EBARA CORPORATION Patent applications |
Patent application number | Title | Published |
20160131141 | MAGNETIC LEVITATED PUMP - A magnetic levitated pump that does not cause pulsation of a pumped liquid and can suppress the generation of particles, which are liable to be produced by contact of a sliding part, is disclosed. The magnetic levitated pump for magnetically levitating an impeller housed in a pump casing includes a motor configured to rotate the impeller, and an electromagnet configured to magnetically support the impeller. The motor and the electromagnet are arranged so as to face each other across the impeller, and the motor is arranged on the opposite side of a suction port of the pump casing. | 05-12-2016 |
20160130702 | METHOD OF OPERATING AN ELECTROLESS PLATING APPARATUS - A method of operating an electroless plating apparatus is disclosed. The operating method includes: storing in the electroless plating apparatus an order of priority of the plurality of processes which has been predetermined based on a stability of a processed substrate with respect to pure water; supplying pure water into the holder storage bath when any of the plurality of processing baths malfunctions; determining whether or not a relieving process can be performed, the relieving process being a process of performing a higher-priority process on a substrate; if the relieving process can be performed, performing the relieving process and then immersing the substrate holder holding the substrate in the pure water in the holder storage bath; and if the relieving process cannot be performed, immersing the substrate holder, holding the substrate, in the pure water held in the holder storage bath without performing the relieving process. | 05-12-2016 |
20160108927 | PUMP IMPELLER FOR SUBMERGED PUMP AND SUBMERGED PUMP INCLUDING SAME - A pump impeller for a submerged pump capable of removing or reducing the radial load is provided. A non-clogging submerged pump is provided, which includes a substantially cylindrical body, an intake port provided in a center of a lower end surface of the body, a discharge port that is open in a side surface of the body, and a flow channel passing from the intake port to the discharge port within the body. The flow channel includes a plurality of flow channels, and the flow channels have their size, shape, and position defined such that fluid unbalance is reduced with respect to an axis of rotation. | 04-21-2016 |
20150354558 | VOLUTE PUMP - The present invention relates to a volute pump and particularly provides a volute pump for delivering a liquid containing fibrous substances and solid substances, while preventing these substances from obstructing the pump. The volute pump includes a pump casing ( | 12-10-2015 |
20150122993 | TESTING APPARATUS USING CHARGED PARTICLES AND DEVICE MANUFACTURING METHOD USING THE TESTING APPARATUS - A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate. | 05-07-2015 |
20150060666 | SPECIMEN OBSERVATION METHOD AND DEVICE USING SECONDARY EMISSION ELECTRON AND MIRROR ELECTRON DETECTION - A technique capable of improving the ability to observe a specimen using an electron beam in an energy region which has not been conventionally given attention is provided. This specimen observation method comprises: irradiating the specimen with an electron beam; detecting electrons to be observed which have been generated and have obtained information on the specimen by the electron beam irradiation; and generating an image of the specimen from the detected electrons to be observed. The electron beam irradiation comprises irradiating the specimen with the electron beam with a landing energy set in a transition region between a secondary emission electron region in which secondary emission electrons are detected and a mirror electron region in which mirror electrons are detected, thereby causing the secondary emission electrons and the mirror electrons to be mixed as the electrons to be observed. The detection of the electrons to be observed comprises performing the detection in a state where the secondary emission electrons and the mirror electrons are mixed. Observation and inspection can be quickly carried out for a fine foreign material and pattern of 100 nm or less. | 03-05-2015 |
20140367570 | SUBSTRATE INSPECTION METHOD AND A SUBSTRATE PROCESSING METHOD - There is provided a substrate inspection method. The method includes: maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; positioning the substrate on a stage in the inspection chamber; selecting an evaluation parameter according to a kind of said processing apparatus; and determining inspection regions of the substrate so that an inspection time required per a lot of the substrate is equal to a processing time spent for said processing step required per a lot of the substrate. The method also includes radiating a primary electron beam from an electron gun; deflecting the primary electron beam with an E*B unit; irradiating said inspection regions of the substrate with the deflected primary electron beam; and projecting secondary electrons emitted from said substrate through the E*B unit onto a detector with a secondary optical system. | 12-18-2014 |
20140358280 | ROBOT ARM CONTROL APPARATUS, SUBSTRATE TRANSFER APPARATUS, SUBSTRATE PROCESSING APPARATUS, ROBOT ARM CONTROL METHOD, AND PROGRAM - A robot arm control apparatus for controlling the operation of a robot arm device having at least two arm portions and at least two rotational joints configured to rotate the arm portions includes a control unit configured to control rotation of the joints to move generally rectilinearly the distal end of a predetermined arm portion of the arm portions except the most proximal arm portion thereof. The control unit controls the rotation of the joints so that the motion acceleration of the distal end of the predetermined arm portion when the distal end is moved generally rectilinearly results in coincidence with a predetermined temporal transition. The motion acceleration with the predetermined temporal transition is such that, when the motion acceleration is expressed as a function of time, a derivative obtained by differentiating the function with respect to the time shows a continuous transition with respect to changes in the time. | 12-04-2014 |
20140352820 | VACUUM PUMP WITH ABATEMENT FUNCTION - A vacuum pump with abatement function is used for evacuating a chamber of a manufacturing apparatus. The vacuum pump with abatement function includes a vacuum pump having a discharge port to which one or more abatement parts for treating an exhaust gas discharged from the vacuum pump to make the exhaust gas harmless are attached. The one or more abatement parts are selected, depending on the amount and kind of the exhaust gas discharged from the vacuum pump, from plural kinds of abatement parts which have different treatment types of exhaust gas and/or different treatment amounts of exhaust gas. | 12-04-2014 |
20140352608 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus capable of preventing corrosion of metal interconnects of a substrate formed thereon is disclosed. The substrate processing apparatus includes a substrate holder configured to hold a substrate horizontally and rotate the substrate, and a slit nozzle configured to supply a processing liquid onto a surface of the substrate. The slit nozzle is adjacent to the surface of the substrate and extends in approximately a radial direction of the substrate. | 12-04-2014 |
20140348717 | VACUUM PUMP WITH ABATEMENT FUNCTION - A vacuum pump with abatement function is used for evacuating a chamber of a manufacturing apparatus. The vacuum pump with abatement function includes a vacuum pump having a discharge port to which at least one abatement part for treating an exhaust gas discharged from the vacuum pump to make the exhaust gas harmless is attached. The abatement part is selected from a plurality of abatement parts having different treatment types of exhaust gas and/or different treatment amounts of exhaust gas and/or different treatment performances of exhaust gas. | 11-27-2014 |
20140345658 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus | 11-27-2014 |
20140332393 | Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD - An Sn alloy plating apparatus is disclosed. The apparatus includes a plating bath configured to store an Sn alloy plating solution therein with an insoluble anode and a substrate immersed in the Sn alloy plating solution, an Sn dissolving having an anion exchange membrane therein which isolates an anode chamber, in which an Sn anode is disposed, and a cathode chamber, in which a cathode is disposed, from each other, a pure water supply structure configured to supply pure water to the anode chamber and the cathode chamber, a methanesulfonic acid solution supply structure configured to supply a methanesulfonic acid solution, containing a methanesulfonic acid, to the anode chamber and the cathode chamber, and an Sn replenisher supply structure configured to supply an Sn replenisher, produced in the anode chamber and containing Sn ions and a methanesulfonic acid, to the plating bath. | 11-13-2014 |
20140331440 | SUBSTRATE CLEANING APPARATUS - A substrate cleaning apparatus including a self-cleaning device is disclosed. The substrate cleaning apparatus includes a self-cleaning device configured to clean a cylindrical scrub-cleaning tool that is rubbed against a substrate surface. The self-cleaning device includes a cleaning body having an inner circumferential surface that is shaped along an circumferential surface of the scrub-cleaning tool, and at least one cleaning nozzle configured to eject a cleaning fluid toward the circumferential surface of the scrub-cleaning tool through a gap between the circumferential surface of the scrub-cleaning tool and the inner circumferential surface of the cleaning body. | 11-13-2014 |
20140323016 | POLISHING METHOD AND POLISHING APPARATUS - A method of polishing a substrate is disclosed. The method includes irradiating the substrate with light; measuring intensity of the reflected light; producing spectral waveform representing relationship between relative reflectance and wavelength of the light; performing a Fourier transform process on the spectral waveform to determine a thickness of the film and a corresponding strength of frequency component; determining whether the determined thickness of the film is reliable or not by comparing the strength of frequency component with a threshold value; calculating a defective data rate representing a proportion of the number of unreliable measured values to the total number of measured values; and changing the threshold value based on the defective data rate. | 10-30-2014 |
20140319346 | INSPECTION SYSTEM BY CHARGED PARTICLE BEAM AND METHOD OF MANUFACTURING DEVICES USING THE SYSTEM - An inspection apparatus by an electron beam comprises: an electron-optical device | 10-30-2014 |
20140319345 | INSPECTION APPARATUS - An inspection apparatus includes: beam generation means for generating any of charged particles and electromagnetic waves as a beam; a primary optical system that guides the beam into an inspection object held in a working chamber and irradiates the inspection object with the beam; a secondary optical system that detects secondary charged particles occurring from the inspection object; and an image processing system that forms an image on the basis of the detected secondary charged particles. The primary optical system includes a photoelectron generator having a photoelectronic surface. The base material of the photoelectronic surface is made of material having a higher thermal conductivity than the thermal conductivity of quartz. | 10-30-2014 |
