CAMTEK LTD. Patent applications |
Patent application number | Title | Published |
20150359094 | SURFACE PRETREATMENT AND DROP SPREADING CONTROL ON MULTI COMPONENT SURFACES - Methods, systems and produced printed substrates are provided, which include substrates composed of one or more materials which are treated by an intermediate layer for normalizing surface energies and a digitally printed formulation adapted to the normalized surface energies. Surface energy normalization may be carried out by physical processes or by selective chemical processes. In an example, a self-assembled monolayer is applied to the surface of a printed circuit board to control ink jet dots by reducing copper surface energy and to improve ink adhesion. The self-assembled monolayer binds via an α group selectively and covalently to the copper on the board and binds via a hydrophobic co group to solder mask ink that is applied to the board. The co group participates in the solidification process of the ink. | 12-10-2015 |
20140362208 | HIGH THROUGHPUT AND LOW COST HEIGHT TRIANGULATION SYSTEM AND METHOD - A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object. | 12-11-2014 |
20140327906 | SYSTEM AND METHOD FOR MAINTAINING OPTICS IN FOCUS - According to an embodiment of the invention there is provided a system that may include a pivot chuck that may include : a lower chuck portion; an upper chuck portion; a first distance changing module that may include a pivot mechanism and an angle changing element; wherein the pivot mechanism pivotally couples the lower chuck portion to the upper chuck portion; wherein the angle changing element is coupled between the upper and lower chuck portions; wherein the upper chuck portion may be arranged to support a substrate; wherein the angle changing element may be arranged to induce a rotation of the upper chuck portion in relation to the pivot mechanism in response to first focus correction signals. | 11-06-2014 |
20140055544 | CURABLE INK AND A METHOD FOR PRINTING AND CURING THE CURABLE INK - A method for printing a curable ink, the curable ink comprises a mixture of reactive monomers and oligomers; at least one pigment; at least one photo initiator; and at least a resin out of phenolic resin, amino resin and epoxy resin. | 02-27-2014 |
20130180843 | DIRECTED MULTI-DEFLECTED ION BEAM MILLING OF A WORK PIECE AND DETERMINING AND CONTROLLING EXTENT THEREOF - Method, device, and system, for directed multi-deflected ion beam milling of a work piece, and, determining and controlling extent thereof. Providing an ion beam; and directing and at least twice deflecting the provided ion beam, for forming a directed multi-deflected ion beam, wherein the directed multi-deflected ion beam is directed towards, incident and impinges upon, and mills, a surface of the work piece. Device includes an ion beam source assembly; and an ion beam directing and multi-deflecting assembly, for directing and at least twice deflecting the provided ion beam, for forming a directed multi-deflected ion beam, wherein the directed multi-deflected ion beam is directed towards, incident and impinges upon, and mills, a surface of the work piece. | 07-18-2013 |
20130177698 | SYSTEM AND A METHOD FOR SOLDER MASK INSPECTION - A system and a method for inspection aided printing, the method may include printing, by a printing unit of a system, a pattern on an area of a substrate, during a printing process; inspecting, by an inspection unit of the system, the area to provide inspection results; searching, by a processor of the system, for a defect, based upon the inspection results; and wherein if a defect is found—determining whether to (a) repair the substrate, (b) perform a corrective measure for improving the printing process, or (c) perform no corrective measure in response to the defect. | 07-11-2013 |
20130171351 | VACUUM TABLE FOR A PRINTING DEVICE - A system that may include a printing module arranged to print patterns on a substrate by inkjetting ink on the substrate; and a substrate supporting module that comprises: a porous material module for supporting the substrate and providing vacuum to multiple locations of the substrate when the substrate is placed on a flat upper surface of the porous material module; and an interface module that comprises: at least one inlet for receiving vacuum from a vacuum system; at least one outlet for providing the vacuum to the porous material module; and at least one structural element arranged to contact the porous material module and provide mechanical support to the porous material module. | 07-04-2013 |
