eMemory Technology Inc. Patent applications |
Patent application number | Title | Published |
20150333744 | TRIMMING CIRCUIT AND METHOD APPLIED TO VOLTAGE GENERATOR - A trimming method for a voltage generator is provided. The voltage generator generates an output voltage according to a reference voltage. The trimming method includes the following steps. Firstly, in a step (a), an initial value of a trimming code is provided. Then, in a step (b), the reference voltage is generated to the voltage generator according to the trimming code, so that the output voltage is correspondingly generated by the voltage generator. Then, in a step (c), an average voltage of the output voltage is compared with a target voltage. If the average voltage does not reach the target voltage, the trimming code is gradually changed, and the step (b) is repeatedly done. If the average voltage reaches the target voltage, the trimming code is locked. | 11-19-2015 |
20150295567 | PULSE DELAY CIRCUIT - A pulse delay circuit includes a pull down element, a first pull up element, a first delay unit, a second delay unit, a second pull up element, and an inverted buffer. The pull down element is connected to an input pulse signal, a node b and a first voltage. The first pull up element is connected to a node c, a second voltage and the node b. The first delay unit has a reset terminal. The first delay unit is connected to the node b and the node c. The second delay unit is connected to the node c and the node d. The second pull up element is connected to the node d, the second voltage and the node c. The inverted buffer is connected to the node c and the reset terminal. Moreover, a delayed pulse signal is outputted from the inverted buffer. | 10-15-2015 |
20150287467 | NON-VOLATILE MEMORY APPARATUS AND ERASING METHOD THEREOF - The invention provides a non-volatile memory apparatus and an erasing method thereof The non-volatile memory apparatus includes a plurality of memory sectors and a control voltage provider. The memory sectors disposed in a same well, wherein, each of the memory sectors includes a plurality of memory cells for respectively receiving a plurality of control line signals. The control voltage provider provides the control line signals to the memory cells of each of the first memory sectors. When an erasing operation is operated, one of the memory sectors is selected for erasing and the control voltage provider provides the control line signals of the selected memory sector with an erase control voltage and provides the control line signals of the un-selected memory sectors with a un-erase control voltage, voltage levels of the erase control voltage and the un-erase control voltage are different. | 10-08-2015 |
20150228315 | SENSING APPARATUS AND DATA SENSING METHOD THEREOF - A sensing apparatus and data sensing method are provided. The sensing apparatus includes an initial circuit, a reference current generator and a sensing circuit. The initial circuit discharges a sensing end to a reference ground during a discharge period, and pre-charges the sensing end to a preset voltage level during a pre-charge period according to an output signal. The reference current generator draws a reference current from the sensing end. The sensing circuit senses a voltage level on the sensing end to generate the output signal. Wherein, the sensing end receives a cell current from a memory cell, and the pre-charge period is after the discharge period. | 08-13-2015 |
20150098278 | NON-VOLATILE MEMORY APPARATUS AND DATA VERIFICATION METHOD THEREOF - A non-volatile memory apparatus and a data verification method thereof are provided. The non-volatile memory apparatus includes a plurality of memory cells, a page buffer, a write circuit, a sense amplifier, and a sense and compare circuit. The page buffer stores a plurality of buffered data and programs the plurality of memory cells according to the plurality of buffered data. The write circuit receives a program data or a rewrite-in data and writes the program data or the rewrite-in data to the page buffer. The sense amplifier senses data read from the memory cells for generating a read-out data. The sense and compare circuit reads the buffered data, and compares the read-out data and a compared buffered data to generate a rewrite-in data. The sense and compare circuit determines the rewrite-in data to be the buffered data or an inhibiting data according to the compared result. | 04-09-2015 |
20150092498 | Non-volatile memory for high rewrite cycles application - A non-volatile memory has an array of non-volatile memory cells. Each of the non-volatile memory cells includes a coupling device formed on a first well, a read device, a floating gate device formed on a second well and coupled to the coupling device, a program device formed on the second well, and an erase device formed on a third well and coupled to the first floating gate device. The read device, the program device, and the erase device are formed on separate wells so as to separate the cycling counts of a read operation, a program operation and an erase operation of the non-volatile memory cell. | 04-02-2015 |
20150092497 | BIAS GENERATOR FOR FLASH MEMORY AND CONTROL METHOD THEREOF - A bias voltage generator for providing a control voltage and a source line voltage to a memory array includes a reference voltage generating circuit and a voltage converting circuit. The reference voltage generating circuit receives a program signal or an erase signal, and generates a reference voltage. If the program signal is received by the reference voltage generating circuit, the reference voltage has a positive temperature coefficient. If the erase signal is received by the reference voltage generating circuit, the reference voltage has a negative temperature coefficient. The voltage converting circuit converts the reference voltage into the control voltage and the source line voltage. The voltage converting circuit enlarges the reference voltage by a first magnification so as to produce the source line voltage, and enlarges the reference voltage by a second magnification so as to produce the control voltage. | 04-02-2015 |
