MPI CORPORATION Patent applications |
Patent application number | Title | Published |
20160143141 | MULTILAYER CIRCUIT BOARD - A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate first substrate a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections. | 05-19-2016 |
20160139179 | HIGH-FREQUENCY CANTILEVER TYPE PROBE CARD - A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT. | 05-19-2016 |
20160128176 | MULTILAYER CIRCUIT BOARD - A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate. | 05-05-2016 |
20160018441 | PROBE CARD, AND CONNECTING CIRCUIT BOARD AND SIGNAL FEEDING STRUCTURE THEREOF - A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end. | 01-21-2016 |
20160018439 | PROBE CARD, AND CONNECTING CIRCUIT BOARD AND SIGNAL FEEDING STRUCTURE THEREOF - A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end. | 01-21-2016 |
20150241544 | METHOD OF CALIBRATING AND DEBUGGING TESTING SYSTEM - A method of calibrating and debugging a testing system is provided. First, values of different electrical path segments are calibrated, and parameters of the electrical path segments while being calibrated are saved. After calibration, electrical tests can be processed on a DUT. If the testing system malfunctions, the values of the electrical path segments are calibrated again to compare the current parameters to the previously saved parameters. The component which goes wrong can be found out quickly in this way. | 08-27-2015 |
20150233969 | Testing system and method for testing of electrical connections - A testing system includes a test machine, a plurality of probe sets, a data input device, a controller, a memory, and a data output device. The test machine has a platform for a DUT to be placed thereon, and a test arm which is movable relative to the platform. The probe sets are provided on the test machine with at least one probe set provided on the test arm to contact the DUT. The data input device is used to input information about the DUT. The controller is electrically connected to the test arm, the probe set on the test arm, and the data input device to move the test arm to a predetermined position according to the inputted information, and to make the probe set contact the DUT for electrical test. The memory saves electrical test result, which is outputted by the data output device. | 08-20-2015 |
20150212186 | METHOD OF CALIBRATING AND OPERATING TESTING SYSTEM - A method of calibrating and operating a testing system is provided, wherein the testing system has a test machine, a conducting wire set, a calibration module, and a probe module. The method includes the following steps: electrically connect the test machine and the conducting wire set; electrically connect the conducting wire set and the calibration module; send out electrical signals from the test machine to the calibration module for doing at least one test among a short-circuit test, an open-circuit test, and an impedance test, and then calibrate the testing system by correspondingly performing compensation based on results of these tests; electrically disconnect the conducting wire set and the calibration module, and electrically connect the conducting wire set and the probe module; abut the probe module against a DUT; send out electrical signals from the test machine to the probe module to do electrical tests on the DUT. | 07-30-2015 |
20150204962 | METHOD OF OPERATING TESTING SYSTEM - A method of operating a testing system is provided, wherein the testing system has a test machine and a probe module, which has a first probe set and a second probe set. One of the first probe set and the second probe set can be connected to the test machine. The method includes the following steps: connect the test machine and the first probe set; calibrate the testing system; abut the first probe set against a DUT to do electrical tests; disconnect the first probe set and the DUT; disconnect the test machine and the first probe set; connect the test machine and the second probe set; calibrate the testing system again; abut the second probe set against the DUT to do electrical tests. | 07-23-2015 |
20150204929 | TESTING SYSTEM AND METHOD OF INSTANT INFORMING WITH THE SAME - A testing system includes a test machine, a communication device, a server, and a user-end device. The test machine does electrical test on an electronic product, wherein the test machine generates a first signal when the test is completed, and generates a second signal when the measured yield is lower than a predetermined threshold. The communication device is electrically connected to the test machine to receive the first signal or the second signal. The communication device correspondingly converts the received signals into first information or second information, and then outputs the first and the second information to a first network. The server communicates with the first network to receive the first and the second information outputted by the communication device, and then outputs the received information to a second network. The user-end device communicates with the second network to receive the first and the second information outputted by the server. | 07-23-2015 |
