| EV GROUP E. THALLNER GMBH Patent applications |
| Patent application number | Title | Published |
|---|
| 20160136873 | EMBOSSING COMPOUND FOR EMBOSSING LITHOGRAPHY - An embossing material that can be hardened and used for embossing lithography, comprised of a mixture of: at least one polymerizable main component, and at least one secondary component. The invention also relates to a use of the embossing material for the primary forming of an embossing form. | 05-19-2016 |
| 20160126085 | METHOD AND DEVICE FOR TREATING A SUBSTRATE SURFACE - A method for treatment of a substrate surface of a substrate by applying a liquid to the substrate surface, the liquid which has been applied to the substrate surface being heated by a heating area which is located above the substrate surface, wherein the temperature of the liquid is kept constant by moving the heating area up and down. Furthermore the invention relates to a corresponding device. | 05-05-2016 |
| 20160111394 | METHOD FOR PERMANENT BONDING OF WAFERS - A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate. | 04-21-2016 |
| 20160103026 | MEASURING DEVICE AND METHOD FOR ASCERTAINING A PRESSURE MAP - A measuring device for determining a pressure map during application of pressure to at least one measurement layer between a first pressure body and a second pressure body the measuring device comprising: (i) at least one transmitter located on one peripheral edge of the measurement layer for emission of signals in the form of electromagnetic waves along a first signal route which runs through the measurement layer and at least one other signal route which runs through the measurement layer, and (ii) at least one receiver located on the peripheral edge for reception of the signals of the first signal route and other signal route(s), which signals are sent by the transmitter through the measurement layer and can be changed when pressure is applied. Furthermore this invention relates to a corresponding method. | 04-14-2016 |
| 20160082453 | DEVICE AND METHOD FOR COATING A SUBSTRATE - A device for coating of a surface of a substrate with a coating material which has at least one coating component and at least one solvent, with the following features: a chamber which can be pressurized, a holding apparatus for holding the substrate on a holding surface and a spray nozzle for coating of the substrate, characterized in that the device has cooling means for cooling of at least the surface of the substrate which is held on the holding surface of the holding apparatus. Furthermore the invention relates to a corresponding method. | 03-24-2016 |
| 20160076147 | MOULD WITH A MOULD PATTERN, AND DEVICE AND METHOD FOR PRODUCING SAME - A method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures are coated at least partially with a coating. In addition, the invention relates to a corresponding structural die as well as a device for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the device has coating means for coating the die structures. | 03-17-2016 |
| 20160071817 | METHOD FOR BONDING METALLIC CONTACT AREAS WITH DISSOLUTION OF A SACRIFICIAL LAYER APPLIED ON ONE OF THE CONTACT AREAS IN AT LEAST ONE OF THE CONTACT AREAS - A method for bonding of a first, at least partially metallic contact surface of a first substrate to a second, at least partially metallic contact surface of a second substrate, with the following steps, especially the following progression: application of a sacrificial layer which is at least partially, especially predominantly soluble in the material of at least one of the contact surfaces to at least one of the contact surfaces, bonding of the contact surfaces with at least partial solution of the sacrificial layer in at least one of the contact surfaces. | 03-10-2016 |
| 20160020136 | RECEPTACLE DEVICE, DEVICE AND METHOD FOR HANDLING SUBSTRATE STACKS - The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate. | 01-21-2016 |
| 20160020124 | BENDABLE CARRIER MOUNT, DEVICE AND METHOD FOR RELEASING A CARRIER SUBSTRATE - A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate. | 01-21-2016 |
| 20150357227 | RECEIVING DEVICE FOR HANDLING STRUCTURED SUBSTRATES - A mounting apparatus for handling of a structured substrate which has structures. The mounting apparatus having a soft material layer for accommodating the structured substrate on a receiving surface. The structures of the structured substrate are able to be taken at least partially into the material layer. Fixing means for fixing of the structured substrate on the receiving surface are provided. | 12-10-2015 |
| 20150314308 | SPRAY NOZZLE DEVICE AND COATING METHOD - A spray nozzle apparatus for spraying a spray jet which contains a coating material in one spray direction S for coating of a surface which is located in the spray direction S opposite the spray nozzle apparatus transversely to the spray direction S with a spray nozzle for spraying the spray jet from a spray nozzle outlet of the spray nozzle and at least one control nozzle with a control nozzle outlet which is aligned or can be aligned to the spray jet transversely to the spray direction S for acting on the spray jet and deflecting it by means of a control flow which is emerging from the control nozzle outlet, characterized in that there is one control apparatus for control of the control flow with a control signal. | 11-05-2015 |
