Lexvu Opto Microelectronics Technology (Shanghai) Ltd Patent applications |
Patent application number | Title | Published |
20140284632 | DISPLAY DEVICE HAVING MEMS TRANSMISSIVE LIGHT VALVE AND METHOD FOR FORMING THE SAME - A display device having a MEMS transmissive light valve and a method for forming the same are provided. The method includes: providing a multilayer semiconductor substrate comprising a bottom semiconductor layer, a middle buried layer and a top semiconductor layer; forming a light guide opening in the top semiconductor layer; forming at least one MOS device in a remaining part of the top semiconductor layer; forming an interconnection layer and an interlayer dielectric layer on the at least one MOS; forming a MEMS transmissive light valve, which is electrically connected to the interconnection layer, on the light guide opening, where the MEMS transmissive light valve is surrounded by the interlayer dielectric layer; forming a transparent backplane on a top surface of the interlayer dielectric layer; and removing the bottom semiconductor layer. | 09-25-2014 |
20140267979 | Panel Display Device - A panel display device is provided, which includes: a transparent back panel having a first surface and a second surface, where the first surface is adapted for reflecting incident lights from the outside, and the second surface is adapted for transmitting lights from the outside; a backlight source, disposed at one side of the second surface of the transparent back panel, which is adapted for emitting lights to the transparent back panel; a polarized grating, disposed at one side of the first surface of the transparent back panel, which includes a plurality of grating strips with gaps formed between neighbouring grating strips, where the polarized grating enables the incident lights from the transparent back panel to be polarized and then pass through the gaps; a semiconductor switch array; and a transmission light valve array. The panel display device of the disclosure increase the utilization efficiency of lights. | 09-18-2014 |
20140139937 | MICRO-ELECTRO-MECHANICAL SYSTEM BASED FOCUSING DEVICE AND MANUFACTURING METHOD THEREOF - A micro-electro-mechanical system based focusing device and manufacturing method thereof are disclosed. The system includes: a deformable lens, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable lens and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable lens and their external edges are connected with the fixed parts. The conductive structs are fixedly connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable lens to be stretched and rotate, thus, surface curvature and focal length are changed. The device has a small size, low power consumption and low manufacturing cost. | 05-22-2014 |
20140139727 | MICRO-ELECTRO-MECHANICAL SYSTEM BASED DEVICE FOR ADJUSTING APERTURE AND MANUFACTURING METHOD THEREOF - A micro-electro-mechanical system based device for adjusting aperture and a manufacturing method thereof are disclosed. The system includes: an opaque deformable aperture ring, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable aperture ring and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable aperture ring, and their external edges are connected with the fixed parts. The conductive structs are connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable aperture ring to be stretched and rotate, so that area of an inner bore of the deformable aperture ring is changed. | 05-22-2014 |
20140111842 | DISPLAY DEVICE PROVIDED WITH MEMS LIGHT VALVE AND FORMING METHOD THEREOF - A display device provided with an MEMS light valve, comprising: a substrate, a fixed grating located on the substrate, an MEMS light valve for controlling the opening and closing of the fixed grating; a guide is disposed on the substrate. The MEMS light valve comprises: a movable grating, a movable electrode and fixed electrodes; the moveable grating is located in the guide and is electrically connected to the guide when contacting the guide; one end of the movable electrode is fixedly connected with the movable grating, and the other end is suspended; and the fixed electrodes and the movable electrode form a capacitor. When a potential difference forms between the fixed electrodes and the movable electrode, the movable electrode drives the movable grating to move in the guide, thereby opening and closing the fixed grating. Therefore, the MEMS light valve sensitivity can be enhanced and reliability is improved. | 04-24-2014 |
20140029077 | DISPLAY DEVICE PROVIDED WITH MEMS LIGHT VALVE AND FORMING METHOD THEREOF - A display device provided with an MEMS light valve, comprising: a substrate, a fixed optical grating located on the substrate, an MEMS light valve for controlling the opening and closing of the fixed optical grating, the MEMS light valve comprises a first light valve and a second light valve; the opening and closing of the fixed optical grating is controlled via controlling the movement of the first light valve and the second light valve, and the moving directions of the first light valve and the second light valve are opposite. Also disclosed is a method for forming a display device provided with an MEMS light valve. Thus the sensitivity of the MEMS light valve is improved. | 01-30-2014 |
