| INVENSENSE, INC Patent applications |
| Patent application number | Title | Published |
|---|
| 20150362589 | ANTI-SCRATCHING PROTECTION FOR ACOUSTIC SENSORS - An acoustic sensing element of an acoustic sensor and/or transducer can be covered with a composite material comprising a cover material and an anti-scratch material. In one aspect, an acoustic impedance of the cover material is lower than an acoustic impedance of the anti-scratch material. During acoustical sensing, the acoustic sensing element transmits an ultrasonic signal through the cover material and the anti-scratch material, which interferes with an object on (or near) the surface of the anti-scratch material. An interference signal that is generated based on an interference of the ultrasonic signal with the object propagates through the anti-scratch material and the cover material and is sensed by the acoustic sensing element. Further, an image of the object is recreated based on an analysis of the interference signal. | 12-17-2015 |
| 20150350793 | TOP PORT MICROELECTROMECHANICAL SYSTEMS MICROPHONE - A top port microelectromechanical systems (MEMS) microphone is presented herein. A device can include a substrate and a MEMS acoustic sensor mechanically attached to the substrate utilizing anchors. Spaces between the anchors can connect a first back volume corresponding to a bottom portion of the MEMS acoustic sensor with a second back volume to form a combined back volume. An acoustic seal can be placed on the MEMS acoustic sensor, and an enclosure placed on the acoustic seal and secured to the substrate. The acoustic seal can isolate a first portion of the enclosure corresponding to a front volume from a second portion of the enclosure corresponding to the combined back volume. The first portion of the enclosure can include an opening adapted to receive acoustic waves into the front volume, and the front volume can be acoustically coupled to a top portion of the MEMS acoustic sensor. | 12-03-2015 |
| 20150350770 | SMART SENSOR FOR ALWAYS-ON OPERATION - Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described. | 12-03-2015 |
| 20150321906 | INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTAL SENSOR AND METHODOLOGY FOR FABRICATING SAME - An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor. | 11-12-2015 |
| 20150289073 | ELECTRICAL TESTING AND FEEDTHROUGH CANCELLATION FOR AN ACOUSTIC SENSOR - A method and circuit for testing an acoustic sensor are disclosed. In a first aspect, the method comprises using electro-mechanical features of the acoustic sensor to measure characteristic of the acoustic sensor. In a second aspect, the method comprises utilizing an actuation signal to evaluate mechanical characteristics of the acoustic sensor. In a third aspect, the method comprises using a feedthrough cancellation system to measure a capacitance of the acoustic sensor. In the fourth aspect, the circuit comprises a mechanism for driving an electrical signal into a signal path of the acoustic sensor to cancel an electrical feedthrough signal provided to the signal path, wherein any of the electrical signal and the electrical feedthrough signal are within or above an audio range. | 10-08-2015 |
| 20150289045 | MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE HAVING TWO BACK CAVITIES SEPARATED BY A TUNING PORT - Microelectromechanical systems (MEMS) microphones associated with a tunable back cavity are described. Provided implementations can comprise a MEMS acoustic sensor element associated with a first back cavity, which first back cavity can be separated and/or acoustically coupled by a tuning port to a second back cavity. In addition, various physical and acoustic filtering configurations of MEMS microphones and tunable back cavities are described. | 10-08-2015 |
| 20150284239 | MEMS DEVICE WITH A STRESS-ISOLATION STRUCTURE - A method and system for a MEMS device is disclosed. The MEMS device includes a free layer, with a first portion and a second portion. The MEMS device also includes a underlying substrate, the free layer movably positioned relative to the underlying substrate. The first portion and second portion of the free layer are coupled through at least one stem. A sense material is disposed over portions of the second portion of the free layer. Stress in the sense material and second portion of the free layer does not cause substantial deflection of the first portion. | 10-08-2015 |
| 20150266723 | DIFFERENTIAL SENSING ACOUSTIC SENSOR - A MEMS device includes a first plate coupled to a second plate and a fixed third plate formed on a first substrate. The first and second plates are displaced in the presence of an acoustic pressure differential across the surfaces of the first plate. The MEMS device also includes a first electrode formed on the third plate and a second electrode formed on the second substrate. The first, second plate, and third plates are contained in an enclosure formed by a first and second substrates. The device includes an acoustic port to expose the first plate to the environment. The MEMS device also includes a first gap formed between the second and third plates and a second gap formed between the second plate and the second electrode. The displacement of the second plate causes the first gap to change inversely to the second gap. | 09-24-2015 |
| 20150264263 | IMAGE STABILIZATION USING LIGHT SENSORS - A method and system for image stabilization is disclosed. The image stabilization system includes a first pair of light sensors placed along an axis relative to a first axis, each light sensor is configured to provide a signal indicative of intensity of light received by the light sensor. The image stabilization system further includes a first directional light filter configured to selectively permit passage of incident light to the first pair of light sensors based on an angle of the incident light with reference to the first axis. An image stabilization circuit is configured to receive a pair of signals from the first pair of light sensors and generates a first signal indicative of a change in the angle of incidence of the incident light with reference to the first axis. | 09-17-2015 |
| 20150217991 | MEMS DEVICE WITH SPLIT PAD PACKAGE - A device and a microphone are disclosed. The device comprises a circuit board and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other. The microphone comprises a circuit board, a seal structure on the circuit board, and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other. | 08-06-2015 |
| 20150214912 | ACOUSTIC SENSOR RESONANT PEAK REDUCTION - A MEMS acoustic sensor includes a transducer with a frequency response with a gain peak, and a peak reduction circuit with a frequency response and coupled to the transducer. The frequency response of the peak reduction circuit causes attenuation of the gain peak. | 07-30-2015 |
| 20150195665 | BACK CAVITY LEAKAGE TEST FOR ACOUSTIC SENSOR - An acoustic sensor system has an acoustic sensor with a cavity, a cavity leakage, and a cavity pressure. The acoustic sensor system further has a test controller coupled to the acoustic sensor that causes a change in the cavity pressure. A response of the acoustic sensor to the change in the cavity pressure is used to measure the cavity leakage. | 07-09-2015 |
| 20150179050 | WEARABLE DEVICE ASSISTING SMART MEDIA APPLICATION AND VICE VERSA - A system includes a wearable device connected to a user and a smart media in remote communication with the wearable device. The wearable device is operable to track movement of the user and transmit the track movement information to the smart media. The smart media is operable to receive the track movement information and to use the received track movement information in an independent application. | 06-25-2015 |
| 20150149085 | METHOD AND SYSTEM FOR AUTOMATICALLY GENERATING LOCATION SIGNATURES FOR POSITIONING USING INERTIAL SENSORS - A device, method and computer readable medium is disclosed for generating a plurality of location signature is disclosed. The method includes seeding a device with an initial position and utilizing an inertial positioning system to propagate user position, and generating location signatures. | 05-28-2015 |
| 20150146887 | MICROPHONE ON PRINTED CIRCUIT BOARD (PCB) - A MEMS device includes a MEM-CMOS module having a CMOS chip and a MEMS chip. The MEMS chip includes a port exposed to the environment. The MEMS device further includes a printed circuit board (PCB) with an aperture, wherein the MEMS-CMOS module is directly mounted on the PCB. | 05-28-2015 |
