Universal Scientific Industrial (Shanghai) Co., Ltd. Patent applications |
Patent application number | Title | Published |
20150214075 | MANUFACTURING METHOD OF SELECTIVE ELECTRONIC PACKAGING DEVICE - A manufacturing method of selective electronic packaging device includes the following. A plurality of electronic components is disposed on a surface of a substrate. A photo-sensitive resin material is formed on the surface of the substrate. UV-light is irradiated to the photo-sensitive resin material to form an embankment structure. An encapsulating material is filled a protective area surrounded by the embankment structure. The encapsulating material covers at least one electronic component. The encapsulating material is solidified to form an encapsulating member, and the encapsulating member covers at least one electronic component. | 07-30-2015 |
20150139025 | Wireless Network Configuration Method and System for Smart Appliance - A wireless network configuration method and system for a smart appliance, wherein the smart appliance can start a client mode and an AP mode to connect with a wireless network AP and a portable electronic device separately. When the smart appliance established the connection with the wireless network AP, it will switch from the AP mode to a hidden SSID mode automatically. If an SSID and password of the access point have been stored in the portable electronic device, the portable electronic device will transmit these data to the smart appliance to simplify the operation for wireless network configuration. Besides, the smart appliance will keep connecting with the portable electronic device and disappearing in an available wireless network list of the portable electronic device in the hidden SSID mode. The advantages of this invention are full function and ease of operation. | 05-21-2015 |
20150116156 | WIRELESS MODULE WITH INTEGRATED ANTENNA BY USING RIGID-FLEX BOARD - A wireless module includes a flex substrate, an antenna integrated in the flex substrate and electrically connected to a signal layer and a ground layer of the flex substrate, a first rigid substrate stacked on one side of the flex substrate remote from the antenna, and a communication unit mounted on the first rigid substrate and electrically connected to the signal layer. Thus, the flex substrate and the first rigid substrate are laminated into a Rigid-Flex board. Further, the signal layer and the ground layer are continuously arranged in the same flex substrate, It will be helpful in decreasing the uncertainty and loss of RF signal transmission path, reducing component costs, facilitating optimization of the antenna and reducing the module size. | 04-30-2015 |
20150067370 | POWER SAVING METHOD AND CONTROL CIRCUITRY AND POWER SUPPLY - The present disclosure provides a control circuitry used in a computing system, for enabling or disabling a standby module of a power supply. The control circuitry is electrically coupled to two nodes of the standby module, and comprises a determination circuit, a transistor, and an optical coupler. The present disclosure further provides a power saving method used in a computing system is illustrated. Whether the computing system is turned off is determined. If the computing system is turned off, a setting that whether the turned off computing system requires the standby voltage is judged. If the turned off computing system does not require the standby voltage, a standby module of a power supply is disabled. | 03-05-2015 |
20150036296 | EMI COMPARTMENT SHIELDING STRUCTURE AND FABRICATING METHOD THEREOF - A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member. A conformal shield is disposed on the encapsulating member, electrically connecting the compartment structure through the notch. | 02-05-2015 |
20150035201 | METHOD OF MANUFACTURING ELECTRONIC PACKAGE MODULE - A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon. | 02-05-2015 |
20150015215 | VOLTAGE REGULATOR, UNDER-VOLTAGE PROTECTION CIRCUIT THEREOF AND VOLTAGE REGULATION SYSTEM - A voltage regulator coupled between a batteryless alternator and a ground includes an under-voltage detection circuit and an exciting current regulating unit. The under-voltage protection circuit includes a voltage detection unit, a plurality of switching circuits, and a power switch. The voltage detection unit generates a first control signal according to an output voltage of the batteryless alternator. The switching circuits are connected in series and controlled by the first control signal. The power switch is coupled to one of the switching circuits and a rotor coil of the batteryless alternator. The exciting current regulating unit controls the operation of the power switch according to the output voltage of the batteryless alternator. The voltage detection unit detects whether the output voltage is lower than a threshold and selectively cuts off the power switch by sequentially controlling the operations of the switching circuits according to the detection result. | 01-15-2015 |