20130170712 | METHOD AND SYSTEM FOR MEASURING BUMPS BASED ON PHASE AND AMPLITUDE INFORMATION - A device for measuring a height of a microscopic structure, the device may include: a storage circuit arranged to store information that comprises amplitude information and phase information, wherein the information is indicative of a shape and a size of the microscopic structure; a mask generation circuit arranged to threshold pixels of the amplitude information to provide a mask that comprises masked amplitude pixels; a phase information circuit arranged to apply the mask on the phase information to provide masked phase pixels; select, out of the masked phase pixels, selected phase pixels that correspond to a phase criterion, the selected phase pixels have selected phase pixels attribute values; find, out of the phase information, elected phase pixels that have the selected phase pixel attribute values; and a height calculation circuit arranged to generate a height measurement result based the elected phase pixels. | 07-04-2013 |
20130115030 | WAFER INSPECTION SYSTEM AND A METHOD FOR TRANSLATING WAFERS - A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck. | 05-09-2013 |
20130050468 | INSPECTION SYSTEM AND A METHOD FOR INSPECTING MULTIPLE WAFERS - A method and an inspection system that includes: a multi wafer support device arranged to concurrently support multiple wafers; optics arranged to acquire images of the multiple wafers supported by the multi wafer support element; | 02-28-2013 |
20130044208 | SYSTEM AND A METHOD FOR INSEPCTING AN OBJECT USING A HYBRID SENSOR - A method and an inspection system may be provided. The inspection system may include (a) a hybrid sensor that may include a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands; (b) a storage element arranged to store the monochromatic image and the multiple-color image; and (c) a defect detection module arranged to detect defects by processing at least one of the monochromatic image and the multiple-color image. | 02-21-2013 |
20120274946 | METHOD AND SYSTEM FOR EVALUATING A HEIGHT OF STRUCTURES - A method and system for interference based detection of height (H) of a microscopic structure. Wherein N*(Ws/2)>H>(N−1)*(Ws/2); wherein N is a positive integer, w | 11-01-2012 |
20120244273 | SYSTEM AND A METHOD FOR SOLDER MASK INSPECTION - A system and a method for method for printing a solder mask on a printed circuit board (PCB), the method includes: acquiring images of multiple areas of a PCB by an inspection unit while the PCB is supported by a mechanical stage; determining spatial differences between a model of the PCB and the PCB based on the images; determining solder mask ink deposition locations based on (i) the spatial differences, and (ii) locations of the model of the PCB that should be coated with the solder mask ink; and printing solder mask ink on the solder mask deposition locations by a printing unit, while the PCB is supported by the mechanical stage. | 09-27-2012 |
20120196039 | METHOD FOR ENHANCING METALLIZATION IN SELECTIVE DEPOSITION PROCESSES - A method for achieving a clean substrate, the method may include depositing a protective material on an area of a substrate, to prevent the area from being contaminated by a coating material that is to be deposited during a deposition process; and removing the protective material from the area after the coating material was cured. | 08-02-2012 |
20120194622 | ULTRA VIOLET LIGHT EMITTING DIODE CURING OF UV REACTIVE INK - A method for printing a pattern on a electrical circuit, the method includes jetting on the electrical circuit an ultraviolet curable ink to form a pattern; and at least partially curing the ultraviolet curable ink by exposing the pattern to ultraviolet radiation generated from at least one ultraviolet light emitting diode (LED). | 08-02-2012 |
20120177814 | METHOD FOR IMPROVING COATING - A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating material to be applied on an electrical circuit that comprises at least one three dimensional structure to be coated by the coating material; wherein the multiple iteration printing scheme is responsive to a shape and size of the at least one three dimensional structure; and performing multiple printing iterations of the coating material, according to the multiple iteration printing scheme; wherein at least one printing iteration is followed by at least partially curing the coating material printed during the at least one printing iteration. | 07-12-2012 |
20120171356 | SYSTEM FOR DIGITAL DEPOSITION OF PAD / INTERCONNECTS COATINGS - A method and a system for printing patterns on an object, is provided. The system may include a copper protective coating printing unit arranged to print copper protective coating ink on the object to provide at least one copper protective coating ink pattern. The system may include zero or more additional printing units selected out of a solder mask printing unit arranged to print solder mask ink on the object to provide at least one solder mask pattern and a notation mark printing unit arranged to print notation mark ink on the object to provide at least one notation mark pattern. The system also includes at least one curing unit arranged to cure each ink printed by each printing unit. | 07-05-2012 |