20140314957 | SUBSTRATE PLATING APPARATUS AND SUBSTRATE PLATING METHOD - A substrate plating apparatus is disclosed. The apparatus includes a substrate holder; a plating bath configured to plate a surface of the substrate in a plating solution; a cleaning bath configured to clean the substrate holder and the substrate with a cleaning liquid; an inner shell disposed in the cleaning bath and configured to house the substrate holder holding the substrate therein; and a cleaning liquid supply conduit configured to supply a cleaning liquid into the inner shell to clean the substrate, together with the substrate holder, with the cleaning liquid. The inner shell has an inner surface having an uneven configuration that follows an uneven exterior configuration of the substrate holder holding the substrate. | 10-23-2014 |
20140312227 | INSPECTION APPARATUS - An inspection apparatus capable of facilitating reduction in cost of the apparatus is provided. The inspection apparatus includes: beam generation means for generating any of charged particles and electromagnetic waves as a beam; a primary optical system that guides the beam into an inspection object held on a movable stage in a working chamber and irradiates the inspection object with the beam; a secondary optical system that detects secondary charged particles occurring from the inspection object; and an image processing system that forms an image on the basis of the detected secondary charged particles. The inspection apparatus further includes: a linear motor that drives the movable stage; and a Helmholtz coil that causes a magnetic field for canceling a magnetic field caused by the linear motor when the movable stage is driven. | 10-23-2014 |
20140311532 | SUBSTRATE PROCESSING APPARATUS AND PROCESSED SUBSTRATE MANUFACTURING METHOD - A substrate processing apparatus has a substrate rotating device | 10-23-2014 |
20140292111 | STAGE DEVICE AND ELECTRON BEAM APPLICATION APPARATUS - A stage device of an electron beam application apparatus configured to irradiate a sample with an electron beam is configured in a compact and simple manner using a linear motor so that it is possible to minimize an influence of magnetic force of the linear motor to the process of inspection or processing of the sample. The stage device housed in a container is configured so that a first stage and a second stage disposed in upper and lower stages are driven by linear motors, respectively, and motor stationary elements and motor movable elements of both motors are disposed on the outside of an electron beam irradiation region so as not to enter this region during the process. | 10-02-2014 |
20140291980 | VACUUM PUMP CONNECTING APPARATUS AND METHOD FOR INSTALLING VACUUM PUMP CONNECTING APPARATUS - A vacuum pump connecting apparatus has a first vibration absorbing portion and a second vibration absorbing portion which are connected to an evacuation connection portion so as to dispose the first vibration absorbing portion and the second vibration absorbing portion opposite each other via the evacuation connection portion. The first vibration absorbing portion is connected to an intake port of a vacuum pump at a second end of the first vibration absorbing portion opposite to a first end of the first vibration absorbing portion connected to the evacuation connection portion. The first vibration absorbing portion and the second vibration absorbing portion are elastic bellows. A vacuum pump connecting apparatus has a rigid coupling member is connected to a second end of the second vibration absorbing portion opposite to a first end of the second vibration absorbing portion connected to the evacuation connection portion. | 10-02-2014 |
20140273308 | METHOD OF MEASURING SURFACE PROPERTIES OF POLISHING PAD - The present invention relates to a method of measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The method of measuring surface properties of a polishing pad includes applying a laser beam to the polishing pad, detecting scattered light that is reflected and scattered by the polishing pad with a photodetector and performing an optical Fourier transform on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad, and calculating a numerical value representing surface properties of the polishing pad based on the intensity distribution corresponding to two different prescribed spatial wavelength ranges. | 09-18-2014 |
20140259728 | SUBSTRATE DRYING APPARATUS, SUBSTRATE DRYING METHOD AND CONTROL PROGRAM - A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ. | 09-18-2014 |
20140256457 | SHAFT COUPLING GUARD AND ROTATABLE APPARATUS SYSTEM - A shaft coupling guard is used to cover a shaft coupling that couples a main shaft of a prime mover and a main shaft of a driven apparatus as a rotatable apparatus driven by the prime mover. The shaft coupling guard includes a guard main body formed so as to extend in a direction along an axis and having a tubular shape for circumferentially covering the shaft coupling. The guard main body includes a guard main body upper portion, and a guard main body lower portion configured to be detachable from the guard main body upper portion. The shaft coupling guard further includes a leg portion formed integrally with the guard main body and configured to support the guard main body. | 09-11-2014 |
20140253914 | INSTALLATION STRUCTURE OF LENGTH METER - A vacuum chamber B which stores a length meter is provided separately from a vacuum chamber A in which an object to be measured is installed, an installation base | 09-11-2014 |
20140231011 | FLATTENING METHOD AND FLATTENING APPARATUS - A flattening method, by utilizing the advantages of the CARE method and making up for the disadvantages, can perform removal processing of a surface of a workpiece at a sufficient processing rate and can provide a processed surface having enhanced flatness without leaving damage in the processed surface. A flattening method comprises at least two surface removal steps and at least two cleaning steps, the final surface removal step being a catalyst-referred etching step comprising immersing a workpiece in a processing solution containing at least one of hydrohalic acid, hydrogen peroxide water and ozone water, and bringing a surface of a catalyst platen into contact with or close proximity to a surface to be processed of the workpiece to process the surface, said catalyst platen having in a surface a catalyst selected from the group consisting of platinum, gold, a ceramic solid catalyst, a transition metal, glass, and an acidic or basic solid catalyst. | 08-21-2014 |
20140220864 | POLISHING APPARATUS - An object of the present invention is to improve the capability of lifting a substrate with the polishing performance of the substrate maintained. A polishing apparatus | 08-07-2014 |
20140213158 | POLISHING APPARATUS - A polishing apparatus is used for polishing a substrate such as a semiconductor. The polishing apparatus includes a polishing table configured to hold a polishing tool having a polishing surface, a polishing head having a top ring configured to press a substrate against the polishing surface, and a polishing head cover configured to cover the polishing head. The polishing apparatus further includes a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover, and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover. | 07-31-2014 |
20140213154 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool. | 07-31-2014 |
20140203041 | WATER SUPPLY APPARATUS - The present invention provides a water supply apparatus capable of performing a backup operation, without lowering water supply capability, when a failure has occurred in one control substrate due to surge or noise caused by lightning or due to lifetimes of various sensors, by switching to the other control substrate, and capable of reliably performing the backup operation by means of devices that prevent failure of the control substrates. The water supply apparatus ( | 07-24-2014 |
20140202567 | WATER SUPPLY APPARATUS - The present invention provides a water supply apparatus capable of performing a backup operation, without lowering water supply capability, when a failure has occurred in one control substrate due to surge or noise caused by lightning or due to lifetimes of various sensors, by switching to the other control substrate, and capable of reliably performing the backup operation by means of devices that prevent failure of the control substrates. The water supply apparatus ( | 07-24-2014 |
20140197610 | SUBSTRATE GRIPPING APPARATUS - The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward. | 07-17-2014 |
20140190633 | SUBSTRATE CLEANING APPARATUS AND POLISHING APPARATUS - A substrate cleaning apparatus capable of efficiently cleaning a substrate, such as a wafer, is provided. The substrate cleaning apparatus includes: a substrate holder for holding and rotating a substrate; a chemical liquid nozzle for supplying a chemical liquid onto the substrate; a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate. The chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle. | 07-10-2014 |
20140190530 | SUBSTRATE CLEANING APPARATUS AND POLISHING APPARATUS - A substrate cleaning apparatus capable of preventing a cleaning vessel from being corroded by a chemical liquid while constituting the cleaning vessel with a low-price material is provided. The substrate cleaning apparatus includes: a cleaning vessel for holding a substrate therein; a substrate holder arranged in the cleaning vessel; a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel. The inner surface of the cleaning vessel has been subjected to a hydrophilization treatment. | 07-10-2014 |
20140187126 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus | 07-03-2014 |
20140179204 | DRESSER - A dresser includes an attachment secured to a dresser shaft for rotating the dresser, a disk holder removably attached to the attachment by a magnetic force, and a dresser disk removably attached to the disk holder. The dresser disk has a dressing surface. Each of the attachment and the disk holder has magnet for generating the magnetic force. | 06-26-2014 |
20140175925 | MAGNETIC BEARING APPARATUS AND METHOD FOR REDUCING VIBRATION CAUSED BY MAGNETIC BEARING APPARATUS - A magnetic bearing apparatus for supporting a rotational shaft includes a magnetic bearing, a rotation sensor, a controller which controls an electric current flown to an electromagnet, and at least one vibration sensor. The controller controls the electric current flown to the electromagnet as follows: in a first control mode, a first electric current is flown to the electromagnet for levitating and supporting the rotational shaft; and in a second control mode, a second electric current is flown to the electromagnet in place of the first electric current at a first periodic timing which is detected by the rotation sensor so that vibration is reduced to a lower level than a first vibration value detected in the first control mode in at least one of setting location of the at least one vibration sensor. | 06-26-2014 |
20140158885 | TESTING APPARATUS USING CHARGED PARTICLES AND DEVICE MANUFACTURING METHOD USING THE TESTING APPARATUS - A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source | 06-12-2014 |
20140134924 | SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS - A substrate holding apparatus holds a substrate and presses the substrate against a polishing pad. The substrate holding apparatus includes a top ring configured to hold the substrate and press the substrate against the polishing pad, a vertical movement mechanism configured to vertically move the top ring, a torque detector configured to detect a torque of the vertical movement mechanism when the top ring is being lowered or being lifted by the vertical movement mechanism, and a controller in which a torque of the vertical movement mechanism when the top ring is brought into contact with a surface of the polishing pad at the time of a pad search is preset as a torque limit value. The controller calculates a torque correction amount from the torque detected by the torque detector and a preset reference value, and corrects the torque limit value by using the torque correction amount. | 05-15-2014 |
20140120808 | DRESSING METHOD, METHOD OF DETERMINING DRESSING CONDITIONS, PROGRAM FOR DETERMINING DRESSING CONDITIONS, AND POLISHING APPARATUS - A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member. | 05-01-2014 |