20140366829 | STARTER PROTECTOR HAVING DELAY CIRCUIT, DELAY CIRCUIT THEREOF AND MOBILE VEHICLE - A delay circuit is coupled to an electromagnetic coil and includes a power input end coupled to a first end of the electromagnetic coil, a first switch module coupled to the power input end, a second switch module coupled to a second end of the electromagnetic coil, a first timing module coupled to the power input end and the first switch module, and a second timing module coupled to the power input end and the second switch module. The second switch module turns on when the power input end supplies power. The first timing module is configured to count time when the power input end supplies power and turns on the first switch module after a first predetermined time. The second timing module is configured to count time after the first switch module turns on and turns on the second switch module after a second predetermined time. | 12-18-2014 |
20140361610 | VOLTAGE REGULATOR, OPERATION METHOD THEREOF, VOLTAGE REGULATING SYSTEM, AND MOBILE VEHICLE - A voltage regulator, an operation method thereof, and a voltage regulating system, and a mobile vehicle are provided. The voltage regulator coupled to an alternator and a battery includes a voltage detection unit which is coupled to the alternator and a startup assisting unit. The voltage detection unit operatively generates an enable signal responsive to an output voltage of the alternator. The startup assisting unit is coupled to the alternator, the battery, and the voltage detection unit. The startup assisting unit operatively generates a first exciting current to excite a rotor coil according to the enable signal. When the voltage detection unit detects that the output voltage is greater than a predetermined voltage threshold, the voltage detection unit outputs the enable signal causing the startup assisting unit to generate the first exciting current to the rotor coil, thereby facilitating the alternator to establish voltage under low rotational speed. | 12-11-2014 |
20140159819 | ELECTRONIC SYSTEM, RF POWER AMPLIFIER AND OUTPUT POWER COMPENSATION METHOD THEREOF - A radio frequency (RF) power amplifier is disclosed. The power amplifier includes an output stage circuit, an exponential type bias circuit and a voltage-current transformation circuit. The output stage circuit receives a first system voltage and outputs an output current. The exponential type bias circuit receives a bias current, wherein a relationship between the bias current and output current is exponential, and when the bias current is zero current, and the output current is zero current. The voltage-current transformation circuit transforms the first system voltage into a second current so that the bias current is in proportion to the first system voltage, and thus the relationship between the output current and the first system voltage is exponential. The bias current is equal to times of the sum of the first current and the second current. | 06-12-2014 |
20140153670 | ELECTRONIC SYSTEM, RF POWER AMPLIFIER AND TEMPERATURE COMPENSATION METHOD THEREOF - A radio frequency (RF) power amplifier is disclosed. The RF power amplifier includes an adder circuit, an output-stage circuit and a differential circuit. The adder circuit has a first ratio and a second ratio, and receives a reference voltage and a feedback voltage so as to output an adder voltage after an operation, wherein the feedback voltage is a voltage with a negative temperature coefficient, and the reference voltage is sum of a first voltage with a negative temperature coefficient and a second voltage with positive temperature coefficient. The output-stage circuit is used for providing the feedback voltage. The differential circuit has a first multiplier factor, and the differential circuit makes the first multiplier factor be multiplied with the adder voltage so as to provide a voltage to the output-stage circuit. The RF power amplifier stabilizes an output current through adjusting the temperature coefficient of the reference voltage. | 06-05-2014 |
20140145570 | ELECTRONIC DEVICE CASE WITH WATER RESISTANT SIDE BUTTON - An electronic device case includes a first shell, a second shell, and a side button. The first and second shells are each provided with a peripheral side plate. A passage communicating the inside and outside of the case, a first restriction slot extending from the passage toward the first shell, and a second restriction slot extending from the passage toward the second shell are formed jointly by the peripheral side plates of the shells embedded with each other. The side button is provided with a base and a press portion protruding from the base. The thickness of the base is larger than or equal to the widths of the restriction slots. The side button is installed in the passage with the base embedded in the restriction slots. As a result, the case is sufficiently water resistant, firm in structure and easy to assemble. | 05-29-2014 |
