FINISAR CORPORATION Patent applications |
Patent application number | Title | Published |
20150334475 | WAVELENGTH DIVISION MULTIPLEXER ARRAY - In an example embodiment, a WDM array includes an optical filter, N common ports, N reflection ports, and N pass ports. The N common ports may be positioned to a first side of the optical filter. N may be greater than or equal to two. The N reflection ports may be positioned to the first side of the optical filter. The N pass ports may be positioned to a second side of the optical filter opposite the first side. | 11-19-2015 |
20150331198 | NxN Optical Switch - Described herein are various embodiments of a cross-connect type optical switch (E.g. 1) for switching optical beams between a plurality of optical fibers. Switch | 11-19-2015 |
20150289368 | HYBRID PRINTED CIRCUIT BOARD CONSTRUCTION - A hybrid printed circuit board is described. The hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers. | 10-08-2015 |
20150288049 | TRANSMISSION LINES - A circuit may include a first transmission line that includes a first first-line conductor configured to transport a signal and a second first-line conductor. The circuit may also include a second transmission line that includes a first second-line conductor, a second second-line conductor electrically coupled to the second first-line conductor, and a third second-line conductor separated from and positioned between the first and second second-line conductors. The third second-line conductor may be electrically coupled to the first first-line conductor. The circuit may also include a conductive jumper electrically coupling the first and second second-line conductors. The conductive jumper may contact the first and second second-line conductors in a position near the coupling of the first and second transmission lines. | 10-08-2015 |
20150282303 | THERMAL MANAGEMENT STRUCTURES FOR OPTOELECTRONIC MODULES - An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components. | 10-01-2015 |
20150208143 | Polarization Diverse Wavelength Selective Switch - Described herein is a wavelength selective switch (WSS) type optical switching device ( | 07-23-2015 |
20150207569 | Method And Apparatus For Stabilization Of Optical Transmitter - A DP-QPSK optical transmitter includes an outer MZM comprising a first parent MZM comprising a first child MZM and a second child MZM that modulates a QPSK signal with a first polarization. A second parent MZM includes a first child MZM and a second child MZM that modulates a QPSK signal with a second polarization. The outer Mach-Zehnder modulator multiplexes the first and second polarization embedded into a dual-polarization QPSK signal generation. A first optical detector detects the QPSK signal generated by the first parent MZM with the first polarization. A second optical detector optical detects the QPSK signal generated by the second parent Mach-Zehnder modulator with the second polarization. A bias control circuit generates bias signals on at least one output that stabilize the DP-QPSK signal in response to signals generated by the first and second optical detector using electrical time division multiplexing. | 07-23-2015 |
20150205048 | POLARIZATION-DEPENDENT LOSS COMPENSATOR - In an embodiment, a polarization-dependent loss (PDL) compensator includes a substrate, an anti-reflective coating, and a partial reflective coating. The substrate has an input surface and an output surface opposite the input surface. The anti-reflective coating is formed on the output surface. The partial reflective coating is formed on the input surface. The PDL compensator may include PDL that depends on an incident angle of an optical signal with respect to the partial reflective coating. | 07-23-2015 |
20150086198 | Ultrafast High Resolution Optical Channel Monitor - Described herein is an optical channel monitor ( | 03-26-2015 |
20140376909 | Optical Channel Monitor With High Resolution Capability - Described herein is an optical channel monitor ( | 12-25-2014 |
20140355228 | RIGID-FLEXIBLE CIRCUIT INTERCONNECTS - In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad. | 12-04-2014 |
20140347733 | Systems And Methods of Aberration Correction In Optical Systems - Described herein is a diffraction grating ( | 11-27-2014 |
20140329405 | THERMAL MANAGEMENT STRUCTURES FOR OPTOELECTRONIC SYSTEMS - An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell. | 11-06-2014 |
20140321821 | CABLE CLIP AND CABLE MANAGEMENT STRUCTURES FOR USE WITH AN OPTOELECTRONIC MODULE - An example embodiment includes a cable clip. The cable clip is configured to maintain engagement of an optical interface with a lens assembly included in an optoelectronic module. The cable clip includes a forward section, a clip body, a connector retention mechanism, a lens latch, and a release lever. The clip body is connected to the forward section at a clip shoulder. The connector retention mechanism is configured to retain the optical interface and extends from the clip body. The lens latch is positioned at a first end. The lens latch is configured to latch the lens assembly when a portion of the optical interface is received within the lens assembly. The release lever is connected to the forward section. The release lever is configured to unlatch the lens latch from the lens assembly in response to application of an actuation force above a particular threshold magnitude. | 10-30-2014 |
20140270765 | PLUGGABLE OPTICAL HOST AND NETWORK I/O OPTOELECTRONIC MODULE - In an embodiment, a pluggable optical host and network I/O optoelectronic module (hereinafter “module”) includes a first optical-electrical-optical (OEO) converter and a second OEO converter. The first OEO converter is configured to convert N inbound optical signals to M inbound optical signals and includes N network-side optical receivers, first signal processing circuitry communicatively coupled to the N network-side optical receivers, and M host-side optical receivers communicatively coupled to the first signal processing circuitry. The second OEO converter is configured to convert M outbound optical signals to N outbound optical signals and includes M host-side optical receivers, second signal processing circuitry communicatively coupled to the M host-side optical receivers, and N network-side optical receivers communicatively coupled to the second signal processing circuitry. | 09-18-2014 |
20140270750 | OPTICAL SOURCE MONITORING SYSTEM - An example embodiment includes an optical transmission device. The optical transmission device includes an optical source, a collimator lens, and an optical monitor. The optical source is configured to transmit a channel of light. The collimator lens is configured to reflect a portion of the channel of light. The optical monitor is arranged to receive at least a first portion of the reflected channel of light directly from the collimator lens, and is configured to communicate a gross electrical signal representative of received light including the first portion of the reflected channel of light. | 09-18-2014 |
20140269807 | SHORT GAIN CAVITY DISTRIBUTED BRAGG REFLECTOR LASER - A long wavelength, short cavity laser can include: an active region or gain cavity having a length from about 10 microns to about 150 microns; a gap region adjacent to the active region and having a gap length that is less than 30 microns or less than the length of the active region; and a distributed Bragg reflector (“DBR”) region having a grating with a kappa of at least about 200 cm | 09-18-2014 |
20140269802 | Lasers With GaPSb Barrier Layers - A laser active region can include a quantum well barrier having GaPSb. The active region can include one or more quantum wells, and a quantum well barrier having GaPSb bounding each side of each of the one or more quantum wells. The quantum well barrier can be GaP | 09-18-2014 |
20140254993 | LATCH MECHANISM FOR COMMUNICATION MODULE - Some embodiments include a latch mechanism and an optoelectronic module that includes the latch mechanism. The latch mechanism may include a driver, a follower, a pivot member, and a cam member. The driver may be configured to rotate relative to a housing of the optoelectronic module about an axis of rotation. The follower may be configured to be slidably positioned relative the housing. The follower may include a resilient member configured to interface with the housing and may define an opening including a protuberance. The pivot member may be coupled to the driver or to the housing and may define the axis of rotation. The cam member may be coupled to the driver and may be configured to engage the follower from within the opening so as to urge the follower to slide relative to the housing as the driver is rotated between a latched position and an unlatched position. | 09-11-2014 |
20140254982 | Multicast Optical Switch - Described herein is an optical switch ( | 09-11-2014 |
20140254653 | SELF-TESTING INTEGRATED CIRCUITS - In an example, a self-testing integrated circuit (IC) includes N channels i and a controller, where i is an integer from 1 to N. Each channel i may include a clock and data recovery circuit (CDR), a pseudorandom bit stream (PRBS) generator circuit, and a PRBS checker and eye quality monitor (EQM) circuit. The controller may be configured to selectively couple the channels i in a daisy chain during self-testing. | 09-11-2014 |
20140242826 | LATCHING MECHANISMS FOR PLUGGABLE ELECTRONIC DEVICES - Latching mechanisms for pluggable electronic devices when received within a host cage of a host device. In one example embodiment, the host cage is configured to be connected to a host printed circuit board and configured to at least partially surround a host connector. The host cage includes a pair of inwardly biased leaf springs that extend toward the host connector and thereby engage with the latching mechanism of the pluggable electronic module in order to secure the pluggable electronic module within the host cage. | 08-28-2014 |
20140205298 | INTELLIGENT BAIL - An identification device is configured to be coupled externally to an optoelectronic device to provide connectivity and/or identification information in an optical network in which the optoelectronic device is implemented. The identification device may include an integrated circuit with unique identification information and a plurality of contacts coupled to the integrated circuit and configured to be coupled to an outside identification system. The outside identification system communicates with the identification device via the plurality of contacts to collect unique identification information, the ability to retrieve the unique identification information additionally implicating connectivity in some embodiments. The identification device may include a plurality of clips configured to engage corresponding posts on a latch of the optoelectronic device. | 07-24-2014 |
20140204330 | PIPELINED PIXEL APPLICATIONS IN LIQUID CRYSTAL ON SILICON CHIP - An example embodiment includes a LCOS IC. The LCOS IC includes multiple pixels, a column driver, and multiple conductive lines. The pixels are arranged in a pixel array. The column driver is configured to supply multiple signals to a column of pixels included in the pixel array. Each of the conductive lines couples the column driver to a subset of pixels in the column of pixels. The conductive lines are configured such that two or more of the signals can be supplied to two or more of the subsets of pixels with some overlapping duration. | 07-24-2014 |
20140204299 | LOCAL BUFFERS IN A LIQUID CRYSTAL ON SILICON CHIP - An example embodiment includes a liquid crystal on silicon (LCOS) system. The LCOS system includes multiple pixels, a pixel voltage supply source (voltage source), an external buffer, and a local buffer. The voltage source is configured to supply an analog ramp to the pixels. The external buffer is configured to buffer the voltage source from the pixels. The local buffer is configured to buffer the external buffer from a subset of pixels of the plurality of pixels. | 07-24-2014 |
20140204298 | PIXEL TEST IN A LIQUID CRYSTAL ON SILICON CHIP - An example embodiment includes a continuity testing method of a pixel in a liquid crystal on silicon integrated circuit. The method includes writing a first voltage to a pixel. The pixel is isolated and a wire that is selectively coupled to the pixel is discharged. The method also includes enabling a sensing amplifier configured to sense voltage on the wire. The pixel is electrically coupled to the wire and a resultant voltage on the wire is sensed. | 07-24-2014 |
20140198817 | Lasers With InGaAsP Quantum Wells And GaAsP Barrier Layers - A laser can include an active region having: one or more quantum wells having InGaAsP; and two or more quantum well barriers having GaAsP bounding the one or more quantum wells, wherein the active region is devoid of Al. The laser emits light having about 850 nm. The one or more quantum wells can have a composition In | 07-17-2014 |
20140197338 | OPTO-ISOLATOR INCLUDING A VERTICAL CAVITY SURFACE EMITTING LASER - An opto-isolator is disclosed that include a vertical cavity surface emitting laser (VCSEL), a photodetector and a package enclosing the VCSEL and the photodetector. The photodetector is optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. | 07-17-2014 |
20140186038 | Multi Directional Multiplexer - Described herein is an optical transmission cross-connect for routing wavelength signals to a bank of directionless transceivers. One embodiment ( | 07-03-2014 |
20140185995 | OPTICAL FIBER SECURING DEVICE - An optical fiber securing device may include a passage, an epoxy well, an epoxy path, an optical fiber seat, and a protrusion. The passage may have an entrance and an exit, the passage configured to receive therein an optical fiber inserted through the entrance. The epoxy well may be configured to receive therein epoxy. The epoxy path may provide a pathway for epoxy between the epoxy well and the passage. The optical fiber seat may be configured to receive at least a portion of the optical fiber, the optical fiber seat configured to position an end of the optical fiber in optical alignment with a lens. The protrusion may define an upper boundary of the passage at the exit of the passage, the protrusion configured to restrain epoxy received within the passage such that the epoxy does not become interposed between the end of the optical fiber and the lens. | 07-03-2014 |
20140178014 | PIN CADENCE FOR HIGH-SPEED CONNECTORS - A connector includes pins having a pinout including a functional designation cadence. The functional designation cadence includes a first ground pin, a first signal pin, a no-connect pin, a second signal pin, and a second ground pin, where the first signal pin is positioned between the first ground pin and the no-connect pin, the no-connect pin is positioned between the first and second signal pins, and the second signal pin is positioned between the no-connect pin and the second ground pin. Alternately, the functional designation cadence includes a first ground pin, a first signal pin, a third ground pin, a second signal pin, and a second ground pin, where the first signal pin is positioned between the first and third ground pins, the third ground pin is positioned between the first and second signal pins, and the second signal pin is positioned between the third and second ground pins. | 06-26-2014 |
20140161399 | HEAT SINK RETENTION IN AN OPTICAL COMPONENT - An example embodiment includes a retention spring. The retention spring includes a central portion, a coupling feature, and a spring arm. The central portion includes a heat sink contact surface configured to contact a detachable heat sink. The coupling feature is configured to mechanically couple the retention spring to an optical component. The spring arm connects the central portion to the coupling feature. The spring arm is configured to elastically deform to allow insertion of the detachable heat sink between the heat sink contact surface and a heat dissipation surface of the optical component and to at least partially retain the detachable heat sink against the heat dissipation surface. | 06-12-2014 |
