MURATA MANUFACTURING CO., LTD. Patent applications |
Patent application number | Title | Published |
20160141839 | VERTICAL CAVITY SURFACE EMITTING LASER ARRAY - A VCSEL array includes a base substrate, VCSEL element columns arranged in a row direction (y direction) on a front-surface side of the base substrate and parallel wiring lines that connect the VCSEL element columns in parallel with each other. Each of the VCSEL element columns includes a plurality of VCSEL elements arranged in a column direction (x direction) and a plurality of series wiring lines. The plurality of series wiring lines serially connect every two VCSEL elements that are adjacent to each other in the column direction among the plurality of VCSEL elements in such an orientation that the forward directions of the two VCSEL elements match. Insulating grooves are formed on the base substrate. The insulating grooves electrically insulate the VCSEL element columns from each other. The insulating grooves electrically insulate the VCSEL elements from each other. | 05-19-2016 |
20160133732 | SEMICONDUCTOR DEVICE - In a bipolar transistor, a collector layer includes three semiconductor layers: an n-type GaAs layer (Si concentration: about 5×10 | 05-12-2016 |
20160133376 | MULTILAYER COIL - A coil is provided at a multilayer body including insulating layers stacked on one another. The coil includes linear conductors connected by via conductors to make a looped track when viewed from a layer stacking direction. The linear conductors include a first linear conductor contacting with an external electrode provided on the surface of the multilayer body, and a second linear conductor forming a half of the looped track. The first linear conductor includes a coil portion forming a part of the looped track. The second linear conductor is adjacent to the first linear conductor with one of the insulating layers in-between, and a first end of the second linear conductor is connected to a first end of the first linear conductor by a first via conductor. A second end of the second linear conductor does not overlap the first linear conductor when viewed from the layer stacking direction. | 05-12-2016 |
20160133374 | COMMON MODE CHOKE COIL - A common mode choke coil includes a laminated-type coil that has high breakdown voltage reliability. Coil conductors and a coil conductor for a secondary coil are laminated so as to be respectively interposed between, coil conductors for a primary coil, two coil conductors connected to each other by an inner circumferential side via hole conductor and two coil conductors connected by an inner circumferential side via hole conductor. Meanwhile, in the primary coil, an outer circumferential side via hole conductor is provided so as to pass through only one insulation layer, and accordingly, a length of the outer circumferential side via hole conductor in an axis line direction thereof is reduced. As a result, an amount of conductive material used for the outer circumferential side via hole conductor that diffuses during firing can be reduced, and a drop in a thickness of the insulation layers can be suppressed. | 05-12-2016 |
20160118809 | WIRELESS POWER TRANSMITTING APPARATUS AND WIRELESS POWER TRANSMISSION SYSTEM - A wireless power transmitting apparatus includes: a loop conductor for power transmission having an inductance; an inverter circuit configured to receive a DC voltage, convert the DC voltage into an AC voltage, and apply the AC voltage to the loop conductor; a capacitor connected between one end of the loop conductor and at least one end of the inverter circuit; and a metal layer covering one of the faces formed by the loop conductor farthest from a power receiving apparatus. | 04-28-2016 |
20160118184 | INDUCTOR - An inductor including: a core having a winding core portion for winding a winding wire and two flange portions disposed on both ends of the winding core portion; and a winding wire wound around the winding core portion for multiple layers, the winding wire including: a forward winding layer having multiple turns on the winding core portion along a forward direction from one of the two flange portions toward the other flange portion; a backward winding layer following the forward winding layer and having at least one turn on the forward winding layer along a backward direction opposite to the forward direction; and a return winding portion following the backward winding layer and passing over the backward winding layer in the forward direction to reach the winding core portion on the forward direction side of the forward winding layer within less than 1/2 turn. | 04-28-2016 |
20160118183 | COIL COMPONENT - A core of a coil component is formed of a first flange, a second flange, and a winding core connecting the first flange and the second flange to each other. A winding is wound around the winding core. The core is formed of a first part and a second part, the second part having a smaller magnetic permeability and a higher rigidity than the first part. The second part is formed of an end portion of the first flange on one side in an extension direction of the first flange and an end portion of the second flange on one side in an extension direction of the second flange. | 04-28-2016 |
20160111219 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A method for forming a conductor film, which allows the reduction in the thickness of a conductor film formed for an electronic component, and can form, at once, conductor films continuously extending over first and second surfaces of an electronic component which intersect one another. A component body is disposed to be opposed to a discharge nozzle for discharging an coating material which serves as a material for a conductor film, and the coating material charged by applying a voltage between the discharge nozzle and the component body ( | 04-21-2016 |
20160111204 | COMMON MODE CHOKE COIL - A common mode choke coil includes a core and a first winding, a second winding, and a third winding that are wrapped around the core. A number of turns in the third winding is less than a number of turns in the first winding and a number of turns in the second winding. | 04-21-2016 |
20160111195 | ELECTRONIC COMPONENT - An electronic component includes a body; a coil including a first coil conductor, a second coil conductor, and a via conductor; and an internal magnetic circuit provided on an inner peripheral side of the coil. The first coil conductor is formed of a plurality of straight portions and a plurality of arc-shaped portions and is substantially spiral shaped. A portion of the first coil conductor located furthermost toward the inner peripheral side is an arc-shaped first connection portion. The second coil conductor is formed of a plurality of straight portions and a plurality of arc-shaped portions and is substantially spiral shaped. A portion of the second coil conductor located furthermost toward the inner peripheral side is an arc-shaped second connection portion. An end of the via conductor is connected to the first connection portion and another end of the via conductor is connected to the second connection portion. | 04-21-2016 |
20160104565 | ELECTRONIC COMPONENT - An electronic component includes a body formed of an insulator, a coil positioned in the body and including first and second coil conductors, an outer electrode including a first bottom-surface electrode and a first substantially columnar electrode (first electrode) and connected to the second conductor, and an outer electrode including a second bottom-surface electrode and a second substantially columnar electrode (second electrode) and connected to the first conductor. The second conductor is positioned between the first conductor and a bottom surface of the body. The second electrode is positioned to oppose the first electrode across the coil's central axis when viewed from the z-axis direction. An outermost peripheral portion of the first conductor is superposed with the first electrode when viewed from the z-axis direction. A smallest distance between the first conductor and a first side surface is smaller than that between the second conductor and a second side surface. | 04-14-2016 |
20160099102 | ELECTRONIC COMPONENT - An electronic component has a laminated body, a circuit element disposed in the laminated body, an electrostatic discharge element disposed in the laminated body, a circuit-element external electrode electrically connecting the electrostatic discharge element and the circuit element, and a grounding external electrode connected to the electrostatic discharge element for electrically connecting the electrostatic discharge element to the ground. The electrostatic discharge element is disposed closer to a first end surface of the laminated body as compared to the circuit element. A height of the grounding external electrode at an end portion closer to the circuit element from the first end surface is lower than a height of the circuit element at an end portion closer to the grounding external electrode from the first end surface. | 04-07-2016 |
20160099098 | ELECTRONIC COMPONENT - An electronic component includes a body and a coil. The body includes first to fourth insulator layers composed of an anisotropic magnetic material, an internal magnetic circuit composed of an isotropic magnetic material and an external magnetic circuit composed of an isotropic magnetic material. The second and third insulator layers cover an upper surface and a lower surface of the coil from a z-axis direction. The internal magnetic circuit and the external magnetic circuit are adjacent to each other in a direction orthogonal to the z-axis direction. In addition, a direction of easy magnetization of the anisotropic magnetic material used in the first to fourth insulator layers is orthogonal to the z-axis direction. | 04-07-2016 |
20160093434 | MANUFACTURING METHOD FOR ELECTRONIC COMPONENT - An electronic component includes a multilayer body formed by laminating an insulator substrate and a plurality of insulator layers, a coil including coil conductors provided on the insulator substrate, and an internal magnetic path penetrating the insulator substrate. A manufacturing method for the electronic component includes: forming the coil conductors and a sacrificial conductor at the same time on a mother insulator substrate, which is the assemblage of a plurality of the insulator substrates; laminating insulator sheets, which are to be the corresponding insulator layers mentioned above, on the mother insulator substrate so as to cover the coil conductors; and exposing the sacrifice conductor by removing part of the insulator sheets. | 03-31-2016 |
20160086725 | COIL COMPONENT - A coil component includes two or more coils configuring a common mode choke coil and functions as an inductor against a normal mode AC current. A coil component includes a pot-type core formed in a box-like shape, a flat plate core, coils, and a partition core formed of a magnetic substance. The coils are accommodated inside the pot-type core and form a common mode choke coil by making the central axes thereof substantially match each other. Further, each of end portions of the coils function as outer electrodes. The partition core is provided between the coils. | 03-24-2016 |
20160083832 | THIN FILM FORMING METHOD - A compound thin film is obtained with a high deposition rate and consistent film quality in reactive sputtering. A thin film is formed by performing voltage monitoring control and gas flow rate monitoring control. The voltage monitoring control is control in which a gas flow rate is adjusted such that the value of a target voltage is brought closer to the value of a desired voltage by monitoring the target voltage in a first cycle time. The gas flow rate monitoring control is control in which the desired voltage for the target voltage is changed such that the value of the gas flow rate is brought closer to the value of a desired gas flow rate by monitoring the gas flow rate in a second cycle time. | 03-24-2016 |
20160079218 | ELECTROSTATIC PROTECTION DEVICE AND LIGHT-EMITTING MODULE - An electrostatic protection device includes a base member formed of a high-resistance semiconductor material. External connecting lands are formed on a first principal surface of the base member along a first direction with a space therebetween. A diode section is formed in the first principal surface of the base member through a semiconductor forming process. The diode section is formed between formation regions of the external connecting lands along the first direction. A high concentration region is a region that has the same polarity as the base member and contains larger amounts of impurities than the base member. The high concentration region is formed in a ring shape enclosing the diode section in a plan view of the base member. | 03-17-2016 |
20160070837 | INDUCTOR SIMULATION METHOD AND INDUCTOR NONLINEAR EQUIVALENT CIRCUIT MODEL - An inductor simulation method and nonlinear equivalent circuit model enabling dynamic simulation of nonlinear characteristics when a direct current is superimposed with high precision. An equivalent circuit of an inductor is represented using a series circuit of passive circuit elements. Characteristic change ratios of the passive circuit elements when a direct current is superimposed are expressed as an approximate function on the basis of actually measured values. A reference current measured by each of voltage source models is referred to by a control voltage source connected in series to the passive circuit elements. The characteristic change ratios are calculated in accordance with the reference current Iref. Difference voltages are generated on the basis of the characteristic change ratios and voltages occurring when no direct current is superimposed, they are superimposed on the voltages V | 03-10-2016 |
20160063159 | CAPACITOR SIMULATION METHOD AND CAPACITOR NONLINEAR EQUIVALENT CIRCUIT MODEL - A capacitor simulation method and nonlinear equivalent circuit model enabling dynamic simulation of nonlinear characteristics when direct-current voltage is applied with high precesion are easily provided using a simple configuration. An equivalent circuit of a capacitor is represented using a series circuit of passive circuit elements. Characteristic change ratios of the passive circuit elements when a direct-current voltage is applied are expressed as an approximate function on the basis of an actually measured value. A reference voltage is referred to by control current sources connected in parallel to the passive circuit elements. The characteristic change ratios are calculated in accordance with the reference voltage Vref. Difference currents are generated on the basis of the characteristic change ratios and currents flowing when no direct-current voltage is applied, they are caused to flow concurrently with the currents flowing when no direct-current voltage is applied, and thus the nonlinear characteristics are simulated. | 03-03-2016 |
20160059263 | ELECTRONIC COMPONENT MANUFACTURING METHOD AND FILM FORMING APPARATUS - An electronic component manufacturing method includes inserting an electronic component base body, which has a substantially rectangular parallelepiped shape and paired opposing end surfaces, paired opposing lateral surfaces connecting the end surfaces, and paired opposing principal surfaces perpendicular to the end surfaces and the lateral surfaces and connecting the end surfaces, in a receiving portion of a component holder. The receiving portion defining an accommodation space that is capable of receiving the electronic component base body, forming an oleophobic film over the surfaces of the electronic component base body by exposing the surfaces of the electronic component base body inserted in the receiving portion to gas containing an oleophobic material, taking out the electronic component base body, which includes the oleophobic film formed thereon, from the receiving portion, and forming outer electrodes on the electronic component base body having been taken out. | 03-03-2016 |
20160042862 | ELECTRONIC COMPONENT - An electronic component having; a multilayer body including insulating layers stacked on one another; a spiral coil including coil conductors provided on the insulating layers and a first via-hole conductor piercing through at least one of the insulating layers to connect the coil conductors to each other; a parallel conductor provided on one of the insulating layers; and a second via-hole conductor piercing through at least one of the insulating layers to connect the parallel conductor in parallel to one of the coil conductors provided on the insulating layer different from the insulating layer on which the parallel conductor is provided. A portion of the coil conductor not connected in parallel to the parallel conductor at least partly has a greater width than a portion of the coil conductor connected in parallel to the parallel conductor other than a contact point with the second via-hole conductor. | 02-11-2016 |
20160041223 | ELECTRONIC COMPONENT TESTING DEVICE - An electronic component testing device which is able to release heat (radiate heat) efficiently from a self-heating electronic component, and is able to carry out an intended test efficiently while keeping the temperature of the electronic component within a predetermined range higher than ordinary temperature. | 02-11-2016 |
20160020014 | LAMINATED COIL COMPONENT AND METHOD FOR MANUFACTURING IT - A laminated coil component has a laminated body which is formed by laminating a plurality of ferrite layers, a helical coil which is provided in the laminated body, and a plurality of external electrodes which are provided on the surface of the laminated body and are electrically connected to the helical coil and are mainly composed of Cu. The ferrite layers have an exposed region exposed from the surface of the laminated body without being covered with the external electrodes. A surface resistivity of the exposed region of the ferrite layers is more than 10 | 01-21-2016 |