20140120725 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring and to press the substrate against the polishing surface. The top ring is movable between a polishing position above the polishing table, a position laterally of the polishing table, and a cleaning position. The polishing apparatus includes a cleaning unit disposed in the cleaning position and configured to eject a cleaning liquid toward the lower surface of the top ring, which is being rotated, thereby cleaning the substrate held by the top ring together with the lower surface of the top ring. | 05-01-2014 |
20140112815 | VACUUM PUMP - A vacuum pump ( | 04-24-2014 |
20140112814 | VACUUM PUMP - A vacuum pump ( | 04-24-2014 |
20140107959 | ELECTRON BEAM APPARATUS FOR INSPECTING A PATTERN ON A SAMPLE USING MULTIPLE ELECTRON BEAMS - An electron beam apparatus for inspecting a pattern on a sample using multiple electron beams includes a plurality of primary electro-optical systems and a plurality of secondary electro-optical systems associated with the respective primary electro-optical systems. The primary electro-optical systems are for irradiating multiple primary electron beams on a surface of the sample, and each includes an electron gun having an anode and an objective lens. The secondary electro-optical systems are for inducing secondary electrons emitted from a surface of the sample by irradiation of the primary electron beams. Detectors are each for detecting the secondary electrons and generating electric signals corresponding to the detected electrons. The anodes of the electron guns of the primary electro-optical systems comprise an anode substrate in common having multiple holes corresponding to the axes of the respective primary electro-optical systems. The anode substrate has metal coatings around the respective holes. | 04-17-2014 |
20140094098 | POLISHING APPARATUS - To provide a polishing apparatus capable of more accurately determining a polishing end point. The polishing apparatus includes a turntable | 04-03-2014 |
20140094095 | POLISHING METHOD - A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate. | 04-03-2014 |
20140091215 | ELECTRO-OPTICAL INSPECTION APPARATUS AND METHOD WITH DUST OR PARTICLE COLLECTION FUNCTION - An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage ( | 04-03-2014 |
20140087629 | PRESSURE REGULATOR, POLISHING APPARATUS HAVING THE PRESSURE REGULATOR, AND POLISHING METHOD - A pressure regulator includes: a pressure-regulating valve configured to regulate pressure of a fluid supplied from a fluid supply source; a first pressure sensor configured to measure the pressure regulated by the pressure-regulating valve; a second pressure sensor located downstream of the first pressure sensor; a PID controller configured to produce a correction pressure command value for eliminating a difference between a pressure command value and a pressure value of the fluid measured by the second pressure sensor; and a regulator controller configured to control operation of the pressure-regulating valve so as to eliminate a difference between the correction pressure command value and a pressure value of the fluid measured by the first pressure sensor. | 03-27-2014 |
20140083468 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus has a cleaning section for cleaning a substrate such as a semiconductor wafer and can be used as a polishing apparatus. The substrate processing apparatus includes a first cleaning chamber which houses at least one first cleaning module and two second cleaning modules arranged in a vertical array, a second cleaning chamber which houses two third cleaning modules arranged in a vertical array, and a first transport robot housed in a first transport chamber disposed between the first cleaning chamber and the second cleaning chamber. The first transport robot is configured to transfer substrates between the first cleaning module, the second cleaning modules, and the third cleaning modules. | 03-27-2014 |
20140065934 | ELASTIC MEMBRANE AND SUBSTRATE HOLDING APPARATUS - An elastic membrane is used in a substrate holding apparatus for holding a substrate such as a semiconductor wafer and pressing the substrate against a polishing surface. The elastic membrane includes a plurality of concentrically circumferential walls configured to define a plurality of pressurizing areas for pressing the substrate. The pressurizing areas includes a central pressurizing area located at a central part of the elastic membrane, an annular edge pressurizing area located at the outermost part of the elastic membrane, and a plurality of intermediate pressurizing areas located between the central pressurizing area and the annular edge pressurizing area. The area width of at least one of the intermediate pressurizing areas is set in a range to allow a polishing rate responsive width not to vary even when the area width is varied. | 03-06-2014 |
20140065931 | METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS - A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient. | 03-06-2014 |
20140056794 | METHOD FOR TREATING EXHAUST GAS CONTAINING INORGANIC HALOGENATED GAS - A method for treating exhaust gas, comprising first contacting exhaust gas comprising inorganic halogenated gas discharged from sources of the exhaust gas with Fe | 02-27-2014 |
20140050605 | SEALING STRUCTURE, VACUUM PUMP MOTOR INCLUDING SAME SEALING STRUCTURE, AND VACUUM PUMP - To provide a sealing structure for a vacuum pump motor which maintains the sealing properties of the vacuum pump motor in an ensured fashion, there is provided a sealing structure for a vacuum pump motor | 02-20-2014 |
20140042032 | ELECTROPLATING METHOD AND ELECTROPLATING APPARATUS FOR THROUGH-HOLE - There is provided an electroplating method for a through-hole. The method includes: a first plating process, a second plating process, and a third plating process. The first plating process is a plating process of forming a metal film with a uniform thickness in the through-hole to reduce a diameter of the through-hole, the second plating process is a plating process of blocking up a central portion of the through-hole with the metal film using a PR pulsed current, and the third plating process is a plating process of completely filling the through-hole with the metal film using the plating current whose value is equal to or larger than a forward-current value of the PR pulsed current used in the second plating process. | 02-13-2014 |
20140036266 | POLISHING MONITORING METHOD, POLISHING METHOD, AND POLISHING MONITORING APPARATUS - A method accurately monitors the progress of polishing and accurately detects the polishing end point. The method includes directing light to the substrate during polishing of the substrate, receiving reflected light from the substrate, measuring an intensity of the reflected light at each wavelength, and producing a spectrum indicating a relationship between intensity and wavelength from measured values of the intensity. The method also includes calculating an amount of change in the spectrum per predetermined time, integrating the amount of change in the spectrum with respect to polishing time to obtain an amount of cumulative change in the spectrum, and monitoring the progress of polishing of the substrate based on the amount of cumulative change in the spectrum. | 02-06-2014 |
20140034831 | INSPECTION SYSTEM BY CHARGED PARTICLE BEAM AND METHOD OF MANUFACTURING DEVICES USING THE SYSTEM - An inspection apparatus by an electron beam comprises: an electron-optical device | 02-06-2014 |
20140030962 | ABRASIVE FILM FABRICATION METHOD AND ABRASIVE FILM - A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization. | 01-30-2014 |
20140030048 | WORKPIECE TRANSPORT DEVICE - A workpiece transport device for transporting a workpiece having a substrate layer and a layer to be processed on a portion of the substrate layer is provided. This workpiece transport device has a workpiece holding mechanism arranged to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one tapered workpiece holding surface on which the substrate layer of the workpiece is held in a state where the layer to be processed is positioned below the substrate layer. The tapered workpiece holding surface is formed so that a clearance equal to or larger than a predetermined distance R exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism. | 01-30-2014 |
20140024294 | POLISHING ENDPOINT DETECTION METHOD AND POLISHING ENDPOINT DETECTION APPARATUS - Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the substrate and receiving a reflected light from the substrate; obtaining a plurality of spectral profiles at predetermined time intervals, each spectral profile indicating reflection intensity at each wavelength of the reflected light; selecting at least one pair of spectral profiles, including a latest spectral profile, from the plurality of spectral profiles obtained; calculating a difference in the reflection intensity at a predetermined wavelength between the spectral profiles selected; determining an amount of change in the reflection intensity from the difference; and determining a polishing endpoint based on the amount of change. | 01-23-2014 |
20140021122 | SEAWATER DESALINATION SYSTEM AND ENERGY EXCHANGE CHAMBER - A seawater desalination system produces fresh water from seawater by passing the seawater pressurized by a pump through a reverse-osmosis membrane-separation apparatus to separate the seawater into fresh water and concentrated seawater. An energy exchange chamber is provided for utilizing pressure energy of the concentrated seawater discharged from the reverse-osmosis membrane-separation apparatus as energy for pressurizing part of the seawater. The energy exchange chamber includes a concentrated seawater port for introducing and discharging the concentrated seawater, a seawater port for introducing and discharging the seawater, and a plurality of partitioned fluid passages provided in the chamber to allow the concentrated seawater port and the seawater port to communicate with each other. | 01-23-2014 |
20140014848 | INSPECTION DEVICE - An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object. | 01-16-2014 |
20140004772 | POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS FOR POLISHING A WORKPIECE, AND METHOD OF POLISHING A WORKPIECE USING THE CHEMICAL MECHANICAL POLISHING APPARATUS | 01-02-2014 |
20130344773 | POLISHING APPARATUS AND POLISHING METHOD - The present invention provides an apparatus and a method for polishing a substrate having a film formed thereon. The method includes: rotating a polishing table supporting a polishing pad by a table motor; pressing the substrate against the polishing pad by a top ring; obtaining a signal containing a thickness information of the film; producing from the signal a polishing index value that varies in accordance with a thickness of the film; monitoring a torque current value of the table motor and the polishing index value; and determining a polishing end point based on a point of time when the torque current value has reached a predetermined threshold value or a point of time when a predetermined distinctive point of the polishing index value has appeared, whichever comes first. | 12-26-2013 |
20130320636 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus is used for a spin drying apparatus, a pencil-type scrubbing cleaning apparatus, an IPA drying apparatus and the like, which are used as semiconductor wafer processing apparatuses. The substrate processing apparatus includes a substrate stage and a substrate chuck mechanism. The substrate chuck mechanism includes a chuck body having a substrate placing portion configured to place a peripheral portion of a substrate and a guide surface configured to guide an outer circumferential end surface of the substrate and to position the substrate when the substrate is placed on the substrate placing portion, and a chuck claw rotatably supported on the chuck body and configured to hold the peripheral portion of the substrate between the substrate placing portion and the chuck claw by turning the chuck claw inward in a closing direction. The guide surface comprises a first guide surface and a second guide surface which guide the outer circumferential end surface of the substrate and differ in inclinations from each other. | 12-05-2013 |