20150091073 | NONVOLATILE MEMORY STRUCTURE AND FABRICATION METHOD THEREOF - According to one embodiment, a single-poly nonvolatile memory (NVM) cell includes a PMOS select transistor on a semiconductor substrate and a PMOS floating gate transistor series connected to the PMOS select transistor. The PMOS floating gate transistor comprises a floating gate and a gate oxide layer between the floating gate and the semiconductor substrate. A protector oxide layer covers and is in direct contact with the floating gate. A contact etch stop layer is disposed on the protector oxide layer such that the floating gate is isolated from the contact etch stop layer by the protector oxide layer. | 04-02-2015 |
20140361358 | NONVOLATILE MEMORY STRUCTURE - A nonvolatile memory structure includes a substrate having thereon a first, a second, and a third OD regions arranged in a row. The first, second, and third OD regions are separated from one another by an isolation region. The isolation region includes a first intervening isolation region between the first OD region and the second OD region, and a second intervening isolation region between the second the third OD region. A first select transistor is formed on the first OD region. A floating gate transistor is formed on the second OD region. The floating gate transistor is serially coupled to the first select transistor. The floating gate transistor includes a floating gate completely overlapped with the second OD region and is partially overlapped with the first and second intervening isolation regions. A second select transistor is on the third OD region and serially coupled to the floating gate transistor. | 12-11-2014 |
20140340955 | ONE TIME PROGRAMABLE MEMORY CELL AND METHOD FOR PROGRAMING AND READING A MEMORY ARRAY COMPRISING THE SAME - The present invention provides a one time programmable (OTP) memory cell including a select gate transistor, a following gate transistor, and an antifuse varactor. The select gate transistor has a first gate terminal, a first drain terminal, a first source terminal, and two first source/drain extension areas respectively coupled to the first drain terminal and the first source terminal. The following gate transistor has a second gate terminal, a second drain terminal, a second source terminal coupled to the first drain terminal, and two second source/drain extension areas respectively coupled to the second drain terminal and the second source terminal. The antifuse varactor has a third gate terminal, a third drain terminal, a third source terminal coupled to the second drain terminal, and a third source/drain extension area coupled with the third drain terminal and the third source terminal for shorting the third drain terminal and the third source terminal. | 11-20-2014 |
20140293673 | NONVOLATILE MEMORY CELL STRUCTURE AND METHOD FOR PROGRAMMING AND READING THE SAME - A nonvolatile memory cell structure includes a doping well disposed in a substrate, an antifuse gate disposed on the doping well, a drain disposed in the substrate, an optional select gate disposed on the doping well and an optional shallow trench isolation disposed inside the doping well. | 10-02-2014 |
20140242763 | METHOD FOR FABRICATING NONVOLATILE MEMORY STRUCTURE - A nonvolatile memory structure includes a semiconductor substrate having thereon a first oxide define (OD) region, a second OD region and a third OD region arranged in a row. The first, second, and third OD regions are separated from one another by an isolation region. The isolation region includes a first intervening isolation region between the first OD region and the second OD region, and a second intervening isolation region between the second OD region and the third OD region. A select gate transistor is formed on the first OD region. A floating gate transistor is formed on the second OD region. The floating gate transistor is serially coupled to the select gate transistor. The floating gate transistor includes a floating gate that is completely overlapped with the underlying second OD region and is partially overlapped with the first and second intervening isolation regions. | 08-28-2014 |
20140211562 | FLASH MEMORY AND ASSOCIATED PROGRAMMING METHOD - A flash memory includes a program voltage generator, plural memory units, a current limiter, and a multi-bit program control unit. The program voltage generator is used for providing a constant program voltage during a detecting cycle and providing a dynamically-adjustable program voltage during a program cycle. The plural memory units output plural drain currents and plural data line voltages to plural data lines. The current limiter is used for receiving a reference current and a reference voltage, thereby controlling the plural drain currents. During the detecting cycle, a specified data line voltage of the plural data line voltages with the minimum voltage level is detected by the multi-bit program control unit. During the program cycle, the specified data line voltage is used as a feedback voltage, and the dynamically-adjustable program voltage is generated by the program voltage generator according to the feedback voltage. | 07-31-2014 |
20140177350 | SINGLE-ENDED SENSE AMPLIFIER CIRCUIT - A single-ended sense amplifier and a method for reading a memory cell are disclosed. The method includes the following steps. A bit line is charged according to a control signal. Thereafter, whether the dropoff time of the bit line voltage is greater or less than a predetermined time is deteremined. When the dropoff time of the voltage of the bit line is less than the predetermined time period, a first operation is sensed. On the other hand, when the dropoff time of the voltage of the bit line is greater than the predetermined time period, a second operation is sensed. The dropoff time of the voltage of the bit line is determined according to a parasitic capacitance on the bit line. A logic level of a sensing transistor circuit is retained and an output data signal according to the operation sensed is generated. | 06-26-2014 |
20140177338 | NON-VOLATILE MEMORY CELL - A non-volatile memory cell comprises a coupling device, a first and a second select transistor, and a first and a second floating gate transistor is disclosed. The coupling device is formed in a first conductivity region. The first select transistor is serially connected to the first floating gate transistor and the second select transistor. Moreover, the first select transistor, the first floating gate transistor, and the second select transistor are formed in a second conductivity region. The second floating gate transistor is formed in a third conductivity region, wherein the first conductivity region, the second conductivity region, and the third conductivity region are formed in a fourth conductivity region. The first conductivity region, the second conductivity region, and the third conductivity region are wells, and the fourth conductivity region is a deep well. The third conductivity region surrounds the first conductivity region and the second conductivity region. | 06-26-2014 |