20120162298 | MULTIPLE ITERATION SUBSTRATE PRINTING - A system and a method for printing a desired pattern on a substrate, the method may include: receiving or generating printing instructions for printing multiple patterns during multiple printing iterations, wherein at least two different printing iterations are expected to be executed by different sets of nozzles of an array of nozzles, wherein a superposition of the multiple patterns is expected to differ from the desired pattern by a tolerable difference even when a nozzle of the array of nozzles malfunctions; and printing the multiple patterns during multiple during multiple printing iterations, wherein at least two different printing iterations are expected to be executed by different sets of nozzles of the array of nozzles. | 06-28-2012 |
20120105869 | THREE DIMENSIONAL INSPECTION AND METROLOGY BASED ON SHORT PULSES OF LIGHT - A system and a method may be provided. The system may include an illumination module arranged to illuminate an object by short pulses of light that form at least one spot on the object; a collection module that comprises a sensor that is arranged to generate detection signals representative of three dimensional information about the object: and a mechanical stage that is arranged to introduce a movement between the object and at least one of the collection module and the illumination module. | 05-03-2012 |
20120103938 | METHOD AND SYSTEM FOR MILLING AND IMAGING AN OBJECT - A system and a method for milling and inspecting an object. The method may include performing at least one iteration of a sequence that includes: milling, by a particle beam, a first surface of the object, during a first surface milling period; obtaining, by an electron detector, an image of a second surface of the object during at least a majority of the first surface milling period; wherein the object is expected to comprise an element of interest (EOI) that is positioned between the first and second surfaces; milling, by the particle beam, the second surface of the object during a second surface milling period; wherein each of the first surface milling period and the second surface milling period has a duration that exceeds a long duration threshold; obtaining by the electron detector an image of the first surface of the object during at least a majority of the second surface milling period. | 05-03-2012 |
20120087774 | Diced Wafer Adaptor and a Method for Transferring a Diced Wafer - A diced wafer adaptor that includes: a cylindrical shaped inner portion, adapted to support and hold an annular frame and a membrane suspended within the annular frame and to apply vacuum to an outer portion of the membrane; wherein an inner portion of the membrane supports a diced wafer and is surrounded by the outer portion of the membrane; and an outer portion having a perimeter shaped substantially as a perimeter of a non-diced wafer. | 04-12-2012 |
20120080406 | METHOD AND SYSTEM FOR PREPARING A LAMELA - A system and a method for preparing a lamella. The method may include aligning, by the manipulator, a mask and a sample. Positioning the mask and the sample in front of an ion miller while unchanging the spatial relationship between the mask and the sample. Milling a first exposed portion of the sample until exposing a first sidewall of the lamella. Positioning the mask and the sample in front of the ion miller so that the mask masks a second masked portion of the sample. Milling, by the ion miller, the second exposed portion of the sample until exposing a second sidewall of the lamella. Removing, by the miller, matter from both sides of the lamella; and detaching the lamella from the sample. | 04-05-2012 |
20120057773 | INSPECTION RECIPE GENERATION AND INSPECTION BASED ON AN INSPECTION RECIPE - System, computer readable medium and method. The system includes (i) a data obtaining module arranged to obtain data about at least one portion of an inspected article; and (ii) a processor arranged to perform at least one processing operation of the data out of: (a) processing the data to provide the inspection recipe; and (b) processing the data, while utilizing the inspection recipe, to detect defects; wherein the inspection recipe comprises multiple zones of multiple types of zones; wherein a zone of a first type of zones differs from a zone of a second type of zone. | 03-08-2012 |
