Aptina Imaging Corporation Patent applications |
Patent application number | Title | Published |
20150146077 | IMAGING SYSTEMS WITH IMAGE PIXELS HAVING ADJUSTABLE SPECTRAL RESPONSES - An imaging system may include an image sensor having an array of image pixels. Some image pixels in the array may be provided with spectral response adjustment structures. For example, a plurality of broadband pixels in the array may include spectral response adjustment structures. The spectral response adjustment structures may be configured to narrow the spectral response of the broadband pixels in high light conditions. For example, the spectral response of the broadband pixels may transition from clear to gray, from clear to green, or from yellow to green as the light level increases. The spectral response adjustment structures may, for example, be formed from photochromic materials or electrochromic elements. Processing circuitry in the imaging system may generate a color correction matrix for an image based at least partly on the state of the spectral response adjustment structures. | 05-28-2015 |
20150146055 | IMAGING PIXELS WITH IMPROVED ANALOG-TO-DIGITAL CIRCUITRY - Imagers may include analog-to-digital converter circuitry that produces a digital output code from an analog input voltage. The analog-to-digital converter circuitry may include a series of capacitors including a first set of binary-mapped capacitors. The analog-to-digital converter circuitry may include a second set of one or more capacitors that have capacitances that are less than binary-mapped capacitance values. The digital output code may include bits having respective bit positions within the digital output code. During successive-approximation operations performed by the analog-to-digital converter circuitry, each bit of the digital output code may be produced using a corresponding capacitor. Digital processing circuitry such as an image processor may produce a digital value from the digital output code by multiplying the bits of the digital output code with respective weights determined based on the capacitance of the corresponding capacitors. | 05-28-2015 |
20150146054 | IMAGE SENSORS WITH COLOR FILTER ELEMENTS OF DIFFERENT SIZES - An image sensor may be provided with an array of imaging pixels. A color filter array may be formed over photosensitive elements in the pixel array. The color filter array may include color filter elements of different sizes. The color filter array may include color filter elements of at least three different sizes. The color filter array may include color filter elements of only two different sizes. Each color filter element by be square, octagonal, or rectangular. Microlenses of different sizes may also be formed on top of the color filter elements of different sizes. Forming color filter elements with different sizes may help skew the quantum efficiency for light at particular wavelengths of interest so that smaller pixel sizes can be used without suffering from diffraction limits. | 05-28-2015 |
20150146014 | IMAGING SYSTEMS AND METHODS FOR LOCATION-SPECIFIC IMAGE FLARE MITIGATION - An imaging system may include a camera module with an image sensor having an array of image sensor pixels and one or more lenses that focus light onto the array. The system may include processing circuitry configured to mitigate flare artifacts in image data captured using the array based on at least one image flare map. The image flare map may identify a portion of the captured image data on which to perform image flare mitigation operations. The processing circuitry may perform image flare mitigation operations such as pixel value desaturation on the identified portion of the captured image data without desaturating portions of the image data that do not include flare artifacts. The flare map may be generated using a calibration system that characterizes the location, intensity, and color of all possible image flare artifacts that may be generated by the imaging system during normal imaging operations. | 05-28-2015 |
20150145007 | IMAGING SYSTEMS WITH IMAGE PIXELS HAVING ADJUSTABLE RESPONSIVITY - An imaging system may include an image sensor having an array of image pixels. Some image pixels in the array may be provided with responsivity adjustment structures. For example, broadband pixels in a pixel array may include responsivity adjustment circuitry. The responsivity adjustment circuitry may be configured to narrow the spectral response or to reduce the conversion gain of the broadband pixels in high light conditions. For example, a deep photodiode may divert charge away from a signal photodiode during an integration period. The deep photodiode may divert charge to a power supply or the charge may be transferred to a storage node and used in image processing, if desired. The responsivity adjustment circuitry may include channel-dependent conversion circuitry that is formed in pixels corresponding to a first color channel, while the conversion gains of pixels corresponding to a second color channel may remain fixed. | 05-28-2015 |
20150144790 | VIDEO AND 3D TIME-OF-FLIGHT IMAGE SENSORS - Electronic devices may include time-of-flight (ToF) image pixels. Each ToF pixel may include a photodiode, a first capacitor coupled to the photodiode via a first transfer gate, a second capacitor coupled to the photodiode via a second transfer gate, and a third capacitor coupled to the photodiode via a third transfer gate. The first transfer gate may be turned on for a given duration to store a first charge in the first capacitor. The second transfer gate may be turned on for the given duration to store a second charge in the second capacitor. The third transfer gate may be turned on for a duration that is longer than the given duration to store a third charge in the third capacitor. Depth information may be computed based on the first, second, and third stored charges and a corresponding pixel constant. | 05-28-2015 |
20150138366 | IMAGING SYSTEMS WITH VISIBLE LIGHT SENSITIVE PIXELS AND INFRARED LIGHT SENSITIVE PIXELS - An image sensor may have an array of image pixels arranged in color filter unit cells that each have at least one red image pixel that generates red image signals, at least one blue image pixel that generate blue image signals, at least one clear image pixels that generate clear image signals, at least one infrared image pixel that generates infrared image signals, and optionally at least one green image pixel that generates green image signals. The image sensor may be coupled to processing circuitry that performs chroma demosaicking operations on the image signals. The processing circuitry may generate an infrared image using the infrared image signals and a luminance value using the clear, red, blue, and infrared image signals. The processing circuitry may perform point filter operations on the image signals based on the generated luminance value to produce corrected visible light image signals having improved image quality. | 05-21-2015 |
20150137297 | METHODS OF FORMING IMAGING DEVICE LAYERS USING CARRIER SUBSTRATES - An array of color filter elements may be formed over an array of photodiodes in an integrated circuit for an imaging device using a carrier substrate. The carrier substrate may have a planar surface with a release layer. A layer of color filter material may be applied to the release layer. The carrier substrate may then be flipped and the layer of color filter material may be bonded to the integrated circuit. Heat may be applied to activate the release layer and the carrier substrate may be removed at the interface between the release layer and the color filter material. The layer of color filter material may be patterned either before bonding the layer of color filter material or after the carrier substrate is removed. A layer of microlenses may be formed over the array of color filter elements using a carrier substrate. | 05-21-2015 |
20150056097 | IMAGING DEVICES FOR MOLECULE DETECTION - An imager may include an array of pixels formed on a substrate. A chemisorption layer such as a planar chemisorption layer may be deposited over the array of pixels. The chemisorption layer may include active sites that bond with anchoring molecules. The anchoring molecules may be bonded to the planar chemisorption layer in only localized regions each covering a respective pixel of the array of pixels. The image sensor may include a photoresist layer that covers the chemisorption layer. Openings in the photoresist layer may define the boundaries of the localized regions. The anchoring molecules may be bonded only with the chemisorption layer without bonding to the photoresist layer. The anchoring molecules may serve to bond with analyte molecules. By forming the anchoring molecules within only localized regions centered over respective pixels, spatial resolution of the imager when imaging the analyte molecules may be improved. | 02-26-2015 |
20150054997 | IMAGE SENSORS HAVING PIXEL ARRAYS WITH NON-UNIFORM PIXEL SIZES - An image sensor having an array of pixels and a silicon substrate may be provided. In one embodiment, the array of pixels may have pixels of equal charge storage capacity but with varying sizes and thus varying sensitivities. For example, a first pixel may have a larger charge-generating volume than a second pixel. In another suitable embodiment, the charge storage capacity of the image sensor pixels may be varied while the charge-generating volume remains the same. These configurations are achieved by placing a p+ type doped layer in the silicon substrate close to and parallel to the surface of the array. The p+ type doped layer may include a plurality of openings to allow photo-generated carriers to flow from the silicon bulk to the charge storage wells located near the surface of the substrate. | 02-26-2015 |
20150054103 | IMAGING SYSTEMS WITH BAFFLE GRIDS - An imaging system may include a camera module with an image sensor having an array of image sensor pixels. The image sensor may include a substrate having an array of photodiodes, an array of microlenses formed over the array of photodiodes, and an array of color filter elements interposed between the array of microlenses and the array of photodiodes. A grid of baffles may be formed over the array of image pixels and may be configured to block stray light from striking the image pixels. The baffles may extend above the microlens array and may be tilted at an angle with respect to the optical axis of the image sensor. The angle at which each baffle is tilted may be proportional to the chief ray angle of an associated microlens. Baffles may be formed from a light-blocking material such as metal, photoresist, carbon, graphite, or other suitable material. | 02-26-2015 |