20140160859 | FLASH MEMORY APPARATUS - A flash memory apparatus is provided. The flash memory apparatus includes a plurality of memory cell regions. Each of the memory cell regions includes a plurality of memory cells, a programming voltage control generator and an erase voltage control generator. The memory cells receives a programming control voltage through a control end point for programming operation, and the memory cells receives an erase control voltage through an erase end point for erasing operation. The programming voltage control generator provides the programming control voltage to the memory cells, and the erase voltage control generator provides the erase control voltage to the memory cells. | 06-12-2014 |
20140119125 | FLASH MEMORY - The present invention provides a flash memory including a memory cell, a current limiter and a program voltage generator. The memory cell is programmed in response to a program current and a program voltage. The current limiter reflects amount of the program current by a data-line signal, e.g., a data-line voltage. The program voltage generator generates and controls the program voltage in response to the data-line voltage, such that the program current can track to a constant reference current. | 05-01-2014 |
20140111245 | INTEGRATED CIRCUIT DESIGN PROTECTING DEVICE AND METHOD THEREOF - An integrated circuit design protecting device includes a switch device and a non-volatile memory. The switch device includes M input ports, N output ports, N multiplexers, and S selection nodes. Each multiplexer of the N multiplexers includes I input nodes, an output node, and at least one selection node. The I input nodes are coupled to I input ports of the M input ports. The output node is coupled to an output port of the N output ports. The non-volatile memory is coupled to the S selection nodes of the switch device for providing selection codes to the switch device. | 04-24-2014 |
20140103988 | VOLTAGE SWITCH CIRCUIT - A voltage switch circuit uses PMOS transistors to withstand high voltage stress. Consequently, the NMOS transistors are not subject to high voltage stress. The lightly-doped PMOS transistors are compatible with a logic circuit manufacturing process. Consequently, the voltage switch circuit may be produced by a logic circuit manufacturing process. | 04-17-2014 |
20140098591 | ANTIFUSE OTP MEMORY CELL WITH PERFORMANCE IMPROVEMENT PREVENTION AND OPERATING METHOD OF MEMORY - Provided is an OTP memory cell including a first antifuse unit, a second antifuse unit, a select transistor, and a well region. The first and the second antifuse unit respectively include an antifuse layer and an antifuse gate disposed on a substrate in sequence. The select transistor includes a select gate, a gate dielectric layer, a first doped region, and a second doped region. The select gate is disposed on the substrate. The gate dielectric layer is disposed between the select gate and the substrate. The first and the second doped region are respectively disposed in the substrate at two sides of the select gate, wherein the second doped region is disposed in the substrate at the periphery of the first and the second antifuse unit. The well region is disposed in the substrate below the first and the second antifuse unit and is connected to the second doped region. | 04-10-2014 |
20140073126 | METHOD OF MANUFACTURING NON-VOLATILE MEMORY - A method of manufacturing a non-volatile memory is provided. A substrate includes a memory cell region and a first periphery circuit region. The memory cell region includes a select transistor region. A first gate dielectric layer having a first thickness is formed on the substrate in the first periphery circuit region and the select transistor region. A portion of the first gate dielectric layer on the select transistor region is removed to form a second gate dielectric layer. The second dielectric layer has a second thickness, wherein the second thickness is less than the first thickness. | 03-13-2014 |
20140056051 | ONE-BIT MEMORY CELL FOR NONVOLATILE MEMORY AND ASSOCIATED CONTROLLING METHOD - A one-bit memory cell for a nonvolatile memory includes a bit line and a plurality of serially-connected storage units. The bit line is connected to the serially-connected storage units. Each storage unit includes a first doped region, a second doped region and a third doped region, which are formed in a surface of a substrate. A first gate structure is disposed over a first channel region between the first doped region and the second doped region. The first gate structure is connected to a control signal line. A second gate structure is disposed over a second channel region between the second doped region and the third doped region. The second gate structure is connected to an anti-fuse signal line. | 02-27-2014 |
20140016414 | FLASH MEMORY - The present invention provides a flash memory including a memory cell, a current limiter and a program voltage generator. The memory cell is programmed in response to a program current and a program voltage. The current limiter reflects amount of the program current by a data-line signal, e.g., a data-line voltage. The program voltage generator generates and controls the program voltage in response to the data-line voltage, such that the program current can track to a constant reference current. | 01-16-2014 |
20140006885 | MEMORY ARCHITECTURE AND ASSOCIATED SERIAL DIRECT ACCESS CIRCUIT | 01-02-2014 |
20130343126 | FLASH MEMORY APPARATUS WITH REFERENCE WORD LINES - The invention provides a flash memory apparatus including at least one flash memory array block and a sense amplifying module. The flash memory array block comprises N storage columns, N reference word-line cell units and a reference storage column, wherein N is a positive integer. Each of the reference word-line cell units disposed in each of the storage columns, wherein, the reference word-line cell units further coupled to a reference word line and a dummy word line. The reference storage column includes a plurality of reference bit-line cells, the reference word line and the dummy word line, one of the reference bit-line cells which coupled to the reference word line is coupled to a reference bit line. The sense amplifying module compares currents from one of the bit lines and the corresponding reference bit line to generate at least one sensing result. | 12-26-2013 |