| 20150145653 | DEVICE CONTROL USING A WEARABLE DEVICE - A system and method are directed to controlling multiple devices using a common control unit for an established context. More particularly, the system and method are directed to controlling multiple devices using a common control unit such as a wearable device which controls activities for an established context. The control unit may control multiple devices where for a particular situation or context, a controlling activity, such as gesturing, enables the control unit to control and communicatively connect with the devices. | 05-28-2015 |
| 20150127298 | ACTIVITY DETECTION AND ANALYTICS - A method and system for activity detection and analytics are disclosed. The method comprises determining a context and providing the determined context and one or more outputs from at least one sensor to an analytics engine to provide analytics results. The system includes at least one sensor and a processing system coupled to the at least one sensor, wherein the processing system includes an analytics engine that is configured to receive a determined context and one or more outputs from at least one sensor to provide analytics results. | 05-07-2015 |
| 20150125004 | MULTI-FUNCTION PINS FOR A PROGRAMMABLE ACOUSTIC SENSOR - A programmable acoustic sensor is disclosed. The programmable acoustic sensor includes a MEMS transducer and a programmable circuitry coupled to the MEMS transducer. The programmable circuitry includes a power pin and a ground pin. The programmable acoustic sensor also includes a communication channel enabling data exchange between the programmable circuitry and a host system. One of the power pin and the ground pin can be utilized for data exchange. | 05-07-2015 |
| 20150102390 | INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF PRODUCING THE SAME - A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity. | 04-16-2015 |
| 20150076631 | REDUCTION OF CHIPPING DAMAGE TO MEMS STRUCTURE - A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with different etch characteristics, or by etching after DRIE. | 03-19-2015 |
| 20150041929 | Packaged Microphone with Multiple Mounting Orientations - A packaged microphone has a base and a lid that at least in part form a package having a plurality of exterior sides and an interior chamber. The packaged microphone also has a flexible substrate having a first portion within the interior chamber, and a second portion, extending from the interior chamber, having at least two sets of pads. A MEMS microphone die is mounted to the first portion of the flexible substrate, and each set of pads is in electrical communication with the microphone die. One set of pads is on a first exterior side of the package, and a second set of pads is on a second exterior side of the package. | 02-12-2015 |
| 20150021718 | APPARATUS AND METHOD FOR REDUCED STRAIN ON MEMS DEVICES - A method and apparatus for coupling a MEMS device to a substrate is disclosed. The method includes providing a substrate with a conductor disposed over the substrate, adhering the MEMS device to the substrate, wherein a first elastomer adheres the MEMS device to the substrate. The MEMS device is electrically connected to the conductor using a wire bond. | 01-22-2015 |
| 20140361388 | CAPACITIVE SENSING STRUCTURE WITH EMBEDDED ACOUSTIC CHANNELS - A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane. | 12-11-2014 |
| 20140307909 | Microphone System with a Stop Member - A microphone system has a package with an interior chamber and an inlet aperture for receiving an acoustic signal, and a microphone die having a backplate and a diaphragm. The microphone is positioned within the package interior to form a front volume between the diaphragm and the inlet aperture. Accordingly, the microphone is positioned to form a back volume defined in part by the diaphragm within the interior chamber. The system also has a stop member positioned in the back volume so that the diaphragm is between the stop member and the backplate. | 10-16-2014 |
| 20140281341 | MULTIPLE, PER SENSOR CONFIGURABLE FIFOS IN A SINGLE STATIC RANDOM ACCESS MEMORY (SRAM) STRUCTURE - A device includes one or more sensors, one or more processors, one or more sensors, and a memory. The memory has a first portion, a second portion, and a third portion. The first portion is allocated to storing instructions for execution by the one or more processors. The second portion is allocated to storing data generated by the one or more processor, and the third portion is allocated to storing data from the one or more sensors. The third portion being a first-in-first-out (FIFO) having one or more FIFO portions, The device further includes a control logic operable to allocate the first, second and third portions of the memory, wherein each of one or more FIFO portions is allocated to each of the one or more sensors. The size each of the FIFO portions depends on the bandwidth of the sensors and the number of sensors. | 09-18-2014 |
| 20140278217 | METHOD TO REDUCE DATA RATES AND POWER CONSUMPTION USING DEVICE BASED ATTITUDE QUATERNION GENERATION - A method includes generating motion data by receiving a gyroscope data from a gyroscope sensor, performing integration using the gyroscope data and generating an integrated gyroscope data using a first processor. The method further includes receiving a data from one or more sensors, other than the gyroscope sensor, and performing sensor fusion using the integrated gyroscope data and the data to generate motion data using a second processor. | 09-18-2014 |
| 20140278215 | METHOD TO REDUCE DATA RATES AND POWER CONSUMPTION USING DEVICE BASED ATTITUDE GENERATION - A method includes generating motion data by receiving a gyroscope data from a gyroscope sensor, performing integration using the gyroscope data and generating an integrated gyroscope data using a first processor. The method further includes receiving a data from one or more sensors, other than the gyroscope sensor, and performing sensor fusion using the integrated gyroscope data and the data to generate motion data using a second processor. | 09-18-2014 |
| 20140278205 | EMBEDDED PROCESSOR ON AN INTEGRATED MEMS SENSOR CHIP AUTONOMOUSLY MANAGING EXTERNAL SENSOR - A device and method for managing external sensors are disclosed. The device comprises at least one embedded processor and a memory device and at least one bus controller that can be used by the embedded processors to communicate with external sensors. The embedded processor includes a mechanism to receive a control input to retrieve raw data from at least one sensor external to the device. The embedded processors may include another mechanism to receive a control input interrupting the embedded processors at regular intervals of time to retrieve raw data from at least one sensor external to the device. | 09-18-2014 |
| 20140278183 | HEADING CONFIDENCE INTERVAL ESTIMATION - An inertial measurement system is disclosed. The inertial measurement system has an accelerometer processing unit that generates a calibrated accelerometer data. The inertial measurement system further includes a magnetometer processing unit generates a calibrated magnetometer data, and a gyroscope processing unit generates a calibrated gyroscope data. Using the calibrated accelerometer data, the calibrated magnetometer data, and the calibrated gyroscope data, the inertial measurement system generates a heading angle error indicative of the accuracy of the heading angle error. | 09-18-2014 |
| 20140266256 | LINEAR CAPACITIVE DISPLACEMENT SENSOR - A method and system for measuring displacement of a structure is disclosed. The method and system comprise providing a first capacitance and providing a second capacitance. The first and second capacitances share a common terminal. The method and system further include determining a difference of the inverses of the value of the first and second capacitances when the structure is displaced. The first capacitance varies in inverse relation to the displacement of the structure. | 09-18-2014 |
| 20140266170 | MAGNETOMETER USING MAGNETIC MATERIALS ON ACCELEROMETER - A MEMS device including a first proof mass, a first magnetized magnetic material disposed partially on a surface of the first proof mass, a first spring anchored to a substrate to support the first proof mass, and a first sensing element coupled to the first proof mass and operable to sense the motion of the first proof mass caused by an ambient acceleration. The MEMS device further includes a second sensing element coupled to the first proof mass and operable to sense the motion of the first proof mass caused by an ambient magnetic field | 09-18-2014 |
| 20140264656 | MEMS ACOUSTIC SENSOR WITH INTEGRATED BACK CAVITY - A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment. | 09-18-2014 |