20150035966 | HANDHELD DIAGNOSTIC SYSTEM WITH DISPOSABLE SAMPLE HOLDER AND CHIP-SCALE MICROSCOPE - A handheld diagnostic system may include a disposable sample holder and an analysis module having a chip-scale microscope. The sample holder may have a transparent portion having test chambers for containing respective portions of a biological sample. The analysis module may having a housing with an opening configured to receive the transparent portion of the sample holder. The chip-scale microscope may include an image sensor for capturing images of the biological sample as the transparent portion of the sample holder is inserted into the opening of the analysis module. The analysis module may include a light source for illuminating the sample during image capture operations and optics for gathering light from the sample and focusing the light onto the image sensor. The analysis module may transmit sample imaging information to a portable electronic device, which may in turn display corresponding sample analysis information for a user. | 02-05-2015 |
20150009379 | IMAGERS WITH IMPROVED ANALOG-TO-DIGITAL CIRCUITRY - An imager may include an array of pixels. The pixel array may be arranged in rows and columns. Each pixel of the pixel array may include a photodiode that is coupled to a floating diffusion region by a transfer gate. A source-follower transistor may be coupled between the floating diffusion region and a pixel output node. The imager may include ramp circuitry that provides a ramp signal to the floating diffusion region. A capacitor interposed between the ramp circuitry and the floating diffusion region may be used in conveying the ramp signal to the floating diffusion region. The pixel may be coupled to a comparator that is implemented using separate circuitry or may include portions of the pixel. | 01-08-2015 |
20150009378 | IMAGE SENSORS WITH PIXEL ARRAY SUB-SAMPLING CAPABILITIES - An image sensor may include an array of image pixels arranged according to a predetermined pattern. A 3-by-3 pixel sub-sampling method is provided that supports a high-speed sub-resolution video mode. The 3-by-3 sub-sampling method may involve organizing the image pixel array into groups, each of which contains a 3-by-3 array of nine pixels. Image pixels at the four corners of each group may be sampled and combined to form a final output. Final outputs produced from each group may form a sub-sampled array that is used by the sub-resolution video mode. | 01-08-2015 |
20150009375 | IMAGING SYSTEMS WITH DYNAMIC SHUTTER OPERATION - An imaging system may include an image sensor having an array of image pixels. Each image pixel may include an electronic shutter for controlling when a photosensor in the image pixel accumulates charge. The electronic shutter may be operable in an open state during which charge is allowed to accumulate on the photosensor and a closed state during which charge is drained from the photosensor. The electronic shutter may be cycled through multiple open and closed states during an image frame capture. At the end of each open state, the charge that has been acquired on the photosensor may be transferred from the photosensor to a pixel memory element. By breaking up the total exposure time for a pixel during an image frame into shorter, non-continuous periods of exposure time, dynamic scenery image artifacts may be minimized while maintaining the desired total exposure time. | 01-08-2015 |
20140313379 | IMAGING SYSTEMS WITH CROSSTALK REDUCTION STRUCTURES - An imaging system may include a camera module with an image sensor having an array of image sensor pixels. The image sensor may include a substrate having an array of photodiodes, an array of microlenses formed over the array of photodiodes, and an array of color filter elements interposed between the array of microlenses and the array of photodiodes. The color filter elements may be separated from each other by color filter barriers. Each color filter barrier may include an upper portion formed from dielectric material and a lower portion formed from metal. The metal portion of each color filter barrier may form a crosstalk reduction structure that prevents stray light from passing from one pixel to an adjacent pixel. The color filter barriers may have a grid shape with an array of openings. The color filter elements may be deposited in the openings. | 10-23-2014 |
20140313375 | SYSTEMS AND METHODS FOR MITIGATING IMAGE SENSOR PIXEL VALUE CLIPPING - An imaging system may include image sensor pixels, converter circuitry, denoising circuitry, dark current subtraction circuitry, and storage and processing circuitry. The image sensor pixels may generate analog image signals and the converter circuitry may convert the analog image signals into digital pixel values. The denoising circuitry may generate denoised pixel values based on the digital pixel values. The dark current subtraction circuitry may subtract a dark current value from the denoised pixel values. The image sensor pixels and converter circuitry may generate pixel values in multiple color channels. The image sensor pixels may include clear color filter elements for generating clear pixel values. The storage and processing circuitry may determine different black pedestal values for each color channel and may add the black pedestal values to the pixel values from the corresponding color channel to mitigate pixel value clipping in a final image generated by the imaging system. | 10-23-2014 |
20140313350 | IMAGING SYSTEMS WITH REFERENCE PIXELS FOR IMAGE FLARE MITIGATION - Imaging devices may include processing circuitry, a lens, and an array of image sensor pixels and reference pixels. The array may receive direct image light and stray light from the lens. The image sensor pixels may include clear color filter elements and the reference pixels may include opaque color filter elements. The opaque color filter elements may block direct image light from being captured by the reference pixels. The image sensor pixels may generate pixel values in response to the direct image light and the stray light whereas the reference pixels may generate reference pixel values in response to the stray light. The processing circuitry may mitigate stray light effects such as local flare and veiling glare within the imaging system by adjusting the pixel values based on the reference pixel values. The imaging system may be calibrated in a calibration system for generating stray light calibration data. | 10-23-2014 |
20140302632 | METHOD OF FABRICATION OF AN ARRAY OF GRADED REFRACTIVE INDEX MICROLENSES INTEGRATED IN A IMAGER SENSOR - Methods and devices that incorporate microlens arrays are disclosed. An image sensor includes a pixel layer and a dielectric layer. The pixel layer has a photodetector portion configured to convert light absorbed by the pixel layer into an electrical signal. The dielectric layer is formed on a surface of the pixel layer. The dielectric layer has a refractive index that varies along a length of the dielectric layer. A method for fabricating an image sensor includes forming an array of microlenses on a surface of the dielectric layer, emitting ions through the array of microlenses to implant the ions in the dielectric layer, and removing the array of microlenses from the surface of the dielectric layer. | 10-09-2014 |
20140270640 | Plasmonic Light Collectors - An electronic device may be provided with imaging modules or communications modules. Imaging modules and communications modules may be improved with the use of plasmonic light collectors. Plasmonic light collectors exploit the interaction between incoming light and plasmons in the plasmonic light collector to redirect the path of the incoming light. Plasmonic light collectors may be used to form lenses for image pixels in an imaging module or to form light pipes or lenses for use in injecting optical communications into a fiber optic cable. Plasmonic lenses may be formed by lithography of metallic surfaces by implantation or by stacking and patterning of layers of materials having different dielectric properties. Plasmonic image pixels may be smaller and more efficient than conventional image pixels. Plasmonic light guides may have significantly less signal loss than conventional lenses and light guides. | 09-18-2014 |
20140258354 | SYSTEMS AND METHODS FOR AN ADJUSTABLE FILTER ENGINE - Systems and methods are provided for an adjustable filter engine. In particular, an electronic system is provided that can include a focus module, memory, and control circuitry. In some embodiments, the focus module can include an adjustable filter engine and a motor. By using the adjustable filter engine to generate a filter with a large number of filter coefficients, the control circuitry can accommodate a variety of system characteristics. For example, by generating a set of cumulative coefficients and re-arranging the order of the cumulative coefficients, the control circuitry can reduce the bit-width requirements of the adjustable filter engine hardware. For instance, the control circuitry can reduce the number of multipliers required to perform a convolution between an updated filter and one or more input signals. In some embodiments, the updated filter can be generated to reduce oscillations of the motor movement due to a new position request. | 09-11-2014 |
20140247380 | IMAGE SENSOR PIXELS WITH SELF-ALIGNED LATERAL ANTI-BLOOMING STRUCTURES - Pixels for solid-state CMOS image sensor arrays may be provided that have a lateral blooming control structure incorporated in them. The lateral blooming control structure is built as a separate structure from the charge transfer gate and it is fabricated in a self-aligned manner, which is particularly suitable for incorporating into small size pixels. The blooming control structure can be used for backside or for front side illuminated image sensors. When the lateral blooming control structure is provided with a separate bias means, it may also be used for the complete or partial charge removal from the photodiode and thus used in pixels that are designed for global shutter operation. | 09-04-2014 |