20130248973 | ERASABLE PROGRAMMABLE SINGLE-PLOY NONVOLATILE MEMORY - An erasable programmable single-poly nonvolatile memory includes a substrate structure; a floating gate transistor having a floating gate, a gate oxide layer under the floating gate, and a channel region, wherein the channel region is formed in a N-well region; and an erase gate region, wherein the floating gate is extended to and is adjacent to the erase gate region and the erase gate region comprises a n-type source/drain region connected to an erase line voltage and a P-well region. The N-well and P-well region are formed in the substrate structure. The gate oxide layer comprises a first portion above the channel region of the floating gate transistor and a second portion above the erase gate region, and a thickness of the first portion of the gate oxide layer is different from a thickness of the second portion of the gate oxide layer. | 09-26-2013 |
20130248972 | ERASABLE PROGRAMMABLE SINGLE-PLOY NONVOLATILE MEMORY - An erasable programmable single-poly nonvolatile memory includes a substrate structure; a first PMOS transistor comprising a select gate, a first source/drain region, and a second source/drain region, wherein the select gate is connected to a select gate voltage, and the first source/drain region is connected to a source line voltage; a second PMOS transistor comprising the second source/drain region, a third source/drain region, and a floating gate, wherein the third source/drain region is connected to a bit line voltage and the first, second and third source/drain regions are constructed in a N-well region; and an erase gate region adjacent to the floating gate, wherein the erase gate region comprises a n-type source/drain region connected to an erase line voltage and a P-well region; wherein the N-well region and the P-well region are formed in the substrate structure. | 09-26-2013 |
20130242663 | PROGRAMMING INHIBIT METHOD OF NONVOLATILE MEMORY APPARATUS FOR REDUCING LEAKAGE CURRENT - The invention provides a nonvolatile memory apparatus. The nonvolatile memory apparatus comprises a plurality of memory cells and a signal generator. The memory cells are arranged in an array, and each of the memory cells has a control gate terminal, a floating gate, a source line terminal, a bit-line terminal, a selected gate terminal and a word-line terminal. The signal generator is coupled to the memory cells. When the nonvolatile memory apparatus executes a programming operation, the signal generator provides a programming signal to the control gate terminals of a plurality of inhibited memory cells among the memory cells. Wherein, the programming signal is a pulse signal with a direct-current (DC) offset voltage. | 09-19-2013 |
20130237048 | METHOD OF FABRICATING ERASABLE PROGRAMMABLE SINGLE-PLOY NONVOLATILE MEMORY - The present invention provides method of fabricating an erasable programmable single-poly nonvolatile memory, comprising steps of: defining a first area and a second area in a first type substrate; forming a second type well region in the first area; forming a first gate oxide layer and a second gate oxide layer covered on a surface of the first area, wherein the second gate oxide layer is extended to and is adjacent to the second area; forming a DDD region in the second area; etching a portion of the second gate oxide layer above the second area; forming two polysilicon gates covered on the first and the second gate oxide layers; and defining a second type doped region in the DDD region and a first type doped regions in the second type well region. | 09-12-2013 |
20130234228 | ERASABLE PROGRAMMABLE SINGLE-PLOY NONVOLATILE MEMORY - An erasable programmable single-poly nonvolatile memory includes a floating gate transistor having a floating gate, a gate oxide layer under the floating gate, and a channel region; and an erase gate region, wherein the floating gate is extended to and is adjacent to the erase gate region. The gate oxide layer comprises a first portion above the channel region of the floating gate transistor and a second portion above the erase gate region, and a thickness of the first portion of the gate oxide layer is different from a thickness of the second portion of the gate oxide layer. | 09-12-2013 |
20130234227 | ERASABLE PROGRAMMABLE SINGLE-PLOY NONVOLATILE MEMORY - An erasable programmable single-poly nonvolatile memory includes a first PMOS transistor comprising a select gate, a first p-type doped region, and a second p-type doped region, wherein the select gate is connected to a select gate voltage, and the first p-type doped region is connected to a source line voltage; a second PMOS transistor comprising the second p-type doped region, a third p-type doped region, and a floating gate, wherein the third p-type doped region is connected to a bit line voltage; and an erase gate region adjacent to the floating gate, wherein the erase gate region is connected to an erase line voltage. | 09-12-2013 |
20130176808 | WORD LINE BOOST CIRCUIT - A word line boost circuit including a first address transfer detector, a second address transfer detector and a boost operation unit is provided. The first address transfer detector generates a first detection pulse in response to variation of a row address signal. The second address transfer detector generates a second detection pulse in response to variation of a column address signal. Moreover, the boost operation unit generates a selection voltage by using a boost voltage according to the first detection pulse, and determines whether or not to use the boost voltage to generate the selection voltage according to a delay time between the first detection pulse and the second detection pulse. | 07-11-2013 |
20130176793 | FLASH MEMORY APPARATUS - A flash memory apparatus is provided. The flash memory apparatus includes a plurality of memory cells and a plurality of programming voltage control generators. Each of the memory cells receives a programming control voltage through a control end thereof, and executes data programming operation according to the programming control voltages. Each of the programming voltage control generators includes a pre-charge voltage transmitter and a pumping capacitor. The pre-charge voltage transmitter provides pre-charge voltage to the end of each of the corresponding memory cells according to pre-charge enable signal during a first period. A pumping voltage is provided to the pumping capacitor during a second period, and the programming control voltage is generated at the control end of each of the memory cells. | 07-11-2013 |
