MITSUBISHI SHINDOH CO., LTD. Patent applications |
Patent application number | Title | Published |
20160138135 | COPPER ALLOY FOR ELECTRONIC/ELECTRICAL EQUIPMENT, COPPER ALLOY THIN SHEET FOR ELECTRONIC/ELECTRICAL EQUIPMENT, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, AND TERMINAL - One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.005-19-2016 | |
20160111179 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - A copper alloy for electric and electronic devices includes: Zn from more than 2 mass % to less than 23 mass %; Sn at 0.1 mass % or more and 0.9 mass % or less; Ni at 0.05 mass % or more and less than 1.0 mass %; Fe at 0.001 mass % or more and less than 0.10 mass %; P at 0.005 mass % or more and 0.1 mass % or less; and a balance including Cu and unavoidable impurities, wherein a ratio Fe/Ni satisfies 0.002≦Fe/Ni<1.5 by atomic ratio, a ratio (Ni+Fe)/P satisfies 3<(Ni+Fe)/P<15 by atomic ratio, a ratio Sn/(Ni+Fe) satisfies 0.304-21-2016 | |
20150357073 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - A copper alloy for an electric and electronic device includes more than 2.0 mass % to 36.5 mass % of Zn, 0.1 mass % to 0.9 mass % of Sn, 0.05 mass % to less than 1.0 mass % of Ni, 0.5 mass ppm to less than 10 mass ppm of Fe, 0.001 mass % to less than 0.10 mass % of Co, 0.001 mass % to 0.10 mass % of P, and a balance including Cu and unavoidable impurities, in which, ratios between the amounts of the respective elements satisfy 0.002≦Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.312-10-2015 | |
20150348665 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device comprises more than 2.0 mass % and less than 23.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002≦Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.1012-03-2015 | |
20150325327 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - A copper alloy for an electric and electronic devices comprises 23 mass % to 36.5 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.15 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002≦Fe/Ni<0.7, 3<(Ni+Fe)/P<15, and 0.311-12-2015 | |
20150325326 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE,CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002≦Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.1011-12-2015 | |
20140255248 | COPPER ALLOY SHEET AND METHOD FOR MANUFACTURING COPPER ALLOY SHEET - An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70% or more. | 09-11-2014 |
20140251488 | HOT-FORGED COPPER ALLOY PART - A hot-forged copper alloy part which has a tubular shape, in which an alloy composition contains 59.0 mass % to 84.0 mass % of Cu and 0.003 mass % to 0.3 mass % of Pb with a remainder of Zn and inevitable impurities, a content of Cu [Cu] mass % and a content of Pb [Pb] mass % have a relationship of 59≦([Cu]+0.5×[Pb])≦64, a shape of the forged part satisfies a formula of 0.4≦(average inner diameter)/(average outer diameter)≦0.92, 0.04≦(average thickness)/(average outer diameter)≦0.3, and 1≦(tube axis direction length)/(average thickness))≦10, a forging material which is to be hot-forged has a tubular shape and satisfies 0.3≦(average inner diameter/average outer diameter)≦0.88, 0.06≦(average thickness)/(average outer diameter)≦0.35, and 0.8≦(tube axis direction length)/(average thickness))≦12, and 0%≦(degree of uneven thickness)≦30%, 0≦(degree of uneven thickness)≦75×1/((tube axis direction length)/(average thickness)) | 09-11-2014 |
20140209221 | Cu-Mg-P-BASED COPPER ALLOY SHEET HAVING EXCELLENT FATIGUE RESISTANCE CHARACTERISTIC AND METHOD OF PRODUCING THE SAME - The fatigue resistance characteristics, particularly, fatigue resistance characteristics after retention at 150° C. for 1000 hours are improved while maintaining the characteristics in the related art. Provided is a copper alloy sheet having a composition containing 0.2% by mass to 1.2% by mass of Mg, and 0.001% by mass to 0.2% by mass of P, the balance being Cu and unavoidable impurities. When X-ray diffraction intensity of a {110} crystal plane is set as I{110}, and X-ray diffraction intensity of {110} crystal plane of a pure copper standard powder is set as I | 07-31-2014 |
20140202602 | COPPER ALLOY SHEET AND METHOD FOR MANUFACTURING COPPER ALLOY SHEET - An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfied a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70 % or more. | 07-24-2014 |
20140174611 | COPPER ALLOY SHEET, AND METHOD OF PRODUCING COPPER ALLOY SHEET - One aspect of this method of producing a copper alloy sheet includes: a hot rolling process; a cold rolling process; a recrystallization heat treatment process; and a finish cold rolling process in this order, wherein a hot rolling initiation temperature is 800° C. to 940° C., a cooling rate from a temperature after final rolling or 650° C. to 350° C. is 1° C./second or more, and a cold working rate is 55% or more. In the recrystallization heat treatment process, 550≦Tmax≦790, 0.04≦tm≦2, and 460≦{Tmax−40×tm | 06-26-2014 |
