KOH YOUNG TECHNOLOGY INC. Patent applications |
Patent application number | Title | Published |
20150342692 | STAND FOR A MEDICAL-OPTICAL INSTRUMENT - A stand for medical optical instrument capable of easily extending, adjusting easily a counter balancing according to a change of a weight of medical optical instrument such as microscope, as well as, maintaining stably a counter balancing regardless of a position of medical optical instrument. The stand for medical optical instrument includes a first to fourth links having a first to fourth turning joins, wherein the first to fourth links are rotatably coupled to each other in a parallelogram shape and the second turning joint is rotatably coupled to a holding unit, a carrier arm extended from the fourth link; and a counter balancing unit coupled to the first and second links, wherein the counter balancing unit is rotated in connection with the first and second links on the second turning joint according to the rotation of the carrier arm, and capable of maintaining a counter balancing of the carrier arm by compensating a torque generated in the second turning joint according to a medical optical instrument installed on the front link. | 12-03-2015 |
20150210064 | METHOD OF CORRECTING A SCREEN PRINTER AND A BOARD INSPECTION SYSTEM USING THE SAME - The present invention relates to a method of correcting a position of a stencil mask which comprises receiving fiducial information from a screen printer, extracting position information of a pad and position information of a solder formed on a board through measuring by a solder paste inspection apparatus, estimating an x, y offset value and a rotating amount of a stencil mask based on the fiducial information by using the position information of the pad and the solder, and transmitting the x,y offset value and the rotating amount of the stencil mask to the screen printer. Thus, a reliability of solder forming process may be increased by correcting a stencil mask position by transmitting a feedback of an x,y offset value and a rotating amount of the stencil mask from a solder paste inspection apparatus, in which the x,y offset value and the rotating amount are estimated based on fiducial information transmitted from the screen printer. | 07-30-2015 |
20150160448 | STEREO MICROSCOPE SYSTEM - A stereo microscope system capable of display virtual reality through a plurality of sub display parts, which is the same as that embodied through a microscope, and capable of embodying virtual reality with same quality image throughout the plurality of display parts, is provided. According to the stereo microscope, the image capturing part captures the beam passing through the beam splitter part of the prism to capture an image and delivers the image to the processor, and the processor digital processes the image captured by the pair of image capturing part and delivers the image to the first and second display parts and to display the image. Therefore, the image captured by the image capturing part is digital processed by the processor, and the image that is digital processed by the processor is delivered to each of the display part to display so that regular image is displayed regardless of change of amount of light. | 06-11-2015 |
20150045656 | SURGICAL NAVIGATION SYSTEM - An surgical navigation system to provide more precise navigation function during endoscopic surgery in otolaryngology such as paranasal sinuses including large curved areas. The surgical navigation system comprises a bendable surgical instrument containing plurality of markers to generate energy, a master device coupled to the bendable surgical instrument to activate the markers, a tracking sensor to detect energy generated from the markers; and a processor coupled to the tracking sensor and the bendable surgical instrument, to determine a position of the energy which is generated from the markers detected by the tracking sensor, and to trace confirmed markers wherein the confirmed markers are matched between the position of the energy detected by the tracking sensor with a predetermined marker stored in the processor. | 02-12-2015 |
20150043065 | STEREO MICROSCOPE - A stereo microscope capable of not only adjusting the three dimensional effect of stereoscopic image but also focusing exactly even when the three dimensional effect of stereoscopic image is adjusted, is provided. A spacing distance of a pair of zoom unit can be adjusted so that a user can adjust three dimensional effect of image seen through an ocular lens according to personal tendency to improve convenience. Additionally, an object with a depth such as a hole can be exactly observed without interference of a boundary. Further, even though the three dimensional effect of an image is adjusted by adjusting the spacing distance of the pair of zoom units, the to focus of optical system can be exactly adjusted. | 02-12-2015 |
