DAINIPPON SCREEN MFG CO., LTD. Patent applications |
Patent application number | Title | Published |
20150255315 | APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE - A rinsing liquid adheres to a substrate subjected to a cleaning process. The rinsing liquid on the substrate is first replaced with IPA liquid. While the substrate covered with the IPA liquid is held in a dryer chamber, liquid carbon dioxide is supplied to the surface of the substrate. Liquid nitrogen is supplied to cool down the interior of the dryer chamber. This solidifies the liquid carbon dioxide on the substrate into solid carbon dioxide. Thereafter, the pressure in the dryer chamber is returned to atmospheric pressure, and gaseous nitrogen is supplied into the dryer chamber. Thus, the temperature in the dryer chamber increases. The solid carbon dioxide on the surface of the substrate is sublimated, and is hence removed from the substrate. All of the steps are performed while carbon dioxide is not in a supercritical state but in a non-supercritical state. | 09-10-2015 |
20150174924 | DRYING APPARATUS AND PRINTING APPARATUS - In an inkjet printing apparatus, heaters are enclosed with a heater casing, achieving accumulation of heated air and efficient performance of heating. A blowing fan blows air to the heaters. The heater casing includes a blowing port configured to narrow and blow warm air heated with the heaters to a transportation path outside the heater casing in a direction along the transportation path. The warm air narrowed at the blowing port obtains an increased air velocity thereof. In addition, uniform air-quantity distribution and uniform heat-quantity are obtainable. Moreover, the heaters face the transportation path. Consequently, the heaters are provided closer to the transportation path than a conventional external heater. This suppresses heat loss. | 06-25-2015 |
20150091999 | IMAGE RECORDING APPARATUS AND BASE MATERIAL SUPPLY APPARATUS - An image recording apparatus includes an unwinder, a recorder, a take-up part, a first supporter, a surface modifying part, and a second supporter. The unwinder unwinds a base material from a roll. The recorder records an image onto a surface of the base material. The take-up part takes up the base material on which an image has been recorded by the recorder. The first supporter supports the base material that is being conveyed in a direction away from the recorder after having been unwound from the unwinder. The surface modifying part modifies a surface of the base material by energizing the surface of the base material that has passed through the first supporter. The second supporter supports the base material that is being conveyed in a direction toward the recorder after having passed through the surface modifying part. The second supporter is more distant from the unwinder than the first supporter is. The unwinder is disposed on at least one of a virtual line segment that connects the surface modifying part and the recorder and a normal to the line segment. | 04-02-2015 |
20150091963 | PRINTING APPARATUS AND METHOD OF CORRECTING STEP SHIFT THEREOF - A printing apparatus performing printing to a print medium includes a printer having at least two line heads with a plurality of recording modules; a scanner configured to scan an image printed with the printer to obtain a scanned image; a correcting-chart printing unit configured to print first and second correcting charts in first and second line head printing areas, respectively; a scanned image collecting unit configured to collect first and second scanned images; a correction-data calculating device configured to calculate correction data by determining a reference head difference from the first scanned image, determining an individual head difference from the second scanned image, summing up the reference head difference and the individual head difference to obtain a total, the reference head difference and the total being regarded as the correction data for the first and second line heads, respectively; and an adjusting device configured to adjust a timing | 04-02-2015 |
20150086102 | METHOD FOR EVALUATING CULTURE QUALITY - A culture quality evaluation method comprises: a first step of culturing a pluripotent stem cell under a predetermined culture condition and creating a sample; a second step of imaging a proliferated cell colony in the sample and accordingly capturing an original image; a third step of dividing the original image into smaller images of a predetermined size and calculating standard deviations of pixel values of pixels of the smaller images; and a fourth step of judging whether the sample is an acceptable sample based upon a ratio of a number of the smaller images whose values of the standard deviations are within a predetermined range to a total number of the smaller images. | 03-26-2015 |
20150068450 | SUBSTRATE TREATMENT APPARATUS - A substrate treatment apparatus includes: a substrate holding unit which horizontally holds a substrate; a substrate rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; a treatment liquid supplying unit which supplies a treatment liquid to an upper surface of the substrate held by the substrate holding unit; an opposing member to be located in opposed spaced relation to the upper surface of the substrate held by the substrate holding unit in contact with a film of the treatment liquid formed on the upper surface of the substrate so as to receive a lift force from the liquid film; a support member which supports the opposing member; and an opposing member holding mechanism which causes the support member to hold the opposing member in a vertically relatively movable manner. | 03-12-2015 |
20150029256 | INKJET PRINTING APPARATUS AND METHOD OF CORRECTING STEP SHIFT THEREOF - Provided is an inkjet printing apparatus configured to perform printing by discharging ink droplets onto a print medium. The apparatus includes a printing head having a plurality of inkjet heads and configured to perform printing by discharging the ink droplets from the plurality of inkjet heads onto the print medium; a chart printing device configured to print a step-shift correcting chart with the printing head; a reading device configured to read the step-shift correcting chart printed on the print medium; a print medium-processed portion detecting device configured to detect a processed portion of the print medium; an uninfluenced step-shift correcting-chart generating device configured to generate an uninfluenced step-shift correcting chart; and a shift-amount calculating device configured to calculate a shift amount for correcting the step shift in accordance with the uninfluenced step-shift correcting chart. | 01-29-2015 |
20150020968 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus of the present invention comprises a cooling mechanism for cooling a processing solution and a filter for removing impurities contained in the processing solution, at some midpoint in a circulation path of the processing solution. With this constitution, the substrate processing apparatus can precipitate the impurities dissolved in the processing solution and remove the precipitated impurities. It therefore becomes possible to maintain the performance of the processing solution and reuse the processing solution. Further, the frequency of changing the processing solution to a new solution decreases, and this causes an increase in availability of the substrate processing apparatus and a decrease in consumption and drainage of the processing solution. | 01-22-2015 |
20150013732 | SUBSTRATE TREATMENT APPARATUS - A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit. | 01-15-2015 |
20140377044 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE CONVEYING APPARATUS FOR USE IN THE SAME - A substrate processing apparatus includes a substrate processing section that processes a plurality of substrates assuming a vertical posture in a batch manner; a first traversing mechanism that laterally moves a first traverse holding portion along a first traversing path between a substrate transfer position and a substrate delivery position; a second traversing mechanism that laterally moves a second traverse holding portion along a second traversing path disposed below the first traversing path between the substrate transfer position and the substrate delivery position; an elevation mechanism that raises and lowers an elevation holding portion in the substrate transfer position; and a main transfer mechanism that conveys a plurality of substrates assuming a vertical posture in a batch manner between the substrate delivery position and the substrate processing section, the first and second traverse holding portions, and the elevation holding portion each holds a plurality of substrates assuming a vertical posture in a batch manner. | 12-25-2014 |
20140373882 | TREATMENT LIQUID SUPPLY APPARATUS AND SUBSTRATE TREATMENT APPARATUS INCLUDING THE SAME - A treatment liquid supply apparatus supplies a treatment liquid to a predetermined object for treatment of a substrate, and recovers the supplied treatment liquid for reuse. The apparatus includes: a first tank in which the treatment liquid to be supplied to the object is stored; a second tank in which the treatment liquid recovered from the object is stored; a transfer unit which transfers the treatment liquid from the second tank to the first tank; a first temperature regulating unit which regulates the temperature of the treatment liquid to be supplied from the first tank to the object; and a second temperature regulating unit which regulates the temperature of the treatment liquid to be transferred from the second tank to the first tank by the transfer unit. | 12-25-2014 |
20140368887 | IMAGE INSPECTION DEVICE, PROGRAM PRODUCT, AND METHOD COMPARING TARGET PRINT PAGE DATA AND DISPLAY PAGE DATA TO CREATE DIFFERENTIAL PAGE IMAGE ATTRIBUTE INFORMATION - When a differential page image is created by comparing a target inspection page image and an inspection page image, differential page image attribute information which is an inspection result is created by acquiring attribute information of an image region of the target inspection page image and an image region of the inspection page image corresponding to the differential page image, from target inspection page image data and inspection page image data. | 12-18-2014 |
20140352742 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus has a cup part for receiving processing liquid such as pure water which is splashed from a substrate. The cup part is formed of electrical insulation material or semiconductor material. Hydrophilic treatment may be performed on an outer annular surface of the cup part and water may be held on the outer annular surface of the cup part while processing the substrate. With the disclosed apparatus, charged potential of the cup part generated by splashing of pure water can be suppressed, without greatly increasing the manufacturing cost of the substrate processing apparatus. As a result, it is possible to prevent electric discharge from occurring on the substrate due to induction charging of the substrate, in application of the processing liquid onto the substrate. | 12-04-2014 |
20140338824 | APPARATUS AND METHOD FOR MANUFACTURING COMPOSITE MEMBRANE - An electrolyte membrane with a backsheet is sent out from an electrolyte membrane unwinding roller, and is separated with its second side sucked on a suction roller by a first press roller. While the electrolyte membrane from which the backsheet has been separated is transported with the electrolyte membrane sucked and supported on the suction roller, an electrode ink is applied to a first side of the electrolyte membrane to form an electrode ink layer, which is dried by blowing hot air thereto to form a catalyst layer. Thereafter, in a state in which the outer surface of a second press roller disposed close to the suction roller is in contact with and supported on the first side of the electrolyte membrane, a support film is pressed against the second side of the electrolyte membrane by a third press roller and attached thereto to manufacture a catalyst-coated membrane. | 11-20-2014 |
20140331927 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a plurality of chuck pins and a heat source. The chuck pin includes a conductive member made of a material containing carbon, and a pin cover that covers the conductive member. The conductive member includes a gripping portion softer than the substrate, the gripping portion to be pressed onto a peripheral edge portion of the substrate, and protrudes outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate. The pin cover covers, in a plan view, the entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate. | 11-13-2014 |
20140293298 | THRESHOLD MATRIX GENERATION METHOD, IMAGE DATA GENERATION METHOD, IMAGE RECORDING APPARATUS, AND RECORDING MEDIUM - An image obtained by shrinking an original image in a row direction is halftoned, and this halftone dot image is enlarged in the row direction and recorded at double speed. In order to determine a threshold value of a threshold matrix used for halftoning an image, prepared is a matrix space in accordance with writing positions used for actual recording of an image. In the matrix space, writing elements are set alternately with non-writing elements both in the row direction and in a column direction. In the matrix space, turn-on numbers are allocated to all the writing elements in avoidance of the non-writing elements. Then, in accordance with the turn-on numbers, respective threshold values for the writing elements are determined. By shrinking the threshold matrix in the row direction with omission of the non-writing elements, a threshold matrix for double speed is obtained. | 10-02-2014 |
