| Lextar Electronics Corporation Patent applications |
| Patent application number | Title | Published |
|---|
| 20150214442 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD THEREOF - A light emitting diode (LED) package structure is provided. The LED package structure comprises a substrate, at least one LED chip, an encapsulating compound and a curing material. The substrate has a first surface and a second surface opposite to the first surface. The LED chip is disposed on the first surface. The encapsulating compound covers the LED chip. The encapsulating compound has a plurality of particulate phosphors therein. The phosphors are centralized near a side of the encapsulating compound away from the substrate. The curing material is adhered to the side of the encapsulating compound away from the substrate. | 07-30-2015 |
| 20150192277 | PANEL LAMP WITH AN EASILY ASSEMBLED LAMPSHADE - A panel lamp includes a lamp housing, multiple first punched holes, multiple second punched holes, multiple first protruding bent portions, multiple second protruding bent portions, a light source module, and a lampshade. The lamp housing includes a first side plate and a second side plate opposite thereto. The first and second side plates respectively include a first folded portion and a second folded portion. Each first protruding bent portion is adjacent to each first punched hole. The first protruding bent portions and first folded portion form a first fixing mechanism. Each second protruding bent portion is adjacent to each second punched hole. The second protruding bent portions and second folded portion form a second fixing mechanism. The lampshade includes a first edge and a second edge. The first and second edges are respectively held by the first and second fixing mechanisms and are fixed to the lamp housing. | 07-09-2015 |
| 20150188012 | LIGHT-EMITTING DIODE ELEMENTS - A light-emitting diode element is provided. N light-emitting diode chips are arranged on a substrate. Each light-emitting diode chip includes a first-type semiconductor layer, an active layer, a second-type semiconductor layer, a first electrode, and a second electrode. The first-type semiconductor layer is disposed on the substrate. The active layer is disposed on the first-type semiconductor layer to bare a surface of a portion of the first-type semiconductor layer. The second-type semiconductor layer is disposed on the active layer. The first and second electrode are disposed on the first-type and second-type semiconductor layers respectively. The second electrode is close to a side of the second-type semiconductor layer which is opposite side of the first-type semiconductor layer. First and second connection lines connect the first electrode of an i-th light-emitting diode chip and the second electrode of an (i+1)-th light-emitting diode chip among the light-emitting diode chips. | 07-02-2015 |
| 20150187997 | LIGHT-EMITTING DIODE CHIP - A light-emitting diode (LED) chip is disclosed. The LED chip includes a substrate and a LED stack on the substrate. The LED stack includes a first-type semiconductor layer, an active layer covering a portion and exposing another portion of the first-type semiconductor layer, and a second-type semiconductor layer on the active layer. A current spreading layer is formed on the second-type semiconductor layer. A first electrode is formed on the exposed portion of the first-type semiconductor layer, and a second electrode is formed on the current spreading layer. The current spreading layer includes a first portion having a first thickness and a second portion having a second thickness. A vertical projection of the second portion onto the first-type semiconductor layer surrounds a vertical projection of a portion of the first electrode onto the first-type semiconductor layer. The first thickness is greater than the second thickness. | 07-02-2015 |
| 20150162510 | LIGHT EMITTING DIODE MODULE - A light emitting diode module includes a lead frame, a first light emitting diode chip, a second light emitting diode chip, an encapsulant, and a lens structure. The lead frame has a die-bonding surface and a side wall together defining an accommodating recess. The encapsulant is filled in the accommodating recess, and covers the first and the second light emitting diode chips. The lens structure disposed on the lead frame has a bottom surface, a reflective surface, a first, a second, a third, and a fourth light emitting curved surface. The light emitting curved surfaces are respectively disposed opposite to the bottom surface. An adjacent position among the light emitting curved surfaces is a lowest point nearest to the bottom surface. The first and the second light emitting diode chips are disposed at the projections of the first and the second light emitting curved surface on the die-bonding surface. | 06-11-2015 |
| 20150162496 | METHOD FOR FABRICATING LIGHT-EMITTING DIODE DEVICE - The invention provides a method for fabricating a light-emitting diode device. The method includes providing a carrier having a first surface and a second surface. The first surface has insulating micro patterns. A buffer layer, a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer are grown on the first surface to form a light-emitting lamination layer. A substrate is provided for the second-type semiconductor layer to bond on. The carrier is lifted off from the light-emitting lamination layer by a laser lift-off process, and surfaces of the insulating micro patterns and a surface of the barrier layer between the insulating micro patterns are exposed. The insulating micro patterns and the barrier layer are removed. Recess structures are formed on the first-type semiconductor layer. A surface-roughing process is then performed on the recess structures. | 06-11-2015 |
| 20150159815 | DIRECT-TYPE ILLUMINATION DEVICE AND LIGHT BAR STRUCTURE FOR USE THEREIN - A light bar structure is disclosed. A light source module is disposed on a circuit board. At least two power input portions are disposed on the circuit board and are in parallel connection. The at least two power input portions are electrically connected to the light source module. | 06-11-2015 |
| 20150155451 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure includes a substrate, a light emitting diode chip and a terminal connecting portion. The substrate has a first surface and a second surface that are opposite to each other, and a side surface surrounding and connecting the first surface and the second surface. The first surface has a predetermined die bonding area and the light emitting diode chip is disposed on the die bonding area. The terminal connecting portion protrudes from the side surface and is electrically connected to the light emitting diode chip. | 06-04-2015 |
| 20150147832 | METHOD FOR PRODUCING LIGHT-EMITTING DIODE - A method for producing a light-emitting diode is provided, including the following steps. First, a carrier is provided, wherein the carrier comprises a die bonding surface. Then, a die bonding adhesive layer is formed on the die bonding surface, wherein the die bonding adhesive layer has a photoresist property. Next, at least one lighting chip is disposed on the die bonding adhesive layer, and an uncovered portion of the die bonding adhesive layer is not covered by the lighting chip. Finally, the uncovered portion of the die bonding adhesive layer is removed. | 05-28-2015 |
| 20150146437 | LIGHT EMITTING DIODE PROJECTION BULB - The disclosure provides a light emitting diode projection bulb including a heat dissipation base, a light emitting diode module, and a annular heat dissipation member. The heat dissipation base includes a bottom surface, a sidewall surrounding the bottom surface, and a annular rim. The annular rim is connected to an end of the sidewall to define a first opening facing toward outside. A surface of the annular rim forms a plurality of first convection holes and a plurality of first locating portions. The light emitting diode module is installed on the bottom surface of the heat dissipation base and emits light toward the first opening. The annular heat dissipation member includes a second opening, a plurality of second convection holes, and a plurality of second locating portions. | 05-28-2015 |
| 20150137158 | LED PACKAGE FRAME AND LED PACKAGE STRUCTURE - A light-emitting diode (LED) package frame is provided, including a leadframe and an insulating member. The leadframe includes a first electrode and a second electrode separated from each other. The insulating member is disposed between the first electrode and the second electrode for insulation between the first and second electrodes, including a first protrusion and a second protrusion. The coefficient of thermal expansion of the insulating member is greater than that of the leadframe. Specifically, the first electrode and the second electrode respectively include a first recess and a second recess which abut the insulating member. The first protrusion and the second protrusion are respectively engaged with the first recess and the second recess. | 05-21-2015 |
| 20150137157 | ILLUMINATING DEVICE - An illuminating device including a substrate, a light-emitting diode element disposed on the substrate, an electrode element, and a sealing ring. The substrate has a groove, and the electrode element has a retaining slot disposed in the groove. The sealing ring is embedded into the retaining slot and a part of the groove to tightly fix the electrode element on the groove. | 05-21-2015 |
| 20150117037 | LAMP STRUCTURE - A lamp structure includes a shell, a light board, at least one light emitting diode, two electrical connecting elements, an electrical terminal, and a driving module. The shell has a first end and a second end opposite to each other. The light board is disposed on the first end of the shell. The light board has two through holes and two conductive portions respectively disposed adjacent to the through holes. The electrical connecting elements are disposed around the through holes and on the light board, and electrically connected to the conductive portions, respectively. The driving module includes a driving circuit and two electrodes. The driving circuit is disposed at a side of the light board opposite to the light emitting diode. The two electrodes are electrically connected to the driving circuit. The two electrodes thread through the two through holes and interfere with the two electrical connecting elements, respectively. | 04-30-2015 |
| 20150117012 | LIGHT EMITTING DIODE DEVICE AND LIGHT EMITTING DIODE LAMP - A light emitting diode (LED) device includes a transparent substrate, a first reflection layer, a LED chip, a positive electrode, a negative electrode and a wavelength-converting layer. The LED chip is disposed on a surface of the transparent substrate, and the first reflection layer is disposed between the LED chip and the transparent substrate. The positive electrode and the negative electrode are disposed on an end portion of the transparent substrate and are electrically connected with the LED chip. The wavelength-converting layer covers the first reflection layer and the LED chip. | 04-30-2015 |
| 20150115308 | LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - The present disclosure provides a light-emitting diode package, including: a carrier; a light-emitting diode chip disposed over the carrier and electrically connected to the carrier, wherein the light-emitting diode chip includes at least two recesses at corners located on a diagonal line of the light-emitting diode chip; a eutectic layer disposed between the light-emitting diode chip and the carrier, wherein the eutectic layer includes at least two metal pillars embedded into the at least two recesses respectively, wherein an upper portion of the metal pillars covers a portion of a top surface of the light-emitting diode chip. The present disclosure also provides a method for manufacturing a light-emitting diode package. | 04-30-2015 |
| 20150115301 | ELECTRODE STRUCTURE AND LIGHT EMITTING DIODE STRUCTURE HAVING THE SAME - An electrode structure includes at least one reflection layer, a barrier layer, and a conductive pad. The barrier layer includes a first barrier layer and a second barrier layer. The first and second barrier layers are stacked on the reflection layer in sequence. The first and second barrier layers are made of different materials. The conductive pad is located on the barrier layer. | 04-30-2015 |
| 20150115276 | LIGHT-EMITTING DIODE - The disclosure provides a light-emitting diode which includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a reflective layer, a current blocking layer and a current spreading layer. The light-emitting layer is positioned on the first semiconductor layer, and the second semiconductor layer is positioned on the light-emitting layer. The reflective layer is positioned on a part of the second semiconductor layer, so as to expose another part of the second semiconductor layer. The current blocking layer covers the reflective layer, and the current spreading layer covers the exposed second semiconductor layer and current blocking layer. | 04-30-2015 |
| 20150111322 | MANUFACTURING METHOD OF LIGHT-EMITTING STRUCTURE - A manufacturing method of a light-emitting structure is provided. The manufacturing method comprises the following steps. Firstly, a light-emitting die is formed on a carrier substrate carrier substrate, wherein the light-emitting die comprises a first type semiconductor layer, a light-emitting layer and a second type semiconductor layer in order, and has an electrode hole passing through the second type semiconductor layer, the light-emitting layer and a part of the first type semiconductor layer. Next, a current blocking layer covering an inner sidewall of the electrode hole is formed. Then, a current spreading layer covering the current blocking layer is formed, wherein the current spreading layer is separated from the inner sidewall by the current blocking layer. Then, the current blocking layer covering the inner sidewall of the electrode hole is removed. | 04-23-2015 |
| 20150108650 | EUTECTIC SOLDER STRUCTURE FOR CHIP - The present invention provides a eutectic solder structure for a chip including a substrate and a solder structure on the substrate. The solder structure includes an alternate lamination of a plurality of first metal layers and a plurality of second metal layers, wherein each second metal layer has a continuous region and a plurality of openings and the melting point of the plurality of second metal layers is higher than that of the plurality of first metal layers. The eutectic solder structure for a chip also includes a chip on the solder structure, wherein the chip is bonded to the substrate by a eutectic reaction of the solder structure. | 04-23-2015 |
| 20150108519 | LIGHT-EMITTING STRUCTURE - A light-emitting structure is provided, including a substrate, an LED stacked structure formed on the substrate, and a plurality of cavities formed on the substrate surrounding the LED stacked structure. The LED stacked structure comprises an N-type epitaxial layer, an illumination layer, and a P-type epitaxial layer. A portion of the N-type epitaxial layer is exposed. | 04-23-2015 |
| 20150108516 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND LIGHT EMITTING DIODE PACKAGE MODULE - A light emitting diode package structure includes a substrate, a light emitting diode chip, a light mixing encapsulating layer, and an ultraviolet protecting layer. The light emitting diode chip is disposed on a surface of the substrate and the light mixing encapsulating layer covers the light emitting diode chip. The ultraviolet protecting layer is adhered to a surface of the light mixing encapsulating layer such that when the ultraviolet protecting layer receives ultraviolet, the color change occurs to reflect or absorb the ultraviolet. | 04-23-2015 |
| 20150108491 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a lead frame, a light emitting diode chip, a wavelength conversion structure, and a filter. The light emitting diode chip is disposed on and electrically connected to the lead frame for providing a first light beam with a first wavelength. The light emitting diode chip is configured to provide a first light beam with a first wavelength. The wavelength conversion structure is disposed on the light emitting diode chip, and is configured to convert the first light beam into a second light beam with a second wavelength. The filter is disposed between the light emitting diode chip and the wavelength conversion structure. The filter allows the first light beam from the light emitting diode chip to pass therethrough to enter the wavelength conversion structure, and reflects the second light beam from the wavelength conversion structure back to the wavelength conversion structure. | 04-23-2015 |
| 20150098208 | PANEL LIGHT MODULE AND BACKLIGHT MODULE - A backlight module is provided, including a bottom plate, a light source, an edge frame, a diffusing sheet, a diffusing plate and a front frame. The light source is disposed on the bottom plate. The edge frame surrounds the light source and abuts the bottom plate to form a groove. The diffusing sheet includes a front side and a back side, wherein the front side is opposite the back side, and the diffusing sheet is disposed in a light-emitting direction of the light source. The diffusing plate is disposed on the front side of the diffusing sheet. The front frame includes a light-emitting opening, wherein a position groove is formed between the front frame and the edge frame, and the diffusing plate and the diffusing sheet are tightly clipped in the positioning groove. | 04-09-2015 |
| 20150097477 | LAMP AND ELECTRODE MODULE THEREOF - A lamp electrode module includes a lamp cap, a spring electrode, a bottom electrode and a first insulation member. The lamp electrode has an inner sidewall surrounded by an internal thread and an inner bottom surface adjacent to the inner sidewall. The spring electrode has a helix portion wedged in the internal thread and a first connecting portion extended from the helix portion and located inside the lamp cap. The bottom electrode includes a contacting portion abutting against an outer surface opposite to the inner surface and a second connecting portion passing through the lamp cap and erecting on the inner bottom surface. The first insulation member covers the helix portion of the spring electrode and the inner sidewall of the lamp cap. | 04-09-2015 |