20140153866 | OPTICAL COMPONENT ARRAYS IN OPTICAL CONNECTORS - An example embodiment includes an optical connector. The optical connector includes a printed circuit board (PCB), multiple optical components, multiple optical fibers, and a lens assembly. The optical components are mounted to the PCB. Additionally, each of the optical components includes an aperture. The lens assembly is positioned on the PCB. The lens assembly defines a cavity in which the optical components are positioned. Additionally, the lens assembly defines optical fiber seats that are configured to receive the optical fibers. The lens assembly includes an angled surface that is configured to reflect optical signals between the optical components and the optical fibers. | 06-05-2014 |
20140133012 | DP-QPSK DEMODULATOR - In an embodiment, a demodulator includes first, second, third, fourth and fifth beam displacers, a half waveplate, and a quarter waveplate. The second beam displacer is positioned to receive an output from the first beam displacer. The third beam displacer is positioned to receive an output from the second beam displacer. The half waveplate is positioned to receive an output from the third beam displacer. The fourth beam displacer is positioned to receive an output from the half waveplate. The fifth beam displacer is positioned to receive an output from the fourth beam displacer. The quarter waveplate is positioned between the fourth beam displacer and the fifth beam displacer. | 05-15-2014 |
20140126957 | COMMUNICATION MODULE LATCHING MECHANISM - An example embodiment includes a latching mechanism configured to selectively secure a communication module to a receptacle of a host device. The latching mechanism includes a latch, a cam, and a latch release. The latch includes a latch hook and a latch protrusion. The cam is mechanically coupled to the latch release. The cam is positioned with respect to the latch such that an activation force applied to the latch release translates the cam to contact the latch protrusion and displace the latch hook. | 05-08-2014 |
20140119746 | INTEGRATED CIRCUITS IN OPTICAL RECEIVERS - A circuit may include a photodiode configured to receive an optical signal and convert the optical signal to a current signal. The circuit may also include a transimpedance amplifier coupled to the photodiode and configured to convert the current signal to a voltage signal. The circuit may also include an equalizer coupled to the transimpedance amplifier and configured to equalize the voltage signal to at least partially compensate for a loss of a high frequency component of the optical signal. The equalizer and the transimpedance amplifier may be housed within a single integrated circuit. | 05-01-2014 |
20140119736 | APPARATUS HAVING FIRST AND SECOND TRANSCEIVER CELLS FORMED IN A SINGLE INTEGRATED CIRCUIT - An apparatus having first and second transceiver cells formed in a single integrated circuit. In one example embodiment, an apparatus includes a first transceiver cell including a first set of components configured to enable communication on a first communication link in a network and a second transceiver cell formed underneath the first transceiver cell in a single integrated circuit (IC). The second transceiver cell is optically isolated from the first transceiver cell. The second transceiver cell includes a second set of components configured to enable communication on a second communication link in the network. | 05-01-2014 |
20140104808 | LATCH MECHANISM FOR COMMUNICATION MODULE - Latch mechanism for communication modules. In an example embodiment, a module latch mechanism includes a follower configured to be slidingly positioned relative to a housing and a driver configured to be rotatingly positioned relative to the housing. The follower includes a first arm configured to facilitate selective engagement of the housing with a host device. The follower may further include a fastening mechanism configured to facilitate selective engagement of the follower with the housing. The driver is configured to be positioned relative to the follower such that the driver urges the follower toward a first position relative to the housing as the driver is rotated from an unlatched position to a latched position. | 04-17-2014 |
20140093237 | OPTICAL CHANNEL MONITOR - In one example, an optical channel monitor includes a tunable filter, a deinterleaver, first and second optical receivers, and a control module. The tunable filter is configured to receive an optical signal having a plurality of channels spaced at a nominal channel spacing. The deinterleaver has an input with an input channel spacing F | 04-03-2014 |
20140079403 | HIGH-SPEED PLUGGABLE RIGID-END FLEX CIRCUIT - High-speed pluggable rigid-end flex circuit. A circuit includes a flexible section, rigid section, connector disposed on the rigid section, and electrically conductive signal transmission line electrically coupled to the connector. The flexible section includes a first portion of a flexible insulating layer. The rigid section includes a second portion of the flexible insulating layer and a rigid insulating layer disposed on the second portion of the flexible insulating layer. The connector is configured to form a pluggable conductive connection. The electrically conductive signal transmission line includes a first signal trace having a root mean square surface roughness below 20 micrometers and a filled signal via configured to pass through at least a portion of the rigid insulating layer. The flexible and rigid insulating layers have a dissipation factor equal to or below a ratio of 0.004 and a dielectric constant equal to or below a ratio of 3.7. | 03-20-2014 |
20140078681 | LATCH MECHANISM FOR COMMUNICATIONS MODULE - In an example embodiment, a module latch mechanism includes a follower and a driver. The follower is configured to be slidingly positioned relative to a housing and to facilitate selective engagement of the housing with a host device. The follower includes a retaining member configured to retain a resilient member in at least one direction such that the resilient member urges the follower towards a first position relative to the housing. The driver is configured to be rotatingly positioned relative to the housing. The driver includes a cam configured to urge the follower towards a second position relative to the housing as the driver is rotated from a latched position to an unlatched position. | 03-20-2014 |
20140064725 | High Bandwidth Demodulator System And Method - A method of analysing an input signal, the method including the steps of: (a) dividing a first input signal into first and second orthogonal signal polarisation components; (b) dividing a second input signal into orthogonal first and second orthogonal local polarisation components; (c) mixing the first orthogonal signal component with the second orthogonal local polarisation component to provide a first mixed signal; (d) mixing the second orthogonal signal component with the first orthogonal local polarisation component to provide a second mixed signal; (e) analysing the first and second mixed signal to determine the polarisation or phase information in the input signal. | 03-06-2014 |
20140064677 | OPTICAL NETWORK UNIT TRANSCEIVER - A pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device. | 03-06-2014 |
20140059638 | Integrated Laser And Modulator Transmitter For CATV Applications - A cable television (CATV) optical transmitter includes a tunable laser having a phase bias input and a gain bias input. The tunable laser generates an optical beam at an output. A semiconductor optical amplifier includes an electrical bias input and an optical input that is optically coupled to the output of the tunable laser. The semiconductor amplifier amplifies the optical beam generated by the tunable laser. An integrated balanced modulator includes an electrical modulation input that receives analog CATV signals and an optical input that is connected to the output of the semiconductor amplifier. A third order pre-distortion circuit includes an output that is electrically connected to a modulation input of the integrated balanced modulator. The 3 | 02-27-2014 |
20140056593 | Linecards With Pluggable Interfaces For Pluggable Optical Amplifiers And Other Pluggable Devices - A linecard includes at least one pluggable device, a linecard processor, and a centralized host processor. The linecard also includes an interface that supports a pluggable device. A pluggable device is electrically coupled to the interface and is controlled by the centralized host processor. A flash memory stores data for the pluggable device. The pluggable device can include at least one of an optical amplifier and a ROADM pluggable device. | 02-27-2014 |
20140044398 | BIASING ASSEMBLY FOR A LATCHING MECHANISM - An example embodiment includes a communication module. The communication module includes a shell, a printed circuit board assembly (“PCBA”) at least partially positioned within the shell, an optical transmitter electrically coupled to the PCBA, an optical receiver electrically coupled to the PCBA, and a biasing assembly. The biasing assembly includes a latch cover configured to be attached to the shell, a slider, and a spring. The slider is configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection. The slider includes a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm. The spring is positioned between the latch cover and the stopper feature to bias the latching mechanism. | 02-13-2014 |
20140035755 | COMMUNICATION DEVICES - Communication devices are disclosed. In an example embodiment, a communication device may include a communication module including an illumination source and a body element. The body element may be configured to allow illumination generated by the illumination source to propagate within and illuminate at least a portion of an outer surface of the body element. | 02-06-2014 |
20140023368 | Method And Apparatus for Stabilization of Optical Transmitter - A DP-QPSK optical transmitter includes an outer MZM comprising a first parent MZM comprising a first child MZM and a second child MZM that modulates a QPSK signal with a first polarization. A second parent MZM includes a first child MZM and a second child MZM that modulates a QPSK signal with a second polarization. The outer Mach-Zehnder modulator multiplexes the first and second polarization embedded into a dual-polarization QPSK signal generation. A first optical detector detects the QPSK signal generated by the first parent MZM with the first polarization. A second optical detector optical detects the QPSK signal generated by the second parent Mach-Zehnder modulator with the second polarization. A bias control circuit generates bias signals on at least one output that stabilize the DP-QPSK signal in response to signals generated by the first and second optical detector using electrical time division multiplexing. | 01-23-2014 |
20140002180 | INTEGRATED CIRCUIT WITH VOLTAGE CONVERSION | 01-02-2014 |
20130315584 | BACKDOOR DIAGNOSTIC COMMUNICATION TO TRANSCEIVER MODULE - Exemplary embodiments of the invention relate to an optical transceiver module having a diagnostic communications link, wherein the link is configured to access diagnostic and other data contained within the transceiver controller via a backdoor interface. Controller data, including operational parameter values and module setup values, is accessible while the transceiver operates in conjunction with an external host and may be retrieved, and sometimes modified, in real time without interrupting normal transceiver operation or suspending the transmission of data over optical fibers. The data is accessed with an external user device via a backdoor interface on the outside of the transceiver module. | 11-28-2013 |
20130315349 | LOW POWER AND COMPACT AREA DIGITAL INTEGRATOR FOR A DIGITAL PHASE DETECTOR - In an example embodiment, a phase-locked loop circuit may include a first circuitry to receive a reference signal and a source signal. The first circuitry may generate a correction signal for demonstrating a difference in phase between the reference signal and the source signal. The phase-locked loop may include a second circuitry to receive the correction signal. The second circuitry may generate a digital signal for demonstrating a phase-to-digital conversion of the correction signal. The phase-locked loop may include a third circuitry to receive the digital signal. The third circuitry may generate a control signal for demonstrating a converted voltage of the digital signal. The phase-locked loop may include a fourth circuitry to receive the control signal. The fourth circuitry may generate the source signal in response to the control signal. | 11-28-2013 |
20130308959 | Directly Modulated Laser for PON Applications - In an embodiment, a distributed Bragg reflector (DBR) laser includes a gain section and a passive section. The gain section includes an active region, an upper separate confinement heterostructure (SCH), and a lower SCH. The upper SCH is above the active region and has a thickness of at least 60 nanometers (nm). The lower SCH is below the active region and has a thickness of at least 60 nm. The passive section is coupled to the gain section, the passive section having a DBR in optical communication with the active region. | 11-21-2013 |
20130308936 | Method of Monitoring an Optoelectronic Transceiver with Multiple Flag Values for a Respective Operating Condition - An optoelectronic transceiver includes an optoelectronic transmitter, an optoelectronic receiver, memory, and an interface. The memory is configured to store digital values representative of operating conditions of the optoelectronic transceiver. The interface is configured to receive from a host a request for data associated with a particular memory address, and respond to the host with a specific digital value of the digital values. The specific digital value is associated with the particular memory address received from the host. The optoelectronic transceiver may further include comparison logic configured to compare the digital values with limit values to generate flag values, wherein the flag values are stored as digital values in the memory. | 11-21-2013 |
20130308662 | Wavelength Tunable Laser - Described herein is a tunable optical filter ( | 11-21-2013 |
20130308178 | Co-modulation of DBR Laser and Integrated Optical Amplifier - In an embodiment, a laser chip includes a laser, an optical amplifier, a first electrode, and a second electrode. The laser includes an active region. The optical amplifier is integrated in the laser chip in front of and in optical communication with the laser. The first electrode is electrically coupled to the active region. The second electrode is electrically coupled to the optical amplifier. The first electrode and the second electrode are configured to be electrically coupled to a common direct modulation source. | 11-21-2013 |
20130294492 | INTEGRATED PROCESSOR AND CDR CIRCUIT - A system may include a clock and data recovery circuit that includes one or more analog components. The system may also include a digital control circuit configured to control the clock and data recovery circuit. The digital control circuit and the clock and data recovery circuit may be formed on a single substrate. | 11-07-2013 |