20140290839 | TRANSFER APPARATUS AND TRANSFER METHOD - A transfer apparatus includes a plurality of holders respectively coming into contact with a carrier and a roller member. Each of the holders is sequentially separated from the carrier in accordance with a movement of the roller member, moves to a retracted position where the holder does not interfere with the roller member, comes into contact with the other surface of the carrier again after the passage of the roller member, and moves in the direction away from the carrier while sucking the carrier by the suction unit. | 10-02-2014 |
20140290703 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus includes a substrate supporting part for supporting a substrate in a horizontal state, an upper nozzle for discharging deionized water as a cleaning solution toward a center portion of an upper surface of the substrate, and a substrate rotating mechanism for rotating the substrate supporting part together with the substrate around a central axis directed in a vertical direction. In the substrate processing apparatus, the plurality of discharge ports are provided in the upper nozzle, and the flow rate of the deionized water to be supplied onto the center portion of the substrate from the upper nozzle can be ensured, with the flow rate of the deionized water from each discharge port reduced. It is thereby possible to perform appropriate cleaning of the upper surface of the substrate while suppressing electrification at the center portion of the substrate. | 10-02-2014 |
20140285549 | APPARATUS FOR AND METHOD OF SUPPLYING LIQUID - A liquid supply apparatus includes a reservoir for storing a liquid therein, a supply path for supplying the liquid from the reservoir to a liquid consuming apparatus, a pump for feeding the liquid from the reservoir to the supply path, and a controller for outputting a driving signal to the pump to control the supply of the liquid. The controller acquires a target feed volume of the liquid from the pump to gradually change a feed volume of the liquid from the pump from a current feed volume to the target feed volume, based on a request signal from the liquid consuming apparatus serving as a destination to which the liquid is supplied. This suppresses an abrupt change in pressure in the liquid consuming apparatus serving as the destination to which the liquid is supplied. | 09-25-2014 |
20140283882 | SUBSTRATE PROCESSING METHOD - A hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented. | 09-25-2014 |
20140273498 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - In a substrate processing apparatus, provided are an upper nozzle for supplying a chemical liquid having a temperature higher than that of a substrate onto an upper surface of the substrate and a heating liquid supply nozzle for supplying a heating liquid having a temperature higher than that of the substrate onto a lower surface of the substrate. It is thereby possible to suppress or prevent a decrease in the temperature of the chemical liquid supplied on the upper surface of the substrate from a center portion of the substrate toward an outer peripheral portion thereof. In a supply nozzle, the heating liquid supply nozzle is positioned on the inner side of a heating gas supply nozzle for ejecting heating gas in drying the substrate. It is thereby possible to simplify and downsize a structure used for heating the lower surface of the substrate. | 09-18-2014 |
20140270734 | LIGHT IRRADIATION TYPE HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD - Four wafer pins are fixed in a chamber and spaced at intervals of 90 degrees. Four support pins are provided in a wafer pocket of a susceptor and spaced at intervals of 90 degrees. The four wafer pins and the four support pins are disposed concyclically in an alternating manner at intervals of 45 degrees. When halogen lamps irradiate a semiconductor wafer with light to heat the semiconductor wafer, the susceptor is moved upwardly and downwardly, so that the semiconductor wafer is shifted between the wafer pins and the support pins. This eliminates the occurrence of a problem such that the quartz pins which are relatively low in temperature are continuously kept in contact with particular places of the semiconductor wafer to improve the uniformity of the in-plane temperature distribution of the semiconductor wafer. | 09-18-2014 |
20140267495 | LIQUID EJECTION APPARATUS - An inkjet printer includes a cleaning unit to be brought into contact with a head lower surface of an ejection head, and a unit movement mechanism for moving the cleaning unit. The cleaning unit includes a base part, a cleaning liquid ejecting part protruding above the base part, and a pair of positioning parts. The positioning parts are brought into contact with a block lower surface of a head fixation block on opposite sides of the cleaning liquid ejecting part to keep an under-head gap for holding the cleaning liquid between the cleaning liquid ejecting part and the head lower surface. Since the positioning parts are spaced from the cleaning liquid ejecting part, it is possible to prevent the cleaning liquid that has spread from the under-head gap to the surrounding area from adhering to the block lower surface via the positioning parts. | 09-18-2014 |
20140267490 | LIQUID EJECTION APPARATUS - In an inkjet printer, a cap part for receiving ink from a head unit during maintenance includes a liquid receiving part and an exhaust part disposed laterally to the liquid receiving part. In the liquid receiving part, a second liquid receiving chamber is disposed further from the exhaust part than is a first liquid receiving part. A second flow path is disposed below the first liquid receiving chamber without passing through the first liquid receiving chamber. In the exhaust part, a first fan part is connected to the first liquid receiving chamber, and a second fan part is connected to the second liquid receiving chamber through the second flow path. Accordingly, it is possible to appropriately exhaust a gas contained within the second liquid receiving chamber, independently of the first liquid receiving chamber. Consequently, a mist in the liquid receiving part can be discharged efficiently. | 09-18-2014 |
20140261586 | SUBSTRATE PROCESSING APPARATUS - In a substrate processing apparatus, an election head from a position above a substrate held by a substrate holding part to an inspection position above a standby pod disposed outside a cup part. At the inspection position, a processing liquid ejected from the ejection head toward the standby pod is irradiated with planar light emitted from a light emitting part. An imaging part acquires an inspection image including bright dots appearing on the processing liquid, and a determination part determines the quality of the ejection operation of the ejection head on the basis of the inspection image. Accordingly, it is possible to eliminate the influence of reflected light from the substrate and droplets, mist, or the like of the processing liquid having collided with the substrate and to accurately determine the quality of the ejection operation of the ejection head. | 09-18-2014 |
20140261577 | EJECTION INSPECTION APPARATUS AND SUBSTRATE PROCESSING APPARATUS - An ejection inspection part of a substrate processing apparatus includes a light emitting part and an imaging part. The light emitting part emits light along a predetermined light existing plane to irradiate a processing liquid ejected from outlets of an ejection head with the light. The imaging part captures an image of the processing liquid passing through planar light emitted from the light emitting part to acquire an inspection image including bright dots. In the ejection inspection part, a determination frame setting part sets normal ejection determination frames corresponding to the outlets in the inspection image. The determination part acquires existence information indicating whether or not a bright dot exists in each normal ejection determination frame and uses the existence information to determine the quality of the ejection operation of the outlet corresponding to the normal ejection determination frame. It is thus possible to individually and accurately determine the quality of the ejection operations of the outlets. | 09-18-2014 |
20140261557 | SUBSTRATE PROCESSING APPARTUS AND STANDBY METHOD FOR EJECTION HEAD - In a substrate processing apparatus, an ejection surface of an ejection head located at a standby position is immersed in an immersion liquid retained in a reservoir during standby of the ejection head. This prevents drying of a plurality of outlets provided in the ejection head and drying of processing liquid flow passages that communicate with the outlets. It is thus possible to suppress or prevent clogging of the fine outlets. When the ejection head resumes processing on a substrate, the immersion liquid in the reservoir is discharged and then a liquid removing part removes the immersion liquid adhering to the ejection surface. Accordingly, it is possible to prevent the immersion liquid remaining on the ejection surface from dropping and adhering to the substrate (so-called “liquid dripping”) when, for example, the ejection head is moved to a position above the substrate. | 09-18-2014 |
20140261162 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus for processing a substrate comprises: a plurality of chuck pins each having an accommodating groove for accommodating a portion of peripheral part of the substrate, holding the substrate at a hold position in a horizontal posture by pressing inner faces of the accommodating grooves toward portions of peripheral part of the substrate; and a plurality of guide members, being disposed on or above the respective plurality of chuck pins, guiding process liquid discharged from the substrate to a surrounding area of the substrate; wherein each of the plurality of guide member includes: an inner-edge guide disposed at a position inward and above the accommodating groove; and an outer-edge guide disposed at a position level with or below the inner-edge guide and outward the chuck pin. | 09-18-2014 |
20140253911 | INSPECTING DEVICE AND INSPECTING METHOD - An inspecting device includes: an irradiation part for dividing pulsed light emitted from a femtosecond laser into measurement pump light and measurement probe light, to irradiate a solar cell; a detection part for detecting an electromagnetic wave emitted from the solar cell in accordance with the irradiation with the measurement probe light; and a measurement delay part for delaying the time of arrival of the measurement probe light at the solar cell relatively to the measurement pump light. The irradiation part is provided with a galvano mirror for scanning with the measurement probe light a wide range which is wider than an irradiated range (pump light spot) being irradiated with the measurement pump light in a solar cell. | 09-11-2014 |
20140253625 | PRINTED MATTER, PRINTING APPARATUS, AND PRINTING PRECISION MEASURING METHOD - Provided is a printed matter for measuring printing precision of a printing apparatus configured to perform printing to both sides of a printing medium. The printed matter includes a plurality of positioning reference marks printed orthogonal to a transportation direction of the printing medium; and an inspecting window bored in a positioning reference mark of the plurality of positioning reference marks, the positioning reference mark corresponding to an object to be inspected. The printing medium is folded so as to make another positioning reference mark on the printing medium visible through the inspecting window, and the positioning reference mark on a side of the inspecting window is compared with the positioning reference mark visible through the inspecting window, whereby printing precision is measured. | 09-11-2014 |
20140242459 | ELECTRODE FOR BATTERY, BATTERY, AND METHOD OF AND APPARATUS FOR MANUFACTURING ELECTRODE FOR BATTERY - An electrode | 08-28-2014 |
20140239182 | INSPECTING DEVICE AND INSPECTING METHOD - An inspecting device inspects an inspecting target that is a semiconductor device or a photo device. The inspecting device includes: a stage for holding an inspecting target; a femtosecond laser for emitting pulsed light; a galvano mirror for obliquely irradiating the inspecting target with the pulsed light, while changing an optical path of the pulsed light, to scan the inspecting target with the pulsed light; and a detection part for detecting an electromagnetic wave emitted non-coaxially with the pulsed light from the inspecting target in accordance with the illumination with the pulsed light. | 08-28-2014 |
20140235072 | THERMAL PROCESSING METHOD AND THERMAL PROCESSING APPARATUS FOR HEATING SUBSTRATE, AND SUSCEPTOR - A semiconductor wafer with (100) plane orientation has two orthogonal cleavage directions. A notch is provided so as to indicate one of these directions. During irradiation with a flash, the semiconductor wafer warps about one of two radii at an angle of 45 degrees with respect to the cleavage directions such that the upper surface thereof becomes convex, and the opposite ends of the other radii become the lowest position. Eight support pins in total are provided in upright position on the upper surface of a holding plate of a susceptor while being spaced at intervals of 45 degrees along the same circumference. The semiconductor wafer is placed on the susceptor such that any of the support pins supports a radius at an angle of 45 degrees with respect to a cleavage direction. | 08-21-2014 |