20140247366 | IMAGE SENSORS WITH DARK PIXELS FOR REAL-TIME VERIFICATION OF IMAGING SYSTEMS - An imaging system may include an array of image pixels. The array of image pixels may be provided with one or more rows and columns of optically shielded dark image pixels. The dark image pixels may be used to produce verification image data that follows the same pixel-to-output data path of light-receiving pixels. The output signals from dark pixels may be continuously or intermittently compared with a set of expected output signals to verify that the imaging system is functioning properly. In some arrangements, verification image data may include a current frame number that is encoded into the dark pixels. The encoded current frame number may be compared with an expected current frame number. In other arrangements, dark pixels may be configured to have a predetermined pattern of conversion gain levels. The output signals may be compared with a “golden” image or other predetermined set of expected output signals. | 09-04-2014 |
20140246748 | IMAGE SENSORS WITH SMALL PIXELS HAVING HIGH WELL CAPACITY - An image sensor having small pixels with high charge storage capacity, low dark current, no image lag, and good blooming control may be provided. The high charge storage capacity is achieved by placing a p+ type doped layer under the pixel charge storage region with an opening in it for allowing photo-generated charge carriers to flow from the silicon hulk to the charge storage well located near the surface of the photodiode. A compensating n-type doped implant may be formed in the opening. Image lag is prevented by placing a p− type doped region under the p+ type doped photodiode pinning layer and aligned with the opening. Blooming control is achieved by adjusting the length of the transfer gate in the pixel and thereby adjusting the punch-through potential under the gate. | 09-04-2014 |
20140197511 | METHODS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSORS WITH FRONT SIDE METAL REDISTRIBUTION LAYERS - Methods for forming backside illuminated (BSI) image sensors having metal redistribution layers (RDL) and solder bumps for high performance connection to external circuitry are provided. In one embodiment, a BSI image sensor with RDL and solder bumps may be formed using a temporary carrier during manufacture that is removed prior to completion of the BSI image sensor. In another embodiment, a BSI image sensor with RDL and solder bumps may be formed using a permanent carrier during manufacture that partially remains in the completed BSI image sensor. A BSI image sensor may be formed before formation of a redistribution layer on the front side of the BSI image sensor. A redistribution layer may, alternatively, be formed on the front side of an image wafer before formation of BSI components such as microlenses and color filters on the back side of the image wafer. | 07-17-2014 |
20140197301 | GLOBAL SHUTTER IMAGE SENSORS WITH LIGHT GUIDE AND LIGHT SHIELD STRUCTURES - An image sensor operable in global shutter mode may include an array of image pixels. Each image pixel may include a photodiode for detecting incoming light and a separate storage diode for temporarily storing charge. To maximize the efficiency of the image pixel array, image pixels may include light guide structures and light shield structures. The light guide structures may be used to funnel light away from the storage node and into the photodiode, while the light shield structures may be formed over storage nodes to block light from entering the storage nodes. The light guide structures may fill cone-shaped cavities in a dielectric layer, or the light guide structures may form sidewalls having a ring-shaped horizontal cross section. Metal interconnect structures in the dielectric layer may be arranged in concentric annular structures to form a near-field diffractive element that funnels light towards the appropriate photodiode. | 07-17-2014 |
20140160326 | COLOR FILTER ARRANGEMENTS FOR FUSED ARRAY IMAGING SYSTEMS - Electronic devices may include camera modules. A camera module may include an array camera having an array of lenses and a corresponding array of image sensors. The array of image sensors may include a monochromatic image sensor such as a green image sensor and a polychromatic image sensor such as a red and blue image sensor. | 06-12-2014 |
20140146209 | PUMPED PINNED PHOTODIODE PIXEL ARRAY - The present invention relates to a pumped pixel that includes a first photo-diode accumulating charge in response to impinging photons, a second photo-diode, and a floating diffusion positioned on a substrate. The pixel also includes a charge barrier positioned on the substrate between the first photo-diode and the second photo-diode, where the charge harrier temporarily blocks charge transfer between the first photo-diode and the second photo-diode. A pump gate may also be formed on the substrate adjacent to the charge barrier. The pump gate pumps the accumulated charge from the first photo-diode to the second photo-diode through the charge barrier. Also included is a transfer gate positioned on the substrate between the second photo-diode and the floating diffusion. The transfer gate serves to transfer the pumped charge from, the second photo-diode to the floating diffusion. | 05-29-2014 |
20140125838 | IMAGING SYSTEMS WITH MODIFIED CLEAR IMAGE PIXELS - An image sensor may have an array of image sensor pixels arranged in unit pixel cells each having at least one modified clear image pixel. Each modified clear image pixel may include a modified clear color filter element formed from a transparent material such as an oxide material that is modified with a colored pigment or colored dye such as yellow pigment. Each unit pixel cell may include one or more color pixels of other colors such as red pixels, blue pixels, and green pixels. Image signals such as yellow image signals from the modified clear pixels may be processed along with other color image signals such as red image signals and blue image signals to generate standard red, green, and blue image data. Image processing operations may include chroma demosaicing or point filtering of the image signals from the modified clear image pixels. | 05-08-2014 |
20140094993 | IMAGING SYSTEMS WITH VERIFICATION PIXELS - An imaging system may include a pixel array having a plurality of image pixels and a plurality of test pixels. The test pixels may each include a photodiode configured to receive a test voltage. For example, the photodiodes of test pixels may be coupled to a bias voltage supply line or the photodiodes may receive test voltages via a column readout line or a row control line. The test voltage may be output on a column line associated with the column of pixels in which the test pixel is located. Verification circuitry may compare the output test signal with a predetermined reference signal to determine whether the imaging system is functioning properly. If an output test signal does not match the expected output signal, the imaging system may be disabled and/or a warning signal may be presented to a user of the system. | 04-03-2014 |
20140085523 | BACK SIDE ILLUMINATED GLOBAL SHUTTER IMAGE SENSORS WITH BACK SIDE CHARGE STORAGE - A back side illuminated image sensor may be provided with an array of image sensor pixels. Each pixel may include a substrate having a front surface and a back surface. The pixels may have a charge storage region at the back surface and a charge readout node at the front surface of the substrate. The pixels may receive light at the back surface. Photo-generated charge may be accumulated at the charge storage region during a charge integration cycle. Upon completion of the charge integration cycle, a transfer gate formed at the front surface may be pulsed high to move the charge from the charge storage region to the charge readout node using a global shutter algorithm. The pixels may include two reset transistors that are coupled to column feedback amplifier circuitry for mitigating kTC-reset noise when the pixels are operated in a global shutter mode. | 03-27-2014 |
20140085517 | BACKSIDE ILLUMINATED IMAGE SENSOR PIXELS WITH DARK FIELD MICROLENSES - A backside illuminated image sensor with an array of image sensor pixels is provided. Each image pixel may include a photodiode and associated pixel circuits formed in a front surface of a semiconductor substrate. Silicon inner microlenses may be formed on a back surface of the semiconductor substrate. In particular, positive inner microlenses may be formed over the photodiodes, whereas negative inner microlenses may be formed over the associated pixel circuits. Buried light shielding structures may be formed over the negative inner microlenses to prevent pixel circuitry that is formed in the substrate between two neighboring photodiodes from being exposed to incoming light. The buried light shielding structures may be lined with absorptive antireflective coating material to prevent light from being reflected off the surface of the buried light shielding structures. Forming buried light shielding structures with antireflective coating material can reduce optical pixel crosstalk and enhance global shutter efficiency. | 03-27-2014 |
20140084409 | IMAGE SENSORS WITH IN-PIXEL ANTI-BLOOMING DRAINS - An imaging system may include an image sensor having an array of image pixels formed in a substrate. Each image pixel may include a photodiode directly coupled to an anti-blooming diode. The anti-blooming diode may be connected to a positive voltage supply line and may be configured to drain excess charge from the photodiode when the photodiode is saturated. The anti-blooming drain may be formed from an n-type diffusion region partially surrounded by a p-type doped layer. The p-type doped layer may be interposed between and in contact with the n-type diffusion region of the anti-blooming diode and an n-type doped region of the photodiode. The anti-blooming diode may begin to drain excess charge from the photodiode in response to the photodiode reaching a threshold potential during integration. If desired, multiple pixels may share a common anti-blooming diode. | 03-27-2014 |