20160006270 | WIRELESS POWER TRANSMISSION APPARATUS - A power transmitter and a power receiver are arranged with a space therebetween. A power transmitting device generates a resonant current by taking out electric energy from a DC power supply through an operation of a power transmitting switch circuit, directly creating, in a space, by using the resonant current, an electromagnetic field that periodically changes at a switching frequency, and forms an electromagnetic resonance field in which the space itself has energy and vibrates. A power receiving device generates a resonant current by obtaining electric energy from the resonance field and forms a new electromagnetic field on the basis of this resonant current. The power transmitting device or the power receiving device, when viewed as a geometric figure, is a fractal-shaped device formed of a line conductor pattern in which a portion is similar to the whole, and increases electromagnetic field energy in a space surrounding the fractal-shaped device. | 01-07-2016 |
20160005841 | HETEROJUNCTION BIPOLAR TRANSISTOR - A heterojunction bipolar transistor includes a collector layer composed of a semiconductor containing GaAs as a main component; a base layer including a first base layer and a second base layer the first base layer forming a heterojunction with the collector layer and being composed of a semiconductor containing a material as a main component, the material being lattice-mismatched to the main component of the collector layer, the first base layer having a film thickness less than a critical thickness at which a misfit dislocation is introduced, the second base layer being joined to the first base layer and composed of a semiconductor containing a material as a main component, and the material being lattice-matched to the main component of the collector layer; and an emitter layer that forms a heterojunction with the second base layer. | 01-07-2016 |
20150380823 | ANTENNA DEVICE AND MOBILE TERMINAL - The disclosure provides an antenna device and mobile terminal including such an antenna device. The antenna device includes a coil including a conductor wound around a plate-shaped magnetic core. A flat conductor is positioned adjacent to the coil, and the coil is positioned such that it is closer than the flat conductor to an antenna of a communication partner positioned near the antenna device. The coil conductor includes a first conductor portion adjacent to a first main surface of the magnetic core and a second conductor portion adjacent to a second main surface thereof. The magnetic core and the coil conductor form an antenna coil. A circuit substrate includes a ground electrode formation area and a ground electrode non-formation area. The antenna coil is mounted on the ground electrode non-formation area of the circuit substrate with the first main surface of the magnetic core facing the circuit substrate. | 12-31-2015 |
20150380822 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - The disclosure provides an antenna device and communications terminal including such an antenna device. The antenna device includes a coil including a conductor wound around a plate-shaped magnetic core. A flat conductor is positioned adjacent to the coil, and the coil is positioned such that it is closer than the flat conductor to an antenna of a communication partner positioned near the antenna device. The coil conductor includes a first conductor portion adjacent to a first main surface of the magnetic core and a second conductor portion adjacent to a second main surface thereof. A circuit substrate includes a ground electrode formation area and a ground electrode non-formation area. The antenna coil is mounted on the ground electrode non-formation area of the circuit substrate with the first main surface of the magnetic core facing the circuit substrate. | 12-31-2015 |
20150377833 | Method of Identifying Direction of Multilayer Ceramic Capacitor, Apparatus Identifying Direction of Multilayer Ceramic Capacitor, and Method of Manufacturing Multilayer Ceramic Capacitor - A method of identifying a direction of a multilayer ceramic capacitor includes the steps of transporting a plurality of multilayer ceramic capacitors in one line before each of a magnetism generator and a magnetic flux density measurement instrument, measuring a magnetic flux density with the magnetic flux density measurement instrument at the time when each of the plurality of multilayer ceramic capacitors passes before the magnetic flux density measurement instrument, and identifying a direction of stack of the multilayer ceramic capacitors based on the magnetic flux density measured in the step of measuring a magnetic flux density. | 12-31-2015 |
20150371757 | ELECTRONIC COMPONENT - A multilayer body is a lamination of a plurality of substantially rectangular insulating layers and has a bottom surface being a series of the outer edges of the insulating layers, an end surface being adjacent to the bottom surface and being a series of the outer edges of the insulating layers, and a side surface located on a negative side in the y-axis direction. An outer electrode is embedded in the multilayer body such that it is exposed while extending across the boundary between the bottom surface and the end surface. A coil is disposed in the multilayer body and is connected to the outer electrode. The distance between the outer electrode and the side surface in the corner between the bottom surface and the end surface is longer than the distance between the outer electrode and the side surface where the outer electrode and the coil are connected. | 12-24-2015 |
20150362647 | DISPLAY DEVICE AND LAMINATED OPTICAL FILM - Provided is a display device containing a crystalline piezoelectric polymer layer having a helical chiral polymer (A) that has a weight average molecular weight of from 50,000 to 1,000,000 and has optical activity, an optical compensation layer satisfying the following expression (1), and a linear polarizer. In expression (1), Xc represents a degree of crystallinity (%) of the crystalline piezoelectric polymer layer obtained by a DSC method; MORc represents a standardized molecular orientation of the crystalline piezoelectric polymer layer measured by a microwave transmission molecular orientation meter when a reference thickness is 50 μm; d represents a thickness (μm) of the crystalline piezoelectric polymer layer; and Rth represents a phase difference (nm) in a thickness direction of the optical compensation layer at a wavelength of 550 nm. | 12-17-2015 |
20150357735 | CONNECTOR SET AND CONNECTOR - An outer peripheral surface of a first anchoring terminal has a first surface facing one side of a second direction and a second surface facing one side of a third direction in a first corner portion, and a third surface facing the other side of the second direction and a fourth surface facing the other side of the third direction in a second corner portion. An inner peripheral surface of a second anchoring terminal has a fifth surface facing the other side of the second direction and a sixth surface facing the other side of the third direction in the first corner portion, and a seventh surface facing the one side of the second direction and an eighth surface facing the one side of the third direction in the second corner portion. The first to fourth surfaces make contact with the fifth to eighth surfaces, respectively. | 12-10-2015 |
20150357729 | CONNECTOR SET AND CONNECTOR - A connector set includes a first connector and a second connector. The first connector has a plurality of first connection terminals, a first anchoring terminal, and a first insulative member, and the second connector has a plurality of second connection terminals, a second anchoring terminal, and a second insulative member. When the first connector and the second connector are coupled, the plurality of first connection terminals and the plurality of second connection terminals respectively make contact at the first contact portions and the second contact portions. The first anchoring terminal and the second anchoring terminal make contact with each other to maintain the coupling between the first connector and the second connector, and have a ring shape that encircles a periphery of the first contact portions and the second contact portions when the first connector and the second connector are coupled. | 12-10-2015 |
20150357114 | ELECTRONIC COMPONENT - To restrict a phenomenon that the direct-current resistance value after firing is larger than the direct-current resistance value before firing in an electronic component in which a conductor formed of a wire rod is embedded in a ceramic sintered compact. An electronic component | 12-10-2015 |
20150349100 | BIPOLAR TRANSISTOR - P-type second semiconductor layers each interposed between a corresponding pair of n-type first semiconductor layers reduce the apparent doping concentration in the entire collector layer without reducing the doping concentrations in the first semiconductor layers. This improves the linearity of capacitance characteristics and enables sufficient mass productivity to be achieved. Interposing each of the second semiconductor layers between the corresponding pair of the first semiconductor layers reduce the average carrier concentration over the entire collector layer, which allows a wide depletion layer to be formed inside the collector layer and, as a result, reduces base-collector capacitance. | 12-03-2015 |
20150348713 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - A ceramic electronic component which is easily downsized, has reduced difficulty in handling, and is hardly chipped in a chip; and a method for producing the ceramic electronic component. The method includes the steps of: forming an uncured ceramic pattern which forms a ceramic layer after firing and has a circular plane shape by applying a ceramic slurry, which contains a ceramic material, to a predetermined location one time or a plurality of times repeatedly using a non-contact-type printing device such as an ink-jet printer; and forming uncured internal electrode patterns which form internal electrodes after firing and each have a circular plane shape by applying an electrode paste, which contains an internal electrode material, to a predetermined location one time or a plurality of times repeatedly using an ink-jet printer. | 12-03-2015 |
20150340764 | ANTENNA - An antenna includes antenna coil having a magnetic-material core and a coil conductor. The antenna coil is arranged toward a side of a planar conductor, such as a circuit board. Of the coil conductor, a first conductor part close to a first main face of the magnetic-material core and a second conductor part close to a second main face of the magnetic-material core are provided such that the first conductor part is not over the second conductor part in view from a line in a direction normal to the first main face or the second main face of the magnetic-material core. In addition, a coil axis of the coil conductor is orthogonal to the side of the planar conductor. | 11-26-2015 |
20150333801 | WIRELESS POWER SUPPLY APPARATUS - A power transmitter coil, a power transmitter circuit, and a direct-current power source constitute a power transmitter unit. Further, a power receiver coil, a power receiver circuit, and a load constitute a power receiver unit. Further, a resonator coil and a resonator circuit constitute a resonator unit. In the power transmitter unit, electric energy of the direct-current power source is directly converted into electromagnetic energy, a resonant field is expanded by making resonance currents of the same frequency to flow in the power transmitter coil and the resonator coil, and in the power receiver unit, electromagnetic energy of the resonant field is directly converted into electric energy, thereby transmitting electric power from the power transmitter unit to the power receiver unit. | 11-19-2015 |
20150331010 | ACCELERATION SENSOR - An acceleration sensor includes weights, a support, and beams on which piezoresistive elements are disposed. The weights include projections and recesses. The support includes projections and recesses. The beams are connected to the projections and the recesses. The beams are connected to the recesses and the projections. The beams are connected to the recesses and the projections. | 11-19-2015 |
20150318778 | INRUSH CURRENT CONTROL DURING STARTING OF RESONANT CONVERTERS - A converter with soft start includes a transformer; first and second switches connected to the transformer to supply power to the transformer; a controller connected to the first and second transistors and arranged to, during startup of the converter, switch the first switch with a variable duty cycle and switch the second switch with either a fixed duty cycle or a variable duty cycle with pulses larger than pulses of the variable duty cycle of the first switch; and a bleed device arranged to set initial conditions of the converter before startup of the converter by discharging a capacitor in the converter before startup. | 11-05-2015 |
20150311881 | ANTENNA DEVICE - A stray capacitance is generated between an antenna element and a ground electrode. A capacitance detection circuit detects the stray capacitance. An antenna matching circuit, is provided along a wireless communication signal path, which is a transmission path between the antenna element and a feeder circuit. A feedback control circuit transmits a control signal to the variable matching circuit on the basis of a detection result of the capacitance detection circuit in accordance with the stray capacitance. The capacitance detection circuit includes a constant current source and a timing circuit to measure the time taken to charge the antenna from the constant current source and for the voltage to reach a predetermined voltage. | 10-29-2015 |
20150311675 | VERTICAL-CAVITY SURFACE-EMITTING LASER - Provided are a base substrate made of a semi-insulating semiconductor; an emission region multilayer unit formed on a surface of the base substrate and including each of an N-type semiconductor contact layer, an N-type DBR layer, an active layer, a P-type semiconductor DBR layer, and a P-type semiconductor contact layer; an anode electrode connected to the P-type semiconductor contact layer; and a cathode electrode formed on a surface side of the base substrate and connected to the N-type semiconductor contact layer. The N-type DBR layer is formed of 15 or more pairs of layers with different compositions laminated on each other. Through this configuration, a vertical-cavity surface-emitting laser that can suppress an occurrence of a defect caused by crystal missing arising from the base substrate can be provided at reduced cost. | 10-29-2015 |
20150302980 | COMPOSITE ELECTRONIC COMPONENT - A composite electronic component with a built-in coil is provided which can be produced inexpensively, which can effectively increase insulating reliability, and which has the antistatic function. Coil wirings are disposed inside a sintered body that is formed by stacking a plurality of ferrite layers, which are fired as an integral unit. Voltage nonlinear members are incorporated in the sintered body at a different height position from those of the coil wirings. First inner electrodes and second inner electrodes are disposed in opposing relation with the voltage nonlinear members interposed therebetween. A magnetic circuit forming portion is constituted by a part of the ferrite layers and the coil wirings in a portion in which the coil wirings are arranged, and an antistatic portion is constituted in a portion in which the remaining ferrite layers, the voltage nonlinear members, and the first and second inner electrodes are arranged. | 10-22-2015 |
20150294780 | LAMINATED COIL COMPONENT AND METHOD FOR PRODUCING SAME - A laminated coil component includes a magnetic material part containing a metal magnetic material and a first glass component, and a nonmagnetic material part containing a ceramic material and a second glass component, and a coil conductor is formed so that at least the main surface of a coil pattern is in contact with the nonmagnetic material part. The magnetic material part is formed with the volume content of the first glass component based on the total amount of the metal magnetic material and the first glass component is 46 to 60 vol %. The nonmagnetic material part is formed with the volume content of the second glass component based on the total amount of the ceramic material and the second glass component is 69 to 79 vol %. A laminated coil component having good high-frequency characteristics and magnetic characteristics is obtained and a method for producing the laminated coil component. | 10-15-2015 |
20150280545 | SOFT-START FOR RESONANT CONVERTERS - A start-up circuit for a resonant converter is arranged such that, during start-up of the resonant converter, the start-up circuit provides a drive signal that is to be applied to a switching transistor of the resonant converter and that has a variable duty cycle and a variable frequency. A converter includes a voltage source, a capacitor connected to the voltage source, a first switching transistor connected to the voltage source, a transformer connected to the capacitor, and a start-up circuit arranged to drive the first switching transistor with the drive signal during start-up of the converter. A start-up method for a resonant converter including a first switching transistor includes driving the first switching transistor with a variable duty cycle and a variable frequency. | 10-01-2015 |
20150270056 | LAMINATED COIL COMPONENT - A laminated coil component that can use inexpensive copper as an internal conductor, and has excellent direct current superimposition characteristics is provided. In a laminated coil component including: a magnetic section including a ferrite material; a non-magnetic section including a non-magnetic ferrite material; and a coiled conductor section containing copper as a main component embedded inside the magnetic section and the non-magnetic section, the non-magnetic section contains at least Fe, Mn and Zn, and optionally Cu. The non-magnetic section has a Fe content of 40.0 mol % to 48.5 mol % in terms of Fe | 09-24-2015 |
20150263413 | ANTENNA DEVICE AND MOBILE TERMINAL - This disclosure provides an antenna device and a mobile terminal equipped with the antenna device. The antenna device includes a coil conductor spirally wound to have a conductor opening portion at the center of winding and is formed on a flexible substrate. A magnetic sheet is disposed near, or proximal to the flexible substrate and between the coil conductor and a flat conductor of a circuit board. A side of the antenna coil that is near an edge of the flat conductor is bent toward the circuit board. | 09-17-2015 |
