The electronic chips are positioned into the recessed windows and electrical connections between the electronic chips and the photonic chip are achieved by flip-chip techniques with predefined traces at a bottom of the recessed windows or direct wire bonding. Advantageously, this integration may be performed on a wafer level for large-volume productions. | 12-11-2014 |
20140366369 | LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING CIRCUIT BOARD - A method for manufacturing a circuit board constituted by a light emitting device and a mounting board includes the steps of: conveying the light emitting device onto the mounting board in a state in which a top face is chucked by a nozzle so that the nozzle and an exposed part of a first terminal part of the light emitting device are in contact; and placing the light emitting device onto the mounting board so that the first terminal part and a wiring component are in contact in a state in which the top face is chucked by the nozzle. | 12-18-2014 |
20150033552 | System and Method for Manufacturing a Swallowable Sensor Device - Methods and systems for manufacturing a swallowable sensor device are disclosed. Such a method includes mechanically coupling a plurality of internal components, wherein the plurality of internal components includes a printed circuit board having a plurality of projections extending radially outward. A cavity is filled with a potting material, and the mechanically coupled components are inserted into the cavity. The cavity may be pre-filled with the potting material, or may be filled after the mechanically coupled components have been inserted therein. A distal end of each projection abuts against a wall of the cavity thereby preventing the potting material from covering each distal end. The cavity is sealed with a cap causing the potting material to harden within the sealed cavity to form a housing of the swallowable sensor device, wherein the distal end of each projection is exposed to an external environment of the swallowable sensor device. | 02-05-2015 |
20150047185 | ELECTRODE JOINING METHOD, PRODUCTION METHOD OF ELECTRODE JOINED STRUCTURE, AND PRODUCTION SYSTEM OF ELECTRODE JOINED STRUCTURE - Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process. | 02-19-2015 |
20150089804 | LOCKING DEVICE WITH EMBEDDED CIRCUIT BOARD - Electrified access-control technology devices for a door, particularly electrified locks for a door, having embedded circuitry therein, and methods of making the same. One or more printed circuit boards (PCBs) having various electronic circuitry are secured inside a housing that encases an access-control device, particularly a lock, for a door. The one or more PCB(s) may be embedded on an internal surface of the housing such that the embedded PCB resides inside the housing along with the lock itself. The embedded PCB(s) avoid interference of both any working components of the lock inside the housing and any openings residing in the housing. | 04-02-2015 |
20150107101 | FABRICATING PREASSEMBLED OPTOELECTRONIC INTERCONNECT STRUCTURES - Fabricating preassembled optoelectronic interconnect structures is provided, which have an optical waveguide link with first and second optoelectronic circuits attached to first and second ends of the waveguide link. The optoelectronic circuits include active optical componentry which facilitates optical signal communication across the optical waveguide link. Further, first and second pluralities of electrical contacts are associated with the first and second optoelectronic circuits, respectively, to facilitate electrically, operatively connecting the interconnect structure between first and second components of an electronic assembly as, for instance, a single, field-replaceable unit. The first and second components of the electronic assembly may be, for instance, stacked electronic components of the electronic assembly, or laterally offset components of a substantially planar electronic assembly. | 04-23-2015 |
20150296671 | Formation of Fixed Equipment Setup Families for Populating Circuit Boards - A component placement line for populating circuit boards with components includes fixed equipment including a number of component types that remain unchanged over the planning horizon. A method includes acts of determining a number of circuit board types with associated circuit boards to be populated within the planning horizon on the component placement line and assigning at least a part of the circuit board types to a fixed equipment setup family, wherein all the components for populating a circuit board of a circuit board type in the fixed equipment setup family are encompassed by the fixed equipment, and the assignment is optimized until an assignment quality exceeds a predefined metric. | 10-15-2015 |
20150351256 | ASSEMBLY OF PRINTED CIRCUIT BOARDS - A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB. | 12-03-2015 |
20150366071 | PROCESS FOR MANUFACTURING A PRINTED CIRCUIT BOARD - A process for manufacturing a printed circuit board, comprising a first main circuit board having a first structure, comprises steps suitable for inserting one or more secondary printed circuit boards having a different structure from that of the main printed circuit board, comprising: defining one or more cavities suitable for receiving the one or more inserts; preparing the one or more inserts comprising, on at least one side intended to make contact with a wall of the cavity, etched features and a metallization, and one or more vias; inserting the one or more inserts into the one or more cavities in the main circuit board; placing a resin in the one or more cavities to ensure cohesion of the assembly formed by the main circuit board and the one or more secondary circuit boards; laminating the assembly formed by the one or more inserts placed in the main circuit board. | 12-17-2015 |