20140232785 | INKJET PRINTER - In an inkjet printer, a first sparsely arranged portion of a first ejection head entirely overlaps in a movement direction with a second densely arranged portion of a second ejection head. A plurality of outlets of the first sparsely arranged portion include use outlets, and among a plurality of outlets of the second densely arranged portion, those that overlap in the movement direction with use outlets of the first sparsely arranged portion are non-use outlets. In an overlapping range of the first ejection head and the second ejection head, outlets of both of the ejection heads are used in recording an image onto a base material. Consequently, it is possible to prevent or suppress a reduction in print quality such as changes in density or the occurrence of voids due to displacement of the mounting positions of ejection heads in the overlapping range. | 08-21-2014 |
20140232779 | TRANSPORT DEVICE AND INKJET PRINTING APPARATUS HAVING THE SAME - The transport device includes a plurality of transporting sections to transport a printing medium; a divided accelerating interval setting section to set a transportation speed in a divided accelerating interval corresponding to a time generated by dividing a time where the transportation speed of the printing medium changes from 0 to a given value in accordance with an acceleration rate; a divided decelerating interval setting section to set a transportation speed in a divided decelerating interval corresponding to a time generated by dividing a time where the transportation speed of the printing medium changes from the given value to 0 in accordance with an decelerating rate; including a basic shaft transporting section configured to be driven at the transportation speed set for every divided accelerating interval or for every divided decelerating interval for transporting the printing medium; and a controller for controlling the foregoing sections. | 08-21-2014 |
20140231013 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a phosphoric acid supply device for supplying phosphoric acid aqueous solution onto the upper surface of a substrate held on a spin chuck, a heater for emitting heat toward a portion of the upper surface of the substrate with the phosphoric acid aqueous solution being held on the substrate, a heater moving device for moving the heater to move a position heated by the heater within the upper surface of the substrate, a water nozzle for discharging water therethrough toward a portion of the upper surface of the substrate with the phosphoric acid aqueous solution being held on the substrate and a water nozzle moving device for moving the water nozzle to move the water landing position within the upper surface of the substrate. | 08-21-2014 |
20140231012 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a spin chuck for holding a substrate horizontally, a phosphoric acid supply device for supplying phosphoric acid aqueous solution onto the upper surface of the substrate held on the spin chuck to form a liquid film of phosphoric acid aqueous solution covering the entire upper surface of the substrate, a heating device for heating the substrate with the liquid film of phosphoric acid aqueous solution held thereon and a pure water supply device for supplying pure water onto the liquid film of phosphoric acid aqueous solution. | 08-21-2014 |
20140222202 | TRANSFER POSITION TEACHING METHOD, TRANSFER POSITION TEACHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS - The transfer position teaching apparatus is provided with a teaching substrate having a shape identical to a semiconductor wafer to be processed by substrate processing apparatuses and having an electrically conductive coating thereon. The transfer position teaching apparatus is also provided with a base member having insulator coating thereon and on the base member, entrance contact members, Y-direction contact members, X-direction contact member are vertically arranged. | 08-07-2014 |
20140220592 | METHOD OF CALIBRATION - The following processes are performed to improve the accuracy of the process of estimating the volume of a cell clump from an image including the cell clump. First, the image including the cell clump is acquired, and the optical density of the cell clump in the image is measured. Cross-section information about the cell clump is acquired by observation using a confocal microscope or by physical cutting. Based on the cross-section information, the vertical height of the cell clump is determined. Thereafter, data representing a relationship between the aforementioned optical density and the height is acquired. This improves the accuracy of the process of converting the optical density into the height to thereby achieve the accurate estimation of the volume of the cell clump. | 08-07-2014 |
20140211229 | IMAGE PROCESSING APPARATUS, AN IMAGE PROCESSING METHOD, AND AN IMAGE PROCESSING PROGRAM - A print data processing apparatus | 07-31-2014 |
20140210133 | PATTERN FORMING APPARATUS AND PATTERN FORMING METHOD - A pattern forming apparatus comprises: a first holder which holds a blanket carrying a pattern forming material on one surface in a horizontal posture with a carrying surface for the pattern forming material faced up; a second holder which holds a plate for patterning the pattern forming material or a substrate, to which a pattern is transferred, as a processing object such that the processing object is proximate to and facing the carrying surface of the blanket held on the first holder; and a push-up unit which partially pushes up an effective area in a central part of the blanket from a lower surface side of the blanket to bring the effective area into contact with the processing object held on the second holder and moves along the lower surface of the blanket to change a push-up position of the blanket. | 07-31-2014 |
20140209250 | DETACHING APPARATUS AND DETACHING METHOD - In a detaching apparatus, a detachment starter bends one end part of a first plate-like body into a cylindrical or prismatic surface in a direction opposite to a second plate-like body, thereby forming a single and straight boundary line between an adhering region and a detached region. A separator increases a distance between a first holder holding the first plate-like body and a second holder holding the second plate-like body to separate the first and second plate-like bodies. | 07-31-2014 |
20140206108 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH FLASH OF LIGHT - A flash heating part in a heat treatment apparatus includes 30 built-in flash lamps, and irradiates a semiconductor wafer held by a holder in a chamber with a flash of light. Thirty switching elements are provided in a one-to-one correspondence with the 30 flash lamps. Each of the switching elements defines the waveform of current flowing through a corresponding one of the flash lamps by intermittently supplying electrical charge thereto. Radiation thermometers measure an in-plane temperature distribution of the semiconductor wafer during flash irradiation. Based on the results of measurement with the radiation thermometers, a controller individually controls the operations of the 30 switching elements to individually define the light emission patterns of the 30 flash lamps. | 07-24-2014 |
20140202989 | SUBSTRATE TREATMENT METHOD - A substrate treatment method includes a substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having an opposing face to be opposed to a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the opposing face for filling a space defined between the lower surface of the substrate and the opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state; wherein the treatment liquid spreads outwardly over the lower surface of the substrate and further, flows around to a peripheral portion of an upper surface of the substrate. | 07-24-2014 |
20140202501 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus has an indexer block and a processing block. One side of the processing block has a vertical stack of a plurality of top surface cleaning units and the other side of the processing block has a vertical stack of a plurality of back surface cleaning units. Reversing units for reversing the substrate W are provided one above the other between the indexer block and the processing block. For example, one reversing unit is used for reversing the substrate before a back surface cleaning processing by the back surface cleaning unit or for other purposes, and the other reversing unit is used for placing the substrate W after a top surface cleaning processing by the top surface cleaning unit or for other purposes. | 07-24-2014 |
20140202499 | SUBSTRATE PROCESSING METHOD - A substrate processing apparatus has an indexer block and a processing block. One side of the processing block has a vertical stack of a plurality of top surface cleaning units and the other side of the processing block has a vertical stack of a plurality of back surface cleaning units. Reversing units for reversing the substrate W are provided one above the other between the indexer block and the processing block. For example, one reversing unit is used for reversing the substrate before a back surface cleaning processing by the back surface cleaning unit or for other purposes, and the other reversing unit is used for placing the substrate W after a top surface cleaning processing by the top surface cleaning unit or for other purposes. | 07-24-2014 |
20140202496 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - In a substrate processing apparatus, a temperature of an anti-static liquid having electrical resistivity which gradually decreases as a liquid temperature increases is adjusted by a temperature adjustment part and the electrical resistivity of the anti-static liquid is higher than the electrical resistivity of a processing liquid (SPM liquid). After that, a plurality of substrates are immersed in the anti-static liquid inside the anti-static liquid storage part and both main surfaces of each substrate entirely conic into contact with the anti-static liquid. This gradually removes static electricity from the substrate. Then, the SPM liquid is supplied onto an upper surface of the substrate to thereby perform an SPM process. In the SPM process, it is thereby possible to prevent a large amount of electric charges from sharply moving from the substrate to the SPM liquid and prevent any damage to the substrate. | 07-24-2014 |
20140198966 | APPARATUS FOR PHYSICS AND CHEMISTRY AND METHOD OF PROCESSING IMAGE - Switching between highlighting and unhighlighting of an object determined as adopted and switching between highlighting and unhighlighting of an object determined as not adopted are performed individually and independently by manipulation of an on/off selectable button. This allows switching to be freely performed between the following states in which: objects are highlighted regardless of whether the objects are adopted or not; only an object determined as adopted is highlighted; only an object determined as not adopted is highlighted; and objects are not highlighted regardless of whether the objects are adopted or not. A user visually judges whether the result of the adoption/non-adoption process is proper or not easily while switching between these displays. | 07-17-2014 |
20140197129 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - Scan step (S | 07-17-2014 |
20140182626 | SUBSTRATE TREATING METHOD FOR TREATING SUBSTRATES WITH TREATING LIQUIDS - A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates and placing the substrates in a treating position inside the treating tank, a first and a second treating liquid supply device, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid, is supplied into the treating tank, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid, and then controlling the second treating liquid supply device to replace the first treating liquid stored in the treating tank with the second treating liquid, and controlling the temperature control device to maintain the second treating liquid in the same said temperature range. | 07-03-2014 |
20140174483 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A rinsing liquid (DIW) is discharged from a rinsing liquid discharge port formed in a blocking member to perform rinsing processing to a substrate surface while a nitrogen gas is supplied into a clearance space, and a liquid mixture (IPA+DIW) is discharged from a liquid mixture discharge port formed in the blocking member to replace the rinsing liquid adhering to the substrate surface with the liquid mixture while the nitrogen gas is supplied into the clearance space. Thus, an increase of the dissolved oxygen concentration of the liquid mixture can be suppressed upon replacing the rinsing liquid adhering to the substrate surface with the liquid mixture, which makes it possible to securely prevent from forming an oxide film or generating watermarks on the substrate surface. | 06-26-2014 |
20140169772 | HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY IRRADIATION WITH FLASH LIGHT - A susceptor of a holding part for holding a semiconductor wafer includes a disc-shaped holding plate, an annular shaped guide ring, and a plurality of support pins. The guide ring has an inside diameter greater than the diameter of the semiconductor wafer and is installed on the peripheral portion of the top face of the holding plate. The guide ring has a tapered surface along the inner circumference. The semiconductor wafer before irradiated with flash light is supported by the support pins. The annular shape of the guide ring increases the contact area when the semiconductor wafer that has jumped off the susceptor and fallen when irradiated with flash light collides with the guide ring, thus reducing the impact of the collision and preventing cracks in the substrate. | 06-19-2014 |
20140162467 | HEAT TREATMENT APPARATUS EMITTING FLASH OF LIGHT - Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking. | 06-12-2014 |