20140084407 | IMAGING SYSTEMS WITH CIRCUIT ELEMENT IN CARRIER WAFER - An imaging system may include an image sensor package with an image sensor wafer mounted on a carrier wafer, which may be a silicon substrate. A capacitor may be formed in the carrier wafer. Trenches may be etched in a serpentine pattern in the silicon substrate. Conductive plates of the capacitor may be formed at least partially in the trenches. An insulator material may be formed between the capacitor and the silicon substrate. A dielectric layer may be formed between the conductive plates of the capacitor. The image sensor package may be mounted on a printed circuit board via a ball grid array. Conductive vias may electrically couple the capacitor and the image sensor wafer to the printed circuit board. | 03-27-2014 |
20140078368 | TRIPLE CONVERSION GAIN IMAGE SENSOR PIXELS - An image sensor having pixel circuitry operable in multiple gain modes is provided. The pixel circuitry may include first and second floating diffusion (FD) regions, a first photodiode coupled to the first FD region via a first transfer gate, a second photodiode coupled to the first FD region via a second transfer gate, a third photodiode coupled to the second FD region via a third transfer gate, and a fourth photodiode coupled to the second FD region via a fourth transfer gate. The first FD region may be coupled to the second FD region via first and second control transistors. The control transistors may be connected to a shared reset transistor. During readout, both control transistors may be deactivated to provide a high gain mode, only one transistor may be activated to provide an intermediate gain mode, or both control transistors may be activated to provide a low gain mode. | 03-20-2014 |
20140078366 | IMAGING SYSTEMS WITH IMAGE PIXELS HAVING VARYING LIGHT COLLECTING AREAS - An image sensor may have an array of image sensor pixels having varying light collecting areas. The light collecting area of each image pixel may vary with respect to other image pixels due to varied microlens sizes and varied color filter element sizes throughout the array. The light collecting area may vary within unit pixel cells and the variability of the light collecting areas of pixels within each pixel cell may depend on the location of the pixel cell in the pixel array. Each unit pixel cell may include at least one clear pixel having a light collecting area that is smaller than the light collecting areas of other single color pixels in the unit pixel cell. | 03-20-2014 |
20140078360 | IMAGERS WITH IMPROVED ANALOG-TO-DIGITAL CONVERTERS - An imager may include analog-to-digital converter circuitry that converts an analog input voltage to a digital output value by generating a number of samples of the analog input voltage. The analog input voltage may be formed from the difference between a pixel signal and a reference signal received at first and second inputs of the analog-to-digital converter circuitry. Processing circuitry may control the number of samples generated from the analog input voltage based on a desired gain level. The analog-to-digital converter circuitry may include a counter that counts to a maximum value. Ramp generation circuitry may generate a ramp signal based on the counter value and apply the ramp signal to the pixel signal at the first input of the analog-to-digital converter circuitry. The total time for generating samples for each different desired gain level may be constant while generating the ramp signal with a slope having a constant magnitude. | 03-20-2014 |
20140078359 | IMAGE SENSOR PIXELS WITH LIGHT GUIDES AND LIGHT SHIELD STRUCTURES - A front-side illuminated image sensor with an array of image sensor pixels is provided. Each image pixel may include a photodiode, transistor gate structures, shallow trench isolation structures, and other associated pixel circuits formed in a semiconductor substrate. Buried light shielding structures that are opaque to light may be formed over regions of the substrate to prevent the transistor gate structures, shallow trench isolation structures, and the other associated pixel circuits from being exposed to stray light. Buried light shielding structures formed in this way can help reduce optical pixel crosstalk. | 03-20-2014 |
20140078356 | IMAGING SYSTEMS WITH HIGH DIELECTRIC CONSTANT BARRIER LAYER - An imaging system may include a camera module with an image sensor having an array of image sensor pixels. The image sensor may include a substrate having an array of photodiodes, an array of microlenses formed over the array of photodiodes, an array of color filter elements interposed between the array of microlenses and the array of photodiodes, and a barrier layer interposed between the array of color filter elements and the array of photodiodes. The barrier layer may be formed from a material with a high dielectric constant. The material used to form the barrier layer may have a dielectric constant above the dielectric constant of silicon dioxide. The barrier layer may replace an antireflective coating over the array of photodiodes and may be used in connection with a silicon dioxide passivation layer interposed between the array of photodiodes and the barrier layer. | 03-20-2014 |
20140078349 | IMAGING SYSTEMS WITH CROSSTALK CALIBRATION PIXELS - An image sensor may include crosstalk calibration pixels. Crosstalk calibration pixels may include exposed pixels and shielded pixels. Exposed pixels may be partially or completely surrounded by shielded pixels. Calibration pixels may be formed in a checkerboard pattern of alternating shielded and exposed pixels or a double checkerboard pattern of alternating pairs of shielded and exposed pixels. Exposed pixels may have apertures of various size in a shielding layer that shields the shielded pixels from light. Signals generated by exposed and shielded pixels may be used in assessing pixel optical and electrical crosstalk and indirectly deducing the spectral composition of incoming light for particular locations in a pixel array. Information about local crosstalk across the array may be used in coordinate dependent color correction matrices, white balance algorithms, luminance and chroma noise cancellation, edge sharpening, assessment of pixel implantation depth, and measuring a modulation transfer function. | 03-20-2014 |
20140078336 | IMAGING PIXELS WITH IMPROVED DYNAMIC RANGE - An imager may include hybrid pixels that can be operated in first and second configurations. A hybrid pixel may include a floating diffusion region and first and second photodiodes that are coupled to the floating diffusion region. The second photodiode may be coupled to the floating diffusion region by a transfer gate. The first photodiode may accumulate charge during a first integration period, whereas the second photodiode may accumulate charge during a second integration period. The imager may operate the hybrid pixel for improved dynamic range by controlling the configuration of the hybrid pixel. | 03-20-2014 |
20140078310 | IMAGING SYSTEMS WITH FRONT SIDE ILLUMINATED NEAR INFRARED IMAGING PIXELS - An imaging system may include an image sensor having front side illuminated near infrared image sensor pixels. Each pixel may be formed in a graded epitaxial substrate layer such as a graded p-type epitaxial layer or a graded n-type epitaxial layer on a graded p-type epitaxial layer. Each pixel may be separated from an adjacent pixel by an isolation trench formed in the graded epitaxial layer. A deep p-well may be formed within each isolation trench. The isolation trenches and photodiodes for the pixels may be formed in the graded p-type epitaxial layer or the graded n-type epitaxial layer. The graded p-type epitaxial layer may have an increasing concentration of dopants that increases toward the backside of the image sensor. The graded n-type epitaxial layer may have an increasing concentration of dopants that increases toward the front side of the image sensor. | 03-20-2014 |
20140077325 | IMAGING PIXELS WITH IMPROVED PHOTODIODE STRUCTURES - A photodiodes may be formed on a substrate such as an imager substrate. The photodiode may include first and second layers in the substrate that form a p-n junction. The first layer may have a first doping type such as p-type doping, whereas the second layer may have a second, opposite doping type such as n-type doping. A counter-doping implant region may be provided that only partially overlaps with the second layer of the photodiode. The counter-doping implant region may have an opposite doping type to the second layer and may have a dopant concentration that is less than the dopant concentration of the second layer. The counter-doping implant region may extend into a third layer of the substrate that may have the same doping type of the second layer but at a lower concentration than the counter-doping implant region. | 03-20-2014 |
20140077323 | IMAGING SYSTEMS WITH BACKSIDE ILLUMINATED NEAR INFRARED IMAGING PIXELS - An imaging system may include an image sensor having backside illuminated near infrared image sensor pixels. Each pixel may be formed in a graded epitaxial substrate layer such as a graded n-type epitaxial layer. Each pixel may be separated from an adjacent pixel by an isolation trench formed in the graded epitaxial layer. The isolation trench may be a continuous isolation trench or may be formed from a combined front side isolation trench and backside isolation trench that are separated by a wall structure. A buried front side reflector may be provided that reflects light such as infrared light that has passed through a pixel back into the pixel, thereby effectively doubling the silicon absorption depth of the pixels. | 03-20-2014 |
20140077283 | IMAGE SENSORS HAVING BURIED LIGHT SHIELDS WITH ANTIREFLECTIVE COATING - An image sensor with an array of image sensor pixels is provided. Each image pixel may include a photodiode and associated pixel circuits formed in a semiconductor substrate. Buried light shielding structures may be formed on the substrate to prevent pixel circuitry that is formed in the substrate between two adjacent photodiodes from being exposed to incoming light. The buried light shielding structures may be lined with absorptive antireflective coating material to prevent light from being reflected off the surface of the buried light shielding structures. Forming buried light shielding structures with absorptive antireflective coating material can help reduce optical pixel crosstalk and enhance global shutter efficiency. | 03-20-2014 |
