FUJITSU MEDIA DEVICES LIMITED Patent applications |
Patent application number | Title | Published |
20110156265 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge. | 06-30-2011 |
20100229647 | ANGULAR VELOCITY SENSOR AND METHOD FOR FABRICATING THE SAME - An angular velocity sensor includes a tuning-fork vibrator having a base and multiple arms extending from the base. Two arms out of the multiple arms driven to vibrate have first end parts opposite to second end parts connected to the base. The first end parts being wider than the second end parts. | 09-16-2010 |
20100220416 | SWITCHING POWER SUPPLY, CONTROL CIRCUIT FOR CONTROLLING SWITCHING POWER SUPPLY, CONTROL METHOD OF SWITCHING POWER SUPPLY AND MODULE SUBSTRATE - A switching power supply includes: a first switch provided between a positive terminal of a DC power supply and a positive terminal of a load; a second switch connected in parallel with the first switch; a first capacitor provided between the second switch and a node of the first switch on a DC power supply side; a first inductor provided between the first capacitor and the positive terminal of the DC power supply; and a control circuit that turns off the second switch after the first switch is turned off and when or before a voltage across the first capacitor becomes zero. | 09-02-2010 |
20100219801 | SWITCHING POWER SUPPLY, CONTROL CIRCUIT CONTROLLING SWITCHING POWER SUPPLY AND CONTROL METHOD OF SWITCHING POWER SUPPLY - A switching power supply includes: a first switch provided between one end of a DC power supply and one end of a load; a second switch provided between a node of the first switch located on a load side and another end of the DC power supply; a capacitor provided between the second switch and the another end of the DC power supply; a third switch provided between a node of the first switch located on a DC power supply side and a node between the second switch and the capacitor; and a delay circuit that is provided between the third switch and the node between the second switch and the capacitor and delays a current for charging the capacitor, wherein the second switch is turned on in a period during which the first switch is kept on. | 09-02-2010 |
20100148888 | FILTER, DUPLEXER AND COMMUNICATION APPARATUS - The filter includes a series arm piezoelectric thin film resonator placed in the series arm and a parallel arm piezoelectric thin film resonator placed in the parallel arm. Each of the series arm piezoelectric thin film resonator and the parallel arm piezoelectric thin film resonator includes a substrate ( | 06-17-2010 |
20100134203 | FILTER AND ANTENNA DUPLEXER - There is provided a filter including a first resonator, a second resonator in which an excitation efficiency is reduced more than the first resonator, and an inductor connected in parallel with the second resonator. | 06-03-2010 |
20100117762 | RESONATOR, FILTER AND ELECTRONIC DEVICE - A resonator includes a substrate, a lower electrode, a piezoelectric film provided on the lower electrode, and an upper electrode provided on the piezoelectric film. The lower electrode includes a first film provided on the substrate, and a second film that is provided on the first film and has a specific gravity greater than that of the first film. The piezoelectric film is provided on the second film. The upper electrode includes a third film provided on the piezoelectric film, and a fourth film provided on the third film, the third film having a specific gravity greater than that of the fourth film. The third film is thicker than the second film. | 05-13-2010 |
20100096946 | SURFACE ACOUSTIC WAVE DEVICE - A surface acoustic wave device includes a surface acoustic wave (SAW) chip, a base that is made of resin and surround the SAW chip, and a cap that is made of resin and is bonded, by a seal member, to the base so as to define a cavity in which the SAW chip is sealed with the cap and the base, the cavity communicating with an outside of the surface acoustic wave device through a through hole formed in the seal member. | 04-22-2010 |
20100096358 | LADDER TYPE FILTER - A ladder filter includes a series resonator having a first film laminate in which an upper electrode and a lower electrode face each other across a piezoelectric film, and a first film provided on the first film laminate, and a parallel resonator having a second film laminate having a structure similar to that of the first film laminate, a second film provided on the second film laminate, and another first film identical to the first film. | 04-22-2010 |
20100066209 | ACOUSTIC WAVE DEVICE AND METHOD FOR FABRICATING THE SAME - An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip. | 03-18-2010 |
20100052819 | ACOUSTIC WAVE DEVICE AND SYSTEM - An acoustic wave device includes: a piezoelectric substrate; at least five IDTs (InterDigital Transducers) arranged on the substrate in directions of SAW (Surface Acoustic Wave) propagation; and two balanced terminals connected to two first IDTs that are two out of the at least five IDTs and are 180 degrees out of phase. One of a pair of comb electrodes of one of the two first IDTs is connected to one of the two balanced terminals, and one of a pair of comb electrodes of the other one of the two first IDTs being connected to the other one of the two balanced terminals. The other comb electrodes of the two first IDTs are connected in series, and one of a pair of comb electrodes that form an IDT that is included in the at least five IDTs and is not connected to the two first IDTs is grounded. | 03-04-2010 |