20150040711 | PARALLEL MICRO-ROBOT WITH 5-DEGREES-OF-FREEDOM - A parallel micro-robot with five degrees of freedom that is capable of manufacturing in compact size as well as capable of controlling more precisely compared with conventional parallel robot is disclosed. The parallel micro-robot with five degrees of freedom is capable of controlling an angle of the operating plate very precisely around two shafts rotating connection means which couples operating plate and up/down height adjusting actuator using a first and second angle adjusting actuator, and therefore, high accuracy is secured. | 02-12-2015 |
20140219542 | METHOD OF GENERATING HEIGHT INFORMATION IN CIRCUIT BOARD INSPECTION APPARATUS - A method of generating height information in a circuit board inspection apparatus, first, obtaining a first image corresponding to a first area and a second image corresponding to a second area with partially overlapped to the first area of a test board. Next, the first image and the second image are matched based on the overlapped area of the first and second area. Sequentially, a relative positional relationship of the first and second images is obtained from the result of matching. Sequentially, a combined grid image is generated by combining the first grid image and the second grid image based on the relative positioning relationship, wherein the first and second grid images are obtained by irradiating a grid patterned light toward a measurement object formed on the board inspection apparatus. Therefore, it is possible to generate an exact height information. | 08-07-2014 |
20140168419 | INSPECTION METHOD - To inspect a board, first, a measurement area is set on the board and a reference data of the measurement area is obtained. Then, a measurement data of the measurement area is obtained per colors, and a lighting condition is set using the reference data of the measurement area and the measurement data obtained per colors. Next, a feature object in the measurement area is set, and a distortion quantity between the reference data and the measurement data is obtained by comparing the reference data corresponding to the feature object and the measurement data corresponding to the feature object obtained under the lighting condition. Then, an inspection area is set by compensating the distortion quantity. Therefore, it is possible to compensate the distortion and set precisely the inspection area. | 06-19-2014 |
20140133738 | METHOD OF INSPECTING A SOLDER JOINT - A method of inspecting a solder joint through which a lead of a semiconductor device is mounted on a printed circuit board is disclosed. The method includes setting an estimated solder joint region at an outside of an end of the lead of the semiconductor device, capturing an image of the estimated solder joint region, calculating a height of solder joint in the estimated solder joint region by using the captured image of the estimated solder joint region, and determining whether the solder joint is defective by comparing the height of the solder joint in the estimated solder joint region with a reference height of a solder joint, which is previously set. According to the method, reliability of inspection is enhanced regardless of environmental noises. | 05-15-2014 |
20140133735 | METHOD OF INSPECTING A LEAD OF AN ELECTRIC DEVICE - A method of inspecting leads of an electric device, which is capable of improve reliability of inspection regardless of noises induced by regions near the lead. The method uses a height or a brightness of a shoulder region of the lead to inspect existence or nonexistence or a height or a brightness of a tip region of the lead to inspect fastening or unfastening. Therefore, reliability of inspection is improved in comparison with a conventional inspection using colors of lead region. | 05-15-2014 |
20140132953 | BOARD INSPECTION METHOD - In order to inspect a board, first, an inspection area including a solder joint is provided with a first light having a first color, a second light having a second color and a third light having a third color at a first inclination angle, a second inclination angle smaller than the first inclination angle and a third inclination angle smaller than the second inclination angle with respect to the board, respectively. Then, a color image of the inspection area is acquired according to the first light, the second light and the third light provided to the inspection area. Thereafter, it is inspected whether the solder joint is good or bad by using a color distribution in the color image. Then, the inspection result is verified by using pre-measured height information of the solder joint. Thus, an inspection error may be prevented. | 05-15-2014 |