20130279912 | BANDWIDTH EFFICIENT DUAL CARRIER - In some examples, a transmit assembly is described that may include a first optical transmitter, a second optical transmitter, and a polarizing beam combiner. The first optical transmitter may be configured to emit a first optical data signal centered at a first frequency. The second optical transmitter may be configured to emit a second optical data signal centered at a second frequency offset from the first frequency by a nominal offset n. The polarizing beam combiner may be configured to generate a dual carrier optical data signal by polarization interleaving the first optical data signal with the second optical data signal. An output of the polarizing beam combiner may be configured to be communicatively coupled via an optical transmission medium to a polarization-insensitive receive assembly. | 10-24-2013 |
20130271822 | ATHERMAL DQPSK AND/OR DPSK DEMODULATOR - In some example embodiments, a demodulator may include an input polarization beam splitter (IPBS), input half waveplate (IHWP), cubical polarization beam splitter (CPBS), first reflector (R | 10-17-2013 |
20130235542 | 3-D INTEGRATED PACKAGE - In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes. | 09-12-2013 |
20130208745 | HEAT-SWAP DEVICE AND METHOD - A TOSA can include: a light emitting element; and one or more heating elements thermally coupled to the light emitting element so as to provide a substantially constant heat generation profile and/or temperature profile across the TOSA during a light emitting element dormant period and a light emitting element firing period. The TOSA can include a controller operably coupled with the one or more heating elements so as to control the substantially constant heat generation profile and/or temperature profile. In one aspect, the one or more heating elements can include one or more dedicated heating elements. In one aspect, the one or more of the dedicated heating elements can include a resistor element or coil. | 08-15-2013 |
20130200930 | INTEGRATED POWER SUPPLY FOR FIBER OPTIC COMMUNICATION DEVICES AND SUBSYSTEMS - An example embodiment includes a fiber optic integrated circuit (IC). The fiber optic IC includes an integrated power supply. The integrated power supply includes a filter, an active switch, and a pulse width modulator (“PWM”). The filter is configured to convert a signal to an output signal of the integrated power supply. The active switch is configured to control introduction of the signal to the filter. The PWM is configured to generate a PWM output signal that triggers the active switch. | 08-08-2013 |
20130200250 | SYSTEM AND METHOD OF ELECTROMAGNETIC RADIATION CONTROL - A method of compensating for electromagnetic radiation. The method may include measuring electromagnetic radiation emanating from circuitry at a first frequency and adjusting at least one of the electrical settings of the circuitry based on the measurement of the electromagnetic radiation to reduce the electromagnetic radiation at the first frequency emanating from the circuitry. | 08-08-2013 |
20130194000 | ELECTROMAGNETIC RADIATION DISSIPATING DEVICES - Electromagnetic radiation (“EMR”) dissipating devices. One example embodiment includes an electrical circuit including an EMR source configured to generate an output signal at an operating bit rate. The output signal may include an EMR component. The electrical circuit may also include an EMR dissipating device electrically coupled to the EMR source and configured to have a resonance frequency corresponding to the operating bit rate. | 08-01-2013 |
20130182390 | THERMALLY CONDUCTIVE FLEXIBLE MEMBER FOR HEAT TRANSFER - An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and to contact the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly. | 07-18-2013 |
20130178090 | LATCHING MECHANISM FOR A MODULE - One embodiment includes a latching mechanism having a latch, a cam and a slider. The cam is configured to rotate about an axis of rotation. The cam is also configured to displace an end of the latch when the cam is rotated about the axis of rotation. The slider is operably connected to the cam and is configured to cause the cam to rotate about the axis of rotation. | 07-11-2013 |
20130177320 | MULTI-LASER TRANSMITTER OPTICAL SUBASSEMBLY FOR OPTOELECTRONIC MODULES - A multi-laser transmitter optical subassembly may include N number of lasers, where each laser is configured to generate an optical signal with a unique wavelength. The transmitter optical subassembly may further include a focusing lens and a filter assembly. The filter assembly may combine the optical signals into a combined signal that is received by the focusing lens. The filter assembly may include N−1 number of filters. Each of the filters may pass at least one of the optical signals and reflect at least one of the optical signals. The filters may be low pass filters, high pass filters, or a combination thereof. | 07-11-2013 |
20130177272 | Systems And Methods For Reducing Off-Axis Optical Aberrations In Wavelength Dispersed Devices - Through its higher refractive index, a silicon grism can be used to reduce the Described herein are systems and methods for reducing optical aberrations in an optical system to decrease polarization dependent loss. Embodiments are provided particularly to define beam trajectories through an optical switching system which reduce off-axis aberrations. In one embodiment, a silicon grism is provided for reducing the curvature of the focal plane at an LCOS device in a wavelength selective switch (WSS) such that the separated polarization states converge at the LCOS at substantially the same point along the optical axis for all wavelengths. In this embodiment, an axial offset at the LCOS device will not produce large PDL at the coupling fibers. In another embodiment, a coupling lens having an arcuate focusing region is provided to address an offset in the optical beams, such that the separated polarization states couple symmetrically to respective output fibers. | 07-11-2013 |
20130163917 | OPTICAL SUBASSEMBLY WITH AN EXTENDED RF PIN - An optical subassembly (OSA) with an extended radio frequency (RF) pin. In one example embodiment, an OSA includes a header, a metallic ring, an RF insulator eyelet, and an RF pin. The header defines an insulator opening and includes an internal header surface. The metallic ring extends above the internal header surface and includes a metallic ring inner diameter substantially equivalent to a diameter of the insulator opening. The RF insulator eyelet is positioned partially in the insulator opening and partially in the metallic ring and defines an RF pin opening. The RF pin is positioned in the RF pin opening and extends through the insulator opening and the metallic ring. | 06-27-2013 |
20130156418 | CHIP ON FLEX OPTICAL SUBASSEMBLY - One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit. | 06-20-2013 |
20130148984 | MODULAR DEVICE FOR AN OPTICAL COMMUNICATION MODULE - A modular device for an optical communication module configured to be coupled to an optical transmission medium. The modular device may include a first edge and a second edge and N number of electrical circuit channels between the first and second edges. Each electrical circuit channel may include at least one element configured to provide functionality for communicating optical signals through the optical transmission medium. The modular device may also have a width between the first and second edges so that each of the N number of electrical circuit channels of C number of modular devices aligns with one of P number of interface channels of an opto-electrical interface configured to be coupled to the optical transmission medium when C equals P/N and C is a whole number greater than zero. | 06-13-2013 |
20130148978 | CHIP IDENTIFICATION PADS FOR IDENTIFICATION OF INTEGRATED CIRCUITS IN AN ASSEMBLY - Chip identification pads for identification of integrated circuits in an assembly. In one example embodiment, an integrated circuit (IC) assembly includes a controller, a plurality of ICs, a shared communication bus connecting the controller to the plurality of ICs and configured to enable communication between the controller and each of the plurality of ICs, and a set of one or more chip identification pads formed on each IC. Each set of chip identification pads has an electrical connection pattern. The electrical connection pattern of each set is distinct from the electrical connection pattern on every other set. Each distinct electrical connection pattern represents a unique identifier of the corresponding IC thereby enabling the controller to distinguish between the ICs. | 06-13-2013 |
20130142490 | ELECTROMAGNETIC RADIATION SHIELD FOR AN ELECTRONIC MODULE - An electromagnetic radiation shield for an electronic module. In one example embodiment, an EMR shield for an electronic transceiver module includes a conductive carrier sized and configured to surround a shell of an electronic transceiver module. The conductive carrier defines a plurality of extended elements located on at least one edge of the conductive carrier and an orientation element. Each extended element is configured to bias against the shell in order to create a physical and electrical contact between the conductive carrier and the shell. The orientation element is configured to engage a corresponding structure in the shell in order to correctly orient the conductive carrier with respect to the shell. | 06-06-2013 |
20130129340 | DUAL OPTICAL ELECTRICAL CONVERSION MODULE - In an embodiment, a dual optical-electrical conversion (DOEC) module is described that includes an optical host interface, an optical network interface, and an integrated circuit. The optical host interface includes an optical transmitter and an optical receiver. The optical network interface includes an optical transmitter and an optical receiver. The integrated circuit conditions electrical signals communicated between the optical host interface and optical network interface. Optical signals received at and transmitted by the optical host interface may have different parameter requirements than optical signals received at and transmitted by the optical network interface, such as such as different wavelength parameters and/or fiber link length parameters. | 05-23-2013 |
20130094797 | Optical Transmitter With Tunable Chirp - An optical transmitter with chirp control includes an input polarizer having an input that receives an optical signal. The input polarizer polarizes the optical signal along an input polarization axis. A Mach-Zehnder modulator includes an optical input that is coupled to an output of the input polarizer and an electrical input that receives a modulation signal. The Mach-Zehnder modulator modulates the optical signal with the modulation signal. The input polarization axis of the input polarizer is chosen to achieve a desired chirp of the modulated optical signal. An output polarizer is coupled to the output of the Mach-Zehnder modulator. The output polarizer polarizes the modulated optical signal along a desired output polarization axis that combines TE and TM mode polarizations. | 04-18-2013 |
20130094153 | ELECTROMAGNETIC RADIATION SHIELDING ON A PCI EXPRESS CARD - An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening. | 04-18-2013 |
20130077254 | COMMUNICATION MODULE ASSEMBLY WITH HEAT SINK AND METHODS OF MANUFACTURE - A communication assembly can include: a module device; a cage having a body defining a first open end that is configured to receive the module device therethrough and the body defining one or more first receiver members between the first end and a second end opposite of the first end, the one or more first receiver members having a first part of fastening system (e.g., two-part fastening system); and a heat sink adapted to be received into the cage so as to be thermally coupled with the module device, the heat sink having a body defining one or more second receiver members configured to receive the one or more first receiver members, the one or more second receiver members having a second part of the fastening system that couples with the first part of the fastening system. | 03-28-2013 |
20130070326 | Polarization-Independent LCOS Device - Described herein is an optical phase modulator ( | 03-21-2013 |
20130057313 | PULSE VOLTAGE AGE ACCELERATION OF A LASER FOR DETERMINING RELIABILITY - A method of accelerating the aging of a laser to thereby determine the reliability of the laser. The method includes an act of providing a laser die for reliability testing, an act of applying a plurality of short signal pulses to the laser die so as to simulate the aging of the laser die, and an act of ascertaining the reliability of the laser die based on its response to the plurality of short signal pulses. | 03-07-2013 |
20130044985 | OPTICAL NETWORK UNIT TRANSCEIVER - In one example embodiment, a pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device. | 02-21-2013 |
20130001410 | MULTICHANNEL RF FEEDTHROUGHS - Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion. | 01-03-2013 |
20120328291 | Optical Wavelength Selective Switch Calibration System - Described herein are systems and methods of enhancing channel bandwidth in an optical system having a number of wavelength selective switching (WSS) devices. The method includes the steps of passing the optical signals through the WSS devices by: (i) spatially dispersing the wavelength channels of the optical signals; (ii) projecting the spatially dispersed channels onto corresponding predetermined regions of an optical manipulation matrix including a plurality of individually addressable manipulating elements; (iii) determining a modification function that specifies a state for each manipulating element within the predetermined region; and (iv) driving the elements of the corresponding regions at states specified by the function to selectively modify the channel band shape such that the received channel's bandwidth is substantially enhanced, and to spatially direct the wavelength channels to predetermined output ports of the WSS devices. | 12-27-2012 |
20120322184 | BAND OFFSET IN ALINGAP BASED LIGHT EMITTERS TO IMPROVE TEMPERATURE PERFORMANCE - Methods for improving the temperature performance of alInGaP based light emitters. Nitrogen is added to the quantum wells in small quantities. Nitrogen is added in a range of about 0.5 percent to 2 percent. The addition of nitrogen increases the conduction band offset and increases the separation of the indirect conduction band. To keep the emission wavelength in a particular range, the concentration of In in the quantum wells may be decreased or the concentration of Al in the quantum wells may be increased. Because the depth of the quantum wells in the valence band is more than is required although the addition of nitrogen reduces the depth of the quantum wells in the valence band. The net result is an increase in the conduction band offset and an increase in the separation of the indirect conduction band. | 12-20-2012 |
20120318573 | ELECTROMAGNETIC SHIELDING CONFIGURATION - An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface. | 12-20-2012 |
20120315032 | EYE SAFETY MECHANISM FOR USE IN OPTICAL CABLE WITH ELECTRICAL INTERFACES - An eye safety mechanism for use with a bi-directional data cable having an electrical interface at at least one (but potentially both) ends, despite the fact that the cable communicates over much of its length using a bi-directional optical channel. Upon power-up, the eye safety mechanism determines whether or not a loss of signal condition is present on an optical receive channel of the bi-directional data cable. If the loss of signal is present, the mechanism intermittently disables the optical transmit channel of the bi-directional data cable. On the other hand, if the loss of signal is not present, the mechanism enables the optical transmit channel of the bi-directional data cable without intermittently disabling transmission at least for most of the time until the next time a loss of signal is detected on the optical receive channel. | 12-13-2012 |