| 20150097207 | SEMICONDUCTOR CHIP STRUCTURE - A semiconductor chip structure including a semiconductor chip having a pair of electrodes is disclosed. The electrodes have different conductivity types for electrical connection, respectively. A thermoelectric cooling material layer is disposed within each of the pair of electrodes, respectively. | 04-09-2015 |
| 20150087097 | METHOD FOR MANUFACTURING A LIGHT-EMITTING DIODE - The present disclosure provides a method for manufacturing a light-emitting diode, including: providing a substrate; forming a first semiconductor layer over the substrate; forming an active layer over the first semiconductor layer; forming a second semiconductor layer over the active layer; removing a portion of the second semiconductor layer and a portion of the active layer to expose a portion of the first semiconductor layer; conform to depositing a transparent conductive layer; forming a patterned mask layer over the transparent conductive layer; performing a wet etch process to remove a portion of the transparent conductive layer; performing a dry etch process to completely remove the portion of the transparent conductive layer not covered by the patterned mask layer; removing the patterned mask layer; and forming a first electrode and a second electrode. | 03-26-2015 |
| 20150077996 | HEAT SINK FOR ELECTRICAL ELEMENTS AND LIGHT-EMITTING DEVICE CONTAINING THEREOF - The disclosure provides a heat sink for electrical elements and a light-emitting device containing thereof. The heat sink includes a radiating substrate and at least one hollow radiating channel. In which, the hollow radiating channel is horizontally embedded in the radiating substrate, and has two openings disposed on the same site or the opposite sites of the radiating substrate, so that gas may flow in the hollow radiating channel and remove heat of the radiating substrate. And a light-emitting device containing the heat sink is also provided. | 03-19-2015 |
| 20150076542 | LIGHT EMITTING MODULE - The present disclosure provides a light emitting module, which includes a base board, a light emitting diode chip, a transparent thermoplastic layer, and fluorescent glue. The base board includes a die-bonding zone. The light emitting diode chip is bonded on the die-bonding zone. The light emitting diode chip includes an upper surface, a lower surface opposite to the upper surface, and a plurality of side surfaces adjoined between the upper surface and lower surfaces. A transparent thermoplastic layer encloses at least one portion of the light emitting diode chip. The fluorescent glue disposed over to cover the base board, the light emitting diode chip, and the transparent thermoplastic layer. | 03-19-2015 |
| 20150076537 | LIGHT-EMITTING DIODE - The present disclosure provides a light-emitting diode, including: a silicon substrate having a first surface and a second surface opposite to the first surface; a buffer layer disposed over the first surface of the substrate, wherein the buffer layer includes alternating SiC and In | 03-19-2015 |
| 20150076530 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device package is disclosed. The light-emitting device package includes a metal substrate. An insulating layer is on the metal substrate, wherein the insulating layer has at least one opening to expose the metal substrate. At least one light-emitting device is disposed in the at least one opening of the insulating layer. A sidewall of the at least one opening of the insulating layer is covered by an optical spacer. The disclosure also provides a method for manufacturing the light-emitting device package. | 03-19-2015 |
| 20150076445 | LIGHT-EMITTING DIODES - A light-emitting diode is provided. The light-emitting diode includes an N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer. A P-type electrode includes a body part and an extension part, wherein the body part is disposed on a corner of an upper surface of the P-type semiconductor layer and the extension part extends from the body part onto the N-type semiconductor layer along a sidewall of the P-type semiconductor layer adjacent to the N-type semiconductor layer. An N-type electrode is disposed on the N-type semiconductor layer. Moreover, a current blocking layer is disposed under the P-type electrode. A transparent conductive layer is disposed on a partial upper surface of the P-type semiconductor layer. | 03-19-2015 |
| 20150070931 | BACKLIGHT MODULE - A backlight module is provided, including a circuit board, a plurality of light-emitting elements, a frame, and a plurality of first and second light-reflecting portions. The light-emitting elements are disposed on the circuit board and separated from each other. The frame includes a base plate and two lateral plates extended from the base plate, wherein the circuit board is disposed on the base plate. The first and second light-reflecting portions are disposed on at least one of the lateral plates and arranged in a staggered manner. The first light-reflecting portions are closer to the light-emitting elements than the second light-reflecting portions. The reflectivity of the second light-reflecting portions exceeds that of the first light-reflecting portions. | 03-12-2015 |
| 20150069450 | LIGHT EMITTING MODULE - The present disclosure provides a light emitting module including a substrate, a light emitting diode, a first adhesive glue, and a second adhesive glue. The substrate has a first electrode and a second electrode. The light emitting diode is disposed on the substrate and has a third electrode and a fourth electrode. The first adhesive glue is located between the first electrode and the second electrode so as to enable the first electrode to be electrically connected to the second electrode. The second adhesive glue is located between the third electrode and the fourth electrode, so as to enable the third electrode to be electrically connected to the fourth electrode. The first adhesive glue includes a first conductive body and a first insulation body surrounding the first conductive body. The second adhesive glue includes a second conductive body and a second insulation body surrounding the second conductive body. | 03-12-2015 |
| 20150069427 | OMNIDIRECTIONAL LIGHTING UNIT AND ILLUMINATION DEVICE AND METHOD FOR MANUFACTURING OMNIDIRECTIONAL LIGHTING UNIT - An omnidirectional lighting unit is disclosed, which includes a light-emitting chip, a spherical package member, a diffusion layer, and two conductive structures. The light-emitting chip has a positive electrode and a negative electrode. The spherical package member encapsulates the light-emitting chip, and the diffusion layer covers an outer surface of the spherical package member. The two conductive structures are electrically connected to the positive and negative electrodes, respectively, and each of the two conductive structures penetrates through the spherical package member and the diffusion layer outwardly, such that a portion of each conductive structure is exposed the exterior of the diffusion layer. | 03-12-2015 |
| 20150069406 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure comprising a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, a current resisting layer, a current spreading layer, a first electrode and a second electrode is provided. The first semiconductor layer is formed on the substrate. The active layer covers a portion of the first semiconductor layer, and exposes another portion of the first semiconductor layer. The second semiconductor layer is formed on the active layer. The current resisting layer covers a portion of the second semiconductor layer, and exposes another portion of the second semiconductor layer. The current spreading layer covers the second semiconductor layer and the current resisting layer. The current spreading layer is formed with a reverse trapezoidal concave over the current resisting layer. The first electrode is disposed on the first semiconductor layer. The second electrode is disposed within the reverse trapezoidal concave. | 03-12-2015 |
| 20150062962 | LIGHTING APPARATUS - A lighting apparatus includes a lighting element and a light guide plate. The light guide plate includes an optical waveguide zone and a wavelength converting zone. The optical waveguide zone is disposed on the lighting element, and includes an upper total reflection surface, a lower total reflection surface, a light incident surface and a first light outgoing surface. The upper and lower total reflection surfaces are disposed on opposite sides of the optical waveguide zone. The light incident surface is positioned on a partial area of the lower total reflection surface, and positioned on the optical path of the light emitted by the lighting element. The first light outgoing surface connects the upper and lower total reflection surfaces. The wavelength converting zone is adjoined to the first light outgoing surface, and includes a wavelength converting material therein. | 03-05-2015 |
| 20150062922 | LENS DEVICE AND LIGHT SOURCE MODULE USING THE SAME - A lens device and a light source module using the same are provided. The lens device comprises a lens and a patterned light shielding layer. The lens has a middle light emitting surface and a periphery light emitting surface surrounding the middle light emitting surface. The patterned light shielding layer is formed on the periphery light emitting surface of the lens. | 03-05-2015 |
| 20150062887 | LIGHT BAR STRUCTURE - A light bar structure is provided, including a longitudinal circuit board, a plurality of light-emitting elements, and a power-input terminal. The circuit board includes a first segment, a second segment, and a third segment arranged along a longitudinal axis of the circuit board, wherein the second segment is between the first segment and the third segment. The light-emitting elements are disposed on the circuit board. The power-input terminal is disposed on the second segment and electrically connected to the light-emitting elements in parallel. | 03-05-2015 |
| 20150061525 | ILLUMINATION APPARATUS AUTOMATICALLY ADJUSTED WITH TIME - An illumination apparatus which comprises a timing module, a control module and a first power conversion module and can be automatically adjusted with time is provided. The timing module sets the time into N sessions, and generates an i | 03-05-2015 |
| 20150061518 | LIGHT ADJUSTING DEVICE WITH SWITCHING ELEMENT - A light adjusting device for adjusting the luminance of a light source is provided. The light adjusting device comprises a rectifier module, a first switch element, a second switch element and a control module. The rectifier module receives an AC signal from a first power node and a second power node, and rectifies the AC signal to output a driving signal to the light source. The first switch element is coupled to the first power node. The second switch element is coupled to the second power node. The control module outputs a control signal to the first and second switch elements to control the conduction states of the first and second switch elements. When the first and second switch elements are turned on, the driving signal provided to the light source is interrupted. | 03-05-2015 |
| 20150060915 | LED PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting diode (LED) packaging structure is provided, which includes a LED stacked layer, a first silicon substrate and a second silicon substrate. The first and second silicon substrates are respectively disposed on two opposite surfaces of the LED stacked layer. The first and second silicon substrates respectively have at least one first hollow portion and at least one second hollow portion, so as to expose the surfaces of a portion of the LED stacked layer. Light emitted by a light-emitting layer may go out through the first and second hollow portions. A method for manufacturing the LED packaging structure is also provided. | 03-05-2015 |
| 20150060914 | LIGHT-EMITTING ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - A light-emitting assembly and a method for manufacturing the same are provided. The light-emitting assembly includes a circuit board with a light-emitting element and a plurality of optical microstructures disposed thereon. The optical microstructures adjacent to the light-emitting element absorb or guide a portion of light emitted from the light-emitting element. | 03-05-2015 |
| 20150060913 | LIGHT-EMITTING DIODES AND FABRICATION METHODS THEREOF - A light-emitting diode is provided. The light-emitting diode includes an N-type epitaxial layer, a light-emitting layer disposed on a portion of the N-type epitaxial layer to expose a partial surface of the N-type epitaxial layer, and a P-type epitaxial layer disposed on the light-emitting layer, wherein the P-type epitaxial layer has a ladder-shaped sidewall. The light-emitting diode further includes a P-type electrode disposed on the P-type epitaxial layer and an N-type electrode disposed on the exposed surface of the N-type epitaxial layer. Furthermore, a method of fabricating a light-emitting diode is also provided. The method includes performing an anisotropic-etching process to a P-type epitaxial layer to form a rounded or a right-angled ladder on the sidewall of the P-type epitaxial layer. | 03-05-2015 |
| 20150055337 | LIGHT-EMITTING DEVICE - Disclosed herein is a light-emitting device that includes a blue light source, a first phosphor and a red light source. The blue light source emits blue light. The first phosphor is excited by the blue light to emit light that is then combined with the blue light to produce first white light. The first white light falls in a first region of (0.397, 0.502), (0.337, 0.512), (0.26, 0.34), and (0.313, 0.3334), based on a CIE 1931 color coordinate standard. The red light source emits red light to adjust the first white light into second white light. | 02-26-2015 |
| 20150055336 | PIXEL STRUCTURE AND DISPLAY USING THE SAME - A pixel structure comprising an N-side light emitting surface, several reflectors and several light emitting elements is provided. N is a nature number equal to or greater than 3. The light emitting surface has a first normal line. The reflectors surround peripherals of the light emitting surface. Each reflector, which correspondingly connects with a side of the light emitting surface, is connected to its adjoining reflectors and comprises a first reflecting portion and a second reflecting portion having a second normal line and a third normal line, respectively. The second and the first normal lines intercross to form an acute angle α, and the third and the first normal lines intercross to form an obtuse angle β. The lights emitted by the light emitting elements are reflected by the second reflecting portion of the reflectors so that the lights are directed towards the light emitting surface. | 02-26-2015 |
| 20150053915 | Light Emitting Diode - A light emitting diode includes a substrate, a first semiconductor layer, a luminous layer, a second semiconductor layer, a current diffusion layer, a third semiconductor layer, a first electrode, a second electrode, and an insulation layer. The first semiconductor layer is formed above the substrate. The luminous layer is formed on the first semiconductor layer, and exposes a portion of the first semiconductor layer. The second semiconductor layer is formed on the luminous layer. The current diffusion layer is formed on the second semiconductor layer. The third semiconductor layer is formed on the current diffusion layer. The first electrode is formed on the first semiconductor layer. The second electrode includes a base portion formed on the surface of the substrate, and plural comb structures extending upward vertically. Each tip of the comb structure is in the third semiconductor layer. The insulation layer exposes the tip of each comb structure. | 02-26-2015 |
| 20150049495 | LIGHT-EMITTING DEVICE - A light-emitting device comprising a lamp casing, a heat dissipation element and a light-emitting module is provided. A first opening and a second opening are formed on an upper end and a lower end of the lamp casing respectively. An edge of the lamp casing adjacent to the first opening is bended inward to form a bending portion. The heat dissipation element has several carrying portions separated from each other and arranged in radial-shape, and several fins perpendicular to the carrying portions. Each fin is bended downward and vertically from an edge of the carrying portions and extended toward the second opening. The light-emitting module comprises a substrate and several light-emitting elements. An edge of the substrate leans against the bending portion, such that the light-emitting module is sandwiched between the carrying portions and the e bending portion. | 02-19-2015 |
| 20150048385 | LIGHT EMITTING DIODE SUBSTRATE - A method of manufacturing a light emitting diode (LED) substrate includes following steps: providing a nano-patterned substrate, which has a plurality of convex portions and a plurality of first concave portions that are spaced apart from each other, wherein each first concave portion has a depth (d1); forming a plurality of protection structures to cover each convex portion, and exposing a bottom surface of each first concave portion; performing an anisotropic etching processing to etch the bottom surface of each first concave portion which is not covered by the protection structure so as to form a plurality of second concave portions having a depth (d2), and d2 is greater than d1. | 02-19-2015 |
| 20150048303 | LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THEREOF - The disclosure provides a light-emitting diode (LED) and a method for manufacturing the same. The LED includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first current spreading layer, a current blocking having a plurality of nitrogen vacancies, and a second current spreading layer, wherein the second spreading layer includes a current spreading area and a current blocking area. The current blocking area is formed the nitrogen vacancies by high power sputtering on the current blocking area of the second semiconductor layer, so as to increase the resistance of the current blocking area and occur the efficiency of current blocking. | 02-19-2015 |
