TAIYO YUDEN CO., LTD. Patent applications |
Patent application number | Title | Published |
20160142105 | VARIABLE CAPACITANCE DEVICE AND ANTENNA APPARATUS - A variable capacitance device includes: a first and second terminal for signals; a plural, even number of variable capacitance elements connected in-series between the first and second terminal; a third and fourth terminal for receiving a same voltage; a fifth and sixth terminal for grounding; a plurality of first resistors connected to either the third or fourth terminal on one end; and a plurality of second resistors connected to either the fifth or sixth terminal on one end. With respect to a series of successive nodes beginning with the first terminal and ending with the second terminal, respective other ends of a pair of the first resistors are connected to every other node, and respective other ends of a pair of the second resistors are connected to the remaining every other node, such that the pairs of first and second resistors are alternately connected to the series of successive nodes. | 05-19-2016 |
20160142041 | ACOUSTIC WAVE DEVICE, TRANSCEIVER DEVICE, AND MOBILE COMMUNICATION DEVICE - An acoustic wave device includes: an acoustic wave chip including an acoustic wave element formed therein; a multilayered substrate including the acoustic wave chip mounted on an upper surface thereof; a first ground terminal formed on a lower surface of the multilayered substrate and electrically coupled to a ground electrode of the acoustic wave chip; a second ground terminal formed on the lower surface; a signal terminal formed on the lower surface and electrically coupled to a signal electrode of the acoustic wave chip; and a shield layer formed at least on the upper surface, on the lower surface, or between the lower surface and the upper surface of the multilayered substrate so as to overlap with at least a part of the acoustic wave chip, not electrically coupled to the first ground terminal in the multilayered substrate, and electrically coupled to the second ground terminal. | 05-19-2016 |
20160142038 | PIEZOELECTRIC THIN FILM RESONATOR, FILTER, AND DUPLEXER - A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film; and an insertion film inserted in the piezoelectric film, located in at least a part of an outer peripheral region within a resonance region where the lower electrode and the upper electrode face each other across the piezoelectric film, and not located in a center region of the resonance region, wherein a difference between a total film thickness of the piezoelectric film and the insertion film in a first region, in which the insertion film is inserted, within the resonance region and a film thickness of the piezoelectric film in a second region, in which the insertion film is not inserted, is less than a film thickness of the insertion film. | 05-19-2016 |
20160142017 | RECONFIGURABLE OPERATIONAL AMPLIFIER - A reconfigurable operational amplifier includes: a first signal input terminal; a second signal input terminal; an output terminal; an operational amplifier having a non-inverting input, an inverting input, and an output; a negative feedback circuit path from the output of the operational amplifier to the inverting input of the operational amplifier; a first input circuit path from the first signal input terminal to the non-inverting input of the operational amplifier; a second input circuit path from the second signal input terminal to the inverting input of the operational amplifier; an output circuit path from the output of the operational amplifier to the output terminal; and logic units, wherein one or more of the logic units are provided in at least one of the negative feedback circuit path, the first input circuit path, the second input circuit path, and the output circuit path. | 05-19-2016 |
20160141716 | ALL-SOLID-STATE SECONDARY BATTERY AND METHOD FOR MANUFACTURING SAME - An all-solid-state secondary battery, including: a solid electrolyte layer; a positive electrode layer including a positive electrode active material layer and a first current collector layer; a negative electrode layer including a second current collector layer, the positive electrode layer and the negative electrode layer sandwiching the solid electrolyte layer; and external electrodes connected respectively to the first current collector layer and the second current collector layer, wherein the positive electrode active material layer is formed of an olivine-type active material, wherein the solid electrolyte layer is formed of a phosphate having a NASICON-type structure, and wherein the solid electrolyte layer contains particulate precipitate having an olivine-type crystal structure that includes a same element as an element forming the positive electrode active material layer. | 05-19-2016 |
20160121963 | MOTOR DRIVING CONTROL APPARATUS - This motor driving control apparatus includes (A) a driving unit that drives a motor, and (B) a regeneration control unit that controls the driving unit so as to generate a regenerative braking force in accordance with a vehicle acceleration, a vehicle speed and a pedal-rotation converted speed that is obtained from a pedal rotation. | 05-05-2016 |
20160118951 | HIGH FREQUENCY FILTER AND HIGH FREQUENCY MODULE EQUIPPED WITH SAME - To provide a smaller-sized high frequency filter. In a high frequency filter according to an embodiment of the invention, two filter circuits each equipped with a first externally coupling capacitor having one end coupled to an input-output terminal, a wavelength shortening capacitor having one end coupled to other end of the externally coupling capacitor and having other end coupled to the ground potential, and a resonator having one end coupled to the other end of the externally coupling capacitor and the one end of the wavelength shortening capacitor, having other end coupled to the ground potential, and being formed of a distributed constant line. The two filter circuits are broadside-coupled to each other. | 04-28-2016 |
20160116305 | DISPLACEMENT MEASUREMENT DEVICE AND DISPLACEMENT MEASUREMENT METHOD - A displacement measurement device includes: a light source; a first diffraction grating and a second diffraction grating arranged along a path of light from the light source and movable relative to one another, the first and second diffraction gratings generating diffracted light; an optical sensor that detects interference light produced by interference between −nth order diffracted light generated as a result of the second diffraction grating diffracting +nth order diffracted light from the first diffraction grating and +nth order diffracted light generated as a result of the second diffraction grating diffracting −nth order diffracted light from the first diffraction grating, where n is a natural number greater than or equal to 1; and a calculation unit calculating, according to a signal from the optical sensor, a relative displacement between the first and second diffraction gratings in a direction orthogonal to an optical axis of the first and second diffraction gratings. | 04-28-2016 |
20160112030 | ACOUSTIC WAVE DEVICE, FILTER, AND DUPLEXER - Acoustic wave device includes: a piezoelectric substrate; a first IDT located on the piezoelectric substrate; and a second IDT located on the piezoelectric substrate and connected in series to the first IDT, wherein the first IDT and the second IDT share a single common bus bar as a first bus bar of two bus bars of the first IDT and a first bus bar of two bus bars of the second IDT, and the common bus bar has a width not more than two times a wavelength of an acoustic wave propagating through the first and second IDTs, the common bus bar connects to no dummy electrode finger facing a tip of an electrode finger connected to a second bus bar of the two bus bars of the first IDT and the second IDT across a gap. | 04-21-2016 |
20160112025 | MULTIPLEXER - A multiplexer includes: a first filter connected between a common terminal and a first terminal; a second filter connected between the common terminal and a second terminal, and having a passband lower in frequency than a passband of the first filter; and a resonant circuit including: a first inductor and a capacitor connected in series between a first end and a second end of the resonant circuit, the first end being coupled to a node at which the common terminal diverges into the first filter and the second filter, the second end being coupled to the first filter, and a second inductor connected in parallel to the first inductor and the capacitor between the first end and the second end, wherein the passband of the first filter is higher in frequency than an antiresonant frequency of the resonant circuit. | 04-21-2016 |
20160107719 | CONTROLLER FOR DRIVING A MOTOR, AND ELECTRIC POWER ASSISTED VEHICLE - In one aspect, a controller for driving a motor of the present invention includes a driving control unit that controls driving of a motor, and a regenerative control unit that instructs the driving control unit to start regeneration when a signal from a pedal rotation sensor that detects a rotation direction of a pedal indicates that the rotation direction of the pedal is backwards, the regenerative control unit controlling an amount of the regeneration in accordance with a rotation amount of the pedal while the rotation direction of the pedal is backwards, the rotation amount being obtained by the pedal rotation sensor. | 04-21-2016 |
20160099705 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film; a silicon oxide film located at an opposite side of at least one of the lower electrode and the upper electrode from the piezoelectric film; a non-oxygen-containing insulating film located between the at least one of the lower electrode and the upper electrode and the silicon oxide film; and an additional film located at an opposite side of the silicon oxide film from the non-oxygen-containing insulating film and made of a material different from a material of the silicon oxide film. | 04-07-2016 |
20160095267 | CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME - A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section. | 03-31-2016 |
20160072477 | DUPLEXER, FILTER AND COMMUNICATION MODULE - A duplexer includes: a transmit filter that is connected between an antenna terminal and a transmit terminal and has a plurality of acoustic wave resonators; a receive filter that is connected between the antenna terminal and a receive terminal and has a plurality of acoustic wave resonators; and a delay line or a longitudinal coupling type resonator that is connected in parallel with at least one of the plurality of acoustic wave resonators of the transmit filter and the plurality of acoustic wave resonators of the receive filter and has at least two IDTs (Interdigital Transducers). | 03-10-2016 |
20160071651 | THIN FILM CAPACITOR - A thin film capacitor includes: a supporting substrate; a capacitance forming member formed on the supporting substrate and made of at least two thin film electrodes and at least one thin film dielectric layer alternately stacked on one another; intermediate electrodes electrically connected to the respective thin film electrodes; a sealing member that seals the capacitance forming member and the intermediate electrodes on the supporting substrate the sealing member leaving portions of the intermediate electrodes exposed; and external electrodes formed on at least side faces of the sealing member and respectively connected to the exposed portions of the intermediate electrodes. | 03-10-2016 |
20160066417 | MULTILAYER WIRING SUBSTRATE - In one embodiment of the present invention, a multilayer wiring substrate includes: a first wiring substrate having a first core member made of metal with cavities therein; a second wiring substrate having a second core member made of metal; and a bonding layer between the first wiring substrate and the second wiring substrate to bond a top surface of the first wiring substrate to a bottom surface of the second wiring substrate, the bonding layer having a patterned conductive layer. | 03-03-2016 |
20160064473 | THIN FILM ELECTRONIC COMPONENT - A thin film electronic component includes: a substrate; a thin film electrode layer over the substrate; an inorganic insulation layer formed on the thin film electrode layer; an organic insulation layer formed on the inorganic insulation layer; and a lead-out electrode that electrically connects to the thin film electrode layer. The inorganic insulation layer has a through-hole formed therein, so as to expose a portion of the thin film electrode layer. The organic insulation layer has a through-hole formed therein, so as to expose the through-hole in the inorganic insulation layer. The lead-out electrode is formed in the through-hole in the inorganic insulation layer and the through-hole in the organic insulation layer. A shape of a borderline defining the through-hole at a top surface of the organic insulation layer in a plan view has chamfered corners. | 03-03-2016 |
20160064148 | VARIABLE CAPACITANCE DEVICE AND ANTENNA DEVICE - A variable capacitance device includes: a supporting substrate having a plurality of variable capacitance elements formed thereon, the plurality of variable capacitance elements being connected in series, wherein each of the plurality of variable capacitance elements has a separate lower electrode, or at least some of the plurality of variable capacitance elements share a lower electrode, thereby forming a plural set of the lower electrodes that serves as the lower electrodes of the respective variable capacitance elements, wherein the variable capacitance device further includes an insulating moisture-resistant film and a conductive adhesive film, and wherein the conductive adhesive film and the insulating moisture-resistant film have a gap in a plan view between at least some of regions where the plural set of the lower electrodes are respectively formed so as to avoid electrical leakage between said at least some of regions through the conductive adhesive film. | 03-03-2016 |
20160049919 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes: a support substrate; a piezoelectric substrate that is jointed on the support substrate; a plurality of acoustic wave elements that are provided on the piezoelectric substrate; and an interconnection line that is provided on the piezoelectric substrate and couples the plurality of acoustic wave elements, wherein: the piezoelectric substrate of a first area, on which the plurality of acoustic wave elements are provided, is remained; the piezoelectric substrate of a second area, on which the interconnection line is provided, is remained; the piezoelectric substrate of a third area is for cutting the support substrate; and the piezoelectric substrates of a fourth area is other than the first area, the second area and the third area, the fourth area having a fifth area in which at least a part of the piezoelectric substrate is removed. | 02-18-2016 |
