| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 029594000 | Acoustic transducer | 62 |
| 20080235936 | Capacitive Ultrasonic Transducer and Method of Fabricating the Same - A capacitive ultrasonic transducer includes a first electrode, an insulating layer formed on the first electrode, at least one support frame formed on the insulating layer, and a second electrode formed spaced apart from the first electrode, wherein the first electrode and the second electrode define an effective area of oscillation of the capacitive ultrasonic transducer, and the respective length of the first electrode and the second electrode defining the effective area of oscillation is substantially the same. | 10-02-2008 |
| 20080271307 | METHOD OF MANUFACTURING CRYSTAL UNIT - There is provided a method of manufacturing a crystal unit, the method including: providing a package wafer including a plurality of connecting terminals each having top and bottom ends exposed to top and bottom surfaces of the package wafer; mounting a crystal blank having an excitation electrode formed thereon on at least one of the connecting terminals of the package wafer; depositing and bonding a cap wafer having a cavity with an open bottom therein on the top surface of the package wafer where the crystal blanks are mounted; and cutting bonding portions between the package wafer and the cap wafer into a plurality of individual crystal units. The crystal unit is reduced in thickness and size, and can be manufactured in mass production and packaged in a single process, thereby increasing lead time and process efficiency. | 11-06-2008 |
| 20080307632 | Electrostatic Loudspeaker Stators and their Manufacture - A method for manufacturing a stator ( | 12-18-2008 |
| 20080313883 | Method of Minimizing Inter-Element Signals for Transducers - The present invention provides a method of packaging surface microfabricated transducers such that electrical connections, protection, and relevant environmental exposure are realized prior to their separation into discrete components. The packaging method also isolates elements of array transducers. Post processing of wafers consisting of transducers only on the top few microns of the wafer surface can be used to create a wafer scale packaging solution. By spinning or otherwise depositing polymeric and metallic thin and thick films, and by lithographically defining apertures and patterns on such films, transducers can be fully packaged prior to the final dicing steps that would separate the packaged transducers from each other. In the case of microfabricated ultrasonic transducers, such packaging layers can also enable flexible transducers and eliminate or curtail the acoustic cross-coupling that can occur between array elements. | 12-25-2008 |
| 20090007413 | METHOD OF MANUFACTURING VIBRATING MICROMECHANICAL STRUCTURES - A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped. | 01-08-2009 |
| 20090007414 | SCALABLE ULTRASOUND SYSTEM AND METHODS - A plurality of application specific integrated circuit (ASIC) chips with different functions is provided. Each of the ASICs performs one or more functions along an ultrasound data path. The chips include communications protocols or processes for allowing scaling. For example, ASICs for backend processing include data exchange ports for communicating between other ASICs of the same type. As another example, receive beamformer ASICs cascade for beamformation. By providing ASICs implementing many or most of the ultrasound data path functions, with scalability, the same ASICs may be used for different system designs. A family of systems from high end to low-end using the same types of ASICs, but in different configurations, is provided. | 01-08-2009 |
| 20090013519 | METHOD FOR MANUFACTURING CRYSTAL DEVICE - A method for manufacturing a crystal device is provided. The method includes providing a package wafer including a plurality of internal and external connection terminals each having top and bottom ends respectively exposed to top and bottom surfaces of the package wafer; forming a height control member on the top end of the internal and external connection terminal and bonding one end of a crystal blank including an excitation electrode on the height control member; placing a bottom surface of a cap wafer having a cavity, which is open downward, on the top surface of the package wafer to which the crystal blank is mounted, and anodically bonding the package wafer with the cap wafer; and cutting the package wafer and the cap wafer in a direction across a bonding line formed by the bonding of the package wafer and the cap wafer to provide a plurality of crystal resonator that are individually separated. | 01-15-2009 |