20140077063 | IMAGERS WITH STACKED INTEGRATED CIRCUIT DIES - An imager may include an imaging die that is stacked with an image processing die. The imaging die may generate output signals from received light. The image processing die may process the output signals. Through-silicon vias of the imaging die or solder balls may electrically couple the imaging die to the image processing die and convey the output signals to the image processing die. The imaging die may include a pixel array that generates pixel signals from the received light. The image processing die may generate control signals that control the imaging die and are conveyed to the imaging die over the through-silicon vias or solder balls. | 03-20-2014 |
20140077062 | BACK SIDE ILLUMINATED IMAGE SENSORS WITH BACK SIDE CHARGE STORAGE - A back side illuminated image sensor may be provided with an array of image sensor pixels. Each image sensor pixel may include a substrate having a front surface and a back surface. The image sensor pixels may have a charge storage region formed at the back surface and a charge readout node formed at the front surface of the substrate. The image sensor pixels may receive image light at the back surface of the substrate. Photo-generated charge may be accumulated at the charge storage region during a charge integration cycle. Upon completion of the charge integration cycle, a transfer gate formed at the front surface may be pulsed high to move the charge from the charge storage region to the charge readout node. The charge may be converted to a voltage at the charge readout node and may be read out using a rolling shutter readout mode. | 03-20-2014 |
20140077061 | BACKSIDE ILLUMINATED IMAGE SENSORS HAVING BURIED LIGHT SHIELDS WITH ABSORPTIVE ANTIREFLECTIVE COATING - An image sensor with an array of image sensor pixels is provided. Each image pixel may include a photodiode and associated pixel circuits formed in the front surface of a semiconductor substrate. Buried light shielding structures may be formed on the back surface of the substrate to prevent pixel circuitry that is formed in the substrate between two adjacent photodiodes from being exposed to incoming light. The buried light shielding structures may be lined with absorptive antireflective coating material to prevent light from being reflected off the surface of the buried light shielding structures. Forming buried light shielding structures with absorptive antireflective coating material can help reduce optical pixel crosstalk and enhance signal to noise ratio. | 03-20-2014 |
20140063300 | HIGH DYNAMIC RANGE IMAGING SYSTEMS HAVING CLEAR FILTER PIXEL ARRAYS - Imaging systems may include an image sensor and processing circuitry. An image sensor may include a pixel array having rows and columns. The array may include short and long-exposure groups of pixels arranged in a zig-zag pattern. The short-exposure group may generate short-exposure pixel values in response to receiving control signals from control circuitry over a first line and the long-exposure group may generate long-exposure pixel values in response to receiving control signals from the control circuitry over a second line. The processing circuitry may generate zig-zag-based interleaved high-dynamic-range images using the long and short-exposure pixel values. If desired, the array may include short and long-exposure sets of pixels located in alternating single pixel rows. The processing circuitry may generate single-row-based interleaved high-dynamic-range images using pixel values generated by the short and long-exposure sets. | 03-06-2014 |
20140055654 | BACKSIDE ILLUMINATED IMAGE SENSORS WITH STACKED DIES - An image sensor unit may have a backside-illuminated imager and an image co-processor stacked together. The image co-processor may be mounted in a cavity in a permanent carrier. The permanent carrier may include fluid channels that allow cooling fluid to flow past the image co-process and past the imager, thereby removing excess heat generated by the image sensor unit during operation. | 02-27-2014 |
20140050360 | SYSTEMS AND METHODS FOR PRESENCE DETECTION - Systems and methods are provided for presence detection using an image system. The image system may be a camera that is integrated into an electronic device. In some embodiments, the image system can accommodate multiple operating modes of the electronic device. For example, when the electronic device is operating in a normal power mode, control circuitry of the image system can detect when a user has left and is no longer using the electronic device. When the electronic device is operating in a power saving mode, the control circuitry can detect user presence (e.g., when a user has come back to the electronic device). In some embodiments, the control circuitry can adjust for both gradual and sudden light changes. | 02-20-2014 |
20130328834 | IMAGING SYSTEMS AND METHODS FOR USER INPUT DETECTION - An imaging system may be provided that includes a camera module, a transparent or translucent surface, and processing circuitry that is configured to perform character recognition operations based on images of the translucent surface that have been captured using the camera module. The camera module may include an image sensor having an array of image pixels and one or more lenses that focus light from the translucent surface onto the array of image pixels. The processing circuitry may be configured to recognize gestures from one or more users on the translucent surface. The processing circuitry may be configured to extract user input data from captured images of an object seen through the translucent surface by extracting gesture point locations from the captured images, storing coordinate data associated with the extracted gesture point locations, and comparing the stored coordinate data with template data that corresponds to a plurality of known characters. | 12-12-2013 |
20130308036 | IMAGE FOCUS ADJUSTMENT USING STACKED-CHIP IMAGE SENSORS - Imaging systems may be provided with stacked-chip image sensors and adjustable lens systems. A stacked-chip image sensor may include a vertical chip stack that includes an array of image pixels and processing circuitry. The adjustable lens system may pass light from a scene onto the image pixels at a number of focus positions. The image pixels may capture a focus bracket of image frames at a capture frame rate for light passed by the adjustable lens system at two or more of the focus positions. The processing circuitry may combine a set of image frames in the focus bracket to generate a focused image. The focused image may have one or more portions of the captured scene in focus. The processing circuitry may output the focused image to off-chip image processing circuitry at an output frame rate that is less than the capture frame rate. | 11-21-2013 |
20130308029 | METHOD AND APPARATUS FOR PIXEL CONTROL SIGNAL VERIFICATION - Imaging systems may be provided with image sensors having an array of image pixels coupled to row control circuitry and verification circuitry. The row control circuitry may provide row control signals to the image pixels for capturing image data. The verification circuitry may receive the row control signals through the array of image pixels. The verification circuitry may identify predetermined ranges of acceptable row control signal magnitudes based on the type of row control signal and the mode of operation of the image sensor. The verification circuitry may be configured to compare row control signal magnitudes to the predetermined acceptable ranges. If the row control signal magnitudes are outside of one or more of the predetermined ranges, circuitry in the imaging system may be shut off and/or a fault signal such as an audible or visible failure alert signal may be produced for an operator of imaging system. | 11-21-2013 |
20130308028 | OFFSET INJECTION IN AN ANALOG-TO-DIGITAL CONVERTER - An electronic device may have one or more analog-to-digital converters (ADCs). The ADCs may be used in digitizing signals from an image sensor. In order to ensure that input signals received by an ADC are not clipped, the input signals may be positively or negatively offset by a desired amount. Offsetting the input signals may ensure that the offset input signals wall within the acceptable input range of the ADCs. Offset injection may be accomplished using capacitors that are also used for analog-to-digital conversion. As an example, the ADC may be a successive approximation-type ADC that uses capacitors in a binary search for the digital value most accurately representing an input analog value. The capacitors of the ADC may be used for the successive approximation process and for offset injection. The offset injection may be digitally canceled out following digitization of the input analog signal. | 11-21-2013 |
20130308027 | SYSTEMS AND METHODS FOR GENERATING METADATA IN STACKED-CHIP IMAGING SYSTEMS - Imaging systems may be provided with stacked-chip image sensors. A stacked-chip image sensor may include a vertical chip stack that includes an array of image pixels, analog control circuitry and storage and processing circuitry. The control circuitry or the processing circuitry may include metadata generation circuitry and image data output control circuitry that control the processing of blocks of image data from blocks of image pixels in the image pixel array. The metadata generation circuitry may generate metadata for a current image block and provide the generated metadata to the image data output control circuitry. The image data output control circuitry may output image blocks that have been flagged for readout, flagged for enhanced image processing, or otherwise flagged for transmission in the generated metadata. | 11-21-2013 |
20130308026 | REDUCED HEIGHT CAMERA MODULES - Electronic devices may include camera modules. A camera module may include an anamorphic lens and an image sensor having an array of asymmetrical image pixels. The array may be a square array arranged in pixel columns and pixel rows. The square image pixel array may include more pixel columns than pixel rows and may be located completely within the image circle of the anamorphic lens. The asymmetrical image pixels may each have a width that is smaller the height of that image pixel. The asymmetrical image pixels may be rectangular image pixels or diamond-shaped image pixels. The anamorphic lens may project a distorted image onto the array of asymmetrical image pixels. The width of each asymmetrical image pixel may be smaller than the height of that image pixel by an amount that corresponds to the distortion of the image by the anamorphic lens. | 11-21-2013 |