20160049730 | VARIABLE CAPACITANCE DEVICE AND ANTENNA DEVICE - The variable capacitance device includes one or more of directional elements inserted between the third and fourth terminals that allow current to pass only in prescribed directions, such that a diagram formed of current paths from the third terminal to the fourth terminal for the plurality of third-terminal side resistors and the plurality of fourth-terminal side resistors when the third terminal is biased higher than the fourth terminal is line-symmetric to a diagram formed of current paths from the fourth terminal to the third terminal for the plurality of third-terminal side resistors and the plurality of fourth-terminal side resistors when the fourth terminal is biased higher than the third terminal, with respect to the serial chain of variable capacitance elements between the first and second terminals. | 02-18-2016 |
20160036447 | RECONFIGURABLE LOGIC DEVICE - [Problem] To be able to provide a reconfigurable logic device having a small area and enhanced reprogramming characteristics. | 02-04-2016 |
20160028371 | FILTER AND DUPLEXER - A filter includes: piezoelectric thin film resonators, each including a substrate, a piezoelectric film located on the substrate, a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film, and an insertion film inserted in the piezoelectric film, located in at least a part of an outer peripheral region within a resonance region, and not located in a center region of the resonance region, the resonance region being a region where the lower electrode and the upper electrode face each other across the piezoelectric film, wherein at least two piezoelectric thin film resonators out of the piezoelectric thin film resonators have different widths of the insertion films within the resonance regions. | 01-28-2016 |
20160006408 | MODULE - A module includes: a first duplexer including a common terminal coupled to a first terminal of a diplexer, the diplexer including an antenna terminal coupled to an antenna, the first terminal, and a second terminal; and a second duplexer including a common terminal coupled to the second terminal of the diplexer and having a passband different from a passband of the first duplexer, wherein a frequency at which a reactance component of an impedance is approximately zero and the impedance is less than a reference impedance is not located in a passband of the first duplexer, the impedance being an impedance when the second duplexer is viewed from a node at which the antenna terminal is divided into the first terminal and the second terminal in the diplexer. | 01-07-2016 |
20150381142 | FILTER, DUPLEXER AND MODULE - A filter includes: one or more series resonators connected in series between an input terminal and an output terminal; one or more parallel resonators connected in parallel between the input terminal and the output terminal; a first inductor having one end connected to at least one of the input terminal and the output terminal; a second inductor having one end connected to a terminal near a ground of at least one of the parallel resonators; and a third inductor connected between a first node and the ground, the first node connecting the other end of the first inductor and the other end of the second inductor. | 12-31-2015 |
20150341016 | FILTER AND DUPLEXER - A filter includes: one or more series resonators that are connected in series between an input terminal and an output terminal; one or more parallel resonators that are connected in parallel between the input terminal and the output terminal; and a laterally coupled resonator that is connected in parallel with at least one of the one or more series resonators. | 11-26-2015 |
20150340587 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes: an IDT provided on a piezoelectric substrate; and gratings provided on both sides of the IDT, wherein: a slowness surface of an acoustic wave has a concave shape; a duty ratio of electrode fingers of the gratings is larger than that of the electrode fingers of the IDT, or a thickness of the electrode fingers of the gratings is larger than that of the electrode fingers of the IDT, or a thickness of an added film provided on the electrode fingers of the gratings is larger than that of an added film provided on the electrode fingers of the IDT; a pitch of the electrode fingers of the gratings is smaller than that of the electrode fingers of the IDT; and a resonant frequency of the gratings is substantially the same as that of the IDT. | 11-26-2015 |
20150325775 | ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an acoustic wave device includes: forming reforming regions in a substrate along a first direction and a second direction intersecting the first direction by irradiating the substrate with a laser beam under different conditions in the first direction and the second direction, the substrate including a piezoelectric substrate on which an IDT (InterDigital Transducer) is formed, and linear expansion coefficients of the piezoelectric substrate being different in the first direction and the second direction; and cutting the substrate in the first direction and the second direction at the reforming regions. | 11-12-2015 |
20150295697 | MULTIPLEXER - A multiplexer includes: a first chip that has a first filter and a resonator, the first filter being connected between a common terminal and a first terminal, a first end of the resonator being connected to the common terminal not via the first filter; and a second chip that has a second filter, the second filter being connected between a second end of the resonator and a second terminal and having a pass band lower than that of the first filter, a resonance frequency of the resonator being higher than the pass band of the second filter. | 10-15-2015 |
20150282328 | COMMUNICATION MODULE - A circuit substrate having a built-in component includes a core layer that is a conductive layer in which a penetrating hole is formed. A component is disposed in this penetrating hole. A signal wiring line that transmits high frequency signals is formed in a conductive layer facing the core layer on an area projected in the thickness direction of the penetrating hole. The component is provided with a ground conductor functioning as ground that is formed on at least a portion of the area projected in the thickness direction of the signal wiring line. | 10-01-2015 |
20150280717 | RECONFIGURABLE SEMICONDUCTOR DEVICE - A reconfigurable semiconductor device includes a plurality of logic units connected to each other via address lines or data lines, each of the logic units including: a plurality of address lines; a plurality of data lines; a first address decoder that decodes addresses inputted from some of the address lines; a second address decoder that decodes addresses inputted from the other of the address lines; a first memory cell unit having a plurality of memory cells and selecting, among said plurality of memory cells, a predetermined number of memory cells in accordance with the address decoded by the first address decoder; and a second memory cell unit having a plurality of memory cells and selecting, among said plurality of memory cells, a predetermined number of memory cells in accordance with the address decoded by the second address decoder. | 10-01-2015 |
20150280689 | SURFACE ACOUSTIC WAVE DEVICE AND FILTER - A surface acoustic wave device includes: comb electrodes that are provided on a piezoelectric substrate, respectively has a plurality of electrode fingers, a plurality of dummy electrode fingers and a bus bar, edges of the electrode fingers of one of the comb electrodes facing the dummy electrode fingers of the other; and an added film that is provided at least under the bus bar of the comb electrodes and under the electrode fingers and the dummy electrode fingers in a first region and is not provided in a crossing region where the electrode fingers of the one of the comb electrodes and the electrode fingers of the other cross each other, the first region being a region between front edges of the dummy electrodes and edges of the dummy electrodes connected to the bus bar and extending in an alignment direction of the electrode fingers. | 10-01-2015 |
20150256145 | ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An acoustic wave device includes: a piezoelectric substrate; an interdigital electrode that is provided on the piezoelectric substrate and made of a laminated film, an electric resistivity of a material of an uppermost layer in the laminated film being larger than that of a material of a just-under layer located one layer lower than the uppermost layer; and a pad electrode that is provided on the piezoelectric substrate and electrically connected to the interdigital electrode, and has a same film structure as a film structure from a layer on the piezoelectric substrate to the just-under layer in the laminated film of the interdigital electrode, an upper surface of a layer corresponding to the just-under layer being exposed. | 09-10-2015 |
20150244169 | CONVERTER AND PHOTOVOLTAIC GENERATION SYSTEMS WITH CONVERTER - A converter for use in a distributed power system for stepping up or down a voltage of a power source connected thereto includes a step up/down circuit that receives the voltage, steps up or steps down the voltage from the power source, and then outputs the stepped up/down voltage; and a control circuit that detects the voltage from the power source and transmits a control signal for stepping up or stepping down the voltage to the step up/down circuit. The control circuit transmits an identification signal that identifies the converter and is configured to receive an identification signal from another converter when the other converter is connected to the converter. | 08-27-2015 |
20150236393 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer across an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area, and the first signal line is formed at a smaller line width in the intersection area than in the non-intersection area. | 08-20-2015 |
20150207490 | PIEZOELECTRIC THIN FILM RESONATOR, FILTER AND DUPLEXER - A piezoelectric thin film resonator includes: a substrate; a piezoelectric film provided on the substrate; a lower electrode and an upper electrode that are opposed to each other to put at least a part of the piezoelectric film therebetween; and an insertion film that is inserted into the piezoelectric film in a resonance region where at least the part of the piezoelectric film is put between the lower electrode and the upper electrode, at least a part of the insertion film corresponding to an outer circumference region in the resonance region being thicker than a part of the insertion film corresponding to a central region in the resonance region. | 07-23-2015 |
20150188507 | ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an acoustic wave device includes: forming an altered domain in a supporting substrate by irradiating the supporting substrate with a laser light, a piezoelectric substrate being joined to an upper surface of the supporting substrate; forming a groove on an upper surface of the piezoelectric substrate so as to overlap with the altered domain; and cutting the supporting substrate at the groove. | 07-02-2015 |
20150180451 | SURFACE ACOUSTIC WAVE DEVICE AND FILTER - A surface acoustic wave device includes: a pair of comb-type electrodes that are provided on a piezoelectric substrate and include electrode fingers and dummy electrode fingers, the electrode fingers of one of the pair of comb-type electrodes facing the dummy electrode fingers of the other comb-type electrode; and additional films that are provided to cover gaps between tip ends of the electrode fingers and tip ends of the dummy electrode fingers and to overlap with at least one of first through third groups in which the first and second groups respectively include the electrode fingers and the dummy electrode fingers located at opposite sides of the gaps in a first direction in which the electrode fingers extend, and the third group includes the electrode fingers located at sides of the gaps in a second direction that crosses the first direction. | 06-25-2015 |
20150155851 | ACOUSTIC WAVE ELEMENT - An acoustic wave element includes: a piezoelectric substrate; an IDT (Interdigital Transducer) formed on the piezoelectric substrate; and an end face of the piezoelectric substrate that is formed on at least one end of the IDT in a propagation direction of an acoustic wave; wherein when a wavelength of the acoustic wave which the IDT excites is expressed by “λ” and a metallization ratio of the IDT is expressed by “D”, a distance between an inner end of an electrode finger of the IDT nearest to the end face and the end face is equal to or more than 7λ/16+D×λ/4 and equal to or less than 3λ/4+Dλ/4. | 06-04-2015 |
20150137908 | ACOUSTIC WAVE FILTER AND DUPLEXER - An acoustic wave filter includes series resonators and parallel resonators that have a piezoelectric film on an identical substrate and have a lower electrode and an upper electrode, wherein: one of the series resonators and the parallel resonators have a temperature compensation film on a face of the lower electrode or the upper electrode that is opposite to the piezoelectric film in a resonance region, the compensation film having an elastic constant of a temperature coefficient of which sign is opposite to a sign of a temperature coefficient of an elastic constant of the piezoelectric film; and the other have an added film on the same side as the temperature compensation film on the lower electrode side or the upper electrode side compared to the piezoelectric film in the resonance region in the one of the series resonators and the parallel resonators. | 05-21-2015 |
20150130561 | PIEZOELECTRIC THIN FILM RESONATOR, FILTER AND DUPLEXER - A piezoelectric thin film resonator includes: a substrate; a piezoelectric film provided on the substrate; a lower electrode and an upper electrode that sandwich at least a part of the piezoelectric film and face with each other; and an inserted film that is inserted in the piezoelectric film, is provided on an outer circumference region in a resonance region in which the lower electrode and the upper electrode sandwich the piezoelectric film and face with each other, is not provided in a center region of the resonance region, and has a cutout in the resonance region. | 05-14-2015 |