| 20140264655 | SURFACE ROUGHENING TO REDUCE ADHESION IN AN INTEGRATED MEMS DEVICE - In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface can be provided by etching the smooth surfaces in gas, plasma, or liquid with locally non-uniform etch rate. Various etch chemistries and conditions lead to various surface roughness. | 09-18-2014 |
| 20140264652 | ACOUSTIC SENSOR WITH INTEGRATED PROGRAMMABLE ELECTRONIC INTERFACE - An integrated MEMS acoustic sensor has a MEMS transducer and a programmable electronic interface. The programmable electronic interface includes non-volatile memory and is coupled to the MEMS transducer. Using programmable electrical functions, the programmable electronic interface is operable to sense variations in the MEMS transducer caused by application of an acoustic pressure to the MEMS transducer. | 09-18-2014 |
| 20140264650 | Low Frequency Response Microphone Diaphragm Structures And Methods For Producing The Same - A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic signal. In some embodiments, the sealing layer may include an equalization aperture to allow pressure to equalize on both sides of the diaphragm. | 09-18-2014 |
| 20140264645 | INTEGRATED STRUCTURE WITH BIDIRECTIONAL VERTICAL ACTUATION - A Micro-Electro-Mechanical Systems (MEMS) device includes a first substrate with a first surface and a second surface, the first substrate including a base layer, a moveable beam disposed on the base layer, at least one metal layer, and one or more standoffs disposed on the base layer such that one or more metal layers are situated on the top surface of the one or more standoffs. The MEMS device further includes a second substrate including one or more metal layers bonded to the one or more standoffs resulting in an electrical connection between at least a portion of the one or more metal layers of the second substrate and one or more of the at least one electrode on the bottom surface and the at least one electrode on the top surface. | 09-18-2014 |
| 20140260713 | DUTY-CYCLED GYROSCOPE - A gyroscope system comprises a MEMS gyroscope coupled to a drive system and a sense system. The drive system maintains the MEMS gyroscope in a state of oscillation and the sense system for receiving, amplifying, and demodulating an output signal of the MEMS gyroscope that is indicative of the rate of rotation. The gyroscope system further includes a phase-locked look (PLL) which receives a reference clock (REFCLK) from the drive system and produces a system clock (CLK). Finally, the gyroscope system includes a controller operating on the system clock sets an operating state of the drive system and the sense system and also controls a state of the PLL. One or more system state variables are maintained in a substantially fixed state during a protect mode thereby enabling rapid transitions between a low-power mode and a normal operating mode of the gyroscope system. | 09-18-2014 |
| 20140260704 | DEVICE AND SYSTEM FOR INTEGRATED SENSOR SYSTEM (ISS) - The present invention is directed toward a device and system having a sensor hub capable of receiving measurement outputs from a plurality of sensors and processing the measurements for output to other devices, from a single chip arrangement. The sensor hub provides for facilitating efficient communication among the sensors for improved high-level features, such as interpreting gestures or actions according to the context. | 09-18-2014 |
| 20140260647 | PRESSURE SENSOR STABILIZATION - A pressure sensor is provided which produces a measurement of the displacement and a measurement of a natural frequency of the diaphragm which are then combined to produce a compensated measurement of the displacement of the diaphragm, thereby substantially eliminating the dependence of the compensated displacement measurement on strain. | 09-18-2014 |
| 20140260619 | ROUND-ROBIN SENSING DEVICE AND METHOD OF USE - A round-robin sensing device is disclosed. The round-robin sensing device comprises a MEMS device, wherein the MEMS device includes first and second sense electrodes. The round-robin sensing device also comprises a multiplexer coupled to the first and second sense electrodes, at least one sense amplifier coupled to the multiplexer, a demodulator coupled to the at least one sense amplifier, and an integrate and dump circuit coupled to the demodulator. Finally, the round-robin sensing device comprises an analog-to-digital converter (ADC) coupled to the de-multiplexer, wherein the multiplexer, the at least one sense amplifier and the demodulator provide a continuous time sense path during amplification that is resettable and wherein the integrate and dump circuit and the ADC provide a discrete time processing path. | 09-18-2014 |
| 20140260613 | ELASTIC BUMP STOPS FOR MEMS DEVICES - A MEMS device includes at least one proof mass, the at least one proof mass is capable of moving to contact at least one target structure. The MEMS device further includes at least one elastic bump stop coupled to the proof mass and situated at a first distance from the target structure. The MEMS device additionally includes at least one secondary bump stop situated at a second distance from the target structure, wherein the second distance is greater than the first distance, and further wherein the at least one elastic bump stop moves to reduce the first distance when a shock is applied. | 09-18-2014 |
| 20140254837 | INTEGRATED AUDIO AMPLIFICATION CIRCUIT WITH MULTI-FUNCTIONAL EXTERNAL TERMINALS - An audio amplification circuit may include an input terminal for receipt of an input signal from a transducer. A signal processor may be coupled to the input terminal for receipt and processing of the input signal to generate a processed digital audio signal in accordance with a programmable configuration setting of the signal processor. A serial data transmission interface is configured for receipt of the processed digital audio signal and supply of a corresponding digital audio stream at an output terminal of the integrated audio amplification circuit. A serial data receipt interface may be coupled to an externally accessible configuration terminal of the integrated audio amplification circuit and a controller is configured to adjust one of the programmable configuration setting of the signal processor and a format of a digital audio stream in accordance with first configuration data received through the serial data receipt interface. | 09-11-2014 |
| 20140254823 | Distributed Automatic Level Control for a Microphone Array - A distributed automatic level control function is provided, in which information relating to a common automatic level control parameter is transmitted to each of a plurality of microphone devices, wherein the information transmitted to at least one microphone device is derived from an audio sample of at least one different microphone device. Each microphone device produces the common automatic level control parameter based on the information received by the microphone device and applies the common automatic level control parameter produced by the microphone device to a distributed automatic level controller of the microphone device. | 09-11-2014 |
| 20140239353 | METHOD FOR MEMS STRUCTURE WITH DUAL-LEVEL STRUCTURAL LAYER AND ACOUSTIC PORT - A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer. | 08-28-2014 |
| 20140233782 | Packaged Microphone with Frame Having Die Mounting Concavity - A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume. | 08-21-2014 |
| 20140213007 | INTERNAL ELECTRICAL CONTACT FOR ENCLOSED MEMS DEVICES - A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate. | 07-31-2014 |
| 20140211957 | Noise Mitigating Microphone System - A microphone system has a package with a top, a bottom, and four sides that at least in part form an interior chamber. One of the sides forms an inlet aperture for communicating the inlet chamber with the exterior environment. The system also has first and second microphone dies, in a stacked relationship, respectively having a first and second diaphragms. A circuit die, positioned in electrical communication with the first and second microphone dies, is configured to mitigate vibrational noise from the first microphone die using a signal produced by the second microphone die or vice versa. The first and second microphone dies are positioned so that the first and second diaphragms are substantially the same distance from the inlet aperture in the side. | 07-31-2014 |
| 20140210019 | LOW-COST PACKAGE FOR INTEGRATED MEMS SENSORS - An integrated MEMS sensor package is disclosed. The package comprises a sensor chip with a top surface and a bottom surface. The top surface comprises an opening. The bottom surface is attached to a substrate with electrical inter-connects. A lid is coupled to the top surface with an adhesive material. The lid may have an opening to expose the sensor chip to ambient environment. | 07-31-2014 |