20130309797 | METHOD FOR MANUFACTURING MEMS DEVICE - A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure ( | 11-21-2013 |
20130307165 | METHOD FOR LOW TEMPERATURE WAFER BONDING AND BONDED STRUCTURE - A low temperature wafer bonding method and a bonded structure are provided. The method includes: providing a first substrate having a plurality of metal pads and a first dielectric layer close to the metal pads, where the metal pads and the first dielectric layer are on a top surface of the first substrate; providing a second substrate having a plurality of semiconductor pads and a second dielectric layer close to the semiconductor pads, where the semiconductor pads and the second dielectric layer are on a top surface of the second substrate; disposing at least one of the metal pads in direct contact with at least one of the semiconductor pads, and disposing the first dielectric layer in direct contact with the second dielectric layer; and bonding the metal pads with the semiconductor pads, and bonding the first dielectric layer with the second dielectric layer. | 11-21-2013 |
20130285168 | MEMS INERTIAL SENSOR AND METHOD FOR MANUFACTURING THE SAME - A MEMS inertial sensor and a method for manufacturing the same are provided. The method includes: depositing a first carbon layer on a semiconductor substrate; patterning the first carbon layer to form a fixed anchor bolt, an inertial anchor bolt and a bottom sealing ring; forming a contact plug in the fixed anchor bolt and a contact plug in the inertial anchor bolt; forming a first fixed electrode, an inertial electrode and a connection electrode on the first carbon layer, where the first fixed electrode and the inertial electrode constitute a capacitor; forming a second carbon layer on the first fixed electrode and the inertial electrode; and forming a sealing cap layer on the second carbon layer and the top sealing ring. Under an inertial force, only the inertial electrode may move, the fixed electrode will almost not move or vibrate, which improves the accuracy of the MEMS inertial sensor. | 10-31-2013 |
20130240962 | Photosensitive Imaging Device and Method for Forming Semiconductor Device - A photosensitive imaging device and a method for forming a semiconductor device are provided. The method includes: providing a first device layer formed on a first substrate, wherein a conductive top bonding pad layer is formed on the first device layer; providing a continuous second device layer formed on a second substrate, wherein a continuous conductive adhesion layer is formed on the continuous second device layer; bonding the first device layer with the second device layer, where the top bonding pad layer on the first device layer is directly connected with the conductive continuous adhesion layer on the continuous second device layer; removing the second substrate; selectively etching the continuous second device and the continuous conductive adhesion layer to form a groove array; and filling up the groove array with an insulation material to form a plurality of second devices. Alignment accuracy may be improved. | 09-19-2013 |
20130221450 | MEMS DEVICE AND METHOD OF FORMING THE SAME - A micro electro mechanical system (MEMS) device and a method of forming the same are provided. The MEMS device comprises a semiconductor substrate ( | 08-29-2013 |
20130221421 | STACKED-GATE NON-VOLATILE FLASH MEMORY CELL, MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - A stacked-gate non-volatile flash memory cell, a memory device including the memory cell, and a manufacturing method thereof are provided. The memory cell includes a semiconductor structure and a movable switch ( | 08-29-2013 |
20130200957 | MEMS OSCILLATOR AND MANUFACTURING METHOD THEREOF - A crystal oscillator and manufacturing method thereof are provided. The crystal oscillator includes: a semiconductor substrate; an interlayer dielectric layer located on the surface of the semiconductor substrate, an excitation plate and a positive electrode plug and a negative electrode plug being formed inside the interlayer dielectric layer, and the positive electrode plug and the negative electrode plug being located at the both sides of the excitation plate; a bottom cavity on top of the excitation plate, located between the positive electrode plug and the negative electrode plug; a vibrating crystal located on the surface of the interlayer dielectric layer, across the bottom cavity and connected with the positive electrode plug and the negative plug, wherein the vibrating crystal connects the positive electrode plug and the negative electrode plug at its both sides and besides the other both sides are the free ends and do not contact with the surrounding objects; an isolating layer located on top of the interlayer dielectric layer, a gap between the isolating layer and the vibrating crystal thus forming a top cavity; a covering layer formed on the surface of the isolating layer. The crystal oscillator is manufactured based on Complementary Metal-Oxide-Semiconductor Transistor (CMOS) technology, and can be integrated into the semiconductor chip easily and can meet the requirement for the miniature components. | 08-08-2013 |