| 20090094817 | Directional Microphone Assembly - A directional microphone assembly for a hearing aid is disclosed. The hearing aid has one or more microphone cartridge(s), and first and second sound passages. Inlets to the sound passages, or the sound passages themselves, are spaced apart such that the shortest distance between them is less than or approximately equal to the length of the microphone cartridge(s). A sound duct and at least one surface of a microphone cartridge may form each sound passage, where the sound duct is mounted with the microphone cartridge. Alternatively, each sound duct may be formed as an integral part of a microphone cartridge. | 04-16-2009 |
| 20090119905 | METHOD OF FABRICATING AN ULTRA-SMALL CONDENSER MICROPHONE - In the present invention, a plurality of ultra-small condenser microphones is formed on a same substrate. Then, charges are fixed to a dielectric film provided in each of the ultra-small condenser microphones. After an amount of deposited charges in each of the dielectric films is inspected, the substrate whereon the plurality of ultra-small condenser microphones is formed is diced so that each of the ultra-small condenser microphones is separated. Thus, at least the step of fixing charges is performed in a substrate state where the plurality of ultra-small condenser microphones is formed on the same substrate. Therefore, the present invention contributes to enhancement of productivity in an assembly process of the ultra-small condenser microphone and reduction in equipment costs. | 05-14-2009 |
| 20090126183 | METHOD OF FABRICATING A POLYMER-BASED CAPACITIVE ULTRASONIC TRANSDUCER - A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity. | 05-21-2009 |
| 20090144963 | Contour-Mode Piezoelectric Micromechanical Resonators - A contour mode micromechanical piezoelectric resonator. The resonator has a bottom electrode; a top electrode; and a piezoelectric layer disposed between the bottom electrode and the top electrode. The piezoelectric resonator has a planar surface with a cantilevered periphery, dimensioned to undergo in-plane lateral displacement at the periphery. The resonator also includes means for applying an alternating electric field across the thickness of the piezoelectric resonator. The electric field is configured to cause the resonator to have a contour mode in-plane lateral displacement that is substantially in the plane of the planar surface of the resonator, wherein the fundamental frequency for the displacement of the piezoelectric resonator is set in part lithographically by the planar dimension of the bottom electrode, the top electrode or the piezoelectric layer. | 06-11-2009 |
| 20090199392 | ULTRASOUND TRANSDUCER PROBES AND SYSTEM AND METHOD OF MANUFACTURE - A method for fabricating an ultrasound transducer structure is disclosed. The method includes performing the steps of forming a functional layer, including an ultrasound transducer material and a photopolymer, and exposing a plurality of selected regions of the functional layer to a programmable light pattern to cure the selected regions of the functional layer to form polymerized ultrasound transducer material regions, repeatedly. The method further includes selectively removing unexposed regions of the functional layer to obtain a green component, and sintering the green component to obtain the sensing structure. A system for making at least one piezoelectric element is also disclosed. | 08-13-2009 |
| 20090217509 | SPEAKER, MODULE USING THE SAME, ELECTRONIC EQUIPMENT AND DEVICE, AND SPEAKER PRODUCING METHOD | 09-03-2009 |
| 20090313808 | ELECTROMECHANICAL TRANSDUCER AND FABRICATION METHOD OF ELECTROMECHANICAL TRANSDUCING APPARATUS - A groove is formed on a handling member, on a face to be fixed to an element, the groove making up a portion of a channel that externally communicates in the state of being fixed to the element. In the fixing process of the substrate and then handling member, the handling member is fixed so that the edge direction of the vibrating membrane supporting portion and the edge direction of the groove of the handling member intersect. Thus, the probability that a membrane will break during handling or processing of the substrate is reduced, and the handling member can be quickly removed from the substrate. | 12-24-2009 |
| 20090313809 | ELECTROMECHANICAL TRANSDUCER AND FABRICATION METHOD OF ELECTROMECHANICAL TRANSDUCING APPARATUS - A handling member is prepared that provides a channel that can withstand subsequent back face processing as to a substrate having elements made up of a substrate and a membrane, and the handling member is fixed to the substrate so that at least a portion within the elements are supported by the handling member. This provides a manufacturing method wherein the physical strength of an element at the time of manufacturing an electromechanical transducing apparatus is strengthened, and the handling member is easily detached in a short time after processing of the element. | 12-24-2009 |