| 20140205127 | Microphone System with Non-Orthogonally Mounted Microphone Die - A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side. | 07-24-2014 |
| 20140184213 | IN-PLANE SENSING LORENTZ FORCE MAGNETOMETER - A magnetic field sensor includes a driving element through which an electric current circumnavigates the driving element. A Lorentz force acts on the driving element resulting in a torque about a first axis in response to a magnetic field along a second axis substantially parallel to a plane of a substrate. The driving element is coiled-shaped. A sensing element of the magnetic field sensor is configured to rotate about the first axis substantially parallel to the plane of the substrate in response to the magnetic field and a coupling element mechanically couples the driving element to the sensing element. The driving element, the sensing element, and the coupling element are disposed in the plane, substantially parallel to the substrate. At least two anchors are configured to connect the driving element, the sensing element, and the coupling element to the substrate. | 07-03-2014 |
| 20140169607 | Integrated Microphone Package - An apparatus has a packaged microphone with a base and a lid that at least in part form an interior chamber containing a microphone die. The base has a bottom surface with an electrical interface and a base aperture. The apparatus also has a device housing having an internal surface, and a filter extending between the internal surface of the device housing, through an underlying substrate, and the bottom surface of the base. | 06-19-2014 |
| 20140167789 | MODE-TUNING SENSE INTERFACE - A MEMS capacitive sensing interface includes a sense capacitor having a first terminal and a second terminal, and having associated therewith a first electrostatic force. Further included in the MEMS capacitive sensing interface is a feedback capacitor having a third terminal and a fourth terminal, the feedback capacitor having associated therewith a second electrostatic force. The second and the fourth terminals are coupled to a common mass, and a net electrostatic force includes the first and second electrostatic forces acting on the common mass. Further, a capacitance measurement circuit measures the sense capacitance and couples the first terminal and the third terminal. The capacitance measurement circuit, the sense capacitor, and the feedback capacitor define a feedback loop that substantially eliminates dependence of the net electrostatic force on a position of the common mass. | 06-19-2014 |
| 20140151869 | INTEGRATED HEATER ON MEMS CAP FOR WAFER SCALE PACKAGED MEMS SENSORS - A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. | 06-05-2014 |
| 20140145244 | MEMS DEVICE AND PROCESS FOR RF AND LOW RESISTANCE APPLICATIONS - MEMS device for low resistance applications are disclosed. In a first aspect, the MEMS device comprises a MEMS wafer including a handle wafer with one or more cavities containing a first surface and a second surface and an insulating layer deposited on the second surface of the handle wafer. The MEMS device also includes a device layer having a third and fourth surface, the third surface bonded to the insulating layer of the second surface of handle wafer; and a metal conductive layer on the fourth surface. The MEMS device also includes CMOS wafer bonded to the MEMS wafer. The CMOS wafer includes at least one metal electrode, such that an electrical connection is formed between the at least one metal electrode and at least a portion of the metal conductive layer. | 05-29-2014 |
| 20140133685 | Microphone System with Mechanically-Coupled Diaphragms - A microphone system has two diaphragms and are mechanically interconnected such that they respond in antiphase to an acoustic signal impinging on one of the diaphragms. The two diaphragms produce two variable capacitances that vary proportionately but inversely to one another. Voltage signals produced by the two variable capacitances are summed to provide an output signal proportional to the acoustic signal, but with greater sensitivity than a single-diaphragm microphone. | 05-15-2014 |
| 20140131820 | METHOD OF FABRICATION OF AI/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM - A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer. | 05-15-2014 |
| 20140118073 | CANCELLATION OF DYNAMIC OFFSET IN MOS RESISTORS - A circuit utilizes a MOS device in a triode mode of operation and includes a biasing circuit and a MOS device. The MOS device has a drain, a source, and a gate terminal, and is coupled to the biasing circuit. The source terminal, drain terminal, and gate terminal each has a potential and the drain and the source terminals have a resistance. The biasing circuit couples the drain and source terminals of the MOS device to the gate terminal of the MOS device. The biasing circuit couples a DC potential to the gate terminal to adjust the resistance between the source and drain terminals of the MOS device. The resistance between the source and drain terminals is a non-linear function of voltage potentials at the source and drain terminals. The biasing circuit reduces the non-linearity of the resistance between the drain and source terminals by modulating the potential at the gate terminal by a combination of source and drain terminal potentials. | 05-01-2014 |
| 20140117966 | CURVATURE-CORRECTED BANDGAP REFERENCE - A curvature-corrected bandgap reference is disclosed. The curvature-corrected bandgap reference comprises a Brokaw bandgap circuit. The Brokaw bandgap circuit includes an output node providing a reference voltage. The Brokaw bandgap circuit further comprising a first BJT device including a first base terminal coupled to the output node and a first emitter terminal. The first BJT device operates at a first current density that is substantially proportional to absolute temperature. The curvature-corrected bandgap reference also includes a second BJT device including a second base terminal coupled to the output node and a second emitter terminal. The second BJT device operates at a second current density that is substantially independent of temperature. Finally the curvature-corrected bandgap reference includes a correction voltage proportional to a voltage difference of the first and second emitter terminals, wherein the correction voltage substantially cancels a curvature of the reference voltage. | 05-01-2014 |
| 20140093102 | SWITCHABLE ATTENUATION CIRCUIT FOR MEMS MICROPHONE SY - A switch control circuit monitors a signal produced by a MEMS or other capacitor microphone. When a criterion is met, for example when the amplitude of the monitored signal exceeds a threshold or the monitored signal has been clipped or analysis of the monitored signal indicates clipping is imminent or likely, the switch control circuit operates one or more switches so as to selectively connect one or more capacitors to a signal line from the microphone, i.e., so as to connect a selected capacitance to the signal line to attenuate the signal from the microphone and, therefore, avoid clipping. The switches may be MOSFET, MEMS or other types of switches co-located with the microphone in a common semiconductor package. Similarly, the capacitors, a circuit that processes the signals from the microphone and/or the switch control circuit may be co-located with the microphone in a common semiconductor package. | 04-03-2014 |
| 20140091406 | MEMS Microphone System for Harsh Environments - A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving audio signals into the chamber. A MEMS microphone is attached within the chamber about the aperture. A filter covers the aperture opening in the opposing face of the base to prevent contaminants from entering the acoustic chamber. A second metal lid encloses the opposing face of the base and may attach the filter to this face of the base. The lids are electrically connected with vias forming a radio frequency interference shield. The ceramic base material is thermally matched to the silicon microphone material to allow operation over an extended temperature range. | 04-03-2014 |
| 20140085120 | CHOPPER-STABILIZATION METHOD AND APPARATUS FOR SIGMA DELTA MODULATORS - An embodiment of the invention includes an analog to digital converter including a sigma delta modulator that generates a feedback signal. The sigma delta modulator includes a quantizer responsive to an input signal and the feedback signal and generates a quantizer output. The sigma delta modulator further includes a chopper-stabilized amplifier that provides a reference signal to the sigma delta modulator, and the chopper-stabilized amplifier is stabilized according to a combination of a chopping signal and the quantizer output. | 03-27-2014 |