20130307954 | OPTO-FLUIDIC SYSTEM WITH COATED FLUID CHANNELS - An image sensor integrated circuit may contain image sensor pixels. A channel for receiving a fluid with samples may be formed on top of the image sensor. The image sensor pixels may form light sensors and imagers. The imagers may gather images of the samples as the fluid passes over the imagers or when the samples from the fluid adhere to the surface above an imager array. A protective coating may be formed on surfaces of the channel to protect the image sensor pixels and integrated circuit from potentially damaging materials in the fluid, samples, or materials provided for evaluating the samples. The protective coating may be a base-resistant material such as a silylating agent. A cover glass may be attached above the image sensor integrated circuit to form a portion of the channel. The protective coating may be formed on surfaces of the cover glass. | 11-21-2013 |
20130293752 | EXPOSURE TIME SELECTION USING STACKED-CHIP IMAGE SENSORS - Imaging systems may be provided with stacked-chip image sensors. A stacked-chip image sensor may include a vertical chip stack that includes an array of image pixels and processing circuitry. The image pixel array may be coupled to the processing circuitry through an array of vertical metal interconnects. The image pixel array may be partitioned into image pixel sub-arrays configured to capture image data using one or more integration times. The processing circuitry may determine motion information for the image data captured by each pixel sub-array and may determine integration times for each pixel sub-array. The pixel sub-arrays may capture additional image data using the determined integration times. The additional image data may be combined to generate final image frames having short integration pixel values and long integration pixel values. The processing circuitry may output the final image frames to off-chip image processing circuitry. | 11-07-2013 |
20130293751 | IMAGING SYSTEMS WITH SEPARATED COLOR FILTER ELEMENTS - An image sensor may be provided with an array of imaging pixels. A color filter array may be formed over photosensitive elements in the pixel array. The color filter array may include a Bayer color filter array. Separating material may be interposed between color filter elements of adjacent imaging pixels. The separating material may be relatively low index of refraction material configured to reduce or eliminate optical crosstalk between adjacent imaging pixels. The separating material may be air so that neighboring color filter elements are separated by an air gap. The air gaps may be formed during the color filter array fabrication process by depositing a sacrificial layer on the substrate, forming openings in the sacrificial layer, forming color filter elements in the openings, and removing remaining portions of the sacrificial layer that are formed between the color filter elements. | 11-07-2013 |
20130293738 | IMAGING SYSTEMS WITH PROGRAMMABLE FIXED RATE CODECS - An imaging system may be provided haying an image sensor and a fixed-rate codec for encoding image data from the image sensor into a fixed-rate bitstream. The image sensor may include an array of image pixels with a corresponding Bayer pattern array of color filter elements. The codec may include circuits for partitioning the image data into fixed-size blocks of image data and compressing the image data in each fixed-size block based on the image content in that block using, a logarithm-based quantization of selected transform coefficients. The available bits for each block. may be allocated to various components such as color components of the data based on the complexity of the image content in each component. The bitstream may include header information with pointers to coefficient locations within each block. The header information may be compressed prior to insertion into the bitstream. | 11-07-2013 |
20130293732 | IMAGING SYSTEMS AND METHODS - An electronic device may have one or more imaging sensors. The imaging sensors may be used in combination with an optional mechanical gesture to analyze the lighting conditions of the environment around the electronic device. The electronic device may set auto-exposure, auto-white balance, and auto-focus settings based on the analysis. The electronic device may include a shaped display. The imaging sensors may be used in calibration of a projector for the shaped display and may be used in sending touch inputs associated with the shaped display. The electronic device may be able to capture a photograph during video capture. The electronic device may generate a display screen that identifies which portions of the scene being imaged correspond to the video and which portions correspond to the photograph. | 11-07-2013 |
20130293724 | IMAGING SYSTEMS WITH SIGNAL CHAIN VERIFICATION CIRCUITRY - An imaging system may include an array of image pixels and verification circuitry. The verification circuitry may inject a test voltage into the pixel signal chain of a test pixel. The test voltage may be output on a column line associated with the column of pixels in which the test pixel is located. The test signal may be provided to a column ADC circuit for conversion from an analog test signal to a digital test signal. Verification circuitry may compare the digital output test signal with a predetermined reference signal to determine whether the imaging system is functioning properly (e.g., to determine whether column ADC circuits or other circuit elements in the pixel signal chain are functioning properly). If the output test signals do not match the expected output signals, the imaging system may be disabled and/or a warning signal may be presented to a user of the system. | 11-07-2013 |
20130292548 | IMAGE SENSORS WITH PHOTOELECTRIC FILMS - An image sensor with an organic photoelectric film for converting light into charge may be provided. The image sensor may include an array of image sensor pixels. Each image sensor pixel may include a charge-integrating pinned diode that collects photo-generated charge from the photoelectric film during an integration period. An anode electrode may be coupled to an n+ doped charge injection region in the charge-integrating pinned diode and may be used to convey the photo-generated charge from the photoelectric film to the charge-integrating pinned diode. Upon completion of a charge integration cycle, a first transfer transistor gate may be pulsed to move the charge from the charge-integrating pinned diode to a charge-storage pinned diode. The charge may be transferred from the charge-storage pinned diode to a floating diffusion node for readout by pulsing a gate of a second charge transfer transistor. | 11-07-2013 |
20130255380 | OPTICAL ACCELEROMETERS - Optical accelerometers may be provided that detect acceleration in up to six axes. An optical accelerometer may include an image sensor and optical elements such as light pipes that extend over the image sensor. Light may be injected into the optical elements by a light source. The optical elements may guide the light onto corresponding portions of an image pixel array on the image sensor. The image pixels may be used to detect changes in the location, size, and intensity of illuminated portions of the pixel array when the optical elements move due to acceleration of the optical accelerometer. The optical accelerometer may include multiple light pipes having various lengths and thicknesses. Light pipes of matching length and thickness may be formed over opposing sides of a pixel array. The light pipes may be coated with a material that responds to electric or magnetic fields. | 10-03-2013 |
20130242148 | IMAGING SYSTEMS WITH CLEAR FILTER PIXELS - An image sensor may have art array of image sensor pixels arranged in color filter unit cells each having one red image pixel that generates red image signals, one blue image pixel that generate blue image signals, and two clear image sensor pixels that generate white image signals. The image sensor may be coupled to processing circuitry that performs filtering operations on the red, blue, and white image signals to increase noise correlations in the image signals that reduce noise- amplification when applying a color correction matrix to the-image signals. The processing circuitry may extract a green image signal from the white image signal. The processing circuitry may compute a scaling value that includes a linear combination of the red, blue, white and green image signals. The scaling value may be applied to the red, blue, and green image signals to produce corrected, image signals having improved image quality. | 09-19-2013 |
20130242133 | SYSTEMS AND METHODS FOR GENERATING INTERPOLATED HIGH-DYNAMIC-RANGE IMAGES - Electronic devices may have camera modules that include an image sensor and processing circuitry. The image sensor may capture an interleaved image having rows of long-exposure pixel values that are interleaved with rows of short-exposure pixel values. The image sensor may separate the interleaved image into first and second images each having empty image pixel values. The processing circuitry may generate interpolated long-exposure and interpolated short-exposure images by generating chroma-filtered interpolated pixel values for the empty pixel values in the first and second images. The processing circuitry may perform interpolation operations along one or more directions for the empty image pixels based on whether the empty image pixels are within a texture area or on a dominant edge of the captured image. The processing circuitry may combine the interpolated long-exposure image and the interpolated short-exposure image to generate a high-dynamic-range image. | 09-19-2013 |