20140161429 | THERMAL PROCESSING APPARATUS AND THERMAL PROCESSING METHOD FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - A susceptor that holds a semiconductor wafer placed thereon is capable of moving up and down inside a chamber. For preheating with a halogen lamp, the susceptor moves to a preheating position. The preheating position is a height of the susceptor that achieves the most uniform in-plane illumination distribution of light emitted from the halogen lamp and applied to the semiconductor wafer. After the preheating is finished, the susceptor moves to a flash heating position for irradiation with a flash from a flash lamp. The flash heating position is a height of the susceptor that achieves the most uniform in-plane illumination distribution of a flash emitted from the flash lamp and applied to the semiconductor wafer. | 06-12-2014 |
20140153812 | APPARATUS FOR AND METHOD OF PROCESSING IMAGE AND STORAGE MEDIUM - An image processing apparatus displays an object adopted and an object not adopted by an adoption/non-adoption process in a distinguishable manner. A user designates an object whose adoption/non-adoption result is desired to be reversed among the objects displayed by the image processing apparatus. The image processing apparatus changes an allowable range stored in a storage part so that the adoption/non-adoption result of the designated object is reversed. That is, the user views the adoption/non-adoption result of the objects to change the allowable range of a parameter so that the adoption/non-adoption result becomes proper. This makes the allowable range of the parameter for use in the adoption/non-adoption process proper with ease. | 06-05-2014 |
20140152732 | IMAGE RECORDING APPARATUS, AND RECORDING DENSITY CORRECTION METHOD AND EJECTION TIMING CORRECTION METHOD - An image recording apparatus includes a head for ejecting ink, a moving mechanism for moving a recording medium, and a control part for controlling these constituent elements. The control part includes an information storage part, a conversion part, and a correction part. The conversion part converts input image data into converted image data which is suitable for image recording. The information storage part stores an LUT indicating a relation between the input image data and the converted image data for each head and each type of recording medium. The correction part updates the LUT on a representative recording medium on the basis of correction amounts determined in accordance with reference images which are recorded onto the representative recording medium and further updates the LUT on another type of recording medium. By virtue of providing this correction part, it is possible to simplify a correcting operation of recording densities. | 06-05-2014 |
20140127908 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS - The inventive substrate treatment method includes: an organic solvent supplying step of supplying an organic solvent having a smaller surface tension than a rinse liquid to the upper surface of a substrate so that rinse liquid adhering to the upper surface of the substrate is replaced with the organic solvent; a higher temperature maintaining step of maintaining the upper surface of the substrate at a predetermined temperature higher than the boiling point of the organic solvent to thereby form a gas film of the organic solvent on the entire upper surface of the substrate including the gap of the minute pattern and to form a liquid film of the organic solvent on the gas film, the higher temperature maintaining step being performed after the organic solvent supplying step is started; and an organic solvent removing step of removing the organic solvent liquid film from the upper surface of the substrate. | 05-08-2014 |
20140121791 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, CONTROL METHOD FOR SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM - A substrate processing apparatus includes a plurality of functional sections | 05-01-2014 |
20140109430 | SUBSTRATE TREATING APPARATUS - A substrate treating apparatus for drying substrates with a solvent vapor after treating the substrates with a treating liquid. The apparatus includes a treating tank for storing the treating liquid, a holder for holding the substrates in the treating tank, a chamber enclosing the treating tank, a solvent vapor supply device for supplying the solvent vapor into the chamber, an exhaust device for exhausting gas from the chamber through an exhaust pipe connected at one end thereof to the chamber, a drain pipe connected at one end thereof to the chamber for draining the treating liquid from the chamber, a gas-liquid separator having the other end of the exhaust pipe connected thereto for receiving the gas exhausted by the exhaust device, and having the other end of the drain pipe connected thereto for receiving the treating liquid drained through the drain pipe, the gas-liquid separator separating the gas and the liquid, and a mixer mounted on the exhaust pipe for mixing deionized water into the gas exhausted by the exhaust device. | 04-24-2014 |
20140094951 | WORKING UNIT CONTROL DEVICE, WORKING ROBOT, WORKING UNIT CONTROL METHOD, AND WORKING UNIT CONTROL PROGRAM - A working unit control device includes: a recognizing unit that recognizes the three-dimensional position and the three-dimensional posture of a first target; a setting unit that sets an access start location and an access route based on the three-dimensional position and the three-dimensional posture of the first target thereby recognized, the access start location indicating the three-dimensional position and the three-dimensional posture of a second target in which the second target starts to access, the access route indicating a route of movement of the second target; and a controller that controls the working unit to fit the second target to the first target. This allows control of the working unit while contact between the targets to be fitted to each other is prevented in the middle of the route of movement. | 04-03-2014 |
20140093644 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS - A substrate treatment method includes a rinsing step of supplying a rinse liquid to a front surface of a substrate while rotating the substrate at a first rotation speed, a liquid mixture film forming step of forming a liquid film of a liquid mixture of water and an organic solvent having a smaller surface tension than the water on the front surface after the rinsing step by supplying the water and the organic solvent to the front surface while reducing the rotation speed of the substrate from the first rotation speed to a second rotation speed lower than the first rotation speed, and an organic solvent replacing step of replacing the liquid mixture supplied to the front surface with the organic solvent after the liquid mixture film forming step by supplying the organic solvent to the front surface. | 04-03-2014 |
20140093337 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR PERFORMING CLEANING PROCESS AND THE LIKE ON SUBSTRATE - For the transport of a substrate from a cassette to a back surface cleaning processing unit in a cleaning processing block, a transfer robot rotates the substrate through 90 degrees from a horizontal attitude in which the front surface of the substrate is positioned to face upward into a standing attitude while transporting the substrate out of a cassette to a substrate passing part, and passes the substrate in the standing attitude to the substrate passing part. The substrate passing part holds the substrate in the standing attitude. A main transport robot receives the substrate held in the standing attitude. The main transport robot rotates the substrate through 90 degrees from the standing attitude into a horizontal attitude in which the back surface of the substrate is positioned to face upward while transporting the substrate from the substrate passing part to the back surface cleaning processing unit. | 04-03-2014 |
20140090669 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS - The inventive substrate treatment apparatus includes a spin chuck which horizontally holds and rotates a wafer; a heater which is disposed in opposed relation to a lower surface of the wafer held by the spin chuck and heats the wafer from a lower side; a phosphoric acid nozzle which spouts a phosphoric acid aqueous solution to a front surface (upper surface) of the wafer held by the spin chuck; and a suspension liquid nozzle which spouts a silicon suspension liquid to the front surface of the wafer held by the spin chuck. The wafer is maintained at a higher temperature on the order of 300° C. and, in this state, a liquid mixture of the phosphoric acid aqueous solution and the silicon suspension liquid is supplied to the front surface of the wafer. | 04-03-2014 |
20140089784 | PAGE DATA GENERATION APPARATUS, RECORDING MEDIUM, AND PAGE DATA GENERATION METHOD - A nested relationship acquisition part ( | 03-27-2014 |
20140085657 | CONVERSION TIME PREDICTION APPARATUS, RECORDING MEDIUM, AND CONVERSION TIME PREDICTION METHOD - Page-group data indicating many pages is analyzed to acquire the degree of reuse of page components as an analysis result. A set of page data pieces in the page-group data is acquired as a data block, the number of the pieces corresponding to a unit page number that is the number of pages to be processed collectively as a single task when a conversion processor in a system actually converts the page-group data into drawing data. A predetermined conversion processor converts the data block into drawing data to acquire a conversion processing time. A predicted value of a conversion processing time required for the conversion processor in the system to actually convert the page-group data is accurately obtained using the conversion processing time of the data block. An operator is notified of the analysis result and the predicted value and can easily ascertain the appropriateness of the page-group data. | 03-27-2014 |
20140065295 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS - A substrate treatment method is provided, which includes: a liquid film forming step of forming a liquid film of a treatment liquid on a front surface of a substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied. | 03-06-2014 |
20140060573 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS - A substrate treatment method for removing a resist from a front surface of a substrate is provided. The method includes: a liquid mixture film forming step of forming a liquid film of a liquid mixture of a sulfuric acid-containing liquid and an organic solvent on a front surface of a substrate held by a substrate holding unit; and an infrared radiation applying step of providing a heater in opposed relation to the front surface of the substrate and applying infrared radiation emitted from the heater to the front surface of the substrate on which the liquid film of the liquid mixture is retained. | 03-06-2014 |
20140060423 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, a liquid receiving part, and an upper nozzle. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down. While the chamber cover is in contact with the chamber body, a small sealed space is formed and some processings involving pressure reduction or pressurization are performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. On an outer side relative to the annular opening, positioned are a first cup part and a second cup part. A processing liquid spattering from a substrate is received by the first cup part or the second cup part. In the substrate processing apparatus, it is possible to perform various processings in the small chamber. | 03-06-2014 |
20140051259 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR CARRYING OUT CHEMICAL TREATMENT FOR SUBSTRATE - It is an object to reduce a chemical treating width in a peripheral edge part of a substrate while suppressing deterioration in each of uniformity of the chemical treating width and processing efficiency. In order to achieve the object, a substrate processing device for carrying out a chemical treatment for a substrate using a processing liquid having a reaction rate increased with a rise in temperature includes a substrate holding portion, a rotating portion for rotating the substrate held in the substrate holding portion in a substantially horizontal plane, a heating portion for injecting heating steam to a central part of a lower surface of the substrate to entirely heat the substrate, and a peripheral edge processing portion for supplying the processing liquid from above to a peripheral edge part of the substrate heated by the heating portion, thereby carrying out a chemical treatment for the peripheral edge part. | 02-20-2014 |
20140051258 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR CARRYING OUT CHEMICAL TREATMENT FOR SUBSTRATE - It is an object to carry out a chemical treatment for a peripheral edge part of a substrate while suppressing an amount of consumption of a processing liquid and a time required for processing. In order to achieve the object, a substrate processing device injects heating steam to a peripheral edge part of a substrate to heat the peripheral edge part when carrying out a chemical treatment for the peripheral edge part of the substrate while rotating the substrate in a substantially horizontal posture. Moreover, the substrate processing device injects a gas from above the substrate toward a predetermined injection target region defined within a range surrounded by a rotating track of the peripheral edge part of the substrate in an upper surface of the substrate, thereby generating, on the substrate, a gas flow which flows from the injection target region toward the peripheral edge part of the substrate. | 02-20-2014 |