20140166164 | COPPER ALLOY SHEET AND METHOD OF MANUFACTURING COPPER ALLOY SHEET - A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44≧[Zn]+20×[Sn]≧37 and 32≦[Zn]+9×([Sn]−0.25) | 06-19-2014 |
20140134457 | CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME - A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu | 05-15-2014 |
20140124106 | SILVER-WHITE COPPER ALLOY AND METHOD OF PRODUCING SILVER-WHITE COPPER ALLOY - Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%. | 05-08-2014 |
20140112822 | SILVER-WHITE COPPER ALLOY AND METHOD OF PRODUCING SILVER-WHITE COPPER ALLOY - Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%. | 04-24-2014 |
20140087606 | COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY THIN PLATE FOR ELECTRONIC/ELECTRIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRIC DEVICE AND TERMINAL - What is provided is a copper alloy for electronic/electric device comprising: in mass %, more than 2% and 36.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.10% of Fe; 0.005% or more and 0.10% or less of P; and the balance Cu and inevitable impurities, wherein a content ratio of Fe to Ni, Fe/Ni satisfies 0.002≦Fe/Ni<1.5, a content ratio of a sum of Ni and Fe, (Ni+Fe), to P satisfies 3<(Ni+Fe)/P<15, a content ratio of Sn to a sum of Ni and Fe, (Ni+Fe) satisfies 0.303-27-2014 | |
20130319584 | Cu-Zr-BASED COPPER ALLOY PLATE AND PROCESS FOR MANUFACTURING SAME - Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm | 12-05-2013 |
20130319581 | PRESSURE RESISTANT AND CORROSION RESISTANT COPPER ALLOY, BRAZED STRUCTURE, AND METHOD OF MANUFACTURING BRAZED STRUCTURE - A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0≦[Cu]−3.6×[Si]≦67.5. In addition, the area fraction of the α phase “α”%, the area fraction of a β phase “β”%, the area fraction of a γ phase “γ”%, the area fraction of the κ phase “κ”%, and the area fraction of a μ phase “μ”% satisfy 30≦“α”≦84, 15≦“κ”≦68, “α”+“κ”≧92, 0.2≦“κ”/“α”≦2, “β”≦3, “μ”≦5, “β”+“μ”≦6, 0≦“γ”≦7, and 0≦“β”+“μ”+“γ”≦8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy. | 12-05-2013 |
20130315660 | PRESSURE RESISTANT AND CORROSION RESISTANT COPPER ALLOY, BRAZED STRUCTURE, AND METHOD OF MANUFACTURING BRAZED STRUCTURE - A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0≦[Cu]−3.6×[Si]≦67.5. In addition, the area fraction of the α phase “α”%, the area fraction of a β phase “β”%, the area fraction of a γ phase “γ”%, the area fraction of the κ phase “κ”%, and the area fraction of a μ phase “μ”% satisfy 30≦“α”≦84, 15≦“κ”≦68, “α”+“κ”≧92, 0.2≦“κ”/“α”≦2, “β”≦3, “μ”≦5, “β”+“μ”≦6, 0≦“γ”≦7, and 0≦“β”+“μ”+“γ”≦8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy. | 11-28-2013 |
20130167988 | Cu-Ni-Si-BASED COPPER ALLOY PLATE HAVING EXCELLENT DEEP DRAWING WORKABILITY AND METHOD OF MANUFACTURING THE SAME - The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm | 07-04-2013 |
20110266035 | CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME - [Object] To provide a conductive member which has a stable contact resistance, is difficult to be separated, and also decreases the inserting and drawing force when used for a connector. | 11-03-2011 |
20110265917 | HIGH-STRENGTH AND HIGH-ELECTRICAL CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD OF MANUFACTURING THE SAME - In a high-strength and high-electrical conductivity copper alloy rolled sheet, 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn are contained, [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9, a total cold rolling ratio is equal to or greater than 70%, a recrystallization ratio is equal to or less than 45% a an average grain size of recrystallized grains is in the range of 0.7 to 7 μm, an average grain diameter of precipitates is in the range of 2.0 to 11 nm, and an average grain size of fine crystals is in the range of 0.3 to 4 μm. By the precipitates of Co and P, the solid solution of Sn, and fine crystals, the strength, conductivity and ductility of the copper alloy rolled sheet are improved. | 11-03-2011 |
20110265916 | HIGH-STRENGTH AND HIGH-ELECTRICAL CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD OF MANUFACTURING THE SAME - A high-strength and high-electrical conductivity copper alloy rolled sheet has an alloy composition containing 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn and the balance including Cu and inevitable impurities, wherein [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9. In a metal structure, precipitates are formed, the shape of the precipitates is substantially circular or elliptical, the precipitates have an average grain diameter of 1.5 to 9.0 nm, or 90% or more of all the precipitates have a diameter of 15 nm or less to be fine precipitates, and the precipitates are uniformly dispersed. With the precipitation of the fine precipitates of Co and P and the solid-solution of Sn, the strength, conductivity and heat resistance are improved and a reduction in costs is realized. | 11-03-2011 |