| 20090320273 | METHOD FOR MANUFACTURING AN EAR DEVICE HAVING A RETENTION ELEMENT - A method for manufacturing a first ear device having a first retention element to be worn at least in part in at least one of the outer ear and the ear canal of a user and a second ear device having a second retention element to be worn at least in part in at least the outer ear and the ear canal of the user. The outer surface of the first retention element is individually shaped according to the measured inner shape of the user's outer ear and ear canal; a digital data set according to a data format which is representative of the measured inner shape of the user's outer ear and ear canal is obtained; the user provided with a personal copy of the digital data set for personal use by the user; and the personal copy of the digital data set used for manufacturing the second retention element. | 12-31-2009 |
| 20100000074 | Method of Assembling a Cordless Hand-Held Ultrasonic Cautery Cutting Device - A method for assembling an ultrasonic surgical assembly includes the steps of substantially simultaneously removably coupling an ultrasonic-driving-wave-signal generating circuit to an ultrasonic surgical handle body and removably inserting an ultrasonic-movement-producing distal end of a rotatably free ultrasonic transducer into the ultrasonic surgical handle body. An ultrasonic waveguide is inserted into the ultrasonic surgical handle body opposite the ultrasonic-movement-producing distal end. The ultrasonic waveguide is rotated with respect to the ultrasonic transducer to fixedly couple the ultrasonic waveguide to the ultrasonic-movement-producing distal end of the ultrasonic transducer. | 01-07-2010 |
| 20100024198 | METHODS OF MAKING SPEAKERS - A method of making a speaker may be performed partially or completely in a roll-based processing. The method includes: providing an electrode; providing a membrane; forming a conductive layer on the membrane; forming a plurality of first supporting members on one of the electrode and the membrane; providing a substrate; forming a plurality of second supporting members on one of the substrate and the membrane; and combining the electrode, the membrane, and the substrate to provide a first chamber between the electrode and membrane and to provide a second chamber between the membrane and the substrate. | 02-04-2010 |
| 20100088883 | METHOD OF MANUFACTURING FACEPLATE FOR IN-THE-EAR HEARING AID - Provided is a faceplate for an In-The-Ear (ITE) hearing aid and a method of manufacturing a faceplate for an In-The-Ear (ITE) hearing aid in which the faceplate can be manufactured in a compact size, using a foldable flexible printed circuit board (PCB), while maintaining the quality, enabling mass-production, and reducing the manufacturing cost. | 04-15-2010 |
| 20100107400 | METHOD OF MANUFACTURING AN ACOUSTIC MIRROR - An acoustic mirror of alternately arranged layers of high and low acoustic impedances is manufactured in that a basic material having a first layer of the layer sequence is initially provided, on which a second layer of the layer sequence is created on the first layer such that the second layer of the layer sequence partially covers the first layer. Subsequently, a planarization layer is applied onto the layer sequence, and the planarization layer is removed in an area which in the common layer plane projects laterally beyond the second layer so as to result in a residual planarization layer. Finally, a termination layer is applied onto the layer sequence and the residual planarization layer. | 05-06-2010 |
| 20100175242 | Method for packaging micro electromechanical systems microphone - A method for packaging micro electromechanical systems (MEMS) microphone has steps of providing a base, arranging and mounting multiple microphone component assemblies on the base, providing a frame, mounting the frame on the base, forming multiple microphone units, providing a cover; mounting the microphone units on the cover and forming multiple MEMS microphones. Therefore, the MEMS microphones can be produced once in large quantities to save production time and costs. | 07-15-2010 |
| 20100175243 | THERMOACOUSTIC MODULE, THERMOACOUSTIC DEVICE, AND METHOD FOR MAKING THE SAME - A method for making a thermoacoustic module is disclosed. An insulating substrate and a sound wave generator are provided. A conductive paste is screen printed on the insulating substrate to form a first patterned conductive paste layer. The sound wave generator is placed on the first patterned conductive paste layer and at least partially suspended above the insulating substrate by the patterned conductive paste layer. | 07-15-2010 |
| 20100263197 | SELECTABLE TUNING TRANSFORMER - An assembly and method for assembling a tuning transformer ( | 10-21-2010 |