| 20150303082 | PRESSURE TRANSMITTING DEVICE FOR BONDING CHIPS ONTO A SUBSTRATE - This invention relates to a pressure transmission apparatus for bonding a plurality of chips to a substrate. The pressure transmission apparatus includes a pressure body for applying a bonding force which acts in the bonding direction (B) to the chip. The pressure body has a first pressure side and an opposite second pressure side, both oriented to be transverse to the bonding direction (B). Fixing means are provided to attach to the periphery of the pressure transmission apparatus for fixing of the pressure transmission apparatus on a retaining body in the bonding direction (B). A sliding layer is provided for sliding motion of the pressure body transversely to the bonding direction (B). | 10-22-2015 |
| 20150293442 | METHOD FOR MICROCONTACT PRINTING - A method for microcontact embossing of a structure by transferring an embossing material onto a target surface of a substrate by means of an embossing surface of a structural die. The embossing material is comprised at least predominantly of silane or at least predominantly of at least one silane derivative and in that the structural die is a soft die. A corresponding method is provided in which the embossing material is a molecular component that is comprised at least predominantly of organic molecules. | 10-15-2015 |
| 20150293269 | METHOD AND DEVICE FOR PRODUCING A LENS WAFER - A device for producing a lens wafer with a plurality of microlenses with an upper die and a lower die for embossing of the lens wafer from a fluid embossing mass which has been delivered between the dies, curing means for curing of the embossed lens wafer, characterized in that at least one release element for detachment of the cured lens wafer prior to curing can be located between the lower die and the upper die. | 10-15-2015 |
| 20150279715 | DEVICE AND METHOD FOR BONDING - A device for bonding of a second substrate onto a first substrate, comprising a receiving apparatus for receiving the first substrate which has been coated with a bond layer and the second substrate which is held on the bond layer, and an action apparatus for applying a bond force to the second substrate on one action side of the second substrate, which side faces away from the bond layer proceeding from an initial zone A, which lies within an edge zone R of the action side as far as action on the entire action side. | 10-01-2015 |
| 20150262849 | SEMICONDUCTOR TREATING DEVICE AND METHOD - A semiconductor processing device with bearing means for supporting a plate with one plate plane. The plate has a function region with evenness, a bearing region which surrounds the function region at least in sections, and an action region which is located outside the function region and outside the bearing region. The bearing means is made to support the plate in the bearing region and the action means is controllable such that by deformation of the function region the evenness can be adjusted and/or changed and/or influenced and/or re-set. The action means comprise at least one vacuum region which allows a deformation of the plate in the bearing region. | 09-17-2015 |
| 20150251349 | METHOD FOR EMBOSSING OF SUBSTRATES - A method for embossing a structure material on a substrate disposed within a device having side walls, a base plate and a cover that define a working space that is isolated from a surrounding environment. The method includes the steps of: a) moving the substrate using a first calibration means and aligning the substrate with an application means, b) applying the structure material to the substrate, c) moving the substrate using a second calibration means that is located at least partially in the working space wherein the substrate is disposed within the working space and is aligned with an embossing means that is located at least partially in the working space, and d) embossing the structure material on the substrate while the substrate is in the working space using the embossing means, wherein the working space has a defined atmosphere, before and during the step of embossing, without interruption. | 09-10-2015 |
| 20150228521 | ACCOMMODATING DEVICE FOR RETAINING WAFERS - A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer. | 08-13-2015 |
| 20150224755 | METHOD FOR COATING AND BONDING SUBSTRATES - A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 μm. The invention further relates to a method for bonding of a first substrate which has been coated as described above to a second substrate which has a second diffusion bond layer, the method of the bonding comprising the following steps: bring a first diffusion bond layer of a first substrate into contact with a second diffusion bond layer of a second substrate, pressing the substrates together to form a permanent metal diffusion bond between the first and second substrates. | 08-13-2015 |
| 20150224705 | METHOD AND DEVICE FOR EMBOSSING - A process for embossing a structure in an embossing material that is applied on a substrate comprising the steps of embossing the embossing material by an embossing die and hardening the embossing material, wherein at least the substrate and/or the embossing die and/or at least one heating layer arranged between the substrate and the embossing material and/or between the embossing die and the embossing material are irradiated by means of microwaves for hardening the embossing material. | 08-13-2015 |
| 20150217505 | STRUCTURE STAMP, DEVICE AND METHOD OF EMBOSSING - A structure stamp with a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, an embossing element drive for moving an embossing element along the structure stamp. | 08-06-2015 |