20130319820 | MOVABLE RANGE ADJUSTING MECHANISM FOR WORKPIECE CONVEYING DEVICE - The present invention enables adjustment of a motion range of a workpiece conveying mechanism by a simple configuration. Provided is a workpiece conveying device including a simple motion range adjusting mechanism for conveying workpieces of different sizes. According to one embodiment of the invention, the workpiece conveying device for conveying workpieces includes a workpiece holding mechanism configured to operate to hold and release the workpiece. The workpiece conveying device also includes an actuator equipped with a movable member directly or indirectly connected to the workpiece holding mechanism to drive the workpiece holding mechanism. The workpiece conveying device further includes a stopper device having a male member and a female member, and these male member and female member are configured to engage with each other in at least two different arrangements, thereby defining at least two predefined discontinuous holding positions of the workpiece holding mechanism connected to the movable member. | 12-05-2013 |
20130313429 | METHOD AND APPARATUS FOR INSPECTING SAMPLE SURFACE - Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface. | 11-28-2013 |
20130312790 | SUBSTRATE CLEANING METHOD - A substrate cleaning method is used for performing scrub cleaning of a surface of a substrate. The substrate cleaning method includes rotating a roll cleaning member and a substrate respectively in one direction while keeping the roll cleaning member in contact with the substrate in a cleaning area, and supplying a cleaning liquid to a surface of the substrate to scrub-clean the surface of the substrate in the presence of the cleaning liquid in the cleaning area. The cleaning liquid is supplied initially to an inverse-direction cleaning area of the cleaning area where the relative rotational velocity between the roll cleaning member and the substrate is relatively high, and thereafter to a forward-direction cleaning area of the cleaning area where the relative rotational velocity between the roll cleaning member and the substrate is relatively low while the substrate makes one revolution on a central axis thereof. | 11-28-2013 |
20130306483 | PLATING APPARATUS AND PLATING SOLUTION MANAGEMENT METHOD - A plating apparatus plates a substrate with Sn alloy to form an Sn alloy film on a surface of the substrate. The apparatus includes: a plating bath for retaining a plating solution therein, the substrate being immersed in the plating solution in a position opposite to an insoluble anode; a plating solution dialysis line for extracting the plating solution from the plating bath and returning the plating solution to the plating bath; a dialysis cell provided in the plating solution dialysis line and configured to remove a free acid from the plating solution by dialysis using an anion exchange membrane; a free acid concentration analyzer; and a controller for controlling a flow rate of the plating solution flowing through the plating solution dialysis line based on the concentration of the free acid measured by the free acid concentration analyzer. | 11-21-2013 |
20130306116 | SUBSTRATE CLEANING APPARATUS - A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer and dries the substrate. The substrate cleaning apparatus includes a process chamber having a substrate conveying unit configured to hold a substrate horizontally with its upper surface facing upwardly and to convey the substrate in one direction, and a cleaning unit configured to clean the surface of the substrate in non-contact state by supplying a cleaning liquid to the surface of the substrate which is moving in the process chamber. The substrate apparatus has an inert gas blowing unit configured to blow an inert gas toward the front and reverse surfaces of the substrate which has been cleaned in the cleaning unit to produce an inert gas atmosphere in the process chamber while drying the substrate with the inert gas. | 11-21-2013 |
20130273814 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus polishes a substrate having a film formed thereon. A sensor is disposed in a polishing table that supports a polishing pad thereon. The polishing apparatus is configured to perform an idling process in which polishing of the substrate on the polishing pad does not progress substantially, while rotating the polishing table and the substrate. The sensor obtains the film thickness data, which varies in accordance with a thickness of the film, while the idling process is performed. A processor calculates, from the film thickness data, a polishing index value indicating the progress of polishing of the film. | 10-17-2013 |
20130259712 | VACUUM EVACUATION APPARATUS - The present invention relates to a vacuum evacuation apparatus which can be mounted in a posture that can freely be selected a vacuum evacuation apparatus for evacuating a container from an atmospheric pressure to a high vacuum or less includes a first vacuum pump for evacuating the container to a high vacuum or less, and a second vacuum pump for evacuating the container from an atmospheric pressure to a medium or low vacuum the first vacuum pump and the second vacuum pump are integrally connected to each other into an integral unit. | 10-03-2013 |
20130255360 | PLATING METHOD AND PLATING APPARATUS - A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time. | 10-03-2013 |
20130240000 | GAS-LIQUID SEPARATOR AND POLISHING APPARATUS - A gas-liquid separator separates gas-liquid two-phase flow into a gas and a liquid. The gas-liquid separator includes: a container having a bottom and a side portion, the bottom having a liquid discharge outlet and the side portion having a gas discharge outlet; a gas-liquid introduction pipe for introducing a gas-liquid two-phase flow into the container, the gas-liquid introduction pipe extending downward from above the container and having a lower end located in an interior of the container, the gas discharge outlet of the container being located above the lower end of the gas-liquid introduction pipe; and a guide device disposed in the gas-liquid introduction pipe and configured so as to impart a swirling motion to the gas-liquid two-phase flow in the gas-liquid introduction pipe. | 09-19-2013 |
20130237033 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth. | 09-12-2013 |
20130233785 | SEAWATER DESALINATION SYSTEM AND ENERGY RECOVERY APPARATUS - An energy recovery apparatus exchanges pressure energy between concentrated seawater discharged from a reverse-osmosis membrane-separation apparatus and a part of seawater to be treated by the reverse-osmosis membrane-separation apparatus in a seawater desalination system for producing fresh water from the seawater. The energy recovery apparatus includes two perforated plates provided at a concentrated seawater port side in a chamber, and two perforated plates provided at a seawater port side in the chamber. The two perforated plates comprises a first perforated plate and a second perforated plate. The first perforated plate and the second perforated plate at the concentrated seawater port side and the seawater port side are arranged to meet certain requirements including one of an open area ratio of the first perforated plate, an open area ratio of the second perforated plate, and a distance between the first perforated plate and the second perforated plate. | 09-12-2013 |
20130228684 | DETECTOR AND INSPECTING APPARATUS - An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors 11, 12 for receiving an electron beam emitted from a sample W to capture image data representative of the sample W, and a switching mechanism M for causing the electron beam to be incident on one of the plurality of detectors 11, 12, where the plurality of detectors 11, 12 are disposed in the same chamber MC. The plurality of detectors 11, 12 can be an arbitrary combination of a detector comprising an electron sensor for converting an electron beam into an electric signal with a detector comprising an optical sensor for converting an electron beam into light and converting the light into an electric signal. The switching mechanism M may be a mechanical moving mechanism or an electron beam deflector. | 09-05-2013 |
20130220383 | SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD - A substrate cleaning apparatus for cleaning a substrate is provided. The apparatus includes a cleaning bath in which a substrate holder holding a substrate is disposed in a vertical position, the substrate holder having a sealing member contacting a periphery of a surface of the substrate to seal a gap between the substrate and the substrate holder, and cleaning nozzles each configured to supply a jet of cleaning water to the substrate holder. The cleaning nozzles are disposed in the cleaning bath and arranged concentrically with a contact portion of the substrate surface contacting the sealing member and located at such positions that the jet of cleaning water impinges on the contact portion or its vicinity in an upper half of the substrate. | 08-29-2013 |
20130220382 | SUBSTRATE PROCESSING METHOD - There is provided a substrate processing method which can keep a surface of a substrate, which has hydrophobic properties, completely wet with a processing liquid during liquid processing, thereby preventing the formation of watermarks on the surface of the substrate. The substrate processing method for processing a substrate by supplying a processing liquid to a central portion of a surface of the substrate rotating horizontally, includes: determining the rotational speed of the substrate and the flow rate of the processing liquid when supplied to the surface of the substrate from a relationship between the rotational speed of the substrate and the flow rate of the processing liquid when supplied to the surface of the substrate, said relationship being dependent on the contact angle of the processing liquid with respect to the surface of the substrate and being capable of preventing partial draining of the processing liquid held on the surface of the substrate or partial drying of the surface of the substrate; and supplying the processing liquid to the central portion of the surface of the substrate at the determined flow rate while rotating the substrate at the determined rotational speed. | 08-29-2013 |
20130220368 | SUBSTRATE CLEANING METHOD - A substrate cleaning method can prevent corrosion of copper interconnects even when the cleaning method, which uses two-fluid jet cleaning, is used for cleaning of a surface of a substrate after polishing. The substrate cleaning method includes: carrying out primary cleaning of a surface of a substrate by scrub cleaning using a neutral or alkaline liquid chemical as a cleaning liquid; carrying out finish cleaning of the surface of the substrate by two-fluid jet cleaning which cleans the surface of the substrate in a non-contact manner by jetting carbonated water, comprising pure water or ultrapure water containing dissolved CO | 08-29-2013 |
20130219740 | SUBSTRATE DRYING APPARATUS, SUBSTRATE DRYING METHOD AND CONTROL PROGRAM - A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ. | 08-29-2013 |
20130213437 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber. | 08-22-2013 |