20150130560 | PIEZOELECTRIC THIN-FILM RESONATOR, FILTER AND DUPLEXER - A piezoelectric thin-film resonator includes, a substrate, a piezoelectric film provided on the substrate, and a lower electrode and an upper electrode that face each other through the piezoelectric film. The piezoelectric film has an air space that is provided in at least part of an outer circumferential part of a resonance region in which the upper and lower electrodes face each other through the piezoelectric film and is not provided in a central part of the resonance region. | 05-14-2015 |
20150130559 | PIEZOELECTRIC THIN FILM RESONATOR, FILTER AND DUPLEXER - A piezoelectric thin film resonator includes: a piezoelectric film provided on a substrate; a lower electrode and an upper electrode sandwiching at least a part of the piezoelectric film and facing with each other; and an inserted film that is inserted in the piezoelectric film, is provided in an outer circumference region of a resonance region and is not provided in a center region of the resonance region, wherein: an angle between an edge face of the lower electrode and a lower face of the lower electrode in the resonance region is an acute angle; and a width of the inserted film in the resonance region on a side for extracting the upper electrode from the resonance region is larger than another width of the inserted film in the resonance region on a side for extracting the lower electrode from the resonance region. | 05-14-2015 |
20150126131 | WIRELESS COMMUNICATION DEVICE AND MEASURING DEVICE THEREFOR - In a wireless communication device, a reactance element is connected in series between an input/output terminal of a wireless communication and an impedance-matching circuit. A measuring reactance element is provided in an external measuring device, and the types and circuit contacts of respective elements are chosen such that when the reactance element and the measuring reactance element are connected in parallel during power measurement, they together form a band-stop filter circuit that blocks signals of a prescribed frequency band outputted from the wireless communication circuit. | 05-07-2015 |
20150123746 | SURFACE ACOUSTIC WAVE DEVICE AND FILTER - A surface acoustic wave device includes: a pair of comb-like electrodes formed on a piezoelectric substrate, each of which includes electrode fingers, dummy electrode fingers and a bus bar to which the electrode fingers and the dummy electrode fingers are connected, the electrode fingers and the dummy electrode fingers of one of the pair of comb-like electrodes facing the dummy electrode fingers and the electrode fingers of the other com-like electrode, respectively; and additional films extending in the form of a strip in a first direction in which the electrode fingers are arranged side by side, each of the additional films covering at least parts of gaps defined by ends of the electrode fingers of one of the pair of comb-like electrodes and ends of the dummy electrode fingers of the other comb-like electrode. | 05-07-2015 |
20150123744 | ELECTRONIC DEVICE AND MODULE - An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections. | 05-07-2015 |
20150119104 | CIRCUIT MODULE - A circuit module includes: an RFIC that has a transceiver circuit for processing high-frequency signals related to mobile phone communication and a reception circuit for processing reception signals related to GPS, which is a satellite positioning system; GPS front end components; and mobile phone front end components. The mobile phone front end components are mounted on one main surface of a circuit substrate, and at least one of the GPS front end components (a second band-pass filter) is embedded in the circuit substrate. | 04-30-2015 |
20150119102 | COMMUNICATION MODULE - A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section. | 04-30-2015 |
20150116179 | CHIP ANTENNA AND COMMUNICATION CIRCUIT SUBSTRATE FOR TRANSMISSION AND RECEPTION - A first radiating electrode of a split ring resonator type is formed on a side face of a substrate of a rectangular cuboid antenna device so as to be at a right angle to a ground electrode surface, a second radiating electrode is provided on a top surface of the substrate, the first radiating electrode and the second radiating electrode are capacitively coupled, and the resonance frequency of the first radiating electrode and second radiating electrode are configured to be approximately in symmetry with the central frequency of the used frequency. | 04-30-2015 |
20150109894 | OPTICAL RECORDING DEVICE AND OPTICAL RECORDING METHOD - An optical recording device for recording to a disk having a guide layer and a plurality of recording layers includes a controller which obtains, by calculation, logical addresses of data areas of all recording layers on the basis of physical addresses of a guide layer and recording layer information. Specifically, in treating the maximum value (last physical address) of physical addresses in the guide layer as PSN_max, recording layer information of recording layer Lx as x (x=0, 1, 2, . . . ), physical addresses corresponding to recording destination positions in the data area of recording layer Lx as PSN, and logical addresses imparted to data units recorded at recording destination positions in the data area of recording layer Lx as LSN, calculation for LSN=(PSN_max*x)+PSN . . . (1) is performed. | 04-23-2015 |
20150103612 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device which is intended to reduce the total number of storage element blocks that constitute a desired logic circuit. The semiconductor device includes N address lines (N is an integer equal to two or more), N data lines, and a plurality of storage sections. Each of the storage sections includes an address decoder for decoding an address supplied via the N address lines to output a word select signal to word lines; and a plurality of storage elements which are connected to the word lines and the data lines, each store data that constitute a truth table, and input or output the data via the data lines in accordance with the word select signal supplied via the word lines. The semiconductor device is adapted such that the N address lines for the storage sections are connected to the respective data lines of other N ones of the storage sections, while the N data lines for the storage sections are connected to the respective address lines of other N ones of the storage sections. | 04-16-2015 |
20150098203 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively. | 04-09-2015 |
20150092526 | MULTI-LAYER OPTICAL RECORDING MEDIUM AND OPTICAL RECORDING DEVICE - A multi-layer recording medium is constituted by guide layer-equipped optical disks having a plurality of recording layers and guide layers are integrated by bonding said disks to one another so as to produce a double-sided disk, both sides of which may be used for recording. With regards to the lead-in areas for the guide layers of the guide layer-equipped optical disks for both sides, single-sided disks and double-sided disks are identified, and face-management information for identifying the side surfaces in the case of a double-sided disk is recorded in advance in said lead-in areas using wobbles or the like. As a result, the likelihood of the occurrence of defective products caused by the inability to read the face information can be reduced. | 04-02-2015 |
20150084716 | DUPLEXER - A duplexer includes a reception filter that is connected between a reception terminal and an antenna terminal and includes one or a plurality of series resonators that are acoustic wave resonators, and a transmission filter that is connected between a transmission terminal and the antenna terminal and includes one or a plurality of acoustic wave resonators, a resonance frequency of a first series resonator that is one of the one or the plurality of series resonators and is closest to the antenna terminal in the reception filter being higher than an upper limit frequency of a reception band of the reception filter. | 03-26-2015 |
20150077194 | ELECTRONIC CIRCUIT - An electronic circuit includes: a switch that includes ports, and selects a port to be connected to an antenna from among the ports; a first filter connected between a first port and a first terminal, and having a pass band which overlaps with a transmission band of a first band; a second filter connected between a second port and a second terminal, and having a pass band which overlaps with a transmission band of a second band; a third filter connected between a third port and a third terminal, and having a pass band which overlaps with reception bands of the first and the second bands; wherein when a signal in the first band is transmitted and received, the switch selects the first and the third ports, and when a signal in the second band is transmitted and received, the switch selects the second and the third ports. | 03-19-2015 |
20150070862 | SUBSTRATE WITH BUILT-IN COMPONENT - There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction. | 03-12-2015 |
20150070851 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern. | 03-12-2015 |
20150070849 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section. | 03-12-2015 |
20150070817 | MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multi-layer ceramic capacitor has a structure where the dispersion, nd, of average grain size of the dielectric grains constituting the dielectric layer (a value (D90/D10) obtained by dividing D90 which is a grain size including 90% cumulative abundance of grains by D10 which is a grain size including 10% cumulative abundance of grains) is smaller than 4. | 03-12-2015 |
20150068795 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND CORE BASE-MATERIAL FOR SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with built-in electronic component includes an electronic component, a first wiring layer, a second wiring layer, a via, and a core base-material. The first wiring layer has a first wiring portion. The second wiring layer has a second wiring portion. The via is configured to electrically connect the first wiring portion and the second wiring portion. The core base-material has a metal layer, at least one first storage portion, and a second storage portion, the metal layer being disposed between the first wiring layer and the second wiring layer, the at least one first storage portion being formed in the metal layer, the at least one first storage portion storing the electronic component, the second storage portion being formed on an outside of the first storage portion integrally with the first storage portion, the second storage portion storing the via. | 03-12-2015 |
20150062835 | CIRCUIT MODULE - A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion. | 03-05-2015 |
20150049439 | CIRCUIT MODULE - A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield. | 02-19-2015 |
20150043189 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a wiring substrate having a mount surface and a conductor pattern, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, an outermost layer of the conductor pattern including Au or Ag; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer formed along the boundary, the insulating sealing layer having a trench with a depth such that at least a part of the outermost layer of the conductor pattern is exposed, the insulating sealing layer covering the electronic components; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being formed at the trench, the second shield portion being electrically connected to the conductor pattern. | 02-12-2015 |
20150043172 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section. | 02-12-2015 |
20150043171 | CIRCUIT MODULE - There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section. | 02-12-2015 |
20150043170 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench. | 02-12-2015 |
20150042377 | RECONFIGURABLE SEMICONDUCTOR DEVICE - A semiconductor device capable of reconfiguration, including: a plurality of logic units which configure an array and are connected to each other, wherein each logic unit includes a pair of a first and a second memory cell units, each of the first and the second memory cell units operates as a logic element when truth value table data is written in, which is configured so that a logic calculation of an input value specified by a plurality of addresses is output to a data line, and/or operates as a connection element when truth value table data is written in, which is configured so that an input value specified by a certain address is output to a data line to be connected to an address of another memory cell unit, a latter stage of the first memory cell unit includes a sequential circuit which synchronizes with a clock, and the logic units include, for each pair of the first and the second memory cell units, a selection unit which selectively outputs an address to the first or the second memory cell unit in accordance with an operation switch signal. | 02-12-2015 |
20150042348 | CAPACITOR POWER SUPPLY, VOLTAGE MONITORING DEVICE, METHOD OF MONITORING VOLTAGE, AND METHOD OF MANUFACTURING CAPACITOR POWER SUPPLY - In a calibration process, a capacitor unit is removed from end terminals, or namely, respective capacitors are not connected to terminals. A prescribed voltage (a known voltage) is applied between these end terminals. Among bypass switches of a bypass circuit, the bypass switches connected to one terminal or two or more consecutive terminal pairs from the positive end terminal side are ON. Terminal voltages other than the negative end terminal are obtained and stored as calibration information. | 02-12-2015 |
20150036304 | ELECTRONIC DEVICE - An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips. | 02-05-2015 |
20150028963 | ELECTRONIC CIRCUIT - An electronic circuit includes: a switch including ports and selecting a port to be connected to an antenna from the ports; a first filter connected between a first port out of the ports and a first terminal; a second filter connected between a second port out of the ports and a second terminal and having a frequency band different from a frequency band of the first filter; and an impedance matching unit of which a first end is coupled to a third port out of the ports. | 01-29-2015 |