20120301154 | SEMICONDUCTOR-BASED OPTICAL TRANSCEIVER - A semiconductor-based optical transceiver. The optical transceiver includes a post-amplifier that may communicate with an optoelectronic transducer, an electro-optic transducer driver that may communicate with an electro-optic transducer, and a control module that controls the operation of the post-amplifier and electro-optic transducer driver. The control module, the post-amplifier, and the electro-optic transducer driver are integrated in a single integrated circuit (IC) that does not require a printed circuit board for interconnecting these components of the optical transceiver. | 11-29-2012 |
20120281982 | Optical Channel Monitor - Described herein is an optical channel monitor ( | 11-08-2012 |
20120281724 | Tuneable Laser Source - Described herein is a laser ( | 11-08-2012 |
20120281234 | DELAY LINE INTERFEROMETER MULTIPLEXER - In an embodiment, a delay line interferometer (DLI) multiplexer (MUX) includes a first stage and a second stage. The first stage includes a first DLI and a second DLI. The first DLI includes a first left input, a first right input, and a first output and has a free spectral range (FSR) that is about four times a nominal channel spacing. The second DLI includes a second left input, a second right input, and a second output and has an FSR that is about four times the nominal channel spacing. The second stage is coupled to the first stage and includes a third DLI. The third DLI includes a third left input optically coupled to the first output, a third right input optically coupled to the second output, and a third output. An FSR of the third DLI is about two times the nominal channel spacing. | 11-08-2012 |
20120275120 | LATCHING MECHANISMS FOR PLUGGABLE ELECTRONIC DEVICES - Latching mechanisms for pluggable electronic devices. In one example embodiment, a latching mechanism includes a driver and a follower. The driver is configured to rotate about an axis between a latched positioned and an unlatched position. The follower is operably connected to the driver and configured to slide axially along an electronic device toward the driver as the driver is rotated from the unlatched position to the latched position and slide axially along the electronic device away from the driver as the driver is rotated from the latched position to the unlatched position. | 11-01-2012 |
20120270346 | ASYMMETRIC DBR PAIRS COMBINED WITH PERIODIC AND MODULATION DOPING TO MAXIMIZE CONDUCTION AND REFLECTIVITY, AND MINIMIZE ABSORPTION - Methods for fabricating an optical device that exhibits improved conduction and reflectivity, and minimized absorption. Steps include forming a plurality of mirror periods designed to reflect an optical field having peaks and nulls. The formation of a portion of the plurality of minor periods includes forming a first layer having a thickness of less than one-quarter wavelength of the optical field; forming a first compositional ramp on the first layer; and forming a second layer on the compositional ramp, the second layer having a different index of refraction than the first layer and having a thickness such that the nulls of the optical field occur within the second layer and not within the compositional ramp, and wherein forming the second layer further comprises heavily doping the second layer at a location of the nulls of the optical field. | 10-25-2012 |
20120269523 | OPTICAL DIFFERENTIAL PHASE-SHIFT KEYED SIGNAL DEMODULATOR - A phase-shift keyed signal demodulator and method for demodulating is disclosed. An example demodulator includes N filters that receive inputs from a splitter and include transmission functions offset from one another. N pairs of photodiodes receive the transmitted and reflected beams from each filter and a decoder converts the outputs of the pairs of photodiodes to one or more data symbols. | 10-25-2012 |
20120251130 | THERMAL CHIRP COMPENSATION IN A CHIRP MANAGED LASER - Thermal chirp compensation in a chirp managed laser. In one example embodiment, a laser package including a laser and an optical spectrum reshaper configured to convert frequency modulated optical signals from the laser into an amplitude modulated optical signals is provided. A thermal chirp compensation device is in communication with the laser package and a laser driver. The thermal chirp compensation device includes means for generating bias condition and temperature specific thermal chirp compensation signals that each corresponds to a predetermined level of thermal chirp that is induced in the laser by operating the laser at a particular bias condition and temperature. | 10-04-2012 |
20120243866 | FAULT ANALYSIS AND MONITORING APPLICATIONS USING OUT-OF-BAND BASED MODULES - One example embodiment includes a testing device. The testing device comprises a signal reception element, an out-of-band detector and testing logic. The signal reception element is configured to receive a physical layer signal from a communication module via a physical link and to produce an incoming double modulated signal, the incoming double modulated signal including a high-speed data signal and an out-of-band data signal. The out-of-band data signal comprises diagnostic data of the communication module. The out-of-band detector is coupled to the signal reception element and is configured to extract the out-of-band data signal from the incoming double modulated signal. The testing logic is coupled to the out-of-band detector and is configured to extract and analyze the diagnostic data from the out-of-band data signal. | 09-27-2012 |
20120236892 | LASERS WITH INGAAS(P) QUANTUM WELLS WITH INDIUM INGAP BARRIER LAYERS WITH REDUCED DECOMPOSITION - A method for preparing a VCSEL can use MBE for: growing a first conduction region over a first mirror region; growing an active region over the first conduction region opposite of the first mirror region, including: (a) growing a quantum well barrier having In | 09-20-2012 |
20120236891 | LASERS WITH QUANTUM WELLS HAVING HIGH INDIUM AND LOW ALUMINUM WITH BARRIER LAYERS HAVING HIGH ALUMINUM AND LOW INDIUM WITH REDUCED TRAPS - A VCSEL can include: one or more quantum wells having (Al)InGaAs; two or more quantum well barriers having Al(In)GaAs bounding the one or more quantum well layers; and one or more transitional monolayers deposited between each quantum well layer and quantum well barrier, wherein the quantum wells, barriers and transitional monolayers are substantially devoid of traps. The one or more transitional monolayers include GaP, GaAs, and/or GaAsP. Alternatively, the VCSEL can include two or more transitional monolayers of AlInGaAs with a barrier-side monolayer having lower In and higher Al compared to a quantum well side monolayer that has higher In and lower Al. | 09-20-2012 |
20120213243 | VERTICAL CAVITY SURFACE EMITTING LASER WITH UNDOPED TOP MIRROR - A VCSEL with undoped top mirror. The VCSEL is formed from an epitaxial structure deposited on a substrate, and a periodically doped conduction layer is coupled to the undoped top minor. A periodically doped spacer layer is coupled to an active region. An undoped bottom minor coupled to the periodically doped spacer layer. A first intracavity contact is coupled to the periodically doped conduction layer and a second intracavity contact is coupled to the periodically doped spacer layer. | 08-23-2012 |
20120205521 | DUAL-POLARIZATION QPSK DEMODULATOR - In an embodiment, a DP-QPSK demodulator includes first, second and third polarization beam splitters (“PBSs”) and first, second and third half waveplates (“HWPs”). The first HWP is positioned to receive an output of the first PBS. The second PBS is positioned to receive an output of the first HWP. The second HWP is positioned to receive an output of the second PBS. The third PBS is positioned to receive an output of the second HWP. The third HWP is positioned to receive an output of the third PBS. | 08-16-2012 |
20120189323 | MULTI-LASER TRANSMITTER OPTICAL SUBASSEMBLY - Multi-laser transmitter optical subassembly (TOSAs) for an optoelectronic module. In one example embodiment, a method of fabricating a multi-laser TOSA includes various acts. First, first and second optical signals are transmitted from first and second lasers, respectively. Next, the angle of a first minor actively adjusted to reflect the first optical signal toward a first filter that reflects the first optical signal and transmits the second optical signal such that the first and second optical signals are aligned and combined. | 07-26-2012 |
20120189314 | MULTI-LASER TRANSMITTER OPTICAL SUBASSEMBLY - Multi-laser transmitter optical subassembly (TOSA). In one example embodiment, a method of fabricating a multi-laser TOSA includes various acts. First, first and second optical signals are transmitted from first and second lasers, respectively. Next, the angle of a first collimating lens is actively adjusted to cause the second optical signal to be aligned with the first optical signal as the first optical signal passes through a first filter and as the second optical signal is reflected by the first filter such that the first and second optical signals are aligned and combined. | 07-26-2012 |
20120189306 | MULTI-LASER TRANSMITTER OPTICAL SUBASSEMBLIES FOR OPTOELECTRONIC MODULES - Multi-laser transmitter optical subassemblies (TOSAs) for optoelectronic modules. In one example embodiment, a multi-laser TOSA includes first and second lasers configured to generate first and second optical signals, respectively, a polarization beam combiner (PBC), first and second collimating lenses positioned between the first and second lasers, respectively, and the PBC, a half waveplate positioned between the first laser and the PBC, and a focusing lens. The half waveplate is configured to rotate the polarization of the first optical signal. The PBC is configured to combine the first and second optical signals and transmit the combined first and second optical signals toward the focusing lens. | 07-26-2012 |
20120183300 | OPTICAL NETWORK UNIT TRANSCEIVER MODULE HAVING DIRECT CONNECT RF PIN CONFIGURATION - Methods for providing a direct connect RF pin configuration for an ONU transceiver module to connect directly to an external component. The ONU module communicates with an optical network. The ONU module further includes an RF interface and a direct connect RF pin configuration to communicate using RF signals. In one embodiment, the direct connect RF pin configuration includes two ground pins and a data pin which are spaced apart and directly connected to a PCB of the ONU. The opposing ends of the pins are directly connected to a PCB of an external component, such as an ONU host box. The pins are thus spaced apart such that they do not impede each others' function and available for direct connection to the external component. | 07-19-2012 |
20120148198 | COMMUNICATIONS MODULE INTEGRATED BOOT AND RELEASE SLIDE - One embodiment includes communications module having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is disposed over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable. | 06-14-2012 |
20120120851 | PROTOCOLS FOR OUT-OF-BAND COMMUNICATION - Methods for managing an optical network through out-of-band communication between optical transceiver modules in a heterogeneous network fabric are disclosed. The disclosed methods include methods for performing fabric discovery, communicating error messages, detecting intrusion. Methods are also disclosed for communicating between transceivers of differing protocol versions and memory capacity. | 05-17-2012 |
20120120407 | Optical Coherence Tomography System And Method - A method of analysis of a sample, including the steps of: (a) splitting an input optical beam into a probe beam and reference beam; (b) utilizing the probe beam to interrogate a sample and obtaining a return sample beam there from; (c) manipulating the reference beam into a predetermined polarization state; (d) mixing the return sample beam and reference beam producing a series of mixed beams; and (e) analyzing the polarization components of the series of mixed beams. | 05-17-2012 |
20120082450 | MONOLITHIC POWER MONITOR AND WAVELENGTH DETECTOR - Monolithic single and/or dual detector structures are fabricated on the emitting surface of a VCSEL and/or on a lens or glass substrate configured to be positioned along the axis of emission of an optical light source. Each monolithic detector structure includes one or two PIN detectors fabricated from amorphous silicon germanium with carbon doping or amorphous germanium with hydrogen doping. The monolithic detectors may additionally include various metallization layers, buffer layers, and/or anti-reflective coatings. The monolithic detectors can be grown on 1550 NM VCSELs used in optical transmitters, including lasers with managed chirp and TOSA modules, to reduce power and real estate requirements of the optical transmitters, enabling the optical transmitters to be implemented in long-reach SFP+ transceivers. | 04-05-2012 |
20120076505 | THERMAL MANAGEMENT OF A LOCKER ETALON IN A TRANSMITTER OPTICAL SUBASSEMBLY - Thermal management of a locker etalon in a transmitter optical subassembly (TOSA). In one example embodiment, a TOSA includes a case, a laser positioned within the case and electro-thermally connected to the case, a locker etalon positioned in the case and thermally connected to the case, and a thermoelectric cooler (TEC) positioned within the case and in thermal contact with both the laser and the locker etalon. | 03-29-2012 |
20120057879 | DISCRETE BOOTSTRAPPING IN AN OPTICAL RECEIVER TO PREVENT SIGNAL FEEDBACK - An optical receiver assembly that is configured to avoid the introduction of feedback in an electrical signal converted by the assembly is disclosed. In one embodiment, an optical receiver assembly is disclosed, comprising a capacitor, an optical detector provided with a power supply being mounted on a top electrode of the capacitor, and an amplifier mounted on the reference surface. The assembly further includes an isolator interposed between the reference surface and the capacitor, wherein the isolator includes a bottom layer of dielectric material that is affixed to a portion of the reference surface, and a metallic top plate that is electrically coupled both to a ground of the amplifier and to the capacitor. This configuration bootstraps the amplifier ground to the amplifier input via the photodiode top electrode of the capacitor to cancel out feedback signals present at the amplifier ground. | 03-08-2012 |
20120057821 | ACTIVE OPTICAL CABLE - Integrated cables are disclosed that can include a first optical fiber for optical communication over the length of the integrated cables from a first connector at a first end to a second connector at a second end. The integrated cable can further include a second electrical connector configured to connect with a second electrical port external to the integrated cable. The integrated cable can further include an electrical conductor extending from the first electrical connector to the second electrical connector and configured to supply operating power to an electronic device connected to the second electrical connector but external to the integrated cable. | 03-08-2012 |
20120039572 | ELECTRONIC MODULE HAVING MULTIPLE FLEX CIRCUIT CONNECTORS - In one example embodiment, an electronic module comprises a plurality of components and flex circuit connectors each electrically connected to respective components of the electronic module. The electronic module may be an optical subassembly of an optical transceiver. Moreover, one of the flex circuit connectors may be physically connected to another of the flex circuit connectors. | 02-16-2012 |