20140051156 | IMAGING APPARATUS - An imaging apparatus, comprising a holder that holds a specimen container carrying a biological specimen, an imager that images the specimen in the specimen container, a sterilizer that supplies a drug or electromagnetic waves having a sterilization effect to the holder, and a controller that performs a sterilization process of supplying the drug or the electromagnetic waves to the holder by controlling the sterilizer at least either before or after imaging the specimen by the imager. | 02-20-2014 |
20140050977 | METHOD OF AND APPARATUS FOR MANUFACTURING ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY AND ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY - An electrode for lithium-ion secondary battery comprises: a base member which functions as a current collector; and an active material layer formed in a surface of the base member as a stripe-like pattern including a plurality of active material lines which contain silicon or a silicon compound as an active material, which are spaced apart from each other and which protrude beyond the surface of the base member. | 02-20-2014 |
20140041689 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus includes a substrate holding part, a substrate rotating mechanism, and a chamber. The substrate rotating mechanism incudes an annular rotor part disposed in an internal space of the chamber and a stator part disposed around the rotor part outside the chamber. The substrate holding part is attached to the rotor part in the internal space of the chamber. In the substrate rotating mechanism, a rotating force is generated about a central axis between the stator part and the rotor part. The rotor part is thereby rotated about the central axis, being in a floating state, together with a substrate and the substrate holding part. In the substrate processing apparatus, the substrate can be easily rotated in the internal space having excellent sealability. As a result, it is possible to easily perform single-substrate processing in a sealed internal space. | 02-13-2014 |
20140007033 | DEVICE FOR AND METHOD OF GENERATING WIRING DATA, AND IMAGING SYSTEM | 01-02-2014 |
20130333731 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus includes a transferring unit disposed in a connecting part of a washing processing cell and an indexer cell. The transferring unit includes an inverting support portion for supporting a substrate in a horizontal posture, a feed supporting portion disposed at an interval in a vertical direction from the inverting support portion for supporting the substrate in the horizontal posture, and an interposing and inverting mechanism for inverting the substrate to be supported by the inverting support portion and bringing the inverted substrate to be supported by the inverting support portion again. A part of the substrate to be supported by a feed supporting portion is disposed in an inversion region for the substrate to be inverted by the interposing and inverting mechanism. | 12-19-2013 |
20130333722 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus includes a substrate holding unit holding a substrate, a cleaning liquid supplying unit supplying, to the substrate held by the substrate holding unit, a cleaning liquid containing a foaming agent that foams due to application of foaming energy, and a foaming energy supplying unit applying the foaming energy to the cleaning liquid in contact with the substrate held by the substrate holding unit. | 12-19-2013 |
20130327365 | SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS - A valve is closed while a cleaning liquid is fed into a tubular body of a cleaning nozzle, and a piezoelectric element applies vibrations to the cleaning liquid. This causes droplets of the cleaning liquid to be produced and discharged from a plurality of discharge holes. The droplet diameter of the discharged droplets is in the range from 15 to 200 μm, and the distribution of the droplet diameter is such that the value of where a value of 3σ does not exceed 10% of the average droplet diameter. The droplet speed is in the range from 20 to 100 meters per second, and the distribution of the droplet speed is such that the value of where a value of 3ν does not exceed 10% of the average droplet speed. The droplet flow rate is not less than 10 milliliters per minute. Discharging the droplets of the cleaning liquid from the cleaning nozzle toward a substrate while satisfying these discharge conditions improves cleaning efficiency without damages to the substrate. | 12-12-2013 |
20130315576 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD FOR MEASURING PARTICLE CONCENTRATION - A heat treatment apparatus includes a chamber for receiving a substrate therein, and a measurement part for measuring an air particle concentration in a processing space provided in the chamber. An air particle concentration in the processing space provided in the chamber is measured by the measurement part. The air particle concentration is correlated with the number of particles attached to a substrate received in the chamber. Accordingly, by conducting a particle test after the air particle concentration in the processing space is lowered to an air particle concentration corresponding to the number of particles existing on the substrate which can pass the particle test, the number of times the particle test should be conducted after maintenance of the heat treatment apparatus can be reduced. | 11-28-2013 |
20130306238 | CHEMICAL LIQUID PREPARATION METHOD OF PREPARING A CHEMICAL LIQUID FOR SUBSTRATE PROCESSING, CHEMICAL LIQUID PREPARATION UNIT PREPARING A CHEMICAL LIQUID FOR SUBSTRATE PROCESSING, AND SUBSTRATE PROCESSING SYSTEM - A substrate processing system includes a chemical liquid preparation unit preparing a chemical liquid to be supplied to a substrate and a processing unit which supplies the chemical liquid, prepared by the chemical liquid preparation unit, to the substrate. The chemical liquid preparation unit supplies an oxygen-containing gas, containing oxygen gas, to a TMAH-containing chemical liquid, containing TMAH (tetramethylammoniumhydroxide),tomaketheoxygen-containing gas dissolve in the TMAH-containing chemical liquid. | 11-21-2013 |
20130260574 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - In a substrate processing apparatus, with an internal space of a chamber brought into a reduced pressure atmosphere, a first processing liquid is supplied onto an upper surface of a substrate while the substrate is rotated, and the first processing liquid is thereby quickly spread from a center portion toward a peripheral portion on the upper surface of the substrate. It is thereby possible to coat the upper surface of the substrate with the first processing liquid in a shorter time as compared with under normal pressure. Further, by sucking the first processing liquid from the vicinity of an edge of the substrate, it is possible to coat the upper surface of the substrate with the first processing liquid in a still shorter time. As a result, it is possible to shorten the time required for the processing of the substrate. | 10-03-2013 |
20130260570 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - In a substrate processing apparatus, with an internal space of a chamber brought into a pressurized atmosphere, an etching process is performed by continuously supplying a first processing liquid onto an upper surface of a substrate while rotating the substrate. | 10-03-2013 |
20130260546 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH FLASH OF LIGHT - After the completion of the transport of a semiconductor wafer into a chamber, the flow rate of nitrogen gas supplied into the chamber is decreased. In this state, a preheating treatment and flash irradiation are performed. The flow rate of nitrogen gas supplied into the chamber is increased when the temperature of the front surface of the semiconductor wafer is decreased to become equal to the temperature of the back surface thereof after reaching its maximum temperature by the irradiation of the substrate with a flash of light. Thereafter, the supply flow rate of nitrogen gas is maintained at a constant value until the semiconductor wafer is transported out of the chamber. This achieves the reduction in particles deposited on the semiconductor wafer while suppressing adverse effects resulting from the nonuniform in-plane temperature distribution of the semiconductor wafer. | 10-03-2013 |
20130259457 | HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH FLASH OF LIGHT - Three support members made of silicon carbide are provided fixedly on an inner periphery of the support ring. The support members are inclined at an angle in the range of 15 to 30 degrees with respect to a horizontal plane. With an outer peripheral edge of a semiconductor wafer supported by the three support members, a heating treatment is performed by irradiating the semiconductor wafer with halogen light from halogen lamps. Silicon carbide absorbs the halogen light better than quartz. The support members support the outer peripheral edge of the semiconductor wafer in point contacting relationship, so that the contact between a holder and the semiconductor wafer is minimized. This minimizes the disorder of the temperature distribution of the semiconductor wafer due to the support members to achieve the uniform heating of the semiconductor wafer. | 10-03-2013 |
20130258398 | PRINTING CONTROL APPARATUS, RECORDING MEDIUM HAVING RECORDED THEREON PRINTING CONTROL PROGRAM, AND PRINTING CONTROL METHOD - A preflight check unit in a printing control apparatus includes a sub-preflight check unit, an object page determination unit, a main preflight check unit, and a preflight result output unit. The sub-preflight check unit obtains resource use information and part use information. The object page determination unit determines object pages to be subjected to the preflight check, based on the resource use information and the part use information, and writes object page information indicating the object pages in a storage unit. The main preflight check unit reads the object page information from the storage unit to perform preflight check on the object pages indicated by the object page information. The preflight result output unit outputs a preflight result. | 10-03-2013 |
20130258378 | PRINTING CONTROL APPARATUS, PRINTING SYSTEM, RECORDING MEDIUM HAVING RECORDED THEREON PRINTING CONTROL PROGRAM, AND PRINTING CONTROL METHOD - A first RIP processing unit reads cache data from a first cache unit. The first RIP processing unit transmits first RIP-processed variable part data to a printer. Since an identifier read by the first RIP processing unit is not a transmitted identifier, the first RIP processing unit transmits RIP-processed reuse part data to the printer. A second RIP processing unit reads cache data from a second cache unit. The second RIP processing unit transmits second RIP-processed variable part data to the printer. Since an identifier read by the second RIP processing unit is a transmitted identifier, the second RIP processing unit does not transmit the RIP-processed reuse part data to the printer. | 10-03-2013 |
20130258076 | IMAGING APPARATUS AND IMAGING METHOD - A preliminary image is obtained by irradiating illumination light, whose light quantity distribution is set at a standard state, to a specimen obtained by injecting fluid into a well from an illuminator capable of arbitrarily setting the light quantity distribution, for example, by a liquid crystal shutter, and a luminance distribution of the preliminary image is detected. As a result, luminance nonuniformity in the preliminary image is canceled by performing imaging with a light quantity distribution of illumination light to be incident on the well set such that an incident light amount is larger in a part with lower luminance. | 10-03-2013 |
20130258021 | PRINTING APPARATUS - Each unit of an inkjet printing station includes chains arranged along a transportation path of a web paper. A holding mechanism is fixedly arranged on the chain. The holding mechanism holds both ends of a paper passing bar to which the web paper is attached. Driving the chain with a handle causes the holding mechanism to move. The paper passing bar is delivered between the units adjoining each other. Therefore, the paper passing bar is movable from one end to the other end of the inkjet printing station formed by the units. Moreover, when specifications are changed for changing combination of the units, the combination can be made optionally. | 10-03-2013 |
20130257963 | METHOD FOR CONTROLLING TRANSPORTATION OF PRINT MEDIUM IN INKJET PRINTING APPARATUS AND THE INKJET PRINTING APPARATUS - Web paper is transported by roll with two or more drive rollers. The two adjacent drive rollers each have difference in rotation speed in accordance with a draw ratio. Accordingly, tension is applied to the web paper. Tension of the web paper between the adjacent drive rollers is detected by a tension sensor. A tension controller controls the detected tension value so as to be a target tension value. A predictive control device predicts decrease in tension during an initial printing period where tension control is not stable, and increases rotation speeds of the drive rollers downstream of a print unit to suppress the decrease in tension. Consequently, tension acting on the web paper is appropriately controlled also during the initial printing period, resulting in possible reduction in printing quality. | 10-03-2013 |