20130210324 | POLISHING APPARATUS - The present invention relates to a polishing apparatus for polishing an object to be polished (substrate) such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table configured to support a polishing pad, a polishing head having a top ring configured to press an object to be polished against the polishing pad while the object to be polished is rotated, and a dresser head having a dresser configured to dress the polishing pad. The polishing apparatus has a head cover having a purge gas introducing unit configured to introduce a purge gas into the head cover and an exhausting unit configured to exhaust the interior of the head cover. The pressure in the head cover is set to a pressure level slightly higher than the pressure outside the head cover, and main components of the polishing head are housed in the head cover. | 08-15-2013 |
20130209777 | CERAMICS SLIDING MEMBER FOR USE IN PURE WATER - A ceramics sliding member for use in ultrapure water or pure water of the present invention is made of a non-continuous-pore SiC sintered body. The non-continuous-pore SiC sintered body includes β-SiC at a ratio of 20% by weight or more thereto and has an average crystal structure whose aspect ratio is 2 or greater. | 08-15-2013 |
20130196573 | SUBSTRATE HOLDER, POLISHING APPARATUS, AND POLISHING METHOD - The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring. | 08-01-2013 |
20130192983 | SUBSTRATE HOLDER AND PLATING APPARATUS - There is provided a substrate holder which can absorb a change in the thickness between substrates and can hold a substrate while preventing deflection of the substrate and keeping the amount of compression of a substrate sealing member within a certain narrow range. The substrate holder includes a first holding member and a second holding member, both for detachably holding a substrate by holding a peripheral portion of the substrate therebetween; and a substrate sealing member, mounted to the second holding member, for sealing the peripheral portion of the substrate along a substrate sealing line. The first holding member has a thickness absorbing mechanism which biases the substrate toward the second holding member at positions along the substrate sealing line. | 08-01-2013 |
20130181554 | MOTOR ASSEMBLY AND PUMP APPARATUS - A motor assembly ( | 07-18-2013 |
20130171919 | EXHAUST SYSTEM - An exhaust system ( | 07-04-2013 |
20130167947 | LIQUID SCATTERING PREVENTION CUP, SUBSTRATE PROCESSING APPARATUS PROVIDED WITH THE CUP, AND SUBSTRATE POLISHING APPARATUS - There is provided a liquid scattering prevention cup which has a relatively simple construction and is easy to manufacture, has excellent durability, and can effectively prevent liquid droplets from bouncing off the inner peripheral surface of the cup. The liquid scattering prevention cup is disposed such that it surrounds a periphery of a substrate held and rotated by a substrate holding mechanism for preventing scattering of liquid droplets coming out of the rotating substrate. The liquid scattering prevention cup has a hydrophilic coating formed on at least part of the inner peripheral surface thereof and facing the substrate held and rotated by the substrate holding mechanism. The at least part of the inner peripheral surface has been subjected to surface roughening. | 07-04-2013 |
20130161511 | SAMPLE OBSERVING DEVICE AND SAMPLE OBSERVING METHOD - An electron beam inspection device observes a sample by irradiating the sample set on a stage with electron beams and detecting the electron beams from the sample. The electron beam inspection device has one electron column which irradiates the sample with the electron beams, and detects the electron beams from the sample. In this one electron column, a plurality of electron beam irradiation detecting systems are formed which each form electron beam paths in which the electron beams with which the sample is irradiated and the electron beams from the sample pass. The electron beam inspection device inspects the sample by simultaneously using a plurality of electron beam irradiation detecting systems and simultaneously irradiating the sample with the plurality of electron beams. | 06-27-2013 |
20130149938 | METHOD OF MAKING DIAGRAM FOR USE IN SELECTION OF WAVELENGTH OF LIGHT FOR POLISHING ENDPOINT DETECTION, METHOD AND APPARATUS FOR SELECTING WAVELENGTH OF LIGHT FOR POLISHING ENDPOINT DETECTION, POLISHING ENDPOINT DETECTION METHOD, POLISHING ENDPOINT DETECTION APPARATUS, AND POLISHING MONITORING METHOD - A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; calculating relative reflectances of the reflected light at respective wavelengths; determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time; identifying a point of time when the wavelengths, indicating the local maximum point and the local minimum point, are determined; and plotting coordinates, specified by the wavelengths and the point of time corresponding to the wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time. | 06-13-2013 |
20130136884 | ELASTIC MEMBRANE - There is provided an elastic membrane which can uniformly reduce deformation (elongation) of its contact portion, having a contact surface for contact with a substrate, along the contact surface in substantially the entire area of the contact portion from the center to the periphery. The elastic membrane includes a contact portion having a contact surface for contact with the substrate; a first peripheral wall portion coupled to the peripheral end of the contact portion and extending upwardly; and a second peripheral wall portion located on the inside of the first peripheral wall portion, coupled to the contact portion and extending upwardly, and defining a first chamber on the outer side thereof and a second chamber on the inner side thereof. In the elastic membrane, substantially the entire area of the contact portion is reinforced with a reinforcing member having a higher rigidity than the elastic membrane. | 05-30-2013 |
20130122704 | ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD - There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank. | 05-16-2013 |
20130119251 | METHOD AND APPARATUS FOR CHARGED PARTICLE BEAM INSPECTION - A charged particle beam inspection apparatus comprises: an electron gun for irradiating an electron beam onto a sample; a detector for detecting a signal obtained from the sample; an image processor for forming an image from the signal obtained from the detector, and an energy controller for controlling the beam energy of the electron beam to be irradiated onto the sample. An identical charged particle beam inspection apparatus carries out a plurality of types of inspections. An inspection apparatus of a projection type may be applied thereto. A pattern defect inspection, a foreign material inspection, and an inspection for a defect in a multilayer are carried out. Beam energies E | 05-16-2013 |
20130109278 | POLISHING METHOD AND POLISHING APPARATUS | 05-02-2013 |
20130098397 | SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS - The present invention can reduce the burden on a scrub cleaning member without entailing a large footprint and a long cleaning time and can enhance cleaning performance. A moving arm is moved to move a scrub cleaning member from a standby position above the edge of a substrate to a scrub cleaning position above the center of the substrate. A two-fluid nozzle is moved in conjunction with the movement of the moving arm while jetting a mixed fluid from the two-fluid nozzle toward the surface of the rotating substrate to carry out two-fluid jet cleaning of the substrate. After stopping the jetting of the fluid from the two-fluid nozzle, the scrub cleaning member is brought into contact with the surface of the substrate to carry out scrub cleaning of the substrate. | 04-25-2013 |
20130081941 | Electrochemical deposition apparatus - The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member. | 04-04-2013 |
20130032716 | ELECTRON BEAM APPARATUS AND A DEVICE MANUFACTURING METHOD BY USING SAID ELECTRON BEAM APPARATUS - An electron beam apparatus, in which an electron beam emitted from an electron gun having a cathode and an anode is focused and irradiated onto a sample, and secondary electrons emanated from the sample are directed into a detector, the apparatus further comprising means for optimizing irradiation of the electron beam emitted from the electron gun onto the sample, the optimizing means may be two-stage deflectors disposed in proximity to the electron gun which deflects and directs the electron beam emitted in a specific direction so as to be in alignment with the optical axis direction of the electron beam apparatus, the electron beam emitted in the specific direction being at a certain angle with respect to the optical axis due to the fact that, among the crystal orientations of said cathode, a specific crystal orientation allowing a higher level of electron beam emission out of alignment with the optical axis direction. | 02-07-2013 |
20120305387 | PLATING APPARATUS - A plating apparatus for plating a surface of a substrate includes a plurality of plating tanks for holding a plating solution therein, a plurality of pumps combined respectively with the plating tanks, for circulating the plating solution through the plating tanks, a plurality of suction pipes connecting respective suction ports of the pumps to the plating tanks, respectively, and a plurality of discharge pipes connecting respective discharge ports of the pumps to respective different ones of the plating tanks from the plating tanks which are connected to the suction ports of the pumps. The plating tanks and the pumps are connected in series with each other. | 12-06-2012 |
20120255864 | ELECTROPLATING METHOD - An electroplating method is capable of reliably embedding via holes with a plated metal such as copper or the like when a substrate with a seed layer of a metal having a greater ionization tendency than hydrogen is electroplated using an acidic plating solution such as a copper sulfate plating solution. The electroplating method including preparing a substrate having via holes covered with a first metal, which has a greater ionization tendency than hydrogen, in a surface thereof, pretreating the substrate by immersing the substrate in a pretreatment solution in which a second metal that is more noble than the first metal or a salt thereof is dissolved, and then electroplating the surface of the substrate to embed the second metal or a third metal in the via holes. | 10-11-2012 |
20120235036 | INSPECTION DEVICE - An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object. | 09-20-2012 |
20120220196 | POLISHING APPARATUS HAVING TEMPERATURE REGULATOR FOR POLISHING PAD - A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage. | 08-30-2012 |
20120195748 | VORTEX PREVENTION DEVICE AND DOUBLE SUCTION VERTICAL PUMP HAVING SUCH VORTEX PREVENTION DEVICE - A vortex prevention device is capable of preventing creation of air entrained vortex and also provides a double suction vertical pump having such a vortex prevention device. The vortex prevention device is used in combination with the double suction vertical pump which is installed in an open channel and has an upper suction opening and a lower suction opening. The vortex prevention device includes a plate member as a vortex prevention structure arranged above the upper suction opening. The plate member is arranged away from the upper suction opening such that a passage is formed between the plate member and the upper suction opening. | 08-02-2012 |
20120145921 | METHOD AND APPARATUS FOR INSPECTING SAMPLE SURFACE - Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface. | 06-14-2012 |
20120032079 | INSPECTION SYSTEM BY CHARGED PARTICLE BEAM AND METHOD OF MANUFACTURING DEVICES USING THE SYSTEM - An inspection apparatus by an electron beam comprises: an electron-optical device | 02-09-2012 |
20110266468 | EXTREME ULTRAVIOLET LIGHT SOURCE APPARATUS - An extreme ultraviolet light source apparatus comprises a target supply unit supplying a target into a vacuum chamber, a laser oscillator outputting a laser light into the vacuum chamber, a collector mirror outputting an extreme ultraviolet light outside by reflecting the extreme ultraviolet light emitted from the target being ionized as a plasma by irradiation with the laser light at a plasma luminescence point in the vacuum chamber, and an ion debris removal unit at least a part of which is located in an obscuration region including the plasma luminescence point. | 11-03-2011 |
