Trillion Science Inc. Patent applications |
Patent application number | Title | Published |
20150072109 | FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES WITH BLOCK COPOLYMER COATING - Structures and manufacturing processes of an ACF array and more particularly a non-random particles are transferred to the array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a block copolymer composition onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. | 03-12-2015 |
20140312501 | NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURING PROCESSES - Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, of selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution. | 10-23-2014 |
20140261992 | MICROCAVITY CARRIER WITH IMAGE ENHANCEMENT FOR LASER ABLATION - A carrier belt for fabricating a device or component such as an anisotropic conductive film. The carrier belt includes a substrate having a sacrificial image enhancing layer. Microcavities are formed in the carrier by laser ablation through the image enhancing layer. After the image enhancement layer is removed, a plurality of conductive particles are distributed into an array of microcavities formed by laser ablation on a surface of a carrier belt and transferred to an adhesive layer. The image enhancing layer enables one to form microcavities with a fine pitch and spacing and partitions having a high aspect ratio. | 09-18-2014 |
20130146816 | ONE PART EPOXY RESIN INCLUDING ACRYLIC BLOCK COPOLYMER - An adhesive composition comprising a phenoxy resin, a latent hardener, an acrylic block co-polymer dispersant and a weak solvent wherein the dispersant enables the phenoxy resin to be dispersed in a weak solvent that does not attack the latent hardener thereby providing a composition with good shelf life. The compositions are useful in making anisotropic conductive films. | 06-13-2013 |
20130071636 | MICROCAVITY CARRIER BELT AND METHOD OF MANUFACTURE - A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner. | 03-21-2013 |
20120295098 | FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING SURFACE MODIFIED CONDUCTIVE PARTICLES - Structures and manufacturing processes of an ACF array and more particularly a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a coupling agent onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film, the conductive particles are transferred to the adhesive film such that they are only partially embedded in the film. | 11-22-2012 |
20120029116 | CURABLE ADHESIVE COMPOSITIONS, PROCESS, AND APPLICATIONS - The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent. | 02-02-2012 |
20120007259 | LATENT HARDENER WITH IMPROVED BARRIER PROPERTIES AND COMPATIBILITY - A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications. | 01-12-2012 |
20110253943 | ONE PART EPOXY RESIN INCLUDING A LOW PROFILE ADDITIVE - An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when admixed with the adhesive composition and that separates from the adhesive to form a network of stress-absorbing nodules therein when the adhesive is cured, the low profile additive being present in an amount sufficient to prevent or reduce shrinkage and/or the formation of voids or cracks when the adhesive is cured. In one embodiment the LPA is a block copolymer including at least one flexible block and at least one rigid block that makes the low profile additive compatible with the epoxy adhesive such that a mixture of the uncured epoxy resin and the low profile additive forms a homogenous solution and as the epoxy resin is cured, the low profile additive forms a stress absorbing network of nodules in the cured epoxy resin matrix. | 10-20-2011 |
20110220401 | LATENT HARDENER WITH IMPROVED BARRIER PROPERTIES AND COMPATIBILITY - A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications. | 09-15-2011 |
20100101700 | NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURING PROCESSES - Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution. | 04-29-2010 |
20090181165 | Curable adhesive compositions, Process, and applications - The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent. | 07-16-2009 |
20090053859 | Non-random array anisotropic conductive film (ACF) and manufacturing process - The present invention discloses structures and manufacturing processes of an ACF of improved resolution and reliability of electrical connection using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes the steps of (i) fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or (ii) selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. | 02-26-2009 |