| 20100319185 | Methods of Forming Micromechanical Resonators Having High Density Trench Arrays Therein that Provide Passive Temperature Compensation - A method of forming a micromechanical resonator includes forming a resonator body anchored to a substrate by at least a first anchor. This resonator body may include a semiconductor or other first material having a negative temperature coefficient of elasticity (TCE). A two-dimensional array of spaced-apart trenches are provided in the resonator body. These trenches may be filled with an electrically insulating or other second material having a positive TCE. The array of trenches may extend uniformly across the resonator body, including regions in the body that have relatively high and low mechanical stress during resonance. This two-dimensional array (or network) of trenches can be modeled as a network of mass-spring systems with springs in parallel and/or in series with respect to a direction of a traveling acoustic wave within the resonator body during resonance. | 12-23-2010 |
| 20100325873 | ELECTROSTATIC LOUDSPEAKER STATORS AND THEIR MANUFACTURE - A method for manufacturing a stator ( | 12-30-2010 |
| 20110010925 | Ultrasonic Imaging Catheters - An intravascular ultrasonic imaging catheter is provided with a flexible circuit electrically coupled to a transducer array mounted on the distal end of the catheter, a portion of the flexible circuit being helically wound about the catheter in order to enhance the flexibility of the circuit. The catheter may be a balloon catheter which is also provided with a stent mounted on the balloon, the stent carrying one or more drugs designed to be eluted or washed into a patient's blood stream after the stent has been delivered, by a the balloon catheter, into a target area within the patient's vascular system. | 01-20-2011 |
| 20110047783 | METHOD OF MANUFACTURING VERTICALLY SEPARATED ACOUSTIC FILTERS AND RESONATORS - An apparatus including vertically separated acoustic resonators are disclosed. The apparatus includes a first acoustic resonator on a substrate and a second acoustic resonator vertically separated above the first acoustic resonator. Because the resonators are vertically separated above another, total area required to implement the resonators is reduced thereby savings in die size and cost are realized. The vertically separated resonators are supported by standoffs that are fabricated on the substrate, or on a resonator. | 03-03-2011 |
| 20110088248 | DIAGNOSTIC ULTRASOUND TRANSDUCER - An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member. | 04-21-2011 |
| 20110131794 | METHODS FOR MAKING CAPACITIVE MICROPHONE - A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids. | 06-09-2011 |
| 20110154649 | METHOD OF MANUFACTURING CAPACITIVE ELECTROMECHANICAL TRANSDUCER - Provided is a method of manufacturing a capacitive electromechanical transducer, including: forming a lower electrode layer on a substrate; forming a sacrificial layer on the lower electrode layer; forming by application a resist layer on the sacrificial layer to form a cavity pattern; forming an insulating layer above regions including a region that contains the resist layer used to form the cavity pattern, and then removing a part of the insulating layer that is formed above the resist layer along with the resist layer, thereby leaving the insulating layer in the other regions than the region where the cavity pattern has been formed; forming a vibrating film above the region where the cavity pattern has been formed and the regions where the insulating layer remains; and removing the sacrificial layer to form a cavity. | 06-30-2011 |
| 20110167619 | Cordless Hand-Held Ultrasonic Cautery Cutting Device - An ultrasonic surgical assembly includes an ultrasonic transducer operable to convert a received motional current into a movement of a cutting blade of an ultrasonic waveguide, a measurement circuit connected in a parallel configuration with the ultrasonic transducer, a variable power source operable to supply current through a set of connection points to the parallel configuration and thereby create the motional current in the ultrasonic transducer, and a current controller operable to regulate the motional current by varying an output of the variable power source, thereby maintaining a substantially constant rate of movement of the cutting blade across a variety of cutting loads. | 07-14-2011 |
| 20110167620 | Cordless Hand-Held Ultrasonic Cautery Cutting Device - An ultrasonic surgical assembly includes an ultrasonic-movement-generator assembly having a shell and an ultrasonic-driving-wave-signal generating circuit housed within the shell, an ultrasonic transducer having a proximal end and an ultrasonic-movement-producing distal end, an ultrasonic waveguide having a proximal end for receiving ultrasonic movement thereat, and a handle body having a waveguide attachment dock operable to accept the waveguide therein, an ultrasonic-movement-generator assembly dock operable to selectively removably secure the ultrasonic-movement-generator assembly thereto, and a transducer attachment dock operable to substantially simultaneously selectively removably and rotatably freely couple the ultrasonic transducer to the handle body rotationally independent of the ultrasonic-movement-generator assembly and axially align the ultrasonic-movement-producing distal end opposite the proximal end of the ultrasonic waveguide when the ultrasonic waveguide is disposed within the waveguide attachment dock. | 07-14-2011 |