20110155905 | SPECIMEN OBSERVATION METHOD AND DEVICE, AND INSPECTION METHOD AND DEVICE USING THE METHOD AND DEVICE - A technique capable of improving the ability to observe a specimen using an electron beam in an energy region which has not been conventionally given attention is provided. This specimen observation method comprises: irradiating the specimen with an electron beam; detecting electrons to be observed which have been generated and have obtained information on the specimen by the electron beam irradiation; and generating an image of the specimen from the detected electrons to be observed. The electron beam irradiation comprises irradiating the specimen with the electron beam with a landing energy set in a transition region between a secondary emission electron region in which secondary emission electrons are detected and a mirror electron region in which mirror electrons are detected, thereby causing the secondary emission electrons and the mirror electrons to be mixed as the electrons to be observed. The detection of the electrons to be observed comprises performing the detection in a state where the secondary emission electrons and the mirror electrons are mixed. Observation and inspection can be quickly carried out for a fine foreign material and pattern of 100 nm or less. | 06-30-2011 |
20110104830 | APPARATUS FOR INSPECTION WITH ELECTRON BEAM, METHOD FOR OPERATING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING FORMER - A substrate inspection apparatus | 05-05-2011 |
20110085918 | WATER-LIFTING PUMP APPARATUS AND METHOD OF CONTROLLING OPERATION THEREOF - A water-lifting pump apparatus which is free of a discharge valve and a check valve, is low in cost, and is capable of reducing vibration and noise due to a waterfall after the end of water pumping operation. The water-lifting pump apparatus has a suction tank ( | 04-14-2011 |
20110059183 | WATER-INSOLUBLE MEDICINE - A method of producing water-insoluble anti-cancer drug in the form of particulates, the method including preparing a water-insoluble anti-cancer drug having at least one multiple bond in the structure, and irradiating said water-insoluble anti-cancer drug with a laser beam having a wavelength of a low absorption portion in the vicinity of the foot of an absorption curve on the long wavelength side within the absorption band until said water-insoluble anti-cancer drug is formed into particulates having an average particle diameter of 50 to 200 nm. | 03-10-2011 |
20110024623 | DETECTOR AND INSPECTING APPARATUS - An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors | 02-03-2011 |
20110012456 | MAGNETIC BEARING DEVICE AND METHOD - An energy-saving magnetic bearing device with no bias current for making the relation between the excitation current and the magnetic force of the electromagnet linear is provided. In a magnetic bearing device for supporting a rotor | 01-20-2011 |
20100307619 | WATER SUPPLY APPARATUS - The present invention provides a water supply apparatus capable of performing a backup operation, without lowering water supply capability, when a failure has occurred in one control substrate due to surge or noise caused by lightning or due to lifetimes of various sensors, by switching to the other control substrate, and capable of reliably performing the backup operation by means of devices that prevent failure of the control substrates. The water supply apparatus ( | 12-09-2010 |
20100286289 | CHITOSAN-CONTAINING COMPOSITION AND PRODUCTION PROCESS OF SAME - The present invention provides an industrially useful chitosan-containing composition in the form of any of a transparent aqueous solution, gel or dry powder having a neutral to weakly alkaline pH when in the form of an aqueous solution that can be applied to pharmaceutical additives, foods, beverages and cosmetics. A production process of the chitosan-containing composition of the present invention has a step for preparing an acidic chitosan aqueous solution, a step for forming a solid by removing a water-soluble salt from a salt formed by mixing an acidic polymer component into the acidic chitosan aqueous solution, and a step for dissolving the solid in a weakly basic solution. | 11-11-2010 |
20100237243 | Testing apparatus using charged particles and device manufacturing method using the testing apparatus - A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source | 09-23-2010 |
20100209259 | EVACUATION APPARATUS - The present invention relates to an evacuation apparatus for evacuating a vacuum chamber of a substrate processing apparatus for processing a substrate such as a semiconductor wafer or liquid crystal panel. An evacuation apparatus according to the present invention includes a first vacuum pump connected to a vacuum chamber, and a second vacuum pump connected to the first vacuum pump. The first vacuum pump has a pair of multistage pump rotors. | 08-19-2010 |
20100130343 | CERAMICS SLIDING MEMBER FOR USE IN PURE WATER - A ceramics sliding member for use in ultrapure water or pure water of the present invention is made of an SiC sintered body. The SiC sintered body includes β-SiC at a ratio of 20% or more thereto and has an average crystal structure whose aspect ratio is 2 or greater. | 05-27-2010 |
20100080686 | MULTISTAGE HIGH-PRESSURE PUMP - A multistage high-pressure pump according to the present invention includes a rotational shaft ( | 04-01-2010 |
20100061676 | BEARING SYSTEM OR A SEALING SYSTEM USING A CARBON BASED SLIDING MEMBER - An object of the present invention is to provide a bearing system or a sealing system which has excellent durability when used with the purified water as a lubricating liquid. | 03-11-2010 |
20100047096 | TURBO VACUUM PUMP AND SEMICONDUCTOR MANUFACTURING APPARATUS HAVING THE SAME - A turbo vacuum pump is suitable for evacuating a corrosive process gas or evacuating a gas containing reaction products. The turbo vacuum pump includes a casing having an intake port, a pump section comprising rotor blades and stator blades housed in the casing, bearings for supporting the rotor blades, a motor for rotating the rotor blades; and a rotating shaft comprising a first rotating shaft to which the rotor blades are attached, and a second rotating shaft to which a motor rotor of the motor is attached. | 02-25-2010 |
20100032566 | SUBSTRATE SURFACE INSPECTION METHOD AND INSPECTION APPARATUS - A substrate surface inspection method inspects for a defect on a substrate including a plurality of materials on a surface thereof. The inspection method comprises: irradiating the surface of the substrate with an electron beam, a landing energy of the electron beam set such that a contrast between at least two types of materials of the plurality of materials is within a predetermined range; detecting electrons generated by the substrate to acquire a surface image of the substrate, with a pattern formed thereon from the at least two types of materials eliminated or weakened; and detecting the defect from the acquired surface image by detecting as the defect an object image having a contrast by which the object image can be distinguished from a background image in the surface image. Defects present on the substrate surface can be detected easily and precisely by using a cell inspection. | 02-11-2010 |
20100019149 | MAPPING-PROJECTION-TYPE ELECTRON BEAM APPARATUS FOR INSPECTING SAMPLE BY USING ELECTRONS EMITTED FROM THE SAMPLE - An apparatus capable of detecting defects of a pattern on a sample with high accuracy and reliability and at a high throughput, and a semiconductor manufacturing method using the same are provided. The electron beam apparatus is a mapping-projection-type electron beam apparatus for observing or evaluating a surface of the sample by irradiating the sample with a primary electron beam and forming on a detector an image of reflected electrons emitted from the sample. An electron impact-type detector such as an electron impact-type CCD or an electron impact-type TDI is used as the detector for detecting the reflected electrons. The reflected electrons are selectively detected from an energy difference between the reflected electrons and secondary electrons emitted from the sample. To eliminate charge-up caused on the sample surface by irradiation with the primary electron beam, the surface of the sample is covered with a cover placed above the sample and a gas is supplied to the space above the sample covered with the cover. The gas is brought into contact with the sample surface to reduce charge-up on the sample surface. | 01-28-2010 |
20100019147 | METHOD AND APPARATUS FOR CHARGED PARTICLE BEAM INSPECTION - A charged particle beam inspection apparatus comprises: an electron gun for irradiating an electron beam onto a sample; a detector for detecting a signal obtained from the sample; an image processor for forming an image from the signal obtained from the detector, and an energy controller for controlling the beam energy of the electron beam to be irradiated onto the sample. An identical charged particle beam inspection apparatus carries out a plurality of types of inspections. An inspection apparatus of a projection type may be applied thereto. A pattern defect inspection, a foreign material inspection, and an inspection for a defect in a multilayer are carried out. Beam energies E | 01-28-2010 |
20100012838 | INSPECTION METHOD AND APPARATUS OF A GLASS SUBSTRATE FOR IMPRINT - A method for inspecting a glass substrate for imprint including a glass substrate with a pattern surface and a transmissive conductive film coating at least part of the pattern surface, includes an electron beam irradiation step of irradiating the pattern surface of the glass substrate for imprint disposed on a stage with an electron beam having a predetermined irradiation area; an electron detection step of simultaneously detecting electrons from the pattern surface by the electron beam irradiation by means of a detection surface with a plurality of pixels; and a defect detection step of obtaining an image of the pattern surface based on the electrons detected by the detection surface and detecting a defect of the pattern surface. | 01-21-2010 |
20090324725 | PEG-MODIFIED HYDROXYAPATITE, PHARMACEUTICAL USING THE SAME AS BASE MATERIAL AND PRODUCTION PROCESS THEREOF - The present invention provides a PEG-modified HAP having a high degree of safety and novel functions by modifying the surface of hydroxyapatite particles with a polyethylene glycol derivative, applications thereof, and a production process of the same. The PEG-modified HAP of the present invention is a substance in which hydroxyapatite having a particle diameter of 50 μm to 10 nm is bonded to a polyethylene glycol derivative having a carboxyl group as a terminal functional group through —O(CO) bonds, and the carbon content thereof is 10 to 0.1%. In addition, the present invention is a substance composed of this substance and a pharmaceutical active ingredient or pharmaceutical additive, in which the weight ratio of the pharmaceutical active ingredient is 1 to 30%, and the substance is obtained by treating hydroxyapatite having a particle diameter of 50 μm to 10 nm and an active ester of polyethylene glycol derivative having a carboxyl group as a terminal functional group in an anhydrous organic solvent. | 12-31-2009 |
20090294287 | MICROCHIP ELECTROPHORESIS METHOD AND DEVICE - An separation method comprising a temperature control process useful for microchip electrophoresis such as microchip DGGE is provided along with a device therefor. | 12-03-2009 |