| 20150043205 | LIGHT-EMITTING DEVICE - A light-emitting device comprising a string-shape circuit board, several light-emitting elements, a first terminal pair and a second terminal pair is provided. The string-shape circuit board has a first side and a second side. The first terminal pair and the second terminal pair are disposed on the first side and the second side respectively, and are electrically connected to the light-emitting elements. The first terminal pair comprises a first base, a second base, a first positive electrode and a first negative electrode. The first positive electrode and the first negative electrode are pivotally connected to the first base and the second base respectively. The second terminal pair comprises a third base, a fourth base, a second positive electrode and a second negative electrode. The second positive electrode and the second negative electrode are pivotally connected to the third base and the fourth base respectively. | 02-12-2015 |
| 20150042241 | LIGHT EMITTING DEVICE - A light emitting device comprising a carrier board, a first group of light emitting elements, a second group of light emitting elements and a driver circuit. The first group of light emitting elements includes a plurality of first LEDs disposing on the carrier board and are used for emitting a first color temperature light. The second group of light emitting elements includes a plurality of second LEDs disposing on the carrier board and are used for emitting a second color temperature light. The first LEDs and the second LEDs are disposed in an alternative arrangement. The driver circuit output a first and a second driving current to drives the first LED and the second LED respectively. When the first driving current is the maximum, the second driving current is the minimum, and vice versa. The minimum of the first driving current and the second driving current is not zero. | 02-12-2015 |
| 20150034982 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure is provided. The light emitting diode structure comprises a substrate, a light emitting multi-layer structure, a first current blocking layer, a first current spreading layer, a second current blocking layer and a second current spreading layer. The light emitting multi-layer structure is formed on the substrate by way of stacking. The first current blocking layer is formed on part of the light emitting multi-layer structure. The first current spreading layer covers the first current blocking layer and the light emitting multi-layer structure. The second current blocking layer is formed on part of the first current spreading layer. An orthogonal projection of the second current blocking layer is disposed in an orthogonal projection of the first current blocking layer. The second current spreading layer covers the second current blocking layer and the first current spreading layer. | 02-05-2015 |
| 20150034959 | PATTERNED SUBSTRATE AND LIGHT EMITTING DIODE STRUCTURE HAVING THE SAME - A light emitting diode structure includes a patterned substrate, an N-type semiconductor layer, a light emitting layer, and a P-type semiconductor layer. Plural protruding portions are formed on a surface of the substrate. A horizontal projection of each of the protruding portions on the surface of the substrate has a projection width W | 02-05-2015 |
| 20150029723 | LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND LIGHT-EMITTING DIODE LIGHT BULB - The disclosure provides a light-emitting diode (LED) package structure, including: a lead frame; at least two light-emitting diode chips having different light-emitting wavelengths disposed on the lead frame; an encapsulant disposed over the lead frame and covering the light-emitting diode chips, wherein the encapsulant has a first concave portion; and an optical glue disposed in the first concave portion, wherein the optical glue has a plurality of scattering particles to uniformly mix the lights of different wavelengths emitted by the light-emitting diode chips. | 01-29-2015 |
| 20150028379 | LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF - A light emitting diode includes a semiconductor epitaxial stack structure, a first transparent conductive layer and at least one second transparent conductive layer. The semiconductor epitaxial stack structure includes a first semiconductor layer, an active layer and a second semiconductor layer. The active layer is disposed on a portion of the second semiconductor layer. The first semiconductor layer is disposed on the active layer. The first transparent conductive layer is disposed on the first semiconductor layer, and includes plural first crystalline particles, wherein the average size thereof is d1. The second transparent conductive layer is disposed on the first transparent conductive layer, and includes plural second crystalline particles, wherein the average size thereof is d2, and d1 is greater than d2. | 01-29-2015 |
| 20150021633 | LIGHT-EMITTING DIODE PACKAGE AND LIGHT-EMITTING DEVICE - An LED package is disclosed, which includes a heat dissipation plate, a composite structure, an LED chip, and an encapsulant. The heat dissipation plate has a chip bonding area, a circuit area, and a first dam disposed at the boundary between the chip bonding area and the circuit area, wherein the first dam is formed by punching or bending the heat dissipation plate. The composite structure is disposed on the circuit area. The LED chip which is disposed on the chip bonding area is electrically connected to the composite structure and covered by the encapsulant. Also a light-emitting device using the LED package is disclosed. | 01-22-2015 |
| 20150015154 | LIGHT-EMITTING DIODE LIGHT TUBE DRIVING CIRCUIT - A light-emitting diode (LED) light tube driving circuit includes a LED driver and a rectifier unit. The LED driver is configured for receiving an operating voltage to drive at least one LED. The rectifier unit has a first input/output terminal and a second input/output terminal and is electrically coupled to an external alternating-current power source selectively by the first input/output terminal and the second input/output terminal. The rectifier unit is configured for providing the operating voltage to the LED driver. The rectifier unit further includes a first rectifier diode and a second rectifier diode. | 01-15-2015 |
| 20150014720 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A LED package structure including a carrier and a light emitting diode (LED) chip is provided. The LED chip includes a substrate, a patterned structure, a first semiconductor layer, an active layer and a second semiconductor layer. The substrate has a first surface and a second surface opposite to the first surface. The patterned structure is formed on the second surface of the substrate. The first semiconductor layer is disposed on the first surface of the substrate. The active layer is disposed on a portion of a surface of the first semiconductor layer, and other portion of the surface not covered by the active layer is exposed. The second semiconductor layer is disposed on the active layer. The LED chip is disposed on the carrier by way of flip-chip so that the first and the second semiconductor layers face towards the carrier. | 01-15-2015 |
| 20150011164 | WIRELESS CONTROL SYSTEM AND WIRELESS NETWORK EXPANSION METHOD APPLIED THERETO - A wireless control system and a wireless network expansion method applied thereto are provided. The wireless control system comprises a mobile platform and a plurality of wireless devices capable of switching between a first role and a second role. The wireless network expansion method comprises following steps. A mobile platform is turned on. The mobile platforms scans the wireless devices and links to any wireless device serving the first role and then sends a control command to corresponding wireless device, which accordingly broadcasts the control command. The control command is received by at least one wireless device serving the second role. The wireless devices cyclically switch between the first role and the second role to continuously broadcast the control command to other wireless devices serving the second role, so that all of the wireless devices can finally receive the control command from the mobile platform. | 01-08-2015 |
| 20150008846 | INTEGRATED WIRELESS AND WIRED LIGHT CONTROL SYSTEM - A light control system includes a wired control device, a wireless control device, a communication module, and light devices. The wired control device includes a first user interface and a first wired communication protocol interface. The wireless control device includes a second user interface and a first wireless communication protocol interface. The communication module includes a second wired communication protocol interface and a second wireless communication protocol interface. Each of the light devices includes a third wired communication protocol interface, and each of the light devices performs data exchange with the third wired communication protocol interface of another one of the light devices by a network cable connected to the third wired communication protocol interface. The first wired communication protocol interface and the first wireless communication protocol interface perform data exchange respectively with the second wired communication protocol interface and the second wireless communication protocol interface. | 01-08-2015 |
| 20150008472 | Light Emitting Diode - A light emitting diode including a substrate, a first type semiconductor layer, a luminous layer, a second type semiconductor layer, a first electrode, a transparent conductive layer, and a second electrode. The first type semiconductor layer is disposed on the substrate. The luminous layer is disposed on a portion of the first type semiconductor layer. The second type semiconductor layer is disposed on the luminous layer. The first electrode is disposed on a portion of the first type semiconductor layer not covered by the luminous layer. The transparent conductive layer disposed on the second type semiconductor layer has a plurality of through holes exposing the surface of the second type semiconductor layer. The second electrode is disposed on the transparent conductive layer. The distribution density D | 01-08-2015 |
| 20140377899 | LIGHT EMITTING DIODE CHIP MANUFACTURING METHOD - A light emitting diode chip manufacturing method includes the following steps: a substrate is provided. A first semiconductor layer is formed on the substrate. A light-emitting layer is formed on a portion of the first semiconductor layer, and the surface of the first semiconductor layer not covered by the light-emitting layer is exposed. A second semiconductor layer is formed on the light-emitting layer. A hard shielding layer is formed on the second semiconductor layer and the exposed surface of the first semiconductor layer, such that a multi-layer stacked structure is formed on the substrate. A cutting treatment is performed. An etching treatment is performed. The hard shielding layer is patterned to form a current blocking layer on the second semiconductor layer, and the current blocking layer is made of the hard shielding layer. | 12-25-2014 |
| 20140374767 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode (LED) structure includes a substrate, an LED element, a reverse current protection element, a third conductor, and a fourth conductor. The LED element includes a first N-type semiconductor layer, a first lighting layer, a first P-type semiconductor layer, a first transparent conductive layer, a first electrode, and a second electrode. The reverse current protection element is located on the substrate and surrounds the LED element. The reverse current protection element includes a stack layer, a first conductor, and a second conductor. The stack layer is formed on the substrate by sequentially stacking a second N-type semiconductor layer, a second lighting layer, and a second P-type semiconductor layer. The third conductor is electrically connected to the first conductor and the second electrode. The fourth conductor is electrically connected to the second conductor and the first electrode. | 12-25-2014 |
| 20140367635 | LIGHT EMITTING DIODE STRUCTURE - An LED structure includes a substrate, an emitting multilayer structure, a plurality of microstructures and a transparent conductive layer. The emitting multilayer structure is formed on the substrate. The microstructures are spaced apart from each other on the light emitting multilayer structure, and an upper surface of each microstructure has a concave-convex surface. The transparent conductive layer is conformably covered over the light emitting multilayer structure and the microstructures. The transparent conductive layer has similar concave-convex surfaces due to the concave-convex surface of each microstructure. The light emitted from the emitting multilayer structure is changed due to the concave-convex surface of the transparent conductive layer, so that the phenomenon of total internal reflection can be reduced so as to increase the light transmittance. | 12-18-2014 |
| 20140361325 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A package structure and methods for forming the package structure are provided. The package structure includes a lead frame having a chip bonding area and a shell surrounding a portion of the lead frame. The shell has an inner surface and an outer surface opposite to the inner surface. A cavity is recessed from the inner surface, and the chip bonding area is exposed from the cavity. The structure further includes a light emitting diode chip disposed over the chip bonding area and a first glue layer disposed in the cavity to cover the light emitting diode chip. A separation film is disposed on the first glue layer in the cavity and a second glue layer disposed on the separation film in the cavity. The second glue layer contains a wavelength conversion material and the first glue layer does not contain any wavelength conversion material. | 12-11-2014 |
| 20140361323 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A LED package structure includes a base portion, a light-emitting chip, a cup portion and an encapsulating glue. The base portion has an upper surface and a lower surface. The upper surface has a die-bonding area. The light-emitting chip emits a light with a first wavelength and is located on the die-bonding area. The cup portion is located on the base portion to surround the die-bonding area to form a recess having an opening. The encapsulating glue is filled into the recess. The encapsulating glue has a wavelength conversion material configured to convert part of the light with the first wavelength into a light with a second wavelength. The cup portion includes an electro chromic layer electrically connected to a first external power and a transmittance of the electro chromic layer is changed in accordance with an input voltage of the first external power to adjust the light-emitting profile of the light-emitting chip. | 12-11-2014 |
| 20140346964 | APPLICATION CIRCUIT AND CONTROL METHOD THEREOF - An application circuit includes a dynamic load circuit and a control circuit. The dynamic load circuit is electrically connected to a light source. The control circuit is electrically connected to the dynamic load circuit and a TRIAC. The control circuit controls the load status of the dynamic load circuit based on output current from the TRIAC, so as to turn on the light source. | 11-27-2014 |
| 20140327366 | ILLUMINATION DEVICE AND LED DIMMING CIRCUIT THEREOF - An illumination device includes a light-emitting diode (LED) lamp and a LED dimming circuit. The LED dimming circuit includes a power converting module, a sensing unit and a dimming module. The power converting module is used to generate a driving voltage to drive the LED lamp. The sensing unit is used to generate a sensing voltage signal. The dimming module includes an input interface, a dimming signal generator and an isolating unit. The input interface is used to receive a dimming control signal. The dimming signal generator is used to output a first feedback signal based on the sensing voltage signal and the dimming control signal. The isolating unit is used to receive the first feedback signal and output a second feedback signal to the power converting module so as to control a driving current. | 11-06-2014 |
| 20140327021 | LED LIGHTING MODULE - An LED lighting module includes a support board with a first LED and a second LED thereon. The wavelength of light emitted by the first LED is different from that of light emitted by the second LED. The height of the first LED is different from that of the second LED for preventing the emitting light of the first LED absorbed by the wavelength conversion layer of the second LED. | 11-06-2014 |
| 20140321110 | LIGHT TUBE DEVICE - A light tube device includes a light bar section and a heat dissipation structure. The light bar section and a heat dissipation structure is a single-piece integrally formed structure, and collectively form a hollow tube. An insulating layer, a copper foil layer and a solder mask layer are sequentially formed on the light bar section, and the solder mask layer is patterned to expose the copper foil layer so as to serve as welding zones. A plurality of light emitting units are located on the welding zones respectively and electrically connected to the copper foil layer to form a light bar. | 10-30-2014 |
| 20140312379 | LIGHT-EMITTING DIODE WITH SIDE-WALL BUMP STRUCTURE AND MOUNTING STRUCTURE HAVING THE SAME - A light-emitting diode (LED) with a bump structure on a sidewall is provided. The LED comprises a substrate, an epitaxial structure, a first conductive bump, a second conductive bump, a first extended electrode and a second extended electrode. The substrate has a top surface, a first side surface and an inclined surface between the top surface and the first side surface. The epitaxial structure is disposed on the top surface of the substrate, and comprises a N-type semiconductor layer, a light-emitting layer, a P-type semiconductor layer, a transparent conductive layer, a P-electrode and a N-electrode. The first extended electrode and the second extended electrode connect the P-electrode and the N-electrode, extend through the inclined surface, and are electrically connected to the first and the second conductive bumps, respectively. A mounting structure comprises said LED, a sub-mount and a connector mounting the LED onto the sub-mount. | 10-23-2014 |
| 20140312368 | LED DISPLAY AND MANUFACTURING METHOD THEREOF - A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided. | 10-23-2014 |