20150373855 | SERIAL CONNECTION EXTERNAL INTERFACE RISER CARDS AVOIDANCE OF ABUTMENT OF PARALLEL CONNECTION EXTERNAL INTERFACE MEMORY MODULES - A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card. | 12-24-2015 |
20160021757 | METHOD AND DEVICE FOR FABRICATING MULTI-PIECE SUBSTRATE - Provided are a multi-piece board fabrication method and apparatus which are capable of efficiently bonding a frame and a non-defective board piece together, thereby efficiently fabricating a multi-piece board comprising a plurality of non-defective board pieces. The method and apparatus are configured to cause a board piece conveyance mechanism to extract and hold a board piece stored in a board piece stacker and couple the board piece with a frame placed on a retaining table located in a first working area, and, after moving the retaining table from the first working area to a second working area, apply an adhesive to a coupled region between the board piece and the frame by using a dispenser to thereby fix a positional relationship therebetween. | 01-21-2016 |
20160044797 | METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD WITH COMPONENT MOUNTING SECTION FOR MOUNTING ELECTRONIC COMPONENT AND FLEXIBLE CABLE SECTIONS EXTENDING IN DIFFERENT DIRECTIONS FROM THE COMPONENT MOUNTING SECTION - [Problem] To allow an efficient sheet layout of a flexible printed circuit board having a plurality of cable sections extending in different directions and to improve a yield. | 02-11-2016 |
20160066436 | METHOD FOR FABRICATING CIRCUIT BOARD STRUCTURE - A method for fabricating a circuit board structure is provided. The method includes providing a first circuit board and a second circuit board, wherein the area of the second circuit board is less than the area of the first circuit board. The first circuit board and the second circuit board are combined by a surface mount technology to form the circuit board structure having a portion with a different number of layers. | 03-03-2016 |
20160072246 | METHOD OF MANUFACTURING A BOARD-TO-BOARD CONNECTOR FOR ELECTRICALLY CONNECTING TWO CIRCUIT BOARDS - A method of manufacturing a board-to-board connector capable of preventing a short-circuit from occurring between contacts when connectors are fitted to each other. Pin-shaped male-side contact portions protrude from one surface of a male-side insulating film, and male-side terminal portions are provided on the other surface of said male-side insulating film. This makes it possible to prevent a short-circuit from occurring between adjacent female-side contacts by the male-side contacts. | 03-10-2016 |
20160073560 | IMPLEMENTING SIMULTANEOUSLY CONNECTING OF MULTIPLE DEVICES IN A MULTI-TIERED, MULTI-DIRECTIONAL, ENHANCED TOLERANCE SYSTEM WITH MECHANICAL SUPPORT STRUCTURES - A method and apparatus are provided for implementing simultaneously connecting of multiple devices in a multi-tiered, multi-directional, enhanced tolerance system with mechanical support structures. A main system planar assembly and an elevated planar assembly share a direct connection provided by a plurality of connectors with no cables. A mechanical support bracket is attached to a top surface of the main system planar assembly positioning and supporting the elevated planar assembly spaced appropriately for accurately connecting respective connectors with respective chassis connectors. The elevated planar assembly includes a stiffening component to facilitate proper spacing between upper and lower levels of respective connectors and tool-less insertion and extraction of the elevated planar assembly. | 03-10-2016 |
20160079201 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device, for example formed utilizing component stacking. As non-limiting examples, various aspects of this disclosure provide a method for reducing warpage and/or stress in stacked semiconductor devices. | 03-17-2016 |
20160095204 | 3D FLEX SOLDERING - In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations. | 03-31-2016 |
20160157360 | METHOD FOR MANUFACTURING STRUCTURE FOR FLEXIBLE PRINTED CIRCUIT BOARDS | 06-02-2016 |
20160187598 | LOW COST, CONNECTORLESS, RUGGEDIZED SMALL FORM FACTOR OPTICAL SUB-ASSEMBLY (OSA) AND DATA BUS-IN-A-BOX (BIB) - Systems, methods, and apparatus for an optical sub-assembly (OSA) are disclosed. In one or more embodiments, the disclosed apparatus involves a package body, and a lock nut, where a first end of the lock nut inserted into a first cavity of the package body. The apparatus further involves a transistor outline (TO) can, where a first end of the TO can is inserted into a second cavity of the package body. Also, the apparatus involves an optical fiber, where a portion of the jacket from an end of the optical fiber is stripped off, thereby exposing bare optical fiber at the end of the optical fiber. The end of the optical fiber is inserted into a second end of the lock nut such that the bare optical fiber passes into the package body and at least a portion of the bare optical fiber is inserted into the TO can cavity. | 06-30-2016 |