20150022257 | SWITCHING DEVICE AND MODULE - A switching device includes: a switch that selects and connects one of at least three terminals including a first terminal, a second terminal, and a third terminal to a common terminal; and a compensating circuit that shifts a phase of at least one of a first signal transmitted through the second terminal and a second signal transmitted through the third terminal so that the first signal and the second signal compensate each other and unifies and outputs the first signal and the second signal to a fourth terminal as a third signal, or that branches a third signal input to the fourth terminal into the first signal and the second signal. | 01-22-2015 |
20150022232 | RECONFIGURABLE SEMICONDUCTOR DEVICE - A semiconductor device capable of reconfiguration, including: a plurality of logic units which configure an array and are connected to each other, wherein each logic unit includes a pair of a first and a second memory cell units, each of the first and the second memory cell units operates as a logic element when truth value table data is written in, which is configured so that a logic calculation of an input value specified by a plurality of addresses is output to a data line, and/or operates as a connection element when truth value table data is written in, which is configured so that an input value specified by a certain address is output to a data line to be connected to an address of another memory cell unit, a latter stage of the first memory cell unit includes a sequential circuit which synchronizes with a clock, and the logic units include, for each pair of the first and the second memory cell units, a selection unit which selectively outputs an address to the first or the second memory cell unit in accordance with an operation switch signal. | 01-22-2015 |
20150021290 | METHOD FOR FABRICATING ACOUSTIC WAVE DEVICE - An acoustic wave device includes a piezoelectric substrate, interdigitated electrodes formed on the piezoelectric substrate, and an insulation film that is formed on a surface of the interdigitated electrodes by atomic layer deposition and includes aluminum oxide. | 01-22-2015 |
20150016066 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a wiring substrate, an electronic component, a sealing layer, and a conductive shield. The wiring substrate has a mount surface. The electronic component is mounted on the mount surface. The sealing layer is formed of an insulating material, covers the electronic component, and has a first surface and a second surface, the first surface being opposite to the mount surface and having a first sealing area and a second sealing area, the second sealing area projecting from the first sealing area to an opposite side of the mount surface, the second surface being connected to the mount surface and the first surface. The conductive shield covers at least the second surface and the first sealing area of the first surface. | 01-15-2015 |
20150010694 | METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY - The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching. | 01-08-2015 |
20140368971 | ELECTROCHEMICAL DEVICE - An electrochemical device has a lid, case, electric storage element, electrolyte, and conductive bonding material layer. The case has a via hole and forms a solution chamber between itself and the lid. The electric storage element is accommodated in the solution chamber. The electrolyte is accommodated in the solution chamber. The wiring has a via hole part provided in the via hole and connects the interior and exterior of the solution chamber. The conductive bonding material layer fixes the electric storage element onto the case while electrically connecting the electric storage element and via hole part, where the conductive bonding material layer has a contact area that contacts the case and non-contact area that does not contact the case and the non-contact area is formed in a manner surrounding the via hole. | 12-18-2014 |
20140368299 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes: a chip; an acoustic wave element formed on a principal surface of the chip; a first pad formed on the principal surface of the chip and electrically connected to the acoustic wave element; a substrate having a principal surface facing the principal surface of the chip; a second pad formed on the principal surface of the substrate; a first bump formed between the first pad and the second pad and electrically connecting the first pad and the second pad; and a second bump formed between the chip and the substrate and making direct contact with the substrate. | 12-18-2014 |
20140368296 | ACOUSTIC WAVE DEVICE - An acoustic wave filter includes a piezoelectric substrate, an insulating pattern that has higher thermal conductivity than the piezoelectric substrate formed on the piezoelectric substrate, at least two pads formed on the piezoelectric substrate or the insulating pattern, at least one pad formed on the insulating pattern, at least one acoustic resonator formed on the insulating pattern, and at least one acoustic resonator directly formed on the piezoelectric substrate. | 12-18-2014 |
20140368090 | PIEZOELECTRIC DEVICE AND PIEZOELECTRIC CERAMIC COMPOSITION - A piezoelectric device is provided with: a piezoelectric ceramic layer that is obtained by firing a piezoelectric ceramic composition which contains a perovskite composition and an Ag component; and a conductor layer that sandwiches the piezoelectric ceramic layer, wherein Ag is segregated in voids in a sintered body of the perovskite composition in the piezoelectric ceramic layer. The piezoelectric ceramic composition preferably contains a perovskite composition which is represented by (Pba.Rex){Zr | 12-18-2014 |
20140364070 | COMMUNICATION DEVICE - Electrodes are formed of a nonmagnetic metal in high-frequency electronic components that conduct high frequency electric current having a frequency included in any of a first frequency band for transmitting and a third frequency band for receiving, both assigned to a first transmitting/receiving unit for data communication, and a second frequency band for transmitting and a fourth frequency band for receiving, both assigned to a second transmitting/receiving unit for telephone communication. The high-frequency electronic components also restrict the frequency of the conducted electric current. | 12-11-2014 |
20140361850 | RESONATOR, FILTER, AND DUPLEXER - A resonator includes: a first comb-shaped electrode including a first bus bar, first electrode fingers coupled to the first bus bar and extending in an extension direction, and first dummy electrode fingers coupled to the first bus bar; and a second comb-shaped electrode including a second bus bar, second electrode fingers coupled to the second bus bar, extending in the extension direction, and facing the first dummy electrode fingers through first gaps, and second dummy electrode fingers coupled to the second bus bar and facing the first electrode fingers through second gaps, wherein 0.5λ≦ΔD where ΔD represents a distance in the extension direction between at least two gaps that are at least adjoining two of the first gaps or/and at least adjoining two of the second gaps, and λ represents pitches of the first electrode finger and the second electrode finger. | 12-11-2014 |
20140361664 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes: a piezoelectric film located on a substrate; a lower electrode and an upper electrode facing each other across the piezoelectric film; a temperature compensation film located on a surface, which is opposite to the piezoelectric film, of at least one of the lower electrode and the upper electrode and having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric film; and an additional film located on a surface of the temperature compensation film opposite to the piezoelectric film and having an acoustic impedance greater than an acoustic impedance of the temperature compensation film. | 12-11-2014 |
20140354374 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes: a first chip that includes a first substrate, and a first filter formed on a first surface of the first substrate; and a second chip that includes a second substrate, and a second filter formed on a second surface of the second substrate, the second surface being located in a plane different from the first surface. | 12-04-2014 |
20140354114 | ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME - An acoustic wave device includes: a support substrate; a piezoelectric substrate; and a cap substrate, wherein the cap substrate includes a first region located along an outer peripheral portion of the cap substrate, a second region located along an inside of the first region and having a thickness less than a thickness of the first region, and a third region located inside the second region and having a thickness less than a thickness of the second region, and a surface of the first region is bonded to the surface of the outer peripheral portion of the support substrate, a surface of the second region is bonded to a surface of an outer peripheral portion of the piezoelectric substrate, and a surface of the third region is located away from a surface of the piezoelectric substrate to form a space for the excitation electrode to vibrate. | 12-04-2014 |
20140349596 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 11-27-2014 |
20140347789 | ELECTRODE FOR ELECTROCHEMICAL DEVICE, ELECTROCHEMICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRODE FOR ELECTROCHEMICAL DEVICE - An electrode for an electrochemical device includes a current collector and an electrode layer. The current collector has a main face and a side face. The side face has a concave-convex shape whose convex part is constituted by a projection extending along the main face. The projection is formed along a periphery of the electrode layer, forming a support portion. The electrode layer contains active material and is formed on and in contact with the main face including a surface formed by the support portion. The electrode is capable of mitigating the concentration of current at the edges of the electrode layer. | 11-27-2014 |
20140347788 | ELECTRODE FOR ELECTROCHEMICAL DEVICE, ELECTROCHEMICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRODE FOR ELECTROCHEMICAL DEVICE - An electrode for an electrochemical device includes a current collector, electrode layer, and active material layer. The electrode layer is formed on the current collector and contains an active material. The active material layer is formed in an area on the current collector where the electrode layer is not formed, and contains an active material. The electrode is capable of reducing the leak current while improving the device reliability. | 11-27-2014 |
20140347145 | HIGH FREQUENCY CIRCUIT MODULE - The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC. | 11-27-2014 |
20140341090 | FILTER CIRCUIT AND MODULE - A filter circuit includes: a first transmission filter connected between a first antenna terminal and a first transmission terminal; a second transmission filter connected between the first antenna terminal and a second transmission terminal; a first reception filter connected between a second antenna terminal and a first reception terminal, the second antenna terminal being connected to an antenna different from an antenna to which the first antenna terminal is connected; and a second reception filter connected between the second antenna terminal and a second reception terminal. | 11-20-2014 |
20140340168 | FILTER CIRCUIT AND MODULE - A filter circuit includes: a first band-pass filter, a second band-pass filter, a third band-pass filter and a fourth band-pass filter each having input and output terminals; a first terminal to which one of input and output terminals of first band-pass filter and one of input and output terminals of second band-pass filter are connected; a second terminal to which one of input and output terminals of third band-pass filter and one of input and output terminals of fourth band-pass filter are connected; a third terminal to which another one of input and output terminals of first band-pass filter and another one of input and output terminals of fourth band-pass filter are connected; and a fourth terminal to which another one of input and output terminals of second band-pass filter and another one of input and output terminals of third band-pass filter are connected. | 11-20-2014 |
20140339957 | ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME - An acoustic wave device includes: a substrate; a pad formed on the substrate; a cap formed of an inorganic insulating material and located on the substrate, the cap including a cavity located in a surface of the cap at a substrate side and a penetration hole formed in a location overlapping with the pad; a terminal filling the penetration hole, coupled to the pad on the substrate, and formed of solder; and a functional element formed on an upper surface of the substrate and in the cavity, the functional element exciting an acoustic wave. | 11-20-2014 |
20140339695 | ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME - An electronic component includes: a substrate formed of ceramic and including one or more pads on an upper surface thereof; a component flip-chip mounted on the upper surface of the substrate with one or more bumps bonded to the one or more pads; and an additional film located on a lower surface of the substrate and overlapping with at least a part of a smaller one of the pad and the bump in each of one or more pad/bump pairs, the one or more pad/bump pairs being composed of the one or more pads and the one or more bumps bonded to each other. | 11-20-2014 |
20140319968 | PIEZOELECTRIC SOUND-GENERATING BODY AND ELECTRONIC DEVICE USING THE SAME - A piezoelectric drive element includes piezoelectric layers, electrode layers between the piezoelectric layers, and electrode layers as the surfaces of the laminated layers. The piezoelectric layers are arranged on the upper side and on the lower side with reference to the center in the thickness direction, and are polarized in opposite directions. The thicknesses of piezoelectric layers at the center which have the least displacement are the thickest. The thicknesses of the piezoelectric layers above and under the thickest piezoelectric layers decrease gradually in an outward direction. A piezoelectric sound-generating body is constructed by affixing the piezoelectric driving element to a support plate and supporting the piezoelectric driving element with a frame. | 10-30-2014 |
20140308906 | HIGH FREQUENCY CIRCUIT MODULE - A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components. | 10-16-2014 |
20140307402 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface. | 10-16-2014 |
20140299358 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal linein a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area. | 10-09-2014 |