20090246048 | TURBO VACUUM PUMP - An oil-free turbo vacuum pump is capable of evacuating gas in a chamber from atmospheric pressure to high vacuum. The turbo vacuum pump includes a pumping section having rotor blades and stator blades which are disposed alternately in a casing, and a main shaft for supporting the rotor blades. A gas bearing is used as a bearing for supporting the main shaft in a thrust direction, spiral grooves are formed in both surfaces of a stationary part of the gas bearing, and the stationary part having the spiral grooves is placed between an upper rotating part and a lower rotating part which are fixed to the main shaft. A thrust magnetic bearing for canceling out a thrust force generated by the differential pressure between a discharge side and an intake side by an evacuation action of the pumping suction is provided. | 10-01-2009 |
20090246038 | TURBO VACUUM PUMP - An oil-free turbo vacuum pump is capable of evacuating gas in a chamber from atmospheric pressure to high vacuum. The turbo vacuum pump includes a pumping section having rotor blades and stator blades which are disposed alternately in a casing, a main shaft for supporting the rotor blades, and a bearing and motor section having a motor for rotating the main shaft and a bearing mechanism for supporting the main shaft rotatably. A gas bearing is used as a bearing for supporting the main shaft in a thrust direction, spiral grooves are formed in both surfaces of a stationary part of the gas bearing, and the stationary part having the spiral grooves is placed between an upper rotating part and a lower rotating part which are fixed to the main shaft. | 10-01-2009 |
20090242471 | POWER RECOVERY CHAMBER - A power recovery chamber is used for a positive-displacement power recovery apparatus in the seawater desalination plant or system. The power recovery chamber includes a cylinder, a piston disposed in the cylinder and capable of being reciprocated in a longitudinal direction of the cylinder, and a piston guide disposed in the cylinder and extending in the longitudinal direction of the cylinder for guiding the piston when the piston is reciprocated in the longitudinal direction of the cylinder. At least a part of an outer circumferential surface of the piston is out of contact with an inner surface of the cylinder, and the piston is brought into contact with the piston guide at a part where the piston guide passes through the piston. | 10-01-2009 |
20090239446 | Polishing Apparatus and Polishing Method - A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer W by applying a pressure between a polishing member (polishing pad) | 09-24-2009 |
20090236786 | HAND HAVING ROCKING MECHANISM AND SUBSTRATE DELIVERING DEVICE HAVING THE SAME | 09-24-2009 |
20090226608 | APPARATUS AND METHOD FOR COATING PARTICLES - An apparatus for coating particles with a polymer electrolyte, which includes at least one polymer membrane shell-coating part, the particles being coated with a membrane shell in the at least one polymer membrane shell-coating part by performing a step including contacting the particles having a predetermined charge with the polymer electrolyte having a charge opposite to that of the outer surface of the particles, thereby forming a membrane shell on the surface of the outermost layer of the particles. | 09-10-2009 |
20090224151 | DETECTOR AND INSPECTING APPARATUS - An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors | 09-10-2009 |
20090218506 | ELECTRON BEAM APPARATUS - An electron beam emitted from an electron gun (G) forms a reduced image on a sample (S) through a non-dispersion Wien-filter ( | 09-03-2009 |
20090212214 | SAMPLE INSPECTION APPARATUS - The invention avoids charge up when creating a focus map for an electron beam apparatus for inspecting a sample. An auto-focus (AF) control apparatus controls to drive an actuator for moving a focus lens of an optical microscope while acquiring a contrast signal from the optical microscope for each of focus measurement points on a surface of a sample under control of a PC device, to automatically focus on the surface of the sample. The control apparatus detects a focus value of the optical microscope corresponding to a position (height) of the sample surface in an optical axis direction. The PC device receives the detected focus value, and converts the focus value into a voltage to be applied to an electrostatic lens of the electron beam device during actual sample inspection, and stores the converted value. | 08-27-2009 |
20090212213 | PROJECTION ELECTRON BEAM APPARATUS AND DEFECT INSPECTION SYSTEM USING THE APPARATUS - A sample is evaluated at a high throughput by reducing axial chromatic aberration and increasing the transmittance of secondary electrons. Electron beams emitted from an electron gun | 08-27-2009 |
20090196734 | TURBO VACUUM PUMP - A turbo vacuum pump comprising a suction part | 08-06-2009 |
20090189469 | MAGNETIC BEARING APPARATUS - A magnetic bearing apparatus supports a rotating object using magnetic levitation by a magnetic force of electromagnets. The magnetic bearing apparatus includes a PWM driver configured to supply exciting currents to the electromagnets, a driver power source configured to drive the PWM driver, and a displacement error signal removing section configured to extract a displacement error signal of the displacement information from a current flowing through the driver power source and to remove the displacement error signal from the displacement information. | 07-30-2009 |
20090152595 | SEMICONDUCTOR DEVICES AND METHOD OF TESTING SAME - There are provided a semiconductor device having a pattern which allows electric failures to be sensitively detected at high speeds, and a method of testing the same. In one embodiment, the semiconductor device comprises a pair of row wires including a plurality of first wires arranged in a first layer at predetermined intervals in a row direction, where the first wires have ends connected to second wires arranged in a second layer at a predetermined intervals through vias, and the first wire and second wire are at the same potential. In the pair of row wires, a first wire positioned at a right end of one row wire is connected to a first conductor, and a first wire positioned at a left end in the other row wire is connected to a second conductor. By sequentially scanning the first conductor and second conductor using an electron beam, a change in the amount of emitted secondary electrons due to a difference in potential between these conductors is detected to detect electric anomalies. | 06-18-2009 |
20090134036 | Electrolytic Processing Method and Electrolytic Processing Apparatus - An electrolytic processing method makes it possible to preferentially process a diffusion barrier layer while suppressing processing of an interconnect metal, thereby enabling omission of CMP or a lowering of processing pressure in CMP. The electrolytic processing method comprises: bringing a surface of a substrate (W) into contact with an electrolytic solution ( | 05-28-2009 |
20090127117 | HIGH PRESSURE-RESISTANT TYPE ELECTRICAL DEIONIZATION APPARATUS, HIGH PRESSURE-RESISTANT TYPE ELECTRICAL DEIONIZATION SYSTEM AND METHOD OF PRODUCING ULTRAPURE WATER USING HIGH PRESSURE-RESISTANT TYPE DEIONIZATION SYSTEM - The present invention provides an electrical deionization apparatus suitable for an ultra pure water production system allowing high pressure raw water from an atomic power plant to be reused as the ultra water. The electric deionization stack | 05-21-2009 |
20090111358 | Polishing apparatus and polishing method - The present invention provides a apparatus for polishing an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser. | 04-30-2009 |
20090110563 | POWER RECOVERY SYSTEM - A power recovery system is used for reducing the total energy consumption in a process such as an industrial treating process or a fluid refining process including the delivery of a fluid under a high pressure. The power recovery system includes a high-pressure pump for pressuring raw water, a reverse osmosis membrane cartridge for treating high-pressure water discharged from the high-pressure pump with a reverse osmosis membrane to produce treated water, a positive-displacement piston pump for pressuring raw water under the pressure of concentrated water which is discharged from the reverse osmosis membrane cartridge without being treated by the reverse osmosis membrane, and a power recovery pump turbine for boosting the pressurized raw water discharged from the positive-displacement piston pump and adding the boosted water to the high-pressure water discharged from the high-pressure pump. The power recovery pump turbine is actuated by pressurized water generated in the power recovery system. | 04-30-2009 |
20090108703 | ROTARY APPARATUS - A rotary apparatus, in which a rotor can rotate stably when it rotates at a high speed, can rotate at a relatively high speed by the torque of a highly reliable induction motor. The rotary apparatus comprises a rotor shaft and an induction motor. The induction motor includes a motor rotor core fixed to the rotor shaft, conductors disposed in the motor rotor core and a motor end ring for assembling and connecting the conductors, and can rotate the rotor shaft at a high speed by the torque. The rotor shaft is provided with a member that covers the motor end ring. | 04-30-2009 |
20090101816 | Testing apparatus using charged particles and device manufacturing method using the testing apparatus - A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source | 04-23-2009 |
20090097984 | OPERATION CONTROL DEVICE FOR VACUUM PUMP AND METHOD FOR STOPPING OPERATION THEREOF - To provide an operation control device for a vacuum pump and a method for stopping the operation of the vacuum pump that make it possible to effectively remove products, resulting from solidification and liquefaction of gas in a casing and possibly hindering the rotation of a pump rotor, so that the vacuum pump may be started normally. An operation control device | 04-16-2009 |
20090096302 | MAGNETIC BEARING DEVICE AND METHOD - An energy-saving magnetic bearing device with no bias current for making the relation between the excitation current and the magnetic force of the electromagnet linear is provided. In a magnetic bearing device for supporting a rotor | 04-16-2009 |
20090093192 | DEVICE FOR AND METHOD OF POLISHING PERIPHERAL EDGE OF SEMICONDUCTOR WAFER - A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part. | 04-09-2009 |
20090092469 | SUBSTRATE PROCESSING UNIT, SUBSTRATE TRANSFER METHOD, SUBSTRATE CLEANSING PROCESS UNIT, AND SUBSTRATE PLATING APPARATUS - To provide a substrate processing unit, a substrate transfer method, a substrate cleansing process unit, and a substrate plating apparatus that make it possible for a substrate carry-in mechanism such as a robot arm to quickly release hold on the substrate after carrying in the substrate so as to shorten the time for holding the substrate and improve throughput. The substrate processing unit | 04-09-2009 |
20090090863 | SAMPLE SURFACE OBSERVATION METHOD - A surface of a sample is observed by acquiring an image of the surface of the sample. An electron beam I irradiated onto the surface of the sample in which wiring including an insulation material and an electrically conductive material is formed. Electrons that acquired structure information regarding a structure of the surface of the sample are detected. An image of the surface of the sample is acquired by a result of the detection of electrons. The surface of the sample is observed using the acquired image of the surface of the sample. The electron beam is irradiated onto the surface of the sample in a state where a brightness of the insulation material and a brightness of the electrically conductive material in the image of the surface of the sample are set equal to each other. | 04-09-2009 |
20090081810 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus has a fluid supply means | 03-26-2009 |
20090067977 | Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber - The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage. | 03-12-2009 |
20090060408 | DIAMOND-COATED BEARING OR SEAL STRUCTURE AND FLUID MACHINE COMPRISING THE SAME - The present invention is a bearing or seal structure | 03-05-2009 |