| 20140306616 | LED DRIVE CIRCUIT - An LED drive circuit applied between an LED load and an AC power supply is provided. The circuit includes a rectifier, a power conversion module, a voltage regulator, a photo coupler and a controller. The rectifier rectifies and converts an AC voltage outputted from the AC power supply into a DC voltage. The power conversion module converts the DC voltage into a first drive voltage and a second drive voltage. The first drive voltage drives the LED load. The voltage regulator receives and processes the second drive voltage with a voltage regulating process to generate a third drive voltage not exceeding a maximum voltage rating of the controller. The photo coupler generates a feedback signal according to a signal outputted from the LED load. The controller receives the third drive voltage and generates a control signal to control the power conversion module according to the feedback signal. | 10-16-2014 |
| 20140293594 | LAMP STRUCTURE - A lamp structure includes a base, a side-emitting light source, first and second reflecting portions. The base includes a central protrusion portion extending from the base. The side-emitting light source is disposed on a side surface of the central protrusion portion and configured to emit a light beam. The first reflecting portion includes a first reflective curved surface, and a portion of the light beam is reflected thereby and then is directly emitted out. The first reflecting portion is disposed between the central protrusion portion and the second reflecting portion. The second reflecting portion includes a second reflective curved surface adjacent to the first reflective curved surface, and the other portion of the light beam is reflected thereby and then is directly or indirectly emitted out. The first reflective curved surface has a radius of curvature less than that of the second reflective curved surface. | 10-02-2014 |
| 20140291711 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND PACKAGE STRUCTURE THEREOF - A semiconductor light emitting device and a package structure thereof are provided. The semiconductor light emitting device includes a substrate, an epitaxial structure layer, a first electrode, a second electrode and a patterned film structure. The substrate has a first surface and a second surface opposite to the first surface. The epitaxial structure layer is disposed on the first surface, and includes a first type semiconductor layer, an active layer and a second type semiconductor layer on the first surface in sequence. The first electrode is formed on an exposed surface of the first type semiconductor layer. The second electrode is formed on an exposed surface of the second type semiconductor layer. The patterned film structure is disposed on the second surface and includes thin films composed of a metamaterial having a negative refraction index. | 10-02-2014 |
| 20140286015 | DUAL-USE LIGHT FIXTURE HAVING AC AND DC LEDS - A dual-use light fixture having AC and DC LEDs includes a heat-dissipating housing, a printed circuit board located on a first end of the heat-dissipating housing, AC and DC LED chips located on the printed circuit board, and a power supply pedestal coupled to a second end of the heat-dissipating housing. The power supply pedestal includes an AC plug, a DC driving unit, and a thread connector. The AC plug is electrically connected to the printed circuit board for inserting into an AC outlet to provide an AC power. The DC driving unit is located in an accommodating space formed by the power supply pedestal and the heat-dissipating housing and is electrically connected to the printed circuit board. The thread connector is coupled to another AC power, and the AC power is converted into a DC power by the DC driving unit. | 09-25-2014 |
| 20140268877 | LUMINOUS ELEMENT, BAR-TYPE LUMINOUS ELEMENT AND APPLICATIONS THEREOF - A luminous element includes a heat dissipation plate, a body, a plurality of LED chips, a first connector and a second connector. The heat dissipation plate includes a die-bonding area and a heat dissipation area opposite to the die-bonding area. The body surrounds the heat dissipation plate, and includes a first body surface and a second body surface opposite to the first body surface. The first body surface includes a concave part exposing the die-bonding area. The second body surface includes an opening exposing the heat dissipation area. The LED chips are mounted on the die-bonding area. The first and the second connectors are disposed on the body, and they can be pluggably connected to an external power source or other connectors. The LED chips are connected to the electrical input terminals in the first and the second connectors. | 09-18-2014 |
| 20140246983 | LAMP - A lamp includes a light-emitting device, a lamp cover and a lamp driver. The lamp cover covers the light-emitting device, such that the light emitted by the light-emitting device partly passes through the lamp cover and is partly reflected from the lamp cover. The lamp driver determines whether the lamp cover is damaged or the lamp cover still covers the light-emitting device based on the light reflected from the lamp cover to subsequently drive or turn off the light-emitting device selectively. The lamp driver includes a driving unit. The driving unit stops driving the light-emitting device when the lamp cover is damaged or the light-emitting device is not covered by the lamp cover. The driving unit keeps driving the light-emitting device when the lamp cover is not damaged or the light-emitting device is normally covered by the lamp cover. | 09-04-2014 |
| 20140239334 | PACKAGE STRUCTURE OF LIGHT EMITTING DIODE - A package structure of semiconductor light emitting element is provided. The package structure of semiconductor light emitting element includes a substrate, a light emitting element and a transparent conductive board. A first electrode and a second electrode are disposed on the substrate. The light emitting element is disposed on the substrate and between the first electrode and the second electrode. A first bonding pad and a second bonding pad are disposed on the light emitting element. The transparent conductive board has a first surface and a second surface opposite to the first surface. The second surface of the transparent conductive board is located over the light emitting element for electrically connecting the first electrode and the first bonding pad and electrically connecting the second electrode and the second bonding pad. | 08-28-2014 |
| 20140232968 | INFORMATION EXHIBITION SYSTEM - An information exhibition system includes an exhibition cabinet and a least one information display device. The exhibition cabinet is used to exhibit at least one object. The information display device is positioned on the exhibition cabinet. The information display device includes a display panel and an illumination module. The display panel includes a front surface and a back surface opposite to the front surface. The front surface shows information. The illumination module is positioned on the back surface of the display panel, so that the light can be emitted into the display panel through the back surface and also illuminate the object on the backside of the display panel. | 08-21-2014 |
| 20140231858 | LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount - A LED sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface. The first electrical-conductive layers are positioned on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove. | 08-21-2014 |
| 20140231846 | LIGHT EMITTING MODULE - A light emitting module includes a light-emitting unit, a wavelength converting element and an optical convergent element for partially or totally converting the wavelength of incident light. The light-emitting unit includes a light-emitting element which emits a first light, the wavelength converting element and an optical convergent element disposed in a light path of the first light from the light-emitting element, such that the first light is converted into a particular light at a specific area with a reduced beam diameter after passing through the optical convergent element and before entering the wavelength converting element. | 08-21-2014 |
| 20140231831 | LED CHIP AND METHOD FOR MANUFACTURING THE SAME - The invention provides a substrate structure used for manufacturing a light-emitting diode and a method for manufacturing the light-emitting diode. The substrate structure includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of grooving structure formed on the first surface of the substrate. The light-emitting diode is formed on the first surface of the substrate. | 08-21-2014 |
| 20140217440 | LIGHT-EMITTING MODULE AND MANUFACTURING METHOD THEREOF - A light-emitting module includes a first conductive lead frame, a second conductive lead frame physically separated from the first conductive lead frame, a protective plastic layer, a reflective plastic layer, and a light-emitting die. The protective plastic layer surrounds the first and second conductive lead frames, and an accommodating space s defined by the protective plastic layer, and the first and second conductive lead frames. Inner surfaces of the first and second conductive lead frames are exposed through the accommodating space. The accommodating space further includes a die-mounting region. The reflective plastic layer is formed on the inner surfaces within the accommodating space. The light-emitting die is located on the die-mounting region and is electrically connected to the first and second conductive lead frames. The light-emitting die protrudes from the reflective plastic layer. | 08-07-2014 |
| 20140217429 | LIGHT EMITTING DIODE DISPLAY PANEL - A light emitting diode display panel includes a substrate and a plurality of pixels. The substrate includes a plurality of transverse signal lines and a plurality of longitudinal signal lines crossing each other. The pixels are mounted on the substrate in a matrix form. Each pixel includes a plurality of LEDs. The LEDs are electrically connected to one of the transverse signal lines and one of the longitudinal signal lines. | 08-07-2014 |
| 20140214362 | METHOD AND SYSTEM OF DETECTING FLICKERING FREQUENCY OF AMBIENT LIGHT SOURCE - A method of detecting a flickering frequency of an ambient light source includes the following steps. First, a light intensity of the light source is sensed in a predetermined time period according to a sampling frequency to obtain a plurality of sample values. Then, the sample values are calculated to obtain a median value. Next, the sample values are binarized according to a result of a comparison between the sample values and the median value to obtain a first sequence. The first sequence is differentiated to obtain a second sequence, and the second sequence includes numbers −1, 0, and 1. Then, a distance between the same numbers in the second sequence is calculated, and the sampling frequency is divided by the distance to obtain the flickering frequency of the ambient light source. A system of detecting a flickering frequency of an ambient light source is also disclosed herein. | 07-31-2014 |
| 20140198494 | Lighting Unit and Light Bar having the Same - A lighting unit is provided and includes a cup body, a substrate, a first conductive wire connector and a second conductive wire connector. The cup body has a light emitting surface, a first end portion, and a second end portion. The substrate is located in the concave accommodating cavity of the cup body. A lighting element is located on the substrate, and has a light emitting direction toward the light emitting surface. The first and second conductive wire connectors are respectively located at two sides of the substrate in the accommodating cavity. A portion of the first conductive wire connector protrudes from the surface of the first end portion to form a first male connection terminal. The second conductive wire connector is recessed in the surface of the second end portion to form a first female connection terminal. | 07-17-2014 |
| 20140197446 | Lighting Apparatus, LED Mounting Substrate and Mold for Manufacturing the Same - An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base. | 07-17-2014 |
| 20140197426 | LIGHT EMITTING DIODE CHIP STRUCTURE AND LIGHT EMITTING DIODE ELEMENT - A light emitting diode chip structure includes a substrate, a mesa type light emitting diode structure, and an electroluminescent layer. The mesa type light emitting diode structure includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The mesa type light emitting diode structure is formed on the substrate. The first semiconductor layer is formed on the substrate. The light emitting layer is formed on a portion of the first semiconductor layer, and a portion of the first semiconductor layer is uncovered. The second semiconductor layer is formed on the light emitting layer. The electroluminescent layer is formed on the second semiconductor layer. Furthermore, a light emitting diode element is also disclosed herein. | 07-17-2014 |
| 20140191679 | DIMMING CIRCUIT AND LIGHTING DEVICE USING THE SAME - A dimming circuit and a lighting device using the same are provided. The dimming circuit comprises an interface trigger unit, an average duty cycle calculating unit, a control voltage calculating unit and a comparing unit. The interface trigger unit receives an on-time of each pulse width from each period in a PWM signal. The average duty cycle calculating unit is coupled to the interface trigger unit and calculates a ratio of the on-time to the period. The control voltage calculating unit is coupled to the average duty cycle calculating unit, and calculates a desired voltage according to the ratio. The comparing unit is coupled to the control voltage calculating unit, and sends the desired voltage and a differential voltage to a driving circuit. | 07-10-2014 |
| 20140167610 | ILLUMINATION SYSTEM AND ILLUMINATION DRIVING METHOD - An illumination system includes a light-emitting device, a first switch element, a driving device, a detecting circuit, an arithmetic unit and a power supply unit. The first switch element is configured for receiving an external voltage supplied by an external power source. The driving device is configured for converting the external voltage to a direct-current power signal for driving the light-emitting device to emit light; the detecting circuit is configured for detecting a voltage across the first switch element and converting the voltage to a detecting signal; the arithmetic unit is configured for performing an arithmetic operation on the direct-current power signal and the detecting signal to generate a control signal; and the power supply unit is configured for supplying power for the light-emitting device according to the control signal and driving the light-emitting device to emit light. An illumination driving method is also disclosed herein. | 06-19-2014 |
| 20140159087 | LIGHT EMITTING DEVICE - A light emitting device comprising a carrier, a first and a second reflective layers, a first and a second micro-structures, a LED package device, a light guide device and a light directing cover is provided. The carrier comprises an upper plate and a lower plate each having a first surface and a second surface. The lower plate has a through hole. The first and second reflective layers are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The first and second micro-structures are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The LED package device is disposed below the through hole. The light guide device is connected to the LED package device. The light directing cover surrounds the light guide device. | 06-12-2014 |
| 20140146570 | DETACHABLE BULB - A detachable bulb includes a lighting source module and a driving module. The lighting source module includes a support plate, a lighting module, a heat sink, and a light-permeable cover. The heat sink has a cavity, a first end, a second end and an engaging slot disposed on an outer periphery thereof. The support plate is secured on the first end of the heat sink. The light-permeable cover disposed on the first end of the heat sink covering the lighting module. The driving module includes a driving body with a socket, a shell, and a power receiving base. The shell is around the driving body and has several engaging parts that detachably engage with the engaging slot. The power receiving base is electrically connected to the driving body. | 05-29-2014 |
| 20140139144 | LIGHT-EMITTING DEVICE - A light-emitting device is provided. The light-emitting device comprises a substrate and a light-emitting element. The substrate comprises a first variable resistor, a second variable resistor, an insulation portion and a carrier. The insulation portion is located between the first variable resistor and the second variable resistor. The carrier is surrounded by the insulation portion, and the light-emitting element is disposed on the carrier. The first variable resistor, the second variable resistor and the insulation portion respectively penetrate the substrate. | 05-22-2014 |
| 20140138723 | PHOSPHOR COMPOSITION AND LIGHT EMITTING DIODE DEVICE USING THE SAME - A phosphor composition is provided. The phosphor composition comprises a phosphor nucleus and a hydrophobic layer. The hydrophobic layer is bonded on a surface of the phosphor nucleus and consists of an organic compound with a hydrophobic functional group. | 05-22-2014 |
| 20140130340 | DIE-POSITIONING DEVICE, DIE-POSITIONING SYSTEM HAVING THE SAME, AND DIE-POSITIONING METHOD OF LED DISPLAY BOARD - A die-positioning device includes a roller body, a plurality of die-suction portions, and at least one gas control device. The roller body includes a plurality of chambers therein, and the chambers are separated from each other. The die-suction portions are located on the surface of the roller body in columns. The die-suction portions for each column correspond to one of the chambers, and each of the die-suction portions has a die suction region and a gas channel that passes through the die suction region. The gas control device is connected to the chambers and disposed on the roller body. The gas control device selectively sucks the air from a specific chamber, such that each of the die-suction portions on the specific chamber sucks an LED die by the corresponding gas channel. | 05-15-2014 |
| 20140119029 | ILLUMINATION APPARATUS - An illumination apparatus includes a substrate, a reflective cup, an illumination unit and a lens structure. The reflective cup is placed on the substrate, and includes a plurality of first fasteners. The first fasteners are placed on the outer surface of the reflective cup. The illumination unit is mounted on the substrate within the reflective cup. The lens structure covers the reflective cup, and includes a plurality of second fasteners. The second fasteners can be removably engaged with the first fasteners, so that the lens structure can be fastened on the reflective cup. | 05-01-2014 |