20110174417 | HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY PIPE, ROD, OR WIRE - A high strength and high conductivity copper alloy pipe, rod, or wire is composed of an alloy composition containing 0.13 to 0.33 mass % of Co, 0.044 to 0.097 mass % of P, 0.005 to 0.80 mass % of Sn, and 0.00005 to 0.0050 mass % of O, wherein a content [Co] mass % of Co and a content [P] mass % of P satisfy a relationship of 2.9≦([Co]−0.007)/([P]−0.008)≦6.1, and the remainder includes Cu and inevitable impurities. The high strength and high conductivity copper alloy pipe, rod, or wire is produced by a process including a hot extruding process. Strength and conductivity of the high strength and high conductivity copper pipe, rod, or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. | 07-21-2011 |
20110146855 | Cu-Mg-P based copper alloy material and method of producing the same - A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm | 06-23-2011 |
20110100676 | HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY ROD OR WIRE - A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced. | 05-05-2011 |
20110097238 | SILVER-WHITE COPPER ALLOY AND PROCESS FOR PRODUCING THE SAME - To provide a silver-white copper alloy which represents a silver-white color equivalent to that of nickel silver and is excellent in hot workability and the like. The silver-white copper alloy includes 47.5 to 50.5 mass % of Cu, 7.8 to 9.8 mass % of Ni, 4.7 to 6.3 mass % of Mn, and the remainder including Zn, and the silver-white copper alloy has an alloy composition satisfying relationships of f1=[Cu]+1.4×[Ni]+0.3×[Mn]=62.0 to 64.0, f2=[Mn]/[Ni]=0.49 to 0.68, and f3=[Ni]+[Mn]=13.0 to 15.5 among a content [Cu] mass % of Cu, a content [Ni] mass % of Ni, and a content [Mn] mass % of Mn, and has a metal structure in which β phases at an area ratio of 2 to 17% are dispersed in an α-phase matrix. The copper alloy is provided as a hot processing material or continuous casting material formed by performing one or more heat treatments and cold processes on a hot processing raw material formed by performing a hot process on an ingot or a casting raw material obtained by continuous casting. | 04-28-2011 |
20110094085 | METHOD FOR PRODUCING CONTOUR STRIP - A method for producing a contour strip includes a rough rolling step for rolling a plate material to form a contour molding material, a slitting step for slitting the contour molding material at the middle position in the width direction of a thick portion or a thin portion at both side edge portions thereof to form a contour slit material, and a stretching step for stretching the contour slit material to obtain a contour strip. Rolling is carried out in the rough rolling step so that Δt is 0.01 or less, e is 0.15 or less, D | 04-28-2011 |
20110056596 | HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY COPPER ALLOY TUBE AND METHOD FOR PRODUCING THE SAME - A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube. | 03-10-2011 |
20100172791 | ALUMINUM-BRONZE ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - An aluminum-bronze alloy as raw materials for Semi Solid Metal casting has a component composition containing Al of 5 to 10 mass %, Zr of 0.0005 to 0.04 mass %, and P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing Si of 0.5 to 3 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass % as needed. | 07-08-2010 |
20100166595 | PHOSPHOR-BRONZE ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - A phosphor-bronze alloy as raw materials for Semi Solid Metal casting has a component composition containing Sn of 4 to 15 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing Zn of 0.1 to 7.5 mass % as needed, and further containing one or more kinds of Pb of 0.01 to 4.5 mass %, Bi of 0.01 to 3.0 mass %, Se of 0.03 to 1.0 mass %, and Te of 0.01 to 1.0 mass % as needed. | 07-01-2010 |
20090320964 | HEAT RESISTANCE COPPER ALLOY MATERIALS - The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4≦([Co]−0.02)/[P]≦5.2 and 0.20≦[Co]+0.5 [P]+0.9 [Sn]+0.1 [Zn]≦0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes. | 12-31-2009 |
20090294087 | BRASS ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - A brass alloy as raw materials for Semi Solid Metal casting has a component composition containing Zn of 8 to 40 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing one or more kinds of Si of 2 to 5 mass %, Sn of 0.05 to 6 mass %, and Al of 0.05 to 3.5 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass %. | 12-03-2009 |
20090016927 | BRASS ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - A brass alloy as raw materials for Semi Solid Metal casting has a component composition containing Zn of 8 to 40 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing one or more kinds of Si of 2 to 5 mass %, Sn of 0.05 to 6 mass %, and Al of 0.05 to 3.5 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass %. | 01-15-2009 |