SMARTRAC TECHNOLOGY GmbH
SMARTRAC TECHNOLOGY GmbH Patent applications | ||
Patent application number | Title | Published |
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20150208508 | Contact Bump Connection and Contact Bump and Method for Producing a Contact Bump Connection - The invention relates to a contact bump connection ( | 07-23-2015 |
20140084460 | Contact bumps methods of making contact bumps - Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards. | 03-27-2014 |