20140293550 | CIRCUIT MODULE AND PRODUCTION METHOD THEREFOR - A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion. | 10-02-2014 |
20140292470 | LAMINATED INDUCTOR - A laminated inductor includes: a laminate having an insulating part constituted by non-magnetic layers, as well as a coil part constituted by conductors positioned between the non-magnetic layers; and external electrodes that are electrically connected to the ends of the coil part and positioned on the exterior surfaces of the laminate; wherein the external electrodes each have a first electrode layer whose primary constituent is Ag, as well as a second electrode layer whose primary constituent is Cu and which is positioned on the outer side of the first electrode layer and has a thickness of 4 μm or more, and the total thickness of the first electrode layer and second electrode layer is 5 μm or more and preferably 10 μm or less. | 10-02-2014 |
20140292468 | LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME - A laminated electronic component whose internal electrode has sufficient cross-section area to achieve lower resistance, while also achieving a narrower pitch to accommodate more windings, is manufactured by forming a resist film on a conductive base plate; forming an opening of specified pattern in the resist film by photolithography; filling a conductor in the opening, by plating, to a level lower than the height of the resist film to form a conductor pattern; removing the resist film; transferring the conductor pattern from the base plate onto an insulation sheet; and laminating pattern-transferred insulation sheets obtained as above and then heating to obtain insulator layers from the insulation sheet, while obtaining internal electrodes from the conductor patterns. | 10-02-2014 |
20140291568 | NON-AQUEOUS ELECTROLYTE SOLUTION FOR ELECTRIC DOUBLE-LAYER CAPACITOR - A non-aqueous electrolyte solution for an electric double-layer capacitor includes a non-aqueous solvent in which electrolyte salt is dissolved. The non-aqueous electrolyte solution is characterized in that the non-aqueous solvent is a mixed solvent of chained sulfone and cyclic lactone compound. The non-aqueous electrolyte solution can suppress increase in the resistance value of the electric storage element even in a low-temperature environment below 0° C. and can also be used in a normal-temperature environment. | 10-02-2014 |
20140287962 | MOTOR PROTEIN DEVICE - [Problem] To provide a motor protein device capable of efficiently transporting and detecting a target antibody. | 09-25-2014 |
20140285988 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other. | 09-25-2014 |
20140285950 | MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multi-layer ceramic capacitor is constituted by ceramic dielectric layers alternately laminated with conductive layers, wherein the ceramic dielectric layers are sintered in such a way that core-shell grains having a core-shell structure are mixed with uniform solid-solution grains resulting from uniform progression of the solid solution process. Such multi-layer ceramic capacitor is characterized in that the area ratio of the core-shell grains to all sintered grains constituting the ceramic dielectric layer is 5 to 15% and that the average grain size of all sintered grains including the core-shell grains and uniform solid-solution grains is 0.3 to 0.5 μm. | 09-25-2014 |
20140285947 | LOW-HEIGHT MULTILAYER CERAMIC CAPACITOR - A low-height multilayer ceramic capacitor offering excellent flexure strength meets the condition “t | 09-25-2014 |
20140285213 | COMPONENT-EMBEDDED CIRCUIT SUBSTRATE AND METHOD OF INSPECTING THE SAME - In a component-embedded circuit substrate having a plurality of capacitors embedded therein, the capacitors are connected in parallel, inspection electrodes are formed, and the inspection electrodes connect to respective terminal electrodes of the capacitor through via conductors. At the terminal electrodes of the capacitor, the connection position of the via conductors for connecting the inspection electrodes differs from the connection position of via conductors for connecting respective terminal electrodes of the capacitor. | 09-25-2014 |
20140266545 | COMMON MODE CHOKE COIL - A common mode choke coil exhibiting greater reliability against moisture load includes a nonmagnetic layer made of glass, magnetic layers placed in a manner sandwiching the nonmagnetic layer, and two or more coil conductors embedded in a base material constituted by the nonmagnetic layer and magnetic layers, wherein Mg segregation is present in the nonmagnetic layer and the Mg segregation accounts for 0.5 to 16 percent of the total area as observed on an electron micrograph of a section of the nonmagnetic layer, while the size of Mg segregation is preferably 0.2 to 10 μm. | 09-18-2014 |
20140254063 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes ceramic grains forming a dielectric layer of the multilayer ceramic capacitor, which ceramic grains contain a coarse ceramic grain SPr having a coarse grain size Dcoa that satisfies the condition of Tmin Dcoa Tmax where Tmax is the maximum thickness of the dielectric layer and Tmin is the minimum thickness of the dielectric layer. The multilayer ceramic capacitor is capable of inhibiting deterioration of capacitance and capacity-temperature characteristics even when the internal electrode layer is made thin. | 09-11-2014 |
20140253794 | CAMERA MODULE - A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening. | 09-11-2014 |
20140252522 | CAMERA MODULE - In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion. | 09-11-2014 |
20140211367 | MULTILAYER CERAMIC CAPACITOR - With a multilayer ceramic capacitor whose average grain size of the dielectric grains present at the outermost layer position P | 07-31-2014 |
20140210684 | MODULE - A module includes: a duplexer including an antenna terminal; a first wiring connecting the antenna terminal to an antenna; a second wiring coupled to the antenna terminal without the first wiring; and an inductor coupled to the second wiring. | 07-31-2014 |
20140210570 | PIEZOELECTRIC THIN FILM RESONATOR, FILTER, AND DUPLEXER - A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film; and an insertion film that is inserted into the piezoelectric film, is located in at least a part of an outer periphery region in a resonance region in which the lower electrode and the upper electrode face each other across the piezoelectric film, and is not located in a center region of the resonance region. | 07-31-2014 |
20140210310 | ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME - An acoustic wave device includes: a substrate; a functional element formed on the substrate and including an excitation electrode that excites an acoustic wave; a columnar electrode formed on the substrate and electrically connected to the excitation electrode; a metal frame body formed on the substrate and surrounding the functional element and the columnar electrode; and a ceramic substrate sealing the functional element in combination with the metal frame body, a first metal layer bonded to the columnar electrode and a second metal layer bonded to the metal frame body being formed on a surface of the ceramic substrate. | 07-31-2014 |
20140204549 | CIRCUIT SUBSTRATE - A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate. | 07-24-2014 |
20140203887 | MODULE - A module includes: a diplexer that includes a first terminal, a second terminal, and a common terminal coupled to an antenna; a first switch that is coupled to the first terminal, includes first ports, and selects, from the first ports, and connects one port to the diplexer; a first duplexer that is coupled to at least one of the first ports; a second duplexer that is coupled to the second terminal and has a passband different from a passband of the first duplexer; and a first impedance portion that is coupled to another port of the first ports. | 07-24-2014 |
20140198427 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor whose external electrodes are each provided with a solder non-adhesion film made of material to which solder does not adhere, in a manner continuously covering the entire surface of the end face, and optionally the entire surface of the curved face thereof. The multilayer ceramic capacitor, with certainty, allows for suppression of noise accompanying electrostriction. | 07-17-2014 |
20140197915 | ELECTRONIC COMPONENT - An electronic component includes: a wiring substrate; a passive component that includes a substrate, a coil located on an upper surface of the substrate, and a terminal located on a lower surface of the substrate and electrically connected to the coil, and is mounted on an upper surface of the wiring substrate by using the terminal; and a grounding wiring that is located on the wiring substrate and overlaps with the coil in a thickness direction of the wiring substrate. | 07-17-2014 |
20140191835 | MAGNETIC MATERIAL AND COIL COMPONENT EMPLOYING SAME - A magnetic material is constituted by a grain compact formed by compacting multiple metal grains that in turn are constituted by an Fe—Si-M soft magnetic alloy (where M is a metal element that oxidizes more easily than Fe), wherein individual metal grains have oxide film formed at least partially around them as a result of oxidization of the metal grains; the grain compact is formed primarily via bonding between oxide films formed around adjacent metal grains; and the apparent density of the grain compact 1 is 5.2 g/cm | 07-10-2014 |
20140178718 | ELECTROCHEMICAL DEVICE - An electrochemical device includes a positive electrode, a negative electrode, and an electrolyte solution. The positive electrode is formed of an electrode material including an anion doped conductive polymer. The negative electrode is formed of an electrode material capable of absorbing and releasing a lithium ion. The electrolyte solution includes a lithium ion and an anion, the electrolyte solution being in contact with the positive electrode and the negative electrode. | 06-26-2014 |
20140177135 | ELECTROCHEMICAL DEVICE - An electrochemical device that can ensure long-term reliability is equipped with a solution chamber and an electric storage element. The solution chamber houses electrolytic solution and has a first face and a second face opposing the first face. The electric storage element is positioned in the solution chamber and has a first electrode provided on the first face and a second electrode provided on the first face away from the first electrode. This way, an electrochemical device that can ensure long-term reliability can be provided. | 06-26-2014 |
20140167560 | PIEZOELECTRIC THIN FILM RESONATOR - A piezoelectric thin film resonator includes: a substrate; a piezoelectric film that is located on the substrate and includes a first film made of an aluminum nitride film containing an additive element and second films located on an upper surface and a lower surface of the first film and made of an aluminum nitride film containing the additive element at a concentration lower than that of the first film; and a lower electrode and an upper electrode that are located to sandwich the piezoelectric film. | 06-19-2014 |
20140160627 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes external electrodes having a multi-layer structure including an intermediate conductive resin layer, wherein the intermediate conductive resin layer in the external electrode is made of epoxy resin containing conductive filler, and the intermediate conductive resin layer meets both the condition B/A≦0.47 and condition C/A≧0.39 (A, B and C represent the maximum spectral intensities obtained based on the relationship line of the wave number and spectral intensity of the intermediate conductive resin layer as obtained by the ATR method). The ceramic electronic component minimizes separation that could occur at the interface between such intermediate conductive resin layer and a metal layer. | 06-12-2014 |
20140157590 | WORK INSERTION DEVICE - A work insertion device that can be constituted as a small, low-cost device has a structure where a transfer disk having many storage holes formed through its outer periphery part is placed such that its rotation center line is inclined upward to form a sharp angle α with a vertical line and that some of the many storage holes are positioned in the work storage chamber. The works stored in bulk state in the work storage chamber are directly stored in some of the many storage holes positioned in the work storage chamber by utilizing the intermittent turning of the transfer disk. | 06-12-2014 |
20140153157 | Capacitor - A capacitor includes a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first and second planes; a first external electrode layer disposed on the first plane; a second external electrode layer disposed on the second plane; a first internal electrode having first and second electrode portions, the first and second electrode portions being formed of a first conductive material, and a second conductive material, respectively, the second electrode material connecting the first electrode portion with the first external electrode layer, the second conductive material having a smaller Young's modulus than the first conductive material, the first internal electrode being formed in a part of the plurality of through-holes; and a second internal electrode formed in another part of the plurality of through-holes, the second internal electrode being connected to the second external electrode layer. | 06-05-2014 |
20140152398 | MULTILAYER POWER SPLITTER - A multilayer power splitter includes a laminate contains two transformers, wherein the inductance ratio of the primary side and secondary side of the first transformer is adjusted to 4:1, whereas the inductance ratio of the primary side and secondary side of the second transformer is adjusted to 1:1. An input port is branched into two for inputting to the primary side and secondary side of the first transformer in opposite phases, with one output made from the first output port. The other output from the first transformer is branched into two for inputting to the primary side and secondary side of the second transformer in opposite phases, with one output made from the second output port and the other output made from the third output port. | 06-05-2014 |