20140132350 | ELECTRONIC SYSTEM, RF POWER AMPLIFIER AND TEMPERATURE COMPENSATION METHOD THEREOF - A radio frequency (RF) power amplifier is disclosed. The RF radio power amplifier includes a bias current generating unit, a first impedance unit, a second impedance unit, a third impedance unit and an output stage unit. The bias current generating unit receives a reference voltage. There is a first voltage with negative temperature coefficient between the first impedance unit and the second impedance unit, and the second unit receives a ground current. There is a second voltage between the third impedance unit and the second impedance unit, and the second voltage is a partial voltage of the first voltage. The bias current generating unit outputs a bias current with positive temperature coefficient according to the second voltage. The output stage unit receives an input current. The bias current is a sum of the input current with positive temperature coefficient and the ground current. | 05-15-2014 |
20140126161 | ELECTRONIC PACAKGE MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component. | 05-08-2014 |
20140126159 | ELECTRONIC DEVICE, SYSTEM PACKAGE MODULE AND METHOD OF MANUFACTURING SYSTEM PACKAGE MODULE - A system in package (SiP) module includes a first circuit board assembly, a second circuit board assembly and a plurality of metallic pillars. The first circuit board assembly has a first top surface, a first bottom surface and a plurality of pads mounted on the first bottom surface. The second circuit board assembly has a second top surface, a second bottom surface and a plurality of second pads mounted on the second top surface. The metallic pillars are disposed between the first bottom surface and the second top surface. The metallic pillars electrically connect the first pad and the second pad. | 05-08-2014 |
20140125295 | SOFT-START VOLTAGE REGULATING CIRCUIT AND GENERATOR VOLTAGE REGULATING SYSTEM THEREOF - A soft-start circuit composed of active components and passive components and a soft-start voltage regulator based on this soft-start circuit are disclosed. The soft-start voltage regulator is coupled to a generator, a battery and a starter. When the starter is started, the soft-start voltage regulator receives the voltage of the battery to generate a soft-start signal, enabling the generator to establish a voltage. Further, after the generator established the voltage, the soft-start voltage regulator is shut off and the soft-start signal is outputted. | 05-08-2014 |
20140104799 | 3D STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A 3D stacked package structure includes a first unit, a molding unit, a conductive unit and a second unit. The first unit includes a first substrate and at least one first electronic component, and the first substrate has at least one runner and at least one first conductive pad. The molding unit includes a top portion, a frame, and at least one connection connected between the top portion and the frame. The conductive unit includes at least one conductor passing through the frame and electrically connected to the first conductive pad. Therefore, the first unit can be stacked on the second unit through the frame of the molding unit, and the first unit can be electrically connected to the second unit through the conductor of the conductive unit. | 04-17-2014 |
20140098002 | ANTENNA MODULE - An antenna module includes a printed circuit board, multiple conductive clamps bonded to the printed circuit board, each conductive clamp having elastic clamping arms at two opposite lateral sides thereof, and an antenna inserted in between the clamping arms of each conductive clamp and secured and electrically conducted to the printed circuit board by the conductive clamps for signal feed-in and grounding. | 04-10-2014 |
20140085857 | ELECTRONIC MODULE AND METHOD FOR SAME - An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer. | 03-27-2014 |
20140084483 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A package structure comprises a substrate, a plurality of first electronic components, at least a second electronic component, a first covering layer and a wiring layer. A surface of the substrate includes a first region and a second region. The first electronic components are disposed in the first region, wherein at least one of the first electronic components has a first conductive contact. The second electronic component is disposed in the second region. The first covering layer includes a recess and a first exposing region for exposing the first conductive contact. The wiring layer is formed on the recess and electronically coupled to the first conductive contact. | 03-27-2014 |
20140070395 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF - An electronic device and the manufacturing method thereof are provided. The method comprises providing a module, in which the module includes a substrate, at least one component mounted on the substrate and a molding, and the molding encapsulates the component and a portion of the substrate; forming a first hole to expose a ground pad of the component; forming a first conductive layer which covers the module and is electrically connected to the ground pad. | 03-13-2014 |
