Stion Corporation Patent applications |
Patent application number | Title | Published |
20140308774 | METHOD AND DEVICE FOR CADMIUM-FREE SOLAR CELLS - A method for fabricating a thin film photovoltaic device is provided. The method includes providing a substrate comprising a surface region made of a thin-film photovoltaic absorber including copper, indium, gallium, selenium, and sulfur species. Additionally, the method includes applying a dip-in chemical bath deposition process for forming a buffer layer containing at least zinc-oxygen-sulfide material but substantially free of cadmium species. Furthermore, the method includes producing a chemical bath including steps of heating a bath of water to about 75° C., adding aqueous ammonia to mix with the bath of water, adding a solution of sodium hydroxide, adding zinc salt solution, and adding a solution of thiourea. The dip-in chemical bath deposition process includes immersing a plurality of substrates formed with the thin-film photovoltaic absorber substantially vertically in the chemical bath for 30 minutes to form the zinc-oxygen-sulfide buffer layer followed by a cleaning and drying process. | 10-16-2014 |
20140287551 | THERMAL PRE-TREATMENT PROCESS FOR SODA LIME GLASS SUBSTRATE FOR THIN FILM PHOTOVOLTAIC MATERIALS - A method for fabricating a thin film solar cell includes providing a soda lime glass substrate comprising a surface region, treating the surface region with one or more cleaning process including an aqueous solution to remove one or more contaminants and/or particulates, and forming a lower electrode layer overlying the surface region. The method also includes performing a thermal treatment process to remove any residual water species to substantially less than a monolayer of water species from the lower electrode layer and soda lime glass substrate. The thermal treatment process changes a temperature of the soda lime glass substrate from a first temperature to a second temperature to pre-heat the soda lime glass substrate. Additionally, the method includes transferring the soda lime glass substrate, which has been preheated, to a deposition chamber and forming a layer of photovoltaic material overlying the lower electrode layer within the deposition chamber. | 09-25-2014 |
20140170808 | ZINC OXIDE FILM METHOD AND STRUCTURE FOR CIGS CELL - A method for fabricating a thin film photovoltaic device. The method includes providing a substrate comprising an absorber layer and an overlying window layer. The substrate is loaded into a chamber and subjected to a vacuum environment. The vacuum environment is at a pressure ranging from 0.1 Torr to about 0.02 Torr. In a specific embodiment, a mixture of reactant species derived from diethylzinc species, water species and a carrier gas is introduced into the chamber. The method further introduces a diborane species using a selected flow rate into the mixture of reactant species. A zinc oxide film is formed overlying the window layer to define a transparent conductive oxide using the selected flow rate to provide a resistivity of about 2.5 milliohm-cm and less and an average grain size of about 3000 to 5000 Angstroms | 06-19-2014 |
20140147800 | QUARTZ BOAT METHOD AND APPARATUS FOR THIN FILM THERMAL TREATMENT - A method of supporting a plurality of planar substrates in a tube shaped furnace for conducting a thermal treatment process is disclosed. The method uses a boat fixture having a base frame including two length portions and a first width portion, a second width portion, and one or more middle members connected between the two length portions. Additionally, the method includes mounting a removable first grooved rod respectively on the first width portion, the second width portion, and each of the one or more middle members, each first grooved rod having a first plurality of grooves characterized by a first spatial configuration. The method further includes inserting one or two substrates of a plurality of planar substrates into each groove in the boat fixture separated by a distance. | 05-29-2014 |
20140134785 | SODIUM DOPED THIN FILM CIGS/CIGSS ABSORBER FOR HIGH EFFICIENCY PHOTOVOLTAIC DEVICES AND RELATED METHODS - A method of processing a thin-film absorber material with enhanced photovoltaic efficiency. The method includes providing a soda-lime glass substrate having a surface region and forming a barrier material overlying the surface region, followed by formation of a stack structure including a first thickness of a first precursor, a second thickness of a second precursor, and a third thickness of a third precursor. The first thickness of the first precursor is sputtered with a first target device including a first mixture of copper, gallium, and a first sodium species. The method further includes subjecting the soda-lime glass substrate having the stack structure in a thermal treatment process with at least H | 05-15-2014 |
20140116508 | COLUMN STRUCTURE THIN FILM MATERIAL USING METAL OXIDE BEARING SEMICONDUCTOR MATERIAL FOR SOLAR CELL DEVICES - A thin film material structure for solar cell devices. The thin film material structure includes a thickness of material comprises a plurality of single crystal structures. In a specific embodiment, each of the single crystal structure is configured in a column like shape. The column like shape has a dimension of about 0.01 micron to about 10 microns characterizes a first end and a second end. An optical absorption coefficient of greater than 10 | 05-01-2014 |
20140014170 | DOUBLE SIDED BARRIER FOR ENCAPSULATING SODA LIME GLASS FOR CIS/CIGS MATERIALS - A method of fabricating a thin film photovoltaic device is provided. The method subjects a soda lime glass substrate having a front side, backside, and edges to a first cleaning process and forms a first coating of silicon dioxide overlying the backside and the edges. The method further subjects the substrate to a second cleaning process and forms a second coating of silicon dioxide overlying the front side and the edges of the substrate. Furthermore, the method includes causing a barrier layer comprising the first coating and the second coating to encapsulate entirely the front side, backside, and edges. The barrier layer includes at least a thickness of oxygen rich silicon dioxide to contain any sodium bearing material within the substrate. Moreover, the method includes forming a thickness of metal material overlying the second coating on the front side followed by an absorber material and window material plus a top electrode. | 01-16-2014 |
20130306150 | METHOD AND STRUCTURE FOR ELIMINATING EDGE PEELING IN THIN-FILM PHOTOVOLTAIC ABSORBER MATERIALS - A method for manufacturing a thin-film photovoltaic device includes providing a glass substrate contained sodium species. The glass substrate comprising a surface region and a peripheral edge region surround the surface region. The method further includes forming a barrier material overlying the surface region and partially overlying the peripheral edge region and forming a conductor material overlying the barrier material. Additionally, the method includes forming at least a first trench in a vicinity of the peripheral edge region to remove substantially the conductor material therein and forming precursor materials overlying the patterned conductor material. Furthermore, the method includes thermally treating the precursor materials to transform the precursor materials into a film of photovoltaic absorber. The first trench is configured to maintain the film of photovoltaic absorber substantially free from peeling off the conductor material. | 11-21-2013 |
20130306130 | SOLAR MODULE APPARATUS WITH EDGE REFLECTION ENHANCEMENT AND METHOD OF MAKING THE SAME - A monolithic integrated solar module with edge reflection enhancement includes a plurality of thin-film photovoltaic cells formed overlying a surface region of a glass substrate except in vicinities of peripheral edge regions. The solar module further includes a mask tape applied on a conductor bar disposed within the peripheral edge regions and coupled with the plurality of thin-film photovoltaic cells and an edge seal material disposed within the peripheral edge regions in a vicinity of the mask tape and an end region of the glass substrate. Additionally, the solar module includes a top glass panel disposed overlying the plurality of thin-film photovoltaic cells, the mask tape, and the edge seal material. Moreover, the solar module includes a reflector structure comprising one or more angled surfaces being configured to facilitate scattering of incoming sunlight from the vicinities of the peripheral edge regions partially to the plurality of thin-film photovoltaic cells. | 11-21-2013 |
20130174900 | NANOWIRE ENHANCED TRANSPARENT CONDUCTIVE OXIDE FOR THIN FILM PHOTOVOLTAIC DEVICES - A thin-film photovoltaic devices includes transparent conductive oxide which has embedded within it nanowires at less than 2% nominal shadowing area. The nanowires enhance the electrical conductivity of the conductive oxide. | 07-11-2013 |
20120302002 | Method of Manufacture of Sodium Doped CIGS/CIGSS Absorber Layers for High Efficiency Photovoltaic Devices - A method for processing a thin-film absorber material with enhanced photovoltaic efficiency includes forming a barrier layer on a soda lime glass substrate followed by formation of a stack structure of precursor layers. The method further includes subjecting the soda-lime glass substrate with the stack structure to a thermal treatment process with at least H | 11-29-2012 |