| 20110167621 | Method of Assembling a Cordless Hand-Held Ultrasonic Cautery Cutting Device - A method for assembling an ultrasonic surgical device includes the steps of providing a proximal end of an ultrasonic waveguide at an ultrasonic surgical handle body, removably coupling an ultrasonic-movement-generator assembly having a ultrasonic-driving-wave-signal generating circuit to the ultrasonic surgical handle body, mechanically coupling an ultrasonic transducer rotationally freely and substantially longitudinally fixedly to the ultrasonic surgical handle body to place an ultrasonic-movement-producing distal end of the ultrasonic transducer opposite and adjacent the proximal end of the ultrasonic waveguide, and rotating the waveguide and the ultrasonic transducer with respect to one another to removably fixedly couple the waveguide to the ultrasonic-movement-producing distal end of the ultrasonic transducer and to electrically couple the ultrasonic-driving-wave-signal generating circuit to the ultrasonic surgical handle body. | 07-14-2011 |
| 20110258839 | METHOD OF MANUFACTURING HEARING DEVICES - A method of manufacturing hearing devices comprising an otoplastic individually shaped for a user to be using the respective hearing device is disclosed. The method comprises the steps of
| 10-27-2011 |
| 20110289764 | Method of Assembling A Hearing Aid | 12-01-2011 |
| 20120204415 | Process for Producing an Acoustic Device Having a Controlled-Bandgap Phononic Crystal Structure Containing Conical Inclusions - A process for producing an acoustic device having a phononic crystal structure comprising inclusions produced in a first medium distributed in a matrix of a second medium, to block propagation of acoustic waves within a bandgap frequency band, includes: defining geometric parameters of said inclusions, which have walls contacting said matrix, making at least one non-zero first wall angle, to the normal of the plane of said structure, said geometric parameters including said first wall angle; determining a function relating to variation in frequency position of said bandgap with said wall angle or relating to variation in width of said bandgap with said wall angle; determining said at least first angle, for a selected frequency position and/or selected width of the bandgap, from the function or functions determined beforehand; and producing said inclusions having at least said first wall angle in said matrix formed by said second medium. | 08-16-2012 |
| 20120204416 | METHOD AND APPARATUS FOR MANUFACTURING A PASSIVE COMPONENT FOR AN ACOUSTIC TRANSDUCER - The present disclosure relates to a method and apparatus for manufacturing a passive component for an acoustic transducer, wherein a mixture of metal oxide filler with an epoxy resin is subjected to ultrasonic wave generated and followed by an addition of a hardener to cast the passive component for the acoustic transducer. Mixing the materials with the ultrasonic wave improves the dispersion of the metal oxide filler over conventional passive components, thus enabling the passive component to have uniform surfaces, resulting in improved sound velocity and attenuation characteristics with acoustic transducers that use the passive component manufactured by the present disclosure. | 08-16-2012 |
| 20120317792 | SPEAKER MANUFACTURING METHOD - Provided is a method of manufacturing a loudspeaker including assembling a magnetic circuit and a frame. In the step of assembling the magnetic circuit and the frame, parallelism between a plate and a damper attachment portion of the frame is ensured by bringing an upper portion of the plate and the damper attachment portion of the frame into contact with a jig. In addition, perpendicularity between a magnetic gap and the damper attachment portion of the frame is ensured by bringing an outer circumferential side portion of the plate of the magnetic gap and an inner circumferential side portion of the yoke into contact with the jig. The magnetic circuit and the frame are assembled in such a state. With such a manufacturing method, it is possible to achieve a superior loudspeaker capable of reducing a gap defect while being downsized and having increased maximum input power. | 12-20-2012 |
| 20130104384 | Microphone with Irregular Diaphragm | 05-02-2013 |
| 20130133179 | METHOD OF MANUFACTURING BOUNDARY ACOUSTIC WAVE DEVICE - A method of manufacturing a boundary acoustic wave device includes the steps of forming an electrode on a first medium layer, forming a second medium layer so as to cover the electrode on the first medium layer, and forming a sound absorbing layer on an external surface of the second medium layer. The sound absorbing layer has an acoustic velocity of transverse waves that is lower than an acoustic velocity of transverse waves of the second medium layer. | 05-30-2013 |