20120038921 | METHOD AND SYSTEM FOR INSPECTING BEVELED OBJECTS - An inspection system and a method. The method may include: illuminating the object with impinging light of a first polarization; performing a polarization based filtering of (a) multiple-reflected light signals, each multiple-reflected light signal being reflected from at least two different bevel side surfaces of the object, and (b) additional light signals, each additional light signal being reflected from a single element of the object, such as to suppress the multiple-reflected light signals, and to provide polarization based filtered light signals; and detecting the polarization based filtered light signals. | 02-16-2012 |
20120006786 | METHOD AND SYSTEM FOR PREPARING A SAMPLE - A system and method for a sample, the method may include manipulating a mask and a sample and thereby exposing different sides of the sample to an ion miller. The manipulating may include rotating the mask and the sample while maintaining the spatial relationship between the sample and the mask unchanged. | 01-12-2012 |
20110199764 | DEVICE AND METHOD FOR CONTROLLING AN ANGULAR COVERAGE OF A LIGHT BEAM - A system and method for controlling an angular coverage of a light beam. The method includes: defining a non-uniform angular coverage of a first light beam; altering a first spatial relationship between a first movable transmissive deflector and a first light source in response to the definition; directing a first light beam from the first light source through the first movable transmissive deflector such as to provide a first deflected light beam; and focusing the first deflected beam, by a first optical focusing element, to provide a first focused light bean that is focused onto a first area that is characterized by a location that is substantially indifferent to changes in the first spatial relationship. | 08-18-2011 |
20110199480 | OPTICAL INSPECTION SYSTEM USING MULTI-FACET IMAGING - An optical inspection system, the system includes: (i) an image sensor; and (ii) a single optical element, that at least partially surrounds an edge of an inspected object; wherein the optical element is adapted to direct light from different areas of the edge of the inspected object towards the image sensor so that the image sensor concurrently obtains images of the different areas. | 08-18-2011 |
20110184694 | DEPTH MEASUREMENTS OF NARROW HOLES - A method for measuring a depth of a narrow hole, the method includes: obtaining from a chromatic confocal sensor a group of height measurements taken along an imaginary line that crosses the narrow hole; ignoring height measurements attributed to optical artifacts and blind measurement points and calculating an inverted parabolic estimate of a sub-group of the height measurements; wherein a top of the parabolic estimate is representative of a height of a bottom of the narrow hole. | 07-28-2011 |
20110164806 | METHOD AND SYSTEM FOR LOW COST INSPECTION - A method for macro inspection, the method includes: (i) concurrently illuminating a current group of spaced apart object sub areas; wherein light reflected in a specular manner from a certain object sub area of the current group of object sub areas is expected to be detected by a certain sensor element of a current group of spaced apart sensor elements that correspond to the current group of spaced apart object sub areas; wherein the object sub areas are spaced apart so as to reduce a probability of a detection of non-specular light from the object; wherein each image sub area comprises multiple pixels; (ii) obtaining image information from the current group of spaced apart sensor elements; and (iii) processing at least a portion of the image information to provide an inspection result. | 07-07-2011 |
20110164129 | METHOD AND A SYSTEM FOR CREATING A REFERENCE IMAGE USING UNKNOWN QUALITY PATTERNS - A method and a system for preparing a pattern's reference-model to be used for automatic inspection of surface are disclosed. The system according to the present invention is comprised of an imaging device that captured images of plurality of the patters; a dedicated software that uses dedicated algorithms to correct and align the captured images; and a controller operative for collecting the same located and same coincident pixel of each of the images; choosing, according to predetermined criteria, one of the collected pixels; creating a new image with same dimensions as the captured images and locating the chosen pixel in the same place corresponding to the place of the collected pixels in the origin images; repeating the process as defined above for each pixel of the captured images; and providing the new created image as a reference model for inspecting the pattern. | 07-07-2011 |
20110154764 | COMPOSITE STRUCTURE FOR EXTERIOR INSULATION APPLICATIONS - A composite structure comprising an extruded polystyrene layer, a mortar layer and a primer layer, wherein at least one surface of the extruded polystyrene layer is planed, and the mortar layer is made from a mortar composition comprising re-dispersible powder, cellulose ether, one or more viscosity modification agents, one or more hydraulic binders, and one or more aggregates. A method of making such a composite structure. | 06-30-2011 |