| 20140118999 | LIGHTING DEVICE - A lighting device includes a light bar, two reflective covers and a reflective plate. The two reflective covers respectively connected to two opposite long sides of the light bar. The reflective plate is positioned at the light output side of the light bar. The reflective surface of the reflective plate faces the light output side of the light bar. The reflective plate has a wavelength conversion layer positioned on the reflective surface thereof. The light bar emits a first wavelength light, and a portion of the first wavelength light is converted by the wavelength conversion layer into a second wavelength light which is reflected by the reflective plate to the two reflective covers, while the remaining non-converted first wavelength light is reflected by the reflective plate to the two reflective covers and mixed with the second wavelength lights to give a light with a predetermined spectrum. | 05-01-2014 |
| 20140117851 | ILLUMINATION SYSTEM - An illumination system includes a lighting unit, a rectifier circuit, a drive circuit and a time control circuit. The rectifier circuit rectifies an AC power from an external power source to a DC power. The drive circuit is configured for receiving the DC power and generating a first driving current. The control circuit includes a resistive element and an energy storage element. The energy storage element is electrically coupled to the resistive element, and the energy storage element is configured for charging while the external power source is supplying the power to the illumination system and generating a second driving current to the lighting unit. When the external power source turns off, the energy storage element generates a discharging current to the lighting unit with the resistive element to extend the time duration which a bright state of the lighting unit goes to a dark state. | 05-01-2014 |
| 20140117832 | ILLUMINATION APPARATUS - An illumination apparatus includes a substrate, an illumination element and a lens structure. The illumination element is disposed on the substrate. The lens structure is disposed above the illumination element, and includes a lens body and a plurality of lens stands. The lens body is positioned above the illumination element. The lens stands are disposed on the bottom of the lens body. The substrate has a plurality of tunnels are around the illumination element. The lens stands respectively insert into the tunnels, so that the lens body is fastened on the substrate. | 05-01-2014 |
| 20140111983 | LIGHT-EMITTING DIODE TUBE - A light-emitting diode tube, comprising a base, a fixing cover, an LED, a lampshade, a driver and a sliding cover is provided. The base has a first carrying surface and a second carrying surface, and a pair of first guiding rail and second guiding rail parallel to each other. The second carrying surface comprises a first area and a second area. The fixing cover is fixedly disposed on the guiding rail located in the first area of the second carrying surface, and covers the first area of the second carrying surface. The LED is disposed on the first carrying surface. The lampshade is located over the first carrying surface and fixed to the base and covers the LED. The driver is disposed in the second area of the second carrying surface. The sliding cover movably covers the second area of the second carrying surface or the fixing cover. | 04-24-2014 |
| 20140111105 | DIMMER CIRCUIT AND LIGHTING APPARATUS USING THE SAME - A dimmer circuit and a lighting apparatus using the same are provided. The dimmer circuit comprises a dimmer, a rectifier, a sample-and-hold unit, an integral unit and a current holding circuit. The dimmer is coupled to an AC for modulating the AC into an alternating signal. The rectifier couples the dimmer and the AC for rectifying the alternating signal into a DC signal. The sample-and-hold unit is coupled to the rectifier for sampling the DC signal to obtain an average positive wave pulse. The integral unit is coupled to the sample-and-hold unit for integrating the average positive wave pulse to generate a DC voltage. The current holding circuit comprises a switch and a bleeder. The current holding circuit determines the on/off state of the switch according to a comparison between the DC voltage and a reference voltage, such that the DC signal passes through the bleeder or the switch. | 04-24-2014 |
| 20140104828 | LIGHT FIXTURE - A light fixture includes a light guide member, a light bar, and two conductive pins. A cavity is formed on a bottom portion of the light guide member, and two engaging groove are respectively at two sides of the bottom portion. The light bar is arranged under the bottom portion of the light guide member, and a plurality of light emitting units are disposed on a surface of the light bar. Two sides of the light bar are respectively fixed in the two engaging grooves, such that the emitting units are located in the cavity. The two conductive pins protrude from each end of the light guide member, and are electrically connected to the light emitting units. | 04-17-2014 |
| 20140103830 | LIGHT-EMITTING MODULE, LED DRIVING CIRCUIT, AND LED DRIVING METHOD - A light-emitting diode (LED) driving circuit is configured for driving at least one group of LEDs. The LED driving circuit includes a constant current source, a pulse width modulation (PWM) element, and at least one pulse frequency modulation (PFM) element. The constant current source is configured for generating a current signal with a constant current value; the PWM element is electrically connected to the constant current source and configured for modulating the current signal to generate a PWM signal corresponding to the current signal; the PFM element is electrically connected between the PWM element and the LED and configured for modulating a frequency width of the PWM signal to generate at least one PFM signal for driving the LED. | 04-17-2014 |
| 20140103824 | LAMP - A lamp includes a lamp tube, a carrier, a light bar circuit board, a driver circuit board, a plurality of first luminous elements and a parallel-connected type luminous unit. The carrier is accommodated in the lamp tube. The light bar circuit board is disposed on the carrier. The driver circuit board is disposed on the carrier and adjoins the light bar circuit board. The first luminous elements are disposed on the light bar circuit board. The parallel-connected type luminous unit is disposed on the driver circuit board, and includes a plurality of luminous element groups connected in parallel. | 04-17-2014 |
| 20140103378 | LIGHT-EMITTING DIODE STRUCTURE - A light-emitting diode structure is provided. The light-emitting diode structure comprises a substrate, a light-emitting diode device, a ring-shaped dam and an optical lens. The substrate has an upper surface. The light-emitting diode device is disposed on the upper surface of the substrate for emitting a first light having a first wavelength. The ring-shaped dam is disposed on the upper surface of the substrate, and surrounds the light-emitting diode device. The optical lens is disposed on the substrate, and encapsulates the ring-shaped dam and the light-emitting diode device. The optical lens and the ring-shaped dam and the light-emitting diode device form a cavity. | 04-17-2014 |
| 20140098527 | END CAP OF A LIGHTING TUBE - An end cap of a lighting tube includes a first assembly member and a second assembly member. The first assembly member includes a first shell, several recesses, and two first position-limiting elements. The first shell has a first central-securing element, and the first shell forms a first area and a second area. The two first position-limiting elements are disposed on the first area. The second assembly member includes a second shell, a first elastic element, a second elastic element, and two positioning elements. An end of the second shell is connected to a lighting tube and a second central-securing element of the second shell is secured with the first central-securing element. The first elastic element is disposed on the second shell. The second elastic element is disposed on the second shell. The two positioning elements are disposed on the second shell. | 04-10-2014 |
| 20140091351 | LIGHT EMITTING DIODE CHIP - A Light emitting diode (LED) chip includes a substrate, an N-type semiconductor layer, a luminous layer, a P-type semiconductor layer, an N-type electrode layer and a P-type electrode layer. The N-type semiconductor layer is mounted on the substrate. The luminous layer is mounted on the N-type semiconductor layer. The P-type semiconductor layer is mounted on the luminous layer. The N-type electrode layer is mounted on the N-type semiconductor layer. The P-type electrode layer is mounted on the P-type semiconductor layer, and includes a plurality of enclosed circuit patterns. These enclosed circuit patterns respectively encompass different parts of the N-type electrode layer. | 04-03-2014 |
| 20140091344 | ILLUMINATION COMPONENT PACKAGE - An illumination component package includes a substrate, at least one illumination component, a dam and an encapsulating glue. The illumination component is mounted on the substrate. The dam surrounds the illumination component to form a accommodating space. The inner wall of the dam includes a plurality of glue adhering microstructures. The encapsulating glue is filled in the accommodating space. | 04-03-2014 |
| 20140078771 | LIGHT DEVICE - A light device includes a light transmission tube, a heat sink, a light bar, and two end caps. The light transmission tube has two securing parts. Each of the securing parts includes a first rib and a second rib, and a guide-track groove is formed between the first and second ribs. The heat sink includes a first plate body and a second plate body. The first plate body is curved and abutted on an inner wall of the light transmission tube, and the second plate body is curved toward the first plate body. Two terminals of the first plate body are connected to two terminals of the second plate body to form two connecting parts for coupling with the guide-track grooves. The light bar is disposed on the second plate body. The end caps are respectively connected to two terminals of the light transmission tube. | 03-20-2014 |
| 20140077241 | LIGHT EMITTING DIODE - A Light emitting diode (LED) includes a substrate, a LED chip, a wavelength conversion layer, a lens and a reflective layer. The LED chip is mounted on the substrate. The wavelength conversion layer covers the top surface of the LED chip and exposes the lateral surface of the LED chip. The lens is disposed on the substrate and encloses the LED chip and the wavelength conversion layer. The reflective layer is disposed on the lens for reflecting the light emitted from the lateral surface of the LED chip. | 03-20-2014 |
| 20140070716 | LIGHT-EMITTING DEVICE - A light-emitting device includes a power module, a first light-emitting module, a second light-emitting module, a third light-emitting module, and a control module. The power module is configured to rectify an AC voltage for providing a periodic driving voltage. The first, second, third light-emitting modules are connected in series. The control module is configured to make the first, second, third light-emitting modules being driven by the driving voltage in response to different driving stages in a cycle period of a driving voltage. An average-diode-junction-area of the first light-emitting module is different from an average-diode-junction-area of the second light-emitting module or an average-diode-junction-area of the third light-emitting module. | 03-13-2014 |
| 20140070241 | SOLID STATE LIGHT SOURCE ARRAY - A solid state light source array including a transparent substrate and N rows of solid state light emitting element series is provided. Each row of the solid state light emitting element series includes M solid state light emitting elements connected in series, wherein N, M are integers and N≧1, M≧2. Each of the solid state emitting elements includes a first type electrode pad and a second type electrode pad. The first and the M | 03-13-2014 |
| 20140063820 | LAMP TUBE - A lamp tube includes a light transmission tube, a heat dissipation structure, a die bonding substrate and at least one light source. The light transmission tube includes first guiding rails disposed on opposite positions of the inner wall thereof. The first guising rails and the inner wall of the light transmission tube form first grooves. The heat dissipation structure inserts into the light transmission tube, and includes a die bonding area, extending arms downwardly extended from opposite sides of the heat dissipation structure, and connecting arms connected to the extending arms. Each of the extending arms includes second guiding rails and second grooves. The second guiding rail is engaged with the first groove, and the first guiding rail is engaged with the second groove. The die bonding substrate is placed on the die bonding area. The light source is placed on the die bonding substrate. | 03-06-2014 |
| 20140061700 | FLIP-CHIP LIGHT-EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF - A flip-chip light-emitting diode structure comprises a carrier substrate, a light-emitting die structure, a reflective layer, an aperture, a dielectric layer, a first contact layer and a second contact layer. The light-emitting die structure, located on the carrier substrate, comprises a first type semiconductor layer, a second type semiconductor layer and a light emitting layer. The light emitting layer is formed between the first type and the second type semiconductor layer. The reflective layer is located on the first type semiconductor layer. The aperture penetrates the light-emitting die structure. The dielectric layer covers an inner sidewall of the aperture and extends to a portion of a surface of the reflective layer. The first contact layer is disposed on the part of the reflective layer not covered by the dielectric layer. The second contact layer fills up the aperture and is electrically connected to the second type semiconductor layer. | 03-06-2014 |
| 20140055992 | ILLUMINATION MODULE AND APPARATUS AND ELEMENT THEREOF - An illumination apparatus includes an optical element. The optical element includes a light incident curved surface and a light outgoing curved surface. The center of curvature of the light incident curved surface is positioned on the center of the light emitting surface of a light source, and the center of the curvature of the light outgoing curved surface is positioned beneath the center of curvature of the light incident curved surface and deviates from the light source. The radius of curvature R | 02-27-2014 |
| 20140016322 | LIGHT EMITTING DEVICE - A light emitting device comprising a reflection cap, a substrate, a light source, a first wavelength transformation layer, a second wavelength transformation layer, a cover and a reflection device is provided. The substrate is disposed on the reflection cap. The light source is disposed on the substrate. The first wavelength transformation layer disposed on the substrate surrounds the light source. The second wavelength transformation layer disposed on the substrate surrounds the first wavelength transformation layer. The cover is fixed on the reflection cap. The reflection device comprises a reflection angle adjustment mechanism and a reflector. A ratio of the light reflected by the reflector to be incident on the first wavelength transformation layer to that being incident on the second wavelength transformation layer is adjusted through the angle adjustment of the reflector by the reflection angle adjustment mechanism to generate light with different color temperature. | 01-16-2014 |
| 20140008678 | LIGHT EMITTING DIODE DEVICE - A light emitting diode device includes a substrate, a light emitting diode chip, an optical lens and an adhesive interface layer. The light emitting diode chip is electrically connected with the substrate. The optical lens has an accommodation cavity to enclose the light emitting diode chip on the substrate, wherein the accommodation cavity includes a micro diffusion structure on an inner wall thereof. The adhesive interface layer is filled within the accommodation cavity of the optical lens. | 01-09-2014 |
| 20140001434 | LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF | 01-02-2014 |
| 20130341591 | LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF - The present invention relates to a light emitting diode (LED) structure and a manufacturing method thereof. A first semiconductor stacking layer consisting of a first type semiconductor layer, a light-emitting layer, a second type semiconductor layer and a second type light-guiding layer is sequentially formed on a semiconductor substrate. Partial of the first type semiconductor layer, the light-emitting layer, the second type semiconductor layer and the second type light-guiding layer is removed. A second semiconductor stacking layer consisting of the first type semiconductor layer, the light-emitting layer, the second type semiconductor layer and the second type light-guiding layer is defined in a light-emitting area. A transparent conductive layer is formed on a surface of the second type light-guiding layer of the second semiconductor stacking layer. | 12-26-2013 |
| 20130341589 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode includes a substrate, a first-type semiconductor layer, a nanorod layer and a transparent planar layer. The first-type semiconductor layer is disposed over the substrate. The nanorod layer is formed on the first-type semiconductor layer. The nanorod layer includes a plurality of nanorods and each of the nanorods has a quantum well structure and a second-type semiconductor layer. The quantum well structure is in contact with the first-type semiconductor layer, and the second-type semiconductor layer is formed on the quantum well structure. The transparent planar layer is filled between the nanorods. A surface of the second-type semiconductor layer is exposed out of the transparent planar layer. | 12-26-2013 |