20150204908 | ELECTRICAL TESTING MACHINE - An electrical testing machine includes a base having two parallel first rails, a platform provided on the base, a probe holder provided on the base and having a plurality of placement locations, a support provided between the first rails and having a second rail thereon, a test arm provided on the second rail and above the platform, a receiving seat provided on the test arm, and a plurality of probe sets, wherein one of the probe sets is engaged on the receiving seat, while the others are respectively provided on the placement locations. The support is movable relative to the base and the platform. The test arm is movable along with the support, and is also movable relative to the support. The receiving seat is movable or rotatable relative to the test arm. The probe set engaged on the receiving seat is movable along with the receiving seat. | 07-23-2015 |
20150204907 | ELECTRICAL TESTING DEVICE - An electrical testing device includes a base having two parallel first rails, a platform provided on the base, a support provided between the first rails, a test arm, a rotary table provided on the test arm, a plurality of holders provided on the rotary table, and a plurality of probe sets respectively provided on the holders. The support has a second rail provided thereon, and is moveable relative to the base and the platform. The test arm is provided on the second rail and above the platform, wherein the test arm is moveable along with the support, and is also movable relative to the support. The rotary table is moveable or rotatable relative to the test arm. The holders are moveable along with the rotary table, and are also moveable or rotatable relative to the rotary table. The probe sets are moveable along with the holders. | 07-23-2015 |
20150204906 | TESTING JIG - A testing jig includes a substrate and a plurality of conductive elastic pieces, wherein the substrate has a recess and a plurality of circuits; the recess is located on a top surface of the substrate, while the circuits are provided on the top surface of the substrate. The conductive elastic pieces are provided on the substrate, and are respectively electrically connected to the circuits. Each of the conductive elastic pieces has a contact portion located within an orthographic projection range of the recess, wherein each of the contact portions contacts a pad of a DUT. Whereby, attenuation happens while transmitting test signals with high frequency can be effectively reduces by using the conductive elastic pieces to transmit test signals. | 07-23-2015 |
20150204905 | TESTING JIG - A testing jig includes a substrate, a carrier provided on the substrate, two conductive members made of a conductive material, and a compensation member made of a conductive material. The substrate has a signal circuit and a grounding circuit thereon. The carrier has a base board made of an insulating material and a conductive circuit made of a conductive material provided thereon. The base board has a signal perforation aligning with the signal circuit, a grounding perforation aligning with the grounding circuit, and multiple compensation holes. The conductive members both have an end exposed out of the carrier, and are respectively fitted in the signal perforation and the grounding perforation to make another end thereof contact the signal circuit or the grounding circuit. The compensation member is fitted in one of the compensation holes to be electrically connected to the conductive member in the grounding perforation through the conductive circuit. | 07-23-2015 |
20150204581 | HEATING DEVICE USING PHOTODETECTOR TO DETECT TEMPERATURE AND METHOD FOR PROTECTING THE SAME - A heating device includes a housing having a flow channel, a heater disposed in the flow channel, an optical rod, a light guider and a photodetector. The optical rod has a transparent body, a first end portion, and a second end portion located inside the housing. The light guider is provided at the second end portion for guiding lights emitted by the heater toward the first end portion. The photodetector is located around the first end portion and faces the second end portion for indirectly receiving the lights emitted by the heater to the light guider through the transparent body. The temperature of the heater can be measured efficiently and timely by using the photodetector having a high responding speed, such that an overheat or damage of the heater can be prevented by controlling the heater based on the measured temperature. | 07-23-2015 |
20150185253 | PROBE MODULE - A probe module including a housing, a PCB, three probes, a resonating member, and a signal connector. The housing has a room therein, a first opening, and a second opening at opposite ends thereof. The PCB is received in the room of the housing, and has a substrate, on which a circuit and two groundings are provided. The probes are electrical connected to the circuit and the groundings of the PCB respectively, and then extend out of the housing via the first opening. The resonating member has a chamber, and is attached to the PCB. The signal connector is connected to the PCB, and extends out of the housing via the second opening. The signal connector has a signal transmission portion electrically connected to the circuit of the PCB, and a grounding portion electrically connected to the at least one grounding of the PCB. | 07-02-2015 |
20150015295 | SIGNAL PATH SWITCH AND PROBE CARD HAVING THE SIGNAL PATH SWITCH - A probe card, which is between a tester and a device under test (DUT), includes two first electrical lines, two second electrical lines, two inductive elements, and a capacitor. The first electrical lines are electrically connected to the probes respectively. The second first electrical lines are electrically connected to the first electrical lines respectively. The inductive elements are electrically connected the first electrical lines and the tester respectively; and the capacitor has opposite ends connected to the second first electrical lines respectively. | 01-15-2015 |