20130121079 | NOR FLAH MEMORY CELL AND STRUCTURE THEREOF - The present invention provides a NOR flash memory cell. The NOR flash memory cell includes a first transistor, a second transistor and at least one third transistor. The first transistor has a control terminal, a first terminal and a second terminal. The control terminal used to receive a word line signal and the first terminal used to receive a bit line signal. A gate of the first transistor comprises a silicon-rich nitride layer and an oxide layer, wherein the silicon-rich nitride layer is buried in the oxide layer. A control terminal of the second transistor used to receive a read signal. A second terminal of the second transistor used to transport a source line signal according to the read signal. The third transistor coupled between the first transistor and the bit line signal, and a control terminal of the third transistor receives a midway control signal. | 05-16-2013 |
20130119458 | NOR FLASH MEMORY CELL AND STRUCTURE THEREOF - The present invention provides a NOR flash memory cell. The NOR flash memory cell includes a a substrate, an active area, a first gate structure, a second gate structure and at least one third gate structure. The first gate structure covers a first partial region of the active area and is formed by a silicon-rich nitride material. The second gate structure covers a second partial region of the active area. The third gate structure covers a third partial region between a first opening and the first gate structure. The active area has the first opening, the first opening disposed on a first side of the first gate structure and the first side is not neighbor to the second gate structure. The NOR flash memory cell further comprises a first conducting structure for covering the first opening to form a bit line signal receiving terminal. | 05-16-2013 |
20130119453 | NON-VOLATILE MEMORY UNIT CELL WITH IMPROVED SENSING MARGIN AND RELIABILITY - A non-volatile memory unit cell includes a transistor pair, and first, second, third and fourth control gates. The transistor pair has a first transistor and a second transistor that are connected in parallel and of opposite types. The first transistor and the second transistor have a first floating polysilicon gate and a second floating polysilicon gate, respectively, wherein the first floating polysilicon gate and the second floating polysilicon gate are electrically or physically isolated. The first control gate is capacitively coupled to the first floating polysilicon gate through a first coupling junction. The second control gate is capacitively coupled to the second floating polysilicon gates through a second coupling junction. The third control gate is capacitively coupled to the first floating polysilicon gate through a first tunneling junction. The fourth control gate is capacitively coupled to the second floating polysilicon gates through a second tunneling junction. | 05-16-2013 |
20130105884 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH INTRINSIC CHARGE TRAPPING LAYER | 05-02-2013 |
20130099850 | VOLTAGE SWITCH CIRCUIT - A voltage switch circuit uses PMOS transistors to withstand high voltage stress. Consequently, the NMOS transistors are not subject to high voltage stress. The lightly-doped PMOS transistors are compatible with a logic circuit manufacturing process. Consequently, the voltage switch circuit may be produced by a logic circuit manufacturing process. | 04-25-2013 |
20130044548 | FLASH MEMORY AND MEMORY CELL PROGRAMMING METHOD THEREOF - A flash memory and a memory cell programming method thereof are provided. The programming method includes the following steps. A preset programming voltage is applied to a memory cell to program the memory cell. A first verify voltage is applied to the memory cell to detect a programming result of the memory cell. A programming voltage applied on the memory cell is adjusted according to the programming result of the memory cell. | 02-21-2013 |
20130010518 | ANTI-FUSE MEMORY ULTILIZING A COUPLING CHANNEL AND OPERATING METHOD THEREOF - An anti-fuse memory with coupling channel is provided. The anti-fuse memory includes a substrate of a first conductive type, a doped region of a second conductive type, a coupling gate, a gate dielectric layer, an anti-fuse gate, and an anti-fuse layer. The substrate has an isolation structure. The doped region is disposed in the substrate. A channel region is defined between the doped region and the isolation structure. The coupling gate is disposed on the substrate between the doped region and the isolation structure. The coupling gate is adjacent to the doped region. The gate dielectric layer is disposed between the coupling gate and the substrate. The anti-fuse gate is disposed on the substrate between the coupling gate and the isolation structure. The anti-fuse gate and the coupling gate have a space therebetween. The anti-fuse layer is disposed between the anti-fuse gate and the substrate. | 01-10-2013 |
20120273860 | NON-VOLATILE MEMORY UNIT CELL WITH IMPROVED SENSING MARGIN AND RELIABILITY - An only-one-polysilicon layer non-volatile memory unit cell includes a first P-type transistor, a second P-type transistor, a N-type transistor pair, a first and second coupling capacitors is provided. The N-type transistor pair has a third transistor and a fourth transistor that are connected. The third transistor and the fourth transistor have a first floating polysilicon gate and a second floating polysilicon gate to serve as charge storage mediums, respectively. One end of the second coupling capacitor is connected to the gate of the second transistor and is coupled to the second floating polysilicon gate, the other end of the second coupling capacitor receives a second control voltage. One end of the second coupling capacitor is connected to the gate of the second transistor and is coupled to the second floating polysilicon gate, the other end of the second coupling capacitor receives a second control voltage. | 11-01-2012 |