| 20130337598 | MANUFACTURING PROCESS OF VERTICAL TYPE SOLID STATE LIGHT EMITTING DEVICE - A manufacturing process of a vertical type solid state light emitting device is provided. A substrate is provided. M metal nitride buffer layer is formed on the substrate, and a breakable structure containing M metal droplet structures is formed on the buffer layer. A first type semiconductor layer, an active layer and a second type semiconductor layer are sequentially formed on the breakable structure. A second type electrode is formed on the second type semiconductor layer. The first type semiconductor layer, the active layer, the second type semiconductor layer and the second type electrode are stacked to form a light emitting stacking structure. The breakable structure is damaged to separate from the light emitting stacking structure, so that a surface of the first type semiconductor layer of the light emitting stacking structure is exposed. A first type electrode is formed on the surface of the first type semiconductor layer. | 12-19-2013 |
| 20130334493 | SEMICONDUCTOR LIGHT EMITTING STRUCTURE - A semiconductor light emitting structure including an n-type semiconductor layer, a p-type semiconductor layer and an active layer is provided. The active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer is a multi-quantum well structure consisting of well layers and barrier layers interlaced and stacked to each other. The well layers near the n-type semiconductor layer at least include a first well layer having a first thickness, and the well layers near the p-type semiconductor layer at least include a second well layer having a second thickness smaller than the first thickness, so that the ability to restrict electrons within the area of the active layer near the n-type semiconductor layer is increased, and the conversion efficiency of the active layer is enhanced. There is a differential Δd | 12-19-2013 |
| 20130328010 | LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A high brightness light-emitting diode free of p-type gallium nitride (GaN) layer is provided, which includes an n-type semiconductor layer, a multi-quantum well (MQW) layer, a p-type indium gallium nitride (InGaN) layer and an indium tin oxide (ITO) layer. The grain size of the ITO layer is ranging from 5 to 1000 angstroms. A method for manufacturing the high brightness light-emitting diode is also provided. | 12-12-2013 |
| 20130322086 | LIGHT EMITTING DEVICE - A light emitting device comprising a light guiding frame and a light source is provided. The light guiding frame has a recess, and an edge of an opening of the recess defines a light-emitting opening. The light guiding frame comprises a first light guiding structure and a second light guiding structure connected to the first light guiding structure. The light source is disposed on a bottom of the recess and has a light-emitting surface. The first light guiding structure is extended along a direction away from the light-emitting surface and the light-emitting opening. The second light guiding structure is extended along a direction away from the light-emitting surface but close to the opening. | 12-05-2013 |
| 20130322067 | LIGHT SOURCE MODULE - A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip. | 12-05-2013 |
| 20130320372 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode, comprising a light emitting diode (LED) cell, a dielectric layer and a metal layer is provided. The LED cell has a top surface, a bottom surface, a first lateral surface and a second lateral surface. The bottom surface is opposite to the top surface. The second lateral surface is opposite to the first lateral surface. An electrode layer is disposed on the top surface. The dielectric layer is disposed on the bottom surface, the first lateral surface and the second lateral surface. The metal layer is disposed on the dielectric layer and electrically insulated from the electrode layer. | 12-05-2013 |
| 20130307433 | CONTROL METHOD OF LAMP - The control method comprises the following steps. Firstly, whether a touch event occurs in a control device is determined. Then, responding to a color temperature set and a brightness set from the control device, a first PWM and a second PWM is generated. Then, whether the lamp connects with to the control device is determined. Then, the first PWM and the second PWM is packaged in a color control package if the lamp connects with to the control device. Then, the color control package is transmitted to the lamp in wireless. | 11-21-2013 |
| 20130292722 | LIGHT EMITTING DIODE ELEMENT - The present invention provides a light emitting diode (LED) element which comprises a substrate, a buffer layer, a plurality of nano-spheres and a light emitting structure. The substrate comprises a plurality of grooves arranged at intervals on a surface of the substrate. The buffer layer is disposed on the surface of the substrate where the grooves being formed, wherein the grooves are disposed between the substrate and the buffer layer. The nano-spheres are received in the grooves, so each groove is provided with at least a nano-sphere. The light emitting structure is disposed on the buffer layer. | 11-07-2013 |
| 20130278160 | ILLUMINATION DEVICE WITH ADJUSTABLE LUMINANCE AND LUMINANCE ADJUSTMENT METHOD THEREOF - The present application relates to an illumination device having a light source module, a power supply module, a driving module, a control module and a start module. The driving module outputs a driving current to the light source module based on a power supply from the power supply module. The control module controls the magnitude of the driving current based on a first voltage signal generated by the power source module. After receiving the first voltage signal, the control module controls the driving module to steadily increase the driving current in a first stage output. After receiving the first voltage signal again, the control module controls the driving module to output a constant driving current equal to the driving current at the end of the first stage. | 10-24-2013 |
| 20130277706 | PACKAGE STRUCTURE OF LIGHT EMITTING DEVICE - A package structure of a light emitting device is disclosed. The package structure includes a light emitting device, a leadframe and a cup structure. The leadframe is used for supporting the light emitting device. The leadframe has a top surface, a bottom surface and a side surface located between the top surface and the bottom surface. The side surface has a dimension in the thickness direction of the leadframe. The cup structure made of thermosetting resin is disposed on the leadframe. A sidewall of the cup structure covers the side surface of the leadframe, and has a connecting profile length in the thickness direction with respect to the side surface. The connecting profile length is larger than the dimension of the side surface in the thickness direction. | 10-24-2013 |
| 20130271031 | COLOR TEMPERATURE AND ILLUMINATION ADJUSTING SYSTEM, AND METHOD THEREOF - A temperature and illumination adjusting system, including: a temperature and illumination adjusting device, including a CPU, receiving a temperature value and an illumination value, and generating a first PWM value and a second PWM value according to a first formula and a second formula; and a communication unit, outputting the first PWM value and the second PWM value; and a lamp device, including a lamp communication unit, receiving the first PWM value and the second PWM value; a first light module; a second light module; a first PWM driving unit, driving the first light module with the first PWM value; a second PWM driving unit, driving the second light module with the second PWM value, wherein the outputs of the first light module and the second light module have different color temperature. | 10-17-2013 |
| 20130271012 | ILLUMINATION SYSTEM - An illumination system includes a light module, a power module, a driver module, a light sensor module, and a control module. The power module is coupled to an input power source. The power module converts the input power source and outputs a direct voltage. The driver module, coupled between the light module and the power module, converts the direct voltage into a driving voltage and then outputs a driving current to drive the light module. The light sensor module senses an environment brightness and outputs a brightness signal. The control module receives the brightness signal and outputs a light modulation signal to the driver module, wherein the driver module controls the activation time of the light module according to the light modulation signal. | 10-17-2013 |
| 20130270602 | LIGHT-EMITTING DIODE PACKAGE - The present invention provides an LED packaging structure comprising a leadframe, including: a first electrode including a first functional area and a first extension area extending from the first functional area: a second electrode including a second functional area and a second extension area extending from the second functional area, a cup-shaped insulator, wrapping the first and second electrodes, including an emitting concave formed at the inner side of the cup-shaped insulator and exposing the upper surfaces of the first and second functional areas, wherein portions of the first and second extension areas are exposed from the bottom of the outer side of the cup-shaped insulator; an interposed spacer physically separating the first and second electrodes; and an electroplating layer partially covering the surfaces of the first and second electrodes. | 10-17-2013 |
| 20130270601 | PACKAGE STRUCTURE OF SEMICONDUCTOR LIGHT EMITTING DEVICE - A package structure of a semiconductor light emitting device is provided. The packaging structure comprises a substrate, a circuit board, a semiconductor light emitting device and a coating layer is provided. The circuit board has an opening portion disposed on the substrate for exposing a surface of the substrate. The semiconductor light emitting device is disposed on the surface of the substrate exposed by the opening portion. The coating layer covers the sidewalls of the opening portion and the circuit board. | 10-17-2013 |
| 20130270594 | LIGHT-EMITTING DIODE PACKAGE - A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface. | 10-17-2013 |
| 20130258652 | LIGHT-GUIDING ELEMENT, ILLUMINATION MODULE AND LAMINATE LAMP APPARATUS - A light-guiding element, an illumination module and a laminate lamp apparatus are provided. The light-guiding element comprises an upper reflection member extended along a longitudinal axis direction, and a lower reflection member extended along the longitudinal axis direction thereof and coupled to the upper reflection member. The lower reflection member comprises a first reflective portion with at least a first inclined flat plate, and the upper reflection member comprises a second reflective portion facing towards the first reflective portion. A light placement portion and a light outputting trough are formed between the first reflective portion and the second reflective portion. The light outputting trough is gradually expanded largely according to a direction of being away from the light placement portion. | 10-03-2013 |
| 20130256738 | LIGHT EMITTING DIODE COMPONENT, LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - A light emitting diode component, a light emitting diode package and the manufacturing method thereof are provided. The LED component includes a semiconductor epitaxial stack structure, a first electrode and a second electrode. The semiconductor epitaxial stack structure has a bottom surface, a top surface, a first lateral surface, and a second lateral surface. The first electrode is disposed on the first lateral surface. The second electrode is disposed on the bottom surface. | 10-03-2013 |
| 20130240921 | LIGHT SOURCE MODULE - A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor. | 09-19-2013 |
| 20130234180 | LIGHT EMITTING DIODE PACKAGING STRUCTURE - A light emitting diode packaging structure provided in the invention includes a base, a plurality of lead frames, a LED chip, a thermal conductive film and an encapsulating member. The base includes a reflective recess and a plurality of outer surfaces surrounding the reflective recess. The lead frames are respectively disposed on the base, and exposed from the reflective recess. The LED chip is disposed on one of the lead frames in the reflective recess The thermal conductive film is with a light shielding property, and covers all inner surfaces of the reflective recess and at least one of the outer surfaces of the base. The encapsulating member is disposed in the reflective recess to cover the thermal conductive film and the LED chip. | 09-12-2013 |
| 20130229796 | LIGHT EMITTING DIODE BAR AND LIGHT EMITTING DIODE MODULE USING THE SAME - A light emitting diode (LED) bar and an LED module using the same are provided. The LED bar includes a long shaped substrate, a plurality of first LEDs and a second LED. Two long parallel edges of the long shaped substrate are extended along a first direction. The long shaped substrate includes a non-connecting area and a connecting area located at an end of the long shaped substrate. The first LEDs are interlaced and disposed in the non-connecting area and between the two long sides. Each first LED has a first long axis disposed along the first direction. The second LED has a second long axis disposed in the connecting area and along a second direction. The first direction and the second direction are intersected at a predetermined angle. | 09-05-2013 |
| 20130215627 | ELECTRONIC UNIT BASE AND ELECTRONIC MODULE AND ELECTRONIC DEVICE USING THE SAME - The electronic unit base includes a body and a first conducting layer. The body includes a supporting face, a bottom face, and a first incline. The supporting face and the bottom face are disposed on the opposite sides of the body. The first incline is disposed on one side of the body between the supporting face and the bottom face, wherein the first incline and the bottom face substantially have a first angle. The first conducting layer is disposed on the supporting face and extends toward the first incline, wherein the first conducting layer covers a portion of the supporting face and a portion of the first incline. | 08-22-2013 |
| 20130215610 | LIGHT BAR ASSEMBLY - A first substrate of a light bar assembly includes a first edge and a second edge parallel to each other along a first direction. A first connecting end includes a first connecting portion protruding further outward than a second connecting portion. A first bonding pad and a second bonding pad are disposed on the first substrate. First solid-state semiconductor light sources are disposed along the first edge and the second edge. A second substrate, disposed corresponding to the first substrate, includes a third edge, a fourth edge, a second connecting portion, a third bonding pad, a fourth bonding pad, and second solid-state semiconductor light sources. A first connecting device is electrically connected to the first bonding pad and the fourth bonding pad; a second connecting device is electrically connected to the second bonding pad and the third bonding pad to fix the first substrate and the second substrate. | 08-22-2013 |
| 20130208468 | OPTICAL REFLECTION PLATE AND LIGHTING DEVICE HAVING THE SAME - A lighting device is provided. The lighting device includes an optical reflection plate, a light holder, and at least one light source. The optical reflection plate includes a non-reflective region located in the center of the optical reflection plate, and a plurality of reflection regions surrounding the non-reflective region in sequence. The light holder is located on the non-reflective region of the optical reflection plate and includes a circle side-light concave portion. A light-emitting opening of the side-light concave portion faces to the reflection regions. The light source is located in the side-light concave portion of the light holder. When the light source emits light, the light emitted from the light source is reflected by the reflection regions. | 08-15-2013 |
| 20130207143 | PATTERNED SUBSTRATE OF LIGHT EMITTING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A patterned substrate of a light emitting semiconductor device has a plurality of convex members on a top surface thereof. Each convex member has a substantially flat top surface and a plurality of convex arc-shaped sidewalls. | 08-15-2013 |
| 20130207071 | LIGHT EMITTING DIODE ARRAY - A light emitting diode (LED) array includes a substrate with an array having a plurality of LED chips thereon, a dielectric layer, a plug, and a conductive connection layer. Each of the LED chips is isolated from another LED chip adjacent thereto by a trench. The dielectric layer covers a surface of the substrate exposed by the trench and sidewalls and partial surfaces of the LED chips adjacent to the trench. The plug fills the trench. The conductive connection layer is disposed over the plug and the dielectric layer to connect the LED chips with the LED chips adjacent thereto. Radiation emitted from one of the LED chips can be reflected by the dielectric layer and the plug, and finally reflected and output from a side of the LED chip not adjacent to the trench, thereby not affecting the adjacent LED chip and being absorbed by it. | 08-15-2013 |
| 20130200403 | PACKAGE STRUCTURE FOR SEMICONDUCTOR LIGHT EMITTING DEVICE - A package structure for a semiconductor light emitting device is provided. The package structure includes a semiconductor light emitting device, a lead frame, an electrostatic discharge protection device and an encapsulation. The lead frame supports the semiconductor light emitting device, and has a gap. The electrostatic discharge protection device is fastened in the gap and electrically connected to the lead frame. The encapsulation covers the lead frame, the semiconductor light emitting device and the electrostatic discharge protection device. | 08-08-2013 |
| 20130193448 | PATTERNED SUBSTRATE AND STACKED LIGHT EMITTING DIODE - A patterned substrate is provided, including: a substrate having a (0001) crystal plane and a plurality of alternatively arranged recess structures therein, thereby forming a plurality of alternatively arranged top surfaces; and a dielectric barrier layer covering the bottom surface and/or the sidewalls of the recess structures. Each of the alternatively arranged recess structures includes a bottom surface and a plurality of sidewalls surrounding the bottom surface. | 08-01-2013 |