20140125375 | BOARD INSPECTION APPARATUS SYSTEM AND BOARD INSPECTION METHOD - A board inspection apparatus system includes a first apparatus, a second apparatus, a third apparatus and an information transfer section. The first apparatus acquires first three-dimensional information of a solder paste on a board, and inspects whether the solder paste is formed good by a first tolerance based on the first three-dimensional information. The second apparatus mounts an electronic component on the board to join the electronic component and the solder paste. The third apparatus acquires second three-dimensional information of a solder joint, and inspects whether the electronic component is mounted good by a second tolerance based on the second three-dimensional information. The information transfer section transfers the first three-dimensional information to the third apparatus, or transfers the second three-dimensional information to the first apparatus. Thus, a more effective inspection condition may be established, and a rate of defect for each apparatus may be greatly reduced. | 05-08-2014 |
20140010438 | THREE DIMENSIONAL SHAPE MEASUREMENT APPARATUS AND METHOD - A three dimensional shape measurement apparatus includes m projecting sections, each of which includes a light source and a grating element, and, while moving the grating element by n times, projects a grating pattern light onto a measurement target for each movement, wherein the ‘n’ and the ‘m’ are natural numbers greater than or equal to 2, an imaging section photographing a grating pattern image reflected by the measurement target, and a control section controlling that, while photographing the grating pattern image by using one of the m projecting sections, a grating element of at least another projecting section is moved. Thus, measurement time may be reduced. | 01-09-2014 |
20130263078 | METHOD FOR GENERATING TASK DATA OF A PCB AND INSPECTING A PCB - A method for generating PCB inspection task data and inspecting a PCB is disclosed. The method by which Gerber data and CAD coordinate file generated at the time of PCB designing is matched to each other facilitates to generate a task data and allows a higher inspection accuracy. The task data generating method comprises generating a Gerber data comprising information for pads on the PCB, loading a CAD coordinate file comprising a coordinate of a component mounted on the pads, inferring a shape of lead and body of the component within a pad area by matching the Gerber data and CAD coordinate file, and then setting a pad area where a tip-end of the body locates as an inspection area. | 10-03-2013 |
20130259359 | JOINT INSPETION APPARATUS - Disclosed herein is a joint inspection apparatus for judging whether an electronic component mounted on a board is appropriately soldered to the board capable of increasing accuracy in judging a state of a joint by combining at least two joint features with each other and capable of allowing a user to intuitively and easily change a reference for judging the state of the joint. The joint inspection apparatus includes: a three-dimensional shape measuring device measuring joint features; a classifying device judging a state of a joint by at least two joint features transmitted by the three-dimensional shape measuring device; and a user interface device displaying the state of the joint, wherein the state of the joint is displayed in a joint space graph in which a user may easily adjust a judgment reference. | 10-03-2013 |
20130229509 | METHOD OF MEASURING A THREE-DIMENSIONAL SHAPE - In order to measure a three-dimensional shape, feature information is read from a database. A board is transferred to a measurement position. A measurement head is transferred to an inspection area of the board. Light of a first lighting device for three-dimensional measurement and light of a second lighting device for two-dimensional measurement is illuminated onto the inspection area to photograph a first reflection image and a second reflection image that are reflected from the inspection area. The inspection area is realigned by comparing the feature information with at least one of the photographed first and second reflection images to inspect distortion of the inspection area. The realigned inspection area is inspected. Thus, the three-dimensional shape may be precisely measured. | 09-05-2013 |
20130222579 | MEASUREMENT APPARATUS AND CORRECTION METHOD OF THE SAME - A measurement apparatus for measuring a substrate, on which a measurement object is formed, and a correction method of the same is shown. The correction method includes measuring a reference phase by measuring a phase of a substrate for measuring the reference phase by using an image-capture part, acquiring a tilted pose of a reference plane of the measured reference phase to an image plane of the image-capture part, and calculating a height that is required to correct the reference plane with regard to the image-capture part based on the tilted pose. Therefore, based on a tilted pose of a reference phase in order to correct a reference plane being a reference of measuring a height, a measurement credibility of the measurement object may be improved. | 08-29-2013 |