20130257955 | THRESHOLD MATRIX GENERATION METHOD, IMAGE DATA GENERATION METHOD, IMAGE DATA GENERATION APPARATUS, IMAGE RECORDING APPARATUS, AND THRESHOLD MATRIX - A threshold matrix generation part determines a turn-on order in a matrix area where a threshold matrix is generated and determines a threshold value of each matrix element. In determining the turn-on order, a temporary evaluation value element is obtained based on a distance between each undetermined matrix element whose position in the turn-on order has not been determined and each determined matrix element. If these matrix elements are located in the same position with respect to a row or column direction, the temporary evaluation value element is corrected such that the undetermined matrix element is less evaluated based on the evaluation value. Then, the position of an undetermined matrix element that is most highly evaluated in the turn-on order is determined. Accordingly, a threshold matrix that suppresses the occurrence of a grid-like dot pattern can be provided. | 10-03-2013 |
20130257950 | IMAGE RECORDING APPARATUS AND IMAGE RECORDING METHOD - In an image recording apparatus, only small ink droplets are ejected toward a recording medium in the range of tone values less than a second tone value. In the range of tone values greater than or equal to the second tone value and less than a first tone value, large and small droplets are ejected toward the recording medium. The first tone value is less than or equal to a 50% tone value, and the total ejection rate at the first tone value is less than 50%. In the range of tone values greater than or equal to the first tone value, only large droplets are ejected toward the recording medium. Thus, the occurrence of streaking can be suppressed while reducing the degree of instability of the landing positions of fine droplets of ink. | 10-03-2013 |
20130256273 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - A substrate treatment apparatus includes: a chamber; a substrate being treated with a treatment liquid in the chamber; a temperature measuring unit which measures an internal air temperature of the chamber and/or a temperature of the treatment liquid; a temperature adjusting unit which changes the internal air temperature and/or the temperature of the treatment liquid; a storage unit which stores a map defining a relationship between the air temperature and the treatment liquid temperature so that a treatment liquid temperature level for a given air temperature level is lower than the given air temperature level; and a temperature controlling unit which sets a target value of the internal air temperature of the chamber or the temperature of the treatment liquid based on the map and a measurement value detected by the temperature measuring unit, and controls the temperature adjusting unit based on the target value. | 10-03-2013 |
20130256267 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A substrate processing method includes a water removing step of removing water from a substrate, a silylating step of supplying a silylating agent to the substrate after the water removing step, and an etching step of supplying an etching agent to the substrate after the silylating step. The substrate may have a surface on which a nitride film and an oxide film are exposed and in this case, the etching step may be a selective etching step of selectively etching the nitride film by the etching agent. The etching agent may be supplied in a form of a vapor having an etching component. | 10-03-2013 |
20130255882 | SUBSTRATE TREATING APPARATUS - A substrate treating apparatus includes a circulating line having a treating tank for storing a phosphoric acid aqueous solution, a circulating pump for feeding the phosphoric acid aqueous solution, a heater for circulation for heating the phosphoric acid aqueous solution, a filter for filtering the phosphoric acid aqueous solution, the circulating line causing the phosphoric acid aqueous solution discharged from the treating tank to flow in order of the circulating pump, the heater for circulation and the filter, and returning the phosphoric acid aqueous solution from the filter to the treating tank. The apparatus also includes a branch pipe branching from the circulating line between the heater for circulation and the filter for extracting the phosphoric acid aqueous solution from the circulating line, and a concentration measuring station connected to the branch pipe for measuring silicon concentration in the phosphoric acid aqueous solution by potentiometry. | 10-03-2013 |
20130255732 | SUBSTRATE TREATING APPARATUS - A substrate treating apparatus includes a loading section | 10-03-2013 |
20130255718 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A substrate processing method includes a rinsing step of supplying water of a first temperature to a surface of a silicon substrate to apply a rinsing process using the water to the silicon substrate surface, a second temperature water supplying (coating) step of supplying water of a second temperature lower than the first temperature to the silicon substrate surface after the rinsing step, and a drying step of rotating the silicon substrate after the second temperature water supplying step to spin off the water on the silicon substrate surface to a periphery of the silicon substrate and thereby dry the silicon substrate. | 10-03-2013 |
20130250341 | PRINT CONTROL APPARATUS, INKJET PRINTING APPARATUS, PRINT CONTROL METHOD, AND RECORDING MEDIUM - Compressed data transmitted to a print control apparatus includes break data having information on a compressed size and a decompressed size for each page. When the compressed data is transferred to a decompressing unit, the break data is converted to NOP data. Information on the decompressed size included in each break data is provided to a checking unit. During a period in which a decompression process is performed, a decompression flag is turned on. The checking unit obtains the actual decompressed size by counting a period in which the decompression flag is turned on, to check whether the decompression process has been normally performed. During a period in which the decompressing unit and the checking unit perform processes for a certain page, a reading unit reads compressed data for the next page. | 09-26-2013 |
20130248504 | HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - The temperature of a semiconductor wafer is raised by light irradiation heating performed by halogen lamps. An infrared ray emitted from the semiconductor wafer whose temperature has been raised transmits through an infrared-transparent window made of silicon, and then is detected by an infrared camera. The infrared camera two-dimensionally detects the temperature of an entire surface of the semiconductor wafer. Based on a result of the detection obtained by the infrared camera, a temperature drop region having a relatively low temperature among the region of the semiconductor wafer is irradiated with laser light emitted from a laser light emission part. Accordingly, without rotating the semiconductor wafer, a temperature distribution can be made uniform with a high accuracy throughout the entire surface of the semiconductor wafer. | 09-26-2013 |
20130242006 | LIQUID FEEDING DEVICE AND METHOD OF DETERMINING TIME OF EXCHANGE OF GAS CONTROL ELEMENT - Ink in an ink tank is fed through a dissolved gas control filter to a printer head. A gas pressure changing mechanism reduces pressure in a gas pressure control tank. In response, the dissolved gas control filter removes gas dissolved in the ink. The gas pressure control tank is placed under pressure corresponding to a sum of the pressure reduced by the gas pressure changing mechanism and the pressure of the gas having been removed from the liquid. A gas pressure measuring part measures the sum of these pressures as pressure in the gas pressure control tank. Then, a controller determines when time of exchange of the dissolved gas control filter has come based on the magnitude of a gradient of gas pressure variation in the gas pressure control tank. | 09-19-2013 |
20130233354 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD - A substrate treating apparatus for treating substrates by immersing the substrates in a treating solution includes the following elements. A treating tank for storing the treating solution; a lifter capable of supporting a plurality of substrates, and vertically movable between an upper withdrawn position above the treating tank and a treating position inside the treating tank; a treating solution supply device for supplying the treating solution to the treating tank; a dripping device for dripping a surfactant to a surface of the treating solution stored in the treating tank; and a control device for causing the treating solution supply device to supply the treating solution to the treating tank, causing the lifter to place the substrates in the treating position, and causing the dripping device to drip the surfactant when raising the lifter to the upper withdrawn position after treatment of the substrates with the treating solution. | 09-12-2013 |
20130224967 | HEAT TREATMENT APPARATUS HEATING SUBSTRATE BY IRRADIATION WITH LIGHT - A capacitor, a coil, a flash lamp, and a switching element such as an IGBT are connected in series. A controller outputs a pulse signal to the gate of the switching element. A waveform setter sets the waveform of the pulse signal, based on the contents of input from an input unit. With electrical charge accumulated in the capacitor, a pulse signal is output to the gate of the switching element so that the flash lamp emits light intermittently. A change in the waveform of the pulse signal applied to the switching element will change the waveform of current flowing through the flash lamp and, accordingly, the form of light emission, thereby resulting in a change in the temperature profile for a semiconductor wafer. | 08-29-2013 |
20130224956 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit. | 08-29-2013 |
20130222459 | DATA PROCESSING METHOD OF PRINTING APPARATUS AND THE PRINTING APPARATUS - Provided is a data processing method of a printing apparatus for printing a multi-color image on a printing medium by each of printing heads for at least two colors while transporting the printing medium relative to the printing heads in a paper-feed direction. The method includes a skew detecting step of detecting a degree of skew of the printing medium; a correction printing-data generating step of shifting print data from a printing unit for performing printing in a direction orthogonal to the paper-feed direction in accordance with the degree of skew to generate correction printing-data, the printing unit having a first printing head disposed upstream in the paper-feed direction and a second printing head spaced away from the first printing head downstream in the paper-feed direction; and a printing step of performing printing on the printing medium with the printing unit in accordance with the correction printing-data. | 08-29-2013 |
20130222004 | INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus inspects a photovoltaic cell panel in which the photo device is formed. The inspection apparatus includes: an irradiation part that irradiates the photovoltaic cell panel with pulsed light (pump light) emitted from a femtosecond laser; a detecting part that detects an electromagnetic wave pulse, which is generated from the photovoltaic cell panel according to the irradiation of the pump light; and a continuous light irradiation part that irradiates a portion, which is irradiated with the pump light in the photovoltaic cell panel, with continuous light. | 08-29-2013 |
20130215176 | INKJET PRINTER AND CORRECTION VALUE ACQUISITION METHOD - In an inkjet printer, a pattern for density correction that indicates a constant density image is printed on printing paper with a head having a plurality of outlet rows, and pattern image data that indicates the pattern is acquired. A target outlet that ejects ink toward a linear region having a missing part in the pattern is detected, and a reference outlet that is included in the same outlet row as the target outlet and located close to the target outlet is specified. A density correction value of the target outlet among density correction values that are acquired based on a density profile of the pattern is replaced with a representative value of a density correction value of the reference outlet. Through this, even if an ink ejection failure occurs in any of the outlets, appropriate density correction values can be obtained for a plurality of outlets. | 08-22-2013 |
20130206747 | HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH FLASH OF LIGHT - The front surface of a semiconductor wafer with a back surface supported by lift pins is irradiated with a flash of light from flash lamps, so that the semiconductor wafer is heated. A transparent restriction ring made of quartz is into abutment with or close to a peripheral portion of the front surface of the semiconductor wafer. In this state, the flash irradiation is performed. If the temperature of the front surface of the semiconductor wafer rises rapidly when the flash irradiation is performed, the restriction ring restrains the semiconductor wafer from jumping up from the lift pins. This prevents wafer cracking resulting from the jumping of the semiconductor wafer when the flash irradiation is performed. | 08-15-2013 |
20130206185 | Substrate Processing Apparatus - A substrate processing apparatus is composed of an indexer block, a first processing block and a second processing block that are provided in parallel with one another. The indexer block is provided with an indexer robot. The first processing block is provided with a plurality of back surface cleaning units and a first main robot. The second processing block is provided with a plurality of end surface cleaning units, a plurality of top surface cleaning units and a second main robot. | 08-15-2013 |