20120033979 | OPTOELECTRONIC COMMUNICATIONS ASSEMBLY HAVING AN ELECTRICAL AND OPTICAL INTERFACE - In one example embodiment, an optoelectronic communications assembly having an optical receiver or an optical transmitter includes an optical interface disposed at an end thereof and through which optical signals are communicated by the optical receiver or optical transmitter. The optoelectronic communications assembly also includes an electronic component and a first electrical interface disposed at the optical interface end of the optical communications assembly and communicatively coupled to the electronic component. | 02-09-2012 |
20120032752 | VERTICAL QUASI-CPWG TRANSMISSION LINES - In one example embodiment, a coplanar waveguide signal transition element transitions high-speed signals between vertically stacked coplanar waveguide transmission lines. The signal transition element comprises one or more dielectric layers and a plurality of electrically conductive vias extending through at least a portion of the one or more dielectric layers. The vias include one or more signal vias and one or more ground vias that are configured to transition signals between the vertically stacked coplanar waveguide transmission lines. The signal transition element also comprises a ground plane disposed within the one or more dielectric layers and electrically coupled to the one or more ground vias. The ground plane has one or more openings through which the one or more signal vias respectively pass. | 02-09-2012 |
20120026697 | THUMBSCREW FOR PLUGGABLE MODULES - In one example, a pluggable module comprises a shell, a module connector, and one or more thumbscrews. The shell defines a cavity within which a PCB and one or more components are disposed and includes a front, back, first side, and second side. The module connector is operatively connected to the PCB near the back of the shell and extends from within the cavity to outside the shell through an opening defined in the back of the shell. The module connector is configured to operatively couple the pluggable module to a host device. The thumbscrews are housed within one or more portions of the shell and are configured to threadably secure the pluggable module to the host device. Each of the thumbscrews comprises a torque limiter. The pluggable module can further comprise protecting means for protecting a portion of the module connector extending outside the cavity from damage. | 02-02-2012 |
20120020674 | STATUS LINK FOR MULTI-CHANNEL OPTICAL COMMUNICATION SYSTEMS - A robust and redundant status link is established by a first multi-channel optoelectronic device with a second multi-channel optoelectronic device in a multi-channel communication link. Transmitter bias currents are effectively modulated with a status link modulation signal representative of status data and subsequently modulated with primary data modulation signals. The resulting signals are transformed into optical signals and transmitted over the link as main communication links combined with a status link. At the second device, the optical signals are received and converted to electrical signals. The receipt of the optical signals creates multiple receiver bias currents, which may be monitored to detect the status link modulation signal. The second device may adjust various operating parameters in response to the information conveyed by the status link. For instance, devices can use status links to operate above nominal eye safety limits and/or to adjust transmit power to compensate for degradation effects. | 01-26-2012 |
20120007689 | EMI TRAP USING MICROWAVE CIRCUIT - In one example embodiment, a transmitter comprises a first component coupled to receive a signal for transmission and a second component communicatively coupled to the first component to transmit the signal over a transmission medium. The transmitter further comprises a planar transmission line formed on a substrate and disposed between the first and second components to couple the signal from the first component to the second component. The planar transmission line includes a first transmission line element formed on the substrate and configured to suppress radiation of EMI at a predetermined frequency. | 01-12-2012 |
20110318000 | OPTICAL BUS - An optical bus. Optical sub-assemblies are used to connect lengths of optical fiber to form a single optical fiber that is a bus. A master transceiver may be connected to one end of the fiber and nodes can be connected to the optical sub-assemblies. Each optical sub-assembly includes a center fiber with a mirror that enables each connector to reflect optical signals out of the fiber and that enables a node to launch optical signals on the optical bus. The optical bus can also be connected with a second transceiver that may be used to deliver optical power to the attached nodes. Some nodes include two optical subassemblies to enable bidirectional communication on the optical bus. | 12-29-2011 |
20110311230 | OPTICAL BUS - An optical bus. Optical sub-assemblies are used to connect lengths of optical fiber to form a single optical fiber that is a bus. A master transceiver may be connected to one end of the fiber and nodes can be connected to the optical sub-assemblies. Each optical sub-assembly includes a center fiber with a mirror that enables each connector to reflect optical signals out of the fiber and that enables a node to launch optical signals on the optical bus. The optical bus can also be connected with a second transceiver that may be used to deliver optical power to the attached nodes. Some nodes include two optical subassemblies to enable bidirectional communication on the optical bus. | 12-22-2011 |
20110306156 | SURFACE GRATINGS ON VCSELS FOR POLARIZATION PINNING - Methods for manufacturing a polarization pinned vertical cavity surface emitting laser (VCSEL). Steps include growing a lower mirror on a substrate; growing an active region on the lower mirror; growing an upper mirror on the active region; depositing a grating layer on the upper minor; and etching a grating into the grating layer. | 12-15-2011 |
20110305454 | OPTICAL TRANSCEIVERS WITH CLOSED-LOOP DIGITAL DIAGNOSTICS - Systems and methods for performing closed-loop diagnostics in optical transceiver. The TOSA of an optical receiver includes a primary transmit module and a secondary receiver module. The transmit module transmits a data signal to a ROSA of another optical transceiver. The ROSA has a secondary transmit module that can transmit a diagnostic data signal back to the secondary receiver module of the TOSA. The TOSA can use the diagnostic data received from the ROSA to automatically adjust itself and perform closed-loop feedback functions. The closed loop diagnostics can be implemented in a network where one transceiver may be connected with more than one other transceiver in a multi-node configuration. | 12-15-2011 |
20110293285 | TRANSCEIVER MODULE AND INTEGRATED CIRCUIT WITH DUAL EYE OPENERS - A transceiver module having integrated eye diagram opening functionality for reducing jitter is described. The transceiver module may include a transmitter eye opener and a receiver eye opener integrated in a single circuit. The transceiver module may also include serial control and various other integrated components. Other functionalities that may be integrated on the transceiver module include loopback modes, bypass features, bit error rate testing, and power down modes. | 12-01-2011 |
20110267742 | LATCHING MECHANISM FOR AN ELECTRONIC MODULE - Latching mechanisms for electronic modules. In one example embodiment, a latching mechanism for an electronic module includes a latch, a latch return spring, and a release slide. The latch is configured to rotate between a latched position and an unlatched position. The latch includes a latch arm on a first end of the latch and an engagement pin on a second end of the latch. The latch return spring is configured to bias the latch in the latched position. The release slide includes a slide ramp. The slide ramp is configured to engage the latch arm as the release slide is slid away from the engagement pin, which causes the latch to rotate from the latched position to the unlatched position. | 11-03-2011 |
20110255878 | BANDPASS COMPONENT DECIMATION AND TRANSMISSION OF DATA IN CABLE TELEVISION DIGITAL RETURN PATH - A device for and a method of decreasing the data rate of a digital return path link in a Cable Television Hybrid Fiber-Coax system (CATV system) is disclosed. At the node of the CATV system, the bandwidth of the a digital data stream representative of an analog return signal is limited to a desired frequency band. The ba | 10-20-2011 |
20110229702 | REDUCING THERMAL EXPANSION EFFECTS IN SEMICONDUCTOR PACKAGES - Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature. The electronic component can be a laser. The first and second materials can be selected to disperse an optical emission from the optical transmitter. | 09-22-2011 |
20110228803 | VCSEL WITH INTEGRAL RESISTIVE REGION - In one embodiment, a VCSEL includes a plurality of semiconductor layers, an insulative region, a resistive region, and a remainder region. The semiconductor layers include a lower mirror, an active region, and an upper mirror. The active region is disposed over the lower mirror and includes a first lasing region. The upper mirror is disposed over the active region. The insulative region and the resistive region are integrally formed in the semiconductor layers. The remainder region includes the semiconductor layers except for the insulative region and the resistive region integrally formed in the semiconductor layers. The insulative region is disposed between the resistive region and the remainder region. | 09-22-2011 |
20110228483 | COMMUNICATIONS MODULE WITH A SHELL ASSEMBLY HAVING THERMAL MECHANICAL FEATURES - In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel. | 09-22-2011 |
20110200287 | CONSTRAINING BALL LENS IN AN OPTICAL SUBASSEMBLY - In one embodiment, an optical subassembly includes a housing, a ball lens, a constraining insert, and a ball lens constraint. The housing includes a fiber receptacle formed in a first end of the housing and a second receptacle formed in a second end of the housing opposite the first end. The fiber receptacle and second receptacle define a cavity through the housing from the first end to the second end of the housing. The ball lens and the constraining insert are disposed within the cavity. The ball lens constraint is configured to cooperate with the constraining insert to constrain the ball lens in three dimensions within the cavity. | 08-18-2011 |
20110194810 | REINFORCED MULTI-BODY OPTICAL DEVICES - Reinforced multi-body optical devices. In one example embodiment, a method for fabricating a reinforced multi-body optical device includes various acts. First, a supporting plate is bonded, using pressure and heat, to a multi-body optical device to form a reinforced multi-body optical device. The supporting plate has a coefficient of thermal expansion (CTE) that is within about 0.5 parts per million of the CTE of the multi-body optical device. Then, the multi-body optical device is ground to reduce the thickness of the multi-body optical device. | 08-11-2011 |
20110188867 | DQPSK DEMODULATOR - A phase shift keyed demodulator includes first and second beam splitters, a first optical path, a second optical path, and a wavelength tuner. The first beam splitter splits an input signal into first and second output signals. The second beam splitter splits each first and second output signal into a transmitted signal and a reflected signal. The first optical path includes an optical path of each transmitted signal from a beam splitting surface to a reflector and back to the beam splitting surface. The second optical path includes an optical path of each reflected signal from the beam splitting surface to a mirror surface and back to the beam splitting surface. A path difference introduces a delay between the transmitted signal and the reflected signal. The wavelength tuner tunes the demodulator to a predetermined central wavelength and introduces a phase shift between first and second transmitted signals. | 08-04-2011 |
20110182571 | OPTICAL TRANSCEIVER WITH CLOCK FOR PROVIDING MAINTENANCE AND LIFETIME INFORMATION - An optoelectronic device uses microcode to perform an end of life calculation for the optoelectronic device. In a disclosed example, the optoelectronic device senses environmental and operational parameters under changing conditions during device operation. The optoelectronic device then calculates the end of life for itself based on one or more of the sensed environmental and/or operational parameters. The calculation can be done in real time and using digital logic. The calculation can provide a result in a format which is useful to a host system with which the device is connected. The optoelectronic device may automatically shut itself down upon reaching its calculated end of life. | 07-28-2011 |
20110170880 | VARIABLE OPTICAL ATTENUATOR INTEGRATION INTO TRANSMITTER OPTICAL SUBASSEMBLIES - A small-scale VOA system includes a polarization rotator, a voltage multiplier circuit, and at least one transistor. The polarization rotator can be positioned within a TOSA along the emission axis of a corresponding optical signal source in addition to one or more polarizers. A microcontroller provides a first low voltage control signal to a voltage multiplier to generate a large voltage DC signal which is provided to the transistor. The transistor modulates the large voltage signal with a second control signal from the microcontroller to generate a large voltage AC signal for driving the polarization rotator. The polarization rotation of the polarization rotator can be altered depending on the applied large-voltage AC signal. As a result, the polarization rotator and one or more polarizers can variably attenuate signals emitted by the optical signal source or act as a shutter. | 07-14-2011 |
20110110669 | OPTICAL TRANSCIEVER - An optical transceiver for detecting an incoming light beam and for transmitting an outgoing light beam along a common optical axis is provided. Such an optical transceiver provides a compact optical transceiver that is suitable for a wide variety of applications. | 05-12-2011 |
20110096803 | ASYMMETRIC DBR PAIRS COMBINED WITH PERIODIC AND MODULATION DOPING TO MAXIMIZE CONDUCTION AND REFLECTIVITY, AND MINIMIZE ABSORPTION - An optical device for improving conduction and reflectivity and minimizing absorption. The optical device includes a first mirror comprising a first plurality of mirror periods designed to reflect an optical field at a predetermined wavelength, where the optical field has peaks and nulls. Each of the plurality of mirror periods includes a first layer of having a high carrier mobility, a second layer having lower carrier mobility, and a first compositional ramp between the first and second layers. The thicknesses of the first and second layers for at least a portion of the first plurality of mirror periods are established such that the nulls of the optical field occur within the first layer and not within the compositional ramp. At least the portion of the first layers within the first plurality of mirror periods include elevated doping concentrations at locations of the nulls of the optical field. | 04-28-2011 |