20130222578 | SHAPE MEASUREMENT APPARATUS AND METHOD - A shape measurement apparatus includes a work stage supporting a target substrate, a pattern-projecting section including a light source, a grating part partially transmitting and blocking light generated by the light source to generate a grating image and a projecting lens part making the grating image on a measurement target of the target substrate, an image-capturing section capturing the grating image reflected by the measurement target of the target substrate, and a control section controlling the work stage, the pattern-projecting section and the image-capturing section, calculating a reliability index of the grating image and phases of the grating image, which is corresponding to the measurement target, and inspecting the measurement target by using the reliability index and the phases. Thus, the accuracy of measurement may be enhanced. | 08-29-2013 |
20130215262 | BOARD INSPECTION APPARATUS AND METHOD - An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined. | 08-22-2013 |
20130194569 | SUBSTRATE INSPECTION METHOD - A substrate inspection apparatus for inspecting a substrate, on which a measurement object is formed, is shown. The substrate inspection method includes measuring a substrate, on which a measurement object is formed, generating a plane equation of the substrate, and acquiring a region of the measurement object formed on the substrate. After, by considering a height of measurement object a region of the measurement object is converted into a substrate plane by plane equation,. Then, the measurement object is inspected based on a region of the measurement object converted into a substrate plane by plane equation and a region of the measurement object by reference data. Therefore, an offset value of a measurement object is acquired according to a tilted pose of the substrate, and a distortion of measurement data is compensated by using the offset value, to improve a measurement credibility of a measurement object. | 08-01-2013 |
20130128280 | METHOD FOR MEASURING THREE-DIMENSION SHAPE OF TARGET OBJECT - A method of measuring a 3D shape, which can measure a 3D shape of target objects on a board by searching a database for bare board information when a measuring object is not set to a normal inspection mode or by performing bare board teaching when the board is supplied from a supplier having not the bare board information is provided. The method of measuring a 3D shape includes operation S | 05-23-2013 |
20130077849 | METHOD FOR INSPECTING MEASUREMENT OBJECT - An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted. | 03-28-2013 |
20130039563 | METHOD OF GENERATING INSPECTION PROGRAM - A method of generating an inspection program that does not have a gerber file is shown. To generate the inspection program, a first image information is acquired by scanning a bare board, a second image information is acquired by scanning a solder-pasted board that solder is pasted on a pad area of the bare board, and by analyzing the first image information and the second image information an inspection program is generated. The first image information and the second image information may include at least one of a two-dimensional image information and a three-dimensional image information. The step for generating an inspection program calculates a difference between the first image information and the second image information, after extracting a position and a size of an area in which the difference occurs, then generates the inspection program by using the extracted information. Therefore, a bare board and a solder-pasted board may be each inspected and the accurate position and size of the solder pasted area may be extracted through analyzing the acquired two-dimensional image information or a three-dimensional image information differences. | 02-14-2013 |
20130010102 | METHOD OF MEASURING MEASUREMENT TARGET - In order to measure a measurement target on a PCB, height information of the PCB is acquired by using a first image photographed by illuminating a grating pattern light onto the PCB. Then, a first area protruding on the PCB by greater than a reference height is determined as the measurement target by using the height information. Thereafter, color information of the PCB is acquired by using a second image photographed by illuminating light onto the PCB. Then, the first color information of the first area determined as the measurement target out of the color information of the PCB is set as reference color information. Thereafter, the reference color information is compared with color information of an area except for the first area to judge whether the measurement target is formed in the area except for the first area. Thus, the measurement target may be accurately measured. | 01-10-2013 |
20120287264 | BOARD INSPECTION APPARATUS - An apparatus for inspecting a board is shown. The board inspection apparatus includes at least one illuminating module, an imaging lens, a first beam splitter, a first camera, and a second camera. The illuminating module provides light to an inspection board and the imaging lens transmits a light reflected from the inspection board. The first beam splitter transmits a portion of the light transmitted from the imaging lens and reflects the rest of the transmitted light. The first camera image-captures by receiving the light that transmits the first beam, and the second camera image-captures by receiving the light reflected from the first beam splitter. Therefore, by using one imaging lens to inspect the inspection board, the decrease in accuracy caused by the different optical axis or magnification may be prevented. | 11-15-2012 |