20130203269 | HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY IRRADIATION WITH FLASHES OF LIGHT, AND HEAT TREATMENT METHOD - A first flash heating is performed in which a lower flash lamp irradiates a back surface of a semiconductor wafer with flashes of light, so that heat conduction from the back surface to a surface of the semiconductor wafer raises the temperature of the surface from the room temperature to an intermediate temperature. Then, a second flash heating is performed in which an upper flash lamp irradiates the surface of the semiconductor wafer with flashes of light, to raise the temperature of the surface of the semiconductor wafer from the intermediate temperature to a target temperature. Since only the irradiation with flashes of light emitted from the lower flash lamp and the upper flash lamp is used to cause the semiconductor wafer having the room temperature to reach the target temperature, all heat treatments can be completed in an extremely short time of one second or less. | 08-08-2013 |
20130199578 | Substrate Treating Apparatus And Substrate Treating Method - A substrate processing apparatus and a substrate processing method are capable of restraining or preventing the generation of streaky particles on a substrate surface by excellent removal of a rinsing liquid therefrom. The substrate processing apparatus has a substrate inclining mechanism for inclining a substrate held by a substrate holding mechanism. After a rinsing liquid has been supplied onto a substrate to form a liquid mass, the substrate is inclined at a small angle by the substrate inclining mechanism. Then, the liquid mass is downwardly moved without being fragmented and then falls down without leaving minute droplets on the substrate top. Thereafter, the substrate is returned to a horizontal posture and then dried. | 08-08-2013 |
20130182941 | APPEARANCE INSPECTION APPARATUS AND METHOD - An appearance inspection apparatus comprises an inspection part for detecting a defect of a pattern on the basis of an image of a surface of a substrate on which the pattern is formed, which is captured by an imaging part. The inspection part comprises an image transfer part for transferring image data which is obtained by imaging a region to be inspected on the substrate and stored in an image storing memory by the imaging part to a plurality of image processing memories and a plurality of GPUs for taking image data corresponding to respective regions to be processed out of transferred image data which are transferred to the image processing memories by the image transfer part and performing an inspection process for defect detection on the image data. The inspection part further comprises an image processing control part for acquiring inspection tasks each prescribing inspection details from an inspection task holding part and controlling the plurality of GPUs in accordance with the inspection tasks, respectively, independently of the image transfer by the image transfer part. | 07-18-2013 |
20130180551 | Substrate Processing Apparatus - A substrate processing apparatus is composed of an indexer block, a first processing block and a second processing block that are provided in parallel with one another. The indexer block is provided with an indexer robot. The first processing block is provided with a plurality of back surface cleaning units and a first main robot. The second processing block is provided with a plurality of end surface cleaning units, a plurality of top surface cleaning units and a second main robot. | 07-18-2013 |
20130175241 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A solvent vapor containing a solvent material capable of dissolving hydrogen fluoride is supplied to a surface of a substrate, thereby covering the surface of the substrate with a liquid film containing solvent material. Thereafter an etching vapor containing a hydrogen fluoride is supplied to the surface of the substrate covered by the liquid film containing the solvent material, thereby etching the surface of the substrate. | 07-11-2013 |
20130167877 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - In a substrate processing apparatus, a liquid film of a supercooled liquid of pure water is formed on the upper surface of a substrate and then cooled with cooling gas into a frozen film. The temperature of the liquid film is lower than the freezing point of pure water, and thus the liquid film is in an easy-to-freeze state. Thus, the time required to freeze the liquid film can be shortened. Even if the temperature of the cooling gas is increased, the liquid film can be speedily frozen as compared with the case in which a liquid film is formed of pure water having a temperature higher than its freezing point. Thus, heat insulating facilities such as piping that supply cooling gas can be simplified. This results in a reduction of the cooling cost required to freeze the liquid film. | 07-04-2013 |
20130167876 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus ( | 07-04-2013 |
20130161287 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A preprocess step for supplying an inert gas into an enclosed space in which a substrate is disposed, while exhausting gas by sucking out of the enclosed space. And then, an etching step for supplying a process vapor into the enclosed space while exhausting gas out of the enclosed space at an rate lower than a rate in the preprocess step. And then a post-process step for supplying an inert gas into the enclosed space while exhausting gas by sucking out of the enclosed space at a rate higher than the rate in the etching step. | 06-27-2013 |
20130154061 | ANODIZING APPARATUS, AN ANODIZING SYSTEM HAVING THE SAME, AND A SEMICONDUCTOR WAFER - An anodizing apparatus for causing an anodizing reaction to substrates immersed in an electrolyte solution. The apparatus includes a storage tank for storing the electrolyte solution, a holder for holding a plurality of substrates in liquid-tight contact with circumferential surfaces of the substrates, a moving mechanism for moving the holder between a transfer position outside the storage tank and a treating position inside the storage tank, and a closing device disposed in the storage tank for cooperating with the holder to complete a liquid-tight closure of the circumferential surfaces of the substrates held by the holder. Chemical reaction treatment is carried out with the circumferential surfaces of the substrates placed in a liquid-tight state. After the chemical reaction treatment is completed, the closing device is made inoperative and the holder is moved away from the treating position to unload the substrates from the storage tank. | 06-20-2013 |
20130153793 | ELECTROMAGNETIC RADIATION GENERATING ELEMENT, ELECTROMAGNETIC RADIATION GENERATING DEVICE, AND METHOD OF GENERATING ELECTROMAGNETIC RADIATION - An electromagnetic radiation generating device is a device that generates electromagnetic wave pulses from a plane surface. The electromagnetic radiation generating device includes an electromagnetic radiation generating element, a light irradiating unit. The electromagnetic radiation generating element includes: a depletion layer forming body formed by stacking a p-type silicon layer and an n-type silicon layer in a planar pattern; a light receiving surface electrode formed on one surface of the depletion layer forming body, the light receiving surface electrode including a plurality of parallel electrode parts that are equally spaced while a forming distance is maintained between the parallel electrode parts, the forming distance corresponding to the wavelength of the electromagnetic wave pulses generated from the depletion layer forming body; and a rear surface electrode formed on the opposite surface of the depletion layer forming body. | 06-20-2013 |
20130148948 | HEAT TREATMENT APPARATUS AND METHOD FOR HEATING SUBSTRATE BY LIGHT-IRRADIATION - A light-emission output of a flash lamp for performing a light-irradiation heat treatment on a substrate in which impurities are implanted is increased up to a target value L | 06-13-2013 |
20130122704 | ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD - There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank. | 05-16-2013 |
20130111731 | ASSEMBLING APPARATUS AND METHOD, AND ASSEMBLING OPERATION PROGRAM - In an assembling apparatus according to the present invention, a control portion controls an operation of a working portion such that a first reference position, which corresponds to a first reference point of an assembling component defined in three-dimensional model data of the assembling component, and a second reference position, which corresponds to a second reference point of the assembling component defined in three-dimensional model data of an assembled component, are associated with each other. Therefore, it is possible to carry out an assembling operation properly and efficiently irrespective of a positional shift of the assembled component. | 05-09-2013 |
20130088540 | INKJET PRINTING APPARATUS - An inkjet printing apparatus for printing images on printing paper by discharging ink while moving inkjet heads and the printing paper relative to each other. The apparatus includes an inkjet head holder for holding the inkjet heads, a controller for operating a plurality of motors to move the inkjet head holder vertically at least between a printing position and an origin position, and a monitoring unit for monitoring, during a vertical movement caused by the controller, synchronous rotations of the plurality of motors, and corresponding directions of rotation of the plurality of motors. | 04-11-2013 |
20130083319 | SEMICONDUCTOR INSPECTION METHOD AND SEMICONDUCTOR INSPECTION APPARATUS - A semiconductor inspection apparatus ( | 04-04-2013 |
20130083105 | INKJET PRINTER AND IMAGE RECORDING METHOD - In an inkjet printer, an ejecting part for K color is previously selected as an ejecting part for outputting three values used for formation of a large dot, formation of a medium dot, and non-ejection (step S | 04-04-2013 |
20130083104 | INKJET PRINTER AND IMAGE RECORDING METHOD - In an inkjet printer, for forming a large dot on a recording paper in the course of image recording, a second ejection pulse ( | 04-04-2013 |
20130083099 | DEGASSING APPARATUS ON A LIQUID FEED LINE, AND AN INKJET PRINTING APPARATUS HAVING THE SAME - A degassing apparatus of a liquid feed line for removing gas present in a liquid before feeding the liquid includes a degassing module for receiving, and removing the gas present in, the liquid. The apparatus is constructed and operated for removing gas in deionized water in a semiconductor process or in ink used in printing. | 04-04-2013 |
20130076829 | INKJET PRINTING APPARATUS AND A PURGING METHOD THEREFOR - An inkjet printing apparatus carries out printing by moving an inkjet head and printing paper relative to each other. The inkjet head has a plurality of nozzles for discharging ink droplets. The apparatus includes a feed pipe connected to each nozzle of the inkjet head for feeding ink thereto, an ink feed control valve mounted on the feed pipe for controlling circulation of the ink, a cap for blocking the plurality of nozzles of the inkjet head, a decompression device for decompressing an inside of the cap, decompression piping for connecting the cap and the decompression device, a decompression control valve mounted on the decompression piping for controlling communication between the cap and the decompression device, and a controller. | 03-28-2013 |
20130076823 | NOZZLE SHADING METHOD, AND AN INKJET PRINTING APPARATUS USING SAME - An inkjet printing apparatus includes a plurality of nozzles for discharging ink, a CIS (Contact Image Sensor) type scanner for reading, as image data, charts for correction printed in the ink discharged from the nozzles, light emitters for emitting light to the charts for correction, a scanner controller for causing the scanner to scan the charts for correction with a plurality of read conditions, a correction table creator for creating nozzle shading correction tables based on the image data read, and a shading corrector for carrying out shading correction for the nozzles based on the correction tables. | 03-28-2013 |
20130076815 | INKJET PRINTER AND PRINTING METHOD - In a head ( | 03-28-2013 |
20130057886 | IMAGE INSPECTION APPARATUS, IMAGE RECORDING APPARATUS, AND IMAGE INSPECTION METHOD - In an image inspection apparatus, a first accumulation part acquires a reference accumulated value distribution by accumulating values of pixels in a reference image arranged in an image recording direction. A second accumulation part acquires an inspection accumulated value distribution by accumulating values of pixels in the inspection image arranged in the image recording direction. A sensitivity correction part performs sensitivity correction wherein a plurality of accumulated values other than a local peak in the inspection accumulated value distribution are corrected so as to relatively approach a plurality of corresponding accumulated values in the reference accumulated value distribution, based on a ratio between the inspection accumulated value distribution from which the local peak has been removed and the reference accumulated value distribution. A comparison part subtracts the reference accumulated value distribution from the inspection accumulated value distribution that has undergone the sensitivity correction to detect a defect. | 03-07-2013 |
20130057608 | PRINTER AND PRINTING METHOD - The present invention provides a printer and printing method that forms a lenticular lens or a transparent structure based on pseudo-embossment printing or the like on paper having penetrability, and an inkjet printer performs: with respect to a base material | 03-07-2013 |