| 20150210057 | DEVICE AND METHOD FOR BONDING SUBSTRATES - A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces. | 07-30-2015 |
| 20150179604 | METHOD FOR BONDING SUBSTRATES - This invention relates to a method for bonding of a first contact area of a first at least largely transparent substrate to a second contact area of a second at least largely transparent substrate, on at least one of the contact areas an oxide being used for bonding, from which an at least largely transparent interconnection layer is formed with an electrical conductivity of at least 10e1 S/cm | 06-25-2015 |
| 20150138566 | APPARATUS AND METHOD FOR ASCERTAINING ORIENTATION ERRORS - A device for determining alignment errors of structures which are present on, or which have been applied to a substrate, comprising a substrate holder for accommodating the substrate with the structures and detection means for detecting X-Y positions of first markings on the substrate and/or second markings on the structures by moving the substrate or the detection means in a first coordinate system, wherein in a second coordinate system which is independent of the first coordinate system X′-Y′ structure positions for the structures are given whose respective distance from the X-Y positions of the first markings and/or second markings can be determined by the device. | 05-21-2015 |
| 20150130095 | METHOD AND DEVICE FOR PRODUCING A PLURALITY OF MICROLENSES - Device and method for producing a plurality of microlenses from a lens material. The method includes: applying lens material intended for the embossing of the microlenses to a plurality of first lens molds distributed on a first embossing side of a first die for embossing of the microlenses, moving the first die and a second die located essentially parallel, in an X-Y plane, and opposite the first die, on top of one another in a Z-direction running essentially perpendicular to the X-Y plane, embossing the microlenses by shaping and curing the lens material, the shaping taking place by moving the first and second embossing sides on top of one another, up to a thickness D | 05-14-2015 |
| 20150104902 | METHOD FOR FASTENING CHIPS WITH A CONTACT ELEMENT ONTO A SUBSTRATE PROVIDED WITH A FUNCTIONAL LAYER HAVING OPENINGS FOR THE CHIP CONTACT ELEMENTS - A method for tacking of chips onto a substrate at chip positions which are distributed on a surface of the substrate. The method includes the following steps: formation or application of a function layer onto the substrate, removing the function layer from the substrate at the chip positions at least in the region of contacts to uncover the contacts, tacking chips onto one chip contact side of the function layer at the chip positions and contacting the chips with the contacts via contact elements. | 04-16-2015 |
| 20150096689 | FLEXIBLE SUBSTRATE HOLDER, DEVICE AND METHOD FOR DETACHING A FIRST SUBSTRATE - A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same. | 04-09-2015 |
| 20150069115 | DEVICE AND METHOD FOR BONDING SUBSTRATES - A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space, | 03-12-2015 |
| 20150047784 | METHOD FOR APPLYING A TEMPORARY BONDING LAYER - A method for applying a temporary bonding layer to a carrier wafer for temporary joining to a product wafer by fusion bonding or anodic bonding, said method comprising:
| 02-19-2015 |
| 20150047783 | PRESSURE TRANSFER PLATE FOR PRESSURE TRANSFER OF A BONDING PRESSURE - A pressure transfer plate for transferring a bonding pressure, especially in thermocompression bonding, from a pressurization apparatus to a wafer, comprising a first pressure side for making contact with a pressurization apparatus, a second pressure side facing away from the first pressure side having an effective contact area for making contact with the wafer and pressurizing it, at least the effective contact area having a low adhesiveness relative to the wafer. | 02-19-2015 |
| 20140374144 | METHOD FOR THE TEMPORARY CONNECTION OF A PRODUCT SUBSTRATE TO A CARRIER SUBSTRATE - A method for temporary connection of a product substrate to a carrier substrate comprised of the steps of:
| 12-25-2014 |
| 20140360666 | METHOD AND DEVICE FOR BONDING OF SUBSTRATES - A device and method for bonding first substrates to second substrates. The device includes: a receptacle for accommodating a carrier substrate, a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, and a fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate. The method includes the following steps: placement of multiple first substrates on a substrate side of a carrier substrate accommodated on a receptacle, and fixing of each first substrate on the substrate side on at least one fixing section of each first substrate. | 12-11-2014 |
| 20140339589 | METHOD FOR PRODUCING A POLYCHROMATIZING LAYER AND SUBSTRATE AND ALSO LIGHT-EMITTING DIODE HAVING A POLYCHROMATIZING LAYER - The invention relates to a method for applying a polychromatizing layer which contains at least one luminescent means on a semiconductor substrate, which layer is suitable for producing a monochromatic light. The polychromatizing layer is applied with a printing process, especially with a micro-contact printing process. Preferably the polychromatizing layer is applied structured. | 11-20-2014 |
| 20140332036 | DEVICE AND METHOD FOR TREATING SUBSTRATE SURFACES - A device and method for treatment of a substrate treatment surface of a substrate with a fluid by immersion of the substrate treatment surface into the fluid, The device includes:
| 11-13-2014 |
| 20140232037 | NANOSTRUCTURE DIE, EMBOSSING ROLL, DEVICE AND METHOD FOR CONTINUOUS EMBOSSING OF NANOSTRUCTURES - A nanostructure die with a concavely curved nanostructured die surface for seamless embossing of at least one peripheral ring of a jacket surface of an embossing roll in a step-and-repeat process and an embossing roll for continuous embossing of nanostructures with an embossing layer, which has been applied on a body of revolution, with a jacket surface with at least one peripheral ring which is made seamless at least in the peripheral direction and which is embossed in the step-and-repeat process. Furthermore, the invention relates to a method and a device for producing such an embossing roll for continuous embossing of nanostructures as well as a method for producing such a nanostructure die and a method for producing an embossing substrate. | 08-21-2014 |
| 20140209230 | APPARATUS AND METHOD FOR BONDING SUBSTRATES - This invention relates to a method and a device for temporary bonding of a first substrate with a second substrate. The device is comprised of a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface. The mounting apparatus has an outer ring section for controllable fixing of the first substrate. Deformation means are provided for controllable deformation of the first substrate. The deformation means act within the outer ring section. Bonding means are provided for bonding of the first substrate with the second substrate. | 07-31-2014 |
| 20140196842 | METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS, AS WELL AS CUTTING TOOL - A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material, said method comprising the steps of:
| 07-17-2014 |
| 20140159321 | HOLDING DEVICE FOR HOLDING A PATTERNED WAFER - This invention relates to a mounting apparatus for mounting and supporting one structure side of a substrate, which structure side has structures thereon. The apparatus having a mounting element with a flat mounting surface for supporting the structures and a suction surface F | 06-12-2014 |
| 20140154867 | METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEANS OF SOLID STATE DIFFUSION OR PHASE TRANSFORMATION - A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused. | 06-05-2014 |
| 20140102221 | METHOD AND DEVICE FOR DETERMINING THE PRESSURE DISTRIBUTION FOR BONDING - A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution. | 04-17-2014 |
| 20140073112 | METHOD FOR PERMANENTLY BONDING WAFERS - A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises:
| 03-13-2014 |
| 20140051231 | METHOD FOR PERMANENTLY BONDING WAFERS - This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, the second substrate having at least one reaction layer, with the following steps, especially the following sequence:
| 02-20-2014 |
| 20140020847 | BENDABLE CARRIER MOUNT, DEVICE AND METHOD FOR RELEASING A CARRIER SUBSTRATE - A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the product substrate. | 01-23-2014 |
| 20140017877 | METHOD FOR PERMANENTLY BONDING WAFERS - This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence:
| 01-16-2014 |
| 20130330165 | ACCOMMODATING DEVICE FOR RETAINING WAFERS - A receiving means for receiving and mounting of wafers, comprised of:
| 12-12-2013 |
| 20130306742 | METHOD AND DEVICE FOR PRODUCING INDIVIDUALLY CODED READ PATTERNS - A device for producing individually coded read patterns, especially resonators for use in RFID chips. The device includes a structuring apparatus for producing a basic pattern with at least one group of individual patters on a carrier substrate, and a processing apparatus for forming at least one individually coded read pattern at a time with read elements from a subset of a total set of the individual patters of each group. The invention also relates to a corresponding method and a read structure, produced according to the described method and/or the described device. | 11-21-2013 |
| 20130299080 | METHOD FOR PERMANENT BONDING OF WAFERS - A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate. | 11-14-2013 |
| 20130288454 | METHOD FOR SEPARATING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE - The invention relates to a method for stripping a product substrate from a carrier substrate which is connected to the product substrate by an interconnect layer with the following steps, especially the following sequence:
| 10-31-2013 |
| 20130270756 | RETAINING SYSTEM FOR RETAINING AND HOLDING A WAFER - This invention relates to a retaining system for retaining and holding a wafer for processing the wafer with a holding surface for placing the wafer on a support surface of the wafer and holding means for holding the wafer, whereby because of the holding means holding extremely thin wafers on the holding surface of the wafer, the smallest possible local distortions of the wafer are achieved. | 10-17-2013 |
| 20130211779 | METHOD FOR DETERMINING THE POSITION OF A ROTATION AXIS - In a system having a substrate holding means for holding a substrate, wherein the substrate holding means is rotatable about an axis of rotation that is perpendicular to an X-Y coordinate system, a method for determining position of the axis of rotation in the X-Y coordinate system, comprising the steps of:
| 08-15-2013 |
| 20130011997 | METHOD FOR PRODUCING A WAFER PROVIDED WITH CHIPS - A method for producing a product wafer having chips thereon, comprising the steps of:
| 01-10-2013 |