20110091219 | LASER DRIVERS FOR CLOSED PATH OPTICAL CABLES - Simplified laser drivers for closed path digital optical cables and digital optical cables including the simplified laser drivers. The laser driver can include less transistors than conventional laser drivers for optical communication cables. The laser can include a bias source and modulation source. The bias source can have a single constant current bias point for all laser diodes. The modulation current source can have a single temperature coefficient for all laser diodes. The laser driver can exclude, for example, any one of or combination of temperature compensation of the modulation or bias current sources, external programming of the modulation or bias current sources, power control based on output of the laser diode, and/or control based on feedback received from a monitor device or other sensor within the cables. | 04-21-2011 |
20110090930 | VERTICAL CAVITY SURFACE EMITTING LASER WITH UNDOPED TOP MIRROR - A VCSEL with undoped top mirror. The VCSEL is formed from an epitaxial structure deposited on a substrate. A doped bottom mirror is formed on the substrate. An active layer that includes quantum wells is formed on the bottom mirror. A periodically doped conduction layer is formed on the active layer. The periodically doped conduction layer is heavily doped at locations where the optical energy is at a minimum when the VCSEL is in operation. A current aperture is used between the conduction layer and the active region. An undoped top mirror is formed on the heavily doped conduction layer. | 04-21-2011 |
20110086452 | SEMICONDUCTOR HAVING ENHANCED CARBON DOPING - Methods for fabricating semiconductors with enhanced strain. One embodiment includes fabrication of a semiconductor device with an epitaxial structure. The epitaxial structure is formed with one or more semiconductor layers. One or more of the layers includes a dopant including small quantities of Al and repeated delta doping during expitaxial growth to form periods where surfaces are group III rich. | 04-14-2011 |
20110081120 | OPTICAL SUBASSEMBLY GROUNDING IN AN OPTOELECTRONIC MODULE - Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module. | 04-07-2011 |
20110081119 | SIMPLIFIED AND SHORTENED PARALLEL CABLE - One embodiment includes a connector comprising a connector housing, a ferrule, and a crimp ring. The connector housing has inner and outer surfaces extending between forward and rear ends of the connector housing. The inner surfaces defined a passageway extending lengthwise between the forward and rear ends. The connector housing includes at least one protrusion formed on one of the outer surfaces that is configured to engage a corresponding connector engaging structure of an alignment guide to secure the connector housing within the alignment guide. The ferrule is configured to mount upon end portions of a plurality of optical fibers of a multi-fiber communication cable. The ferrule is disposed partially within the passageway. The crimp ring encompasses the rear end of the connector housing and is configured to secure the connector to the multi-fiber communication cable. | 04-07-2011 |
20110081114 | COMMUNICATIONS MODULE INTEGRATED BOOT AND RELEASE SLIDE - One embodiment includes an integrated boot and release slide having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is overmolded over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable. | 04-07-2011 |
20110080008 | LATCHING MECHANISM FOR A MODULE - One embodiment includes a latching mechanism having a latch, a cam and a slider. The cam is configured to rotate about an axis of rotation. The cam is also configured to displace an end of the latch when the cam is rotated about the axis of rotation. The slider is operably connected to the cam and is configured to cause the cam to rotate about the axis of rotation. Some embodiments also include a retaining cover and a boot. The retaining cover secures a second end of the latch to a module in which the latching mechanism is implemented. The boot is operatively connected to the slider and can be manipulated by a user to activate the slider. | 04-07-2011 |
20110076032 | HIGH-SPEED SPECTRAL GAIN OFFSET OPTICAL TRANSMITTER - In one example, a DFB laser includes a substrate, an active region, and a grating. The active region is formed above the substrate and is designed to emit light having a gain peak wavelength. The grating is formed above the active region and is designed to provide optical feedback for light having a lasing peak wavelength. The gain peak wavelength is longer than the lasing peak wavelength and a difference between the gain peak wavelength and the lasing peak wavelength at room temperature is between 10 nm and 50 nm. | 03-31-2011 |
20110076023 | MULTICHANNEL TUNABLE OPTICAL DISPERSION COMPENSATOR - An embodiment of the invention includes a tunable optical dispersion compensator (TODC) comprising a first beam displacer on an optical path, wherein the first beam displacer separates an optical signal into a first beam and a second beam, and one or more polarizing beam splitters on the optical path, wherein the one or more polarizing beam splitters keep the first beam and the second beam on the optical path. The TODC also comprises one or more etalons on the optical path, wherein the one or more etalons are tunable to introduce a group delay in the first beam and the second beam, and a reflecting mirror on the optical path, wherein the reflecting mirror returns the optical signal back along the optical path. The TODC further comprises a second beam displacer, wherein the second beam displacer combines the first beam and the second beam into an output optical signal. | 03-31-2011 |
20110069959 | OPTICAL INTERLEAVER AND DEINTERLEAVER - Optical interleavers and deinterleavers. In one example embodiment, an optical deinterleaver includes first, second, and third filter cells interleaved with first and second waveplates. The filter cells are configured to filter optical signals propagating on first, second, and third paths of an optical loop. The optical deinterleaver also includes a retro reflector optically coupled with the filter cells and waveplates. The retro reflector is configured to reflect the optical signals between the first path and the second and third paths to form the optical loop. The optical deinterleaver further includes first, second, and third single-fiber collimators optically coupled to the first, second, and third paths of the optical loop, respectively. | 03-24-2011 |
20110064406 | ASYMMETRICAL INTERLEAVER AND DEINTERLEAVER - Asymmetrical interleavers and deinterleavers. In one example embodiment, an asymmetrical deinterleaver includes first, second, third, fourth, and fifth filter cells interleaved with first, second, third, and fourth waveplates and followed by a fifth waveplate. The filter cells are configured to filter optical signals propagating on first and second legs of an optical loop. The asymmetrical deinterleaver also includes a retro reflector optically coupled with the filter cells and waveplates. The retro reflector is configured to reflect the optical signals between the first leg and the second leg to form the optical loop. The asymmetrical deinterleaver further includes a single-fiber collimator optically coupled to the first leg of the optical loop and a dual-fiber collimator optically coupled to the second leg of the optical loop. | 03-17-2011 |
20110062312 | OPTOELECTRONIC SUBASSEMBLY WITH INTEGRAL THERMOELECTRIC COOLER DRIVER - Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing, and first and second substrates mounted within the housing. Also disposed within the housing is a thermoelectric cooler (TEC) thermally coupled to the first substrate. An optical transmitter is mounted on the first substrate, and thermally coupled to the TEC. A TEC driver is mounted on the second substrate and electrically coupled to the TEC. In some embodiments a thermal resistance mechanism is provided for connecting the first substrate to the second substrate. | 03-17-2011 |
20110057128 | OPTO-ISOLATOR INCLUDING A VERTICAL CAVITY SURFACE EMITTING LASER - The present invention relates to opto-isolators. Opto-isolators are disclosed that include a transmitter package and a vertical VCSEL disposed within the transmitter package. The opto-isolators further include a receiver package and a photodetector disposed within the receiver package. The photodetector is optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include an alignment package configured to receive the transmitter package and the receiver package. In another embodiment, opto-isolators include a VCSEL and a photodetector optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include a package enclosing both the VCSEL and the photodetector. | 03-10-2011 |
20110049471 | EFFICIENT CARRIER INJECTION IN A SEMICONDUCTOR DEVICE - Semiconductor devices such as VCSELs, SELs, LEDs, and HBTs are manufactured to have a wide bandgap material near a narrow bandgap material. Electron injection is improved by an intermediate structure positioned between the wide bandgap material and the narrow bandgap material. The intermediate structure is an inflection, such as a plateau, in the ramping of the composition between the wide bandgap material and the narrow bandgap material. The intermediate structure is highly doped and has a composition with a desired low electron affinity. The injection structure can be used on the p-side of a device with a p-doped intermediate structure at high hole affinity. | 03-03-2011 |
20110045621 | VERTICAL CAVITY SURFACE EMITTING LASER HAVING MULTIPLE TOP-SIDE CONTACTS - A VCSEL with undoped mirrors. An essentially undoped bottom DBR mirror is formed on a substrate. A periodically doped first conduction layer region is formed on the bottom DBR mirror. The first conduction layer region is heavily doped at a location where the optical electric field is at about a minimum. An active layer, including quantum wells, is on the first conduction layer region. A periodically doped second conduction layer region is connected to the active layer. The second conduction layer region is heavily doped where the optical electric field is at a minimum. An aperture is formed in the epitaxial structure above the quantum wells. A top mirror coupled to the periodically doped second conduction layer region. The top mirror is essentially undoped and formed in a mesa structure. An oxide is formed around the mesa structure to protect the top mirror during wet oxidation processes. | 02-24-2011 |
20110044006 | HEAT MANAGEMENT IN AN ELECTRONIC MODULE - In one example, a heat management system suitable for use in connection with an electronic module is disclosed. In a disclosed embodiment the heat management system includes a module guide configured to receive an electronic module. At least two heat sink elements are configured and arranged for movement independent of each other. At least two retention elements are configured to bias a respective heat sink element against any electronic module that is positioned within the module guide. | 02-24-2011 |
20110033049 | ENCRYPTED OPTOELECTRONIC MODULE - Methods and systems for encrypting and decrypting data are described. An exemplary system includes an optical transceiver that includes at least one of an encryption block and a decryption block. The optical transceiver also has at least one encryption and decryption key stored at the transceiver. The encryption block receives unencrypted data and performs encryption operations on the data using the encryption and decryption key. The decryption block receives encrypted data and performs a decryption operation using the encryption and decryption key. | 02-10-2011 |
20110020007 | INTER-TRANSCEIVER MODULE COMMUNICATION FOR OPTIMIZATION OF LINK BETWEEN TRANSCEIVERS - Two or more optical transceivers coupled to each other by an optical link to optimize communication over the optical link. A first transceiver generates electrical data that represents an operational parameter for optimization. The transceiver then converts the electrical data into an optical signal and transmits the optical signal over the optical link to a second transceiver. The second transceiver recovers the electrical data from the optical signal and uses the recovered electrical data to change characteristics of the optical signal transmitted by the second transceiver. | 01-27-2011 |
20110012739 | ELECTRICAL OVERSTRESS EVENT INDICATOR ON ELECTRONIC CIRCUITRY - Detecting electrical overstress events in electronic circuitry such as optical emitters. In one example embodiment, a laser includes an active area and a contact region in electrical communication with the active area. A portion of the contact region is configured to manifest a change in a visual attribute of the portion in response to exposure of the portion to an electrical overstress event. | 01-20-2011 |
20110010576 | MICROCODE CONFIGURABLE FREQUENCY CLOCK - A microcode configurable frequency clock that may be used to control the speed of high speed comparison in an operational optical transceiver. The frequency clock includes a memory and a logic circuit. The memory receives microcode generated data relating to the desired speed of comparison. The logic circuit is configured to receive an input clock signal and to produce an output clock signal by frequency dividing the input signal based on the microcode generated data. The output clock is used to control the speed of comparison in the optical transceiver. | 01-13-2011 |
20110008917 | HIGH-POWER OPTICAL BURN-IN - Semiconductor lasers are aged to identify weak or flawed devices, resulting in improved reliability of the remaining devices. The lasers can be aged using a high-power optical burn-in that includes providing a high drive current to the lasers for a period of time, and maintaining the ambient temperature of the lasers at a low temperature. After the high-power optical burn-in, the output of the lasers can be measured to determine if the lasers are operating within specifications. Those that are not can be discarded, while those that are can be further aged using a high-temperature thermal burn-in that includes providing a drive current to the lasers while maintaining the ambient temperature of the lasers at a high-temperature. | 01-13-2011 |
20110008053 | QUANTIFYING LINK QUALITY IN AN OPTOELECTRONIC MODULE - In one example embodiment, an optoelectronic module includes an optical receiver and a post-amplifier. The optical receiver is configured to receive an optical signal and generate an electrical data signal corresponding to the optical signal. The post-amplifier is electrically connected to the optical receiver and is configured to amplify the electrical data signal. The optoelectronic module further includes means for quantifying a quality of the optical signal from which the amplified electrical data signal is derived. | 01-13-2011 |
20100325324 | ELECTRICAL DEVICE WITH ELECTRICAL INTERFACE THAT IS COMPATIBLE WITH OPTICAL CABLES - A device having a plug that is configured to mechanically interface with a receptacle external to the device. The plug also has an electrical interface that electrically interfaces with the receptacle even though the external receptacle has a mechanical and electrical interface shaped to interface with an integrated cable that includes an optical communication mechanism for communicating over most of the length of the integrated cable, and even though the device itself has a full electrical communication channel communicatively coupling a data communication endpoint of the device with the electrical interface of the plug. | 12-23-2010 |