20110115903 | INSPECTION SYSTEM AND METHOD FOR HIGH SPEED IMAGING - A method and an inspection system, the inspection system includes a camera comprising multiple pixels having a pixel width; a mechanical stage, for introducing a movement between an inspected object and optics of the inspection system; wherein the inspected object is expected to move a distance that substantially equals the pixel width during a pixel movement period; an illumination module and optics for illuminating inspected portions of the inspected object and for directing light from the inspected portions to the camera; and wherein the camera is arranged to acquire multiple acquired images of the inspected portions during each pixel movement period, wherein at least two acquired images partially overlap. | 05-19-2011 |
20110102771 | SYSTEMS AND METHODS FOR NEAR INFRA-RED OPTICAL INSPECTION - An inspection system and a method for defect detection, the method includes: generating a first beam that comprises a near infrared spectral component and a visible light component; directing at least the near infrared spectral component of the first beam towards an inspected object; directing, towards a sensor, a near infrared spectral component of a second beam generated from the illuminating of the inspected object; wherein the sensor is sensitive to visual light radiation and to near infrared radiation; generating, by the sensor, detection signals that are responsive to the near infrared component of the second beam; and detecting defects in the inspected object by processing the detection signals. | 05-05-2011 |
20110102574 | SYSTEMS AND METHODS FOR IMAGING MULTIPLE SIDES OF OBJECTS - A system for acquiring multiple images of objects, the system includes: a lateral transferor that comprises multiple lateral transferor portions adapted to transfer the objects to a lateral imaging area in a lateral manner; wherein each lateral transferor portion comprises a object receiver and a transfer element; wherein the transfer element moves the object receiver towards an imaging area unless encountering a resistance that is above a predefined resistance; and an imager that is configured to obtain images of two opposite sides of the object when the objects are positioned at the lateral imaging area. | 05-05-2011 |
20110094945 | SYSTEMS AND METHOD FOR IMAGING MULTIPLE SIDES OF OBJECTS - A system for acquiring multiple images of objects, the system includes: four longitudinal transferor that comprise multiple tunnels through which the objects propagate to four imaging areas; wherein the four longitudinal transferor utilize gas pressure differentials to convey the electrical circuits through the tunnels; wherein at least one longitudinal transferor has a movable portion that when placed in a certain position exposes at least a substantial portion of at least one tunnel; three rotation modules configured to rotate objects about a longitudinal axis of the objects; wherein each rotating is located between two longitudinal transferor; and imager, configured to obtain, in each of the four imaging areas, an image of the objects. | 04-28-2011 |
20110032534 | SYSTEM AND A METHOD FOR BROADBAND INTERFEROMETRY - A method and a system for determining a depth of a space, the system includes: a scanner for scanning, by a single broadband light beam, the structural element and the area of the surface of the object, wherein the area at least partially surrounds the structural element; a sensor for detecting interference patterns generated when the single broadband light beam concurrently illuminates a portion of the area and at least a portion of the structural element; and an analyzer for analyzing the interference patterns to determine the height difference between the area and the structural element. | 02-10-2011 |
20110029121 | METHOD AND SYSTEM FOR CONTROLLING A MANUFACTURING PROCESS - A method, system and computer program product for controlling a manufacturing process of an electronic circuit, the method includes: calculating at least one layer misalignment between layers of an electrical circuit that are expected to be mutually aligned; wherein the layers are manufactured by at least a direct imaging device that exposes a photo-resistive material to radiation to provide a pattern; selecting, in response to the at least one layer misalignment and in response to at least one allowable misalignment threshold, a selected response out of: manufacturing at least one additional layer of the electrical circuit; and stopping the manufacturing process of the electrical circuit; and participating in executing the selected response. | 02-03-2011 |