20120285508 | FOUR TERMINAL MULTI-JUNCTION THIN FILM PHOTOVOLTAIC DEVICE AND METHOD - A multi junction photovoltaic cell device includes a lower cell and an upper cell operably coupled to the lower cell. The lower cell includes a lower glass substrate material, a lower electrode, and a first terminal coupled to the lower electrode through the lower glass substrate material. The lower cell includes a lower absorber characterized by a bandgap smaller than 1 eV overlying the lower electrode and a lower window overlying the lower absorber and a lower transparent-conductive oxide coupled to a second terminal overlying the lower window. The upper cell includes a p+-type transparent conductor coupled to a third terminal. The upper cell further has an upper p-type absorber with a bandgap in a range of 1.6 to 1.9 eV overlying the p+-type transparent conductor and has an upper n-type window overlying the upper p-type absorber, an upper transparent-conductive oxide coupled to a fourth terminal overlying the upper n-type window. | 11-15-2012 |
20120276682 | METHOD AND SYSTEM FOR LARGE SCALE MANUFACTURE OF THIN FILM PHOTOVOLTAIC DEVICES USING SINGLE-CHAMBER CONFIGURATION - A system for large scale manufacture of thin film photovoltaic cells includes a chamber comprising a plurality of compartments in a common vacuum ambient therein. Additionally, the system includes one or more shutter screens removably separating each of the plurality of compartments. The system further includes one or more transfer tools configured to transfer a substrate from one compartment to another without breaking the common vacuum ambient. The substrate is optically transparent and is characterized by a lateral dimension of about 1 meter or greater for a solar module. Embodiments of the invention provide compartments configured to subject the substrate to one or more thin film processes to form a Cu-rich Cu—In composite material overlying the substrate and at least one of the plurality of compartments is configured to subject the Cu-rich Cu—In composite material to a thermal process to form a chalcogenide structured material. | 11-01-2012 |
20120270361 | METHOD AND SYSTEM FOR LARGE SCALE MANUFACTURE OF THIN FILM PHOTOVOLTAIC DEVICES USING MULTI-CHAMBER CONFIGURATION - A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. | 10-25-2012 |
20120270341 | METHOD AND SYSTEM FOR LARGE SCALE MANUFACTURE OF THIN FILM PHOTOVOLTAIC DEVICES USING MULTI-CHAMBER CONFIGURATION - A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. | 10-25-2012 |
20120264072 | METHOD AND APPARATUS FOR PERFORMING REACTIVE THERMAL TREATMENT OF THIN FILM PV MATERIAL - An apparatus for performing reactive thermal treatment of thin film photovoltaic devices includes a furnace having a tubular body surrounded by heaters and cooling devices. The apparatus includes cooled doors at ends of the furnace separated from a central portion of the furnace by baffles. The cooled doors facilitate increased convection within the furnace and improve temperature uniformity. | 10-18-2012 |
20120240989 | Method and Device for Cadmium-Free Solar Cells - A method for fabricating a thin film photovoltaic device is provided. The method includes providing a substrate comprising a thin film photovoltaic absorber which has a surface including copper, indium, gallium, selenium, and sulfur. The method further includes subjecting the surface to a material containing at least a zinc species substantially free of any cadmium. The surface is heated to cause formation of a zinc doped material. The zinc doped material is free from cadmium. Furthermore the method includes forming a zinc oxide material overlying the zinc doped material and forming a transparent conductive material overlying the zinc oxide material. | 09-27-2012 |
20120237885 | Apparatus and Method Utilizing Forced Convection for Uniform Thermal Treatment of Thin Film Devices - An apparatus for uniform reactive thermal treatment of thin-film materials includes a chamber enclosing a tube shaped space filled with a work gas and heaters disposed outside the chamber. The apparatus further includes a loading configuration for subjecting a plurality of planar substrates to the work gas in the tube shaped space. Baffles are disposed above and below the loading configuration. | 09-20-2012 |
20120204939 | Structure and Method for High Efficiency CIS/CIGS-based Tandem Photovoltaic Module - A tandem thin-film photovoltaic module includes a bottom device having a first PV junction including a p+ type absorber having an energy band-gap ranging from 1.0 to 1.2 eV, sandwiched between a first transparent electrode and a lower reflective electrode. The tandem module also includes a top device mechanically coupled to the bottom device. The top device is a bi-facial device having a second PV junction sandwiched by transparent conductive oxide electrodes. The second PV junction includes a second p+ type absorber engineered with an energy band-gap within 1.7 to 2.0 eV. A tandem thin-film photovoltaic module is configured have a superstrate for the top device for receiving sunlight radiation. The tandem thin-film photovoltaic module is configured to covert high-energy electromagnetic radiation to electric current at the top device and convert low-energy electromagnetic radiation to electric current at the bottom device with a combined conversion efficiency of 18% or greater. | 08-16-2012 |
20120199065 | Multi-Module System for Processing Thin Film Photovoltaic Devices - A system for in-line substrate processing includes a horizontal rail structure at a first height. A substrate transfer module next to the rail structure receives substrates ready for processing and delivers substrates after processing. Process modules disposed along the rail structure enable process operations on the substrates. A substrate loader moves along the rail structure and transfers substrates to and from the substrate transfer module and to and from the process modules. A controller manages operation of the system. | 08-09-2012 |
20120186975 | METHOD AND SYSTEM FOR LARGE SCALE MANUFACTURE OF THIN FILM PHOTOVOLTAIC DEVICES USING MULTI-CHAMBER CONFIGURATION - A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and forming a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. That is, the method includes in-situ monitoring of the physical, electrical, and optical properties of the thin films. These properties are used to determine and adjust process conditions for subsequent processes. | 07-26-2012 |
20120122321 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - thermal management for large scale processing of CIS and/or CIGS based thin film is described. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, to at least initiate formation of a copper indium diselenide film. | 05-17-2012 |
20120122304 | System and Method for Transferring Substrates in Large Scale Processing of CIGS and/or CIS Devices - The present invention provides methods for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates having a copper and indium composite structure, and including a peripheral region, the peripheral region including a plurality of openings, the plurality of openings including at least a first opening and a second opening. The method includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the furnace including a holding apparatus. The method further includes introducing a gaseous species into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature to at least initiate formation of a copper indium diselenide film on each of the substrates. | 05-17-2012 |
20120094432 | SELF CLEANING LARGE SCALE METHOD AND FURNACE SYSTEM FOR SELENIZATION OF THIN FILM PHOTOVOLTAIC MATERIALS - A method for fabricating a copper indium diselenide semiconductor film using a self cleaning furnace is provided. The method includes transferring a plurality of substrates having a copper and indium composite structure into a furnace comprising a processing region and at least one end cap region disengageably coupled to the processing region. The method also includes introducing a gaseous species including a hydrogen species and a selenium species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature to initiate formation of a copper indium diselenide film on each of the substrates. The method further includes decomposing residual selenide species from an inner region of the process region of the furnace. The method further includes depositing elemental selenium species within a vicinity of the end cap region operable at a third temperature. | 04-19-2012 |
20120045886 | Methods for Infusing One or More Materials into Nano-Voids of Nanoporous or Nanostructured Materials - A method of forming composite nanostructures using one or more nanomaterials. The method provides a nanostructure material having a surface region and one or more nano void regions within a first thickness in the surface region. The method subjects the surface region of the nanostructure material with a fluid. An external energy is applied to the fluid and/or the nanostructure material to drive in a portion of the fluid into one or more of the void regions and cause the one or more nano void regions to be substantially filled with the fluid and free from air gaps. | 02-23-2012 |
20120028405 | METHOD AND MATERIAL FOR PROCESSING IRON DISILICIDE FOR PHOTOVOLTAIC APPLICATION - A method for providing a semiconductor material for photovoltaic devices, the method includes providing a sample of iron disilicide comprising approximately 90 percent or greater of a beta phase entity. The sample of iron disilicide is characterized by a substantially uniform first particle size ranging from about 1 micron to about 10 microns. The method includes combining the sample of iron disilicide and a binding material to form a mixture of material. The method includes providing a substrate member including a surface region and deposits the mixture of material overlying the surface region of the substrate. In a specific embodiment, the mixture of material is subjected to a post-deposition process such as a curing process to form a thickness of material comprising the sample of iron disilicide overlying the substrate member. In a specific embodiment, the thickness of material is characterized by a thickness of about the first particle size. | 02-02-2012 |
