| Besi Switzerland AG Patent applications |
| Patent application number | Title | Published |
|---|
| 20140311652 | Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate - A method for mounting components on a substrate includes receiving a component with a suction member which is mounted on a bonding head, displacing the bonding head relative to the substrate by means of a first movement axis and a second movement axis in order to position the component in a target position above the substrate, lowering the suction member by means of a third movement axis until the component touches the substrate, producing a predetermined bonding force with which the suction member presses the component against the substrate, and displacing at least one of the bonding head and the substrate by means of at least one of the first movement axis by a corrective value W | 10-23-2014 |
| 20140305372 | Device For Dispensing Adhesive On A Substrate - A device for dispensing adhesive on a substrate comprises a writing head with a first dispensing nozzle and at least one second dispensing nozzle. The device can be operated in two operating modes and is configured to perform the following steps for the change from the one operating mode to the other operating mode:
| 10-16-2014 |
| 20140202636 | Bonding Head With A Heatable And Coolable Suction Member - A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium. | 07-24-2014 |
| 20140196853 | Method For Detaching A Semiconductor Chip From A Foil - The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step:
| 07-17-2014 |
| 20140175159 | Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A Substrate - A thermocompression bonding method for mounting semiconductor chips on a substrate comprises:
| 06-26-2014 |
| 20140030052 | Kinematic Holding System For A Placement Head Of A Placement Apparatus - A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated. | 01-30-2014 |
| 20130255889 | Method For Detaching A Semiconductor Chip From A Foil - A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises:
| 10-03-2013 |