20130054030 | OBJECT GRIPPING APPARATUS, OBJECT GRIPPING METHOD, AND OBJECT GRIPPING PROGRAM - In an object gripping apparatus according to the present invention, based on three-dimensional position and attitude of a gripping object and a gripping position that is preliminarily set for each gripping object, an operation of a grip part is controlled such that the grip part grips the gripping position on the gripping object. Thereby, an intended gripping position can be identified, and the object can be appropriately gripped. | 02-28-2013 |
20130047919 | PATTERN FORMING APPARATUS - A tip section of a discharge nozzle | 02-28-2013 |
20130043229 | HEAT TREATMENT APPARATUS AND METHOD FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - In light-irradiation heating with a total irradiation time of one second or less, two-stage irradiation is performed, including a first stage of light irradiation of a semiconductor wafer, which irradiation produces an output waveform that reaches a peak at a given emission output; and a second stage of supplemental light irradiation of the semiconductor wafer, which irradiation is started after the peak, producing an emission output smaller than the above given emission output. The emission output in the second stage is two thirds or less than the above given emission output at the peak. The first-stage light-irradiation time is between 0.1 and 10 milliseconds, and the second-stage light-irradiation time is 5 milliseconds or more. This allows the temperature of the semiconductor wafer even at a somewhat greater depth below the surface to be raised to some extent while allowing the surface temperature to be maintained at a generally constant processing temperature. | 02-21-2013 |
20120312333 | Substrate Treating Apparatus And Substrate Treating Method - A substrate processing apparatus and a substrate processing method are capable of restraining or preventing the generation of streaky particles on a substrate surface by excellent removal of a rinsing liquid therefrom. The substrate processing apparatus has a substrate inclining mechanism for inclining a substrate held by a substrate holding mechanism. After a rinsing liquid has been supplied onto a substrate to form a liquid mass, the substrate is inclined at a small angle by the substrate inclining mechanism. Then, the liquid mass is downwardly moved without being fragmented and then falls down without leaving minute droplets on the substrate top. Thereafter, the substrate is returned to a horizontal posture and then dried. | 12-13-2012 |
20120307313 | Threshold Matrix Generating Method, Image Data Generating Method, Image Data Generating Apparatus, Image Recording Apparatus And Recording Medium - In a matrix area, a plurality of linear areas each of which extends in a tilt direction tilted relatively to row and column directions are arranged in a direction perpendicular to the tilt direction without spaces, and the plurality of linear areas are alternatively assigned to first and second element groups along an arrangement direction. One element is specified in each element group, and subsequently a process of specifying an element farthest from the specified elements is repeated, to acquire a turn-on order of dots with increase in gray level in one grayscale range and a turn-off order of dots with decrease in gray level in the remaining grayscale range, and a threshold value of each element is determined according to these orders. Thus, generated is a threshold matrix capable of reducing graininess in a halftone image with directionality in the tilt direction, and improving the reproduction of thin lines and characters. | 12-06-2012 |
20120298152 | Substrate Processing Apparatus And Substrate Processing Method - A substrate processing apparatus comprises a substrate holding mechanism, a process liquid supplying mechanism supplying a process liquid, a first guide portion around the substrate holding mechanism having an upper edge portion extending toward the rotation axis for guiding scattered process to flow down, a second guide portion provided around the substrate holding mechanism outside the first guide portion and having an upper edge portion extending toward the rotation axis as vertically overlapping with the upper edge portion of the first guide portion for further guiding the scattered process liquid to flow down, a recovery channel provided outside and integrally with the first guide portion for recovering the process liquid guided by the second guide portion, and a driving mechanism for moving up and down the first guide portion and the second guide portion independently of each other. | 11-29-2012 |
20120261400 | HEAT TREATMENT APPARATUS AND METHOD FOR HEATING SUBSTRATE BY IRRADIATION THEREOF WITH LIGHT - A semiconductor wafer preheated to a preheating temperature is irradiated with light from flash lamps. With the light emission from the flash lamps, a surface temperature of the semiconductor wafer is maintained at a recovery temperature during a period of 10 to 100 milliseconds to induce recovery of defects created in silicon crystals. Then, with subsequent flashing light emission from the flash lamps, the surface temperature of the semiconductor wafer will reach a processing temperature to induce activation of impurities. Increasing the surface temperature of the semiconductor wafer once to the recovery temperature and then, with the flashing light emission, to the processing temperature will also prevent cracking of the semiconductor wafer. | 10-18-2012 |
20120143366 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR SUCCESSIVELY PROCESSING A PLURALITY OF SUBSTRATES - One of reverse passing parts provided in a substrate passing part comprises a first holding mechanism and a second holding mechanism. The first holding mechanism and the second holding mechanism are arranged in vertically symmetry with respect to a rotary central axis and rotate 180 degrees about the rotary central axis, to replace each other in position. A transport robot on the loading side passes a substrate to a third holding mechanism or a fourth holding mechanism at a first vertical position. The substrate reversed in the reverse passing part is passed to a transport robot on the unloading side from the third holding mechanism or the fourth holding mechanism at a second vertical position. Before a reverse process on the preceding substrate is finished, the transport robot on the loading side can start the transfer of the following substrate. | 06-07-2012 |
20120128336 | HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - A semiconductor wafer in which a carbon thin film is formed on a surface of a silicon substrate implanted with impurities is irradiated with flash light emitted from flash lamps. Absorbing the flash light causes the temperature of the carbon thin film to increase. The surface temperature of the silicon substrate implanted with impurities is therefore increased to be higher than that in a case where no thin film is formed, and the sheet resistance value can be thereby decreased. When the semiconductor wafer with the carbon thin film formed thereon is irradiated with flash light in high concentration oxygen atmosphere, since the carbon of the thin film is oxidized to be vaporized, removal of the thin film is performed concurrently with flash heating. | 05-24-2012 |
20120114316 | HEAT TREATMENT APPARATUS AND METHOD FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - In light-irradiation heating with a total irradiation time of one second or less, two-stage irradiation is performed, including a first stage of light irradiation of a semiconductor wafer, which irradiation produces an output waveform that reaches a peak at a given emission output; and a second stage of supplemental light irradiation of the semiconductor wafer, which irradiation is started after the peak, producing an emission output smaller than the above given emission output. The emission output in the second stage is two thirds or less than the above given emission output at the peak. The first-stage light-irradiation time is between 0.1 and 10 milliseconds, and the second-stage light-irradiation time is 5 milliseconds or more. | 05-10-2012 |
20120063751 | Heat Treatment Apparatus Emitting Flash of Light - Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking. | 03-15-2012 |
20120061374 | Heat Treatment Apparatus Emitting Flash of Light - Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking. | 03-15-2012 |
20120057855 | Heat Treatment Apparatus Emitting Flash of Light - Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking. | 03-08-2012 |
20120008926 | HEAT TREATMENT APPARATUS HEATING SUBSTRATE BY IRRADIATION WITH LIGHT - A capacitor, a coil, a flash lamp, and a switching element such as an IGBT are connected in series. A controller outputs a pulse signal to the gate of the switching element. A waveform setter sets the waveform of the pulse signal, based on the contents of input from an input unit. With electrical charge accumulated in the capacitor, a pulse signal is output to the gate of the switching element so that the flash lamp emits light intermittently. A change in the waveform of the pulse signal applied to the switching element will change the waveform of current flowing through the flash lamp and, accordingly, the form of light emission, thereby resulting in a change in the temperature profile for a semiconductor wafer. | 01-12-2012 |
20110279501 | INKJET PRINTER AND IMAGE RECORDING METHOD - In recording an image by an inkjet printer, when not forming a dot on a recording paper, non-ejection operation of droplet is performed in a head part by a non-ejection pulse (P | 11-17-2011 |
20110279500 | INKJET PRINTER AND IMAGE RECORDING METHOD - In a head part of inkjet printer, a leading droplet and a following droplet are ejected from an outlet by inputting one driving signal, and the leading droplet and the following droplet land onto a recording paper. At this time, a waveform of the driving signal is set such that an average of distance from the center of a main dot element formed by the leading droplet to the farthest point in a group of dot elements formed by the leading droplet and the following droplet is equal to or more than 1.1 times an average of radius of the main dot element and equal to or less than 3.0 times the average. Therefore, the dot shape can be made noncircular, and as the result, it is possible to suppress jaggies on edges of an image on the recording paper and lowering of density in a solid area. | 11-17-2011 |
20110222126 | INKJET PRINTER AND INKJET PRINTING METHOD - An ejection part ( | 09-15-2011 |
20110174336 | SUBSTRATE PROCESSING APPARATUS - In a solution change processing which comprises: changing a processing solution stored in a processing bath, specifically deionized water for sulfuric acid; and controlling the temperature of sulfuric acid so changed to a predetermined temperature, first, deionized water is discharged from a processing bath and an external bath. Subsequently, sulfuric acid is supplied from a supplying nozzle to the external bath. Subsequently, an upper circulating process is started by opening and closing a predetermined valve, while allowing a pump and a temperature controller be operated. At the time the temperature of a processing solution is higher than a predetermined value, an inside circulating process is carried out by opening and closing a predetermined valve, while having the pump and the temperature controller keep operating. | 07-21-2011 |
20100328376 | IMAGE RECORDING DEVICE - An image recording device for recording an image by an interlace system of scanning a specified region repeatedly with use of an ink-jet head having a configuration of a plurality of nozzle heads arranged in a sub-scanning direction, the nozzle head including multiple ink discharged discharge nozzles arranged in the sub-scanning direction. | 12-30-2010 |
20100150426 | APPARATUS AND METHOD FOR INSPECTING PATTERN - An operation part in a pattern inspection apparatus includes a defect candidate image generator for generating a binary defect candidate image representing a defect candidate area in an inspection image by comparing the inspection image with a reference image, in an inspection image masking part the inspection image is masked with the defect candidate image to obtain a masked inspection image. In a feature value calculation part, an autocorrelation feature value is obtained from the masked inspection image, and outputted to a classifying part. The classifying part comprises a classifier outputting a classification result on the basis of the autocorrelation feature value and a classifier construction part for constructing the classifier by learning. It is thereby possible to easily perform the high accurate classification of defect candidate using the autocorrelation feature value which is hard to characterize as compared with geometric feature value or feature value representing density. | 06-17-2010 |
20100126532 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A processing solution supply nozzle is moved relatively from one end to the opposite end of a semiconductor wafer having undergone a developing operation while discharging an anti-static processing solution in a discharge width equal to or greater than the width of the semiconductor wafer. The anti-static processing solution is thereby supplied onto the semiconductor wafer. The prevention of charging of the substrate avoids the occurrence of defects. The processing solution supplied almost uniformly on the entire surface of the substrate also avoids the occurrence of defects. | 05-27-2010 |
20090019722 | Apparatus and method for removing organic contamination adsorbed onto substrate, and apparatus and method for measuring thickness of thin film formed on substrate - In a body of a film-thickness measuring apparatus ( | 01-22-2009 |
20090015625 | Printing Apparatus And Cleaning Mechanism Thereof - The present invention relates to a printing apparatus and a cleaning mechanism thereof. | 01-15-2009 |
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