| THREE BOND CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20140114007 | TEMPORARY FIXING COMPOSITION - The present invention provides a temporary fixing composition capable of fixing wafers and the like and metals with high adhesive strength and removing easily and completely the wafers and the like and the metals without breakage thereof. The temporary fixing composition used for flat surface polishing includes the following components (A) to (C): Component (A): a thermoplastic resin polymerized from an α-olefin having 16 to 35 carbon atoms alone; Component (B): a hydrogenated tackifier; and Component (C): a hydrocarbon compound which is in the state of a solid at 25° C., and having a melt viscosity of 1 to 5000 mPa·s at 100° C. and a Shore D hardness of 30 to 100. | 04-24-2014 |
| 20140045963 | PHOTOCURABLE COMPOSITION - [Problem] To provide a photocurable sealing material which exhibits stable physical properties, particularly permanent compression set when subjected to a heat resistance test in an atmosphere of 100 to 150° C., and has a stable applying shape and storage stability. | 02-13-2014 |
| 20130267626 | PHOTOCURABLE COMPOSITION - The present invention allows for a photocurable composition which exhibits stable physical characteristics in a heat resistance test and an oil resistance test, and exhibits good debubbling properties and excellent workability. A photocurable composition including components (A) to (C).
| 10-10-2013 |
| 20130056491 | MATERIAL PRESSURE FEEDING APPARATUS - A material pressure feeding apparatus | 03-07-2013 |
| 20130042973 | PHOTOCURABLE SILICONE GEL COMPOSITION AND APPLICATION THEREOF - The present invention relates to a photocurable silicone gel composition includes: (A) an organopolysiloxane having at least one group represented by the following general formula (1): in which R | 02-21-2013 |
| 20130005854 | CURABLE COMPOSITION - The present invention relates to a curable composition including: (a) at least one compound having at least one (meth)acrylic functional group in the molecule thereof, which is selected from a (meth)acrylic monomer and a (meth)acrylic oligomer; (b) an organic peroxide; (c) an o-benzoic sulfimide; and (d) an oxazoline compound, in which the component (d) is contained in an amount of 0.005 to 10 parts by mass based on 100 parts by weight of the component (a). | 01-03-2013 |
| 20120316285 | TEMPORARY FIXING COMPOSITION - In the past, it was difficult to fix an adherend sufficiently during polishing processing and to peel off the adherend conveniently. | 12-13-2012 |
| 20120095124 | BASE AND RADICAL GENERATOR, COMPOSITION USING SAME AND METHOD FOR CURING SAME - The present invention relates to an aminimide compound having a structure represented by the following general formula (I) in the molecule thereof, relates to a curable composition using the aminimide compound and relates to a method for curing the composition; | 04-19-2012 |
| 20110213069 | AQUEOUS COATING COMPOSITION - The present invention relates to an aqueous coating composition having excellent coating adhesion, workability, heat resistance and chemical resistance, and has an object to provide an aqueous coating composition for sealing, which is suitable for members to be screwed in. The present invention relates to an aqueous coating composition including: as main components, component (A) an ethylene-vinyl acetate copolymer resin emulsion and component (B) two or more PTFE resin powders having different particle diameters, in which 35 to 80 parts by mass of water is contained on the basis of 100 parts by mass of the total of (A) and (B). | 09-01-2011 |
| 20100137530 | PHOTOCURABLE RESIN COMPOSITION FOR SEALING ORGANIC EL DEVICE - A photocurable resin composition for sealing an organic EL device is provided, which can seal the organic EL device without exerting any bad influence on the device, thereby suppress the formation and growth of dark spots positively, and which can ensure a high transmittance of light, thereby maintain a stable light emitting characteristic over a long period of time. The composition comprises (A) an epoxy resin containing at least two glycidyl groups in each molecule thereof and having a molecular weight of 200 to 7000, (B) an epoxy resin containing at least one glycidyl group in each molecule thereof and having a molecular weight of 20000 to 100000, (C) a latent acid photo catalyst adapted to be activated and produce an acid upon being irradiated with energy beam, and (D) a silane coupling agent containing a glycidyl group in each molecule thereof, the composition exhibiting non-fluidity at 25° C., but exhibiting fluidity in a temperature range of 50° to 100° C. | 06-03-2010 |
| 20090025870 | CURABLE COMPOSITION AND SEALING METHOD - An object of the present invention is to provide a curable composition excellent in on-site formability, excellent in heat resistance, chemical resistance and oil resistance, and low in compression set. The invention relates to a curable composition comprising (a) a vinyl-based polymer containing at least one (meth)acryloyl group in a molecule thereof and having a number average molecular weight of 500 to 1,000,000, (b) an ethylenic unsaturated group-containing compound, (c) a thixotropic property-imparting agent, (d) fumed silica surface-treated with a (meth)acryloyl group-containing silane and (e) a photopolymerization initiator. | 01-29-2009 |
| 20080279617 | Curable Composition and Sealing Method - The present invention provides a curable composition comprising (a) a vinyl-based polymer containing, in its molecule, at least one alkenyl group which can be hydrosilylated, and having a number average molecular weight of 500 to 1,000,000, (b) a hydrosilyl group-containing compound and (c) a silicone powder, and a sealing method using the curable composition. According to the invention, there can be provided a curable composition excellent in on-site formability, excellent in heat resistance, chemical resistance and oil resistance, and low in compression set. | 11-13-2008 |
