Gebr. Schmid GmbH Patent applications |
Patent application number | Title | Published |
20130112185 | CARRIER FOR A SILICON BLOCK, CARRIER ARRANGEMENT HAVING SUCH A CARRIER AND PROCESS FOR PRODUCING SUCH A CARRIER ARRANGEMENT - A carrier ( | 05-09-2013 |
20120276749 | Method and Device for Treating Silicon Substrates - In a method for processing monocrystalline silicon wafers, which are transported while lying flat along a horizontal transport path, etching solution for texturing the surface is applied from above by means of nozzles or the like. The etching solution is applied from above several times in succession onto the upper side of the silicon substrates, remains there and reacts with the silicon substrate. | 11-01-2012 |
20120241294 | Retaining Device for Thin, Planar Substrates - A retaining device for printed circuit boards is of a frame-like form, with transporting carriages arranged on the outer longitudinal sides and intended for transporting the retaining device, a retaining frame of the retaining device for the substrates being arranged between the transporting carriages. The retaining frame is mounted height-adjustably on the transporting carriages and so a substrate restrained in it can be lowered or raised during the treatment. | 09-27-2012 |
20120204946 | METHOD FOR PRODUCING AN EMITTER ELECTRODE FOR A CRYSTALLINE SILICON SOLAR CELL AND CORRESPONDING SILICON SOLAR CELL - In a method for producing a front-side emitter electrode as front contact for a silicon solar cell on a silicon wafer, a depression is produced in the front side of said silicon wafer. A front-side n-doped silicon layer and an antireflection layer are then produced. A paste is then introduced into the depression, said paste containing electrically conductive metal particles and etching glass frit. Said paste, as a result of momentary heating, etches through the antireflection layer to the n-doped silicon layer making electrical contact with the latter. Afterwards, electrically conductive front contact metal is galvanically attached as front contact onto the heat-treated paste in the depression. | 08-16-2012 |
20120132236 | DEVICE FOR CLEANING SUBSTRATES ON A CARRIER - An apparatus for cleaning substrates on a carrier, which has in the interior thereof a plurality of longitudinal passages, which run parallel to one another and are connected to the outside at the underside of the carrier via openings. There is provided a plurality of elongated pipes, which are arranged on a pipe holder and are connected in a fluid-conducting manner to a fluid supply. A centring template is provided, which encompasses the pipes and is displaceable in the longitudinal direction thereof between an attachment position in the end region of the pipes away from the pipe holder and a working position, which lies between the attachment position and the pipe holder. The centring template bears against the carrier, such that the pipes are then aligned exactly with the longitudinal passages. | 05-31-2012 |
20120118329 | METHOD AND DEVICE FOR CLEANING SUBSTRATES ON A CARRIER - In the case of a device and a method for cleaning substrates on a carrier, to the underside of which the substrates are fastened so as to be parallel to and slightly apart from one another, the carrier has in its interior a plurality of longitudinal channels, which run parallel to one another. As a result of the sawing of the wafers, they merge, via openings, into interstices between the substrates. As a result of a relative movement, an elongate tube, from which cleaning fluid is let out, is introduced into one of the longitudinal channels, the relative movement being achieved substantially through moving of the carrier. | 05-17-2012 |
20120097188 | Method and Apparatus for Treating Substrates - In the case of a method and an apparatus for treating substrates, resist layers are removed from the substrates by spraying with process solution. The substrates are sprayed with the process solution first in a main stripping module and then in a post-stripping module and the said process solution collects in containers under the modules. At least one container is respectively provided for each module. The process solution is collected in the main stripping module in two containers and first fed directly into a second container, which is largely separated from the first container by a wall, which is liquid-permeable in a region significantly below the surface level of the process solution. Process solution is taken from the first container without froth and returned once again into the cycle of the process for wetting the substrates. | 04-26-2012 |
20120064300 | Carrier for a Silicon Block and Method for Producing Such a Carrier and Arrangement - A silicon block is firmly connected to a carrier for being moved together for further working by sawing, cleaning or the like. The carrier consists of plastic, for example of glass-fibre-reinforced plastic, and has in its interior a number of continuous longitudinal channels. These longitudinal channels are sawn into, and so cleaning fluid can then be introduced into the intermediate space between the sawn-up wafers in order to flush out sawing remains. | 03-15-2012 |
20120034725 | METHOD FOR TEXTURING SILICON WAFERS, TREATMENT LIQUID THEREFOR, AND USE - In a method for the treatment of silicon wafers in the production of solar cells, a treatment liquid is applied to the surface of the silicon wafers for the purpose of texturization thereof. The treatment liquid contains, as additive, ethyl hexanol or cyclohexanol in an amount ranging from 0.5% to 3%, by weight. | 02-09-2012 |