20120268188 | VOLATGE LEVEL SHIFTING APPARATUS - A voltage level shifting apparatus is disclosed. The voltage level shifting apparatus has a cross-coupled transistor pair, a plurality of transistor pairs, a first diode string, a second diode string and an input transistor pair. One of the transistor pairs is coupled to the cross-coupled transistor pair, and the transistor pairs are controlled by a plurality of reference voltages. The first and the second diode strings are coupled between two of the transistor pairs. Each of the first and the second diode strings has at least one diode. The input transistor pair receives a first and a second input voltage, and the first and second input voltages are complementary signals. The cross-coupled transistor pair generates and outputs a first output voltage and a second output voltage by shifting the voltage level of the first and the second input voltage. | 10-25-2012 |
20120134205 | OPERATING METHOD FOR MEMORY UNIT - An operating method for a memory unit is provided, wherein the memory unit includes a well region, a select gate, a first gate, a second gate, an oxide nitride spacer, a first diffusion region, and a second diffusion region. The operating method for the memory unit comprises the following steps. During a programming operation, a breakdown voltage is coupled to the second diffusion region through a first channel region formed under the select gate. A programming voltage is sequentially or simultaneously applied to the first gate and the second gate to rupture a first oxide layer and a second oxide layer, wherein the first oxide layer is disposed between the first gate and the well region, and the second oxide layer is disposed between the second gate and the well region. | 05-31-2012 |
20120124272 | FLASH MEMORY APPARATUS - A flash memory apparatus including a command analysis unit, a first flash memory and a second flash memory is provided. The command analysis unit with a plurality of command buffers receives a plurality of command elements and queues the command elements in the command buffers in sequence. The command analysis unit transmits the command elements simultaneously to the first flash memory and the second flash memory through a command bus, and the flash memory device writes/reads the first flash memory and the second flash memory simultaneously through a first data bus and a second data bus different from the first data bus respectively to execute an operation. The flash memory device queues the command elements so as to enhance the command throughput, and the flash memories share the same command bus for dual channel operation. | 05-17-2012 |
20120099361 | SEMICONDUCTOR CAPACITOR, ONE TIME PROGRAMMABLE MEMORY CELL AND FABRICATING METHOD AND OPERATING METHOD THEREOF - A one time programmable memory cell having a gate, a gate dielectric layer, a source region, a drain region, a capacitor dielectric layer and a conductive plug is provided herein. The gate dielectric layer is disposed on a substrate. The gate is disposed on the gate dielectric layer. The source region and the drain region are disposed in the substrate at the sides of the gate, respectively. The capacitor dielectric layer is disposed on the source region. The capacitor dielectric layer is a resistive protection oxide layer or a self-aligned silicide block layer. The conductive plug is disposed on the capacitor dielectric layer. The conductive plug is served as a first electrode of a capacitor and the source region is served as a second electrode of the capacitor. The one time programmable memory (OTP) cell is programmed by making the capacitor dielectric layer breakdown. | 04-26-2012 |
20110299336 | SINGLE-POLYSILICON LAYER NON-VOLATILE MEMORY AND OPERATING METHOD THEREOF - A single-polysilicon layer non-volatile memory having a floating gate transistor, a program gate and a control gate is provided. The floating gate transistor has a floating gate and a tunneling dielectric layer. The floating gate is disposed on a substrate. The tunneling dielectric layer is disposed between the floating gate and the substrate. The program gate, the control gate and the erase gate are respectively disposed in the substrate under the floating gate separated by the tunneling dielectric layer. Therefore, during a program operation and an erase operation, charges are injected in and expelled out through different regions of the tunneling dielectric layer, so as to increase reliability of the non-volatile memory. | 12-08-2011 |
20110298556 | VOLTAGE SOURCE CIRCUIT FOR CRYSTAL OSCILLATION CIRCUIT - A voltage source circuit for a crystal oscillation circuit is provided, in which the voltage source circuit and the crystal oscillation circuit are formed with the same process. The voltage source circuit includes a current source, a first PMOS, a first NMOS and a regulator unit. The current source is coupled between a voltage source and an output terminal, in which the output terminal outputs a reference voltage. Both of the gates and drains of the first PMOS and the NMOS are coupled to each other, and the first PMOS and the first NMOS are coupled between the output terminal and a ground. The regulator unit generates a work voltage to the crystal oscillation circuit as a voltage source of the crystal oscillation circuit according to the reference voltage. | 12-08-2011 |
20110242893 | NON-VOLATILE MEMORY UNIT CELL WITH IMPROVED SENSING MARGIN AND RELIABILITY - A non-volatile memory unit cell includes a first transistor pair and first and second control gates. The first transistor pair includes first and second transistors that are connected in series and of the same type. The first and second transistors have a first floating polysilicon gate and a second floating polysilicon gate, respectively. The first control gate is coupled to the first floating polysilicon gate through a tunneling junction and the second control gate is coupled to the second floating polysilicon gate through another tunneling junction. | 10-06-2011 |
20110194355 | VERIFY WHILE WRITE SCHEME FOR NON-VOLATILE MEMORY CELL - A verify while write (VWW) scheme for a non-volatile memory (NVM) cell is provided. The VWW scheme conducts simultaneous write and verify operation by sensing the memory cell current during the write pulse at exactly the same write bias condition in contrast to the “verify+retry-write” write algorithm in the prior art. The VWW scheme removes the iterative “verify and then retry-write” to save both control timing and power consumed in these iterations. Instead, the VWW scheme is composed of single write pulse only in the entire algorithm with exact write pulse width trimmed automatically for multiple memory cells undergoing parallel writing within one write command assertion. Faster write speed, more power efficient write operation and higher reliability of non-volatile semiconductor memory cell are thus achieved with the VWW scheme in this present disclosure. | 08-11-2011 |