| 20130139377 | METHOD OF MANUFACTURING RESONANT TRANSDUCER - A method of manufacturing a resonant transducer having a vibration beam includes: (a) providing an SOI substrate including: a first silicon layer; a silicon oxide layer on the first silicon layer; and a second silicon layer on the silicon oxide layer; (b) forming a first gap and second gap through the second silicon layer by etching the second silicon layer using the silicon oxide layer as an etching stop layer; (c) forming an impurity diffusion source layer on the second silicon layer; (d) forming an impurity diffused layer in a surface portion of the second silicon layer; (e) removing the impurity diffusion source layer through etching; and (f) removing at least a portion of the silicon oxide layer through etching such that an air gap is formed between the first silicon layer and a region of the second silicon layer surrounded by the first and second gaps. | 06-06-2013 |
| 20130145611 | DIAGNOSTIC ULTRASOUND TRANSDUCER - An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member. | 06-13-2013 |
| 20130174412 | FULL-FIELD BREAST ULTRASOUND SYSTEM AND ARCHITECHTURE - A modular, flexible architecture for offering full-field breast ultrasound (FFBU) functionality and general-purpose ultrasound functionality in a single system is described. A conventional, general-purpose ultrasound system ( | 07-11-2013 |
| 20130185928 | ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME - Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode. | 07-25-2013 |
| 20130239402 | Method of Assembling a Cordless Hand-Held Ultrasonic Cautery Cutting Device - A method for assembling an ultrasonic surgical device includes the steps of rotatably freely connecting an ultrasonic waveguide to an ultrasonic surgical handle body, the ultrasonic waveguide having a proximal coupling end, substantially simultaneously removably coupling an ultrasonic-driving-wave-signal generating circuit to the ultrasonic surgical handle body and removably inserting an ultrasonic-movement-producing distal end of a cordless, rotatably free ultrasonic transducer into the ultrasonic surgical handle body opposite the proximal coupling end of the ultrasonic waveguide, and rotating the ultrasonic waveguide with respect to the ultrasonic transducer to fixedly couple the ultrasonic waveguide to the ultrasonic-movement-producing distal end of the ultrasonic transducer. | 09-19-2013 |
| 20130269174 | Miniature Forward-Looking Ultrasound Imaging Mechanism Enabled by Local Shape Memory Alloy Actuator - The present invention relates to a new forward-looking ultrasound device including a local actuator embedded inside an elongate member such as a guide wire or catheter. The present invention includes an ultrasound transducer element configured to engage with the local actuator and rotate about an axis of rotation at least when the ultrasound transducer element and the local actuator are engaged. Also disclosed are methods of using the same. | 10-17-2013 |
| 20130291370 | METHOD FOR PRODUCING AN EARPIECE WITH A VENT - The production of an earpiece for a hearing apparatus and in particular for a hearing device is closely tailored to the simulation. To this end, the earpiece of a hearing apparatus to be inserted into an auditory canal is produced by first selecting a virtual raw vent and manufacturing the earpiece with a real vent. A base frequency of the acoustic transmission function of the virtual raw vent is determined. From that, a virtual vent is determined as a function of the base frequency and of at least one predetermined property of the auditory canal or of the earpiece. The earpiece is then manufactured on the basis of the virtual vent. | 11-07-2013 |
| 20140013581 | ELECTROSTATIC SPEAKER AND MANUFACTURING METHOD THEREOF AND CONDUCTIVE BACKPLATE OF THE SPEAKER - An electrostatic speaker and a method for manufacturing the speaker are disclosed. Said speaker comprises a vibrating film; an electrode portion disposed on a surface of the vibrating film and joined with the vibrating film; and a conductive backplate spaced from the electrode portion by a distance, the conductive backplate forming a plurality of holes, the vibrating film being deformed and vibrated to generate and release a sound through the holes due to a variation of an electric field generated between the conductive backplate and the electrode portion, wherein the conductive backplate is covered by a polymer layer serving as a protective film. The covering polymer layer on the conductive backplate is capable of improving the stability of the electrostatic speaker and increasing its lifespan. | 01-16-2014 |
