Asano Laboratories Co., Ltd. Patent applications |
Patent application number | Title | Published |
20130174970 | FORMING APPARATUS AND FORMING METHOD - A forming apparatus includes a base material jig provided on a base, adhesion means for making a sheet having an adhesion layer and covered to a base material retained on the base material jig adhere to the base material, and trimming means for performing trimming on the sheet with respect to the base material with the sheet adhered thereto, in a state in which the base material is not removed from the base material jig. | 07-11-2013 |
20120211928 | THERMOFORMING DEVICE AND THERMOFORMING METHOD USING HOT PLATE HEATING - A thermoforming device using a hot plate heating includes a frame a hot plate; a decompression unit connected to the frame; a decompression unit which is connected to a hot plate; a unit which is connected to the hot plate and opens a heating surface side to an atmosphere or pressures the heating surface side; an adsorption and heating control unit which performs the adsorption and heating operation of the sheet by the hot plate; a decompression control unit which performs a decompression operation in the concave portion; and a molding operation control unit which concurrently performs the adsorption and heating operation and the decompression operation, stops the adsorption and heating operation of the sheet after a predetermined time from the start of the operation, and opens a portion between the hot plate and the sheet to the atmosphere or pressures the portion. | 08-23-2012 |
20090304960 | METHOD OF CUTTING MULTILAYER BODY, METHOD OF FORMING MULTILAYER CONTAINER, AND MULTILAYER FORMED PRODUCT - An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure includes the steps of: compressing and deforming the multilayer structure, while extending respective layers of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer and surface resin layers of the multilayer structure to the abutting portion A of the push cutter and the cutter receiving portion. | 12-10-2009 |