20150015291 | CANTILEVER PROBE CARD FOR HIGH-FREQUENCY SIGNAL TRANSMISSION - A cantilever probe card, which is provided between a device under test (DUT) and a tester, includes a carrier board, a probe base, two probes, and a transmission device. The carrier board is provided with through holes. The probe base is provided on the carrier board, and the probes are mounted to the probe base. Each probe has a tip to contact a test pad of the DUT. The transmission device is flexible, and has signal circuits. The transmission device passes through the through hole on the carrier board, and the signal circuits connect the probes to the tester respectively. | 01-15-2015 |
20150015290 | PROBE MODULE SUPPORTING LOOPBACK TEST - A probe module, which supports loopback test and is provided between a PCB and a DUT, includes a substrate, a probe base, two probes, two signal path switchers, and a capacitor. The substrate has two first connecting circuits and two second connecting circuits, wherein an end of each first connecting circuit is connected to the PCB. The probe base is provided between the substrate and the DUT with the probes provided thereon, wherein an end of each probe is exposed and electrically connected to one second connecting circuit, while another end thereof is also exposed to contact the DUT. Each signal path switcher is provided on the probe base, and respectively electrically connected to another end of one first and one second connecting circuits. The capacitor is provided on the probe base with two ends electrically connected to the two signal path switchers. | 01-15-2015 |
20150014046 | MULTILAYER CIRCUIT BOARD - A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands. | 01-15-2015 |
20140352460 | Probe Needle and Probe Module Using the Same - A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan. | 12-04-2014 |
20140306730 | ALIGNMENT ADJUSTING MECHANISM FOR PROBE CARD, POSITION ADJUSTING MODULE USING THE SAME AND MODULARIZED PROBING DEVICE - An alignment adjusting mechanism for a probe card includes a frame, a substrate and positioning screws. The frame has an opening, an inner periphery wall surrounding around the opening, and an outer periphery wall corresponding to the inner periphery wall. The substrate is disposed in the opening and supported by a support flange extending from the inner periphery wall toward a center of the opening. The frame is provided with a plurality of positioning threaded holes each extending from the outer periphery wall to the inner periphery wall in communication with the opening. Each positioning screw is threaded into one of the positioning threaded holes and has an end stopped at a lateral side of the substrate. By turning the positioning screws, the planimetric position of the substrate on an imaginary plane is adjustable. | 10-16-2014 |
20140306729 | POSITION ADJUSTABLE PROBING DEVICE AND PROBE CARD ASSEMBLY USING THE SAME - A position adjustable probing device adapted for being mounted to a circuit board includes a frame, a probe head, a space transformer module and an elevation adjusting structure. The frame has a first surface, a second surface opposite to the first surface, and a first opening penetrating through the first and second surfaces. The probe head is coupled to the frame. The space transformer module is disposed in the first opening. The elevation adjusting structure is provided at the frame and has a plurality of spacers for adjusting a position of the frame relative to a reference surface in a vertical direction. | 10-16-2014 |
20140290053 | METHOD OF MANUFACTURING SPACE TRANSFORMER FOR PROBE CARD - A method of manufacturing a space transformer for a probe card includes the steps of mounting and electrically connecting second substrates on a first substrate, forming an insulated layer with through holes on each of the second substrates, and forming electrically conductive blocks in the through holes, respectively. Because the electrically conductive blocks are formed after the second substrates are mounted to the first substrate, any unexpected relative displacement of the first and second substrates during mounting is uninfluential to positions of the electrically conductive blocks. Besides, a step of planarizing the electrically conductive blocks can be further carried out. Therefore, the positions and flatness of probe needles may not need to be adjusted after the probe needles are connected with the electrically conductive blocks of the space transformer thus obtained. | 10-02-2014 |
20140232421 | Probe card of low power loss - A probe card, which is used to transmit power signals and test signals from a tester to a DUT, includes a pin base, a plurality of signal pins, a signal conducting circuit and at least one power conducting circuit. The signal pins are made of conductive materials, and each contacts the DUT with an end thereof; the signal conducting circuit has a first resistance, and electrically connects the tester and the other end of one of the signal pin to transmit the test signals to the DUT; the power conducting circuit has a second resistance which is much less than the first resistance, and electrically connects the tester and the other end of one of the signal pin which is not connected with the signal conducting circuit to transmit the power signals to the DUT. | 08-21-2014 |