20110057243 | NON-VOLATILE MEMORY WITH A STABLE THRESHOLD VOLTAGE ON SOI SUBSTRATE - A non-volatile memory disposed in a SOI substrate is provided. The non-volatile memory includes a memory cell and a first conductive type doped region. The memory cell includes a gate, a charge storage structure, a bottom dielectric layer, a second conductive type drain region, and a second conductive type source region. The gate is disposed on the SOI substrate. The charge storage structure is disposed between the gate and the SOI substrate. The bottom dielectric layer is disposed between the charge storage layer and the SOI substrate. The second conductive type drain region and the second conductive type source region are disposed in a first conductive type silicon body layer next to the two sides of the gate. The first conductive type doped region is disposed in the first conductive type silicon body layer and electrically connected to the first conductive type silicon body layer beneath the gate. | 03-10-2011 |
20100265755 | ONE TIME PROGRAMMABLE READ ONLY MEMORY AND PROGRAMMING METHOD THEREOF - A one time programmable read only memory disposed on a substrate of a first conductive type is provided. A gate structure is disposed on the substrate. A first doped region and a second doped region are disposed in the substrate at respective sides of the gate structure, and the first doped region and the second doped region are of a second conductive type which is different from the first conductive type. A third doped region of the first conductive type is disposed in the substrate and is adjacent to the second doped region, and a junction is formed between the third doped region and the second doped region. A metal silicide layer is disposed on the substrate. An clearance is formed in the metal silicide layer, and the clearance at least exposes the junction. | 10-21-2010 |
20100148238 | NON-VOLATILE MEMORY AND FABRICATING METHOD THEREOF - A non-volatile memory is formed on a substrate. The non-volatile memory includes an isolation structure, a floating gate, and a gate dielectric layer. The isolation structure is disposed in the substrate to define an active area. The floating gate is disposed on the substrate and crosses over the active area. The gate dielectric layer is disposed between the floating gate and the substrate. The floating gate includes a first region and a second region. An energy band of the second region is lower than an energy band of the first region, so that charges stored in the floating gate are away from an overlap region of the floating gate and the gate dielectric layer. | 06-17-2010 |
20100073985 | METHOD FOR OPERATING ONE-TIME PROGRAMMABLE READ-ONLY MEMORY - A method for operating a one-time programmable read-only memory (OTP-ROM) is provided. The OTP-ROM comprises a first gate and a second gate respectively disposed on a gate dielectric layer between a first doped region and a second doped region on a substrate, wherein the first gate is adjacent to the first doped region and coupled to the first doped region, the second gate is adjacent to the second doped region, the first gate is electrically coupled grounded, and the OTP-ROM is programmed through a breakdown effect. The method comprises a step of programming the OTP-ROM under the conditions that a voltage of the second doped region is higher than a voltage of the first doped region, the voltage of the second gate is higher than a threshold voltage to pass the voltage of the second doped region, and the first doped region and the substrate are at a reference voltage. | 03-25-2010 |
20100014359 | OPERATING METHOD OF NON-VOLATILE MEMORY - An operating method of a non-volatile memory adapted for a non-volatile memory disposed on an SOI substrate including a first conductive type silicon body layer is provided. The non-volatile memory includes a gate, a charge storage structure, a second conductive type drain region, and a second conductive type source region. In operating such a non-volatile memory, voltages are applied to the gate, the second conductive type drain region, the second conductive type source region and the first conductive type silicon body layer beneath the gate, to inject electrons or holes in to the charge storage structure or evacuate the electrons from the charge storage structure by a method selected from a group consisting of channel hot carrier injection, source side injection, band-to-band tunnelling hot carrier injection and Fowler-Nordheim (F-N) tunnelling. | 01-21-2010 |
20100006924 | ONE-TIME PROGRAMMABLE READ-ONLY MEMORY - A one-time programmable read-only memory (OTP-ROM) including a substrate, a first doped region, a second doped region, a third doped region, a first dielectric layer, a select gate, a second dielectric layer, a first channel, a second channel and a silicide layer is provided. The first doped region, the second doped region and the third doped region are disposed apart in a substrate. The first dielectric layer is disposed on the substrate between the first doped region and the second doped region. The select gate is disposed on the first dielectric layer. The second dielectric layer is disposed on the substrate between the second doped region and the third doped region. The silicide layer is disposed on the first doped region, the second doped region and the third doped region. The OTP-ROM stores data by a punch-through effect occurring between the second doped region and the third doped region. | 01-14-2010 |
20090244985 | METHOD FOR ERASING A P-CHANNEL NON-VOLATILE MEMORY - A present invention relates to a method of erasing a P-channel non-volatile memory is provided. This P-channel non-volatile memory includes a select transistor and a memory cell connected in series and disposed on a substrate. In the method of erasing the P-channel non-volatile memory, holes are injected into a charge storage structure by substrate hole injection effect. Hence, the applied operational voltage is low, so the power consumption is lowered, and the efficiency of erasing is enhanced. As a result, an operational speed of the memory is accelerated, and the reliability of the memory is improved. | 10-01-2009 |