| 20140026396 | ULTRASONIC TRANSDUCER - An ultrasonic transducer includes: a diaphragm pot that has a surrounding wall; a transducer element mounted in a diaphragm pot on a transducer section on an inner side of the diaphragm for generating the ultrasonic vibrations; a first damping element situated in the diaphragm pot on transducer element for damping the diaphragm; and a second damping element situated within the diaphragm pot in an edge section of the diaphragm around the transducer element for damping vibrations of the wall; the second damping element being connected with force locking, at least section by section, both to the edge section and to the inner side of the wall. | 01-30-2014 |
| 20140137397 | METHOD FOR MAKING THERMOACOUSTIC DEVICE - A method for making thermoacoustic device includes following steps. A silicon substrate having a first surface and second surface opposite to the first surface is provided. The first surface is patterned by forming a plurality of grooves substantially oriented along a first direction, wherein the plurality of grooves is spaced from each other, and a bulge is formed between each two adjacent grooves. An insulating layer is coated on the patterned surface. A first electrode and a second electrode are formed on the insulating layer, wherein the first electrode and the second electrode are spaced from each other. A carbon nanotube structure is applied on the insulating layer, wherein the carbon nanotube structure is electrically connected to the first electrode and the second electrode, the carbon nanotube structure is suspended above the plurality of grooves. | 05-22-2014 |
| 20140137398 | METHOD FOR MAKING THERMOACOUSTIC DEVICE ARRAY - A method for making a thermoacoustic device array includes the following step. A substrate having a surface is provided. The surface defines a grid having a number of cells. A number of recesses are defined on each of the cells. The recesses are parallel with and spaced from each other. A first electrode and a second electrode are formed on each of the cells. The first electrode is spaced from the second electrode, and one of the recesses is located between the first electrode and the second electrode. A sound wave generator is applied on the substrate and electrically connected to the first electrode and the second electrode. The sound wave generator is suspended over the recesses. The sound wave generator is separated according to the cells. | 05-22-2014 |
| 20140173888 | Method and Apparatus for Coupling Micro-Components Together Using a Micro-Clip - The present disclosure provides a micro-structure for coupling a first micro-component with a second micro-component. The micro-structure includes a center portion. The micro-structure also includes a first pair of arms connected to the center portion and extending away from the center portion in a first direction. The first pair of arms are separated by a first gap that is approximately equal to, or less than, a thickness of the first micro-component. The micro-structure also includes a second pair of arms connected to the center portion and extending away from the center portion in a second direction different from the first direction. The second pair of arms are separated by a second gap that is approximately equal to, or less than, a thickness of the second micro-component. | 06-26-2014 |
| 20140245596 | USE OF FRACTALS TO TUNE A METALLIC PLATE TO MULTIPLE RESONANCES - A process for manufacturing a wave energy emitter and a system for manufacturing the same. | 09-04-2014 |
| 20150068027 | ASSEMBLING METHOD FOR MICRO-LOUDSPEAKER ASSEMBLY - Provided is an assembling method for a micro-loudspeaker assembly. The method comprises the steps of: (a) preparing a chuck ring material plate and a vibrating diaphragm material plate, and stamping a number of chuck ring inner holes in the chuck ring material plate; (b) coating an adhesive on the upper surface of the chuck ring material plate stamped with the chuck ring inner holes; (c) bonding the vibrating diaphragm material plate to the upper surface of the chuck ring material plate coated with an adhesive; (d) downwards stamping the part of the vibrating diaphragm material plate corresponding to the chuck ring inner holes into the central part of a vibrating diaphragm; and (e) stamping to form the outer edge of the assembly around the chuck ring inner holes, and removing the assembly from the material plate. | 03-12-2015 |
| 20150113795 | Manufacturing Process for a Custom Fit In-Ear Monitor Utilizing a Single Piece Driver Module - A method of fabricating a custom-fit in-ear-monitor (IEM) is provided that utilizes a pre-tuned, single piece driver module to simplify fabrication and reduce cost while insuring that the performance of the IEM consistently meets the acoustic goals set for the device. During fabrication the driver module, the drivers coupled to the module's driver ports, and the crossover circuit are installed in a custom-fit IEM shell such that the module's acoustic output is aligned with the output surface of the IEM shell. After installing the device components within the IEM shell, the shell is sealed. | 04-30-2015 |
