HICON CO., LTD. Patent applications |
Patent application number | Title | Published |
20150377925 | SPRING CONTACT - The present invention relates to a spring contact, which is integrally formed by blanking and bending a metal plate member, the spring contact comprising: an upper head portion | 12-31-2015 |
20150377924 | SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE - The present invention relates to a socket device for testing a semiconductor device. More particularly, the present invention relates to a socket device that is capable of testing ball grid array (BGA) and land grid array (LGA) type semiconductor devices, or BGA/LGA hybrid semiconductor devices according to the shapes of leads of the semiconductor devices. A latch structure for pressing and holding a semiconductor device is improved such that a roller is provided at the front end of a latch so as to minimize wear caused by friction with a sandpaper-like surface on an upper surface of the semiconductor device, even in the case of approximately one hundred thousand or more rounds of testing, thereby remarkably extending the life of the socket device, increasing testing efficiency, and reducing costs. | 12-31-2015 |
20140239993 | SOCKET DEVICE FOR AN IC TEST - Disclosed herein is a socket device for an integrated circuit (IC) test. The device includes: a socket which is provided with a pin guide plate that can guide and protect a spring contact so as to prevent damage to or breakage of the spring contact that electrically connects an IC lead to a PCB; and an IC insert provided with a guide plate. According to said configuration, ball grid array (BGA) ICs in which IC leads are balls can be more efficiently tested. Particularly, contact pins of the socket and the IC leads can be mechanically and electrically more precisely positioned for narrow pitches of the IC leads such as 0.4 mm, 0.35 mm, and 0.3 mm. Thereby, damage to or breakage not only of the ICs to be tested but also of the socket can be minimized. | 08-28-2014 |
20120238136 | SPRING CONTACT AND A SOCKET EMBEDDED WITH SPRING CONTACTS - The present invention relates to a spring contact and a socket embedded with spring contacts. The spring contact comprises: an upper contact pin, which includes a contact portion of a predetermined shape intended to be in contact with the lead of a separate semiconductor IC to be inspected, two spring-fixed protrusions and a body; a lower contact two spring-fixed protrusions and a body; a lower contact pin coupled orthogonally to the upper contact pin; and a spring to be inserted between the upper contact pin and the lower contact pin, wherein the body has an oblique end surface with a locking protrusion formed thereon and two symmetric elastic portions, and wherein the two elastic portions form inside thereof an escape groove to provide a flow space when coupled with the lower contact pin and a flow groove to receive the locking protrusion of the lower contact pin and allow it to flow therein, the flow groove being intended to have an electric contact with the locking protrusion of the lower contact pin and with a side contact portion. Further, the present invention provides a variety of structure, such as a structure for minimizing a compressed length of a contact, a structure for an in-line fine pitch spring contact and socket or a structure for a soldered spring contact and socket. | 09-20-2012 |