Meiko Electronics Co., Ltd. Patent applications |
Patent application number | Title | Published |
20160143126 | METHOD OF FABRICATING HEAT DISSIPATING BOARD - A method of fabricating a heat dissipating board according to the present invention, includes: a substrate intermediate forming step of forming a substrate intermediate with an insulating layer made of an insulating resin material and a conducting layer made of a conductive material formed on the insulating layer; a through hole forming step of forming a through hole having an approximately cylindrical shape, the through hole penetrating through the substrate intermediate; an inserting step of inserting a heat conducting member to be disposed in the through hole, the heat conducting member being made of a metal and having an approximately cylindrical shape; and a plastically deforming step of plastically deforming the heat conducting member to be secured in the through hole. Prior to the inserting step, an annealing step of annealing the heat conducting member is performed. | 05-19-2016 |
20160118346 | DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - A device embedded substrate includes: an insulating layer; a first metal layer and a second metal layer that are formed such that the insulating layer is sandwiched therebetween; a device that is embedded in the insulating layer, and in which a connection terminal non-formation surface where a connection terminal is not formed is located on a side close to the first metal layer; an adhesive layer that is located on the connection terminal non-formation surface of the device; and a conductive via that electrically connects the second metal layer and the connection terminal of the device, wherein an area of the adhesive layer on a surface side in contact with the device is smaller than an area of the connection terminal non-formation surface of the device. | 04-28-2016 |
20160099215 | METHOD FOR MANUFACTURING DEVICE EMBEDDED SUBSTRATE, AND DEVICE EMBEDDED SUBSTRATE - In a method for manufacturing a device embedded substrate, a conductive via that penetrates a first insulating layer and a second insulating layer from an outer metal layer to reach a second terminal of an IC device is formed after forming the outer metal layer. | 04-07-2016 |
20160016318 | SUCTION DEVICE - The suction device ( | 01-21-2016 |
20150382478 | DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF DEVICE EMBEDDED SUBSTRATE - A device embedded substrate includes an insulating layer including an insulating resin material, a device embedded in the insulating layer, a metal film coating at least one face of the device, and a roughened portion formed by roughening at least part of the surface of the metal film. Preferably, the device embedded substrate further includes: a conductive layer pattern-formed on a bottom face, the bottom face being one face of the insulating layer; and a bonding agent made of a material different from the insulating layer and joining the conductive layer ( | 12-31-2015 |
20150373829 | PRINTED WIRING BOARD - A printed wiring board includes: an inner layer structure body containing at least an inner layer insulative base material composed of a glass cloth and resin which covers the glass cloth and not containing a resin insulative base material composed only of resin; outer layer wiring formed on a first face of the inner layer structure body; and a solder resist layer formed on a surface of the outer layer wiring, wherein in the inner layer structure body, an opening part is formed, and the solder resist layer is composed of a first ink part covering at least the outer layer wiring that is formed on a partial region of the first face which corresponds to the opening part and a second ink part interposing both ends of the first ink part and being lower in flexibility than the first ink part. | 12-24-2015 |
20150327369 | Device Embedded Substrate and Manufacturing Method of Device Embedded Substrate - A device embedded substrate ( | 11-12-2015 |
20150257284 | METHOD OF BENDING BACK RIGID PRINTED WIRING BOARD WITH FLEXIBLE PORTION - A method for bending back a rigid printed wiring board with a flexible portion includes: forming a preparation substrate on a surface of a prepreg made of thermosetting resin, the preparation substrate including a conducting layer made of a conductive material; laminating the plurality of preparation substrates; thermally hardening the thermosetting resin so as to integrate the plurality of laminated preparation substrates as an intermediate substrate while heating and pressing together the plurality of preparation substrates; cutting an insulating layer formed by thermally hardening the thermosetting resin in a lamination direction of the preparation substrate so as to form a flexible portion, the flexible portion being thinly formed across opposed both edges of the intermediate substrate to form a complete substrate; bending the flexible portion; bending-back the flexible portion; and dehydrating by raising a temperature of the bent flexible portion before bending-back the flexible portion. | 09-10-2015 |
20150245475 | COMPONENT-EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention provides a component-embedded substrate ( | 08-27-2015 |
20150243628 | Manufacturing Method of Device Embedded Substrate and Device Embedded Substrate Manufactured by this Method - The present invention provides a manufacturing method of a device embedded substrate, including: forming a bonding layer of an insulation material on a metal layer formed on a support plate; and mounting an electric or electronic device on the bonding layer, wherein the device is formed of a device main body and a protruding terminal; the bonding layer includes a first bonding body bonded with the metal layer and a second bonding body bonded with the device; the first bonding body is formed along the outer edge of the device; the second bonding body is formed in an area equal or smaller than the area defined by the outer edge of the terminal; and, in the bonding layer forming step, the second bonding body is formed on the first bonding body after the first bonding body is cured. | 08-27-2015 |
20150237734 | MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPONENT INCORPORATED SUBSTRATE MANUFACTURED USING THE METHOD - In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line. | 08-20-2015 |
20150152124 | SURFACE TREATMENT METHOD, SURFACE TREATMENT AGENT, AND NOVEL COMPOUND - Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: said compound (α) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present. | 06-04-2015 |
20140299367 | Component-Embedded Substrate Manufacturing Method and Component-Embedded Substrate Manufactured Using the Same - The method includes forming an annular seat and main marks on a metal layer simultaneously so that the annular seat opposes with a terminal of an electronic component when the component is placed above the annular seat at a subsequent step; then positioning the electronic component in a mounting expected region using the main marks and mounting the electronic component with an adhesive layer therebetween; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and thereby forming first and second windows; then irradiating the adhesive layer with laser using the exposed main marks thereby forming a laser via hole; and then filling the laser via hole with copper and forming a wiring pattern from the metal layer electrically connected to the terminal through a conductive via. | 10-09-2014 |
20140216801 | METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-EMBEDDED SUBSTRATE MANUFACTURED BY THE SAME - A method of manufacturing a component-embedded substrate comprises forming an adhesive layer on a metal layer formed on a supporting plate, and mounting an electric or electronic component on the adhesive layer, wherein the component includes a component main body and a protrusion that protrudes beyond the component main body toward the adhesive layer, the adhesive layer includes a first adhesive body and a second adhesive body, the first adhesive body is formed only at a position corresponding to the protrusion, the second adhesive body is formed in an area corresponding to the whole of the surface of the component facing the adhesive layer after the first adhesive body is cured, and the component is mounted with the protrusion aligned with the first adhesive body in the component mounting step. | 08-07-2014 |
20140111238 | SPIRAL PROBE AND METHOD OF MANUFACTURING THE SPIRAL PROBE - A spiral probe includes a tapered distal end portion ( | 04-24-2014 |
20130242516 | Method of Manufacturing Component-Embedded Substrate, and Component-Embedded Substrate Manufactured Using the Method - A thin conductive layer which is to form a conductor pattern ( | 09-19-2013 |
20130183534 | PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM - The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer. | 07-18-2013 |
20130176701 | COMPONENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURING THE COMPONENT- EMBEDDED SUBSTRATE - A component-embedded substrate includes an electrically insulating base ( | 07-11-2013 |