20100325298 | AUTHENTICATION MODES FOR AN OPTICAL TRANSCEIVER MODULE - Methods for authenticating an optical transceiver module to a host are disclosed. The transceiver comprises a receive signal line for transferring data from the transceiver to the host and a transmit signal line for transferring data from the host to the transceiver in preparation for transmission to a communications network. The transceiver includes a controller having a processor in communication with the host, and a first memory register assignable by the processor. A consolidated laser driver/post amplifier is also included and features a pattern generator and a data switch. The pattern generator produces a string of bit values that serve as an authenticating data portion. The data switch selectively inputs the authenticating data portion to the receive signal line of the transceiver according to the state of the first memory register, enabling the authenticating data portion to be received by the host, thereby authenticating the transceiver. | 12-23-2010 |
20100311195 | DBR Laser with Improved Thermal Tuning Efficiency - A distributed Bragg reflector (DBR) includes a base substrate and a gain medium formed on the base substrate. A waveguide positioned above the base substrate in optical communication with the gain medium and defines a gap extending between the base substrate and the waveguide along a substantial portion of the length thereof. The waveguide may have a grating formed therein. A heating element is in thermal contact with the waveguide and electrically coupled to a controller configured to adjust optical properties of the waveguide by controlling power supplied to the heating element. | 12-09-2010 |
20100296817 | ELECTROMAGNETIC RADIATION CONTAINMENT IN AN OPTOELECTRONIC MODULE - Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module. | 11-25-2010 |
20100279447 | DBR LASER WITH IMPROVED THERMAL TUNING EFFICIENCY - A distributed Bragg reflector (DBR) includes a base substrate and a gain medium formed on the base substrate. A waveguide positioned above the base substrate in optical communication with the gain medium and defines a gap extending between the base substrate and the waveguide along a substantial portion of the length thereof. The waveguide having a grating formed therein. A heating element is in thermal contact with the waveguide and electrically coupled to a controller electrically configured to adjust optical properties of the waveguide by controlling power supplied to the heating element. | 11-04-2010 |
20100258896 | PASSIVATED OPTICAL DETECTORS WITH FULL PROTECTION LAYER - In one example, an optoelectronic transducer includes a first contact, a second contact, a passivation layer, and a protection layer. The passivation layer is formed on top of the first contact and the second contact and is configured to substantially minimize dark current in the optoelectronic transducer. The protection layer is formed on top of the passivation layer and substantially covers the passivation layer. The protection layer is configured to protect the passivation layer from external factors and prevent degradation of the passivation layer. | 10-14-2010 |
20100254710 | EARLY SELF-VALIDATION OF PERSISTENT MEMORY DURING BOOT IN AN OPTICAL TRANSCEIVER - An operational optical transceiver configured to self-validate a boot image loaded from the persistent memory early in the boot process. The optical transceiver includes a persistent memory, a controller, and a system memory. The controller initializes the boot process and begins to load information from the persistent memory to the system memory. Next, the controller detects early in the boot process boot image verification data in the information being sent to the system memory. The controller then determines if the boot image verification data has an expected value. If the verification data includes the expected value, the controller continues the boot process. If the verification data does not include the expected value, the controller will retry the boot process a predetermined number of times and will enter a default operational state if the expected value is not detected while retrying the boot process the predetermined number of times. | 10-07-2010 |
20100158057 | FEEDBACK CONTROL FOR HEATED TOSA - A closed loop system for controlling laser temperature without the need for additional sensors or other hardware. Embodiments utilize an existing automatic power feedback loop and existing sensors to determine the temperature of a TOSA based on changes in laser bias current, thus avoiding the need for the additional hardware. The automatic power feedback loop will modify the laser bias current as the temperature of the TOSA changes. That is, as the temperature increases, the amount of laser bias current is increased and as the temperature decreases, the amount of laser bias current is decreased. Thus, the laser bias current may be used as feedback for the laser temperature control. Accordingly, when the transceiver module drops below a predetermined temperature, a laser heater current may be controlled to thereby maintain the same laser bias current as at the preset temperature. | 06-24-2010 |
20100149759 | THUMBSCREW FOR PLUGGABLE MODULES - In one example, a pluggable module comprises a shell, a module connector, and one or more thumbscrews. The shell defines a cavity within which a PCB and one or more components are disposed and includes a front, back, first side, and second side. The module connector is operatively connected to the PCB near the back of the shell and extends from within the cavity to outside the shell through an opening defined in the back of the shell. The module connector is configured to operatively couple the pluggable module to a host device. The thumbscrews are housed within one or more portions of the shell and are configured to threadably secure the pluggable module to the host device. Each of the thumbscrews comprises a torque limiter. The pluggable module can further comprise protecting means for protecting a portion of the module connector extending outside the cavity from damage. | 06-17-2010 |
20100142898 | BAIL RELEASE MECHANISM FOR COMMUNICATIONS MODULE - In one example, a bail release mechanism includes a bail and a de-latching member. The bail is configured to be attached to the shell of a module that includes a latch pin configured to engage a structure of a host device receptacle to secure the module within the receptacle. The bail is further configured to rotate about a first axis between a latched position and an unlatched position. The first axis is in a fixed position relative to the shell. The de-latching member is attached to the bail at a second axis that is offset from the first axis and is configured to rotate about the second axis. The second axis is movable relative to the shell. The de-latching member includes a first end configured to displace the structure of the receptacle during rotation of the de-latching member to disengage the latch pin from the structure. | 06-10-2010 |
20100135677 | Temperature Controlled Interferometer For Phase Demodulation - An interferometer includes an optical beam splitter that splits an input optical signal into a first optical signal propagating in a first optical path comprising free space and a second optical signal propagating in a second optical path comprising a dielectric medium. A differential delay delays the second optical signal relative to the first optical signal by a differential delay time that is proportional to at least one of a temperature and a refractive index of the dielectric medium. A temperature controller in thermal contact with the dielectric medium changes the temperature of the dielectric medium to control at least one of thermal expansion/contraction and a temperature dependent change in the refractive index of the dielectric medium, thereby changing the differential phase delay. An optical beam splitter/combiner optically coupled to the first and second optical paths generates a first and second interferometric optical signal having an amplitude and phase that is related to the differential delay. | 06-03-2010 |
20100132999 | ELECTROMAGNETIC SHIELDING CONFIGURATION - An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface. | 06-03-2010 |
20100129035 | OPTICAL NETWORK UNIT TRANSCEIVER - In one example embodiment, a pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device. | 05-27-2010 |
20100124418 | TRANSMISSION OF EYE INFORMATION FROM OPTO-ELECTRONIC MODULES - A method of controlling communication between transceivers includes transmitting payload data from a transmitter of a first transceiver in a data channel of a physical link to a receiver of a second transceiver, the second transceiver further including an equalizer, varying equalizer settings in the equalizer, analyzing effects of varying equalizer settings to determine transmitter diagnostic settings for the first transceiver, and transmitting the transmitter diagnostic settings from a transmitter of the second transceiver in an out-of-band channel of a physical link to a receiver of the first transceiver a second transceiver in a data channel. | 05-20-2010 |
20100124030 | FLOATING FRONT ENCLOSURE FOR PLUGGABLE MODULE - In one example embodiment, a host device includes a front panel, a bezel assembly, a floating PCB, and two host guides. The front panel defines an opening configured to receive a pluggable module in a plugging direction. The bezel assembly defines an opening configured to align with the front panel opening and to receive the pluggable module, the bezel assembly rigidly secured to the front panel. The host guides are rigidly secured to the floating PCB and are configured to guide the pluggable module when it is plugged into the host device. The host guides and bezel assembly operate together to allow the floating PCB to float with respect to the front panel in the plugging direction while remaining substantially aligned with the front panel in directions normal to the plugging direction. | 05-20-2010 |
20100112861 | COMMUNICATION MODULE GROUND CONTACT - A transceiver module that utilizes a side contact spring portion to ground a shielded cable that is plugged into the transceiver module. In one example embodiment, a transceiver module includes a housing, a jack, and a side contact spring portion. The housing is operative to be electrically connected to chassis ground when the transceiver module is received within a host port. The jack is defined in the housing and operative to receive a shielded plug. The side contact spring portion is substantially implemented within the jack and is configured to be in electrical contact with both the housing and a conductive element of the shielded plug received by the jack such that a chassis ground is established between the housing and the shielded plug and such that a moveable bail pivot lever is able to move without disrupting the electrical contact between the side contact spring portion and the housing and/or the conductive element of the shielded plug. | 05-06-2010 |
20100111539 | TRANSCEIVER MODULE AND INTEGRATED CIRCUIT WITH DUAL EYE OPENERS - A transceiver module having integrated eye diagram opening functionality for reducing jitter is described. The transceiver module may include a transmitter eye opener and a receiver eye opener integrated in a single circuit. The transceiver module may also include serial control and various other integrated components. Other functionalities that may be integrated on the transceiver module include loopback modes, bypass features, bit error rate testing, and power down modes. | 05-06-2010 |
20100110137 | USE OF VCSEL TO DETECT PAPER IN A PRINTER - A method of detecting the properties of a printing target in a printing apparatus capable of performing a recording process on the printing target. The method uses a vertical cavity surface emitting laser disposed in the printing apparatus and comprises transporting the printing target through the printing apparatus, emitting a wavelength modulated optical signal toward the printing target using the vertical cavity surface emitting laser, receiving a reflection of the wavelength modulated optical signal, and analyzing the reflected optical signal to identify a property of the printing target. | 05-06-2010 |
20100098436 | METHOD AND APPARATUS FOR GENERATING SIGNALS WITH INCREASED DISPERSION TOLERANCE USING A DIRECTLY MODULATED LASER TRANSMITTER - An optical transmitter is disclosed wherein a signal processor receives a data stream and outputs a drive signal for a laser, where the drive signal encodes each bit of the data stream according to the values of adjacent bits effective to compensate for spreading of bits within the fiber. The output of the laser is input to an optical spectrum reshaper that outputs a signal having an enhanced extinction ratio. | 04-22-2010 |
20100098427 | EMI SHROUD FOR A PLASTIC RECEIVE OPTICAL SUBASSEMBLY - The principles of the present invention provide for a plastic ROSA that has a metallic EMI shroud covering a portion of the plastic ROSA. The combination of the plastic ROSA and the EMI shroud provides the unexpected result of having EMI shielding substantially similar to a metal ROSA. | 04-22-2010 |
20100097942 | SERIALIZER/DESERIALIZER TEST MODES - Serializer, deserializer, and/or serdes ICs are configured to support one or more test modes to enable end-to-end testing in communication links in which the ICs are implemented. To support the end-to-end testing, the ICs can include a multiplexing stage with means for deterministically mapping a plurality of input parallel data signals to at least one output serial data signal and/or a demultiplexing stage with means for deterministically mapping at least one input serial data signal to a plurality of output parallel data signals. When used in combination in a communication link, the means included in the multiplexing stage and demultiplexing stage deterministically map specific input parallel data signals to specific output parallel data signals. | 04-22-2010 |
20100095110 | OUT OF BAND ENCRYPTION - Embodiments of the invention relate to systems and methods for securing data transmission in networks. Embodiments of the invention further relate to encryption methods that dynamically adjust during the course of data transmission. Further, the encryption methods can adapt dynamically without user intervention. In one embodiment, an encryption scheme can be established, controlled, and monitored via out-of-band communication between transceiver modules. | 04-15-2010 |
20100092184 | Active Linear Amplifier Inside Transmitter Module - In one example embodiment, a transmitter module includes a header electrically coupled to a chassis ground. First and second input nodes are configured to receive a differential data signal. A buffer stage has a first node coupled to the first input node and a second node coupled to the second input node. An amplifier stage has a fifth node coupled to a third node of the buffer stage and a sixth node coupled to a signal ground that is not coupled to the chassis ground. An optical transmitter has an eighth node coupled to a seventh node of the amplifier stage and a ninth node configured to be coupled to a voltage source. A bias circuit is configured to couple a fourth node of the buffer stage to a bias current source. | 04-15-2010 |
20100080518 | PRINTED CIRCUIT BOARD POSITIONING IN AN OPTOELECTRONIC MODULE - Printed circuit board (PCB) positioning in an optoelectronic module. In one example embodiment, a spacer can be use to position top and bottom PCBs that are at least partially enclosed within top and bottom shells of an optoelectronic module. The spacer includes top and bottom surfaces and a plurality of top posts extending from the top surface. The top posts are configured to extend through openings in the top PCB to contact inside surfaces of the top shell. | 04-01-2010 |
20100067636 | Baseband Phase-Locked Loop - An example method includes receiving a phase correction signal representing a phase difference between a source signal and a reference signal, generating a first control voltage from the phase correction signal using a charge pump circuit, generating a second control voltage from the phase correction signal in response to a digitally filtered version of the phase correction signal, wherein the second control voltage corrects for an offset error present in the first control voltage, calculating a VCO control signal based on a linear combination of the first and the second control voltages; and generating the source signal in response to the VCO control signal. | 03-18-2010 |