20100245566 | SYSTEM AND METHOD FOR INSPECTION - Method and inspection system. The inspection system includes: (i) a stage, for supporting an inspected object and for moving the inspected object by a movement that is characterized by speed variations; (ii) a signal generator, for generating triggering pulses at a fixed frequency regardless of the speed variations; (iii) a stage location generator, for providing location information indicative of a location of the stage at points of time that are determined by the triggering pulses; (iv) a strobe illuminator for illuminating areas of the inspected object in response to the triggering pulses; (v) a camera for acquiring images of areas of the inspected object in response to the triggering pulses; wherein overlaps between the images of the areas of the inspected object are characterized by overlap variations; and (vi) a processor for associating location information to the acquired images. | 09-30-2010 |
20100117279 | SUPPORTING SYSTEM AND A METHOD FOR SUPPORTING AN OBJECT - A supporting system, the system includes a vertically movable chuck and a stationary chuck; wherein the vertically movable chuck and the stationary chuck are concentric; wherein the vertically movable chuck vertically moves between an upper position and a lower position; wherein when the vertically movable chuck is positioned at the upper position an upper surface of the vertically movable chuck is higher than an upper surface of the stationary chuck and when the vertically movable chuck is positioned at the lower position the upper surface of the vertically movable chuck is lower than the upper surface of the stationary chuck. | 05-13-2010 |
20090116726 | Method and system for inspecting a diced wafer - A method for inspecting a diced object that comprises multiple dies, the method includes: acquiring multiple images of multiple portions of the diced object, starting from a first portion that comprises an alignment area and continuing through adjacent portions of the diced object; assigning a die index to each die of the multiple dies of the diced object, starting from a die of the first portion and continuing through adjacent portions of the diced object; associating between dies of the diced object and a dies of a reference object in response to the assigned indexes and locations of the dies of the diced object; wherein the reference object is not diced; and comparing between a die of the diced object and another die while taking into account an association between the die of the diced object and a reference object die. | 05-07-2009 |
20090110260 | Inspection System and a Method for Detecting Defects Based Upon a Reference Frame - A method for inspecting objects and an inspection system, the system includes: an image acquisition unit adapted to acquire multiple images, according to a predefined image acquisition scheme, of multiple portions of a diced wafer that comprises multiple dice; and a processor adapted to locate multiple unique features within the multiple images, at least partially during the acquisition of images; associate multiple unique features with multiple dice, at least partially during the location of multiple unique features; determine multiple transformations between multiple die coordinate systems and a global coordinate system, in response to a locations of unique features and their associations with multiple dice, at least partially during an association between multiple unique features with multiple dice; and detect defects in response to a comparison between dice and corresponding reference dice, in response to the transformations, at least partially during the determination of the multiple transformations. | 04-30-2009 |
20080281548 | Method and System for Automatic Defect Detection of Articles in Visual Inspection Machines - There is provided a method for establishing a parameters setup for inspecting a plurality of articles by an automatic inspection system. The method includes inspecting a first article by the inspection system, applying an automatic defects detection method according to a given set of inspection parameters, receiving an initial map of defects and sorting uncovered defects into defect types according to a predetermined set of defect types. While sorting defects, if new defects not recognized by the inspection system are detected, adding the new defects to the initial map to be sorted and automatically setting the inspection parameters by means of applying computational dedicated algorithms, using a heuristic approach, to form a modified parameters setup. The modified parameters setup is then used for obtaining a modified map of detected defects, and the modified parameters setup for inspecting other of the plurality of articles. A system for establishing a parameters setup for inspecting a plurality of articles is also provided. | 11-13-2008 |