20120021552 | Quartz Boat Method and Apparatus for Thin Film Thermal Treatment - A method of supporting a plurality of planar substrates in a tube shaped furnace for conducting a thermal treatment process is disclosed. The method uses a boat fixture having a base frame including two length portions and a first width portion, a second width portion, and one or more middle members connected between the two length portions. Additionally, the method includes mounting a removable first grooved rod respectively on the first width portion, the second width portion, and each of the one or more middle members, each first grooved rod having a first plurality of grooves characterized by a first spatial configuration. The method further includes inserting one or two substrates of a plurality of planar substrates into each groove in the boat fixture separated by a distance. | 01-26-2012 |
20120018828 | Sodium Sputtering Doping Method for Large Scale CIGS Based Thin Film Photovoltaic Materials - A method of processing sodium doping for thin-film photovoltaic material includes forming a metallic electrode on a substrate. A sputter deposition using a first target device comprising 4-12 wt % Na | 01-26-2012 |
20120003789 | Apparatus for Manufacturing Thin Film Photovoltaic Devices - An apparatus for fabricating thin film photovoltaic devices includes a deposition chamber for loading a pair of substrates. Two heater platens in a side-by-side configuration with a middle gap form intimate contact with the pair of substrates. Each heater platen has a second width and a second length respectively made smaller than the first width and the first length to allow the substrate to fully cover the heater platen for preventing formation of edge lip due to coating buildup in a peripheral edge region. The apparatus further includes a shield structure which covers both the middle gap and all outer peripheral side regions of the side-by-side configuration of the two heater platens for preventing coating buildup and guiding a downstream flow. | 01-05-2012 |
20110312122 | METAL SPECIES SURFACE TREATMENT OF THIN FILM PHOTOVOLTAIC CELL AND MANUFACTURING METHOD - A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate including a surface region. A first electrode layer is formed overlying the surface region. A copper layer is formed overlying the first electrode layer and an indium layer overlying the copper layer to form a multi-layered structure. The method subjects at least the multi-layered structure to a thermal treatment process in an environment containing a sulfur bearing species and form a copper indium disulfide material. The copper indium disulfide material includes a thickness of substantially copper sulfide material. The thickness of the copper sulfide material is removed to expose a surface region having a copper poor surface characterized by a copper to indium atomic ratio of less than about 0.95:1. The method subjects the copper poor surface to a metal cation species to convert the copper poor surface from an n-type semiconductor characteristic to a p-type semiconductor characteristic. A window layer is formed overlying the copper indium disulfide material. | 12-22-2011 |
20110297218 | METHOD AND STRUCTURE FOR THIN FILM PHOTOVOLTAIC MATERIALS USING BULK SEMICONDUCTOR MATERIALS - A photovoltaic device and related methods. The device has a structured material positioned between an electron collecting electrode and a hole collecting electrode. An electron transporting/hole blocking material is positioned between the electron collecting electrode and the structured material. In a specific embodiment, negatively charged carriers generated by optical absorption by the structured material are preferentially separated into the electron transporting/hole blocking material. In a specific embodiment, the structured material has an optical absorption coefficient of at least 10 | 12-08-2011 |
20110287576 | BULK COPPER SPECIES TREATMENT OF THIN FILM PHOTOVOLTAIC CELL AND MANUFACTURING METHOD - A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region. A first electrode layer is formed overlying the surface region. A copper layer is formed overlying the first electrode layer and an indium layer is formed overlying the copper layer to form a multi-layered structure. The method subject at least the multi-layered structure to a thermal treatment process in an environment containing a sulfur bearing species to form a bulk copper indium disulfide material. The bulk copper indium disulfide material includes one or more portions of copper indium disulfide material characterized by a copper-to-indium atomic ratio of less than about 0.95:1 and a copper poor surface comprising a copper to indium atomic ratio of less than about 0.95:1. The method subjects the copper poor surface and one or more portions of the bulk copper indium disulfide material to copper species to convert the copper poor surface from an n-type characteristic to a p-type characteristic and to convert any of the one or more portions of the bulk copper indium disulfide material having the copper-to-indium atomic ratio of less than about 0.95:1 from a p-type characteristic to an n-type characteristic. A window layer is formed overlying the copper indium disulfide material. | 11-24-2011 |
20110287575 | SULFIDE SPECIES TREATMENT OF THIN FILM PHOTOVOLTAIC CELL AND MANUFACTURING METHOD - A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region, forming a first electrode layer overlying the surface region, forming a copper layer overlying the first electrode layer and forming an indium layer overlying the copper layer to form a multi-layered structure. The multi-layered structure is subjected to a thermal treatment process in an environment containing a sulfur bearing species to forming a copper indium disulfide material. The copper indium disulfide material comprising a copper-to-indium atomic ratio ranging from about 1.2:1 to about 2:1 and a thickness of substantially copper sulfide material having a copper sulfide surface region. The thickness of the copper sulfide material is selectively removed to expose a surface region having a copper poor surface comprising a copper to indium atomic ratio of less than about 0.95:1. The method subjects the copper poor surface to a sulfide species to convert the copper poor surface from an n-type semiconductor characteristic to a p-type semiconductor characteristic. A window layer is formed overlying the copper indium disulfide material. | 11-24-2011 |
20110287574 | BULK SODIUM SPECIES TREATMENT OF THIN FILM PHOTOVOLTAIC CELL AND MANUFACTURING METHOD - A method for forming a thin film photovoltaic device is provided. The method includes providing a transparent substrate comprising a surface region. A first electrode layer is formed overlying the surface region. A chalcopyrite material is formed overlying the first electrode layer. In a specific embodiment, the chalcopyrite material comprises a copper poor copper indium disulfide region. The copper poor copper indium disulfide region having an atomic ratio of Cu:In of about 0.95 and less. The method includes compensating the copper poor copper indium disulfide region using a sodium species to cause the chalcopyrite material to change from an n-type characteristic to a p-type characteristic. The method includes forming a window layer overlying the chalcopyrite material and forming a second electrode layer overlying the window layer. | 11-24-2011 |
20110277837 | BULK CHLORIDE SPECIES TREATMENT OF THIN FILM PHOTOVOLTAIC CELL AND MANUFACTURING METHOD - A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region. A first electrode layer is formed overlying the surface region. A copper layer is formed overlying the first electrode layer and an indium layer is formed overlying the copper layer to form a multi-layered structure. The method subjects at least the multi-layered structure to a thermal treatment process in an environment containing a sulfur bearing species to form a bulk copper indium disulfide material. The bulk copper indium disulfide material comprises one or more portions of copper indium disulfide material and a copper poor surface region characterized by a copper-to-indium atomic ratio of less than about 0.95:1. The method subjects the copper poor surface and one or more portions of the bulk copper indium disulfide material to a chlorine species to convert the copper poor surface from an n-type characteristic to a p-type characteristic and to convert any of the one or more portions of the bulk copper indium disulfide material having the copper-to-indium atomic ratio of less than about 0.95:1 from a n-type characteristic to an p-type characteristic. A window layer is formed overlying the copper indium disulfide material. | 11-17-2011 |
20110277836 | COLUMN STRUCTURE THIN FILM MATERIAL USING METAL OXIDE BEARING SEMICONDUCTOR MATERIAL FOR SOLAR CELL DEVICES - A thin film material structure for solar cell devices. The thin film material structure includes a thickness of material comprises a plurality of single crystal structures. In a specific embodiment, each of the single crystal structure is configured in a column like shape. The column like shape has a dimension of about 0.01 micron to about 10 microns characterizes a first end and a second end. An optical absorption coefficient of greater than 10 | 11-17-2011 |
20110277830 | MULTI-JUNCTION SOLAR CELL DEVICES - A photovoltaic cell structure for manufacturing a photovoltaic device. The photovoltaic cell structure includes a substrate including a surface region. A first conductor layer overlies the surface region. The photovoltaic cell structure includes a lower cell structure. The lower cell structure includes a first P type absorber layer using a first semiconductor metal chalcogenide material and/or other semiconductor material overlying the first conductor layer. The first P type absorber material is characterized by a first bandgap ranging from about 0.5 eV to about 1.0 eV, a first optical absorption coefficient greater than about 10 | 11-17-2011 |