20130243221 | METHOD AND SYSTEM OF EQUALIZATION PRE-PREOCESSING FOR SOUND RECEIVNG SYSTEM - An exemplary embodiment illustrates an equalization pre-processing method, adapted for characterizing a second sound receptor unit in a sound receiving system based on knowing the internal structure parameters of a first sound receptor unit. The method includes: measuring a first sensitivity response of the first sound receptor unit and a second sensitivity response of the second sound receptor unit; equalizing the second sensitivity response according to the first sensitivity response and obtaining the differences in the sensitivity response; conducting simulation to obtain the third sensitivity response associated with the first sound receptor unit in the given sound receiving system; compensating the third sensitivity response to generate the fourth sensitivity response associated with the second sound receptor unit in the sound receiving system according to the differences in the sensitivity response; analyzing the fourth sensitivity response to characterize the second sound receptor unit in the given sound receiving system. | 09-19-2013 |
20130201648 | STACKED SUBSTRATE STRUCTURE - The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder. | 08-08-2013 |
20130158934 | METHOD FOR AUTOMATICALLY TESTING COMMUNICATION FUNCTIONALITY OF DEVICE UNDER TEST AND COMPUTER-READABLE MEDIA THEREOF - An exemplary embodiment of present disclosure illustrates a method for automatically testing communication functionality of a device under test (DUT). The method is adapted for driving and controlling at least an instrument to test communication functionality of a DUT through a computing device. The method includes steps described as follows establishing a communication functionality testing system and providing a user interface installed in the computing device, wherein the user interface includes a DUT selection window providing a plurality of DUT module selections; a testing menu window, providing various preset testing item selections; a selected test list displaying configurable sequence for the selected testing items of a specific testing task; a property table provides property and parameter configurations associated with a selected testing item; and a DUT and instrument configuration window for configuring hardware properties of the DUT and instruments as well as the calibration data of the instruments. | 06-20-2013 |
20130151748 | STRUCTURE FOR TRANSMITTING SIGNALS OF PCI EXPRESS AND METHOD THEREOF - A structure for transmitting signals of PCI express and a method thereof provides a converting device and a high-definition multimedia interface (HDMI) cable. The converting device has a plug connector to into a PCI express slot, along with a HDMI connector. The signal converting circuit connects the signal pins of the PCI express slot to the signal pins of HDMI connector. One end of the HDMI cable is connected with the HDMI connector of the converting device. The present invention can extends the signal distance of the PCI express to exactly perform the signal test. | 06-13-2013 |
20130062111 | STACKED SUBSTRATE MODULE - A stacked substrate module includes a first and a second substrate. The first substrate has several pads which extend respectively from a stacked area of the first substrate to the outside of the stacked area. The second substrate has several welding areas arranged on the outer lateral side thereof; each welding area extends respectively from the outer lateral side of the second substrate to an upper and a lower surface of the second substrate. The second substrate is stacked in the stacked area of the first substrate, wherein the lateral side of the second substrate is aligned to the edge of the stacked area of the first substrate. The aforementioned pads correspond to the welding areas respectively. It is suitable to position a solder paste between the pads and the welding areas which can be reflowed to connect the pads and the welding areas. | 03-14-2013 |
20130056603 | ANGLE-ADJUSTABLE SUPPORT WITH PIVOT MECHANISM - An angle-adjustable support includes a base, a carrier and a pivot mechanism. The base includes a sidewall and a bottom. The sidewall has a first pivot and a second pivot. The pivot mechanism pivotally connects the carrier with the base. The pivot mechanism has three working states. The carrier is locked when the pivot mechanism works in a first working state. The carrier is capable of pivoting relative to the base in a clockwise or anticlockwise when the pivot mechanism works in a second working state. The carrier is free to rotate when the pivot mechanism works in a third working state. | 03-07-2013 |
20130044454 | ANGLE ADJUSTABLE DEVICE AND ELECTRONIC DISPLAY UNIT USING THE SAME - The instant disclosure relates to an angle adjustable device, which includes: a base having a fixing member disposed thereon, where the fixing member has a fixing surface; a switch mechanism having a locking ring, a first gear, and a second gear, while at least one block protrudes from the inner surface of the locking ring, with the first gear having a contact incline slidingly abutted by the block, where the contact incline is defined with a first end and a second end, where the first gear is received by the locking ring and capable of meshing with the second gear; and a rotator having at least one connecting member connected to the second gear. The instant disclosure also discloses an electronic display unit using the same. | 02-21-2013 |