| 20140085017 | MEMS DEVICE OSCILLATOR LOOP WITH AMPLITUDE CONTROL - A MEMS device and method for amplitude regulation of a MEMS device are disclosed. In a first aspect, the MEMS device comprises a MEMS resonator, a limiter coupled to the MEMS resonator, and a regulator coupled to the limiter. The MEMS device includes an amplitude control circuit coupled to the MEMS resonator. The amplitude control circuit controls a supply of the limiter via the regulator to regulate oscillation loop amplitude of the MEMS device. In a second aspect, the method includes coupling a regulator to the limiter, coupling an amplitude control circuit to the MEMS resonator, and controlling a supply of the limiter via the regulator to regulate oscillation loop amplitude of the MEMS device. | 03-27-2014 |
| 20140074420 | METHOD AND SYSTEM FOR ESTIMATING OFFSET IN ENVIRONMENTS WITH LIMITED MEMORY SPACE - A computer implemented method, system and computer program product for estimating an offset of at least one sensor is disclosed. The computer implemented method, system and computer program product comprise calculating combinations of running sums to define for computing /or one or more slopes for the sensor. At least one of the one or more slopes provides an indication of the sensor offset changes with temperature. | 03-13-2014 |
| 20140072152 | Dual Single-Crystal Backplate Microphone System and Method Of Fabricating Same - A dual backplate MEMS microphone system includes a flexible diaphragm sandwiched between two single-crystal silicon backplates. Such a MEMS microphone system may be formed by fabricating each backplate in a separate wafer, and then transferring one backplate from its wafer to the other wafer, to form two separate capacitors with the diaphragm. | 03-13-2014 |
| 20140047921 | EXTENSION-MODE ANGULAR VELOCITY SENSOR - An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode. | 02-20-2014 |
| 20140046586 | DEDUCED RECKONING NAVIGATION WITHOUT A CONSTRAINT RELATIONSHIP BETWEEN ORIENTATION OF A SENSOR PLATFORM AND A DIRECTION OF TRAVEL OF AN OBJECT - Systems, methods, and apparatus for performing deduced reckoning navigation without a constraint relationship between orientation of a sensor platform and a direction of travel of an object are described herein. A sensor fusion component can be configured to receive data from sensors of a sensor platform coupled to a pedestrian; and generate world coordinate information based on the data. Further, a gait recognition component can be configured to record one or more walking patterns of the pedestrian in a training database; and determine whether the world coordinate information is associated with a walking pattern of the one or more walking patterns. Furthermore, a position estimation component can be configured to estimate a position of the pedestrian based on the world coordinate information if the world coordinate information is associated with the walking pattern, regardless of an orientation of the sensor platform with respect to the position of the pedestrian. | 02-13-2014 |
| 20140026662 | MICROMACHINED GYROSCOPE INCLUDING A GUIDED MASS SYSTEM - A gyroscope comprises a substrate and a guided mass system. The guided mass system comprises proof masses and guiding arms disposed in a plane parallel to the substrate. The proof masses are coupled to the guiding arm by springs. The guiding arm is coupled to the substrate by springs. At least one of the proof-masses is directly coupled to the substrate by at least one anchor via a spring system. The gyroscope also comprises an actuator for vibrating one of the proof-masses in the first direction, which causes another proof mass to rotate in the plane. Finally, the gyroscope also includes transducers for sensing motion of the guided mass system in response to angular velocities about a single axis or multiple input axes. | 01-30-2014 |
| 20130246848 | METHOD AND SYSTEM PROVIDNG A SELF-TEST ON ONE OR MORE SENSORS COUPLED TO A DEVICE - A method and system for providing a self-test configuration in a device is disclosed. The method and system comprise providing a self-test mechanism in a kernel space of a memory and enabling a hook in a user space of the memory, wherein the hook is in communication with the self-test mechanism. The method and system also include running the self-test driver and utilizing the results. | 09-19-2013 |
| 20130233048 | GYROSCOPE SELF TEST BY APPLYING ROTATION ON CORIOLIS SENSE MASS - A self-test method by rotating the proof mass at a high frequency enables testing the functionality of both the drive and sense systems at the same time. In this method, the proof mass is rotated at a drive frequency. An input force which is substantially two times the drive frequency is applied to the actuation structures to rotate the proof mass of the gyroscope around the sensitive axis orthogonal to the drive axis. An output response of the gyroscope at the drive frequency is detected by a circuitry and a self-test response is obtained. | 09-12-2013 |
| 20130197845 | N-USE AUTOMATIC CALIBRATION METHODOLOGY FOR SENSORS IN MOBILE DEVICES - A method, system and computer readable medium for calibrating an accelerometer in a portable device is disclosed. The method, system and computer readable medium comprises receiving data from the accelerometer, and providing accelerometer samples from the data based upon one or more selection rules that adaptively selects data that satisfy certain criteria. The method system and computer readable medium also includes fitting the accelerometer samples to a mathematical mode. The method system and computer readable medium further includes providing a bias of the accelerometer based upon a center of the mathematical model. | 08-01-2013 |
| 20130179110 | ACTIVITY CLASSIFICATION IN A MULTI-AXIS ACTIVITY MONITOR DEVICE - An activity classification device is disclosed. The activity classification device comprises one or more motion sensors and a memory configured to receive signals from the one or more motion sensors. The device further includes a processor in communication with the memory. Finally, the device includes a classification algorithm executed by the processor, the classification algorithm for identifying activities that a user is engaged in. The memory may also record a user's activity log, calorie count and an RF module, which transmits the recorded data to a host either upon request or continuously. | 07-11-2013 |
| 20130099955 | SIGNAL QUANTIZATION METHOD AND APPARATUS AND SENSOR BASED THEREON - A signal quantizer includes a summing junction, a loop filter, a quantizer and a reconstruction filter. The summing junction is responsive to an input signal and to a modulated signal and is operative to combine the modulated signal and the input signal to generate a summing junction output. The loop filter is responsive to the summing junction output and is operative to generate a loop filter output and has a first regenerative gain associated therewith. The quantizer is responsive to the loop filter output and is operative to generate the modulated signal. The reconstruction filter is responsive to the modulated signal and is operative to generate a quantized output signal and has a second regenerative gain associated therewith that is substantially equal to that of the loop filter. | 04-25-2013 |
| 20130099836 | GYROSCOPE WITH PHASE AND DUTY-CYCLE LOCKED LOOP - A system and method in accordance with the present invention provides a gyroscope incorporating an improved PLL technique. The improved PLL auto-corrects its own reference low-frequency noise, thereby eliminating this source of noise, improving the noise performance of the gyroscope and allowing a compact implementation. The net result is a gyroscope with improved bias stability that can meet noise requirements with a smaller footprint. | 04-25-2013 |
| 20130069866 | SELECTABLE COMMUNICATION INTERFACE CONFIGURATIONS FOR MOTION SENSING DEVICE - Selectable communication interface configurations for motion sensing devices. In one aspect, a module for a motion sensing device includes a motion processor connected to a device component and a first motion sensor, and a multiplexer having first and second positions. Only one of the multiplexer positions is selectable at a time, where the first position selectively couples the first motion sensor and the device component using a first bus, and the second position selectively couples the first motion sensor and the motion processor using a second bus, wherein communication of information over the second bus does not influence a communication bandwidth of the first bus. | 03-21-2013 |