20120130666 | INSPECTION METHOD - In order to inspect a board, a measurement area is set on a board, and reference data and measurement data of the measurement area are acquired. Then, a conversion condition is established for the measurement area, and a conversion relation is acquired according to a distortion degree between reference data and measurement data. Thereafter, validity of the conversion relation is verified by using at least one of verifying that a comparison feature object satisfies the conversion relation, verifying that a verification feature object selected from feature objects satisfies the conversion relation and verifying that a pad formed on the board satisfies the conversion relation. Then, the conversion condition is confirmed, and an inspection area for inspecting a measurement target is set according to the confirmed conversion condition. Thus, an inspection area may be correctly set so that distortion is compensated for. | 05-24-2012 |
20120128232 | METHOD FOR DETECTING A BRIDGE CONNECTING FAILURE - A method for detecting a bridge connecting failure to detect a bridge shorting terminals of a component includes acquiring a 2D image and height-based information through lights irradiated on a board, acquiring rotation information of the component using at least one of the 2D image and the height-based information, establishing an inspection region for detection of the bridge connecting failure using the rotation information, extracting a first bridge region within the inspection region using the 2D image, extracting a second bridge region within the inspection region using the height-based information, and judging whether the bridge connecting failure of the component occurs by using at least one of the first and second bridge regions. Thus, the method may inspect more precisely the bridge connecting failure through the first bridge region extracted from the 2D image and the second bridge region extracted from the height-based information. | 05-24-2012 |
20120128231 | INSPECTION METHOD - In order to inspect a board, firstly, a measurement area is set on a board, and reference data and measurement data of the measurement area are acquired. Then, a plurality of feature blocks is established by a block unit so as to include a predetermined shape in the measurement area, and a merged block is established by merging feature blocks overlapped in the feature blocks. Thereafter, a distortion degree is acquired by comparing reference data and measurement data corresponding to a feature block except for the merged block and/or the merged block, and the distortion degree is compensated for, to set an inspection area in the target measurement area. Thus, an inspection area, in which distortion is compensated for, may be correctly set. | 05-24-2012 |
20120127486 | METHOD OF INSPECTING A SUBSTRATE - A method of inspecting a substrate is disclosed. The method of inspecting a substrate, comprises: obtaining phase data per projecting part with regard to a substrate, by projecting pattern beam onto the substrate having a target object formed thereon through a plurality of projecting parts in sequence; obtaining height data per projecting part with regard to the substrate by using the phase data per the projecting part; compensating tilt of the height data by using the height data per projecting part; modifying the tilt-compensated height data per projecting part; and obtaining integrated height data by using the modified height data. | 05-24-2012 |
20120127463 | INSPECTION APPARATUS - An inspection apparatus includes a work stage part, an optical module, and an optical module moving part. The work stage part receives a board. The work stage part includes work stages disposed in parallel. The optical module includes a projecting part disposed over the board, an image capturing part disposed at a side portion of the projecting part to receive the grating pattern light and capture a reflection image, and an optical path changing part changing a path of the grating pattern light and guiding the grating pattern light to the image capturing part so that the grating pattern light is downwardly incident into the image capturing part. The optical module moving part is disposed over and coupled to the optical module to move the optical module. Thus, time may be reduced and a space may be secured, required for inspecting a board. | 05-24-2012 |
20120127461 | METHOD OF INSPECTING A SUBSTRATE - A method of inspecting a substrate is disclosed. The method of inspecting a substrate, comprises: obtaining phase data per projecting part with regard to a substrate, by projecting pattern beam onto the substrate having a target object formed thereon through a plurality of projecting parts in sequence; obtaining height data per projecting part with regard to the substrate by using the phase data per the projecting part; setting up a projecting part with highest reliability in the a plurality of projecting parts to be a reference projecting part; modifying height data of remaining projecting part, referenced by height data of the reference projecting part; and obtaining integrated height data by using the modified height data. | 05-24-2012 |