20150251860 | CONVEYING APPARATUS - A conveying apparatus includes first, second, and third conveying sections, and a controller. The first and second conveying sections include first and second conveying mechanisms configured to convey workpieces at first and second speeds, respectively. The third conveying section includes a third conveying mechanism, a rotation mechanism, and a first sensor. The third conveying mechanism is in a form of a slide and positioned between the first and second conveying mechanisms. The third conveying mechanism is configured to allow the workpieces dropped thereon from the first conveying mechanism to slide to be transferred onto the second conveying mechanism. The rotation mechanism is configured to turn the third conveying mechanism about a rotation shaft. The first sensor is configured to detect first information indicating that the workpieces have passed the second end portion of the third conveying mechanism. The controller is coupled to the first sensor and the rotation mechanism. | 09-10-2015 |
20150247984 | OPTICAL TRANSMISSION MODULE AND METHOD OF MANUFACTURING OPTICAL TRANSMISSION MODULE - A method of manufacturing an optical transmission module includes temporary disposing, measuring, and placing steps. The temporary disposing step includes temporarily disposing a light-emitting-element receptacle over a mounting substrate so that a lens of the light-emitting-element receptacle and a light emitting element array face each other. The measuring step includes measuring the position of a light spot at which light emitted from the light-emitting element array emerges from the emergence surface of the light-emitting-element receptacle. The placing step includes placing the light-emitting-element receptacle over the mounting substrate on the basis of information on the position of a designed intersection point of the optical axis of an optical cable with the emergence surface of the light-emitting-element receptacle, and information on the position of the light spot. | 09-03-2015 |
20150235765 | INDUCTOR MANUFACTURING METHOD - An inductor manufacturing method includes a first step of press bonding a Cu foil onto a non-magnetic resin sheet, a second step of forming a conductor pattern by performing etching on the Cu foil, a third step of press bonding another non-magnetic resin sheet onto the conductor pattern, and a via conductor formation step of forming a via conductor that penetrates through the other resin sheet and leads to the conductor pattern. The method further includes a step of forming a body in which resin having magnetism is provided outside of a coil, by press bonding magnetic-powder-containing resin sheets onto a multilayer body, obtained by a manufacturing method including the first to third steps and the via conductor formation step, and then thermally curing the magnetic-powder-containing resin sheets. | 08-20-2015 |
20150228396 | INDUCTOR - An inductor includes a multilayer body, which is composed of a non-magnetic material and a magnetic material, and a coil. An inner circumferential surface of the coil is covered by non-magnetic material layers. The sum of the width of a coil conductor forming part of the coil and the width of a non-magnetic material layer covering an inner circumferential side of the coil conductor that are located in a center portion of the coil in a z-axis direction is larger than the sum of the width of a coil conductor forming part of the coil and the width of a non-magnetic material layer covering the coil conductor that are located in an end portion of the coil on the positive side in the z-axis direction. | 08-13-2015 |
20150226624 | PRESSURE SENSOR - A microelectromechanical pressure sensor structure wherein the length of the diaphragm is at least three times the width of the diaphragm. The oblong diaphragm experiences a minimized difference between lateral bending of the wafer and of the diaphragm along the width of the diaphragm. In a perpendicular direction, the diaphragm is at least three times longer due to which it accurately aligns with the bending form of the wafer. Due to this, the total error caused by bending of the structure is significantly reduced and a more robust structure is achieved. At the same time, the longer diaphragm provides mode deflected area for detection and thus significantly improves sensitivity of the device. | 08-13-2015 |
20150224762 | PRINTING METHOD AND PRINTING DEVICE - A printing method and a printing device, in which printing quality can be maintained without increasing time necessary for printing even if resolution is enhanced. In the printing method, a reference signal is sent at intervals shorter than a minimum time interval at which an ink head provided with plural nozzles can eject ink, at least two reference signals set longer than the minimum time interval are counted as one count, the ink is ejected every one count, and a print pattern is formed by collectivity of the ejected ink. At least a final one count used to form the print pattern is adjusted so as to be lengthened by one or plural reference signals, and the ink is ejected every one count. | 08-13-2015 |
20150214788 | WIRELESS POWER TRANSFER APPARATUS - A power sending loop coil disposed in a power sending device takes out electric energy from DC power and generates periodically-varying electromagnetic field resonance energy in a space. A power receiving loop coil disposed in a power receiving device takes out, as electric energy, the periodically-varying electromagnetic field resonance energy from the space and supplies electric power to a load. The power sending loop coil and the power receiving loop coil are coupled to each other through electromagnetic field resonant coupling, whereby electric power is wirelessly transferred from the power sending device to the power receiving device. | 07-30-2015 |
20150213947 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminate has a structure in which magnetic layers and a non-magnetic layer containing glass are stacked. A coil is incorporated in the laminate. The magnetic permeability μ2 in portions (low-magnetic-permeability portions), of the magnetic layers, which are adjacent to the non-magnetic layer and into which the glass diffuses is lower than the magnetic permeability μ1 in portions (high-magnetic-permeability portions), of the magnetic layers, which are not adjacent to the non-magnetic layer. | 07-30-2015 |
20150207278 | COAXIAL CONNECTOR PLUG - A coaxial connector plug includes a first outer conductor with a cylinder shape extending in a first direction, a first center conductor that has a cylinder shape extending in the first direction and is provided inside the first outer conductor, and an insulation member that fixes the first center conductor to the first outer conductor. In the coaxial connector plug, a communication section to cause the inside and the outside of the first center conductor to communicate with each other is provided in an end portion of the first center conductor on one side in the first direction. A width of the communication section in a second direction orthogonal to the first direction becomes larger as it progresses from the one side toward the other side of the first direction, and the insulation member penetrates from the outside to the inside of the first center conductor through the communication section. | 07-23-2015 |
20150162689 | COAXIAL CONNECTOR - A coaxial connector is manufactured to have a structure in which a first resin member is not easily separated from an external terminal. A coaxial connector according to the present disclosure includes a first resin member, a second resin member attached to the first resin member, a fixed terminal and a movable terminal disposed between the first resin member and the second resin member, and an external terminal attached to outer peripheries of the first resin member and the second resin member. The external terminal includes a cylindrical accommodating portion that accommodates the first resin member, and the first resin member includes a resin engagement portion. The resin engagement portion is engaged with the accommodating portion, so that separation of the first resin member is prevented. | 06-11-2015 |
20150162523 | PIEZOELECTRIC DEVICE - A piezoelectric device that includes: a diaphragm; a supporting part configured to support at least a portion of an end of the diaphragm; a piezoelectric film disposed along a portion supported by the supporting part on the diaphragm, a width of the film along the supported portion being narrower than a width of the portion; a lower electrode disposed at a face of the piezoelectric film on a diaphragm side; and an upper electrode disposed on a face of the piezoelectric film on an opposite side to the diaphragm. | 06-11-2015 |
20150162126 | COMMON MODE CHOKE COIL AND MANUFACTURING METHOD THEREOF - A common mode choke coil has a core including a winding base, and a first and a second wire wound around the winding base side by side. The winding base includes a first area and a second area. The first area is from a first end of a region where the first wire is in contact with the winding base to a first point in the region. The second area is from a second end, which is opposite to the first end, of the region to a second point in the region. The second area does not overlap with the first area. When the first and second wires on a same turn are compared with each other, in the first area, the first wire is located nearer the first end, and in the second area, the first wire is located nearer the second end. | 06-11-2015 |
20150155850 | ELASTIC WAVE FILTER DEVICE AND DUPLEXER - In an elastic wave filter device, an elastic wave filter element chip is mounted on a board. In the elastic wave filter element chip, a ladder filter including a plurality of series arm resonators and a plurality of parallel arm resonators are provided. In/on the board, a first inductor connected in parallel to the series arm resonator and a second inductor connected between the parallel arm resonators P | 06-04-2015 |
20150151926 | CONVEYING SYSTEM - A conveying system includes a first belt conveyor; a second belt conveyor; a workpiece guide that includes guide paths that receive workpieces that have fallen from a downstream end portion of the first belt conveyor one by one and then guide the workpieces to an upstream end portion of the second belt conveyor; a rotary mechanism that displaces the downstream end portion along a substantially arc-shaped trajectory to distribute the workpieces that have fallen from the downstream end portion into the guide paths; a first sensor that detects first information that represents that one of the workpieces has fallen from the downstream end portion; and a controlling device that controls an operation of the rotary mechanism. The controlling device controls the rotary mechanism by transmitting an operation command to the displacement mechanism to intermittently displace the downstream end portion by a predetermined distance in response to first information. | 06-04-2015 |
20150138030 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - An antenna device includes a first insulating base portion including a spiral antenna pattern, and a second insulating base portion including at least two conductor wires. An insulating layer configured to insulate the conductor wires from the antenna pattern is provided between a first end and a second end of the antenna pattern in a planar view. The insulating layer includes a cut or an opening allowing at least one of the first end and the second end of the antenna pattern to be exposed toward the conductor wires. Electrode portions of the conductor wires are electrically and mechanically connected to the first end and the second end, respectively, of the antenna pattern by a conductive material in the cut or the opening of the insulating layer. The second insulating base portion is more flexible than the first insulating base portion. | 05-21-2015 |
20150137138 | TRANSISTOR AND METHOD FOR PRODUCING TRANSISTOR - A transistor that offers a high dielectric breakdown voltage of a gate insulating film with limited reduction of the current flowing between drain and source electrodes. The transistor has a semiconductor layer, a gate insulating film on the semiconductor layer, a gate electrode on the gate insulating film, and a source electrode and a drain electrode disposed on the semiconductor layer with the gate electrode therebetween. The concentration of the impurities contained in the gate insulating film is on a downward gradient starting at the surface of the gate insulating film on the semiconductor layer side and ending at the surface of the gate insulating film on the gate electrode side. | 05-21-2015 |
20150131822 | Plane-Type Speaker and AV Apparatus - A plane-type speaker where, on one of the main surfaces of an exciter film, there are placed piezoelectric films which are expanded and contracted by sound-releasing driving signals applied thereto. An oscillation plate is secured to the excited film through frame members. The oscillation plate has a flat-plate shape and is secured to the exciter film while having a warped shape such that it is gradually spaced further away from the exciter film, with decreasing distance from the secured ends to a center area, when viewed at a side surface. This realizes a state where the exciter film is pulled outwardly with respect to the secured ends due to bending stresses therein. If sound-releasing driving signals are applied to the piezoelectric films in this state, the exciter film contracts and expands along with the expansion and contraction of the piezoelectric films, thereby causing the oscillation plate to oscillate. | 05-14-2015 |
20150130683 | HIGH-FREQUENCY TRANSMISSION LINE AND ANTENNA DEVICE - An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band. | 05-14-2015 |
20150118900 | COAXIAL CONNECTOR PLUG - A coaxial connector plug includes a first outer conductive unit that includes a first outer conductor that has a substantially ring-like shape in a portion of which a cutting portion is formed when viewed in plan and first and second outer terminals that are drawn out downwardly from the first outer conductor and a first central conductive unit that includes a first central conductor disposed in an area surrounded by the first outer conductor when viewed in plan. The first and second outer terminals are disposed, when viewed in plan from above, further toward the side on which the cutting portion is formed than a second line with the cutting portion interposed between the first and second outer terminals, the second line being perpendicular to a first line, which connects the center of the first outer conductor and the cutting portion, and passing through the center. | 04-30-2015 |
20150113801 | METHOD FOR MANUFACTURING GRAVURE PLATE, GRAVURE PRINTING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A method for manufacturing a gravure plate includes, setting a certain measurement area on a surface of the gravure plate, finding at least one of a spatial volume that is the total of the volume of a space formed by a plurality of cells located in the measurement area and an average depth obtained by dividing the spatial volume by a surface area of the measurement area, and adjusting, based on a relationship between at least one of the spatial volume and the average depth and an application thickness of a printing material after printing, at least one of the spatial volume and the average depth so as to fall within at least one of a specified value range for the spatial volume and a specified value range for the average depth determined in accordance with a target value range for the application thickness. | 04-30-2015 |
20150113780 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT - A method of manufacturing an electronic component includes the steps of: preparing a first block formed by stacking a plurality of green sheets serving as an element body; cutting the first block in a first direction into a plurality of second blocks such that a portion of an internal conductor connected to an external electrode is exposed at a cut surface; and cutting each of the plurality of second blocks in a second direction crossing the first direction such that the internal conductor exposed at each of both cut surfaces is located in the center of a portion serving as each element body in the first direction in each of the plurality of second blocks. | 04-30-2015 |
20150108998 | COAXIAL CONNECTOR - A coaxial connector including a connector main body is formed of an upper housing and a lower housing. An outer conductor includes a circular cylinder portion surrounding the periphery of a hole of the connector main body and configured to be inserted into an outer conductor of a mating coaxial connector. A main body portion is provided on the connector main body, and a fixation portion that is extended from the main body portion so as to sandwich the connector main body along with the main body portion. A fixed terminal is anchored to the connector main body. A movable terminal includes a fixation portion anchored to the connector main body, and a plate spring that extends from the fixation portion toward the fixed terminal and overlaps with the fixation portion at tip ends of the plate spring. | 04-23-2015 |
20150108533 | LIGHT-EMITTING DEVICE - A drop in the luminous efficiency of a light-emitting element and the occurrence of mounting problems for the light-emitting element can be prevented even in a configuration in which an ESD protection element is provided within a mounting substrate. A light-emitting device includes a light-emitting element and a mounting substrate, having a first surface on which the light-emitting element is mounted and a second surface that is opposite from the first surface, that includes a semiconductor-based electrostatic discharge protection element portion that is provided on the second surface side and is connected to the light-emitting element. | 04-23-2015 |
20150108393 | SINTERED BODY AND INDUCTOR - A sintered body contains Z-type hexagonal ferrite, Bi | 04-23-2015 |
