TAZMO CO., LTD.
TAZMO CO., LTD. Patent applications | ||
Patent application number | Title | Published |
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20150321347 | LINK-TYPE TRANSFER ROBOT - The present invention provides a transfer robot which has a simple structure and a small occupied area in an operation. | 11-12-2015 |
20150298162 | COATING APPARATUS AND COATING METHOD - This coating device according to the present invention comprises a slit nozzle ( | 10-22-2015 |
20140348622 | WAFER TRANSPORT APPARATUS - An object is to make it possible to adequately reduce the wafer transport time and to contribute to size-reduction of the semiconductor processing system. | 11-27-2014 |
20140321957 | WAFER TRANSPORT ROBOT - An object is to transmit an operation of a first parallel link to a second parallel link through a plurality of rotatably supported arms, to prevent the second parallel link from meandering or rolling so that a wafer can be transported smoothly. | 10-30-2014 |
20140186537 | METHOD FOR CONTROLLING A FLOW RATE OF A PUMP AND METHOD FOR FORMING A COATED FILM - A method for controlling a flow rate of a pump ( | 07-03-2014 |
20140138590 | PHOSPHOR FOR DISPERSION-TYPE EL, DISPERSION-TYPE EL DEVICE, AND METHOD OF MANUFACTURING THE SAME - Provided is a phosphor for a dispersion-type EL that may be manufactured in a simple process and may provide stable, high brightness and light emission efficiency. The phosphor for a dispersion-type EL according to the present invention includes a mixture of an electron-accepting phosphor particle ( | 05-22-2014 |
20140056679 | WAFER EXCHANGE APPARATUS AND WAFER SUPPORTING HAND - A wafer exchange apparatus is provided that is compact with excellent accessibility. The wafer exchange apparatus of the present invention includes a first and a second hands ( | 02-27-2014 |
20140042124 | FILM REMOVING METHOD, NOZZLE FOR REMOVING FILM, AND FILM REMOVING DEVICE - A film in a dry state is efficiently dissolved and removed. A film removing method includes steps of moving a nozzle head ( | 02-13-2014 |
20130252432 | PATTERNING METHOD - Provided is a patterning method that can greatly reduce process costs and environmental load. The patterning method includes: a film forming step of forming a functional film ( | 09-26-2013 |
20120288635 | SUBSTRATE COATING DEVICE AND SUBSTRATE COATING METHOD - A substrate coating device ( | 11-15-2012 |
20120085282 | SUBSTRATE COATING DEVICE - A substrate coating device is provided which is capable of reducing non-uniform film thickness areas that take place in a coating start portion and a coating end portion during coating using a slit nozzle coater. | 04-12-2012 |
20120000420 | SUBSTRATE COATING DEVICE - The substrate coating device ( | 01-05-2012 |