20100052473 | ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An acoustic wave device includes: a piezoelectric substrate on which an acoustic wave element and an electrode pad connected to the acoustic wave element are formed; a first resin part having a first opening located above a function area in which an acoustic wave is excited by the acoustic wave element and a second opening located above the electrode pad; a second resin part that covers the first opening and has a third opening located above the second opening; and a metal layer formed on the electrode pad in the second opening, the first opening and the second opening being inversely tapered. | 03-04-2010 |
20100038992 | SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME - A surface acoustic wave device includes a piezoelectric substrate; comb electrodes provided on a first surface of the piezoelectric substrate; and an insulating film provided on at least one of the first surface of the piezoelectric substrate and a second surface thereof opposite to the first surface, the insulating film having a thickness greater than that of the piezoelectric substrate and having a linear expansion coefficient smaller than that of the piezoelectric substrate in a direction of propagation of a surface acoustic wave. | 02-18-2010 |
20100038122 | ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME - An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip. | 02-18-2010 |
20090302970 | DUPLEXER - A duplexer includes a substrate including an insulation layer, an upper interconnection layer provided on an upper surface of the insulation layer, a lower interconnection layer provided on a lower surface of the insulation layer, and an inner interconnection layer provided in the insulation layer, the inner interconnection layer including an inner ground pad, at least one acoustic wave filter chip mounted on an upper surface of the substrate, signal pads provided on the upper interconnection layer and connected to signal electrodes of the at least one acoustic wave filter chip, and an upper ground pad that is provided in the upper interconnection layer so as to be located between the signal pads and is connected to a ground electrode of the at least one acoustic wave filter, wherein D | 12-10-2009 |
20090297785 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a method for manufacturing an electronic device including: printing a conductive pattern on a first surface of a first green sheet having a multilayer structure, the conductive pattern being electrically connected to an internal interconnection formed in the first green sheet; superposing a second green sheet on the first surface of the first green sheet, the second green sheet having an opening located in an area corresponding to the conductive pattern; pressurizing the first green sheet and the second green sheet superposed thereon in directions in which the second green sheet is superposed on the first green sheet; burning the first green sheet and the second green sheet superimposed thereon to thus form a multilayer ceramic substrate; and mounting an electronic element on a second surface of the multilayer ceramic substrate opposite to the first surface, the electronic element being electrically connected to the internal interconnection. | 12-03-2009 |
20090261921 | BALANCE FILTER - A balance filter includes two acoustic wave filters connected between a single unbalanced terminal and two balanced terminals, and a ground terminal connected to the two acoustic wave filters via a first interconnection portion and a second interconnection portion. The first interconnection portion is connected to the two acoustic wave filters, and the second interconnection portion is connected to the first interconnection portion in a region that is located between the two acoustic wave filters and extends in a direction orthogonal to a direction in which the two acoustic wave filters are aligned. | 10-22-2009 |
20090237894 | ELECTRONIC DEVICE - An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces. | 09-24-2009 |
20090236934 | SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME - A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer. | 09-24-2009 |
20090219670 | ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes. | 09-03-2009 |
20090213561 | ELECTRONIC DEVICE - An electronic device includes an insulative substrate, a spiral inductor formed by an interconnection layer provided on a first surface of the insulative layer, a first chip that is mounted on a second surface of the insulative layer opposite to the first surface and is electrically connected to a passive circuit including the spiral inductor, the first chip having an electrically conductive substrate, and a first protrusion that is provided on one of the first and second surface of the insulative substrate and protrudes therefrom, the first protrusion being electrically connected to one of the passive circuit and the first chip to an external circuit. | 08-27-2009 |
20090212399 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge. | 08-27-2009 |