20140145815 | LAMINATED INDUCTOR - A laminated inductor includes a component body that provides a mounting surface on one of its faces, and at least a pair of external electrodes are formed on the mounting surface, wherein the component body has a laminate constituted by multiple insulator layers, a spiral coil conductor formed in the laminate, and leader parts that electrically connect the coil conductor and external electrodes; the coil conductor comprises conductor patterns formed in the insulator layers and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns, and also has a coil axis running roughly in parallel with the mounting surface and a turn unit having one or more sides running roughly in parallel with the mounting surface; and the via hole conductors are formed only on the side farthest away from the mounting surface among the one or more sides. | 05-29-2014 |
20140144692 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate obtained by alternately stacking conductor layers and insulator layers. The conductor layers include a core layer having a greater thickness than any of the other conductor layers and located in an inner layer of the multilayer circuit substrate. A first conductor layer facing the core layer through an insulator layer has first signal wires that transmit high frequency signals, and through-holes are formed in the core layer along the first signal wires in a location facing the first signal wires. | 05-29-2014 |
20140139968 | VARIABLE CAPACITY COMPOSITE COMPONENT - A variable capacity composite component has structures connecting four variable capacitors, for example, to signal terminals in series with bias application terminals of opposite polarities facing each other, connecting a power supply terminal to the bias+ sides of the first and second variable capacitors via a first bias resistance, and also to the bias+ sides of the third and fourth variable capacitors via a second bias resistance, connecting a grounding terminal to the bias− side of the first variable capacitor via a third bias resistance, also to the bias− sides of the second and third variable capacitors via a fourth bias resistance, and also to the bias− sides of the fourth variable capacitor via a fifth bias resistance, and setting the value of the first, second, and fourth bias resistances to one-half the value of the third and fifth bias resistances. | 05-22-2014 |
20140139311 | MAGNETIC MATERIAL AND COIL COMPONENT USING SAME - A magnetic material contains multiple metal grains constituted by soft magnetic alloy and oxide film formed on a surface of the metal grains, which soft magnetic alloy includes Fe and a metal element that oxidizes more easily than Fe, wherein the magnetic material forms a grain compact having first bonding parts where adjacent metal grains are contacted and directly bonded together, second bonding parts where adjacent metal grains are bonded together via the oxide film formed around the entire surface of said adjacent metal grains other than the first bonding parts, and voids formed in an area other than the first and second bonding parts and surrounded by the oxide film. | 05-22-2014 |
20140133117 | HIGH FREQUENCY CIRCUIT MODULE - A multilayer circuit substrate has a high frequency switch embedded therein. In the multilayer circuit substrate, a first conductive layer that faces a main surface of the high frequency switch through an insulating layer has circuit patterns formed therein so as to be connected to input/output terminals through via conductors. The first conductive layer has an opening pattern in which a ground conductor is not present in a region that faces the main surface of the high frequency switch and that is outside of the circuit patterns. In a third conductive layer disposed outer side of the first conductive layer with respect to the high frequency switch, a ground conductor is formed at least in a region where the main surface of the high frequency switch is projected in the thickness direction. | 05-15-2014 |
20140133114 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions. | 05-15-2014 |
20140133103 | HIGH FREQUENCY CIRCUIT MODULE - The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC. | 05-15-2014 |
20140132385 | MULTILAYER CHIP INDUCTOR AND PRODUCTION METHOD FOR SAME - A group of magnetic sheets are stacked and connected via through-holes, on each of which magnetic sheets a circling pattern having connection parts at its corners and ends is formed to form a spiral coil pattern. Leader patterns each have a leader part formed at a position not overlapping with the circling parts of the coil pattern and connected to an external terminal electrode, as well as two connection parts that continue to the leader part and are formed at positions corresponding to the connection parts of the circling patterns, together with a cutout formed between the two connection parts. Magnetic sheets with the leader patterns are provided at the top and bottom of the laminate forming the coil pattern. The multilayer chip inductor can suppress decrease in core area caused by displacement due to the stacking | 05-15-2014 |
20140132383 | MAGNETIC MATERIAL AND COIL COMPONENT - An object is to provide a magnetic material and coil component offering improved magnetic permeability and insulation resistance, while also offering improved high-temperature load, moisture resistance, water absorbency, and other reliability characteristics at the same time. A magnetic material that has multiple metal grains constituted by Fe—Si-M soft magnetic alloy (where M is a metal element that oxidizes more easily than Fe), as well as oxide film constituted by an oxide of the soft magnetic alloy and formed on the surface of the metal grains, wherein the magnetic material has bonding parts where adjacent metal grains are bonded together via the oxide film formed on their surface, as well as bonding parts where metal grains are directly bonded together in areas having no oxide film, and resin material is filled in at least some of the voids generating as a result of accumulation of the metal grains. | 05-15-2014 |
20140132365 | HIGH FREQUENCY CIRCUIT MODULE - The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC. | 05-15-2014 |
20140132116 | ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME - An acoustic wave device includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across the piezoelectric film, at least one of the lower electrode and the upper electrode including a first conductive film and a second conductive film formed on the first conductive film; an insulating film sandwiched between the first conductive film and the second conductive film and having a temperature coefficient of an elastic constant opposite in sign to a temperature coefficient of an elastic constant of the piezoelectric film; and a third conductive film formed on edge surfaces of the insulating film and the second conductive film and causing electrical short circuits between the first conductive film and the second conductive film. | 05-15-2014 |
20140126160 | ELECTRONIC CIRCUIT MODULE - There is provided an electronic circuit module that prevents a bonding force between ground wiring and a shield from decreasing and maintains successfully a desirable shield effect. The electronic circuit module includes a core layer also functioning as the ground wiring, each face OS of each first protrusion of the core layer facing to an end face of a shield is adjacent to faces OS of an outer cover made of an insulating synthetic resin facing to the end face of the shield, and the end face of the shield is bonded to both of the each face OS of each first protrusion facing to the end face of the shield and the faces OS of the outer cover facing to the end face of the shield. | 05-08-2014 |
20140126157 | ELECTRONIC CIRCUIT MODULE AND METHOD FOR PRODUCING THE SAME - An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface. | 05-08-2014 |
20140126156 | CIRCUIT MODULE - In a circuit module, a multilayer substrate has a core layer made of a metal, a filter device is stored in a storage portion of the core layer, the filter device and a power amp IC are arranged such that a parallel projection region of the filter device is completely covered by a parallel projection region of the power amp IC, and the power amp IC is connected to the upper surface (one surface in the thickness direction) of the core layer through a plurality of thermal vias provided in the multilayer substrate. | 05-08-2014 |
20140125428 | SWITCHING DEVICE AND MODULE - A switching device includes: a switch that selects and connects one of input-output terminals to a common terminal; and a delay line that is connected in parallel to the switch between two terminals of the input-output terminals and delays a signal by using an acoustic wave. | 05-08-2014 |
20140121877 | MOTOR DRIVE CONTROLLER AND ELECTRIC POWER-ASSISTED VEHICLE - A controller for driving a motor in a motor driven vehicle, provided with: a detection part, a control coefficient computing part, and a control part. The control coefficient computing part identifies, as a first vehicle speed, the speed of the vehicle when the detection part detects a start signal for regeneration control, the control coefficient computing part assigning a prescribed value to a control coefficient that determines a value of a control parameter that controls the motor relative to a target value of the control parameter. The target value is a value of the control parameter at which the motor achieves a desired power generation efficiency, and the control coefficient computing part increases the control coefficient if a current vehicle speed becomes faster than the first vehicle speed, and decreases the control coefficient if the current vehicle speed becomes slower than the first vehicle speed. | 05-01-2014 |
20140118094 | ACOUSTIC WAVE FILTER AND MODULE - An acoustic wave filter includes: multimode filters, each including an IDT, connected in parallel; a ceiling that is commonly located above at least two multimode filters of the multimode filters so as to form a cavity between the IDT and the ceiling, electrically connected to the multimode filters, and formed of a metal; and at least two terminals that are electrically connected to the ceiling and located above the at least two multimode filters. | 05-01-2014 |
20140118093 | ELECTRONIC COMPONENT MODULE - An electronic component module includes: a multi-layered wiring board formed by stacking insulating layers, an inner wiring layer formed between the insulating layers, and a surface wiring layer formed on an outermost insulating layer of the insulating layers; and an acoustic wave device located inside the multi-layered wiring board, wherein the acoustic wave device includes a functional element and a sealing portion, the functional element being located on a substrate and exciting an acoustic wave, and the sealing portion sealing the functional element so as to form an air-space above the functional element, and a terminal portion of the surface wiring layer does not overlap the air-space of the acoustic wave device as viewed from a stacking direction of the multi-layered wiring board, the terminal portion being a region to which a terminal of an electronic component is fixed in the surface wiring layer. | 05-01-2014 |
20140111287 | FILTER, DUPLEXER AND COMMUNICATION MODULE - According to an aspect of the invention, each of a filter, a duplexer and a communication module includes a plurality of series resonators connected to a signal line in series and a plurality of parallel resonators connected to the signal line in parallel. At least two of the plurality of parallel resonators are connected to the signal line between two of the plurality of series resonators in parallel, inductors are respectively connected to the at least two parallel resonators, and the inductors have different inductances from each other. | 04-24-2014 |
20140111286 | DUPLEXER - Provided is a duplexer that can maintain isolation characteristics while being able to independently adjust the input/output ground inductances and the common ground inductance of the double-mode filter. The duplexer includes: a transmitting filter; a receiving filter; a package substrate that includes a first substrate, a die attach layer that is patterned onto the first substrate, a second substrate, and an inner layer located between the first substrate and the second substrate; a double-mode filter that constitutes a portion of the receiving filter; a common ground terminal that makes an input ground and an output ground of the double-mode filter commonly grounded, the common ground terminal constituting a portion of the die attach layer; an input-side ground terminal of the double-mode filter, the input-side ground terminal constituting a portion of the inner layer; and an output-side ground terminal of the double-mode filter, the output-side ground terminal constituting a portion of the inner layer and being formed separately from the input-side ground terminal. | 04-24-2014 |
20140104801 | MULTILAYER SUBSTRATE - A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line. | 04-17-2014 |
20140104755 | ELECTROCHEMICAL CAPACITOR - There is provided an electrochemical capacitor including a lid; a case having a via, and forming a liquid chamber together with the lid; an electric storage element housed in the liquid chamber; an electrolyte housed in the liquid chamber; a wiring having a via part arranged within the via, and connecting an inside to an outside of the liquid chamber; an extraction electrode connected to the via part; an overcoating layer for coating the extraction electrode, and having an opening to expose a partial region of the extraction electrode; and a conductive adhesive layer for fixing the electric storage element to the overcoating layer, and electrically connecting the electric storage element to the extraction electrode through the opening. | 04-17-2014 |
20140104031 | MAGNETIC MATERIAL AND COIL COMPONENT EMPLOYING SAME - A coil component having a magnetic material and a coil formed on a surface of or inside the magnetic material. The magnetic material is constituted by a grain compact formed by compacting multiple metal grains that in turn are constituted by an Fe—Si—M soft magnetic alloy (where M is a metal element that oxidizes more easily than Fe), wherein individual metal grains have oxide film formed at least partially around them; the grain compact is formed primarily via bonding between oxide films formed around adjacent metal grains; and the apparent density of the grain compact 1 is 5.2 g/cm | 04-17-2014 |