20130043693 | HOLDING SUPPORT FOR ELECTRONIC DEVICE - The instant disclosure relates to a holding support for electronic device, which includes a case and a bracket. A bracket compartment is formed on the case and defined by an opening formed on the outer surface of the case. The bracket has a body and at least one finger hole formed thereon for sliding a finger through. The bracket can be retracted in or extended from the bracket compartment by being arranged at a retracted position or extended position, respectively. Therefore, the user can firmly secure the electronic device and prevent from dropping it accidentally. | 02-21-2013 |
20120267783 | STACKED-SUBSTRATE STRUCTURE - The stacked-substrate structure includes a first substrate having a first die embedded therein, a second substrate having a second die embedded therein, a plurality of soldering elements, and a third die. The soldering elements are disposed between the first and the second substrates and connected to the first and the second substrates. The first and the second substrates are electrically connected via the soldering elements. The first substrate, the second substrate, and the soldering elements define an accommodating space. The third die is arranged in the accommodating space and is connected to one surface of the first substrate. The third die is electrically connected to the first and the second dies via the first substrate. Thus, the thickness of the stacked-substrate structure can be reduced, and the first and the second dies of the stacked-substrate structure can be test separately in different platforms. | 10-25-2012 |
20120248585 | ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE FOR INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING THE SAME - An electromagnetic interference (EMI) shielding structure for integrated circuit (IC) substrate includes a plurality of conductive contacts, a covering layer, and a sputtered layer. The conductive contacts are formed at the perimeter of a chip area on the IC substrate. The covering layer is formed on the conductive contacts and covers the chip area. A groove is formed on the covering layer for exposing the conductive contacts. The sputtered layer is formed on the covering layer and connected to the conductive contacts. The EMI shielding structure can restrain the interference in the chip area. | 10-04-2012 |
20120243199 | ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF - An electromagnetic interference (EMI) shielding structure, which includes: a substrate, at least one chip unit, a packing layer, and an EMI shielding unit. The chip unit is disposed on the surface of the substrate and electrically coupled thereto. The packing layer is formed on the substrate and covers the chip unit. The EMI shielding unit includes: a first, second, and third shielding layer. The first shielding layer covers the outer surface of the packing layer and the lateral surface of the substrate. The second and third shielding layer respectively covers the outer surface of the first and second shielding layer. Based on the instant disclosure, the EMI shielding unit uses the methods of sputtering and electroless plating, to increase the adhesion strength of the EMI shielding unit and make the thickness of the shielding layer uniform. The instant disclosure raises the EMI shielding efficiency and lowers the manufacturing cost. | 09-27-2012 |
20120243191 | MINIATURIZED ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF - A miniaturized electromagnetic interference (EMI) shielding structure is disclosed, which includes a substrate and a plurality of chip modules disposed thereon. The substrate has a plurality of ground portions formed thereon. Each chip module includes: at least one chip unit disposed on the substrate and connected electrically thereto; at least one conductive bump disposed on the substrate adjacent to the chip unit and connected electrically to the corresponding ground portion; an encapsulation layer arranged on the substrate and covers the chip unit and the conductive bump; and an EMI shielding layer covering the encapsulation layer and electrically connected with an exposed surface of the conductive bump, to allow the EMI shielding layer be electrically connected to the ground portion. The disclosure of the present invention allows each chip module to have its own EMI shielding capability. | 09-27-2012 |