20120127305 | METHOD AND APPARATUS OF PROFILING A SURFACE - A method and an apparatus of profiling a surface are disclosed. The method comprises projecting slit pattern light toward a target object in at least two directions in sequence to obtain pattern images reflected on the target object, obtaining heights by using the pattern images according to the directions, obtaining vector fields showing a direction of maximum variation of height, obtaining confidence indexes of the heights corresponding to the at least two directions, obtaining integrated vector fields by using the confidence indexes and the vector fields, and calculating height of each position of the target object by using the integrated vector fields. Therefore, accuracy is enhanced. | 05-24-2012 |
20120123719 | INSPECTION METHOD - In order to set an inspection area in an inspection apparatus for inspecting a board, a plurality of measurement areas are set on a board, and then reference data and measurement data of at least one adjacent measurement area that is adjacent to a target measurement area for inspecting a measurement target, among the measurement areas, are acquired. Thereafter, at least one feature object is extracted from the adjacent measurement area. Then, a distortion degree is acquired by comparing reference data and measurement data corresponding to the feature object with each other, and thereafter the distortion degree is compensated for, to set an inspection area in the target measurement area. Thus, a conversion relation between the reference data and the measurement data may be correctly acquired, and an inspection area, in which distortion is compensated for, may be correctly set. | 05-17-2012 |
20120120414 | METHOD OF INSPECTING BOARD - A method of establishing a tip location of a terminal includes establishing a virtual tip line by measuring a height of a board, on which a component having a terminal and a body is mounted, and comparing the measured measurement height with a predetermined reference height, establishing a central line with respect to a width direction of the terminal along a longitudinal direction of the terminal, and establishing a tip location of the terminal by using the measurement height along the central line from an intersection point of the virtual tip line and the central line. Thus, a tip location of a terminal may be more correctly acquired. | 05-17-2012 |
20110255771 | METHOD OF DISCRIMINATING BETWEEN AN OBJECT REGION AND A GROUND REGION AND METHOD OF MEASURING THREE DIMENSIONAL SHAPE BY USING THE SAME - A method of discriminating a region and a method of measuring a three dimensional shape are disclosed. The method includes irradiating light onto a substrate having a measurement target formed thereon to capture an image by receiving light reflected by the substrate, setting up an object region in which the measurement target is disposed and a ground region corresponding to a remaining region in an inspection region of the image, irradiating a grating patterned light onto the substrate having the measurement target formed thereon to capture a patterned image by receiving the grating patterned light reflected by the substrate, and obtaining height of each position in the inspection region by using the patterned image to establish a ground height with respect to the measurement target with a height of the ground region. | 10-20-2011 |
20110254949 | METHOD OF CHECKING AN INSPECTION APPARATUS AND METHOD OF ESTABLISHING A MEASUREMENT VARIABLE OF THE INSPECTION APPARATUS - In order to establish a lighting intensity of an inspection apparatus, an inspection board is installed in an inspection apparatus. Then, a width of a histogram of a captured image acquired through a camera of the inspection apparatus is adjusted to avoid from a dark region and a bright region. Thereafter, a lighting intensity of the inspection apparatus is adjusted by adjusting the histogram to be near a middle of a graph. Thus, a setting time of an inspection condition stored in a job file may be reduced to increase the user's convenience, and measurement error due to mis-establishment may be reduced to enhance inspection precision. | 10-20-2011 |
20110191050 | METHOD OF INSPECTING A THREE DIMENSIONAL SHAPE - In order to inspect a three dimensional shape, a predetermined inspection target component formed on a board is selected as the measurement target, a shape of the inspection target component is acquired, a reference point of the inspection target component is detected, relative location information of a polarity mark formed on the inspection target component with respect to the reference point is acquired, and it is judged whether the inspection target component is good or bad by checking whether the polarity mark exists or not by using the relative location information with respect to the reference point. Thus, the location of the polarity mark may be accurately known, and polarity inspection may be more easily and accurately performed. | 08-04-2011 |