20140210505 | WAFER TESTING PROBE CARD - A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head. | 07-31-2014 |
20140203834 | PROBE MODULE - A probe module includes a substrate having a through hole, and at least four probe-needle rows arranged on the substrate. The probe-needle rows are arranged from a first side to a second side along a first direction. Each of the probe-needle rows has at least two needles arranged along a second direction. Each of the needles has a contact segment and an arm segment having an included angle with the contact segment. An end of the arm segment is connected to the substrate, and the other end of which extends toward the through hole to connect the contact segment. The lengths of the contact segments of the needles of each of the probe-needle rows are the same. The included angles of the needles of the probe-needle rows along the first direction are gradually increased from the first side to the second side. | 07-24-2014 |
20140197860 | CURRENT-DIVERTING GUIDE PLATE FOR PROBE MODULE AND PROBE MODULE USING THE SAME - A current-diverting guide plate for use in a probe module is disclosed to include a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces. A conducting layer is provided at a periphery wall of each through hole of the plate body and electrically coupled to a probe slidably inserted through the through holes. A current-diverting circuit trace is disposed on the first surface of the plate body and electrically connected with the conducting layers for diverting the electric current flowing through probes. Thus, the current-diverting guide plate can be used to prevent the probes from possible damage due to an excessive instantaneous current. | 07-17-2014 |
20140197859 | Probe Head - A probe head includes a plate, a probe, and at least one composite coating layer. The plate has at least one through hole therein. The probe is at least partially disposed in the through hole of the plate. The composite coating layer includes a metal layer and a plurality of lubricating particles. The metal layer is disposed in the through hole of the plate and between the plate and the probe. The lubricating particles are dispersed in the metal layer. | 07-17-2014 |
20140103948 | PROBE CARD HAVING CONFIGURABLE STRUCTURE FOR EXCHANGING OR SWAPPING ELECTRONIC COMPONENTS FOR IMPEDANCE MATCHING - A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate. | 04-17-2014 |
20140077833 | PROBE CARD AND MANUFACTURING METHOD THEREOF - A probe card for being abutted against a plurality of probes is provided. The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against the probes. In addition, a method of manufacturing the probe card is provided. | 03-20-2014 |
20130249579 | PROBING APPARATUS EQUIPPED WITH HEATING DEVICE - A probing apparatus includes a rotating device having a plurality of platforms for supporting DUTs, a probe device having a lifting stage movable between first and second positions, and a heating device mounted to the lifting stage so as to move along with it. The platforms are synchronously revolvable in a way that the platforms move to a test position sequentially The heating device is configured in a manner that when the lifting stage moves to the first position, the heating device is located away from the platform at the test position, and when the lifting stage moves to the second position, the heating device contacts and heats the platform at the test position. Therefore, the heating device and the probe device are movable simultaneously for heating up the platform and testing the DUT respectively. | 09-26-2013 |
20130069686 | PROBING DEVICE AND MANUFACTURING METHOD THEREOF - A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer. | 03-21-2013 |
20130033283 | PROBING DEVICE - A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer. | 02-07-2013 |
20100253378 | PROBE FOR HIGH FREQUENCY SIGNAL TRANSMISSION - A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly. | 10-07-2010 |
20100237886 | PROBE CARD - A probe card is provided. The probe card can serialize, analogise and divide a digital signal by a parallel-to-serial converter, a parallel-to-serial converter, and a power divided unit respectively. The probe card can increase signal channels, and is not restricted by signal channels of a tester to test more DUTs simultaneously. Moreover, the probe card has fine impedance matching and channels separating to raise testing efficiency and reduce signal loss. | 09-23-2010 |
20090212801 | METHOD OF MAKING HIGH-FREQUENCY PROBE, PROBE CARD USING THE HIGH-FREQUENCY PROBE - A high frequency probe preparation method for making a high frequency probe for high frequency testing to assure signal integrity by means of making a sleeve assembly subject to the size of a predetermined bare needle and then sleeving bare needle by the sleeve assembly to form a high-frequency probe is disclosed to include the steps of: a) providing an insulated tube, and b) forming a conducting layer on the outer surface of the insulated tube which having a metal layer for grounding. The insulated tube and the conducting layer constitute the sleeve assembly. The metal layer is formed by means of physical deposition, chemical deposition, mixture of physical and chemical deposition or electrochemical deposition. | 08-27-2009 |