20090175470 | ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME - An acoustic wave device includes a substrate; an acoustic wave element provided on the substrate; a terminal that is provided on the substrate and is electrically coupled to the acoustic wave element; a first insulating layer that is provided on the substrate and has a first opening at a region thereof overlapped with at least a part of the terminal; a second insulating layer that has an second opening at a region thereof overlapped with at least a part of the first opening and is provided on the first insulating layer and the acoustic wave element so that a cavity is formed above the acoustic wave element; a third insulating layer that has a third opening including the region where the first opening and the second opening are overlapped with each other, and is provided on the second insulating layer; a metal post that is electrically coupled to the terminal and is provided in the first opening, the second opening and the third opening; and a solder ball provided on the metal post. | 07-09-2009 |
20090170032 | METHOD OF MANUFACTURING ELECTRONIC DEVICE - A method of manufacturing an electronic device includes forming a photosensitive SOG oxide layer on a multi-layer ceramics substrate having a penetrating electrode, forming an opening by subjecting the photosensitive SOG oxide layer to an exposure treatment and developing treatment so that an upper face of the penetrating electrode is exposed, and forming a passive element on the photosensitive SOG oxide layer, the passive element being connected to the penetrating electrode through the opening. | 07-02-2009 |
20090166068 | ELECTRONIC COMPONENT - An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region. | 07-02-2009 |
20090160290 | ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME - An acoustic wave device includes a substrate, an acoustic wave element, an electrode pad, a resin portion and a metal post. The acoustic wave element is provided on the substrate. The electrode pad is provided on the substrate, is electrically coupled to the acoustic wave element, and has an Au layer and an adhesive layer formed on the Au layer and having an opening. The resin portion is provided on the substrate so as to cover the acoustic wave element and the electrode pad, and has a through-hole formed to expose a surface of the electrode pad. The metal post is provided in the through-hole and contacts with the Au layer through the opening of the adhesive layer. The adhesive layer is provided between the Au layer and the resin portion. | 06-25-2009 |
20090153269 | ACOUSTIC WAVE FILTER - An acoustic wave filter includes: a first acoustic wave filter having a first group of multimode filters connected, a first unbalanced input node and two first balanced output nodes, a first multimode filter among the first group of multimode filters being connected to the two first balanced output nodes; and a second acoustic wave filter having a second group of multimode filters, a second unbalanced input node and two second balanced output nodes, a second multimode filter among the second group of multimode filters having an aperture length different from that of the first multimode filter and a connection with the two second balanced output nodes, the first and second multimode filters having different pass bands. One of the two first balanced output nodes and one of the two second balanced output nodes are unified, and the other first balanced output node and the other second balanced output node are unified. | 06-18-2009 |
20090139328 | Packaged micro movable device and method for making the same - A method is provided for making packaged micro-devices each including a micro movable element, a first packaging member formed with a recess, and a second packaging member formed with another recess. The micro movable element has a movable part. In accordance with the method, a device wafer is prepared for forming a plurality of micromovable elements. A first packaging wafer, formed with a plurality of recesses corresponding in position to the movable parts of the respective movable elements, is bonded to one surface of the device wafer. A second packaging wafer, formed with a plurality of recesses, is bonded to the other surface of the device wafer. The resulting laminate assembly is cut into separate products. | 06-04-2009 |
20090107714 | ELECTRONIC COMPONENT MODULE AND CIRCUIT BOARD THEREOF - An electronic component module, including: a circuit board having: an insulating layer; a plurality of conductive layers formed on respective surfaces of the insulating layer; a ground plane comprising one of the conductive layers and covering the greater part of the surface; and wiring formed on another of the surfaces and comprising the conductive layer; and an electronic component mounted on the circuit board and connected by the wiring, wherein a plurality of slits, formed by removing the conductive layer, are provided in the ground plane. | 04-30-2009 |
20090096321 | SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR - A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin. | 04-16-2009 |
20090085708 | ELECTRONIC DEVICE - An electronic device includes a substrate, two ellipse spiral coils that are provided on the substrate, are spaced from each other in a longitudinal direction thereof, and are electrically connected to each other, two wires that are electrically connected to outermost circumference of the two coils respectively and extract the two coils to outside, and a connection portion that electrically connects each end of innermost circumference of the two coils. A ratio of inner diameter against outer diameter of the two coils in a long axis direction and in a short axis direction thereof is respectively 0.5 to 0.8. | 04-02-2009 |
20090085707 | ELECTRONIC DEVICE - An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided. | 04-02-2009 |