20130235239 | POWER SAVING TECHNIQUES FOR IMAGE SENSORS - Power saving techniques are provided for processing circuitry on image sensors. Processing circuitry may include one or more processing blocks. The processing blocks may receive pixel data in the form of lines separated by blanking time. To reduce power consumption, each processing block may have a clock that is enabled when processing data and disabled during blanking time. The processing blocks may have respective clocks that are enabled and disabled at different times. Timing control circuitry may provide a clock enable signal to a first processing block. Each processing block may receive a clock enable signal and output a time-shifted clock enable signal for a subsequent processing block. | 09-12-2013 |
20130222681 | METHOD AND APPARATUS FOR IMAGE BACKGROUND REMOVAL AND REPLACEMENT - Electronic devices may be provided with image sensors and light sources. The image sensors may include image pixels each having a photosensitive element, first and second storage nodes, and first and second transfer transistors coupled between the photosensitive element and the first and second storage nodes. The first and second transfer transistors may be synchronized with the light source so that charges generated by the photosensitive element of each image pixel when the light source is on are transferred to the first storage node of that pixel and charges generated by the photosensitive element of each image pixel when the light source is off are transferred to the second storage node of that pixel. The light source may be an oscillating light source that is configured to turn on and off multiple times during an image exposure. The generated charges may be used in flash-matting operations. | 08-29-2013 |
20130222603 | IMAGING SYSTEMS FOR INFRARED AND VISIBLE IMAGING - An imaging device capable of simultaneously capturing visible and infrared images may be provided with an array of photosensitive elements, an array of filter elements arranged over the array of photosensitive elements, and a dual bandpass filter arranged over the array of filter elements. The dual bandpass filter may have a first passband in the visible spectral range and a second passband in the infrared spectral range. The array of filter elements may include color filter elements and infrared filter elements. During color image capturing operations, each color pixel receives visible and near infrared light through the dual bandpass filter and an associated color filter element. The infrared portion of the pixel signal from the color pixels may be removed using signals from the near infrared pixels. During infrared image capturing operations, each near infrared pixel receives infrared light through the dual bandpass filter and an associated infrared filter element. | 08-29-2013 |
20130222552 | IMAGING PIXELS WITH DEPTH SENSING CAPABILITIES - An imager may include depth sensing pixels that receive and convert incident light into image signals. The imager may have an associated imaging lens that focuses the incident light onto the imager. Each of the depth sensing pixels may include a microlens that focuses incident light received from the imaging lens through a color filter onto first and second photosensitive regions of a substrate. The first and second photosensitive regions may provide different and asymmetrical angular responses to incident light. Depth information for each depth sensing pixel may be determined based on the difference between output signals of the first and second photosensitive regions of that depth sensing pixel. Color information for each depth sensing pixel may be determined from a summation of output signals of the first and second photosensitive regions. | 08-29-2013 |
20130208138 | IMAGING SYSTEMS AND METHODS FOR GENERATING AUTO-EXPOSED HIGH-DYNAMIC-RANGE IMAGES - Electronic devices may have camera modules that include an image sensor and processing circuitry. The image sensor may capture an image from a scene. The processing circuitry may extract image statistics and exposure levels from the image. The processing circuitry may use the image statistics and the exposure levels to generate a first exposure time, a second exposure time, and gain settings for the image sensor. The image sensor may capture additional images from the scene having long-exposure image pixel values that are captured using the first exposure time and short-exposure image pixel values that are captured using the second exposure time. The processing circuitry may generate a long-exposure image and a short-exposure image from the second image. The processing circuitry may generate auto-exposed high-dynamic-range images of the scene using the long-exposure image and the short-exposure image. | 08-15-2013 |
20130208093 | SYSTEM FOR REDUCING DEPTH OF FIELD WITH DIGITAL IMAGE PROCESSING - An electronic device may have a camera module. The camera module may capture images having an initial depth of field. The electronic device may receive user input selecting a focal plane and an effective f-stop for use in producing a modified image with a reduced depth of field. The electronic device may include image processing circuitry that selectively blurs various regions of a captured image, with each region being blurred to an amount that varies with distance to the user selected focal plane and in response to the user selected effective f-stop (e.g., a user selected level of depth of field). | 08-15-2013 |
20130206962 | IMAGING SYSTEMS WITH BACKSIDE ISOLATION TRENCHES - An image sensor such as a backside illumination image sensor may be provided with analog circuitry, digital circuitry, and an image pixel array on a semiconductor substrate. Trench isolation structures may separate the analog circuitry from the digital circuitry on the substrate. The trench isolation structures may be formed from dielectric-filled trenches in the substrate that isolate the portion of the substrate having the analog circuitry from the portion of the substrate having the digital circuitry. The trench isolation structures may prevent digital circuit operations such as switching operations from negatively affecting the performance of the analog circuitry. Additional trench isolation structures may be interposed between portions of the substrate on which bond pads are formed and other portions of the substrate to prevent capacitive coupling between the bond pad structures and the substrate, thereby enhancing the high frequency operations of the image sensor. | 08-15-2013 |
20130201363 | SYSTEMS FOR CONSTANT HUE AND ADAPTIVE COLOR CORRECTION IMAGE PROCESSING - An electronic device may have a camera module. The camera module may capture images. The electronic device may include image processing circuitry that color corrects the images. The image processing circuitry may desaturate the images globally and/or spatially based on global and/or spatial noise levels of the image. The image processing circuitry may desaturate the images substantially without changing the hue of the images. The image processing circuitry may generate a color correction matrix with constant hue in real time and may color correct images in real time as the images are captured by the camera module. | 08-08-2013 |
20130200251 | IMAGING SENSORS WITH OPTICAL CAVITY PIXELS - An image sensor may be provided having a pixel array that includes optical cavity image pixels. An optical cavity image pixel may include a photosensitive element in a substrate and a reflective cavity formed from a frontside reflector that is embedded in an intermetal dielectric stack, a backside reflector formed in a dielectric layer above the photosensor that partially covers the photosensor, and sidewall reflectors formed in the substrate between adjacent photosensors using deep trench isolation techniques. Each optical cavity image pixel may also include a light-guide trench above the photosensor that guides light into the reflective cavity for that pixel. Each optical cavity pixel may also include color filter material in the trench. Light that is guided into the reflective cavity by the light-guide trench may experience multiple reflections from the reflectors of the reflective cavity before being absorbed and detected by the photosensor. | 08-08-2013 |
20130153973 | IMAGE SENSOR PIXELS WITH JUNCTION GATE PHOTODIODES - Image sensor pixels are provided having junction gate photodiodes. A group of pixels may have a shared floating diffusion region and a shared source-follower transistor. The source-follower transistor may be a JFET source-follower with a gate that forms the floating diffusion region. The JFET source-follower may be a vertical or lateral JFET. A reset diode may be forward-biased to reset the floating diffusion region. Each pixel may have a JFET that serves as a charge transfer barrier between the junction gate photodiode and the floating diffusion region. The charge transfer barrier JFET may be a lateral JFET. The image sensor pixels may be formed without any metal-oxide-semiconductor devices. | 06-20-2013 |
20130110444 | FAILSAFE IMAGE SENSOR WITH REAL TIME INTEGRITY CHECKING OF PIXEL ANALOG PATHS AND DIGITAL DATA PATHS | 05-02-2013 |
20130083236 | METHODS AND DEVICES FOR IMPROVING DYNAMIC RANGE IN IMAGE SENSORS - Methods and devices for improving dynamic range in image sensors are disclosed. An image sensing device comprises an image sensor having a plurality of rows of pixels, and a controller for controlling the exposure of each row of pixels. The controller is programmed to perform a shutter operation for one of the plurality of rows of pixels, and to sample the one of the plurality of rows after a predetermined duration following the performance of the shutter operation. The predetermined duration is different from a multiple of a row time period of the image sensing device. | 04-04-2013 |
20130083204 | SELF TEST OF IMAGE SIGNAL CHAIN WHILE RUNNING IN STREAMING MODE - An imager including a self test mode. The imager includes a pixel array for providing multiple pixel output signals via multiple columns; and a test switch for (a) receiving a test signal from a test generator and (b) disconnecting a pixel output signal from a column of the pixel array. The test switch provides the test signal to the column of the pixel array. The test signal includes a test voltage that replaces the pixel output signal. The test signal is digitized by an analog-to digital converter (ADC) and provided to a processor. The processor compares the digitized test signal to an expected pixel output signal. The processor also interpolates the output signal from a corresponding pixel using adjacent pixels, when the test switch disconnects the pixel output signal from the column of the pixel array. | 04-04-2013 |