20110269262 | Method and System for Large Scale Manufacture of Thin Film Photovoltaic Devices Using Multi-Chamber Configuration - A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. That is, the method includes in-situ monitoring of the physical, electrical, and optical properties of the thin films. These properties are used to determine and adjust process conditions for subsequent processes. | 11-03-2011 |
20110269260 | Consumable Adhesive Layer for Thin Film Photovoltaic Material - A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region. The method forms a first electrode layer overlying the surface region of the transparent substrate. The method also forms a thin layer of indium material, using a sputtering target of indium material, overlying the first electrode layer to act as an intermediary glue layer to facilitate attachment to the first electrode layer. In a specific embodiment, the method forms a copper material overlying the thin layer of indium material. The method also forms an indium layer overlying the copper material to form a multi layered structure including at least the thin layer of indium material, copper material, and the indium layer. In a preferred embodiment, the multi-layered structure has a first thickness. In a specific embodiment, the method also subjects at least the multi-layered structure to thermal treatment process in an environment containing a sulfur bearing species to form a copper indium disulfide alloy material while consuming substantially all of the indium layer from at least the treatment process of the multi-layered structure. In a preferred embodiment, the copper indium disulfide alloy material comprises an atomic ratio of copper indium ranging from about 1.35 to about 3.00. In a specific embodiment, the copper indium disulfide alloy material has a second thickness of more than two times of the first thickness of the multi-layered structure. The method consumes substantially all of the thin layer of indium material into a portion of the copper indium disulfide alloy material during at least the thermal treatment process. The method causes formation of a copper sulfide material overlying the copper indium disulfide alloy material during at least the thermal treatment process. | 11-03-2011 |
20110269257 | Method and System for Large Scale Manufacture of Thin Film Photovoltaic Devices Using Multi-Chamber Configuration - A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. That is, the method includes in-situ monitoring of the physical, electrical, and optical properties of the thin films. These properties are used to determine and adjust process conditions for subsequent processes. | 11-03-2011 |
20110263064 | ZINC OXIDE FILM METHOD AND STRUCTURE FOR CIGS CELL - A method for fabricating a thin film photovoltaic device. The method includes providing a substrate comprising an absorber layer and an overlying window layer. The substrate is loaded into a chamber and subjected to a vacuum environment. The vacuum environment is at a pressure ranging from 0.1 Torr to about 0.02 Torr. In a specific embodiment, a mixture of reactant species derived from diethylzinc species, water species and a carrier gas is introduced into the chamber. The method further introduces a diborane species using a selected flow rate into the mixture of reactant species. A zinc oxide film is formed overlying the window layer to define a transparent conductive oxide using the selected flow rate to provide a resistivity of about 2.5 milliohm-cm and less and an average grain size of about 3000 to 5000 Angstroms | 10-27-2011 |
20110259739 | Method and System for Large Scale Manufacture of Thin Film Photovoltaic Devices Using Multi-Chamber Configuration - A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. That is, the method includes in-situ monitoring of the physical, electrical, and optical properties of the thin films. These properties are used to determine and adjust process conditions for subsequent processes. | 10-27-2011 |
20110259413 | Hazy Zinc Oxide Film for Shaped CIGS/CIS Solar Cells - A method for fabricating a shaped thin film photovoltaic device includes providing a length of tubular glass substrate having an inner diameter, an outer diameter, a circumferential outer surface region covered by an absorber layer and a window buffer layer overlying the absorber layer. The substrate is placed in a vacuum of between about 0.1 Torr to about 0.02 Torr and a mixture of reactant species derived from diethylzinc species, water species, and a carrier gas are introduced, as well as a diborane species. The substrate is heated to form a zinc oxide film with a thickness of 0.75-3 μm, a haziness of at least 5%, and an electrical resistivity of less than about 2.5 milliohm-cm. | 10-27-2011 |
20110259395 | Single Junction CIGS/CIS Solar Module - A high efficiency thin-film photovoltaic module is formed on a substrate. The photovoltaic module includes a plurality of stripe shaped photovoltaic cells electrically coupled to each other and physically disposed in parallel to the length one next to another across the width. Each cell includes a barrier material overlying the surface and a first electrode overlying the barrier material. Each cell further includes an absorber formed overlying the first electrode. The absorber includes a copper gallium indium diselenide compound material characterized by an energy band-gap of about 1 eV to 1.1 eV. Each cell additionally includes a buffer material overlying the absorber and a bi-layer zinc oxide material comprising a high resistivity transparent layer overlying the buffer material and a low resistivity transparent layer overlying the high resistivity transparent layer. | 10-27-2011 |
20110256661 | Method for Improved Patterning Accuracy for Thin Film Photovoltaic Panels - A method for patterning a thin film photovoltaic panel on a substrate characterized by a compaction parameter. The method includes forming molybdenum material overlying the substrate and forming a first plurality of patterns in the molybdenum material to configure a first patterned structure having a first inter-pattern spacing. Additionally, the method includes forming a precursor material comprising at least copper bearing species and indium bearing species overlying the first patterned structure. Then the substrate including the precursor material is subjected to a thermal processes to form at least an absorber structure. | 10-20-2011 |
20110244623 | RAPID THERMAL METHOD AND DEVICE FOR THIN FILM TANDEM CELL - A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region. A first transparent electrode layer is formed overlying the surface region. A multilayered structure including a copper material and an indium material is formed overlying a electrode surface region. The multilayered structure is subjected to a plurality of sulfur bearing entities during a rapid thermal process to form an absorber material comprising a copper entity, an indium entity, and a sulfur entity. The rapid thermal process uses a ramp time ranging from about 10 Degrees Celsius/second to about 50 Degrees Celsius/second. In a specific embodiment, the first transparent electrode layer is maintained to a sheet resistance of less than or equal to about 10 Ohms/square centimeters and an optical transmission of 90 percent and greater | 10-06-2011 |
20110230006 | Large Scale MOCVD System for Thin Film Photovoltaic Devices - An apparatus for fabricating thin films on substrate panels includes a deposition chamber enclosed by sidewalls, a lid, and a base. The apparatus includes a mixing chamber disposed above the lid and configured to receive vapor species and form a mixed vapor. The mixing chamber is coupled with the deposition chamber via inlets through the lid, including a diffuser plate. Two heater plates disposed side by side on the base supporting and heating two substrates. | 09-22-2011 |
20110229989 | LARGE SCALE METHOD AND FURNACE SYSTEM FOR SELENIZATION OF THIN FILM PHOTOVOLTAIC MATERIALS - A method for fabricating a copper indium diselenide semiconductor film is provided using substrates having a copper and indium composite structure. The substrates are placed vertically in a furnace and a gas including a selenide species and a carrier gas are introduced. The temperature is increased from about 350° C. to about 450° C. to initiate formation of a copper indium diselenide film from the copper and indium composite on the substrates. | 09-22-2011 |
20110223745 | SELF CLEANING LARGE SCALE METHOD AND FURNACE SYSTEM FOR SELENIZATION OF THIN FILM PHOTOVOLTAIC MATERIALS - According to an embodiment, the present invention provide a method for fabricating a copper indium diselenide semiconductor film using a self cleaning furnace. The method includes transferring a plurality of substrates into a furnace, the furnace comprising a processing region and at least one end cap region disengageably coupled to the processing region, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5, each of the substrates having a copper and indium composite structure. The method also includes introducing a gaseous species including a hydrogen species and a selenium species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350 Degrees Celsius to about 450 Degrees Celsius to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. The method further includes decomposing residual selenide species from an inner region of the process region of the furnace. The method further includes depositing elemental selenium species within a vicinity of the end cap region operable at a third temperature. Also, the method includes maintaining the inner region substantially free from elemental selenium species by at least the decomposition of residual selenide species from the inner region of the process region. | 09-15-2011 |