20150107473 | GRAVURE PRINTING PLATE AND MANUFACTURING METHOD THEREOF, GRAVURE PRINTING MACHINE, AND MANUFACTURING METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT - Banks, as well as a plurality of recess-shaped cells defined by the banks, are provided in an image section formed in a gravure printing plate. A projecting portion is provided in each of the cells so as to protrude from a part of the base surface of that cell. The projecting portions are in positions distanced from the banks. Like the banks, the projecting portions can serve as starting points for the transfer of a printing paste. Accordingly, printing paste that would, in the case where the projecting portions are not provided, remain in the bases of the cells is transferred to the printing target material via the projecting portions, which increases the transfer efficiency. As a result, a paste film that is smooth and has the required thickness can be printed. | 04-23-2015 |
20150107472 | GRAVURE PRINTING PLATE AND MANUFACTURING METHOD THEREOF, GRAVURE PRINTING MACHINE, AND MANUFACTURING METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT - Banks, as well as a plurality of substantially recess-shaped cells defined by the banks, are provided in an image section formed in a gravure printing plate. Each of edge cells located along an outer edge of the image section is provided with a projecting portion that projects from a part of a base surface of that edge cell, and each projecting portion is distanced from the banks and located closer to the outer edge than the center of the corresponding edge cell. Preferably, the projecting portions and the banks that face the outer edge are positioned at a predetermined interval from the outer edge, and substantially frame-shaped recess portions that extend continuously along the outer edge are provided in the image section. | 04-23-2015 |
20150099115 | MAGNETIC MATERIAL COMPOSITION AND COIL COMPONENT - A magnetic material composition includes: magnetic alloy particles such as Fe—Si—Cr or Fe—Si—Al based particles, with a passivation film formed on the surfaces of the particles; and a glass constituent that contains Si, B, and an alkali metal such as K, Na, and Li, and has a softening point of 650 to 800° C. The content of the glass constituent is 12 to 32 wt % with respect to the total of the magnetic alloy particles and the glass constituent. A glass phase formed from the glass constituent is formed between the magnetic alloy particles. A component body with a coil conductor buried therein is formed from the magnetic material composition. Thus, ingress of moisture and plating solutions between the magnetic alloy particles can be suppressed so that favorable insulation performance can be ensured without impairing any magnetic property. | 04-09-2015 |
20150097648 | COMPOSITE ELECTRONIC COMPONENT AND COMPOSITE ELECTRONIC COMPONENT MANUFACTURING METHOD - A composite electronic component includes a multilayer body, coils, an antistatic element and outer electrodes. The multilayer body is configured by laminating insulator layers. The coils are provided on the upper surfaces of the insulator layers. The antistatic element is connected to the coils and includes ground electrodes. The outer electrodes are connected to the coils. The upper surfaces of the insulator layers on which the coils are provided do not intersect with the ground electrodes. | 04-09-2015 |
20150097006 | BONDING MATERIAL APPLYING APPARATUS AND BONDING MATERIAL APPLYING METHOD - A bonding material applying apparatus includes a syringe in which a bonding material is filled. The syringe includes a discharge nozzle disposed at a tip thereof to discharge the bonding material filled in the syringe. A compressed air supply mechanism supplies compressed air to the syringe and discharges the bonding material from the discharge nozzle. When a discharge interval from the end of discharge to the start of discharge of the bonding material lasts for a certain time or longer, the compressed air supply mechanism supplies the compressed air for a time, which is shorter than a discharge time necessary to discharge the bonding material, to such an extent that the bonding material is substantially not discharged. | 04-09-2015 |
20150091685 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component includes a first magnetic substrate provided with a first notch portion and a second notch portion, a multilayer body, a coil which includes a coil portion, a first lead portion, and a second lead portion. The first lead portion and the second lead portion are connected to the two end portions of the coil portion and overlap the first notch portion and the second notch portion, respectively. The electronic component further includes a first outer electrode and a second outer electrode, a first connection portion and a second connection portion which connect the outer electrodes to the lead portions. Particles are disposed at joint portions of the lead portions and the connection portions and have a coefficient of linear expansion smaller than the coefficients of linear expansion of the first lead portion, the second lead portion, the first connection portion, and the second connection portion. | 04-02-2015 |
20150090834 | COIL COMPONENT - A coil component has a core including a winding core extending in a predetermined direction, and a winding wrapped around the winding core in two or more layers. A first winding portion at one end in the predetermined direction in an (n+1)'th layer of the winding, where n is a natural number, is positioned over a space between second and third winding portions in an n'th layer, the second and third winding portions being adjacently spaced in the predetermined direction. | 04-02-2015 |
20150084090 | MOUNTING SUBSTRATE AND LIGHT EMITTING DEVICE - External connection conductors are arranged on a back surface of a base material, and wiring conductors are arranged on a front surface. An insulating layer is provided on surfaces of the wiring conductors. Component mounting conductors are provided on a surface of the insulating layer. The component mounting conductor and the wiring conductor are electrically coupled to each other, and the component mounting conductor and the wiring conductor are electrically coupled to each other. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between forming areas of the component mounting conductors. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between the forming areas of the component mounting conductors. | 03-26-2015 |
20150083315 | METHOD AND DEVICE FOR MANUFACTURING CAPACITOR ELEMENT - A method for manufacturing a capacitor element includes singulating a mother block into a plurality of laminate blocks having a shape of an elongated, substantially rectangular parallelepiped, by dividing the mother block in rows; rolling each of the plurality of laminate blocks; and singulating each of the plurality of laminate blocks into a plurality of laminate chips having a shape of a substantially rectangular parallelepiped, by dividing the plurality of laminate blocks after rolling in columns. The step of rolling each of the plurality of laminate blocks includes the step of moving the plurality of laminate blocks placed on a stage, along a direction in which the plurality of laminate blocks are arranged side by side, thereby sequentially pushing each of the plurality of laminate blocks to an end portion of the stage and causing each of the plurality of laminate blocks to rotationally fall from the end portion. | 03-26-2015 |
20150077960 | LOW-TEMPERATURE PACKAGING METHODOLOGY FOR ELECTRONIC DEVICES AND OTHER DEVICES - A method includes depositing a metal seal material onto a first component of a protective module. The method also includes placing a second component of the protective module into contact with the metal seal material. The components of the protective module define a cavity configured to hold one or more devices. The method further includes heating the metal seal material to create a metal seal between the components of the protective module. In addition, the method includes depositing an outer metal material over and in contact with the metal seal. Heating the metal seal material to create the metal seal could include performing an anneal process with a peak temperature of about 150° C. to about 200° C. The method could optionally include alloying part of the metal seal with part of the outer metal material to create alloyed regions between the components of the protective module. | 03-19-2015 |
20150077210 | FERRITE CERAMIC COMPOSITION, CERAMIC ELECTRONIC COMPONENT, AND PROCESS FOR PRODUCING CERAMIC ELECTRONIC COMPONENT - This disclosure provides a ferrite ceramic composition, a ceramic electronic component including the ceramic composition, and a process of producing a ceramic electronic component including the ferrite ceramic composition, of which the insulation performance can be secured even when fired simultaneously with a metal wire material containing Cu as the main component, and which can have good electric properties. The ferrite ceramic composition includes an Ni—Mn—Zn-based ferrite having a molar content of CuO of 5 mol % or less and in which, when the molar content (x) of Fe | 03-19-2015 |
20150070107 | HIGH FREQUENCY MODULE - Provided is a high frequency module capable of reducing size and cost. A high frequency module includes an LC filter having an inductor formed through a thin film process and a capacitor also formed through a thin film process, and a piezoelectric resonator that is connected in series to the LC filter and serves as a trap filter having a resonant frequency at the outside of a passing band of the LC filter. | 03-12-2015 |
20150070103 | NON-RECIPROCAL CIRCUIT ELEMENT - A non-reciprocal circuit element includes a permanent magnet, a microwave magnetic body to which a direct current magnetic field is applied by the permanent magnet, a first center electrode that is wrapped around the microwave magnetic body, is connected at one end to an input port, and is connected at another end to an output port, a second center electrode that is wrapped around the microwave magnetic body while intersecting with the first center electrode so as to be insulated from the first center electrode, is connected at one end to the output port, and is connected at another end to a ground port, a first matching capacitance connected between the input port and the output port in parallel with the first center electrode, a terminating resistance connected between the input port and the output port in parallel with the first center electrode, and a second matching capacitance connected between the output port and the ground port. A sub-center electrode is connected in parallel to a portion of the second center electrode. | 03-12-2015 |
20150063394 | VERTICAL-CAVITY SURFACE-EMITTING LASER DEVICE AND VERTICAL-CAVITY SURFACE-EMITTING LASER ARRAY DEVICE - A cathode electrode, cathode pad electrodes, cathode wiring electrodes, an anode electrode, an anode pad electrode, and an anode wiring electrode are disposed on the surface of a vertical-cavity surface-emitting laser device. A light-emitting-region multilayer portion having active layers sandwiched by clad layers and DBR layers is formed directly below the anode electrode. A region where the light-emitting-region multilayer portion is formed serves as a light-emitting region. The light-emitting region is positioned closer to one end of the first direction than is a suction region onto which a flat collet sucks with respect to the first direction, in such a way that the light-emitting region is substantially in contact with or spaced a predetermined distance from the suction region. | 03-05-2015 |
20150063393 | VERTICAL CAVITY SURFACE EMITTING LASER - A vertical cavity surface emitting laser includes a base substrate formed by a semi-insulating semiconductor, a light-emitting region multilayer portion including an N-type semiconductor contact layer, an N-type semiconductor multilayer-film reflecting layer, an N-type semiconductor clad layer, an active layer provided with a quantum well, a P-type semiconductor clad layer, a P-type semiconductor multilayer-film reflecting layer, and a P-type semiconductor contact layer, which are formed on the surface of the base substrate sequentially, an anode electrode formed on the surface of the P-type semiconductor contact layer, and a cathode electrode that is connected to the N-type semiconductor clad layer. The cathode electrode is formed on the base substrate at the side of the light-emitting region multilayer portion. A groove is formed among respective vertical cavity surface emitting lasers. | 03-05-2015 |
20150056866 | COAXIAL CONNECTOR - A coaxial connector capable of reducing a probability of another coaxial connector easily separating from the coaxial connector. A hole into which a probe is inserted toward a downward direction is formed in a main body. An external terminal includes a cylinder portion that surrounds the hole extends in a top-bottom direction, and is inserted into an external terminal and a flat portion that is connected to a lower end portion of the cylinder portion and has a surface, which is oriented upward. A fixed terminal is fixed to the main body. A movable terminal is fixed to the main body, in contact with the fixed terminal, and is separated from the fixed terminal as a result of the probe making contact with the movable terminal. A groove that extends around an outer peripheral surface of the cylinder portion is formed in the outer peripheral surface of the cylinder portion. | 02-26-2015 |
20150055274 | METHOD FOR MANUFACTURING TERMINAL-STRIP-EQUIPPED ELECTRONIC COMPONENT AND TERMINAL-STRIP-EQUIPPED ELECTRONIC COMPONENT - A method for manufacturing a terminal-strip-equipped electronic component in which terminal strips made of a metal plate are bonded with solder to terminal electrodes of an electronic chip component on two opposing end surfaces. Solder cream is applied to outer surfaces of the terminal electrodes. The terminal strips are thermocompression bonded to the terminal electrodes by placing the electronic chip component between the terminal strips and pressing the terminal strips against the terminal electrodes using a pair of heating elements so as to obtain an electronic component to which the terminal strips are temporarily fixed. The terminal strips are fully fixed to the electronic component by melting the solder cream as a result of heating the electronic component in a heating furnace so as to obtain a terminal-strip-equipped electronic component. | 02-26-2015 |
20150042434 | CORE FOR WIRE-WOUND ELECTRONIC COMPONENT, WIRE-WOUND ELECTRONIC COMPONENT, AND COMMON MODE CHOKE COIL - A core for a wire-wound electronic component. The core has a winding base to be wound with a wire, and flanges located at both ends of the winding base in an extending direction of the winding base. The flanges protrude from the winding base in a first direction perpendicular to the extending direction. Each of the flanges has a plurality of protrusions on a first surface at a side of the flange in the first direction. An inclined surface is provided to extend from the first surface of each of the flanges to a second surface of the winding base at a side of the winding base in the first direction. | 02-12-2015 |
20150028988 | LAMINATED COIL - A laminated coil having; a laminate body including a plurality of insulating layers laminated horizontally; and a coil located in the laminate body off-center in an upper portion of the laminate body and including a plurality of coil conductors connected through via conductors piercing the insulating layers. The plurality of coil conductors includes a first coil conductor and a second coil conductor. A cross-sectional area of the second coil conductor is less than a cross-sectional area of the first coil conductor. The second coil conductor is a lowermost coil conductor of the plurality of the coil conductors. A lower surface of the laminate body is a mounting surface. | 01-29-2015 |
20150028985 | CORE FOR A WIRE-WOUND ELECTRONIC COMPONENT, A WIRE-WOUND ELECTRONIC COMPONENT AND A METHOD FOR MANUFACTURING A CORE FOR A WIRE-WOUND ELECTRONIC COMPONENT - A wire-wound electronic component, a core for a wire-wound electronic component and a method for manufacturing a core for a wire-wound electronic component are provided. A winding core portion of a core of a wire-wound electronic component includes flanges at respective ends of the winding core portion, and project in directions perpendicular to an axial direction of the winding core portion. Concaves are positioned at corners formed of adjoining surfaces of the flanges that adjoin to the winding core portion and end surfaces of the flanges that are located at ends in a first perpendicular direction, which is one of the projecting directions of the flange. Connecting surfaces, which connect contact portions where the flanges contact with the winding core portion to the end surfaces, are at least part of inner peripheries of the concaves. All normal vectors of the connecting surfaces have components in the first perpendicular direction. | 01-29-2015 |
20150022195 | MAGNETIC FIELD PROBE - A detector of a magnetic field probe includes a first wiring pattern formed on a first surface of a multilayer substrate and having a predetermined inclination with respect to an axial line direction of the magnetic field probe, a second wiring pattern formed on a second surface and having the predetermined inclination with respect to the axial line direction, and a first penetrating via penetrating through the multilayer substrate in the thickness direction and connecting a front end portion of the first wiring pattern and a front end portion of the second wiring pattern. A rear end portion of the first wiring pattern is connected to a conductor pattern configuring a strip line and a rear end portion of the second wiring pattern is connected to ground patterns configuring the strip line. | 01-22-2015 |
20150014899 | METHOD FOR MANUFACTURING LAMINATED COIL COMPONENT - A method includes: a laminate block preparing step of preparing a laminate block as an assembly of a number of laminates, by alternately laminating magnetic layers containing, as their main constituent, a magnetic metal material containing a glass material and conductor layers containing a conductive material so that the conductor layers are electrically connected to each other to form a coil pattern; a dividing step of dividing the laminate block by cutting the laminate block for each of the laminates; a magnetic material applying step of applying a magnetic material containing the magnetic metal material to side surfaces of the laminates; and a firing step of firing the laminates with the magnetic material applied thereto, thereby preparing a component body. This achieves a method for manufacturing a laminated coil component preferred for a power inductor with improved reliability, without impairing direct-current superimposition characteristics. | 01-15-2015 |