| 20130182459 | LIGHTING DEVICE - A lighting device is provided and includes a light guide plate including a plurality of light incident surfaces and two light emitting surfaces, a plurality of edge frames, and at least one light source. Each of the edge frames includes a main body including an accommodating groove and an opening, first and second clamp members, and first and second fixing elements respectively located on first and second ends of the main body. The light emitting surfaces are clamped by the first and second clamp members of each edge frame. Each of the light incident surfaces is inserted in the main body of one of the edge frames through the opening and accommodated in the accommodating groove. The light source is located in the accommodating groove of one of the edge frames and adjacent to the corresponding light incident surface. | 07-18-2013 |
| 20130170201 | LAMPS WITH FUNCTIONS OF ADJUSTING ILLUMINATION DIRECTIONS - A lamp with functions of adjusting an illumination direction is disclosed. A substrate is disposed on a base and includes a through groove. At least one light source is disposed on the substrate. An electronic control unit is disposed in the base. A telescopic member is disposed in the base and is connected to the electronic control unit. The electronic control unit drives the telescopic member to elongate and shorten. A flexible light guiding sheet is connected to the telescopic member. When the electronic control unit drives the telescopic member to elongate, the flexible light guiding sheet protrudes onto the substrate via the through groove of the substrate and deflects toward a specific direction, changing the illumination direction of the light source. | 07-04-2013 |
| 20130169183 | ILLUMINATION CONTROL CIRCUIT AND ILLUMINATION CONTROL METHOD - The invention discloses an illumination control circuit and an illumination control method. The illumination control method includes modulating an alternating current input signal and accordingly generating a dimming signal, which includes several waveform pulses each with an adjustable conduction angles; continuously sampling the waveform pulses of the dimming signal and forming an average waveform pulse from the sampled waveform pulses; extracting the average waveform pulse, which has an average conduction angle corresponding to the conduction angles of the waveform pulses; performing an integration on the sampled average waveform pulse and accordingly generating a current-controlling signal; and driving an illumination lamp according to the current-controlling signal. | 07-04-2013 |
| 20130162147 | PLANT ILLUMINATION APPARATUS - A plant illumination apparatus includes a light source module including a first light source and a second light source generating lights having different wavelengths, an environment-detecting module detecting an external environment to obtain a real-time environment parameter, and a control module connected to the light source module and the environment-detecting module. The control module includes a processor unit and a storage unit storing a database of plant growing environment parameters. The processor unit loads at least one preset growing environment parameter corresponding to a plant growth timing from the database of plant growing environment parameters, and compares the preset growing environment parameter with the real-time environment parameter to output at least one comparison result. The processor unit adjusts the first light source and the second light source according to the comparison result, so that an adjusted environment parameter matches the preset growing environment parameter. | 06-27-2013 |
| 20130147354 | ILLUMINATION CONTROLLING CIRCUIT AND ILLUMINATION SYSTEM - The invention discloses an illumination controlling circuit coupled between a household electricity input and an illumination lamp. The illumination controlling circuit includes a dimmer module, a sampling-and-holding circuit, a differential circuit, an integrator circuit and a clamping circuit. The dimmer circuit is used for generating a dimming signal which includes a plurality of waveform pulses. The sampling-and-holding circuit samples from the dimming signal, so as to obtain an average waveform pulse. The differential circuit is used for extracting a voltage difference of the average waveform pulse. The integrator circuit performs integration on the average waveform pulse according to the voltage difference, so as to generate a direct current voltage signal. When a level of the direct current voltage signal exceeds a threshold voltage level of the clamping circuit, the direct current voltage signal is used for driving the illumination lamp. | 06-13-2013 |
| 20130135333 | LIGHT ADJUSTMENT DEVICE AND LIGHT SYSTEM INCLUDING THE SAME - A light system includes a lamp, a user operation interface, a control unit and a communication unit. The user operation interface is adapted to be used by a user to select a brightness value or a color temperature value, wherein the user operation interface includes a display unit and a touch control unit. The display unit is used to output a graphical interface. The touch control unit is used to detect a touch action upon the graphical interface of the display unit. The control unit is electrically connected to the user operation interface for receiving and processing a selection of the brightness value or the color temperature value from the user operation interface. The communication unit is electrically connected to the control unit for transmitting the selection of the brightness value or the color temperature value to the lamp via a wireless protocol. | 05-30-2013 |
| 20130134466 | LED PACKAGE - An LED package is provided, which includes a base, a lighting device, and a sealing material. The lighting device is disposed on the base. The sealing material is disposed on the lighting material, and the out surface of the sealing material includes a plurality of micro-structures. The micro-structures comprise of protruded micro-structures, depressed micro-structures or any combination thereof. At least of a partial of a light from the lighting element is transmitted to an ambient through the micro-structure. | 05-30-2013 |
| 20130134448 | LIGHT MODULE AND LIGHT COMPONENT THEREOF - A light component includes a printed circuit board and a plurality of lighting emitting diodes (LEDs). The printed circuit board has a metal substrate. The LEDs are disposed on the printed circuit board, wherein two opposite edges of the metal substrate protrude out and are bent towards the LEDs to form two metal clamps. | 05-30-2013 |
| 20130128581 | ASSEMBLY LIGHT BAR STRUCTURE - An assembly light bar structure includes: a substrate, having at least one recess; a first conductive elastic element and a second conductive elastic element, disposed on the substrate and respectively located at two parallel sides of the recess; and at least one light-emitting element. The light-emitting element is compressed by the first and second conductive elastic elements to be removably fixed in the recess of the substrate. The light-emitting element is electrically connected to the first and second conductive elastic elements. | 05-23-2013 |
| 20130119963 | BOOTSTRAP CIRCUIT AND ELECTRONIC DEVICE APPLYING THE SAME - A bootstrap circuit includes: a first switch element, coupled a clock signal; a second switch element, coupled to an operating voltage and the first switch element; a third switch element, coupled to the first switch element; a first charge storage unit, coupled to the second and third switch elements; and a voltage converting unit, coupled to the first charge storage unit as well as the first, second and third switch elements. When the clock signal is at a first logic state, the first charge storage unit is charged. When the clock signal is at a second logic state, a cross voltage of the first charge storage ensures that the voltage converting unit converts an input voltage to an output voltage. | 05-16-2013 |
| 20130107541 | ILLUMINATION STRUCTURE AND ASSEMBLY METHOD OF LIGHT BASE AND COVER | 05-02-2013 |
| 20130100687 | ROTATION ANGLE REGULATING DEVICE AND ROTATABLE LAMP USING THE SAME - A rotation angle regulating device and a rotatable lamp using the same are provided. Through N passive rotating elements used for regulating the rotation angle, the rotation angle of the active rotating element relative to the fixing element is increased, wherein N is a positive integral equal to or more than 1. In addition, each passive rotating element has a first stopper and a second stopper. The active rotating element, when rotating, drives and makes the passive rotating elements rotating on the fixing element, so that the rotation of the lamp can be stopped at any designated angle through the operations of the first and second stoppers of each passive rotating element. | 04-25-2013 |
| 20130100668 | LIGHT BAR STRUCTURE - A light bar structure including a base, a flexible circuit board (FCB), a first circuit, a second circuit, and a first connector is provided. The base has first and second surfaces. The FCB is on the first surface. The first circuit on the FCB includes N+1 serial first conductive contact pads, N light-emitting elements, and a first conductive wire. N and N is a positive integer. The second circuit on the FCB includes N+1 serial second conductive contact pads, and a second conductive wire. To form a closed loop, the first connector connects a first one of the first conductive contact pads and a first one of the second conductive contact pads and the second connector connects a (i+1)-th one of the first conductive contact pads and a (i+1)-th one of the second conductive contact pads. 1≦i≦N and i is a positive integer. | 04-25-2013 |
| 20130095591 | MANUFACTURING METHOD OF SOLID STATE LIGHT EMITTING ELEMENT - A manufacturing method of a solid state light emitting element is provided. A plurality of protrusion structures separated to each other are formed on a first substrate. A buffer layer is formed on the protrusion structures and fills the gaps between protrusion structures. An epitaxial growth layer is formed on the buffer layer to form a first semiconductor stacking structure. The first semiconductor stacking structure is inverted to a second substrate, so that the first semiconductor epitaxial layer and the second substrate are connected to form a second semiconductor stacking structure. The buffer layer is etched by a first etchant solution to form a third semiconductor stacking structure. A second etchant solution is used to permeate through the gaps between the protrusion structures, so that the protrusion structures are etched completely. The first substrate is removed from the third semiconductor stacking structure to form a fourth semiconductor stacking structure. | 04-18-2013 |
| 20130094239 | LIGHT GUIDE COLUMN, LIGHT EMITTING STRUCTURE AND ILLUMINATION DEVICE USING THE SAME - A light guide column is disposed on the top of a light source. The light guide column includes a column body, a cavity, a reflection structure and a micro-structure. The column body has a first end and a second end opposite to the first end. The cavity on the first end is for gathering the light source. The reflection structure is on the second end, when light emitted from the light source, a portion of the light reflected by the reflection structure to emit toward a lateral surface of the column body and others transmitted to the front side direction. The micro-structure is formed on the lateral surface of the column body can facilitate the emitting light from the column body uniformly. | 04-18-2013 |
| 20130093349 | DRIVING CIRCUIT AND LAMPS - The invention relates to a driving circuit comprising a first bridge circuit, a second bridge circuit, a first protection device and a second protection device. The first bridge circuit comprising a first positive input terminal, a first negative input terminal, a first positive output terminal and a first negative output terminal is coupled to an AC voltage source to output a first voltage. The second bridge circuit comprising a second positive input terminal, a second negative input terminal, a second positive output terminal and a second negative output terminal is coupled to the AC voltage source to output a second voltage. The second and the first negative output terminals are both coupled to the ground potential. The first protection device is coupled between the second positive input terminal and the AC voltage source. The second protection device is coupled between the second negative input terminal and the AC voltage source. | 04-18-2013 |
| 20130093344 | LAMPS AND CONTROL CIRCUIT - An embodiment of the invention provides a lamp comprising a first emitting device, a second emitting device, and a control signal generation device. The control signal generation device generates a first control signal and a second control signal to control the first emitting device and the second emitting device, so that a first light flux generated by the first emitting device is equivalent to a second light flux generated by the second emitting device, wherein the second control signal is generated according to the first control signal. | 04-18-2013 |
| 20130093334 | LAMPS AND ILLUMINATING SYSTEM - A lamp comprising a light emitting device and a controller is disclosed. The controller receives a control signal from a handheld device and switches the light emitting device according to the control signal such that the light emitting device operates in a light emitting mode corresponding to the control signal, in which the control signal is generated by the handheld device according to real-time information. | 04-18-2013 |
| 20130093331 | LAMPS - An embodiment of the invention provides a lamp comprising a control circuit and a light emitting device. The light emitting device comprises a plurality of light emitting units with different wavelengths. The control circuit calibrates a control signal according to an environment light to adjust a light spectrum of the light emitting device by controlling the luminance of each light emitting unit. | 04-18-2013 |
| 20130088877 | LIGHTING DEVICE AND COMPONENT - A light device and a lighting component are provided. The lighting device comprises a LED module and a lighting component. The LED module has an exposed light emitting surface. The lighting component covers the LED module and has an inputting surface and a top outputting surface. The inputting surface faces the light emitting surface of the LED module, the top outputting surface has a concave structure, and the concave structure is located opposite the light emitting surface. | 04-11-2013 |
| 20130069094 | PACKAGE STRUCTURE OF SEMICONDUCTOR LIGHT EMITTING ELEMENT - A package structure of semiconductor light emitting element is provided. The package structure of semiconductor light emitting element includes a substrate, a light emitting element and a transparent conductive board. A first electrode and a second electrode are disposed on the substrate. The light emitting element is disposed on the substrate and between the first electrode and the second electrode. A first bonding pad and a second bonding pad are disposed on the light emitting element. The transparent conductive board has a first surface and a second surface opposite to the first surface. The second surface of the transparent conductive board is located over the light emitting element for electrically connecting the first electrode and the first bonding pad and electrically connecting the second electrode and the second bonding pad. | 03-21-2013 |
| 20130062657 | LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF - A light-emitting diode structure is disclosed. A substrate has a first semiconductor layer, a light-emitting layer and a second semiconductor layer formed thereon. The first and second semiconductor layers are of opposite conductivity types. A first contact electrode is disposed between the first semiconductor layer and the substrate, and has a protruding portion extending into the second semiconductor layer. A barrier layer is conformally formed on the first contact electrode and exposes a top surface of the protruding portion. A current blocking member is disposed on the barrier layer and around at least a sidewall of the protruding portion. A second contact electrode is disposed between the first semiconductor layer and the first contact electrode, and in direct contact with the first semiconductor layer, wherein the second contact electrode is electrically insulated from the first contact electrode by the barrier layer. | 03-14-2013 |
| 20130062634 | SOLID STATE LIGHT SOURCE MODULE AND ARRAY THEREOF - A solid state light source array including a transparent substrate and N rows of solid state light emitting element series is provided. Each row of the solid state light emitting element series includes M solid state light emitting elements connected in series, wherein N, M are integrals and N≧1, M≧2. Each of the solid state emitting elements includes a first type electrode pad and a second type electrode pad. The first and the M | 03-14-2013 |
| 20130051004 | LIGHTING MODULE - A lighting module is provided. The lighting module comprises a circuit board, a first light source array, a second light source array, and a plurality of first light guides. The first light source array is disposed on the circuit board and comprises a plurality of first solid light emitting semiconductors providing a first light with a first wavelength. The second light source array is disposed on the circuit board and comprises a plurality of second solid light emitting semiconductors providing a second light with a second wavelength. The first light guides are disposed on the circuit board and between the second solid light emitting semiconductors. The second solid light emitting semiconductors are located on a side of each of the first light guides, respectively, so that the second light emitted by the second solid light emitting semiconductors enters the first light guides to be uniformly emitted. | 02-28-2013 |
| 20130049015 | LEDS AND METHODS FOR MANUFACTURING THE SAME - A light emitting diode (LED) is disclosed. The LED includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, and a patterned structure. The first semiconductor layer having first and second regions is positioned on the substrate, wherein the first region is thicker than the second region. The active layer is positioned on the first region of the first semiconductor layer. The second semiconductor layer is positioned on the active layer, wherein the first and second semiconductor layers have opposite conductivities. The patterned structure is formed on a sidewall of the first region of the first semiconductor layer or on a sidewall of the second semiconductor layer. | 02-28-2013 |