20110220198 | Method and Device Utilizing Strained AZO Layer and Interfacial Fermi Level Pinning in Bifacial Thin Film PV Cells - A method for forming a bifacial thin film photovoltaic cell includes providing a glass substrate having a surface region covered by an intermediate layer and forming a thin film photovoltaic cell on the surface region. Additionally, the thin film photovoltaic cell includes an anode overlying the intermediate layer, an absorber over the anode, and a window layer and cathode over the absorber mediated by a buffer layer. The anode comprises an aluminum doped zinc oxide (AZO) layer forming a first interface with the intermediate layer and a second interface with the absorber. The AZO layer is configured to induce Fermi level pinning at the first interface and a strain field from the first interface to the second interface. | 09-15-2011 |
20110212565 | Humidity Control and Method for Thin Film Photovoltaic Materials - A method for processing a thin film photovoltaic module. The method includes providing a plurality of substrates, each of the substrates having a first electrode layer and an overlying absorber layer composed of copper indium gallium selenide (CIGS)or copper indium selenide (CIS) material. The absorber material comprises a plurality of sodium bearing species. The method maintains the plurality of substrates in a controlled environment after formation of at least the absorber layer through one or more processes up to a lamination process. The controlled environment has a relative humidity of less than 10% and a temperature ranging from about 10 degrees Celsius to about 40 degrees Celsius. The method subjects the plurality of substrates to a liquid comprising water at a temperature from about 10 degrees Celsius to about 80 degrees Celsius to process the plurality of substrates after formation of the absorber layer. The plurality of substrates having the absorber layer is subjected to an environment having a relative humidity of greater than about 10% to a time period of less then four hours. | 09-01-2011 |
20110203634 | Method and Structure for Tiling Industrial Thin-Film Solar Devices - A method for integrating photovoltaic module includes providing a cover plate having a first surface and a second surface opposed to the first surface and supplying photovoltaic devices respectively formed on substrates. The photovoltaic devices include photovoltaic cells electrically coupled to each other, and each cell is characterized by a thin-film photovoltaic layer sandwiched between a first electrode material and a second electrode material. The first electrode material overlies the substrate and the second electrode material overlies the thin-film photovoltaic layer. The method further includes disposing the solar devices side by side to laminate with the cover plate by means of a first organic material filled between the second electrode material and the second surface. Each of the solar devices has a peripheral edge region being sealed by a second organic material. The method further includes electrically coupling the solar devices to each other. | 08-25-2011 |
20110168245 | Four Terminal Multi-Junction Thin Film Photovoltaic Device and Method - A multi-junction photovoltaic cell device. The device includes a lower cell and an upper cell, which is operably coupled to the lower cell. In a specific embodiment, the lower cell includes a lower glass substrate material, e.g., transparent glass. The lower cell also includes a lower electrode layer made of a reflective material overlying the glass material. The lower cell includes a lower absorber layer overlying the lower electrode layer. In a specific embodiment, the absorber layer is made of a semiconductor material having a band gap energy in a range of Eg=0.7 to 1 eV, but can be others. In a specific embodiment, the lower cell includes a lower window layer overlying the lower absorber layer and a lower transparent conductive oxide layer overlying the lower window layer. The upper cell includes a p+ type transparent conductor layer overlying the lower transparent conductive oxide layer. In a preferred embodiment, the p+ type transparent conductor layer is characterized by traversing electromagnetic radiation in at least a wavelength range from about 700 to about 630 nanometers and filtering electromagnetic radiation in a wavelength range from about 490 to about 450 nanometers. In a specific embodiment, the upper cell has an upper p type absorber layer overlying the p+ type transparent conductor layer. In a preferred embodiment, the p type conductor layer made of a semiconductor material has a band gap energy in a range of Eg=1.6 to 1.9 eV, but can be others. The upper cell also has an upper n type window layer overlying the upper p type absorber layer, an upper transparent conductive oxide layer overlying the upper n type window layer, and an upper glass material overlying the upper transparent conductive oxide layer. | 07-14-2011 |
20110143487 | Method and Structure for Thin Film Tandem Photovoltaic Cell - A tandem photovoltaic cell. The tandem photovoltaic cell includes a bifacial top cell and a bottom cell. The top bifacial cell includes a top first transparent conductive oxide material. A top window material underlies the top first transparent conductive oxide material. A first interface region is disposed between the top window material and the top first transparent conductive oxide material. The first interface region is substantially free from one or more entities from the top first transparent conductive oxide material diffused into the top window material. A top absorber material comprising a copper species, an indium species, and a sulfur species underlies the top window material. A top second transparent conductive oxide material underlies the top absorber material. A second interface region is disposed between the top second transparent conductive oxide material and the top absorber material. The bottom cell includes a bottom first transparent conductive oxide material. A bottom window material underlies the first bottom transparent conductive oxide material. A bottom absorber material underlies the bottom window material. A bottom electrode material underlies the bottom absorber material. The tandem photovoltaic cell further includes a coupling material free from a parasitic junction between the top cell and the bottom cell. | 06-16-2011 |
20110073181 | PATTERNING ELECTRODE MATERIALS FREE FROM BERM STRUCTURES FOR THIN FILM PHOTOVOLTAIC CELLS - A method for forming a thin film photovoltaic device having patterned electrode films includes providing a soda lime glass substrate with an overlying lower electrode layer comprising a molybdenum material. The method further includes subjecting the lower electrode layer with one or more pulses of electromagnetic radiation from a laser source to ablate one or more patterns associated with one or more berm structures from the lower electrode layer. Furthermore, the method includes processing the lower electrode layer comprising the one or more patterns using a mechanical brush device to remove the one or more berm structures followed by treating the lower electrode layer comprising the one or more patterns free from the one or more berm structures. The method further includes forming a layer of photovoltaic material overlying the lower electrode layer and forming a first zinc oxide layer overlying the layer of photovoltaic material. | 03-31-2011 |
20110071659 | Application Specific Solar Cell and Method for Manufacture Using Thin Film Photovoltaic Materials - A method for manufacture of application specific solar cells includes providing and processing custom design information to determine at least a cell size and a cell shape. The method includes providing a transparent substrate having a back surface region, a front surface region, and one or more grid-line regions overlying the front side surface region. The one or more grid regions provide one or more unit cells having the cell size and the cell shape. The method further includes forming a layered structure including photovoltaic materials overlying the front surface region. Additionally, the method includes aligning a laser beam from the back surface region to illuminate a first region within the one or more grid-line regions, subjecting a first portion of the layered structure overlying the first region to the laser beam to separate the first portion of the layered structure from the first region, and scanning the laser beam along the one or more grid-line regions to cause formation of one or more unit cells having the cell size and cell shape. The method further includes transferring the one or more unit cells. | 03-24-2011 |
20110070690 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 03-24-2011 |
20110070689 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 03-24-2011 |
20110070688 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 03-24-2011 |
20110070687 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 03-24-2011 |
20110070686 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 03-24-2011 |
20110070685 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 03-24-2011 |
20110070684 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 03-24-2011 |
20110070683 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 03-24-2011 |
20110070682 | THERMAL MANAGEMENT AND METHOD FOR LARGE SCALE PROCESSING OF CIS AND/OR CIGS BASED THIN FILMS OVERLYING GLASS SUBSTRATES - The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 03-24-2011 |