20130155487 | LIGHT MODULATOR PIXEL UNIT AND MANUFACTURING METHOD THEREOF - A light modulator pixel unit and the manufacturing method thereof are provided. The pixel unit includes a top electrode formed on a substrate, a movable electrode and a bottom electrode. Under the control of a control circuit, the position of the movable electrode would deflect. When the movable electrode is positioned in a first position, a first light is diffracted on the top electrode; when the movable electrode is positioned in a second position, a second light is diffracted on the top electrode; when the movable electrode is positioned in a third position, a third light is diffracted on the top electrode. The said first light, second light and third light are lights of three primary colors. The light modulator pixel unit of the present invention can modulate lights of three colors and is applicable in the field of micro-display system. | 06-20-2013 |
20130139594 | LEXVU OPTO MICROELECTRONICS TECHNOLOGY SHANGHAI (LTD) - An inertia MEMS sensor and a manufacturing method are provided. The inertia MEMS sensor includes a main body and a weight block relatively removable. The main body includes a first main body with a first surface and a second main body vertically connecting with the first surface. A first electrode parallel to the first surface is in the first main body. A second electrode perpendicular to the first surface is in the second main body. The weight block is suspended in a space defined by the first and second main bodies. The weight block includes a third electrode parallel to the first surface, a forth electrode is perpendicular to the first surface, and a weight layer. The third electrode connects with the forth electrode to form a U-shaped groove for accommodating the weight layer, thereby increasing the weight block weight, improving precision and reducing the cost. | 06-06-2013 |
20130129118 | MICRO-ELECTRO-MECHANICAL MICROPHONE AND METHOD FOR MANUFACTURING THE SAME - A micro-electro-mechanical microphone and manufacturing method thereof are provided in the invention. The micro-electro-mechanical microphone comprises: a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely by sensing the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner; the air gap cavity is connected with the back cavity through the air holes of the electrode plate; the back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate. The micro-electro-mechanical microphone in the invention is formed on the surface of one side of the semiconductor substrate, and the manufacturing method thereof is compatible with CMOS technics, therefore the device is easy to be miniaturized and integrated into a semiconductor chip. | 05-23-2013 |
20130119822 | MEMS DEVICE AND MANUFACTURING METHOD THEREOF - A Micro-Electro-Mechanical System (MEMS) device and its manufacturing method are provided. Said device comprises a MEMS component and said component comprises a main body ( | 05-16-2013 |
20130118280 | GYROSCOPE AND METHOD FOR MANUFACTURING THE SAME - A gyroscope and a manufacturing method are provided. The gyroscope comprises: a substrate with a bottom driving electrode and a bottom measuring electrode, and a dielectric layer with a sealed cavity comprising: a central axis on the substrate; a support ring on the substrate rotatable around the central axis; a mass ring surrounding and having common central axis with the support ring; cantilevers connected with the support ring and the mass ring and suspend the mass ring in the cavity; elastic components among the support ring, the mass ring and two adjacent cantilevers; a top driving electrode overlaying the support ring, the mass ring, the cantilevers and the elastic components; a conductive plug connected with top driving electrode and bottom driving electrode on the elastic components. The mass ring comprises an insulation layer and a weight layer. Stability and performance of the gyroscope may be improved. | 05-16-2013 |
20130107349 | LIGHT MODULATOR PIXEL UNIT AND MANUFACTURING METHOD THEREOF | 05-02-2013 |
20130094803 | OPTICAL PATH SWITCH AND OPTICAL ROUTER - An optical path switch and an optical router are provided. The optical path switch comprises an input optical path ( | 04-18-2013 |
20130076995 | PROJECTION DISPLAY DEVICE - A projection display device includes a first display panel ( | 03-28-2013 |