20150012899 | METHOD FOR DERIVING EQUIVALENT CIRCUIT MODEL OF CAPACITOR - A method for deriving an equivalent circuit model of a capacitor which makes it possible to derive, with high accuracy and with ease, an equivalent circuit model having characteristics in accordance with a direct current voltage applied to a capacitor. Characteristic values of predetermined resistive elements and capacitive elements forming an equivalent circuit model of a capacitor change in response to a DC bias voltage being applied to the capacitor, and the change is attributable to the material of a dielectric forming the capacitor. However, by multiplying the characteristic values of the resistive elements and the capacitive elements held while the DC bias voltage is not applied by a dimensionless coefficient in accordance with an application rule, the characteristic values of the resistive elements and the capacitive elements are corrected to values in accordance with the voltage of the DC bias voltage applied to the capacitor. | 01-08-2015 |
20150011256 | HIGH-FREQUENCY SIGNAL PROCESSING APPARATUS AND WIRELESS COMMUNICATION APPARATUS - A high-frequency signal processing apparatus and a wireless communication apparatus can achieve a decrease in power consumption. For example, when an indicated power level to a high-frequency power amplifier is equal to or greater than a second reference value, envelope tracking is performed by causing a source voltage control circuit to control a high-speed DCDC converter using a detection result of an envelope detecting circuit and causing a bias control circuit to indicate a fixed bias value. The source voltage control circuit and the bias control circuit indicate a source voltage and a bias value decreasing in proportion to a decrease in the indicated power level when the indicated power level is in a range of the second reference value to the first reference value, and indicate a fixed source voltage and a fixed bias value when the indicated power level is less than the first reference value. | 01-08-2015 |
20150009003 | ELECTRONIC COMPONENT - An electronic component has a laminate including a plurality of laminated insulator layers, the laminate having a top surface and a mounting surface positioned in a first direction perpendicular to a direction of lamination. The direction of lamination is a direction in which the plurality of the insulator layers are laminated. First and second external electrodes are positioned on the mounting surface rather than on the top surface. The first and second external electrodes including first and second Ni-plating films and first and second Sn-plating films provided thereon, respectively. A first total thickness of the first Ni-plating film and the first Sn-plating film and/or a second total thickness of the second Ni-plating film and the second Sn-plating film are/is 11.6 μm or more, respectively. The first and/or second Ni-plating films are/is 1.37 times or more as thick as the first and/or second Sn-plating films, respectively. | 01-08-2015 |
20140375412 | ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME - A laminate in which plural insulator layers are stacked includes an external electrode that is exposed to the exterior of the laminate and includes a plurality of conductive layers stacked in a staking direction and passing through some of the plural insulator layers in the stacking direction. At least one side of the external electrode facing in the stacking direction is overlaid with rest of the plural insulator layers. At least one side surface of the external electrode facing in the stacking direction is uneven with another portion of the side surface. | 12-25-2014 |
20140373341 | METHOD FOR MANUFACTURING LAMINATED COIL COMPONENTS - A method for manufacturing a laminated coil component having: a step of placing a first green sheet having pairs of bordering first and second areas; a step of placing a second green sheet having pairs of bordering third and fourth areas; and a step of staggering another second green sheet on the second green sheet. The first, second, third and fourth areas have identical rectangular shapes and have a first, second, third and fourth conductor, respectively. The third and fourth linear conductors form a loop. An end of the first linear conductor is connected to a first side of the first area. A part of the first linear conductor closest to a second side adjacent to the first side has a line width smaller than a part of the third linear conductor or a part of the fourth linear conductor overlapping with the part of the first linear conductor. | 12-25-2014 |
20140368293 | DIRECTIONAL COUPLER - To achieve favorable directivity in a directional coupler, even with a low magnetic-field coupling coefficient, the directional coupler includes a main line, a secondary line, and impedance conversion sections. The main line is connected between a signal input port and a signal output port. The secondary line is coupled to the main line through coupling capacitance and mutual inductance. The impedance conversion sections are connected between the secondary line and a coupling port or an isolation port, and the impedance viewed from the secondary line differs from the impedance viewed from a port side while both impedances viewed from the secondary line are equal. | 12-18-2014 |
20140368056 | POWER TRANSMISSION SYSTEM - A power transmitting unit-side resonance circuit including a resonance capacitor connected in series to a power transmitting coil and a power receiving unit-side resonance circuit including a resonance capacitor connected in series to a power receiving coil are caused to resonate with each other so that each resonance circuit resonates. With this, power is transmitted between the power transmitting coil and the power receiving unit making use of magnetic field resonance coupling and electric field resonance coupling. By making use of resonance, only effective power is transmitted from the power transmitting unit side to the power receiving unit side, while reactive power that is reflected is reserved as resonance energy in each resonance circuit. | 12-18-2014 |
20140362491 | CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - When firing a composite substrate structured to have stacked ceramic dielectric and ceramic magnetic layers, a glass constituent is diffused from the ceramic dielectric layer to the ceramic magnetic layer to, as a result, decrease sinterability of the ceramic dielectric layer or degrade insulation resistance characteristics thereof. When the ceramic dielectric includes 40 to 80% by weight of glass formed from 35 to 50% by weight of CaO, 0 to 20% by weight of Al | 12-11-2014 |
20140361944 | ANTENNA - An antenna includes antenna coil having a magnetic-material core and a coil conductor. The antenna coil is arranged toward a side of a planar conductor, such as a circuit board. Of the coil conductor, a first conductor part close to a first main face of the magnetic-material core and a second conductor part close to a second main face of the magnetic-material core are provided such that the first conductor part is not over the second conductor part in view from a line in a direction normal to the first main face or the second main face of the magnetic-material core. In addition, a coil axis of the coil conductor is orthogonal to the side of the planar conductor. | 12-11-2014 |
20140352446 | PRESSURE SENSOR STRUCTURE - A microelectromechanical pressure sensor structure that comprises a planar base and side walls and a diaphragm plate. The side walls extend circumferentially away from the planar base to a top surface of the side walls. The planar base, the side walls and the diaphragm plate are attached to each other to form a hermetically closed gap in a reference pressure, and a top edge of the inner surfaces of the side walls forms a periphery of a diaphragm. The diaphragm plate comprises one or more planar material layers of which a first planar material layer spans over the periphery of the diaphragm. The top surface of the side walls comprises at least one isolation area that is not covered by the first planar material layer. | 12-04-2014 |
20140352445 | PRESSURE SENSOR - A microelectromechanical pressure sensor structure comprises a planar base, side walls and a diaphragm plate, attached to each other to form a hermetically closed gap that provides a reference pressure. The diaphragm plate extends along a planar inner surface on top of the side walls, and has an outer surface on the opposite side of the diaphragm plate. At least part of the outer surface of the diaphragm plate forms a planar part that includes a recess, a depth of which extends parallel to the side walls and is less than the nominal thickness of the diaphragm. A large part of reasons causing the different bending of the diaphragm and the underlying structures can be eliminated with one or more recesses arranged to the pressure sensor structure. | 12-04-2014 |
20140347822 | MODULE AND METHOD FOR MANUFACTURING THE SAME - A module includes a wiring board; a plurality of mounting electrodes for component mounting, the mounting electrodes being disposed on one principal surface of the wiring board; a plurality of components mounted on the one principal surface of the wiring board and solder-connected to the mounting electrodes; a solder resist being a photosensitive resin configured to cover the one principal surface of the wiring board, with a plating electrode layer of each mounting electrode exposed; and a sealing resin layer disposed on the one principal surface of the wiring board, the sealing resin layer being configured to cover the photosensitive resin and the components connected to the mounting electrodes. A recess substantially wedge-shaped in cross section is provided at a boundary between the plating electrode layer of each mounting electrode and the solder resist, and the recess is filled with resin of the sealing resin layer. | 11-27-2014 |
20140347130 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND HIGH-FREQUENCY POWER AMPLIFIER MODULE - The invention provides a semiconductor integrated circuit device and a high-frequency power amplifier module capable of reducing variations in the transmission power characteristics. The semiconductor integrated circuit device and the high-frequency power amplifier module each include, for example, a bandgap reference circuit, a regulator circuit, and a reference-voltage correction circuit which is provided between the bandgap reference circuit and the regulator circuit and which includes a unity gain buffer. The reference-voltage correction circuit corrects variations in a bandgap voltage from the bandgap reference circuit. The reference-voltage correction circuit includes first to third resistance paths having mutually different resistance values, and corrects the variations by selectively supplying a current which reflects an output voltage of the unity gain buffer to any one of the first to third resistance paths. The selection in this case is performed by connecting a bonding wire to any one of the terminals REF | 11-27-2014 |
20140345927 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes an electronic component body and a pair of metal terminals. The electronic component body includes a ceramic element assembly and outer electrodes. The pair of metal terminals are connected to the outer electrodes by a bonding member. Each of the pair of metal terminals includes a terminal body and a plated film that is located on a surface of the terminal body. In addition, each of the pair of metal terminals includes a terminal bonding portion, a mounting portion, and an extension portion that is provided between the terminal bonding portions and the mounting portion. A plating-removal portion from which the plated film is removed is provided at least at a peripheral surface of the mounting portion, and thus a surface of the terminal body is exposed. | 11-27-2014 |
20140341246 | VERTICAL CAVITY SURFACE EMITTING LASER - A vertical cavity surface emitting laser includes an active layer that includes a quantum well, a first cladding layer and a second cladding layer between which the active layer is interposed. A first multilayer reflector layer is arranged on a side of the first cladding layer opposite to that on which the active layer is arranged. A second multilayer reflector layer is arranged on a side of the second cladding layer opposite to that on which the active layer is arranged. At least one of the first cladding layer and the second cladding layer includes a low activity energy layer having a band gap that is smaller than a smallest band gap of an optical confinement layer for forming the quantum well of the active layer and larger than a band gap of the quantum well. | 11-20-2014 |
20140340810 | DISCHARGE DEVICE - A discharge device includes a body including a plurality of dielectric layers stacked one above another, a discharge electrode disposed in the body, an induction electrode disposed in the body to face the discharge electrode with at least one of the dielectric layers interposed therebetween, and a heater electrode disposed in a layer different from a layer in which the discharge electrode is disposed, and different from a layer in which the induction electrode is disposed. | 11-20-2014 |
20140340180 | IMPEDANCE MATCHING SWITCH CIRCUIT, IMPEDANCE MATCHING SWITCH CIRCUIT MODULE, AND IMPEDANCE MATCHING CIRCUIT MODULE - An impedance matching switch circuit module includes a first switch device connected to first and second high-frequency input/output terminals, a second switch device connected between the first high-frequency input/output terminal and a first matching terminal, and a third switch device connected between the second high-frequency input/output terminal and a second matching terminal. Impedance matching elements having appropriately set element values (inductances or capacitances) are connected to the first and second high-frequency input/output terminals and the first and second matching terminals, and on/off control is performed for the first, second, and third switch devices. | 11-20-2014 |
20140339960 | PIEZOELECTRIC BULK - WAVE RESONATOR - A piezoelectric bulk-wave resonator has a single-crystal LiNbO | 11-20-2014 |
20140332910 | MICROELECTROMECHANICAL DEVICE AND A METHOD OF MANUFACTURING - A microelectromechanical device that comprises a wafer plate, a group of one or more wafer connector elements, and an electrical distribution layer between them. For reduced device thickness, the wafer plate comprises at least two dies and bonding material that bonds the at least two dies alongside each other to the longitudinal extent of the wafer plate, wherein at least one of the dies is a microelectromechanical die. The electrical distribution layer covers the wafer plate and includes a layer of dielectric material and a layer of conductive material, wherein the layer of conductive material is patterned within the layer of dielectric material for electrical interconnection of the dies and the wafer connector elements. With the new configuration, significantly reduced MEMS device thicknesses are achieved | 11-13-2014 |
20140332261 | CAPACITOR ELEMENT MOUNTING STRUCTURE AND CAPACITOR ELEMENT MOUNTING METHOD - A circuit board includes a wiring board on which is mounted first and second laminated ceramic capacitors near or adjacent to each other, arranged along a direction parallel or substantially parallel to a main surface of the wiring board, and electrically connected in series or in parallel via a conductive pattern provided on the wiring board. One width direction side surface of the first laminated ceramic capacitor and one length direction end surface of the second laminated ceramic capacitor oppose each other perpendicularly or approximately perpendicularly. | 11-13-2014 |
20140307406 | CERAMIC MULTILAYER WIRING SUBSTRATE AND MODULE INCLUDING THE SAME - A module includes a multilayer body including laminated ceramic green sheets that have been fired, multiple mounting terminals arranged to mount a component thereon, the mounting terminals each including an end surface that is exposed at a main surface of the multilayer body, and multiple via conductors disposed inside the multilayer body so as to correspond to the mounting terminals at positions overlapped by the corresponding mounting terminals when viewed in a plan view. The lengths of the via conductors are adjusted so that predetermined points on the mounting terminals are positioned on the same plane. | 10-16-2014 |
20140306792 | ELECTRONIC COMPONENT - An electronic component having; a laminate formed by laminating a plurality of insulator layers; and a coil consisting of linear coil conductor layers that are laminated along with the insulator layers, the coil having a spiral form or a helical form that windingly extends in a direction of lamination. In a cross section perpendicular to a direction in which the coil conductor layers extend, the coil conductor layers have recesses provided in their surfaces directed toward an inner circumference side of the coil, the recesses being set back toward an outer circumference side of the coil. | 10-16-2014 |
20140306789 | COMMON-MODE CHOKE COIL - A common-mode choke coil having: a core that extends in a predetermined direction; and first and second wires that are intertwined and wound together around the core. | 10-16-2014 |
20140305686 | MULTILAYER WIRING SUBSTRATE AND MODULE INCLUDING SAME - A multilayer wiring substrate includes a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted, a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component, and a plurality of rear electrodes disposed on the other principal surface of the multilayer body, wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate. | 10-16-2014 |