| 20130068018 | MICROMACHINED GYROSCOPE INCLUDING A GUIDED MASS SYSTEM - A gyroscope is disclosed. The gyroscope comprises a substrate; and a guided mass system. The guided mass system comprises proof-mass and guiding arm. The proof-mass and the guiding arm are disposed in a plane parallel to the substrate. The proof-mass is coupled to the guiding arm. The guiding arm is also coupled to the substrate through a spring. The guiding arm allows motion of the proof-mass to a first direction in the plane. The guiding arm and the proof-mass rotate about a first sense axis. The first sense axis is in the plane and parallel to the first direction. The gyroscope includes an actuator for vibrating the proof-mass in the first direction. The gyroscope also includes a transducer for sensing motion of the proof-mass-normal to the plane in response to angular velocity about a first input axis that is in the plane and orthogonal to the first direction. | 03-21-2013 |
| 20130046489 | MAGNETOMETER BIAS AND ANOMALY DETECTOR - The computer implemented method, system or computer program product comprises collecting magnetometer data from the device; and calculating a center of a shape of the magnetometer data as a result of minimization. The minimization of calculating the center of the shape further comprises calculating a plurality of running sums of the magnetometer data; storing the plurality of running sums; storing a count of the number of terms in each of the running sums; and calculating the center of the shape and setting the estimated magnetometer bias to the center of the shape. The radius of the sphere is calculated to ensure accuracy in the estimator of the magnetometer bias. | 02-21-2013 |
| 20130001765 | INTEGRATED HEATER ON MEMS CAP FOR WAFER SCALE PACKAGED MEMS SENSORS - A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. | 01-03-2013 |
| 20130001710 | PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT - A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS substrate with a dielectric layer disposed between the handle and device wafers. The method includes lithographically defining at least one standoff on the device wafer and bonding the at least one standoff to an integrated circuit substrate to form a sealed cavity between the MEMS substrate and the integrated circuit substrate. The method includes defining at least one opening in the handle wafer, standoff, or integrated circuit substrate to expose a portion of the to expose a portion of the device wafer to the outside environment. | 01-03-2013 |
| 20130001550 | HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS - A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the integrated circuit substrate. The integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode. The MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff. A force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode. | 01-03-2013 |
| 20120326248 | METHODS FOR CMOS-MEMS INTEGRATED DEVICES WITH MULTIPLE SEALED CAVITIES MAINTAINED AT VARIOUS PRESSURES - A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure. | 12-27-2012 |
| 20120323520 | MOTION DETERMINATION - Described herein are systems and methods that can employ a motion detection algorithm to determine whether a sensor has experienced a motion event or a no motion event. The sensor can be any sensor that can be used to identify and/or characterize motion. Upon receiving a signal from the sensor, moments of the signal can be calculated. Then, the moments can be compared to determine whether the signal is Gaussian. If the signal is a Gaussian signal, the algorithm determines that the signal is due to a no motion event. If the signal is a non-Gaussian signal, the algorithm determines that the signal is due to a motion event. | 12-20-2012 |
| 20120313189 | METHOD OF PREVENTING STICTION OF MEMS DEVICES - A method and apparatus are disclosed for reducing stiction in MEMS devices. The method comprises patterning a CMOS wafer to expose Titanium-Nitride (TiN) surface for a MEMS stop and patterning the TiN to form a plurality of stop pads on the top metal aluminum surface of the CMOS wafer. The method is applied for a moveable MEMS structure bonded to a CMOS wafer. The TiN surface and/or plurality of stop pads minimize stiction between the MEMS structure and the CMOS wafer. Further, the TiN film on top of aluminum electrode suppresses the formation of aluminum hillocks which effects the MEMS structure movement. | 12-13-2012 |
| 20120291549 | EXTENSION-MODE ANGULAR VELOCITY SENSOR - An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode. | 11-22-2012 |
| 20120253738 | INTEGRATED MOTION PROCESSING UNIT (MPU) WITH MEMS INERTIAL SENSING AND EMBEDDED DIGITAL ELECTRONICS - A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate. | 10-04-2012 |
| 20120242400 | HIGH-VOLTAGE MEMS APPARATUS AND METHOD - A high-voltage MEMS system compatible with low-voltage semiconductor process technology is disclosed. The system comprises a MEMS device coupled to a high-voltage bias generator employing an extended-voltage isolation residing in a semiconductor technology substrate. The system avoids the use of high-voltage transistors so that special high-voltage processing steps are not required of the semiconductor technology, thereby reducing process cost and complexity. MEMS testing capability is addressed with a self-test circuit allowing modulation of the bias voltage and current so that a need for external high-voltage connections and associated electro-static discharge protection circuitry are also avoided. | 09-27-2012 |
| 20120235670 | DRIVE SYSTEM FOR MICROMACHINED MAGNETIC FIELD SENSORS - Described herein are systems, devices, and methods that provide a stable magnetometer. The magnetometer includes a drive element that facilitates flow of a drive current through a node and a sense element operable to detect a magnetic field operating on the drive current. To reduce offset in the detection of the magnetic field, a voltage detector, electrically coupled to the drive element through the node, determines a variation between a node voltage and a target voltage. The voltage detector facilitates suppression of the variation and thereby minimizes the offset in the sense element. | 09-20-2012 |
| 20120235297 | WAFER LEVEL PACKAGING OF MEMS DEVICES - A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features. | 09-20-2012 |
| 20120235251 | WAFER LEVEL PACKAGING OF MEMS DEVICES - A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features. | 09-20-2012 |
| 20120216612 | LOW INERTIA FRAME FOR DETECTING CORIOLIS ACCELERATION - A sensing frame is disclosed. The sensing frame includes a first rail and a second rail. The first and second rails are constrained to move along a first axis parallel to the first and second rails. The frame includes a base and at least two guiding arms for ensuring that the first rail and the second rail move in anti-phase fashion along the first axis. First and second guiding arms are flexibly coupled to the first rail and second rail. The first guiding arm is flexibly suspended to the base at first anchoring points for allowing rotation of the first guiding arm, and the second guiding arm is suspended to the base at a second anchoring point allowing rotation of the second guiding arm. The sensing frame includes a plurality of coupling flexures and a transducer for sensing motion of the first and second rails. | 08-30-2012 |
| 20120200497 | HIGH FIDELITY REMOTE CONTOLLER DEVICE FOR DIGITAL LIVING ROOM - Described herein is an intelligent remote controlling device. The device can include a six-axis motion sensor to accurately track three dimensional hand motions. For example, the sensors can include a three-axis accelerometer and a three-axis gyroscope. The remote control device can also include a processing unit integrated with the motion sensors in a single module. The processing unit can convert data regarding the hand motion to data regarding a cursor motion for a cursor that will be displayed on a screen of an electronic device. The processing unit can be integrated with the motion sensors in a single module. The processing unit can include at least two modes of functionality corresponding to different types of hand motion: a one to one mode where the cursor directly tracks the hand motion and a non-linear mode that filters data from the motion sensors to eliminate hand jitter. | 08-09-2012 |
| 20120200362 | METHOD AND SYSTEM FOR USING A MEMS STRUCTURE AS A TIMING SOURCE - A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit. | 08-09-2012 |