20110058181 | 3D IMAGE MEASURING APPARATUS AND METHOD THEREOF - A 3D measuring apparatus includes a stage, a projection portion, and an imaging portion. The projection portion includes first and second lights, first and second lattices, and first and second projection lenses. The imaging portion includes an imaging lens and a camera. The projection portion further includes a movement instrument which control the first and the second lattice simultaneously with predetermined n times. | 03-10-2011 |
20110050893 | APPARATUS AND METHOD FOR MEASURING A THREE-DIMENSIONAL SHAPE - Provided are an apparatus and a method for measuring a three dimensional shape with improved accuracy. The apparatus includes a stage, at least one lighting unit, a plurality of image pickup units and a control unit. The stage supports an object to be measured. The lighting unit includes a light source and a grid, and radiates grid-patterned light to the object to be measured. The image pickup units capture, in different directions, grid images reflected from the object to be measured. The control unit calculates a three dimensional shape of the object from the grid images captured by the image pickup units. The present invention has advantages in capturing grid images through a main image pickup portion and sub-image pickup portions, enabling the measurement of the three dimensional shape of the object in a rapid and accurate manner. | 03-03-2011 |
20110002529 | METHOD FOR INSPECTING MEASUREMENT OBJECT - An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted. | 01-06-2011 |
20110002527 | BOARD INSPECTION APPARATUS AND METHOD - An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined. | 01-06-2011 |
20110001818 | THREE DIMENSIONAL SHAPE MEASUREMENT APPARATUS - A three dimensional shape measurement apparatus includes an illumination section and a grating transfer unit. The illumination section includes a light source unit generating a light and a grating unit changing the light generated by the light source unit into a grating pattern light having a grating pattern. The illumination section illuminates the grating pattern light onto a measurement target in a predetermined direction. The grating transfer unit transfers the grating unit in a predetermined inclination direction with respect to an extension direction of the grating pattern and an arrangement direction of the grating pattern. Thus, manufacturing cost may be reduced, and the three dimensional shape measurement apparatus may be easily managed. | 01-06-2011 |
20100302364 | THREE DIMENSIONAL SHAPE MEASUREMENT APPARATUS AND METHOD - A three dimensional shape measurement apparatus includes m projecting sections, each of which includes a light source and a grating element, and, while moving the grating element by n times, projects a grating pattern light onto a measurement target for each movement, wherein the ‘n’ and the ‘m’ are natural numbers greater than or equal to 2, an imaging section photographing a grating pattern image reflected by the measurement target, and a control section controlling that, while photographing the grating pattern image by using one of the m projecting sections, a grating element of at least another projecting section is moved. Thus, measurement time may be reduced. | 12-02-2010 |
20100295941 | SHAPE MEASUREMENT APPARATUS AND METHOD - A shape measurement apparatus includes a work stage supporting a target substrate, a pattern-projecting section including a light source, a grating part partially transmitting and blocking light generated by the light source to generate a grating image and a projecting lens part making the grating image on a measurement target of the target substrate, an image-capturing section capturing the grating image reflected by the measurement target of the target substrate, and a control section controlling the work stage, the pattern-projecting section and the image-capturing section, calculating a reliability index of the grating image and phases of the grating image, which is corresponding to the measurement target, and inspecting the measurement target by using the reliability index and the phases. Thus, the accuracy of measurement may be enhanced. | 11-25-2010 |
20100290696 | METHOD OF MEASURING MEASUREMENT TARGET - In order to measure a measurement target on a PCB, height information of the PCB is acquired by using a first image photographed by illuminating a grating pattern light onto the PCB. Then, a first area protruding on the PCB by greater than a reference height is determined as the measurement target by using the height information. Thereafter, color information of the PCB is acquired by using a second image photographed by illuminating light onto the PCB. Then, the first color information of the first area determined as the measurement target out of the color information of the PCB is set as reference color information. Thereafter, the reference color information is compared with color information of an area except for the first area to judge whether the measurement target is formed in the area except for the first area. Thus, the measurement target may be accurately measured. | 11-18-2010 |