20090050822 | Electron beam apparatus and method of manufacturing semiconductor device using the apparatus - The present invention provides an electron beam apparatus for evaluating a sample surface, which has a primary electro-optical system for irradiating a sample with a primary electron beam, a detecting system, and a secondary electro-optical system for directing secondary electron beams emitted from the sample surface by the irradiation of the primary electron beam to the detecting system. | 02-26-2009 |
20090050802 | METHOD AND APPARATUS FOR INSPECTING SAMPLE SURFACE - Provided is a method and an apparatus for inspecting a sample surface with high accuracy. | 02-26-2009 |
20090047142 | VACUUM PUMP UNIT - The present invention relates to a dry vacuum pump unit capable of achieving ultimate pressure of about 1 Pa. The vacuum pump unit includes a main pump ( | 02-19-2009 |
20090039262 | ELECTRON BEAM APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE APPARATUS - The present invention provides an electron beam apparatus for irradiating a sample with primary electron beams to detect secondary electron beams generated from a surface of the sample by the irradiation for evaluating the sample surface. In the electron beam apparatus, an electron gun has a cathode for emitting primary electron beams. The cathode includes a plurality of emitters for emitting primary electron beams, arranged apart from one another on a circle centered at an optical axis of a primary electro-optical system. The plurality of emitters are arranged such that when the plurality of emitters are projected onto a straight line parallel with a direction in which the primary electron beams are scanned, resulting points on the straight line are spaced at equal intervals. | 02-12-2009 |
20090035151 | VACUUM PUMP SELF-DIAGNOSIS METHOD, VACUUM PUMP SELF-DIAGNOSIS SYSTEM, AND VACUUM PUMP CENTRAL MONITORING SYSTEM - There are provided a vacuum pump self-diagnosis method, a vacuum pump self-diagnosis system, a vacuum pump central monitoring system capable of making self-diagnosis of a dry vacuum pump. A vacuum pump self-diagnosis method decides the occurrence of failure and generates an alarm when a predetermined alarm set value is exceeded by an integrated value or an average value of a current of a motor for rotating a rotor of said vacuum pump. In a vacuum pump self-diagnosis system for making self-diagnosis of a vacuum pump which comprises a casing and a rotor rotatably arranged in the casing for sucking and discharging a gas through rotations of the rotor, the rotor comprises a plurality of stages and a pressure sensor is provided between the rotor stages. A self-diagnosis unit is provided for calculating an integrated value or an average value of a current of a motor for rotating said rotor, and making self-diagnosis of the vacuum pump when the integrated value or average value exceeds a predetermined alarm set value. The self-diagnosis unit switches from one self-diagnosis calculation method to another or interrupts the self-diagnosis calculation based on a pressure value detected by said pressure sensor. | 02-05-2009 |
20090032708 | Inspection system by charged particle beam and method of manufacturing devices using the system - An inspection apparatus by an electron beam comprises: an electron-optical device | 02-05-2009 |
20090026368 | APPARATUS AND METHOD FOR INSPECTING SAMPLE SURFACE - Provided is a defect inspection apparatus and an inspection (or evaluation) method with highly improved accuracy, which would not be provided by the prior art, in the defect inspection apparatus used in a manufacturing process of a semiconductor device. | 01-29-2009 |
20090017733 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus ( | 01-15-2009 |
20090014649 | ELECTRON BEAM APPARATUS - Secondary electrons emitted from a sample (W) by an electron beam irradiation is deflected by a beam separator ( | 01-15-2009 |
20080315095 | Electron beam apparatus, a device manufacturing method using the same apparatus, a pattern evaluation method, a device manufacturing method using the same method, and a resist pattern or processed wafer evaluation method - An object of the present invention is to provide an electron beam apparatus, in which a plurality of electron beams, e.g., four electron beams, is produced for one optical axis with a relatively high current achieved for each electron beam. | 12-25-2008 |
20080315090 | Objective lens, electron beam system and method of inspecting defect - An electron beam system or a method for manufacturing a device using the electron beam system in which an electron beam can be irradiated at a high current density and a ratio of transmittance of a secondary electron beam of an image projecting optical system can be improved and which can be compact in size. The surface of the sample S is divided into plural stripe regions which in turn are divided into rectangle-shaped main fields. The main field is further divided into plural square-shaped subfields. The irradiation with the electron beams and the formation of a two-dimensional image are repeated in a unit of the subfields. A magnetic gap formed by the inner and outer magnetic poles of the objective lens is formed on the side of the sample, and an outer side surface and an inner side surface of each of the inner magnetic pole and the outer magnetic pole, respectively, forming the magnetic gap have each part of a conical shape with a convex having an angle of 45° or greater with respect to the optical axis. | 12-25-2008 |
20080308729 | Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former - A substrate inspection apparatus | 12-18-2008 |
20080302963 | SHEET BEAM-TYPE TESTING APPARATUS - An electron beam apparatus such as a sheet beam based testing apparatus has an electron-optical system for irradiating an object under testing with a primary electron beam from an electron beam source, and projecting an image of a secondary electron beam emitted by the irradiation of the primary electron beam, and a detector for detecting the secondary electron beam image projected by the electron-optical system; specifically, the electron beam apparatus comprises beam generating means | 12-11-2008 |
20080302122 | ABSORPTION HEAT PUMP - An absorption heat pump, including: an evaporator which takes in a first heat source and evaporates refrigerant liquid into refrigerant vapor; an absorber which has a heat receiving medium passage and which takes in heat receiving medium liquid through a heat receiving medium inlet of the heat receiving medium passage, heats the heat receiving medium liquid with the heat of absorption generated when the refrigerant vapor generated in the evaporator is absorbed into solution, and discharges the heat receiving medium in the form of vapor or mixture of vapor and liquid through a heat receiving medium outlet of the heat receiving medium passage; a generator which takes in a second heat source and evaporates the refrigerant from the solution having absorbed the refrigerant vapor; and a condenser which takes in a cooling source and the refrigerant vapor generated in the generator to condense the refrigerant vapor. | 12-11-2008 |
20080274850 | Transmission apparatus - The present invention relates to a transmission apparatus ( | 11-06-2008 |
20080274670 | Substrate Peripheral Portion Measuring Device, and Substrate Peripheral Portion Polishing Apparatus - A projecting/receiving unit ( | 11-06-2008 |
20080271911 | Submerged Electrode and Material Thereof - [Problems] To provide an electrode that is stable in liquid and is capable of processing a large volume of liquid and a small electrode that is capable of processing a large volume of liquid at high speed; provide a liquid processor and method of processing liquid in which the electrode is used; provide and electrode material being hard to be damaged by thermal stress; and provide an electrode, liquid processor and method of processing liquid in which the electrode material is used. | 11-06-2008 |
20080268150 | Method of Coating for Diamond Electrode - The present invention relates to a film-formation method of a diamond electrode used in an electrolytic processing apparatus and other devices for treating water and waste liquid. This method utilizes CVD such as hot filament CVD including supplying a high-concentration carbon source to form a low-quality thick first diamond film ( | 10-30-2008 |
20080265159 | Sample surface inspection apparatus and method - The present invention provides a surface inspection method and apparatus for inspecting a surface of a sample, in which a resistive film is coated on the surface, and a beam is irradiated to the surface having the resistive film coated thereon, to thereby conduct inspection of the surface of the sample. In the surface inspection method of the present invention, a resistive film having an arbitrarily determined thickness t | 10-30-2008 |
20080264798 | Copper Plating Bath and Plating Method - An acid copper plating solution and plating method are disclosed. The acid copper plating solution comprises copper ions, an organic acid or an inorganic acid, chloride ions, high molecular weight surfactant which controls the electrodeposition reaction, and a sulfur-containing saturated organic compound which promotes the electrocoating rate, wherein the high molecular weight surfactant comprises two or more types with different hydrophobicities. The plating method is a method for forming a plating film on a conductor layer, which is formed on at least a part of a structural object having a concave-convex pattern on a semiconductor substrate, and comprises providing a cathode potential to the conductor layer and supplying a plating solution which electrically connects an anode with the conductor layer, wherein the plating solution contains 25-75 g/l of copper ion and 0.4 mol/l of an organic acid or inorganic acid and an electric resistor is installed between the conductor layer and the anode. Also disclosed is a plating method for forming a wiring circuit on an electronic circuit substrate having fine holes and trenches, comprising forming a plating film on a conductor layer, which is formed on at least a part of the substrate, and filling the holes and trenches with copper, wherein the plating film is formed by using an acid copper plating solution containing copper ions, organic or inorganic acid, chloride ions, sulfur-containing saturated organic compound, and high molecular weight surfactant controlling electrocoating concentration of 500 ppm or more. | 10-30-2008 |
20080251718 | ELECTRON BEAM APPARATUS AND SAMPLE OBSERVATION METHOD USING THE SAME - The electron beam apparatus is provided with a stage for mounting a sample thereon, a primary optical system for generating an electron beam having an irradiation area and irradiating the electron beam onto the sample, a secondary optical system for detecting electrons which have been generated through the irradiation of the electron beam onto the sample and have acquired structural information of the sample and acquiring an image of the sample about a viewing area and an irradiation area changing section for changing the position of the irradiation area with respect to the viewing area. | 10-16-2008 |
20080250811 | Absorption refrigerating machine - To provide a highly efficient and compact absorption refrigerating machine with water heated from 60 to 70 degrees Celsius as the heat source. In an absorption refrigerating machine including a regenerator G, condenser C, an absorber A, an evaporator E, an auxiliary regenerator GX and an auxiliary absorber AX, the concentrated solution from G is heated and further concentrated in GX, while the diluted solution from A is cooled in AX, the refrigerant vapor from GX is absorbed. A low temperature heat exchanger XL is provided for heat exchange between the concentrated solution supplied from GX to A, and the diluted solution sent from AX to G, and a high temperature heat exchanger XH is provided for heating the diluted solution leaving from XL and sent to G with the concentrated solution supplied from G to GX. | 10-16-2008 |
20080200100 | Substrate Processing Apparatus - A substrate processing apparatus ( | 08-21-2008 |