20140300517 | ANTENNA DEVICE AND ELECTRONIC APPARATUS - A first radiation electrode is formed on a bottom surface of a no-ground conductor formation area of a board, and second radiation electrodes are formed on a top surface of the no-ground conductor formation area. A longitudinal electrode of the first radiation electrode is electrically continuous with a ground conductor. A first end portion and a second end portion of a transverse electrode of the first radiation electrode extend toward the ground conductor. The transverse electrode of the first radiation electrode operates as a radiation element for radiating a signal at a first frequency. The second radiation electrodes each operate as a radiation element for radiating a signal at a second frequency, and also as a capacitive feed electrode for the first radiation electrode. This enables to strengthen directivity toward an antenna portion side (forward direction) of the board, and further enables multiband use. | 10-09-2014 |
20140300201 | Power Transfer System - A capacitance (Cp) is a capacitance formed between a transmitting-device-side passive electrode and a receiving-device-side passive electrode. A capacitance (Ca) is a capacitance formed between a transmitting-device-side active electrode and a receiving-device-side active electrode. A bridge circuit formed by Z | 10-09-2014 |
20140295351 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE PASTE INCLUDING THE SAME - A photosensitive resin composition which is high in thermal decomposition property of a photocured product thereof even in a case of being subjected to heat treatment in a non-oxygen atmosphere and is less likely to generate a residue of carbon and a photosensitive paste composed of the same are provided. The composition contains (a) a photopolymerization initiator, (b) an acryl monomer, and (c) polyalkylene carbonate, in which a ratio of polyalkylene carbonate to a total amount of the acryl monomer and polyalkylene carbonate is not lower than 50 weight % and not higher than 90 weight %. Polypropylene carbonate is used as polyalkylene carbonate. The photosensitive paste is obtained by blending the photosensitive composition, a solvent, and inorganic powders. Insulating inorganic material powders or conductive metal powders are employed as the inorganic powders. | 10-02-2014 |
20140293658 | POWER CONVERTER AND POWER CONVERSION METHOD - A power converter includes a switching circuit, a power conversion circuit that receives an input voltage via the switching circuit and converts the input voltage into an output voltage, an input voltage sense circuit that detects the input voltage and generates an input voltage sense signal, and a PWM controller that adjusts a duty cycle of the switching circuit based at least in part on the input voltage sense signal. The power converter also includes an output sense circuit that detects the output voltage and generates an output voltage sense signal, wherein the PWM controller adjusts the duty cycle of the switching circuit based at least in part on the input voltage sense signal and the output voltage sense signal. | 10-02-2014 |
20140293503 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating E1 and an amount of extension of the second plating E2 satisfy the relationship E1/(E1+E2)≦20%, where E1 represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and E2 represents a distance from the edge of the first plating layer to an edge of the second plating layer. | 10-02-2014 |
20140292611 | ANTENNA APPARATUS - An antenna apparatus includes an antenna substrate, a coil antenna including a conductive pattern located on the antenna substrate, a feeding coil magnetically coupled with the coil antenna, and a transceiver circuit electrically connected with the feeding coil. The feeding coil is disposed on the same substrate as the coil antenna, and is defined by a conductive pattern, which is not electrically connected with the coil antenna. Two terminals of the feeding coil are electrically connected with the transceiver circuit. | 10-02-2014 |
20140292585 | ANTENNA AND WIRELESS COMMUNICATION DEVICE - An antenna includes a dielectric base and a radiation electrode formed in the surface of the dielectric base. The radiation electrode includes a side surface electrode formed in the side surface of the dielectric base and a top surface electrode formed in the top surface of the dielectric base. A first point and a second point in the middle of an electrical length leading from a power feeding end of the radiation electrode to an open end are adjacent to each other, and in this adjacent portion, capacitance is formed between the first point and the second point. In addition, a third point and a fourth point in the middle of an electrical length are adjacent to each other, and in this adjacent portion, capacitance is formed between the third point and the fourth point. | 10-02-2014 |
20140292142 | CERAMIC ELECTRONIC COMPONENT AND GLASS PASTE - A ceramic electronic component includes a ceramic body, a glass coating layer, and terminal electrodes. End portions of inner electrodes are exposed at a surface of the ceramic body. The glass coating layer covers portions of the ceramic body in which the inner electrodes are exposed. The terminal electrodes are disposed directly above the glass coating layer and are each constituted by a plating film. The glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define conductive paths which electrically connect the inner electrodes and the terminal electrodes. The metal powder particles include first metal powder particles and second metal powder particles. The first metal powder particles are flat or substantially flat powder particles. The second metal powder particles are spherical or substantially spherical powder particles. | 10-02-2014 |
20140292141 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction. | 10-02-2014 |
20140291000 | CERAMIC ELECTRONIC COMPONENT AND WIRING BOARD HAVING BUILT-IN CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer. | 10-02-2014 |
20140288445 | BLOOD PRESSURE MONITORING METHOD - A device, system and method for monitoring blood pressure information of a user. A device is configured with at least one pressure sensor, a fastening element, and a processing component. In the method the pressure sensor is detachably attached to a position on the outer surface of a tissue of the user. The pressure sensor generates signal that vary according to deformations of the tissue in response to an arterial pressure wave expanding or contracting a blood vessel underlying the tissue. The signal is used to compute pulse wave parameters representing detected characteristics of the progressing arterial pressure wave of the user and blood pressure value of the user. | 09-25-2014 |
20140288443 | MONITORING SYSTEM - A device, system and method for monitoring blood pressure information of a user. A device is configured with first and second pressure sensors, a fastening element, and a processing component. In the method the first pressure sensor is detachably attached to a first position and the second pressure sensor to a second position on the outer surface of a skin of the user. The pressure sensor generate signals that vary according to deformations of the skin in response to an arterial pressure wave expanding or contracting a blood vessel underlying the skin. The first signal and the second signal are used to compute at least one output value that represents a detected characteristic of the progressing arterial pressure wave of the user. | 09-25-2014 |
20140285948 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor having a laminated body composed of a plurality of ceramic layers for inner layers; a plurality of internal electrodes at the interfaces between the plurality of ceramic layers for inner layers; and a plurality of ceramic layers for outer layers, provided on the top and bottom so as to sandwich the plurality of ceramic layers for inner layers. The ceramic layers for inner layers are composed of a material containing a multiple oxide including an alkaline-earth metal. The ceramic layers for outer layers respectively have TiO | 09-25-2014 |
20140285307 | COIL COMPONENT - A coil component is provided with a first magnetic substrate, a laminate body, and a second magnetic substrate. A coil is formed inside the laminate body. In the coil, a plurality of coil patterns provided on one surface of an insulation layer and a plurality of coil patterns provided on the other surface of the insulation layer are connected at multiple locations through vias. The coil patterns are configured in such a manner that a portion which is in contact with each via has a wider width widened with equal size from the center of a coil pattern to both sides thereof in the width direction, and a portion which is adjacent to the portion having the wider width across a gap has a narrower width (s) narrowed with equal size from the center of the coil pattern to both sides thereof in the width direction. | 09-25-2014 |
20140285306 | ELECTRONIC COMPONENT - In an electronic component, a multilayer body is formed by a plurality of stacked insulator layers. A coil includes at least one coil conductor layer provided on at least one of the insulator layers. External electrodes are embedded in a lateral surface of the multilayer body which is formed by a series of continuous perimeter edges of the plurality of insulator layers, and includes a plurality of stacked external conductor layers provided on the plurality of insulator layers. The external electrodes have different shapes. The external conductor layers and the first coil conductor, which are provided on the same insulator layer, are simultaneously formed by photolithography or printing. | 09-25-2014 |
20140285268 | RADIO FREQUENCY AMPLIFYING CIRCUIT AND POWER AMPLIFYING MODULE - An radio frequency amplifying circuit includes an amplifying transistor configured to amplify a radio frequency signal input to a base of the amplifying transistor via a matching network to output the amplified radio frequency signal, a first bias transistor connected to the amplifying transistor based on a current-mirror connection to supply a bias to the amplifying transistor, and a second bias transistor connected to the base of the amplifying transistor based on an emitter-follower connection to supply a bias to the amplifying transistor. | 09-25-2014 |
20140284189 | LAMINATE-TYPE ACTUATOR - A laminate-type actuator including a laminate wherein an electrostrictive material layer is wound and laminated in a form of a tube together with first and second electrodes sandwiching the electrostrictive material layer therebetween is provided with high volume efficiency and high reliability. The tubular laminate includes a pair of flat portions facing each other and a pair of curved portions interconnecting the pair of flat portions circumferentially and specifying spaces inside the curved portions. In a cross-section perpendicular to an axis of the laminate, an outer width formed by the pair of flat portions is smaller than an outer width of each of the curved portions, and a distance between the pair of flat portions is smaller than an inner width of each of the curved portions. | 09-25-2014 |
20140284091 | LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF - A laminated electronic component includes a laminate including internal electrodes and dielectric layers laminated alternately and a first main surface, an external electrode that continuously covers at least one end surface of the laminate in a longitudinal direction and a portion of the first main surface adjacent to the one end surface, and a conductive elastic structure connected to the external electrode at at least corner portions of the first main surface in a portion where the external electrode covers the first main surface. The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity. | 09-25-2014 |
20140284089 | ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PACKAGE - An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces or prevents vibration being transmitted to a circuit substrate on which it is mounted. | 09-25-2014 |
20140273899 | COMMUNICATION DEVICE - An RFID device provided at a transmission and reception circuit processes an RFID carrier signal belonging to a band of about 902 MHz to about 928 MHz or about 865 MHz to about 868 MHz to execute near field radio communication. An RFIC provided at a transmission and reception circuit processes a GSM carrier signal belonging to a band of about 824 MHz to about 894 MHz or about 880 MHz to about 960 MHz to execute mobile communication. A filter circuit provided at the transmission and reception circuit takes the band of about 850 MHz to about 940 MHz where RFID carrier signals appear as the pass band, and takes the band greater than or equal to about 1.2 GHz where a harmonic wave component of GSM carrier signals appears as the attenuation band. | 09-18-2014 |
20140271447 | Piezoelectric Oriented Ceramics and Method of Manufacturing the Same - Piezoelectric oriented ceramics containing a Pb(Ti, Zr)O | 09-18-2014 |
20140268899 | SWITCHING POWER SUPPLY DEVICE - A primary side resonant circuit is formed by a primary side resonant inductor and a primary side resonant capacitor, and secondary side resonant circuits are formed by secondary side resonant inductors and secondary side resonant capacitors. Equivalent mutual inductances and equivalent mutual capacitances are formed through electromagnetic field resonant coupling between a primary winding and secondary windings, and a multi-resonant circuit including an LC resonant circuit formed in each of the primary side and the secondary side is formed. Electric power is transmitted from the primary side circuit to the secondary side circuit, and resonant energy that is not transmitted from the primary winding and, of energy which the secondary winding has received, resonant energy that is not supplied to an output are each retained in the multi-resonant circuit. | 09-18-2014 |
20140268587 | MODULE AND METHOD OF MANUFACTURING THE SAME - An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component. | 09-18-2014 |
20140268489 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor which has a long high temperature load life, small variations in life, large capacitance, high electrical insulation property, and favorable capacitance temperature characteristics, even when high strength electric field is applied while reducing the thickness of dielectric ceramic layers uses a dielectric ceramic represented by the formula: 100(Ba | 09-18-2014 |
20140268488 | MONOLITHIC CAPACITOR - A monolithic capacitor includes a multilayer body including a plurality of stacked dielectric layers, first and second capacitor electrodes inside the multilayer body, and outer electrodes on at least one surface of the multilayer body. The first and second capacitor electrodes are arranged perpendicularly or substantially perpendicularly to first and second surfaces of the multilayer body. The first capacitor electrode includes a capacitor portion opposed to the second capacitor electrode with the dielectric layer interposed therebetween, a lead portion connected to one outer electrode, and an intermediate portion not opposed to the second outer electrode. The second capacitor electrode includes a capacitor portion opposed to the first capacitor electrode with the dielectric layer interposed therebetween, and a lead portion connected to the other outer electrode. The intermediate portion is arranged in a gap area that is surrounded, when viewed in a stacking direction of the dielectric layers, by imaginary lines extending from inner exposed ends of the lead portions in a direction interconnecting the first and second surfaces of the multilayer body, by the capacitor portions, and by the first surface. | 09-18-2014 |
20140268487 | ELECTRONIC COMPONENT, SUBSTRATE-TYPE TERMINAL INCLUDED THEREIN, AND ELECTRONIC COMPONENT MOUNTED STRUCTURE - A substrate-type terminal includes a first major surface with a first mounting electrode and a second mounting electrode. The substrate-type terminal includes a second major surface with a first connecting electrode and a second connecting electrode. The substrate-type terminal includes a first slit located between the first mounting electrode and the first connecting electrode, as seen in a plane, and penetrating the terminal from the first major surface to the second major surface, and a second slit located between the second mounting electrode and the second connecting electrode, as seen in a plane, and penetrating the terminal from the first major surface to the second major surface. | 09-18-2014 |
20140268486 | ELECTRONIC COMPONENT - An electronic component includes a laminated capacitor and a substrate-type terminal on which the laminated capacitor is mounted, with an viscoelastic resin located in a space between the laminated capacitor and the substrate-type terminal. The substrate-type terminal includes a substrate body, component connecting electrodes to mount the laminated capacitor are located on a component mounting surface of the substrate body, and external connecting electrodes to be connected to a circuit board are located on a substrate mounting surface of the substrate body. | 09-18-2014 |
20140266964 | IMPEDANCE CONVERSION DEVICE, ANTENNA DEVICE AND COMMUNICATION TERMINAL DEVICE - In a case in which a capacitor is not provided in parallel with a second inductance element, the impedance ratio between a first inductance element and the second inductance element is constant regardless of the frequency, but when a capacitor is provided, the parallel impedance of the capacitor and the second inductance element gradually increases at frequencies equal to and below the resonant frequency. Consequently, at frequencies equal to or below the resonant frequency, the higher the frequency becomes, the larger the value of the real portion of the impedance observed on a high-frequency-circuit side becomes. Therefore, by appropriately setting the values of the first inductance element, the second inductance element, and the capacitor, the frequency characteristics of the real portion of the impedance observed on the high-frequency-circuit side can be set to be similar to the frequency characteristics of the radiation resistance of the antenna. | 09-18-2014 |
20140266949 | STACK-TYPE INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME, AND COMMUNICATION DEVICE - A stack-type inductor element includes a stack including a magnetic element layer, a coil conductor pattern provided in the stack and the magnetic element layer defines a magnetic element core, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack so as to be symmetric to the plurality of first pad electrodes. One end and the other end of the coil conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open. | 09-18-2014 |