20110020980 | THERMAL PRE-TREATMENT PROCESS FOR SODA LIME GLASS SUBSTRATE FOR THIN FILM PHOTOVOLTAIC MATERIALS - A method for fabricating a thin film solar cell includes providing a soda lime glass substrate comprising a surface region, treating the surface region with one or more cleaning process including an aqueous solution to remove one or more contaminants and/or particulates, and forming a lower electrode layer overlying the surface region. The method also includes performing a thermal treatment process to remove any residual water species to substantially less than a monolayer of water species from the lower electrode layer and soda lime glass substrate. The thermal treatment process changes a temperature of the soda lime glass substrate from a first temperature to a second temperature to pre-heat the soda lime glass substrate. Additionally, the method includes transferring the soda lime glass substrate, which has been preheated, to a deposition chamber and forming a layer of photovoltaic material overlying the lower electrode layer within the deposition chamber. | 01-27-2011 |
20110020978 | SODIUM DOPING METHOD AND SYSTEM OF CIGS BASED MATERIALS USING LARGE SCALE BATCH PROCESSING - A method of processing a plurality of photovoltaic materials in a batch process includes providing at least one transparent substrate having an overlying first electrode layer and an overlying copper species based absorber precursor layer within an internal region of a furnace. The overlying copper species based absorber precursor layer has an exposed face. The method further includes disposing at least one soda lime glass comprising a soda lime glass face within the internal region of the furnace such that the soda lime glass face is adjacent by a spacing to the exposed face of the at least one transparent substrate. Furthermore, the method includes subjecting the at least one transparent substrate and the one soda lime glass to thermal energy to transfer one or more sodium bearing species from the soda lime glass face across the spacing into the copper species based absorber precursor layer via the exposed face. | 01-27-2011 |
20110020977 | Mechanical patterning of thin film photovoltaic materials and structure - A method for forming one or more patterns for a thin film photovoltaic material. The method includes providing a substrate including a molybdenum layer and an overlying absorber comprising a copper bearing species and a window layer comprising a cadmium bearing species. The substrate is supported to expose a surface of the window layer. In a specific embodiment, the method includes using a scribe device. The scribe device includes a scribe having a tip. The scribe device is configured to pivot about one or more regions and configured to apply pressure to the tip, such that the tip is placed on a selected region of the window layer or the absorber layer. The method moves the scribe device relative to the substrate in a direction to form a pattern on at least the window layer or the absorber layer at a determined speed maintaining the molybdenum layer free from the pattern. | 01-27-2011 |
20110020959 | HUMIDITY CONTROL AND METHOD FOR THIN FILM PHOTOVOLTAIC MATERIALS - A method for processing a thin film photovoltaic module. The method includes providing a plurality of substrates, each of the substrates having a first electrode layer and an overlying absorber layer composed of copper indium gallium selenide (CIGS) or copper indium selenide (CIS) material. The absorber material comprises a plurality of sodium bearing species. The method maintains the plurality of substrates in a controlled environment after formation of at least the absorber layer through one or more processes up to a lamination process. The controlled environment has a relative humidity of less than 10% and a temperature ranging from about 10 Degrees Celsius to about 40 Degrees Celsius. The method subjects the plurality of substrates to a liquid comprising water at a temperature from about 10 Degrees Celsius to about 80 Degrees Celsius to process the plurality of substrates after formation of the absorber layer. The plurality of substrates having the absorber layer is subjected to an environment having a relative humidity of greater than about 10% to a time period of less then four hours. | 01-27-2011 |
20110020564 | PROCESSING METHOD FOR CLEANING SULFUR ENTITIES OF CONTACT REGIONS - A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region and forming a first electrode layer overlying the surface region of the transparent substrate. The first electrode layer has an electrode surface region. In a specific embodiment, the method includes masking one or more portions of the electrode surface region using a masking layer to form an exposed region and a blocked region. The method includes forming an absorber layer comprising a sulfur entity overlying the exposed region and removing the mask layer. In a specific embodiment, the method causing formation of a plurality of metal disulfide species overlying the blocked region. In a specific embodiment, the metal disulfide species has a semiconductor characteristic. The method includes subjecting the plurality of metal disulfide species to electromagnetic radiation from a laser beam to substantially remove the metal disulfide species. The method includes exposing the blocked region free and clear from the metal disulfide | 01-27-2011 |
20110018103 | SYSTEM AND METHOD FOR TRANSFERRING SUBSTRATES IN LARGE SCALE PROCESSING OF CIGS AND/OR CIS DEVICES - According to an embodiment, the present invention provide method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure, each of the substrate including a peripheral region, the peripheral region including a plurality of openings, the plurality of openings including at least a first opening and a second opening. The also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5, the furnace including a holding apparatus, the holding apparatus including a first elongated member being configured to hang each of the substrates using at least the first opening. The method further includes introducing a gaseous species including a hydrogen species and a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates. | 01-27-2011 |
20110017298 | MULTI-JUNCTION SOLAR CELL DEVICES - A photovoltaic cell structure for manufacturing a photovoltaic device. The photovoltaic cell structure includes a substrate including a surface region. A first conductor layer overlies the surface region. The photovoltaic cell structure includes a lower cell structure. The lower cell structure includes a first P type absorber layer using a first semiconductor metal chalcogenide material and/or other semiconductor material overlying the first conductor layer. The first P type absorber material is characterized by a first bandgap ranging from about 0.5 eV to about 1.0 eV, a first optical absorption coefficient greater than about 10 | 01-27-2011 |
20110017257 | MULTI-JUNCTION SOLAR MODULE AND METHOD FOR CURRENT MATCHING BETWEEN A PLURALITY OF FIRST PHOTOVOLTAIC DEVICES AND SECOND PHOTOVOLTAIC DEVICES - A multi-junction solar module apparatus. The apparatus has a substrate member. The apparatus has a plurality of first photovoltaic devices arranged in a first spatial configuration, which is preferably disposed on a first planar region. In a specific embodiment, the plurality of first photovoltaic devices are numbered from 1 through N, where N is an integer greater than 1. Each of the plurality of first solar cells has a first bandgap characteristic. The apparatus has a plurality of second photovoltaic devices arranged in a second spatial configuration, which is preferably disposed in a second planar region. The plurality of second photovoltaic devices are numbered from 1 through M, where M is an integer greater than 1. In a preferred embodiment, N is not equal to M. Each of the second solar cells has a second band gap characteristic. In a specific embodiment, a first connector interconnects the plurality of first solar cells in a serial configuration. The first connector has a first terminal end and a second terminal end. A second connector interconnects the plurality of second solar cells in a serial configuration. The second connector has a first terminal end and a second terminal end. In a specific embodiment, a third connector connecting the second terminal end of the first connector and the first terminal end of the second connector. In a specific embodiment, a Vss node is coupled to the first terminal end of the first connector. In a specific embodiment, a Vdd node is coupled to the second terminal end of the second connector. In a preferred embodiment, N and M are selected to match a first current through the plurality of first solar cells and a second current through the plurality of second solar cells. | 01-27-2011 |
20100261307 | PATTERNING ELECTRODE MATERIALS FREE FROM BERM STRUCTURES FOR THIN FILM PHOTOVOLTAIC CELLS - A method for forming a thin film photovoltaic device having patterned electrode films includes providing a soda lime glass substrate with an overlying lower electrode layer comprising a molybdenum material. The method further includes subjecting the lower electrode layer with one or more pulses of electromagnetic radiation from a laser source to ablate one or more patterns associated with one or more berm structures from the lower electrode layer. Furthermore, the method includes processing the lower electrode layer comprising the one or more patterns using a mechanical brush device to remove the one or more berm structures followed by treating the lower electrode layer comprising the one or more patterns free from the one or more berm structures. The method further includes forming a layer of photovoltaic material overlying the lower electrode layer and forming a first zinc oxide layer overlying the layer of photovoltaic material. | 10-14-2010 |
