QULCOMM Incorporated Patent applications |
Patent application number | Title | Published |
20120276716 | SEMICONDUCTOR WAFER-TO-WAFER BONDING FOR DISSIMILAR SEMICONDUCTOR DIES AND/OR WAFERS - A process for wafer-to-wafer bonding of a first wafer having a first set of dies of a first die size to a reconstituted wafer of a second set of dies having a second die size different than the first die size. The process includes aligning the second set of dies such that a second set of interconnects on the second set of dies aligns with a first set of interconnects on the first set of dies. The second set of dies includes a spacing between the second set of dies based on parameters of the first set of dies. The process also includes coupling the reconstituted wafer with the first wafer to create a wafer stack. | 11-01-2012 |
20120002586 | HYBRID RADIO ARCHITECTURE FOR REPEATERS USING RF CANCELLATION REFERENCE - A wireless repeater includes a receiver circuit implemented as an intermediate frequency (IF) subsampling receiver and a transmitter circuit implemented as a direct conversion (zero-IF) transmitter. The repeater further includes a reference receiver implemented as an IF subsampling receiver to sample a portion of the transmit signal prior to over-the-air transmission for use as the reference signal for channel estimation. Highly accurate channel estimation is obtained by using the reference signal from the reference receiver as the reference signal accounts for distortions in the transmitter circuit of the repeater. The repeater may include an echo canceller to cancel an estimated feedback amount from an input signal based on the channel estimation. | 01-05-2012 |