20100275687 | HOUSING FOR A MEASURING EQUIPMENT AND MEASURING EQUIPMENT HAVING THE SAME - A housing for a measuring equipment receiving a measurement apparatus includes a body, a predetermined area of which is open, a first door combined with the body to cover at least a portion of the open predetermined area of the body, and a second door combined with the body to cover at least a portion of the open predetermined area of the body. A display unit is installed on the second door to be rotated from a first face toward a second face. Thus, a space required to install the display unit may be reduced, and a viewing scope of the display unit may be increased. | 11-04-2010 |
20100246931 | INSPECTION METHOD - In order to set an inspection area, a measurement target is disposed onto a stage, a reference data of the measurement target is summoned, and a measurement data of the measurement target is acquired. Then, at least one feature object is selected in the measurement data and the reference data of the measurement target, and at least one feature variable for the selected feature object is extracted from each of the reference data and the measurement data. Thereafter, a change amount of the measurement target is produced by using the feature variable and a quantified conversion formula, and the produced change amount is compensated for to set an inspection area. Thus, the distortion of the measurement target is compensated for to correctly set an inspection area. | 09-30-2010 |
20100092041 | METHOD OF MEASURING A THREE-DIMENSIONAL SHAPE - In order to measure a three-dimensional shape, feature information is read from a database. A board is transferred to a measurement position. A measurement head is transferred to an inspection area of the board. Light of a first lighting device for three-dimensional measurement and light of a second lighting device for two-dimensional measurement is illuminated onto the inspection area to photograph a first reflection image and a second reflection image that are reflected from the inspection area. The inspection area is realigned by comparing the feature information with at least one of the photographed first and second reflection images to inspect distortion of the inspection area. The realigned inspection area is inspected. Thus, the three-dimensional shape may be precisely measured. | 04-15-2010 |
20100091302 | APPARATUS AND METHOD FOR MEASURING THREE-DIMENSIONAL SHAPE BY USING MULTI-WAVELENGTH - An apparatus and a method for measuring a three-dimensional shape are disclosed. The apparatus includes a transfer stage, a first projector, a second projector, a camera unit and a control unit. The transfer stage transfers a measurement object to a measurement position. The first projector irradiates a first pattern light having a first equivalent wavelength toward the measurement object in a first direction. The second projector irradiates a second pattern light having a second equivalent wavelength that is different from the first equivalent wavelength toward the measurement object in a second direction. The camera unit takes a first pattern image that is generated when the first pattern light is reflected by the measurement object, and a second pattern image that is generated when the second pattern light is reflected by the measurement object. The control unit controls the first projector and the second projector, and obtains a three-dimensional shape of the measurement object through the first pattern image and the second pattern image. | 04-15-2010 |
20090051929 | THREE-DIMENSIONAL IMAGE MEASURING APPARATUS - The present invention relates to a three-dimensional image measuring apparatus comprising: an XYZ shaft transfer means mounted onto a base member; a work stage mounted to the base member, for moving a measuring object to a measuring position and thereafter supporting it and having a predetermined reference surface set at a side thereof; an image obtaining means in which it is moved toward X,Y and Z shafts by the XYZ shaft transfer means, scans a grating image by the frequency of N times to a side of the measuring object supported and fixed to the work stage, obtains the changed grating image by the measuring object by N times; a light emitting means mounted to a side of the image obtaining means for generating and emitting light with a predetermined wavelength; and a control unit which irradiates light generated from the light emitting means mounted to a side of the image obtaining means to the reference surface set the side of the work stage, receives the changed grating image obtained from the image obtaining means, thereby producing the three-dimensional image. | 02-26-2009 |