20140266551 | STACK-TYPE INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME - A stack-type inductor element includes a stack including a magnetic element layer, a coil-shaped conductor pattern provided in the stack, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack and symmetric to the plurality of first pad electrodes. The stack is rectangular or substantially rectangular when viewed in a direction of stack of the stack. A first end and a second end of the coil-shaped conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open. | 09-18-2014 |
20140265624 | PIEZOELECTRIC TRANSFORMER, PIEZOELECTRIC TRANSFORMER MODULE, AND WIRELESS POWER TRANSMISSION SYSTEM - A piezoelectric transformer includes a rectangular plate-shaped piezoelectric board having a length L in a longitudinal direction. In the piezoelectric board, five regions having a length L/5 are formed. In the two of regions, inner electrodes are formed in a thickness direction and conducted to outer electrodes provided in these regions. In a third region, outer electrodes are provided. The two regions of the piezoelectric board are polarized in the thickness direction, and two adjacent regions thereof are polarized in the longitudinal direction, and the third region is non-polarized. When a voltage is applied to the outer electrodes, the piezoelectric board expands and contracts in the longitudinal direction due to a piezoelectric effect. Thus, a piezoelectric transformer which enables high-efficient energy conversion even when a driving frequency is increased and a wireless power transmission system using the piezoelectric transformer are provided. | 09-18-2014 |
20140265623 | STEP-DOWN CIRCUIT AND POWER RECEIVING DEVICE USING STEP-DOWN CIRCUIT - A step-down circuit using a piezoelectric transformer that includes a rectangular parallelepiped piezoelectric plate having opposite end portions in a lengthwise direction thereof, which are constituted as two lower voltage portions provided with output electrodes, and a region sandwiched between the two lower voltage portions. The region being partly constituted as a higher voltage portion provided with an input electrode. The two lower voltage portions and the higher voltage portion are each polarized and driven in a 3/2λ or a 5/2λ mode. The higher voltage portion or vicinities thereof are polarized in directions symmetric to each other on both the sides of a center of the higher voltage portion or on both the sides of the higher voltage portion. The output electrodes on the positive and negative charge sides of respective polarized lower voltage portions are connected to each other. | 09-18-2014 |
20140264737 | COMPONENT-EMBEDDED SUBSTRATE - A component-embedded substrate having a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction, an internal component provided in the multilayer substrate, and a surface-mount component mounted on a surface of the multilayer substrate using bumps. The surface-mount component, when viewed in a plan view in the predetermined direction, is positioned so as to cross an outline of the internal component, with the bumps on the surface-mount component located 50 μm or more from the outline of the internal component. | 09-18-2014 |
20140262448 | HIGH-FREQUENCY SIGNAL LINE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE - A high-frequency signal line includes a laminate of a plurality of insulator layers, a signal line provided on a first principal surface of one of the insulator layers, a first ground conductor provided on a second principal surface of the insulator layer provided with the signal line, the first ground conductor including openings that overlap with the signal conductor, and a second ground conductor provided in or on the laminate so as to be opposed to the first ground conductor with the signal conductor positioned therebetween. | 09-18-2014 |
20140262442 | MODULE AND METHOD OF MANUFACTURING THE SAME - A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor. | 09-18-2014 |
20140261969 | ESD PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME - An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity | 09-18-2014 |
20140254568 | SEMICONDUCTOR MODULE - A semiconductor module includes a first transmission circuit outputting a first transmission signal of a first wireless communication system based on time-division multiplexing, a second transmission circuit outputting a second transmission signal of a second wireless communication system based on time-division multiplexing, and a switch circuit outputting a reception signal from an antenna, as a first reception signal of the first wireless communication system or a second reception signal of the second wireless communication system, outputting the first transmission signal and the first reception signal in a time division manner, and outputting the second transmission signal and the second reception signal in a time division manner. | 09-11-2014 |
20140254207 | SWITCHING POWER SUPPLY DEVICE - In a switching power supply device, a voltage of a counter electromotive force induced in a drive winding as a high side switching element is turned off is output to a ZT terminal of a switching control IC, and thus an OUT terminal of the switching control IC is brought to a high level, and thus a low side switching element is turned on. A constant current circuit charges a capacitor with a constant current through a voltage at the OUT terminal. A comparator in the switching control IC inverts the voltage at the OUT terminal to a low level upon a voltage at an IS terminal exceeding a voltage at an FB terminal. Thus, an on time of the low side switching element is controlled in accordance with a voltage output to the FB terminal, and an output voltage Vo is turned into a constant voltage. | 09-11-2014 |
20140254064 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing an electronic component, when conductive paste used to form outer electrodes is applied to a component body, a side surface of the component body is subjected to an affinity-reducing process to reduce an affinity for solvent, and then an end surface of the component body is dipped into the conductive paste. Accordingly, spreading of the conductive paste stops at ridge portions of the component body, and the conductive paste is applied to a large thickness. After that, the end surface of the component body is dipped deeper into the conductive paste. Also in this step, the affinity-reducing process prevents upward spreading of the conductive paste along the side surface. | 09-11-2014 |
20140253404 | ANTENNA DEVICE AND RADIO COMMUNICATION APPARATUS - An antenna device includes a multilayer body including magnetic layers or dielectric layers that are stacked, a first coil conductor that has a winding axis extending in a direction perpendicular or substantially perpendicular to a stacking direction of the multilayer body, the first coil conductor being provided in the multilayer body, and a second coil conductor that has a winding axis extending in a direction perpendicular or substantially perpendicular to the winding axis of the first coil conductor, the second coil conductor being provided in the multilayer body. | 09-11-2014 |
20140253282 | ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE - An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire. | 09-11-2014 |
20140253277 | ELECTRONIC COMPONENT - A laminate formed by laminating a plurality of insulator layers. First coil conductors are provided in the laminate winding in a predetermined direction when viewed in a plan view in a direction of lamination. Second coil conductors are provided in the laminate on one side in the direction of lamination relative to the first coil conductors, winding in the predetermined direction when viewed in a plan view in the direction of lamination. First via-hole conductors connect downstream ends of the first parallel portion in the predetermined direction. Second via-hole conductors connect downstream ends of the second parallel portions in the predetermined direction. A third via-hole conductor connects the farthest of the first coil conductors on one side to the farthest of the second coil conductors on the other side in the direction of lamination. The first through third via-hole conductors are not connected in a series. | 09-11-2014 |
20140253276 | LAMINATED INDUCTOR - A laminated inductor having a laminate formed by laminating a plurality of insulator layers. A plurality of inductive conductor layers are provided in the laminate and connected in parallel. In a cross section perpendicular to a direction in which a current passes through the inductive conductor layers, a combined cross-sectional shape of the inductive conductor layers constitutes an ellipse as a whole. | 09-11-2014 |
20140253243 | POWER AMPLIFYING MODULE - A power amplifying module includes a radio frequency amplifying circuit including an amplifying circuit configured to amplify an input signal and output an amplified signal, and a bias circuit of an emitter-follower type configured to bias the amplifying circuit to an operating point, and a constant voltage generating circuit configured to generate, from a first reference voltage, a first constant voltage applied to a base side of a transistor of the bias circuit and a second constant voltage applied to a collector side of the transistor. | 09-11-2014 |
20140253052 | POWER TRANSMISSION DEVICE AND POWER TRANSMISSION CONTROL METHOD - Power transmission device that causes a power supply circuit to supply a first voltage to a first active electrode when power transmission is performed, causes the power supply circuit to supply a second voltage that is lower than the first voltage to the first active electrode and causes power reception device detection means to perform frequency sweeping at a first time interval until the power reception device is mounted, or causes the power supply circuit to supply a third voltage that is lower than the first voltage to the first active electrode and causes the power reception device detection means to perform frequency sweeping at a second time interval that is longer than the first time interval until the power reception device is removed. | 09-11-2014 |
20140252917 | LAMINATED PIEZOELECTRIC ELEMENT AND MULTI-FEED DETECTION SENSOR - A laminated piezoelectric element that includes a piezoelectric element layer and a matching layer. The piezoelectric element layer is configured to have a plurality of piezoelectric layers and a plurality of electrode layers laminated together. The matching layer is laminated on the piezoelectric element layer, and is different in acoustic impedance from the piezoelectric element layer. When Vp represents the acoustic velocity in the piezoelectric element layer, Vm represents the acoustic velocity in the matching layer, Tp represents the thickness dimension of the piezoelectric element layer, and Tm represents the thickness dimension of the matching layer, Vp/Vm=Tp/Tm holds. Further, when W represents the dimension of the laminated piezoelectric element in the width direction, Tp+Tm>W holds. | 09-11-2014 |
20140252693 | METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component which can achieve favorable electrical properties in such a way that the insulation property of a magnetic section can be ensured, and that the oxidation of Cu as an internal conductor is suppressed. A method for manufacturing ceramic electronic component has a feature that includes a firing step of firing at a predetermined temperature rising rate X (° C./min) and oxygen partial pressure Y (Pa), and when the temperature rising rate and the oxygen partial pressure are respectively indicated on an x axis and a Y axis, the firing is carried out under the condition indicated by the region surrounded by (X, Y)=A (50, 0.05), B (1000, 0.05), C (1000, 0.01), D (1500, 0.01), E (1500, 0.001), F (2000, 0.001), G (2000, 100), H (1500, 100), I (1500, 50), J (1000, 50), K (1000, 10), and L (50, 10). | 09-11-2014 |
20140252235 | MEASUREMENT DEVICE AND FEATURE MEASUREMENT METHOD OF OBJECT TO BE MEASURED EMPLOYING SAME - A measurement device that includes a device main unit including at least one cavity for accommodating an analyte containing a specimen and an aperture array structure including a plurality of apertures extending therethrough in a direction perpendicular to a principal surface thereof. The aperture array structure is fixed such that part or all of the aperture array structure is positioned in the cavity. | 09-11-2014 |
20140251670 | MODULE, METHOD FOR MANUFACTURING THE MODULE, AND ELECTRONIC APPARATUS INCLUDING THE MODULE - A module includes a wiring board; a component mounted on the wiring board; a columnar conductor for external connection, the columnar conductor being connected at one end thereof to the wiring board; and a resin layer disposed on the wiring board and configured to cover the columnar conductor and the component, with an end face of the columnar conductor exposed from a surface of the resin layer, the end face being at the other end of the columnar conductor. A gap to be filled with solder is formed between the resin layer and a periphery of an end portion of the columnar conductor, the end portion being at the other end of the columnar conductor. | 09-11-2014 |
20140249763 | MOBILE DEVICE - A mobile device including a biosensor for obtaining biological signals in which biological information can be obtained stably while the mobile device is being held with a hand and is used, without providing a sensor specially used for detecting body motion generated by operating the mobile device. | 09-04-2014 |
20140248536 | ELECTRODE ACTIVE MATERIAL , PRODUCTION METHOD FOR SAID ELECTRODE ACTIVE MATERIAL, ELECTRODE AND SECONDARY BATTERY - An electrode active material has, as a main component, a mixture of an organic compound containing a rubeanic acid and oxamide. The rubeanic acid is represented by the following general formula: | 09-04-2014 |
20140247625 | SWITCHING POWER SUPPLY DEVICE - A primary side resonant circuit is formed by a primary side resonant inductor and a primary side resonant capacitor, and secondary side resonant circuits are formed by secondary side resonant inductors and secondary side resonant capacitors. Mutual inductances are formed equivalently through magnetic field resonant coupling between a primary winding and secondary windings, and a multi-resonant circuit that includes two or more LC resonant circuits is formed by a primary side circuit and a secondary side circuit. Electric power is transmitted from the primary side circuit to the secondary side circuit; resonant energy that is not transmitted from the primary winding and, of energy which the secondary winding has received, resonant energy that is not supplied to an output are each retained in the multi-resonant circuit; and, at the secondary side, the resonant energy is retained in a current path in which a rectifying element is not formed in series. | 09-04-2014 |
20140247452 | PERIODIC STRUCTURE AND MEASUREMENT METHOD USING THE SAME - A plate-shaped periodic structure is provided that includes at least two aperture portions extending through the periodic structure in a direction perpendicular to a main surface of the periodic structure and periodically arranged in at least one direction along the main surface. Each of the aperture portions has a shape that is not mirror-symmetric with respect to an imaginary plane that is a plane perpendicular to the main surface. Each of the aperture portions includes a constricted portion at which a gap distance of the aperture portion is partially small, the gap distance being a width in a direction parallel to a line of intersection of the main surface and the imaginary plane. | 09-04-2014 |
20140247192 | WIRELESS COMMUNICATION MODULE AND COMMUNICATION TERMINAL APPARATUS INCORPORATING THE SAME - A wireless communication module includes a multilayer structure including a magnetic block and at least one non-magnetic layer stacked on the magnetic block, the magnetic block including at least one magnetic layer, at least one inductor element disposed at the magnetic block, and an antenna coil disposed at the non-magnetic layer so as to overlap the inductor element in a planar view along a stacking direction of the non-magnetic layer with respect to the magnetic block, wherein the magnetic layer is present between the inductor element and the antenna coil. | 09-04-2014 |
20140247188 | ANTENNA DEVICE AND ELECTRONIC APPARATUS INCLUDING ANTENNA DEVICE - An antenna device includes a casing including a metal casing portion and a feed coil. The metal casing portion includes a main surface, a side surface connected to the main surfaces, and a notch portion located in the side surface. The feed coil is disposed inside the casing to be coupled with the metal casing portion by a magnetic field, and includes a winding central portion forming a coil opening portion. The feed coil is disposed near the notch portion, with the coil opening portion directed to a region including the notch portion. | 09-04-2014 |
20140247107 | BARIUM TITANATE SEMICONDUCTOR CERAMIC AND PTC THERMISTOR USING THE SAME - A barium titanate semiconductor ceramic with positive resistance-temperature characteristics, which is represented by the general formula: BaTiO | 09-04-2014 |
20140247105 | ELECTRONIC COMPONENT - An electronic component having a core including a winding base extending in an axial direction. A first flange is located at an end in the axial direction and having at least one first protruded side surface, which is protruded from the winding base, at least at an end in a first direction, which is one of perpendicular directions that are perpendicular to the axial direction. A wire is wound around the winding base. A first external electrode is connected to the wire and is provided on a side surface of the first flange located at an end in one of the perpendicular directions. A first outer edge of the first flange crosses the wire when viewed from the first direction has a vector having a component in the axial direction. | 09-04-2014 |
20140247103 | METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT - An electronic component capable of preventing the occurrence of magnetic saturation due to a magnetic flux surrounding each coil conductor and a method of manufacturing the electronic component are provided. The electronic component includes a laminate formed by stacking unit layers, where each unit layer includes a first insulating layer, and a coil conductor and second insulating layer formed on the first insulating layer. Each second insulating layer has a Ni content greater than a Ni content of each first insulating layer. Portions of the first insulating layers have a Ni content lower than a Ni content of the second portions after the laminate is calcined. | 09-04-2014 |
