DiCon Fiberoptics Inc. Patent applications |
Patent application number | Title | Published |
20140361694 | Circuit and Method for Current-Based Analog Dimming of Light Emitting Diode Illuminators, with Improved Performance at Low Current Levels - By diverting a small amount of current from a string of LED(s) powered by a LED driver at low current levels in a process of dimming the LED string, performance of the LED string light emission is improved. | 12-11-2014 |
20140233095 | BROAD-SPECTRUM ILLUMINATOR FOR MICROSCOPY APPLICATIONS, USING THE EMISSIONS OF LUMINESCENT MATERIALS - A broad-spectrum, multiple wavelength illuminator comprises a luminescent body, and a plurality of semiconductor chips spaced apart from the luminescent body emitting light within one or more wavelength ranges towards the luminescent body, causing the luminescent body to emit light of one or more wavelength ranges. An optical element adjacent to the luminescent body collects light emitted by the luminescent body. An optical device collects light collected by the optical element. An aperture located between the optical element and the optical device passes the light emitted by the luminescent body along an optical axis, wherein light collected by the optical element and the optical device and passed by the aperture forms a beam of light illuminating a target. Alternatively, instead of being spaced apart from the chips, the luminescent body may be a layer adjacent to the chips. | 08-21-2014 |
20140218511 | High-Throughput and High Resolution Method for Measuring the Color Uniformity of a Light Spot - The color uniformity of a light spot is measured by providing an image of the light spot by means of a camera or camera sensor with sensor elements, each of the sensor elements capturing a set of three or more color component values that together define a set of pixel values at such sensor element, wherein the image includes a plurality of sets of pixel values. The method also derives for each of the plurality of sets of pixel values at a corresponding sensor element a first ratio between a first pair of the pixel values or of values obtained therefrom in such set. Preferably a second ratio is also derived between a second pair of the pixel values or of values obtained therefrom in such set, where the second pair is different from the first pair. Where the sensor elements used each provides a single intensity value instead of multiple pixel values of different colors, light is projected onto a spot of the camera or camera sensor along an optical path with a different one of three or more different color filters sequentially in the path. For each sensor element a first ratio is derived between a first pair of the intensity values of different colors provided by such sensor element or of values obtained therefrom and preferably also a second ratio is derived between a second pair of the intensity values of different colors or of values obtained therefrom provided by such sensor element different from the first pair. | 08-07-2014 |
20140210368 | LED ILLUMINATOR APPARATUS, USING MULTIPLE LUMINESCENT MATERIALS DISPENSED ONTO AN ARRAY OF LEDs, FOR IMPROVED COLOR RENDERING, COLOR MIXING, AND COLOR TEMPERATURE CONTROL - An LED array includes three or more strings of bare LEDs mounted in close proximity to each other on a substrate. The strings of LEDs emit light of one or more wavelengths of blue, indigo and/or violet light, with peak wavelengths that are less than 490 nm. Luminescent materials deposited on each of the LED chips in the array emit light of different wavelength ranges that are of longer wavelengths than and in response to light emissions from the LED chips. A control circuit applies currents to the strings of LEDs, causing the LEDs in the strings to emit light, which causes the luminescent materials to emit light. A user interface enables users to control the currents applied by the control circuit to the strings of LEDs to achieve a Correlated Color Temperature (CCT) value and hue that are desired by users, with CIE chromaticity coordinates that lie on, or near to the black body radiation curve. Preferably a transparent material is dispensed on the substrate between the LED semiconductor chips to substantially surround the LED semiconductor chips. Thereafter at least one layer containing luminescent materials is applied on the LED semiconductor chips and the transparent material. | 07-31-2014 |
20140063797 | MULTIPLE WAVELENGTH LED ARRAY ILLUMINATOR FOR FLUORESCENCE MICROSCOPY - One embodiment provides light along an optical axis. It comprises a substrate and at least one array of multiple LED chips without individual packaging supported by the substrate. The LED chips emit light within different wavelength ranges and are distributed laterally with respect to the axis over an area, the LED chips having light emitting surfaces for emitting light in directions transverse to the area. An optical element adjacent to the light emitting surfaces of the LED chips in the at least one array collects and directs light emitted by the LED chips of the at least one array along the axis towards a target. Another embodiment is directed to a method for providing multiple wavelength light for fluorescent microscopy using the above system. Electric current is supplied to the multiple LED chips, causing them to emit light of multiple wavelengths. The currents supplied to the multiple LED chips are controlled so as to control the exposure of fluorescent dyes with different excitation wavelengths wherein the light emitted by the multiple LED chips include wavelength components at such different excitation wavelengths without having to move the multiple LED chips. | 03-06-2014 |