20140097929 | WIRE-WOUND INDUCTOR - A small wire-wound inductor has a drum-shaped core member constituted by an assembly of soft magnetic alloy grains, a coil conductive wire wound around the core member, a pair of terminal electrodes connected to the terminals of the coil conductive wire, and an outer sheath member covering the wound coil conductive wire and constituted by a magnetic powder-containing resin having a specified magnetic permeation ratio, wherein the soft magnetic alloy grains are fixedly bonded together via oxidized layers, and the core member contains 2 to 15 percent by weight of chromium (Cr). | 04-10-2014 |
20140092393 | DISPLACEMENT MEASUREMENT APPARATUS AND DISPLACEMENT MEASUREMENT METHOD - There is provided a displacement measurement apparatus including: a light source; a pair of diffraction gratings that light emitted from the light source enters, the pair of diffraction gratings opposing each other while being relatively movable along an optical axis; a first optical sensor that detects interference light obtained by diffracted light emitted from a diffraction grating device of each of the pair of diffraction gratings; a second optical sensor that detects non-interference light emitted from the pair of diffraction gratings; and a correction unit that corrects a signal obtained by the first optical sensor based on a signal obtained by the second optical sensor. | 04-03-2014 |
20140090703 | DYE-SENSITIZED SOLAR CELL - A dye-sensitized solar cell includes four generation cells, wherein their negative electrodes and positive electrodes are facing each other, with an electrolytic solution sealed in between, and being contacted by generation layers. On the other main side of a polyimide layer on which the positive electrodes are formed, wiring layers corresponding to the positive electrodes are provided in positions overlapping with both the corresponding positive electrodes and the positive electrodes adjacent thereto. The wiring layers corresponding to the positive electrodes are connected by through holes and conductor penetrating the polyimide layer. The negative electrodes of the generation cells are connected, on the outer periphery side, with the wiring layers that are connected to the positive electrodes of the adjacent generation cells, except for the wiring layer and negative electrode on which leader terminal parts are formed. | 04-03-2014 |
20140085769 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor has multiple laminated dielectric ceramic layers made of a dielectric ceramic, internal electrodes formed between the dielectric ceramic layers, and external electrodes electrically connected to the internal electrodes, wherein generation of cracks in the dielectric layer due to expansion of the internal electrode is suppressed by causing ceramic grains having a crystal axis ratio c/a higher than that of the ceramic grains constituting the dielectric layer to be present in non-contiguous parts of the internal electrodes between the dielectric ceramic layers, and by harnessing the stress-mitigating effect of domain switching involving these ceramic grains. | 03-27-2014 |
20140085768 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor, whose CR product can be prevented from dropping with certainty even at a thickness of 1.0 μm or less, includes multiple unit capacitors wherein a part constituted by two adjacent internal electrode layers in the laminating direction and one dielectric layer present between the two internal electrode layers is defined as a unit capacitor. The capacitances of the unit capacitors arranged in the laminating direction exhibit a distribution that gradually increases from both ends in the laminating direction toward the inside, while gradually decreasing from the two apexes of increase toward the center in the laminating direction. | 03-27-2014 |
20140084819 | CONTROLLER FOR DRIVING A MOTOR AND ELECTRIC POWER-ASSISTED VEHICLE - A controller for driving a motor has: an input part that receives, from each of two brake sensors, a signal indicating a corresponding brake is in an ON state or a signal indicating that the brake is in an OFF state; a control coefficient computing part that increases a control coefficient relative to a regeneration target value along a first slope when a first signal indicating only one of the brakes is in an ON state is received from the input part, the control coefficient computing part increasing the control coefficient along a second slope when a second signal indicating both brakes are in an ON state is received from the input part, the second slope rising faster than the first slope; and a control part controlling driving of the motor in accordance with the regeneration target value and the control coefficient computed by the control coefficient computing part. | 03-27-2014 |
20140071749 | SEMICONDUCTOR DEVICE HAVING A NON-VOLATILE MEMORY BUILT-IN - A semiconductor device of this invention has an array of non-volatile memory cells, may operate immediately after power activation to write data on and read out the data without reading from an external portion. Further, this invention is free from the lithographic process of the phase-change layer on the manufacturing process. | 03-13-2014 |
20140063690 | CAPACITOR - A capacitor includes a dielectric layer having a first plane, a second plane opposite to the first plane, and first and second through-holes communicated with the first plane and the second plane; a first external conductor layer disposed on the first plane; a second external conductor layer disposed on the second plane; a first internal electrode formed in the first through-hole, connected to the first external electrode layer, disposed in the second hole diameter part at a tip and separated from the second external electrode layer; and a second internal electrode formed in the second through-hole, connected to the second external electrode layer, and separated from the first external electrode layer. | 03-06-2014 |
20140063687 | ELECTRONIC COMPONENT WITH TERMINAL STRIPS - An electronic component with terminal strips joined to end faces of external electrodes via a solder is characterized in that two plate-like supports of each terminal strip are formed by bending two plate-like parts projecting outward in a line-symmetrical manner from both side edges of a plate-like leg in the width direction such that at least tips of the thickness surfaces on the electronic component sides of the two plate-like parts are positioned below an external electrode of the electronic component, and the electronic component is supported from below by the tips of the thickness surfaces on the electronic component sides of the four plate-like supports. Slipping of the electronic component from both terminal strips due to melting of the solder can be suppressed in a reliable manner. | 03-06-2014 |
20140057158 | ELECTROCHEMICAL DEVICE - An electrochemical device includes a container, a storage element, and a structure. The container includes a container main body including a first inner surface, and a lid including a second inner surface that is opposed to the first inner surface, the lid being joined to the container main body. The storage element includes a first electrode layer that is bonded to the first inner surface, a second electrode layer that is bonded to the second inner surface, and a separator that is provided between the first electrode layer and the second electrode layer, the storage element being sandwiched between the first inner surface and the second inner surface. The structure is provided to at least one of the first inner surface and the second inner surface, at least partially embedded in an inside of at least one of the first electrode layer and the second electrode layer, and made of a cured conductive adhesive. | 02-27-2014 |
20140056183 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency circuit module that has high mounting density. In a high-frequency circuit module, an RFIC that performs transmission and reception processes for high-frequency signals, a power amplifier IC that amplifies a transmission signal from the RFIC, and a duplexer that separates a transmission signal outputted from the power amplifier IC to an antenna and a reception signal that is inputted from the antenna to the RFIC are formed on the top surface thereof. The duplexer is disposed between the RFIC and the power amplifier IC. | 02-27-2014 |
20140055956 | High-Frequency Circuit Module - A high-frequency circuit module having a high mounting density is provided. The high-frequency circuit module includes an RFIC configured to transmit and receive a high-frequency signal, a power amplifier IC configured to amplify a transmission signal output from the RFIC, and duplexers configured to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal from the antenna and input to the RFIC from each other, wherein at least one of the RFIC and power amplifier IC is embedded in the circuit board, and the duplexers are disposed between the RFIC and the power amplifier IC. | 02-27-2014 |
20140055224 | LAMINATED INDUCTOR - A laminated inductor having an internal conductor forming region, as well as a top cover region and bottom cover region formed in a manner sandwiching the internal conductor forming region between top and bottom; wherein the internal conductor forming region has a magnetic part formed with soft magnetic alloy grains, as well as helical internal conductor embedded in the magnetic part; and at least one of the top cover region and bottom cover region (or preferably both) is/are formed with soft magnetic alloy grains whose average grain size is greater than that of grains in the internal conductor forming region including the soft magnetic alloy grains constituting the magnetic part. | 02-27-2014 |
20140055009 | PIEZOELECTRIC CERAMIC AND PIEZOELECTRIC ELEMENT - A piezoelectric ceramic is constituted by a polycrystal whose main phase is an alkali-containing niobate perovskite structure, where both elemental nickel and elemental manganese are present at the grain boundary of the polycrystal. The piezoelectric ceramic is such that drop in piezoelectric characteristics due to application of high electric field is suppressed. | 02-27-2014 |
20140051371 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051370 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051369 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051368 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051367 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140049928 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with a built-in electronic component that can avoid as much as possible the occurrence of malfunctions in the electronic component due to moisture entering, even when an electronic component, provided with a structure in which a terminal pad is present where a hole in the sealing part provided on the main body of a component is located, is built into the substrate. A SAW filter | 02-20-2014 |
20140049348 | MAGNETIC MATERIAL AND COIL COMPONENT USING SAME - A magnetic material suitable for a coil component has multiple metal grains constituted by Fe—Si-M soft magnetic alloy (where M is a metal element that oxidizes more easily than Fe) and oxide film formed on the surface of the metal grains, wherein such magnetic material includes a grain compact having bonding parts where adjacent metal grains are bonded together via the oxide film formed on their surface, and bonding parts where metal grains are directly bonded together in areas where oxide film does not exist. The magnetic material is capable of improving both insulation resistance and magnetic permeability. | 02-20-2014 |
20140049340 | ACOUSTIC WAVE FILTER, DUPLEXER, AND MODULE - An acoustic wave filter includes: at least a parallel resonator, wherein at least one of the parallel resonator includes a piezoelectric substance, an IDT located on the piezoelectric substance, and reflectors located on the piezoelectric substance so as to sandwich the IDT, and a distance between a first electrode finger that is an electrode finger closest to the reflector among electrode fingers of the IDT and a second electrode finger that is an electrode finger closest to the IDT among electrode fingers of the reflector is less than 0.25(λ | 02-20-2014 |
20140048805 | BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY - [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles. | 02-20-2014 |
20140048321 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with a built-in electronic component that can minimize an occurrence of a deformation such as warping or distortion of the substrate with a built-in electronic component, which is caused by a difference in rigidity between a region of low rigidity and a region of high rigidity that are formed in a core layer thereof. In the substrate with a built-in electronic component, electronic components | 02-20-2014 |
20140044022 | HIGH-FREQUENCY CIRCUIT AND COMMUNICATION DEVICE - A high-frequency circuit includes: first duplexers, each including a first transmit filter having a first transmit band, a first receive filter having a first receive band, and a first common terminal to which first ends of the first transmit filter and the first receive filter are commonly connected; a first switch that selects and connects one of the first common terminals to a first antenna; an LPF or BPF that is connected between the first antenna and the first switch, and passes a signal in the first transmit band and the first receive band; and a second duplexer including: a second transmit filter having a second transmit band, a second receive filter having a second receive band, and a second common terminal that is connected to a second antenna and to which first ends of the second transmit filter and the second receive filter are commonly connected. | 02-13-2014 |
20140039742 | MOTOR DRIVING CONTROL APPARATUS - A motor drive control apparatus for performing motor control that is stable and has a good efficiency includes: a speed processing unit that generates a first value by converting a second value corresponding to a current speed into a duty ratio; a torque processing unit that generates a third value by converting a fourth value corresponding to a target torque into the duty ratio; and a drive unit that controls switching by a switch included in a complementary switching amplifier by an average duty ratio corresponding to a sum of the first value and the third value to drive a motor connected to the complementary switching amplifier. | 02-06-2014 |