20090168280 | ELECTROSTATIC DISCHARGE AVOIDING CIRCUIT - An ESD avoiding circuit includes a first ESD protection unit, an ESD detection unit, a switch unit, and an RC filter unit. The first ESD protection unit transmits an ESD current between a first conducting path and a second conducting path. The ESD detection unit is coupled to the first conducting path. The ESD detection unit includes an input terminal, and an output terminal coupled to the first ESD protection unit for detecting an ESD and controlling the first ESD protection unit to conduct the ESD current according to a detection result. The switch unit is coupled between the first conducting path and a core circuit and conducts the first conducting path to the core circuit according to signals of the input terminal and the output terminal of the ESD detection unit. The RC filter unit couples a first voltage to the input terminal of the ESD detection unit. | 07-02-2009 |
20090136038 | APPARATUS FOR RECEIVING ENCRYPTED DIGITAL DATA AND CRYPTOGRAPHIC KEY STORAGE UNIT THEREOF - An apparatus for receiving encrypted digital data is provided. The apparatus includes a decryption circuit, a controller, an NVM, and a one-way device. The decryption circuit receives a piece of encrypted digital data and decrypts the encrypted digital data into a piece of decrypted digital data. The controller is coupled to the decryption circuit for controlling the flow of the decryption performed by the decryption circuit. The NVM is coupled to the decryption circuit for storing and providing a cryptographic key required in the decryption. The one-way device is coupled between an input bus and the NVM. The one-way device blocks read requests received from the input bus. Besides, the one-way device translates write requests received from the input bus into access signals compatible with the NVM and then outputs the access signals to the NVM. | 05-28-2009 |
20080316660 | ELECTROSTATIC DISCHARGE AVOIDING CIRCUIT - An electrostatic discharge (ESD) avoiding circuit comprises an ESD detecting unit and a switch unit. The ESD detecting unit is coupled to a first conductive path for detecting whether the ESD happened or not. The switch unit is coupled between the first conductive path and a core circuit for switching whether the first conductive path is conducted to the core circuit or not according to a detection result of the ESD detecting unit. The ESD avoiding circuit can avoid an electrostatic current transmitting to the core circuit when the ESD is happened, and the ESD avoiding circuit can make the normal signal/voltage providing to the core circuit for operating when the ESD isn't happened. | 12-25-2008 |
20080310235 | SENSING CIRCUIT FOR MEMORIES - A memory apparatus includes a plurality of memory units, a sensing circuit and a bias-generating circuit. The plurality of memory units respectively outputs a data current to the sensing circuit, while the sensing circuit further includes a plurality of first transistors, a plurality of second transistors and a plurality of sensing amplifiers. In order to speed up the access time of the memory units, the bias-generating circuit rapidly provides a bias signal to the sensing circuit to turn on the first transistors of the sensing circuit. In the present invention, the sensing circuit uses a common reference voltage to reduce the circuit utilization area of the memory apparatus. | 12-18-2008 |
20080309399 | Two-phase charge pump circuit without body effect - A two-phase charge pump circuit without the body effect includes a voltage boost stage, an input stage connected to the voltage boost stage, and a high-voltage generator connected to the input stage. Each of the circuits can consist of NMOS or PMOS transistors. The body of each NMOS transistor is connected to an NMOS switch. The body of each PMOS transistor is connected to a PMOS switch. By providing an appropriate driving signal to each NMOS or PMOS switch, the body of each NMOS transistor can be switched to a lower voltage level and the body of each PMOS transistor is switched to a higher voltage level. This can prevent the body effect from occurring. | 12-18-2008 |
20080296701 | ONE-TIME PROGRAMMABLE READ-ONLY MEMORY - A one-time programmable read-only memory (OTP-ROM) including a substrate, a first doped region, a second doped region, a gate dielectric layer, a first gate and a second gate. The substrate is of a first conductive type. The first doped region and the second doped region are of a second conductive type and are separately disposed in the substrate. The gate dielectric layer is disposed on the substrate between the first doped region and the second doped region. The first gate and the second gate are disposed on the gate dielectric layer, respectively. The first gate is adjacent to the first doped region, while the second gate is adjacent to the second doped region. Here, the first gate is electrically coupled grounded, and the OTP-ROM is programmed through a breakdown effect. | 12-04-2008 |
20080246536 | Two-phase charge pump circuit without body effect - A two-phase charge pump circuit without the body effect includes a voltage boost stage, an input stage connected to the voltage boost stage, and a high-voltage generator connected to the input stage. Each of the circuits can consist of NMOS or PMOS transistors. The body of each NMOS transistor is connected to an NMOS switch. The body of each PMOS transistor is connected to a PMOS switch. By providing an appropriate driving signal to each NMOS or PMOS switch, the body of each NMOS transistor can be switched to a lower voltage level and the body of each PMOS transistor is switched to a higher voltage level. This can prevent the body effect from occurring. | 10-09-2008 |
20080205115 | APPARATUS AND METHOD FOR TRIMMING INTEGRATED CIRCUIT - A trimming apparatus including a switch transistor and a one-time programming (OTP) memory component is provided. The switch transistor has a first source/drain terminal connected to a first bias voltage, a gate terminal used for receiving a switch signal, and a second source/drain terminal connected to a first source/drain terminal of the OTP memory component. When the trimming apparatus provided by the present invention intends to perform trimming for an integrated circuit, the switch transistor is conducted to program the OTP memory component. | 08-28-2008 |