| 20150143688 | Markers for a medical ultrasound imaging catheter - A catheter is provided for medical ultrasound imaging that can be effectively used in combination with other imaging modalities to detect medical structures of interest as well as the catheter. Markers are added to the catheter with precision, which provides a means to merge the images from different modalities. Using a template, apertures for marker placement are formed in the catheter after creating the catheter housing. The ultrasound array may be used for accurate positioning of the template. Alternatively or additionally, a rigid insert with markers connects with the array. The insert holds the markers in place and may reduce artifacts in ultrasound scanning due to flexing of the array. | 05-28-2015 |
| 20150304787 | MEMS MICROPHONE SYSTEM FOR HARSH ENVIRONMENTS - A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving audio signals into the chamber. A MEMS microphone is attached within the chamber about the aperture. A filter covers the aperture opening in the opposing face of the base to prevent contaminants from entering the acoustic chamber. A second metal lid encloses the opposing face of the base and may attach the filter to this face of the base. The lids are electrically connected with vias forming a radio frequency interference shield. The ceramic base material is thermally matched to the silicon microphone material to allow operation over an extended temperature range. | 10-22-2015 |
| 20160014538 | Micromechanical Digital Loudspeaker | 01-14-2016 |
| 20160029137 | MASS PORT PLUG FOR CUSTOMIZING HEADPHONE DRIVERS, AND RELATED METHODS - A headphone includes an ear-cup housing and an audio driver. The audio driver has a driver housing, and a driver aperture extending through the audio driver from an exterior thereof toward a diaphragm. A mass port plug is disposed at least partially within the driver aperture extending through the audio driver. The mass port plug has an acoustic aperture extending through the mass port plug from a first side thereof to an opposing second side thereof, and the acoustic aperture is configured to cause the audio driver to exhibit a selected detectable sound pressure level (SPL) profile. Methods of fabricating headphones include insertion of such a mass port plug into a driver aperture extending through an audio driver. The mass port plugs and methods may be used to adapt substantially identical audio drivers for use in ear-cup housings having differing configurations while providing selected detectable sound pressure level profiles. | 01-28-2016 |
| 20160057868 | SYSTEMS AND METHODS FOR PACKAGING ELECTRONIC DEVICES - A packaging system of an electronic device, in which the electronic device is mounted on a circuit board, may comprise: a first jig having a groove configured to contain the electronic device, the first jig having a surface on which a plurality of aligning posts are prepared to protrude; a circuit board supporting member connected to the circuit board to support the circuit board, the circuit board supporting member including a plurality of first guide holes into which the aligning posts are inserted; and/or a second jig configured to apply pressure to the circuit board and including a plurality of second guide holes into which the aligning posts are inserted. | 02-25-2016 |
| 20160088413 | CENTER POSITIONING JIG AND SPEAKER ASSEMBLING METHOD USING THE SAME - A center positioning jig includes a base having a top surface and an annular groove wherein the top surface has central and peripheral sections separated by the annular groove, and a positioning column protruding from the central section. The center positioning jig is adapted for assembling a speaker in a way that a voice coil is combined with a positioning sheet by means of the center positioning jig and a voice coil jig or just sleeved onto the voice coil jig, a magnetic path structure is constructed of a magnet-conductive housing, a magnetic element and a magnet-conductive plate and then combined with the voice coil and a diaphragm by means of the center positioning jig, and a cap is fastened to the diaphragm. In this way, the assembly of the speaker requires relatively fewer jigs and the components of the speaker are easy to be combined coaxially. | 03-24-2016 |
| 20160184863 | METHOD FOR MANUFACTURING ULTRASOUND TRANSDUCER - A method for manufacturing an ultrasound transducer according to the present invention includes a first step of manufacturing a wiring layer by arranging insulating fibers on conductive threads, a second step of electrically connecting one end of the plurality of conductive threads to a transducer array unit, a third step of providing a first backing material after providing a second backing material so that at least connection sites between the transducer array unit and the conductive threads are embedded, and a fourth step of curing the first backing material so as to fix the transducer array unit and the wiring layer. | 06-30-2016 |