20140039741 | MOTOR DRIVING CONTROL APPARATUS - This motor driving control apparatus includes: a smoothing processing unit that executes smoothing processing using values of pedal input torque at plural points to calculate a first smoothed torque value; an insufficiency output unit that obtains a rate of points at which input of the pedal input torque is insufficient among the plural points; an assist torque calculating unit that performs calculation processing of mixing the first torque value calculated by the smoothing processing unit and the pedal input torque in accordance with output of the insufficient output unit to calculate assist torque; and a driving processing unit that performs processing to drive a motor using the assist torque calculated by the assist torque calculating unit. | 02-06-2014 |
20140037945 | BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY - [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles. | 02-06-2014 |
20140036413 | ELECTROCHEMICAL CAPACITOR - An electrochemical capacitor includes a casing, an electrolyte, a storage element, a wiring and an adhesive layer. The casing forms a liquid chamber. The electrolyte is housed in the liquid chamber. The storage element is a storage element in which a positive electrode sheet, a separator sheet and a negative electrode sheet are laminated, being housed in the liquid chamber. A capacitance formed between a positive electrode active material in the positive electrode sheet and the electrolyte is greater than a capacitance formed between a negative electrode active material in the negative electrode sheet and the electrolyte. The wiring is connected to the liquid chamber. The adhesive layer is made of a conductive adhesive made with a synthetic resin including conductive particles. The adhesive layer covers the wiring, causes the positive electrode sheet to adhere to the casing, and electrically connects the wiring with the positive electrode sheet. | 02-06-2014 |
20140036407 | DIELECTRIC CERAMIC, MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A dielectric ceramic is formed with sintered grains constituting the dielectric have an average grain size of 0.2 to 1.0 gm and an oxygen defect concentration of 0.2 to 0.5%. An acceptor element is added to the dielectric ceramic by no more than 0.5 mol per 100 mol of the primary component of BaTiO | 02-06-2014 |
20140016241 | LAMINATED CAPACITOR - In a laminated capacitor, one additional first internal electrode layer, which has its edge connected to the first external electrode as do the first internal electrode layers, is provided to one of the five first internal electrode layers so as to face one another via the second dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity, and one additional second internal electrode layer, which has its edge connected to the second external electrode as do the second internal electrode layers, is provided to one of the five second internal electrode layers so as to face one another via the third dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity. | 01-16-2014 |
20140009864 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor has multiple layered dielectric ceramic layers of a dielectric ceramic constituted by primary phase grains whose primary component is BaTiO | 01-09-2014 |
20140003196 | ACOUSTIC WAVE DEVICE BUILT-IN MODULE AND COMMUNICATION DEVICE | 01-02-2014 |
20140002955 | LAMINATED CERAMIC CAPACITOR | 01-02-2014 |
20130343983 | LITHIUM-TITANIUM COMPLEX OXIDE AND MANUFACTURING METHOD THEREOF, AND BATTERY ELECTRODE USING SAME - A lithium-titanium complex oxide whose total water generation amount and total carbon dioxide generation amount measured by thermal decomposition GC-MS are preferably 1500 wt ppm or less and 2000 wt ppm or less, respectively, is obtained by subjecting a mixture of titanium compound and lithium compound to a heat treatment at 600° C. or above, cooling the obtained reaction product to 50° C. or below, and then subjecting the cooled reaction product to a reheat treatment involving heating to the maximum temperature of 300 to 700° C. and then cooling, wherein the dew point of the ambience of the reheat treatment is controlled at −30° C. or below at a temperature of 200° C. or above. | 12-26-2013 |
20130330596 | ELECTROCHEMICAL DEVICE - An electrochemical device includes a container, a storage element, and a structure. The container includes a container main body including a first inner surface, and a lid including a second inner surface opposed to the first inner surface. The lid is bonded to the container main body. The container contains an electrolyte. The storage element includes first and second electrode layers respectively adhered to the first and second inner surfaces and a separator provided between the first and second electrode layers to retain the electrolyte, and is sandwiched between the first and second inner surfaces. The structure is provided in at least either one of the first and second inner surfaces. The structure compresses and deforms the storage element to form, in an area of the separator sandwiched between the first and second electrode layers, a thin wall portion thinner than in a peripheral area around the area. | 12-12-2013 |
20130328735 | VARIABLE CAPACITANCE CAPACITOR ELEMENT - A variable capacitance capacitor element according to an embodiment of the present invention comprises: a supporting substrate; a first electrode layer provided on the supporting substrate; a second electrode layer provided opposite to the first electrode layer; and a dielectric layer positioned between the first electrode layer and the second electrode layer. In accordance with an aspect, a main component of the dielectric layer is represented by a composition formula Ba | 12-12-2013 |
20130321984 | POROUS CAPACITOR - One object is to provide a porous capacitor having increased insulation reliability. In accordance with one aspect, the porous capacitor includes: a first conductor layer and a second conductor layer opposed to each other at a predetermined distance; a dielectric layer made of an oxidized valve metal and disposed between the first conductor layer and the second conductor layer; a large number of holes formed through the dielectric layer and oriented substantially orthogonal to the first conductor layer and the second conductor layer; and first electrodes and second electrodes formed of a conductive material filled in the holes; and insulation parts insulating the first electrodes from the second conductor layer and insulating the second electrodes from the first conductor layer. The thicknesses of the first conductor layer and the second conductor layer are equal to or greater than half of the inner diameter of the holes. | 12-05-2013 |
20130320815 | PIEZOELECTRIC CERAMIC, PIEZOELECTRIC CERAMIC COMPONENT, AND PIEZOELECTRIC DEVICE USING SUCH PIEZOELECTRIC CERAMIC COMPONENT - In a piezoelectric ceramic which has an alkali-containing niobate-based perovskite structure in which constituent elements are Li, Na, K, Nb, and O, a Li | 12-05-2013 |
20130317679 | MOTOR DRIVE CONTROL DEVICE - An appropriate motor control in accordance with a pedal operation of a driver is to be achieved. A motor drive control device according to the present invention is a motor drive control device for an electric power-assisted vehicle that has one-way clutches respectively provided for a motor drive system and for a pedal drive system. The motor drive control device according to the present invention includes: a first calculating part that calculates a pedal rotation conversion speed that is converted from a pedal rotation; and a second calculating part that calculates a second target torque for a motor based on the pedal rotation conversion speed, during a period in which a first target torque derived from a pedal torque is not detected. | 11-28-2013 |
20130314173 | FILTER, DUPLEXER, AND COMMUNICATION MODULE - A filter includes: acoustic wave resonators connected between an input terminal and an output terminal; and a cancel circuit including an input connection portion and an output connection portion connected so that the cancel circuit is connected in parallel to at least a part of the acoustic wave resonators, wherein the cancel circuit includes a first acoustic wave resonator connected between a node between the input connection portion and the output connection portion and a ground. | 11-28-2013 |
20130313467 | PIEZOELECTRIC PORCELAIN COMPOSITION - Provided is a Sr | 11-28-2013 |
20130311019 | MOTOR DRIVE CONTROL DEVICE - A motor drive control device of an electric power-assisted vehicle that has a gear shifter and a motor, and in which a first ratio of the number of drive rotations in the motor to the number of drive rotations of a pedal changes based on changes in a gear ratio in the gear shifter, includes: a gear ratio obtaining part that obtains the gear ratio of the gear shifter; and a calculating part that calculates an assist torque, which is a target value for a drive torque of the motor, from the pedal input torque based on the gear ratio obtained by the gear ratio obtaining part. | 11-21-2013 |
20130307636 | COMPOSITE ELECTRONIC COMPONENT - A composite electronic component includes: a circuit board; a package that includes an acoustic wave filter and is located on a top surface of the circuit board; a dummy package that is located on the top surface of the circuit board; and a lid that is located above the package and the dummy package. | 11-21-2013 |
20130306901 | PIEZOELECTRIC CERAMIC AND METHOD OF MANUFACTURING THE SAME - A piezoelectric ceramic is expressed by the composition formula 100[(Sr | 11-21-2013 |
20130294012 | ELECTROCHEMICAL DEVICE - An electrochemical device includes a casing, a storage element, an electrolyte, a wiring, and an adhesive layer. The casing forms a liquid chamber, the liquid chamber having a bottom surface provided with a recess. The storage element is housed in the liquid chamber. The electrolyte is housed in the liquid chamber. The wiring is connected to the recess. The adhesive layer is made of a conductive adhesive filled in the recess and configured to coat the wiring and cause the storage element to adhere to the casing. | 11-07-2013 |
20130271928 | CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME - A circuit module pertaining to an embodiment of the present invention has a board, multiple electronic components, a shield member, sealing layer, and cover layer. The board has a mounting surface that includes a first area and second area in which the multiple electronic components are mounted. The shield member is constituted by conductive material and placed between the first area and second area on the mounting surface. The sealing layer has on its top surface a groove having its bottom face including an upper end face of the shield member, is formed on the mounting surface, and is constituted by an insulator that covers the multiple electronic components. The cover layer is constituted by conductive material and has a first cover part that fills the groove as well as a second cover part that covers the first cover part and sealing layer. | 10-17-2013 |
20130271418 | PIEZOELECTRIC OSCILLATION DEVICE AND TOUCH PANEL DEVICE - In a piezoelectric oscillation device in which a support substrate is oscillated using a bimorph-type piezoelectric oscillation element, the click sensation when the support substrate is operated is improved, and shock resistance of a control panel is improved. Provided is a piezoelectric oscillation device in which wiring is not easily broken. On the rear side of a touch panel ( | 10-17-2013 |
20130271339 | MULTI-ANTENNA AND ELECTRONIC DEVICE - A passive element has an electrical length such that a resonance mode thereof is in a target frequency band, and first and second feed elements, each of which has an electrical length such that a resonance mode thereof is not in the target frequency band. The first feed element has a first coupling conductive part, and a first connecting conductive part, which has a continuous shape with the first coupling conductive part. The second feed element has a second coupling conductive part, and a second connecting conductive part, which has a continuous shape with the second coupling conductive part. The first coupling conductive part is disposed parallel and adjacent to the passive element. The second coupling conductive part is disposed parallel and adjacent to the passive element. The first connecting conductive part and the second connecting conductive part are disposed adjacent and parallel to each other. | 10-17-2013 |
20130271238 | FILTER DEVICE, MANUFACTURING METHOD FOR FILTER DEVICE, AND DUPLEXER - A transmitting/receiving filter (filter device) according to one embodiment of the present invention is provided with a transmitting filter, a receiving filter, and a support substrate. The transmitting filter includes a first resonator constituted of a BAW device (FBAR, SMR). The receiving filter includes a second resonator constituted of a Lamb wave device. The support substrate supports both the transmitting filter and the receiving filter. The transmitting filter and the receiving filter are constituted of elastic wave resonators that resonate at different oscillation modes from each other, which allows miniaturization of the support substrate to be realized while preventing oscillation interference between the two filters. | 10-17-2013 |
20130260251 | LITHIUM-TITANIUM COMPLEX OXIDE, AND BATTERY ELECTRODE AND LITHIUM ION SECONDARY BATTERY USING SAME - A lithium-titanium complex oxide containing Li | 10-03-2013 |
20130258548 | CERAMIC POWDER AND MULTI-LAYER CERAMIC CAPACITOR - A ceramic powder that contains, as a main composition, barium titanate powder having a perovskite structure with an average particle size (median size) of 200 nm or smaller as measured by SEM observation, wherein the the barium titanate powder is such that the percentage of barium titanate particle having twin defects in the barium titanate powder is less than 10% as measured by TEM observation and that its crystal lattice c/a is 1.0075 or more. The ceramic powder is particularly useful in the formation of thin dielectric layers of 1 μm or less and can be used to manufacture MLCCs having both desired capacity and longevity traits. | 10-03-2013 |
20130258547 | CERAMIC POWDER AND MULTI-LAYER CERAMIC CAPACITOR - A ceramic powder that contains, as a main composition, barium titanate powder having a perovskite structure with an average particle size (median size) of 200 nm or smaller as measured by SEM observation, wherein the barium titanate powder is such that the percentage of barium titanate particles having twin defects in the barium titanate powder is 13% or more as measured by TEM observation and that its crystal lattice c/a is 1.0080 or more. The ceramic powder has a wide range of optimum sintering temperatures and thus offers excellent productivity and is particularly useful in the formation of thin dielectric layers of 1 μm or less. | 10-03-2013 |