| 20120176129 | MICROMACHINED RESONANT MAGNETIC FIELD SENSORS - A micromachined magnetic field sensor is disclosed. The micromachined magnetic field sensor comprises a substrate; and a drive subsystem partially supported by the substrate with a plurality of beams, and at least one anchor; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field vector along a third axis. The micromachined magnetic field sensor also includes a position transducer to detect the motion of the drive subsystem and an electrostatic offset cancellation mechanism coupled to the drive subsystem. | 07-12-2012 |
| 20120176128 | MICROMACHINED RESONANT MAGNETIC FIELD SENSORS - A micromachined magnetic field sensor comprising is disclosed. The micromachined magnetic field comprises a substrate; a drive subsystem, the drive subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field along a third axis. The micromachined magnetic field sensor also includes a sense subsystem, the sense subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; wherein a portion of the sense subsystem moves along a fourth axis; a coupling spring between the drive subsystem and the sense subsystem which causes motion of the sense subsystem in response to the magnetic field; and a position transducer to detect the motion of the sense subsystem. | 07-12-2012 |
| 20120125104 | ANCHOR-TILT CANCELLING ACCELEROMETER - Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be cancelled from an output signal of the accelerometer so that the accelerometer exhibits sensitivity to only acceleration. | 05-24-2012 |
| 20120125101 | MEMS DEVICE WITH IMPROVED SPRING SYSTEM - A system and method in accordance with an embodiment reduces the cross-axis sensitivity of a gyroscope. This is achieved by building a gyroscope using a mechanical transducer that comprises a spring system that is less sensitive to fabrication imperfection and optimized to minimize the response to the rotations other than the intended input rotation axis. The longitudinal axes of the first and second flexible elements are parallel to each other and parallel to the first direction | 05-24-2012 |
| 20120094435 | METHOD OF FABRICATION OF AI/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM - A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer. | 04-19-2012 |
| 20120086446 | INTEGRATED MEMS DEVICE AND METHOD OF USE - An integrated MEMS device is disclosed. The system comprises a MEMS resonator; and a MEMS device coupled to a MEMS resonator. The MEMS resonator and MEMS device are fabricated on a common substrate so that certain characteristics of the MEM resonator and MEMS device track each other as operating conditions vary. | 04-12-2012 |
| 20120072166 | DEDUCED RECKONING NAVIGATION WITHOUT A CONSTRAINT RELATIONSHIP BETWEEN ORIENTATION OF A SENSOR PLATFORM AND A DIRECTION OF TRAVEL OF AN OBJECT - Systems, methods, and apparatus for performing deduced reckoning navigation without a constraint relationship between orientation of a sensor platform and a direction of travel of an object are described herein. A sensor fusion component can be configured to receive data from sensors of a sensor platform coupled to a pedestrian; and generate world coordinate information based on the data. Further, a gait recognition component can be configured to record one or more walking patterns of the pedestrian in a training database; and determine whether the world coordinate information is associated with a walking pattern of the one or more walking patterns. Furthermore, a position estimation component can be configured to estimate a position of the pedestrian based on the world coordinate information if the world coordinate information is associated with the walking pattern, regardless of an orientation of the sensor platform with respect to the position of the pedestrian. | 03-22-2012 |
| 20120007713 | HANDHELD COMPUTER SYSTEMS AND TECHNIQUES FOR CHARACTER AND COMMAND RECOGNITION RELATED TO HUMAN MOVEMENTS - Systems and methods for human hand gesture recognition through a training mode and a recognition mode are disclosed. In the training mode, a user can move a handheld device with a hand gesture intended to represent a command. Sensors within the handheld device can record raw data, which can be processed to obtain a set of values corresponding to a set of discrete features, which is stored in a database and associated with the intended command. The process is repeated for various hand gestures representing different commands. In the recognition mode, the user can move the handheld device with a hand gesture. A computer system can compare a set of values corresponding to a set of discrete features derived from the hand gesture with the sets of values stored in the database, select a command with the closest match and displays and/or executes the command. | 01-12-2012 |
| 20120007598 | MICROMACHINED MAGNETIC FIELD SENSORS - A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology. | 01-12-2012 |
| 20120007597 | MICROMACHINED OFFSET REDUCTION STRUCTURES FOR MAGNETIC FIELD SENSING - A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology. | 01-12-2012 |
| 20110316888 | MOBILE DEVICE USER INTERFACE COMBINING INPUT FROM MOTION SENSORS AND OTHER CONTROLS - Various embodiments provide user interfaces for mobile devices which combine input from motion sensors and other input controls. In one aspect, a handheld electronic device includes a display operative to display an image, an input control operative to sense a contact motion of the user with the device, a set of motion sensors sensing rotational rate of the device around at least three axes of the device and linear acceleration along at least three axes of the device, and a subsystem capable of facilitating interaction with the device based on combined sensor data. The combined sensor data includes motion data derived from at least one of the motion sensors and contact data derived from the contact motion sensed by the input control. | 12-29-2011 |
| 20110254760 | Wireless Motion Processing Sensor Systems Suitable for Mobile and Battery Operation - The present invention relates to a combination of a 6-axis motion sensor having a 3-axis gyroscope and a 3-axis linear accelerometer, a motion processor and a radio integrated circuit chip (IC), wherein the intelligence in the motion processor enables the communication between the motion sensor, the radio IC and the external network. The motion processor also enables power savings by adaptively controlling the data rate of the motion sensor, depending on the amount or speed of the motion activity. | 10-20-2011 |
| 20110215952 | SELECTABLE COMMUNICATION INTERFACE CONFIGURATIONS FOR MOTION SENSING DEVICE - Selectable communication interface configurations for motion sensing devices. In one aspect, a module for a motion sensing device includes a motion processor connected to a device component and a first motion sensor, and a multiplexer having first and second positions. Only one of the multiplexer positions is selectable at a time, where the first position selectively couples the first motion sensor and the device component using a first bus, and the second position selectively couples the first motion sensor and the motion processor using a second bus, wherein communication of information over the second bus does not influence a communication bandwidth of the first bus. | 09-08-2011 |
| 20110197677 | VERTICALLY INTEGRATED 3-AXIS MEMS ANGULAR ACCELEROMETER WITH INTEGRATED ELECTRONICS - Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes. | 08-18-2011 |
| 20110178707 | APPARATUS AND METHODOLOGY FOR CALIBRATION OF A GYROSCOPE AND A COMPASS INCLUDED IN A HANDHELD DEVICE - Novel techniques for estimating compass and gyroscope biases for handheld devices are disclosed. The handheld devices can include wireless phones, navigational devices and video gaming systems. The compass bias can be determined by causing a small movement of the handheld device and comparing the data obtained from the compass with the data obtained from the gyroscope. The gyroscope bias can be determined by obtaining a quaternion based angular velocity term of the handheld device when the accelerometer and compass data are reliable, and then comparing the angular velocity term to with the gyro data estimate the gyro bias. When the compass and/or the accelerometer data are unreliable, a previously determined quaternion angular velocity term is used, which was determined when the compass and the accelerometer were providing reliable data. The gyroscope bias can also be determined by measuring gyroscope biases at various temperatures in a non-factory setting, and storing that data in a memory, and using the data to estimate gyro biases when the accelerometer and/or the compass data are unreliable. | 07-21-2011 |