| 20130048941 | SOLID STATE LIGHT EMITTING SEMICONDUCTOR STRUCTURE AND EPITAXY GROWTH METHOD THEREOF - A solid state light emitting semiconductor structure and an epitaxy growth method thereof are provided. The method includes the following steps: A substrate is provided. A plurality of protrusions separated from each other are formed on the substrate. A buffer layer is formed on the protrusions, and fills or partially fills the gaps between the protrusions. A semiconductor epitaxy stacking layer is formed on the buffer layer, wherein the semiconductor epitaxy stacking layer is constituted by a first type semiconductor layer, an active layer and a second type semiconductor layer in sequence. | 02-28-2013 |
| 20120326191 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light emitting device, including a substrate, an epitaxy layer and an interference thin film is provided. The substrate has a first surface and a second surface opposite to the first surface. The epitaxy layer is disposed on the first surface. The interference thin film is disposed on the second surface. The interference thin film is formed by a plurality of first-material thin films and a plurality of second-material thin films alternately stacked with one another. The difference in refractive index between the first-material and second-material thin films is at least 0.7. The reflection spectrum of the interference thin film has at least one pass band, which allows an incident light of a specific wavelength to pass through. For example, the central wavelength of the incident light ranges 532±10 nm or 1064±10 nm, and the reflectance of the incident light is smaller than 40%. | 12-27-2012 |
| 20120299013 | SEMICONDUCTOR LIGHT EMITTING STRUCTURE - A semiconductor light emitting structure including a substrate, a patterned structure, a first semiconductor layer, an active layer and a second semiconductor layer is provided. The patterned structure is protruded from or indented into a surface of the substrate, so that the surface of the substrate becomes a roughed surface. The patterned structure has an asymmetrical geometric shape. The first semiconductor layer is disposed on the roughed surface. The active layer is disposed on the first semiconductor layer. The second semiconductor is disposed on the active layer. | 11-29-2012 |
| 20120286307 | SEMICONDUCTOR LIGHT EMITTING STRUCTURE - A semiconductor light emitting structure including a substrate, a second type electrode layer, a reflecting layer, an insulating layer, a first type electrode layer, a first type semiconductor layer, an active layer and a second type semiconductor layer is provided. The second type electrode layer formed on the substrate has a current spreading grating formed by several conductive pillars and conductive walls, which are staggered and connected to each other. The reflecting layer and the insulating layer are formed on the second type electrode layer in sequence, and cover each conductive pillar and each conductive wall. The first type electrode layer, the first type semiconductor layer and the active layer are formed on the insulating layer in sequence. The second type semiconductor layer is formed on the active layer, and covers each conductive pillar and each conductive wall. | 11-15-2012 |
| 20120264239 | LIGHT-TUNING METHOD - A light-tuning method is provided. In the method, a filter material is first selected for filtering out unwanted light of a specific wavelength to obtain a transmittance spectrum. The transmittance spectrum is multiplied by an eye sensitivity function to obtain a filtered spectrum. The filtered spectrum has a wavelength range between 450 nm and 650 nm. According to a full width at half maximum (FWHM) wavelength range of the filtered eye sensitivity function, a phosphor is selected and a light-emitting spectrum of the phosphor is determined so that between the light-emitting spectrum of the phosphor and the filtered eye sensitivity function is an optimal matching degree. | 10-18-2012 |
| 20120262932 | LIGHT EMITTING DIODE CUP LIGHT - A light emitting diode (LED) cup light includes a base, a substrate, a LED light source and a fixing structure. The base includes a frame and a carrying member. The frame is surroundingly coupled to a periphery of the carrying member. The carrying member has a through hole. The substrate is disposed on the carrying member of the base. The LED light source is disposed on the substrate. The fixing structure presses on substrate and is engaged with a bottom surface of the carrying member of the base through the through hole. | 10-18-2012 |
| 20120243242 | LIGHTING MODULE AND POWER CONNECTING SET - A lighting module and a power connecting set are provided. The lighting module includes two circuit boards, two light emitting elements and a power connecting set. The light emitting elements are disposed on the circuit boards respectively. The power connecting set includes two connecting bases and a flexible circuit board. The connecting bases are disposed on the circuit boards and electronically connected to the circuit boards respectively. Two ends of the flexible circuit board are connected to the connecting bases for electrically connecting a power path of the circuit boards. | 09-27-2012 |
| 20120243216 | LAMP COVER AND LAMP STRUCTURE - A cover and a lamp structure. The cover whose curvature has a light incident surface and a light outgoing surface, and includes a plurality of 3D micro-structures disposed thereon and arranged in the form of an array. When a light is emitted into the light outgoing surface from the light incident surface, the light emitting angle of the light outgoing surface is increased through the refraction of the 3D micro-structures, so that the occurrence of mura or spots due to uneven distribution of the light is avoid. | 09-27-2012 |
| 20120235198 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - The invention provides a light emitting diode package structure, including: a light emitting diode chip formed on a substrate; a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip; and an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material. | 09-20-2012 |
| 20120228004 | CARRIER STRUCTURE AND MANUFACTURING METHOD THEREOF - A carrier structure and a manufacturing method thereof are provided. The carrier structure includes a substrate, an adhesive layer and a circuit board. The substrate has a plurality of adhesive regions. The adhesive layer is disposed on the adhesive regions. A thermal expansion coefficient of the adhesive layer corresponding one of the adhesive regions is greater than that of another adhesive region. The circuit board is disposed on the adhesive layer. | 09-13-2012 |
| 20120212951 | LAMP TUBE STRUCTURE AND ASSEMBLY THEREOF - A lamp tube structure includes a first end cap, a second end cap, a heat sink holder, a light emitting element array and a lamp cover. The first end cap includes a pair of electrical terminals and a first insulating portion. The electrical terminals are integrated into the first insulating portion by insert molding, and one end of each electrical terminal is protruded from an outside of the first insulating portion. The second end cap includes a grounding terminal and a second insulating portion. The grounding terminal is integrated into the second insulating portion by insert molding, and one end of the grounding terminal is protruded from an outside of the second insulating portion. The light emitting element array is disposed on top surface of the heat sink holder. A bottom surface of the lamp cover is fixed on the heat sink holder for receiving the light emitting element array. | 08-23-2012 |
| 20120175657 | LIGHT-EMITTING DIODE LAMP WITH AN IMPROVED LEADFRAME - A leadframe includes two spaced apart conductive legs, each of which includes a base section, and a first extension section extending from a bottom end of the base section in a direction away from the other one of the conductive legs. At least one of the conductive legs further includes a second extension section that extends from a top end of the base section thereof in the same direction as the first extension section for fixing the light-emitting diode chip. The heat generated by the light-emitting diode chip can be dissipated through a shortest heat-dissipating route, thereby increasing the heat-dissipating rate. | 07-12-2012 |
| 20120175655 | LIGHT EMITTING DIODE CUP LAMP - A light emitting diode (LED) cup lamp including a base, an LED light source and a light guiding device is disclosed. The LED light source is disposed on the base. The light guiding device is disposed above the LED light source. The light guiding device has a light guiding region facing the LED light source. After the light emitted from the LED light source is guided through the light guiding region, the light is further guided by other parts of the light guiding device so that the light is emitted towards the exterior of the LED cup lamp. | 07-12-2012 |
| 20120170228 | CIRCUIT MODULE AND ELECTRIC CONNECTOR - A circuit module and an electric connector are provided. The electric connector is used for connecting two circuit boards. The electric connector at least includes two bases and a locking element. The bases are disposed on the periphery of the circuit boards and electrically connected with the circuit boards respectively. The locking element is used for locking the bases, such that the circuit boards are mechanically connected with each other and the electric paths thereof are electrically connected. | 07-05-2012 |
| 20120168768 | SEMICONDUCTOR STRUCTURES AND METHOD FOR FABRICATING THE SAME - A semiconductor structure is provided. The semiconductor structure includes: a substrate; one or more semiconductor device layers formed on the substrate; and one or more lattice breaking areas formed on the surface of the substrate between the semiconductor device layers. The invention also provides a method for fabricating a semiconductor structure. | 07-05-2012 |
| 20120168712 | HIGH BRIGHT LIGHT EMITTING DIODE - A high bright LED comprises a substrate, a conductive layer, a first semiconductor layer, a luminous layer, a second semiconductor layer, a first electrode, a second electrode and an insulation structure. The conductive layer, the first semiconductor layer, the luminous layer and the second semiconductor layer are disposed upwards from an upper solder layer of the substrate in order. The first electrode is electrically connected to the conductive layer The second electrode penetrates through the conductive layer, the first semiconductor layer and the luminous layer to make the upper solder and the second semiconductor layer electrically connected. The insulation structure comprises at least two passivation layers peripherally wrapping the second electrode. The thicknesses of the at least two passivation layers are conformed to the distributed Bragg reflection technique to make the passivation layers jointly used as a reflector with high reflectance. | 07-05-2012 |
| 20120153339 | LIGHT-EMITTING DIODE CHIP STRUCTURE AND FABRICATION METHOD THEREOF - A light-emitting diode chip structure including a conductive substrate, a semiconductor stacking layer and a patterned seed crystal layer is provided. The conductive substrate has a surface. The surface has a first region and a second region alternately distributed over the surface. The semiconductor stacking layer is disposed on the conductive substrate, and the surface of the conductive substrate faces the semiconductor stacking layer. The patterned seed crystal layer is disposed on the first region of the surface of the conductive substrate and between the conductive substrate and the semiconductor stacking layer. The patterned seed crystal layer separates the semiconductor stacking layer from the first region. The semiconductor stacking layer covers the patterned seed crystal layer and the second region, and is electrically connected to the conductive substrate through the second region. A fabrication method of the light-emitting diode chip structure is also provided. | 06-21-2012 |
| 20120113675 | LAMP DEVICE WITH COLOR-CHANGEABLE FILTER - A lamp device includes a supporting frame, a light emitting diode (LED) array source, a light filter, two end caps and two couples of electrodes. The LED array source is disposed on the supporting frame. The light filter is arc-shaped and combined with the supporting frame as a tubular structure, wherein the arc surface of the light filter is a light emitting surface of the LED array source. The light filter is used for absorbing a ray in a specific wavelength range of the emitting light of the LED array source. The two end caps are disposed at two ends of the tubular structure respectively. The two couples of electrodes are disposed at two ends of the tubular structure and mounted on the two end caps respectively for electrically connecting to the LED array source. | 05-10-2012 |
| 20120112160 | SOLID STATE LIGHT EMITTING DEVICE AND METHOD FOR MAKING THE SAME - A method for making a solid state light emitting device includes: (a) forming a first cladding layer on a substrate; (b) forming a matrix layer above the first cladding layer, the matrix layer having a top surface and being formed with a plurality of isolated spaces; (c) epitaxially forming a quantum cluster in each of the spaces such that the top surface of the matrix layer and top surfaces of the quantum clusters cooperatively define a coplanar surface, the quantum clusters cooperating with the matrix layer to form a light emitting layer; (d) forming a second cladding layer on the light emitting layer; and (e) forming an electrode unit electrically connected to the first and second cladding layers. | 05-10-2012 |
| 20120044679 | POINT LIGHT SOURCE AND LIGHT SOURCE MODULE USING THE SAME - A point light source includes a light-emitting portion, a first lead and a second lead. The first lead and the second lead are electrically connected to the light-emitting portion. The first lead and the second lead respectively have a wedging portion. The wedging portions can be matched with each other. A light source module using the point light source is also provided. The light source module includes at least one light source assembly. Each light source assembly includes a plurality of the point light sources connected in series. Adjacent two point light sources are wedged to each other in series by a combination of the wedging portions of the adjacent first lead and second lead. | 02-23-2012 |
| 20120037952 | LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF - A light emitting diode and a fabricating method thereof are provided. A first-type semiconductor layer, a light emitting layer and a second-type semiconductor layer with a first surface are sequentially formed a substrate. Next, the first surface is treated during a surface treatment process to form a current-blocking region which extends from the first surface to the light emitting layer to a depth of 1000 angstroms. Afterward, a first electrode is formed above the current-blocking region of the second-type semiconductor layer, and a second electrode is formed to electrically contact to the first-type semiconductor layer. Since the current-blocking region is formed with a determined depth within the second-type semiconductor layer, the light extraction efficiency of the light emitting diode may be increased. | 02-16-2012 |
| 20120012886 | LIGHT EMITTING DIODE, FRAME SHAPING METHOD THEREOF AND IMPROVED FRAME STRUCTURE - A single material tape is shaped into first, second and third frames isolated from and disposed opposite each other, and a press forming process is performed to thin bottoms of first and second wire-bonding sectors extending from the first and second frames. The thickness of each of the first and second wire-bonding sectors is smaller than that of the third frame, so that the thicker third frame can be exposed out of a glue body to achieve the better dissipation effect, and at least one side surface between the two frames isolated from and disposed opposite each other is formed with a slot portion. When the frame is applied to the light emitting diode and fixed to the glue body, the slot portion can increase the bonding property between the frame and the glue body, and the structural strength therebetween can be increased. | 01-19-2012 |
| 20110210343 | SEMICONDUCTOR WAFER - A semiconductor wafer includes a substrate, a first separating structure and a semiconductor stacked layer structure. The substrate has a first surface. The first separating structure is formed on the first surface to divide the first surface into a plurality of independent regions. The minimum area of each of the regions is more than or equal to one square inch. The semiconductor stacked layer structure is disposed on the first surface and the first separating structure. The semiconductor wafer can prevent bowing of the semiconductor wafer during an epitaxial growth process so as to enhance quality of the semiconductor wafer. | 09-01-2011 |
| 20110194296 | LIGHTING APPARATUS - A lighting apparatus includes a housing, a light source disposed in the housing and at least one adjustable assembly disposed at an end of the housing. The adjustable assembly includes a connection element fixed to the end of the housing, a cap capping the connection element, at least one electrical terminal and an adjusting mechanism. A part of the connection element is located in the cap. The electrical terminal is disposed at the cap and electrically connected to the light source. The adjusting mechanism includes a gear, a positioning element, a clasp and a track. The gear and the positioning element are respectively disposed at the connection element and the cap. Positions of the gear and the positioning element can be exchanged. The clasp and the track are respectively disposed at the connection element and the cap. Positions of the clasp and the track can be exchanged. | 08-11-2011 |
| 20110156067 | LIGHT EMITTING MODULE AND ILLUMINATION DEVICE WITH THE SAME - A light emitting module includes a substrate, a conductive layer, a first light emitter, a second light emitter and a protection layer. The substrate has a first surface and a second surface on opposite sides of the substrate. The conductive layer is configured in the substrate. The first light emitter is disposed on the first surface and connected with the conductive layer. The second light emitter is disposed on the second surface and connected with the conductive layer. The protection layer covers the first light emitter and the second light emitter. | 06-30-2011 |