20120287621 | ZOOM SPOTLIGHT USING LED ARRAY - A LED array spot illuminator for providing light along an optical axis comprises a substrate and at least one array of multiple LED chips without individual packaging supported by the substrate, wherein the LED chips emit light within the same or different wavelength ranges and are distributed laterally with respect to the axis over a light-emitting area. The LED chips have light emitting surfaces for emitting light in directions transverse to the area. An optical device collects and directs light emitted by the LED chips of the at least one array along the axis. An aperture passes the light emitted by the LED chips of the at least one array along the axis, wherein light collected by the optical device and passed by the aperture forms a beam of light illuminating a spot. Electric current is supplied to the multiple LED chips, causing them to emit light. Light emitted by the multiple LED chips that passed through the optical device and the aperture form a beam of light illuminating a spot. A distance between the multiple LED chips and one or more elements of the optical device is controlled to select a size of the spot. | 11-15-2012 |
20120043907 | COMPACT HIGH BRIGHTNESS LED GROW LIGHT APPARATUS, USING AN EXTENDED POINT SOURCE LED ARRAY WITH LIGHT EMITTING DIODES - A compact high-brightness LED grow light fixture is described for use in growing plants under artificial light, or as a supplement to natural sunlight. The LED grow light uses a densely-packed array of high-brightness light emitting diodes (LEDs) that are not individually packaged where the array behaves similarly to a point source of light. The LED chips are distributed laterally over an area, where the LED chips have light emitting surfaces for emitting light in directions transverse to said area, wherein the dimensions of the area do not exceed 25 mm. Adjacent chips of the array are preferably separated by less than about 0.2 mm. The extended point source LED array, with its lens and associated reflector, result in a concentrated, partially-collimated light source, such that the intensity of the light does not diminish rapidly as distance from the light source increases. Thus, foliage that is lower down on the plant will receive almost as much light energy as does foliage on the top of the plant. The compact LED grow light does not block much of the natural sunlight, making the LED grow light suitable for use as a supplement to natural sunlight. The LED array contains a plurality of LED strings that may be separately controlled, thereby allowing the spectral content of the LED grow light to be varied, to facilitate desired plant growth at various stages of plant life. Multiple wavelengths of LEDs may be used within each LED string, thereby allowing the ability to further optimize the spectral content of the LED grow light. Due to the compact size of the LED grow light, the light emitted at each of the multiple different wavelengths from the array is evenly distributed, when the objects being illuminated by the array are at a distance of less than about 6 feet or even less than 1 foot from the array. Flexible mounting options allow for the use of multiple compact LED grow lights within a single plant growing area, and also allow for side or bottom lighting of plant foliage, in addition to the more typical overhead lighting. | 02-23-2012 |
20100032699 | System for High Efficiency Solid-State Light Emissions and Method of Manufacture - In one embodiment of the invention, a bonding material is used to bond a substitute substrate to the LED, wherein the bonding material does not including gold or tin. The bonding material preferably includes gallium (Ga), such as a combination of Ga and Al or Cu. This bonding material has high thermal conductivity, high strength, high temperature stability and is low cost. In another embodiment of the invention, the substitute substrate is first thinned before it is bonded to the LED structure, so that the substitute substrate is flexible and conforms to the shape of the LED structure. In yet another embodiment of the invention, an apparatus is used for bonding a substitute substrate to a LED which comprises a plurality of semiconductor epitaxial layers, said semiconductor epitaxial layers having been grown on the growth substrate so that said semiconductor epitaxial layers are curved in shape. The apparatus comprises a conduit for evacuating a region near the substitute substrate on a side of the substitute substrate that is opposite to that of said semiconductor epitaxial layers. Gas pressure is applied on the semiconductor epitaxial layers, and the substitute substrate conforms to the shape of said semiconductor epitaxial layers as a result of pressure applied. A bonding material is used for bonding said substitute substrate to the semiconductor epitaxial layers. | 02-11-2010 |
20080315220 | High Light Efficiency Solid-State Light Emitting Structure And Methods To Manufacturing The Same - In one embodiment of an epitaxial LED device, a buffer layer (e.g. dielectric layer) between the current spreading layer and the substitute substrate comprises a plurality of vias and has a refractive index that is below that of the current spreading layer. A reflective metal layer between the buffer layer and the substitute substrate is connected to the current spreading layer through the vias in the buffer layer. The buffer layer separates the current spreading layer from the reflective metal layer. In yet another embodiment, stress management is provided by causing or preserving stress, such as compressive stress, in the LED so that stress in the LED is reduced when it experiences thermal cycles. In one implementation of this embodiment, a layer is attached to the LED and reflective metal layer, and causes or preserves stress in the LED along one or more directions parallel to an interface between the LED epitaxial layers so that stress in the LED is reduced in said one or more directions when temperature of the structure is increased. | 12-25-2008 |