| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 505150000 |
HIGH TEMPERATURE (TC GREATER THAN 30 K) DEVICES, SYSTEMS, APPARATUS, COM- PONENTS, OR STOCK, OR PROCESSES OF USING
| 709 |
| 505300000 |
PROCESSES OF PRODUCING OR TREATING HIGH TEMPERATURE (TC GREATER THAN 30 K) SUPERCONDUCTOR MATERIAL OR SUPERCONDUCTOR CONTAINING PRODUCTS OR PRECURSORS THEREOF
| 99 |
| 505100000 |
HIGH TEMPERATURE (TC GREATER THAN 30 K) SUPERCONDUCTOR MATERIAL (I.E., ELEMENT, COMPOUND, OR COMPOSITION), PER SE
| 39 |
| 505510000 |
PRECURSOR OF HIGH TEMPERATURE (TC GREATER THAN 30 K) SUPERCONDUCTOR MATERIAL OR STOCK, PER SE, OR PROCESS OF PRODUCING THE PRECURSOR
| 6 |
| 505825000 |
APPARATUS, PER SE, DEVICE, PER SE, OR PROCESS OF MAKING OR OPERATING SAME | 1 |
| 20080293577 | Method for Operating a Superconductor at a Temperature Higher than the Superconductive Temperature Tc - A method of operating a superconductor in its superconductivity state at a temperature Tc(i) in the range of T | 11-27-2008 |
| 505700000 |
HIGH TC (ABOVE 30 K) SUPERCONDUCTING DEVICE, ARTICLE, OR STRUCTURED STOCK | 1 |
| 20090054243 | METHOD OF POLISHING TAPE-SHAPED SUBSTRATE AND SUBSTRATE FOR OXIDE SUPERCONDUCTOR - A target surface of a tape-shaped substrate of an oxide superconductor with an intermediate layer formed on this target surface and an oxide superconductor thin film is polished by causing the tape-shaped substrate to continuously run. The polishing step includes an initial polishing process for carrying out random polishing of the target surface and a finishing process that is carried out after the initial polishing process for forming grooves on the target surface along the running direction of the substrate. The intermediate layer has an in-plane directionality of 7° or less. The tape-shaped substrate is fabricated by rolling nickel, a nickel alloys or stainless steel. | 02-26-2009 |