| 20110163955 | MOTION SENSING AND PROCESSING ON MOBILE DEVICES - Handheld electronic devices including motion sensing and processing. In one aspect, a handheld electronic device includes a set of motion sensors provided on a single sensor wafer, including at least one gyroscope sensing rotational rate of the device around at least three axes and at least one accelerometer sensing gravity and linear acceleration of the device along the at least three axes. Memory stores sensor data derived from the at least one gyroscope and accelerometer, where the sensor data describes movement of the device including a rotation of the device around at least one of the three axes of the device, the rotation causing interaction with the device. The memory is provided on an electronics wafer positioned vertically with respect to the sensor wafer and substantially parallel to the sensor wafer. The electronics wafer is vertically bonded to and electrically connected to the sensor wafer. | 07-07-2011 |
| 20110061460 | EXTENSION -MODE ANGULAR VELOCITY SENSOR - An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode. | 03-17-2011 |
| 20100290769 | OPTICAL IMAGE STABILIZATION IN A DIGITAL STILL CAMERA OR HANDSET - An optical image stabilization system for a camera module is disclosed. The stabilization system comprises a voice coil motor (VCM), at least one digital gyroscope for receiving signals from the VCM, and an angular velocity sensor for receiving signals from the digital gyroscope and outputting an angular position error signal. The stabilization system further comprises signal processing logic for receiving the error signal, and comparing the error signal to a reference signal and providing a stabilized image based upon that comparison, wherein the hard-coded logic, digital gyroscope and rate and position sensor resides on the same chip. | 11-18-2010 |
| 20100253437 | METHOD AND SYSTEM FOR USING A MEMS STRUCTURE AS A TIMING SOURCE - A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit. | 10-07-2010 |
| 20100252897 | PERFORMANCE-ENHANCING TWO-SIDED MEMS ANCHOR DESIGN FOR VERTICALLY INTEGRATED MICROMACHINED DEVICES - An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor. | 10-07-2010 |
| 20100214216 | MOTION SENSING AND PROCESSING ON MOBILE DEVICES - Display devices including motion sensing and processing. In one aspect, a handheld electronic device includes a subsystem providing display capability and a set of motion sensors provided on a single substrate and including at least one gyroscope sensing rotational rate of the device around three axes of the device and at least one accelerometer sensing gravity and linear acceleration of the device along these axes. A computation unit is capable of determining motion data from the sensor data stored in the memory, the motion data derived from a combination of the sensed rotational rate around at least one of the axes and the sensed gravity and linear acceleration along at least one of the axes. The motion data describes movement of the device including a rotation of the device around at least one of the axes, the rotation causing interaction with the device. | 08-26-2010 |
| 20100132460 | X-Y AXIS DUAL-MASS TUNING FORK GYROSCOPE WITH VERTICALLY INTEGRATED ELECTRONICS AND WAFER-SCALE HERMETIC PACKAGING - An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment. | 06-03-2010 |
| 20100064805 | LOW INERTIA FRAME FOR DETECTING CORIOLIS ACCELERATION - A sensing frame that moves in response to torque generated by the Coriolis acceleration on a drive subsystem is disclosed. The sensing frame include a first rail. The first rail is constrained to move along the first axis parallel to the first rail. The frame includes a second rail substantially parallel to said first rail. The second rail is constrained to move along the first axis. The frame includes a base and at least two guiding arms for ensuring that the first rail and the second rail move in anti-phase fashion along the first axis. A first guiding arm is flexibly coupled to the first rail and flexibly coupled to the second rail and a second guiding arm is flexibly coupled to the first rail and flexibly coupled to the second rail. The first guiding arm is flexibly suspended to the base at a first anchoring point for allowing rotation of the first guiding arm around the second axis that is perpendicular to the first axis and normal to the plane, and the second guiding arm is suspended to the base at a second anchoring point allowing rotation of the second guiding arm around the third axis parallel to the second axis. The sensing frame includes a plurality of coupling flexures connecting said sensing frame to the drive subsystem and a transducer for sensing motion of the first and second rails responsive to said angular velocity. | 03-18-2010 |
| 20090303204 | CONTROLLING AND ACCESSING CONTENT USING MOTION PROCESSING ON MOBILE DEVICES - Various embodiments provide systems and methods capable of facilitating interaction with handheld electronics devices based on sensing rotational rate around at least three axes and linear acceleration along at least three axes. In one aspect, a handheld electronic device includes a subsystem providing display capability, a set of motion sensors sensing rotational rate around at least three axes and linear acceleration along at least three axes, and a subsystem which, based on motion data derived from at least one of the motion sensors, is capable of facilitating interaction with the device. | 12-10-2009 |
| 20090262074 | CONTROLLING AND ACCESSING CONTENT USING MOTION PROCESSING ON MOBILE DEVICES - Various embodiments provide systems and methods capable of facilitating interaction with handheld electronics devices based on sensing rotational rate around at least three axes and linear acceleration along at least three axes. In one aspect, a handheld electronic device includes a subsystem providing display capability, a set of motion sensors sensing rotational rate around at least three axes and linear acceleration along at least three axes, and a subsystem which, based on motion data derived from at least one of the motion sensors, is capable of facilitating interaction with the device. | 10-22-2009 |
| 20090193892 | DUAL MODE SENSING FOR VIBRATORY GYROSCOPE - An angular rate sensor is disclosed. The angular rate sensor comprises a substrate and a drive subsystem partially supported by a substrate. The drive subsystem includes at least one spring, at least one anchor, and at least one mass; the at least one mass of the drive subsystem is oscillated by at least one actuator along a first axis. Coriolis force acts on moving the drive subsystem along or around a second axis in response to angular velocity of the substrate around the third axis. The angular rate sensor also includes a sense subsystem partially supported by a substrate. The sense subsystem includes at least one spring, at least one anchor, and at least one mass. | 08-06-2009 |
| 20090184849 | INTERFACING APPLICATION PROGRAMS AND MOTION SENSORS OF A DEVICE - Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program. | 07-23-2009 |
| 20090145225 | Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics - Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes. | 06-11-2009 |
| 20090114016 | INTEGRATED MICROELECTROMECHANICAL SYSTEMS (MEMS) VIBRATING MASS Z-AXIS RATE SENSOR - A sensor that measures angular velocity about an axis that is normal to a sensing plane of the sensor. The sensor comprises a sensing subassembly that includes a planar frame parallel to the sensing plane, a first proof mass disposed in the sensing plane, a second proof mass disposed in the sensing plane laterally to the first proof mass, and a linkage within the frame and connected to the frame. The linkage is connected to the first proof mass and to the second proof mass. The sensor further includes actuator for driving the first proof mass and the second proof mass into oscillation along a drive axis in the sensing plane. The sensor further includes a first transducer to sense motion of the frame in response to a Coriolis force acting on the oscillating first proof mass and the oscillating second proof mass. | 05-07-2009 |
| 20090007661 | Integrated Motion Processing Unit (MPU) With MEMS Inertial Sensing And Embedded Digital Electronics - A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate. | 01-08-2009 |
| 20080314147 | VERTICALLY INTEGRATED 3-AXIS MEMS ACCELEROMETER WITH ELECTRONICS - A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are used per axis to enable full bridge measurements to further reduce the mechanical noise, immunity to power supply changes and cross axis coupling. To reduce the sensitivity to packaging and temperature changes, each mechanical structure is anchored to a single anchor pillar bonded to the top cover. | 12-25-2008 |
| 20080283990 | METHOD OF FABRICATION OF AI/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM - A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer. | 11-20-2008 |