20120086119 | CHIP STACKED STRUCTURE - A chip stacked structure is provided. The chip stacked structure includes a first die and a second die stacked on the first die. The first die has a plurality of connection structures each which has a through hole, a connection pad and a solder bump. The connection pad has a terminal connected to the through hole. The solder bump is disposed on the connection pad and located around the through hole. The second die has a plurality of through holes which are aligned and bonded to the solder bump respectively. The chip stacked structure may simplify the process and improve the process yield rate. | 04-12-2012 |
20120086108 | CHIP LEVEL EMI SHIELDING STRUCTURE AND MANUFACTURE METHOD THEREOF - A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at least one ground conductor line, a ground layer, and a connection structure. The ground conductor line is disposed on a first surface of the semiconductor substrate, and the ground layer is disposed on a second surface of the semiconductor substrate. The connection structure is formed on a lateral wall of the semiconductor substrate for connecting the ground conductor lines with the ground layer to form a shielding. With such arrangement, the chip level EMI shielding structure can reduce the chip size and the manufacturing cost. | 04-12-2012 |
20120074593 | CHIP STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME - A chip stacked structure and method of fabricating the same are provided. The chip stacked structure includes a first chip and a second chip stacked on the first chip. The first chip has a plurality of metal pads disposed on an upper surface thereof and grooves disposed on a side surface thereof. The metal pads are correspondingly connected to upper openings of the grooves. The second chip has a plurality of grooves on a side surface of the second chip, locations of which are corresponding to that of the grooves on the side surface of the first chip. Conductive films are formed on the grooves of the first chip and the second chip and the metal pads to electronically connect the first chip and second chip. The chip stacked structure may simplify the process and improve the process yield rate. | 03-29-2012 |
20120062342 | MULTI BAND-PASS FILTER - A multi band-pass filter includes a first resonator and a second resonator. The first resonator has a first frequency pass band and a second frequency pass band. Moreover, the second resonator is electromagnetically coupled to another end of the first resonator. The second resonator has a third frequency pass band and a fourth frequency pass band, wherein the third frequency pass band overlaps (or is congruous with) the first frequency pass band and the fourth frequency pass band overlaps the second frequency pass band. | 03-15-2012 |
20120062341 | MICRO BAND-PASS FILTER - A micro band-pass filter is disclosed. The micro band-pass filter includes a first resonator having a first inter-digital unit and a second inter-digital unit, which is connected to a first wavelength-impedance converter, on two ends thereof, and a second resonator having a third inter-digital unit and a fourth inter-digital, which is connected to a second wavelength-impedance converter unit on two ends thereof. The second inter-digital unit is adapted to face the third inter-digital unit when forming a first inter-digital coupling structure along with the third inter-digital unit, and the first inter-digital unit is adapted to face the fourth inter-digital unit when forming a second inter-digital coupling structure. | 03-15-2012 |
20120026669 | PORTABLE NETWORKING DEVICE - A portable networking device has a casing, a power connector, a power adapting unit, a circuit board, and a networking interface disposed on the circuit board. A receiving space is formed on an exterior side surface of the casing, and the power connector is fixed inside the casing. The power adapting unit is fixed inside the casing and electrically connected to the power connector, where the power connector can selectively connected to a detachable power plug or a power cord having a connector. The detachable power plug has a pair of conducting pins, which can be rotatably received inside the receiving space of the casing. The circuit board is disposed in the casing. The instant disclosure includes the detachable power plug having concealable conducting pins, and no external power adapter is needed. All of which allow for easy stowing and transport for the user. | 02-02-2012 |
20110149888 | PACKET SCHEDULING METHOD AND COMMUNICATION APPARATUS USING THE SAME - Exemplary embodiments of the present disclosure provide several packet scheduling methods and communication apparatuses using the same. The packet scheduling method is different from the conventional packet scheduling method, since it does not schedule the sleep interval of the mobile subscriber station based upon the connections as the conventional packet scheduling method. Instead, the packet scheduling method considers the quality of service, and aggregates the data bursts to the frame corresponding to the frame index to which the data bursts are shifted based upon the individual packet, such that a total time length of the sleep intervals of the mobile subscriber station is maximized, and the maximum power saving efficiency is obtained correspondingly. | 06-23-2011 |