20100258179 | THIN FILM SODIUM SPECIES BARRIER METHOD AND STRUCTURE FOR CIGS BASED THIN FILM PHOTOVOLTAIC CELL - A method for fabricating a thin film solar cell includes providing a soda lime glass substrate comprising a surface region and a concentration of sodium oxide of greater than about 10 wt % and treating the surface region with one or more cleaning process, using a deionized water rinse, to remove surface contaminants having a particles size of greater than three microns. The method also includes forming a barrier layer overlying the surface region, forming a first molybdenum layer in tensile configuration overlying the barrier layer, and forming a second molybdenum layer in compressive configuration using a second process overlying the first molybdenum layer. Additionally, the method includes patterning the first molybdenum layer and the second molybdenum layer to form a lower electrode layer and forming a layer of photovoltaic material overlying the lower electrode layer. Moreover, the method includes forming a first zinc oxide layer overlying the layer of photovoltaic materials. | 10-14-2010 |
20100229921 | TANDEM PHOTOVOLTAIC CELL AND METHOD USING THREE GLASS SUBSTRATE CONFIGURATION - A tandem photovoltaic cell device. The device includes a lower cell configured for substantial independent operation of an upper cell. In a preferred embodiment, the lower cell has a lower glass substrate material and a lower electrode layer made of a reflective material overlying the glass material. The lower cell also has a lower absorber layer overlying the lower electrode layer. In a preferred embodiment, the absorber layer made of a first semiconductor material has a first band gap energy in a range of Eg=0.7 to 1.1 eV. The lower cell includes a lower window layer overlying the lower absorber layer, a lower transparent conductive oxide layer overlying the lower window layer, and a first optical coupling material comprising first ethylene vinyl acetate overlying the lower transparent conductive oxide layer. In a specific embodiment, the device also has the upper cell coupled to the lower cell. The upper cell has an intermediary glass substrate material, which has a thickness, a lower surface and an upper surface. In a specific embodiment, the thickness is about 1.1 millimeter and less. The lower surface is overlying the optical coupling material. The upper cell also has a first upper transparent conductor layer overlying the upper surface of the intermediary glass substrate material and an upper p type absorber layer overlying the first upper transparent conductor layer. The p type conductor layer is made of a second semiconductor material having a second band gap energy in a range of Eg=1.5 to 1.9 eV. The upper cell also has an upper n type window layer overlying the upper p type absorber layer. The upper cell has a second upper transparent conductive oxide layer overlying the upper n type window layer. The upper cell has a second optical coupling material comprising first ethylene vinyl acetate overlying the second upper transparent conductive oxide layer. The upper cell has an upper glass material overlying the upper transparent conductive oxide layer. | 09-16-2010 |
20100180927 | AFFIXING METHOD AND SOLAR DECAL DEVICE USING A THIN FILM PHOTOVOLTAIC AND INTERCONNECT STRUCTURES - A solar device includes a substrate structure having a surface region, a flexible and conformal material comprising a polymer material affixing the surface region. Additionally, the solar device includes one or more solar cells spatially provided by one or more films of materials characterized by a thickness dimension of 25 microns and less and mechanically coupled to the flexible and conformal material, the one or more solar cells having a flexible characteristic that maintains each of the solar cells substantially free from any damage or breakage. The solar device further includes an interconnect structure configured to couple one or more of the solar cells. The interconnect structure includes at least a first contact region and a second contact region within the flexible and conformal material. | 07-22-2010 |
20100122726 | METHOD AND STRUCTURE FOR THIN FILM PHOTOVOLTAIC CELL USING SIMILAR MATERIAL JUNCTION - A method for forming a thin film photovoltaic device. The method provides a transparent substrate including a surface region. A first electrode layer overlies the surface region. A copper layer is formed overlying the first electrode layer and an indium layer is formed overlying the copper layer to form a multi-layered structure. At least the multi-layered structure is subjected to a thermal treatment process in an environment containing a sulfur bearing species to forming a bulk copper indium disulfide. The bulk copper indium disulfide material has a surface region characterized by a copper poor surface region having a copper to indium atomic ratio of less than about 0.95:1 and n-type impurity characteristics. The bulk copper indium disulfide material excluding the copper poor surface region forms an absorber region and the copper poor surface region forms at least a portion of a window region for the thin film photovoltaic device. The method optionally forms a high resistivity transparent material having an intrinsic semiconductor characteristic overlying the copper poor surface region. A second electrode layer overlies the high resistivity transparent layer. | 05-20-2010 |
20100099214 | CONSUMABLE ADHESIVE LAYER FOR THIN FILM PHOTOVOLTAIC MATERIAL - A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region. The method forms a first electrode layer overlying the surface region of the transparent substrate. The method also forms a thin layer of indium material, using a sputtering target of indium material, overlying the first electrode layer to act as an intermediary glue layer to facilitate attachment to the first electrode layer. In a specific embodiment, the method forms a copper material overlying the thin layer of indium material. The method also forms an indium layer overlying the copper material to form a multi layered structure including at least the thin layer of indium material, copper material, and the indium layer. In a preferred embodiment, the multi-layered structure has a first thickness. In a specific embodiment, the method also subjects at least the multi-layered structure to thermal treatment process in an environment containing a sulfur bearing species to form a copper indium disulfide alloy material while consuming substantially all of the indium layer from at least the treatment process of the multi-layered structure. In a preferred embodiment, the copper indium disulfide alloy material comprises an atomic ratio of copper indium ranging from about 1.35 to about 3.00. In a specific embodiment, the copper indium disulfide alloy material has a second thickness of more than two times of the first thickness of the multi-layered structure. The method consumes substantially all of the thin layer of indium material into a portion of the copper indium disulfide alloy material during at least the thermal treatment process. The method causes formation of a copper sulfide material overlying the copper indium disulfide alloy material during at least the thermal treatment process. | 04-22-2010 |
20100087027 | Large Scale Chemical Bath System and Method for Cadmium Sulfide Processing of Thin Film Photovoltaic Materials - A method for forming a thin film photovoltaic material. The method includes providing a plurality of substrates. Each of the substrates has a surface region, an overlying first electrode material, an absorber material including at least a copper species, an indium species, and a selenium species. The method immerses the plurality of substrates in an aqueous solution including an ammonia species, a cadmium species, and a organosulfur (for example, thiourea) species in a bath to form a cadmium sulfide window material having a thickness of less than about 200 Angstroms overlying the absorber material. The aqueous solution is maintained at a temperature ranging from about 50 to about 60 Degrees Celsius. The plurality of substrates having at least the absorber material and the window layer are removed from the aqueous solution. The aqueous solution is further subjected to a filter process to substantially remove one or more particles greater than about 5 microns. | 04-08-2010 |
20100081230 | METHOD AND STRUCTURE FOR ADHESION OF ABSORBER MATERIAL FOR THIN FILM PHOTOVOLTAIC CELL - A method for forming a thin film photovoltaic device includes providing a transparent substrate comprising a surface region and forming a first electrode layer overlying the surface region. The method further includes forming a thin layer of copper gallium material overlying the first electrode layer to act as an intermediary adhesive layer to facilitate attachment to the first electrode layer. Additionally, the method includes forming a copper layer overlying the thin layer and forming an indium layer overlying the copper layer to form a multilayered structure and subjecting the multilayered structure to thermal treatment process with sulfur bearing species to form a copper indium disulfide alloy material. The copper indium disulfide alloy material comprises a copper:indium atomic ratio of about 1.2:1 to about 3.0:1 overlying a copper gallium disulfide material converted from the thin layer. Furthermore, the method includes forming a window layer overlying the copper indium disulfide alloy material. | 04-01-2010 |