20100061069 | OPTOELECTRONIC MODULE FORM-FACTOR ADAPTER - In one example embodiment, an adapter module includes a body having a first form-factor and multiple receptacles extending into the body. Each of the receptacles is configured to receive an optoelectronic module having a second form-factor. The second form-factor is smaller than the first form-factor. The first form-factor may substantially conform to the CFP MSA, for example. The second form-factor may substantially conform to the SFP+ or QSFP MSA, for example. | 03-11-2010 |
20100054749 | COMBINATION NETWORK FIBER CONNECTOR AND LIGHT PIPE - Exemplary embodiments of the invention relate to an optical transceiver in which the base portion is made of a light permeable material and configured to emit light representative of the status of certain transceiver parameters. The transceiver includes a housing which at least partially encloses the base portion. The base portion connects to a printed circuit board on which a light-emitting diode is mounted. Light from the light-emitting diode is conducted to front portion of the base, which is light permeable, through a light-pipe assembly, thereby illuminating the entire front portion of the base. Because the front portion of the base is not enclosed within the housing the light emitted is clearly visible from a distance even when fiber connectors are plugged into the transceiver receptacles. | 03-04-2010 |
20100054734 | FIBER OPTIC TRANSCEIVER MODULE WITH OPTICAL DIAGNOSTIC DATA OUTPUT - Exemplary embodiments of the invention relates to an optical transceiver module having a diagnostic assembly, wherein the diagnostic assembly is configured to visually display the operational status of the transceiver transmitter and receiver components while optically transmitting diagnostic information. The transceiver operational status is accessible while the transceiver operates in conjunction with an external host and may be ascertained in real time without interrupting normal transceiver operation or suspending the transmission of data over optical fibers. | 03-04-2010 |
20100054733 | ACCESSING TRANCEIVER LINK INFORMATION FROM HOST INTERFACE - Embodiments of the present invention include systems and methods for accessing the digital diagnostic data and controller data of a remote transceiver module via the diagnostic port of a local transceiver. The invention involves modulating high-speed data and out-of-band data as a double modulated signal, wherein the out-of-band data includes the remote transceiver controller and digital diagnostic data, which is subsequently accessible by an external user device from the diagnostic port of the local transceiver. | 03-04-2010 |
20100046943 | SIMULATION OF OPTICAL CHARACTERISTICS OF AN OPTICAL FIBER - An optical communication apparatus that includes multiple optically communicative components positioned optically in series. Some of the optically communicative components may be optical fiber segments of perhaps different types. The optical channel represented by the series of optically communicative components and approximates a transfer function of an optical channel of a longer optical fiber. Accordingly, rather than deal with a lengthy optical fiber, an apparatus having a shorter optical channel may be used instead. The construction of the optical communicative components may be calculating an input transfer function. The construction would include an ordering of discrete optically communicative components that, when placed optically in series, simulates an estimation of a particular transfer function. Testing may then occur by actually passing an optical signal through the series construction of optically communicative components, rather than through the longer optical fiber. | 02-25-2010 |
20100045345 | AC DIFFERENTIAL CONNECTION ASSEMBLY BETWEEN A TRANS-IMPEDANCE AMPLIFIER AND A POST AMPLIFIER FOR BURST MODE RECEIVING - An AC differential connection assembly between a trans-impedance amplifier and a post amplifier for burst mode receiving comprising means for coupling a differential output of the trans-impedance amplifier to a differential input of the post amplifier, the means for coupling comprises a coupling capacitor assembly; and a switching circuit coupled across the differential input of the post amplifier, the switching circuit having an ‘on’ state with low impedance and an ‘off’ state with high impedance; wherein during burst mode receiving, the switching circuit is in the ‘off’ state and the coupling capacitor assembly having a time constant to maintain a stable DC level such that a payload is received accurately by the differential input of the post amplifier; and during an idle period, the switching circuit is in the ‘on’ state and the coupling capacitor assembly having a time constant to recover a DC level of the differential output of the trans-impedance amplifier. | 02-25-2010 |
20100039785 | CFP MECHANICAL PLATFORM - In one example embodiment, a pluggable optoelectronic module includes a shell with a front, back, and first and second sides. A first guiderail protrudes from the first side and extends from the front of the shell to the back of the shell. A second guiderail protrudes from the second side and also extends from the front of the shell to the back of the shell. A first thumbscrew runs the length of the module and is housed within the first guiderail. A second thumbscrew also runs the length of the module and is housed within the second guiderail. The two thumbscrews are configured to secure the module to a host device when the module is plugged into the host device. | 02-18-2010 |
20100039778 | CFP MECHANICAL PLATFORM - In one example embodiment, a host device includes a host bezel, first and second guides, and a host connector. The host bezel defines an opening configured to receive a pluggable module. A first cutout on one side of the opening and a second cutout on the opposite side of the opening are adapted to receive corresponding guiderails on the module. The first and second guides are coupled to the host bezel and to a host printed circuit board. Each of the first and second guides defines a channel configured to receive the first and second guiderails of the module. The host connector is coupled to the host printed circuit board and is disposed at the back end of the first and second guides. The host connector includes a recessed slot configured to receive a module connector to electrically couple the module to the host printed circuit board. | 02-18-2010 |
20100039134 | HIGH-POWER OPTICAL BURN-IN - Semiconductor lasers are aged to identify weak or flawed devices, resulting in improved reliability of the remaining devices. The lasers can be aged using a high-power optical burn-in that includes providing a high drive current to the lasers for a period of time, and maintaining the ambient temperature of the lasers at a low temperature. After the high-power optical burn-in, the output of the lasers can be measured to determine if the lasers are operating within specifications. Those that are not can be discarded, while those that are can be further aged using a high-temperature thermal burn-in that includes providing a drive current to the lasers while maintaining the ambient temperature of the lasers at a high-temperature. | 02-18-2010 |
20100034100 | NETWORK LOAD TESTER WITH REAL-TIME DETECTION AND RECORDING - A load tester is configured to generate traffic streams for testing a network. The traffic streams can include one or more stream objects. Each stream object can be characterized by a unique identifier and can include a fixed number of frames. The frames can share the same S_ID and D_ID while being characterized by a unique sequence count. The load tester can receive a plurality of frames, all or some of which belong to a stream object, and analyze the received frames in real-time to identify the occurrence of one or more errors such as out-of-order frame errors, dropped frame errors, and misdirected frame errors. The different types of errors can be individually recorded. | 02-11-2010 |
20100028015 | BACKDOOR DIAGNOSTIC COMMUNICATION TO TRANSCEIVER MODULE - Exemplary embodiments of the invention relate to an optical transceiver module having a diagnostic communications link, wherein the link is configured to access diagnostic and other data contained within the transceiver controller via a backdoor interface. Controller data, including operational parameter values and module setup values, is accessible while the transceiver operates in conjunction with an external host and may be retrieved, and sometimes modified, in real time without interrupting normal transceiver operation or suspending the transmission of data over optical fibers. The data is accessed with an external user device via a backdoor interface on the outside of the transceiver module. | 02-04-2010 |
20100028014 | FIBEROPTIC TRANSCEIVER MODULE WITH INTEGRAL STATUS INDICATORS - Exemplary embodiments of the invention relate to an optical transceiver module having a status indicator assembly, wherein the status indicator assembly is configured to visually display the operational status of the transceiver transmitter and receiver components. The operational status is accessible while the transceiver operates in conjunction with an external host and may be ascertained in real time without interrupting normal transceiver operation or suspending the transmission of data over optical fibers. | 02-04-2010 |
20100027991 | OPTICAL TRANSCEIVER WITH LED LINK INFORMATION INDICATOR - Exemplary embodiments of the invention relate to an analyzer device configured to interface with an optical transceiver module having a diagnostic communications port, wherein the port is configured to access diagnostic and other data contained within the transceiver controller via a backdoor interface. Controller data, including operational parameter values and module setup values, is accessible while the transceiver operates in conjunction with an external host and may be retrieved, and sometimes modified, in real time without interrupting normal transceiver operation or suspending the transmission of data over optical fibers. The analyzer device accesses the data via the diagnostic communications port on the outside of the transceiver module. | 02-04-2010 |
20100011134 | LOADING AND EXECUTING FIRMWARE MODULE WITHOUT RESETTING OPERATION - A host communicates a firmware module to an electronic device utilizing a data communication interface (e.g., I | 01-14-2010 |
20100008679 | Phase Shift Keyed Modulation of Optical Signal Using Chirp Managed Laser - A high-speed optical transmitter comprises multiple digital lanes that are provided to a bank of digital-to-analog converters. The analog signals are then used to Phase Shift Keyed (PSK) modulation using a Chirp Managed Laser (CML)-based transmitter, and potentially using dual polarization. A corresponding optical receiver receives the sequence of optical signals at a demodulator. For each polarization, the demodulator includes a corresponding demodulation channel that is configured to demodulate that polarization component of the optical signal into one or more signal components. Each of these signal components is converted into a corresponding digital signal using a corresponding analog-to-digital converter. In the case of higher-order PSK modulation (e.g., 8PSK or higher), for each polarization, the analog converter has a lower sampling rate than for QPSK modulation. | 01-14-2010 |
20090305447 | IMPLANTED VERTICAL CAVITY SURFACE EMITTING LASER - A method of forming a gain guide implant for a vertical cavity surface emitting laser (VCSEL) comprises implanting ions into a wafer to simultaneously form a first non-conducting portion of the gain guide implant spaced apart from an active region and a second non-conducting portion of the gain guide implant occupying the active region, the first non-conducting portion laterally offset relative to the second non-conducting portion. | 12-10-2009 |
20090284930 | MODULAR HEATSINK MOUNTING SYSTEM - In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably mounting a modular heatsink to the host system such that the host system directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot. The means for removably mounting has a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arranged can be removably mounted to the host system. | 11-19-2009 |
20090282290 | RECREATING ERRORS IN A NETWORK DEVICE - Recreating errors in a network device. In one embodiment, a method for recreating an error condition in a network device includes capturing a first set of commands sent to a network device; identifying an error condition in the network device, the error condition corresponding to the captured first set of commands; and sending a second set of commands to the network device in a second attempt to recreate the error condition. The second set of commands includes the first set of commands as well as additional commands that are configured to place the network device in substantially the same state as at the time that the first set of commands was sent to the network device. | 11-12-2009 |
20090279902 | METHOD AND APPARATUS FOR DEMODULATING AND REGENERATING PHASE MODULATED OPTICAL SIGNALS - A DPSK/DQPSK receiver includes an optical splitter that separates the received DPSK/DQPSK optical signal according to an optical power splitting ratio into a plurality of received optical signals. A plurality of optical filters passes a plurality of filtered received optical signals. A plurality of optical detectors generates a plurality of electrical detection signals, each with a power that is related to a power of a respective filtered optical signal. A plurality of amplifiers generates a plurality of amplified electrical signals. At least one electrical signal combiner combines the plurality of amplified electrical detection signals generated by the plurality of optical amplifiers into a combined reception signal. | 11-12-2009 |
20090275230 | POWERED LATCHING MECHANISM FOR A MODULE - A latching system for use in selectively securing a module within a receptacle of a host device is described. In one or more examples, the latching system includes a powered actuation mechanism and a latching mechanism. In one or more examples, the module latching mechanism includes a latch and the powered actuation mechanism disengages a latch from a catch. In one or more examples, two latches are provided. In one or more examples, the latching mechanism of a module includes a pusher that interacts with a latch located on a receptacle. In one or more examples, a module includes two latches. | 11-05-2009 |
20090269069 | PASSIVE WAVE DIVISION MULTIPLEXED TRANSMITTER HAVING A DIRECTLY MODULATED LASER ARRAY - An wave division multiplexed (WDM) optical transmitter is disclosed including a directly modulated laser array and a planar lightwave chip (PLC) having a plurality of OSRs that receive outputs of the laser array and increase the extinction ratio of the received light. An optical multiplexer receives the outputs of the OSRs and couples them to a single output port. The multiplexer has transmission peaks through its ports each having a 0.5 dB bandwidth including the frequency of a laser in the array. The optical multiplexer may be embodied as cascaded Mach-Zehnder interferometers or ring resonators. | 10-29-2009 |
20090267712 | FEED THRU WITH FLIPPED SIGNAL PLANE USING GUIDED VIAS - An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure. | 10-29-2009 |