20090073639 | SOLID ELECTROLYTIC CAPACITOR ELEMENT AND SOLID ELECTORLYTIC CAPACITOR - A solid electrolytic capacitor element includes an anode foil, a solid electrolytic layer, a cathode foil, and a connection portion. The anode foil is composed of valve metal and has at least one through hole passing therethrough in thickness direction thereof. The solid electrolytic layer is made of conductive polymer and is provided on a surface of the anode foil. The cathode foil is provided on a surface of the solid electrolytic layer. The connection portion is provided in the through hole and electrically connects a first solid electrolytic layer and a second solid electrolytic layer, the first solid electrolytic layer being a region of the solid electrolytic layer on one face of the anode foil, the second solid electrolytic layer being another region of the solid electrolytic layer on the other face of the anode foil. | 03-19-2009 |
20080292846 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - When manufacturing an electronic component having a flip chip or a surface mount component mounted on a sheet substrate and being covered with a shield cover, the above shield cover is dipped into cream solder and placed on the above sheet substrate after the above cream solder is attached to the peripheral edge sides of the above shield cover, and then the shield cover is fixed to the sheet substrate by reflow process. With such manufacturing, it becomes possible to efficiently fix the shield cover to the sheet substrate. Also, the shield cover can securely be fixed against the bend of the sheet substrate produced during the reflow. | 11-27-2008 |
20080284543 | PIEZOELECTRIC THIN-FILM RESONATOR AND FILTER - A piezoelectric thin-film resonator includes: a lower electrode that is formed on a substrate; a piezoelectric film that is formed on the substrate and the lower electrode; an upper electrode that is formed on the piezoelectric film, with a portion of the piezoelectric film being interposed between the lower electrode and the upper electrode facing each other; and an additional film that is formed on the substrate on at least a part of the outer periphery of the lower electrode at the portion at which the lower electrode and the upper electrode face each other, with the additional film being laid along the lower electrode. | 11-20-2008 |
20080284540 | ANTENNA DUPLEXER - An antenna duplexer is provided, which can be built with a smaller size and lower height than ever without compromising out-of-band attenuation characteristic and isolation characteristic between a transmit terminal and a receive terminal. The antenna duplexer includes a transmit filter provided between an antenna terminal and the transmit terminal, and a receive filter provided between the antenna terminal and the receive terminal. The filters are enclosed by a package, in which a ground pattern for the receive filter is separated from other ground patterns. | 11-20-2008 |
20080252394 | SURFACE ACOUSTIC WAVE DEVICE AND DUPLEXER - A surface acoustic wave device includes a supporting substrate, a LiTaO3 piezoelectric substrate joined on the supporting substrate, which has a normal line direction on a main surface thereof in a direction rotated 43° to 53° from a Y axis to a Z axis direction about an X axis, and an electrode pattern formed on the piezoelectric substrate. | 10-16-2008 |
20080237757 | MICRO MOVABLE DEVICE, WAFER, AND METHOD OF MANUFACTURING WAFER - A micro movable device is made by processing a material substrate of a multilayer structure including a first layer, a second layer having a finely rough region on its surface on the side of the first layer, and an intermediate layer provided between the first and the second layer. The micro movable device includes a first structure formed in the first layer and a second structure formed in the second layer. The second structure includes a portion opposing the first structure via a gap and having a finely rough region on the side of the first structure, and being relatively displaceable with respect to the first structure. | 10-02-2008 |
20080232034 | SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a solid electrolytic capacitor includes: rolling an anode foil, a cathode foil and a separator together, the separator being a mixed fiber composed of a chemical fiber and a natural fiber and being between the anode foil and the cathode foil; degrading and removing the natural fiber with enzyme; and forming an electrolytic layer composed of solid polymer between the anode foil and the cathode foil after degrading and removing the natural fiber. | 09-25-2008 |
20080210007 | Angular velocity sensor - An angular velocity sensor includes: a first tuning-fork vibrator having a first base and first aims extending from the first base in a first direction; a second tuning-fork vibrator having a second bass and second arms extending from the second base in a second direction; and a double gimbal portion mat has a drive gimbal portion vibrating about an axis extending in a fourth direction, and a sense gimbal portion vibrating about an axis extending in a fifth direction and senses an angular velocity about an axis extending in a third direction. | 09-04-2008 |
20080202238 | ANGULAR VELOCITY SENSOR AND METHOD FOR FABRICATING THE SAME - An angular velocity sensor includes a tuning-fork vibrator having a base and multiple arms extending from the base. Two arms out of the multiple arms driven to vibrate have first end parts opposite to second end parts connected to the base. The first end parts being wider than the second end parts. | 08-28-2008 |