20100078059 | METHOD AND STRUCTURE FOR THIN FILM TANDEM PHOTOVOLTAIC CELL - A tandem photovoltaic cell. The tandem photovoltaic cell includes a bifacial top cell and a bottom cell. The top bifacial cell includes a top first transparent conductive oxide material. A top window material underlies the top first transparent conductive oxide material. A first interface region is disposed between the top window material and the top first transparent conductive oxide material. The first interface region is substantially free from one or more entities from the top first transparent conductive oxide material diffused into the top window material. A top absorber material comprising a copper species, an indium species, and a sulfur species underlies the top window material. A top second transparent conductive oxide material underlies the top absorber material. A second interface region is disposed between the top second transparent conductive oxide material and the top absorber material. The bottom cell includes a bottom first transparent conductive oxide material. A bottom window material underlies the first bottom transparent conductive oxide material. A bottom absorber material underlies the bottom window material. A bottom electrode material underlies the bottom absorber material. The tandem photovoltaic cell further includes a coupling material free from a parasitic junction between the top cell and the bottom cell. | 04-01-2010 |
20100062560 | APPLICATION SPECIFIC SOLAR CELL AND METHOD FOR MANUFACTURE USING THIN FILM PHOTOVOLTAIC MATERIALS - A method for manufacture of application specific solar cells includes providing and processing custom design information to determine at least a cell size and a cell shape. The method includes providing a transparent substrate having a back surface region, a front surface region, and one or more grid-line regions overlying the front side surface region. The one or more grid regions provide one or more unit cells having the cell size and the cell shape. The method further includes forming a layered structure including photovoltaic materials overlying the front surface region. Additionally, the method includes aligning a laser beam from the back surface region to illuminate a first region within the one or more grid-line regions, subjecting a first portion of the layered structure overlying the first region to the laser beam to separate the first portion of the layered structure from the first region, and scanning the laser beam along the one or more grid-line regions to cause formation of one or more unit cells having the cell size and cell shape. The method further includes transferring the one or more unit cells. | 03-11-2010 |
20100051090 | FOUR TERMINAL MULTI-JUNCTION THIN FILM PHOTOVOLTAIC DEVICE AND METHOD - A multi-junction photovoltaic cell device. The device includes a lower cell and an upper cell, which is operably coupled to the lower cell. In a specific embodiment, the lower cell includes a lower glass substrate material, e.g., transparent glass. The lower cell also includes a lower electrode layer made of a reflective material overlying the glass material. The lower cell includes a lower absorber layer overlying the lower electrode layer. In a specific embodiment, the absorber layer is made of a semiconductor material having a band gap energy in a range of Eg=0.7 to 1 eV, but can be others. In a specific embodiment, the lower cell includes a lower window layer overlying the lower absorber layer and a lower transparent conductive oxide layer overlying the lower window layer. The upper cell includes a p+ type transparent conductor layer overlying the lower transparent conductive oxide layer. In a preferred embodiment, the p+ type transparent conductor layer is characterized by traversing electromagnetic radiation in at least a wavelength range from about 700 to about 630 nanometers and filtering electromagnetic radiation in a wavelength range from about 490 to about 450 nanometers. In a specific embodiment, the upper cell has an upper p type absorber layer overlying the p+ type transparent conductor layer. In a preferred embodiment, the p type conductor layer made of a semiconductor material has a band gap energy in a range of Eg=1.6 to 1.9 eV, but can be others. The upper cell also has an upper n type window layer overlying the upper p type absorber layer, an upper transparent conductive oxide layer overlying the upper n type window layer, and an upper glass material overlying the upper transparent conductive oxide layer. | 03-04-2010 |
20090320920 | HIGH EFFICIENCY PHOTOVOLTAIC CELL AND MANUFACTURING METHOD FREE OF METAL DISULFIDE BARRIER MATERIAL - A method for forming a thin film photovoltaic device includes providing a transparent substrate comprising a surface region and forming a first electrode layer overlying the surface region. Additionally, the method includes forming a copper indium material comprising an atomic ratio of Cu:In ranging from about 1.35:1 to about 1.60:1 by at least sputtering a target comprising an indium copper material. The method further includes subjecting the copper indium material to thermal treatment process in an environment containing a sulfur bearing species. Furthermore, the method includes forming a copper indium disulfide material from at least the thermal treatment process of the copper indium material and maintaining an interface region between the copper indium disulfide material and electrode substantially free from a metal disulfide layer, which has different semiconductor characteristics from the copper indium disulfide material. Moreover, the method includes forming a window layer overlying the copper indium disulfide material. | 12-31-2009 |
20090301562 | HIGH EFFICIENCY PHOTOVOLTAIC CELL AND MANUFACTURING METHOD - A method for forming a thin film photovoltaic device includes providing a transparent substrate comprising a surface region and forming a first electrode layer overlying the surface region. Additionally, the method includes forming a copper indium material comprising an atomic ratio of Cu:In ranging from about 1.35:1 to about 1.60:1 by at least sputtering a target comprising an indium copper material. The method further includes subjecting the copper indium material to thermal treatment process in an environment containing a sulfur bearing species. Furthermore, the method includes forming a copper indium disulfide material from at least the thermal treatment process of the copper indium material. Moreover, the method includes forming a window layer overlying the copper indium disulfide material. | 12-10-2009 |
20090250105 | THIN FILM METAL OXIDE BEARING SEMICONDUCTOR MATERIAL FOR SINGLE JUNCTION SOLAR CELL DEVICES - A structure for a single junction solar cell. The structure includes a substrate member having a surface region. The structure includes a first electrode structure overlying the surface region of the substrate member. A P absorber layer is formed overlying the first electrode structure. In a specific embodiment, the P absorber layer has a P | 10-08-2009 |
20090117718 | METHODS FOR INFUSING ONE OR MORE MATERIALS INTO NANO-VOIDS IF NANOPOROUS OR NANOSTRUCTURED MATERIALS - A method of forming composite nanostructures using one or more nanomaterials. The method provides a nanostructure material having a surface region and one or more nano void regions within a first thickness in the surface region. The method subjects the surface region of the nanostructure material with a fluid. An external energy is applied to the fluid and/or the nanostructure material to drive in a portion of the fluid into one or more of the void regions and cause the one or more nano void regions to be substantially filled with the fluid and free from air gaps. | 05-07-2009 |
20090087939 | COLUMN STRUCTURE THIN FILM MATERIAL USING METAL OXIDE BEARING SEMICONDUCTOR MATERIAL FOR SOLAR CELL DEVICES - A thin film material structure for solar cell devices. The thin film material structure includes a thickness of material comprises a plurality of single crystal structures. In a specific embodiment, each of the single crystal structure is configured in a column like shape. The column like shape has a dimension of about 0.01 micron to about 10 microns characterizes a first end and a second end. An optical absorption coefficient of greater than 10 | 04-02-2009 |
20090087370 | METHOD AND MATERIAL FOR PURIFYING IRON DISILICIDE FOR PHOTOVOLTAIC APPLICATION - A method for processing iron disilicide for manufacture photovoltaic devices. The method includes providing a first sample of iron disilicide comprising at least an alpha phase entity, a beta phase entity, and an epsilon phase entity. The method includes maintaining the first sample of iron disilicide in an inert environment and subjects the first sample of iron disilicide to a thermal process to form a second sample of iron disilicide. The second sample of iron disilicide comprises substantially beta phase iron disilicide and is characterized by a first particle size. The method includes introducing an organic solvent to the second sample of iron disilicide, forming a first mixture of material comprising the second sample of iron disilicide and the organic solvent. The method processed the first mixture of material including the second sample of iron disilicide using a grinding process. The method converted the second sample of iron disilicide having the first particle size to a third sample of iron disilicide having a second particle size. The organic solvent is removed and output a third sample of iron disilicide characterized by the second particle size and greater than about 90% of the beta phase entity. | 04-02-2009 |
20090017605 | METHODS FOR DOPING NANOSTRUCTURED MATERIALS AND NANOSTRUCTURED THIN FILMS - A method for introducing one or more impurities into nano-structured materials. The method includes providing a nanostructured material having a feature size of about 100 nm and less. The method includes subjecting a surface region of the nanostructured material to one or more impurities to form a first region having a first impurity concentration within a vicinity of the surface region. In a specific embodiment, the method includes applying a driving force to one or more portions of at least the nanostructured material to cause the first region to form a second region having a second impurity concentration. | 01-15-2009 |