20140247102 | MULTILAYER COIL AND A MANUFACTURING METHOD THEREOF - A multilayer coil having a laminate body having a plurality of insulating layers including a specified insulating layer. A linear coil conductor is substantially looped on the specified insulating layer. An insertion is located on the specified insulating layer, in a position between a first part and a second part of the coil conductor. The first part and the second part are closest parts to each other in the coil conductor. Along a boundary surface between the first part of the coil conductor and the insertion, the first part is located at an upper side of the coil conductor with respect to a stacking direction. | 09-04-2014 |
20140246504 | ANTENNA DEVICE, CARD-TYPE COMMUNICATION DEVICE, AND COMMUNICATION TERMINAL APPARATUS - An antenna device includes an antenna resonance circuit connected to a power supply circuit and a variable-frequency resonance element including a resonance circuit which is coupled with the antenna resonance circuit via an electromagnetic field. The resonant frequency of the resonance circuit is variable within a predetermined frequency band. | 09-04-2014 |
20140246336 | SUBSTANCE DETERMINATION METHOD - A technique allowing improved determination accuracy in quantifying a substance to be determined by lessening influence by a current component different from an oxidation current is provided. The oxidation current results from oxidation of a reducing substance generated through reaction between an enzyme and the substance to be determined. Current components are contained in a response current resulting from application of a determination potential, referenced to a counter electrode, to a working electrode. Since a conditioning potential higher than a determination potential is applied as a pulse to the working electrode, influence by a current component different from an oxidation current can be lessened. Thus, the response current can be measured in a stable manner and determination accuracy in quantification of a substance to be determined which is contained in a specimen can be improved. | 09-04-2014 |
20140246335 | METHOD OF DETERMINING HEMATOCRIT VALUE, QUANTATIVE ANALYSIS METHOD, AND SENSOR CHIP - A technique and a sensor chip allowing determination of a hematocrit value of a blood sample in a short period of time with low cost are provided. A response current obtained by sweep of a voltage applied across a working electrode for determination and a counter electrode for determination included in a sensor chip is measured and a hematocrit value is derived based on followability of the response current to temporal change in swept applied voltage. Therefore, it is not necessary to stand by until oxidation reduction reaction of an oxidation reducing substance is stabilized for determining a hematocrit value as in a conventional method of determining a hematocrit value, and thus a hematocrit value of a blood sample can be determined in a short period of time. Since no oxidation reducing substance is necessary for determining a hematocrit value, a hematocrit value can be determined with low cost. | 09-04-2014 |
20140240942 | ELECTRONIC PART AND ELECTRONIC CONTROL UNIT - A main body of an electronic part is formed in a rectangular pillared shape having a first and a second axial end surface. A first electrode is formed on the first axial end surface electrically and mechanically connected to a first wiring pattern formed on a board surface of a printed board. A second electrode is formed on the second axial end surface, to which one end of a fuse terminal is electrically connected. The other end of the fuse terminal is connected to a second wiring pattern of the printed board or a wiring member which is formed as an independent member from the printed board. A cut-off portion is formed in a connecting portion of the fuse terminal. | 08-28-2014 |
20140240941 | ELECTRONIC PART AND ELECTRONIC CONTROL UNIT - A main body of an electronic part has multiple electrodes, to which multiple terminals are connected. The terminals include a normal terminal and a fuse terminal, each of which extends from lands formed in a printed board so as to hold the main body at a position above and separated from a board surface of the printed board. The fuse terminal has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The normal terminal holds the main body at the position above and separated from the board surface even in a case of melt-down of the cut-off portion. | 08-28-2014 |
20140240885 | ELECTRONIC PART AND ELECTRONIC CONTROL UNIT - A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a fuse terminal and a normal terminal, each of which extends from the main body to a printed board so that the main body is supported at a position above and separated from a board surface of the printed board. The fuse terminal has an intermediate portion between an electrode-connected portion and a land-connected portion. The intermediate portion has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The intermediate portion extends in a direction parallel to the board surface or in a direction inclined to the board surface at an angle smaller than 90 degrees. | 08-28-2014 |
20140240878 | ESD PROTECTIVE DEVICE - Inside an insulating multilayer substrate | 08-28-2014 |
20140240081 | ELECTRONIC PART AND ELECTRONIC CONTROL UNIT - A main body of an electronic part is supported by terminals at a position above and separated from a board surface of a printed board. Each of the terminals is composed of a supporting member made of electrically insulating material and a wiring member. Each of the wiring member has an electrode-connected portion electrically connected to an electrode formed on the main body and a land-connected portion electrically connected to a land formed in the printed board. One of the wiring members is composed of a fuse wiring member having a cut-off portion, which is melted down when excess current flows. The wiring member is outwardly expanded in a direction opposite to the main body. | 08-28-2014 |
20140240061 | ELECTRONIC COMPONENT - An electronic component includes a multilayer body including a plurality of insulating layers stacked on top of one another. An LC parallel resonator is provided in the multilayer body, includes a coil and a capacitor, and has a ring shape when viewed in plan in the x-axis direction. The capacitor includes a capacitor conductor layer connected to one end of the coil and a resonant ground conductor layer that is connected to the other end of the coil and that is provided on the positive z-axis direction side of the capacitor conductor layer. The resonant ground conductor layer faces the capacitor conductor layer with one of the plurality of insulating layers therebetween. An outer electrode is provided on the negative z-axis direction side of the LC parallel resonator and faces the capacitor conductor layer with one of the plurality of insulating layers therebetween. | 08-28-2014 |
20140239772 | ELECTRONIC COMPONENT - In an electronic component, when L0 is a dimension of an electronic component body in a first direction, L1 is a distance between a first outer electrode and a second outer electrode on a first surface in the first direction, and L2 is a dimension of each of the first and second outer electrodes on the first surface in the first direction, 0%08-28-2014 | |
20140239077 | COMMUNICATION MODULE, CONNECTOR, AND CONNECTOR-EQUIPPED COMMUNICATION MODULE - A connector-equipped communication module includes a communication module and a connector. The communication module includes a wiring board including antenna-mounted and IC-mounted regions at different positions in a planar view, an antenna element mounted in the antenna-mounted region, a wireless IC and a mounted component mounted in the IC-mounted region, and side terminals in the IC-mounted region and peripheral portions near the IC-mounted region. The connector includes a receiving portion including a placement portion configured to mount the communication module and a wall portion extending around the placement portion, inner wall terminals on an inner side of the wall portion at positions facing the side terminals, and external terminals located outward of the receiving portion and electrically connected to the inner wall terminals. In a state where the communication module is received in the receiving portion, the inner wall and side terminals are fitted so as to contact with each other. | 08-28-2014 |
20140238732 | ELECTRONIC PART AND ELECTRONIC CONTROL UNIT - A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a normal terminal and a fuse terminal, each of which extends from lands formed in a printed board so as to hold the main body at a position above and separated from a board surface of the printed board. The fuse terminal has multiple leg portions divided by slits. A first leg portion forms an electrical path portion having a cut-off portion, a width of which is smaller than that of other portions of the electrical path portion. A second leg portion has a first supporting leg and a second supporting leg, which are arranged at both sides of the first leg portion. Each of the supporting legs is connected to each of dummy lands formed in the printed board. | 08-28-2014 |
20140238578 | METHOD FOR MANUFACTURING MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a method for manufacturing a monolithic ceramic electronic component, electrically conductive paste layers are formed such that each of the electrically conductive paste layers includes a plurality of electrically conductive paste portions isolated from each other and each of the plurality of electrically conductive paste portions includes a first portion configured to constitute a facing portion and a second portion which includes a portion configured to constitute a lead portion and which is disposed astride a cut line. | 08-28-2014 |
20140233190 | ELECTRONIC MODULE - An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed in a see-through manner in a direction perpendicular or substantially perpendicular to the front surface of the substrate, the suckable region is inside of a region in which one built-in electronic component is built in and a center of gravity of the electronic module is located inside of the suckable region. A protective layer is not provided on the front surface of the substrate on which the surface mount electronic component is mounted. | 08-21-2014 |
20140232532 | INSPECTION METHOD AND INSPECTION DEVICE FOR RFID TAG - An RFID tag inspection method includes the steps of transmitting a measurement signal from a reader/writer simultaneously to a plurality of RFID tags arrayed on a collective base member and configured to process radio signals, receiving response waves from the individual RFID tags in a batch by the reader/writer, and determining, based on strengths and a number of received signals read by the reader/writer, whether or not the individual RFID tags are acceptable. Thus, acceptance/rejection inspection can be performed on the plural RFID tags, which are arrayed on the collective base member, in a batch. | 08-21-2014 |
20140232514 | THERMISTOR AND METHOD FOR MANUFACTURING THE SAME - A thermistor that includes a metal substrate layer, a thermistor thin film formed on the metal substrate layer, and electrode films formed on the thermistor thin film. The metal substrate layer and the electrode films contain a Ag—Pd alloy, and the content of Pd of the Ag—Pd alloy is 10 percent by weight or more. | 08-21-2014 |
20140232504 | ELECTRONIC COMPONENT - An electronic component having a laminate having a plurality of insulator layers. A coil is provided consisting of a plurality of coil conductors that are connected by via-conductors piercing through the insulator layers, the coil winding helically about an axis along a direction of lamination. External electrodes are provided on surfaces of the laminate, in which at least some pairs of the coil conductors that neighbor each other with one of the insulator layers provided therebetween have parallel sections that overlap each other when viewed in the direction of lamination. The parallel sections are connected in parallel by the via-conductors or the external electrodes, and each pair of the coil conductors that neighbor each other with one of the insulator layers provided therebetween do not overlap each other when viewed in the direction of lamination, except for the parallel sections, and connections between the coil conductors and the via-conductors. | 08-21-2014 |
20140232501 | COMMON MODE CHOKE COIL AND HIGH-FREQUENCY ELECTRONIC DEVICE - A common mode choke coil includes a primary coil and a secondary coil, wherein the primary coil includes a first coil pattern and a second coil pattern connected in series to the first coil pattern, and the secondary coil includes a third coil pattern and a fourth coil pattern connected in series to the third coil pattern. The first and third coil patterns are concentrically wound, as parallel or substantially parallel lines, in loop shapes on one surface, and the second and fourth coil patterns are concentrically wound, as parallel or substantially parallel lines, in loop shapes on the one surface with being adjacent to the first and third coil patterns. | 08-21-2014 |
20140232488 | FLAT CABLE - A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided in the dielectric element assembly, a first ground conductor provided on one side in a direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line, and a second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line. The first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor. The first openings are larger than the second openings. | 08-21-2014 |
20140232481 | POLAR-TYPE LOW PASS FILTER AND DEMULTIPLEXER EQUIPPED THEREWITH - A polar-type low pass filter includes a low pass filter portion and first, second and third ground conductors, in a laminated body. The low pass filter portion includes parallel resonant circuits including first, second, third and fourth capacitors and inductors, in a series arm, and at least capacitors in a parallel arm thereof. Pattern conductors configuring the first, second, third and fourth capacitors face the first ground conductor and so forth, in a z-axis direction. | 08-21-2014 |
20140231528 | ANTENNA, METHOD OF MANUFACTURING THE ANTENNA, AND WIRELESS IC DEVICE - An antenna includes first and second radiation portions including one lead wire that is folded back into a loop shape to define a folded-back portion and that includes a first power feed portion at a first end and a second power feed portion at a second end. The lead wire portion extending toward the folded-back portion and the lead wire portion extending through the folded-back portion are close enough to each other near each of the first and second power feed portions in the first and second radiation portions, respectively, to be electromagnetically coupled to each other. The power feed portions of the antenna are coupled to a wireless IC chip. The power feed portions may be coupled to a feed circuit in a feed circuit board coupled to a wireless IC. | 08-21-2014 |
20140231518 | WIRELESS COMMUNICATION DEVICE - A wireless communication device includes a resistive-element-including RFIC and an antenna coil. The resistive-element-including RFIC includes an RFIC, a capacitive element, and resistive elements. The resistive elements and a portion of a circuit in the RFIC define a variable impedance circuit. The RFIC controls the impedance of a resistive circuit added to an antenna circuit in accordance with certain IO terminals set as output ports or input ports, thus obtaining a Q value of the antenna circuit in accordance with a communication speed. | 08-21-2014 |
20140231382 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - A piezoelectric device prevents damage to a piezoelectric thin film caused by etching and the manufacturing cost of the piezoelectric device is reduced. On a surface of a support layer formed on a support substrate, an etching adjustment layer is formed. An etchant flows through etching windows to simultaneously form a through hole through which a portion of a sacrificial layer is exposed to a side of a piezoelectric thin film and an opening through which the etching adjustment layer, which is conductive with a lower electrode, is exposed to the side of the piezoelectric thin film. By making an etchant flow through the through hole, the sacrificial layer is removed. A lead-out wiring is formed between an upper electrode and a bump pad and a lead-out wiring is formed between the conductive etching adjustment layer, which is conductive with the lower electrode, and a bump pad. | 08-21-2014 |
20140230573 | DISPLACEMENT DETECTION DEVICE AND DISPLACEMENT DETECTION METHOD - A displacement detection device includes a piezoelectric sensor. The piezoelectric sensor is provided with a piezoelectric sheet on both principal surfaces of which detection electrodes are formed. When stress is applied to the piezoelectric sensor, charge is generated, and an output voltage in accordance with this generated charge is detected in a DC voltage detector. A controller measures this output voltage at a predetermined time interval. Every time the controller measures the output voltage, the controller makes a short-circuit control of a switch, and causes the charge generated in the piezoelectric sensor to be released. The controller can thereby detect an amount of change in output voltage generated at the predetermined time interval in accordance with an amount of displacement of the piezoelectric sensor. By sequentially integrating this, the controller can accurately detect the amount of displacement of the piezoelectric sensor which changes across measurement timings. | 08-21-2014 |
20140230209 | PIEZOELECTRIC POWER GENERATING DEVICE AND MANUFACTURING METHOD THEREOF - A piezoelectric power generating device is provided which is capable of extracting a large amount of power without an increase in device size, even when applied with vibration of low frequency or weak external force, and which is easy to manufacture. | 08-21-2014 |