20130075584 | IMAGER ROW CONTROL-SIGNAL TESTER - Row-control signal monitoring system for an electronic imager includes signal processing circuitry coupled a pixel array of the electronic imager which receives at least one row control signal from the pixel array and provides an output signal corresponding to the selected row control signal. Monitoring circuitry compares the output signal to a target value to test the at least one row-control signal. | 03-28-2013 |
20130057422 | COMPARATOR NOISE REDUCTION BY MEANS OF A PROGRAMMABLE BANDWIDTH - A comparator including a preamplifier amplifying a first signal and a second signal to produce a first amplified signal on a first output terminal and a second amplified signal on a second output terminal. The comparator also includes a capacitor, a clamp and a latch coupled in parallel to the first output terminal and the second output terminal of the preamplifier. A control circuit is coupled to the variable capacitor and the clamp and is configured to close the clamp during a first time period to cause the first amplified signal and the second amplified signal to bypass the capacitor and the latch, and open the clamp during a second time period following the first time period to cause the first amplified signal and the second amplified signal to be coupled to the capacitor and the latch. The capacitor filters the amplified signals, and the latch produces a digital output signal of the comparator based on the filtered signals. | 03-07-2013 |
20130038691 | ASYMMETRIC ANGULAR RESPONSE PIXELS FOR SINGLE SENSOR STEREO - Depth sensing imaging pixels include pairs of left and right pixels forming an asymmetrical angular response to incident light. A single microlens is positioned above each pair of left and right pixels. Each microlens spans across each of the pairs of pixels in a horizontal direction. Each microlens has a length that is substantially twice the length of either the left or right pixel in the horizontal direction; and each microlens has a width that is substantially the same as a width of either the left or right pixel in a vertical direction. The horizontal and vertical directions are horizontal and vertical directions of a planar image array. A light pipe in each pixel is used to improve light concentration and reduce cross talk. | 02-14-2013 |
20130033622 | METHOD AND APPARATUS FOR MOTION ARTIFACT CORRECTION IN HDR VIDEO - A method and system of correcting motion artifacts are provided for video captured from interlaced multiple exposure sensors. The following are included: (a) motion artifacts detection of a pixel area, (b) smoothing of the detected pixel area, and (c) motion artifacts correction. The motion artifacts pixels are detected by comparing the luma difference between a current image frame and a previous image frame; the pixels of the surrounding area are also checked. A smoothing operation is applied to the detected artifacts area, in order to remove isolated pixels and enlarge the detected area. Corrections are then provided using a multistage filter for the luma channel and a mean filter for the chroma channel. | 02-07-2013 |
20130033582 | METHOD OF DEPTH-BASED IMAGING USING AN AUTOMATIC TRILATERAL FILTER FOR 3D STEREO IMAGERS - A system of stereo imagers, including image processing units and methods of blurring an image, is presented. The image is received from an image sensor. For each pixel of the image, a depth filter component is determined based on a focal area of the image and a depth map associated with the image. For each pixel of the image, a trilateral filter is generated that includes a spatial filter component, a range filter component and the depth filter component. The respective trilateral filter is applied to corresponding pixels of the image to blur the image outside of the focal area. A refocus area or position may be determined by imaging geometry or may be selected manually via a user interface. | 02-07-2013 |
20120287316 | RAMP AND SUCCESSIVE APPROXIMATION REGISTER ANALOG TO DIGITAL CONVERSION METHODS, SYSTEMS AND APPARATUS - Successive approximation register (SAR) and ramp analog to digital conversion (ADC) methods, systems, and apparatus are disclosed. An analog voltage signal may be converted into a multiple bit digital value by generating bits of the multiple bit digital value by performing a SAR conversion on the analog voltage signal, where the bits corresponding to a SAR voltage level, and generating other bits of the multiple bit digital value by performing one or more ramp conversions on the analog voltage signal, the ramp conversion comparing the analog voltage signal to a ramp of voltage levels based on the SAR voltage level. The SAR and ramp ADC can provide multi-sampling using one SAR conversion and multiple ramp conversions. The SAR can set the voltage level of a first ramp of a multiple ramp conversion, which can then be used to preset the voltage level prior to subsequent ramps. | 11-15-2012 |
20120281099 | DOUBLE PASS BACK SIDE IMAGE SENSOR SYSTEMS AND METHODS - Double pass back side image (BSI) sensor systems and methods are disclosed. The BSI sensor may include a substrate, pixel reflectors formed on the substrate, and pixel photodiodes fabricated in the substrate, each pixel photodiode positioned over a respective one of the pixel reflectors. Micro-lenses may be formed over each photodiode and an image filter may be formed between the photodiodes and the micro-lenses. The pixels reflectors, photodiodes, micro-lenses, and filter may be formed using CMOS fabrication. | 11-08-2012 |
20120280273 | METHODS AND SUBSTRATES FOR LASER ANNEALING - Methods and substrates for laser annealing are disclosed. The substrate includes a target region to be annealed and a plurality of reflective interfaces. The reflective interfaces cause energy received by the substrate to resonate within the target region. The method includes emitting energy toward the substrate with a laser, receiving the energy with the substrate, and reflecting the received energy with a plurality of reflective interfaces embedded in the substrate to generate a resonance within the target region. | 11-08-2012 |
20120280113 | CORRELATED DOUBLE SAMPLING - Apparatus and a method for correlated double sampling using an up-counter for parallel image sensors. All bits of a counter are set to one. An offset signal is compared to a first reference signal to define a first period during which the counter is incremented. After the first period, all bits of the counter are inverted. A sensor signal is compared to a second reference signal to define a second period during which the counter is incremented to generate a correlated double sampling value. | 11-08-2012 |
20120275929 | FERROFLUID CONTROL AND SAMPLE COLLECTION FOR MICROFLUIDIC APPLICATION - A fluid conveyance system includes a flow passage and a cavity adjacent a side of the flow passage. A wall of the passage includes a flexible section that separates the cavity from the flow passage. The cavity contains a ferrofluidic material. The system further includes at least one magnetic field source positioned adjacent the flow channel. The magnetic field source is operable to move the ferrofluidic material in the cavity to exert a pressure on the flexible section and displace the flexible section into the flow passage to alter the flow of material through the passage. A method of collecting components from a sample volume includes the steps of distributing magnetic particles into the sample volume, capturing the components from the sample volume, and applying a magnetic field to the sample volume to control directional flow of the sample volume. | 11-01-2012 |
20120275725 | SYSTEMS AND METHODS FOR EFFICIENT STORAGE OF IMAGE TRANSFORMATIONS - Systems and methods for generating efficient transformed input image address sets for producing a multi-pane output image from an input image are disclosed. The input address sets may be generated by applying a first transformation corresponding to one pane of the output image to output pixel addresses to create first transformed input addresses, applying a second transformation corresponding to another pane to the output image pixel addresses to create second transformed input addresses, and storing, for one output pixel address, a first transformed image pixel address and a second transformed input pixel address and, for another output pixel address, including a first transformed input pixel address, but no second transformed address. | 11-01-2012 |
20120275667 | CALIBRATION FOR STEREOSCOPIC CAPTURE SYSTEM - Apparatus and a method for generating a rectified image. First pixel information corresponding to a first image is received from a first imager. Second pixel information corresponding to a second image is received from a second imager. A plurality of facial feature points of a portrait in each of the first and second images are identified. A fundamental matrix is generated based on the detected facial features. An essential matrix is generated based on the fundamental matrix. Rotational and translational information corresponding to the first and second imagers are generated based on the essential matrix. The rotational and translational information are applied to at least one of the first and second images to generate at least one rectified image. | 11-01-2012 |
20120274822 | METHOD AND APPARATUS FOR CAPTURING HIGH DYNAMIC RANGE IMAGES USING MULTI-FRAME INTERLACED EXPOSURE IMAGES - An imager includes an array of pixels arranged in rows and a control circuit for sequentially capturing first and second image frames from the array of pixels. The control circuit is configured to sequentially capture first and second pairs of adjacent rows of pixels during first and second exposure times, respectively, when capturing the first image frame. The control circuit is also configured to sequentially capture first and second pairs of adjacent rows of pixels during second and first exposure times, respectively, when capturing the second image frame. The first exposure times during the first and second frames are of similar duration; and the second exposure times during the first and second frames are of similar duration. The control circuit is configured to detect motion of an object upon combining the first and second image frames and, then, correct for the motion of the object. | 11-01-2012 |
20120274817 | METHOD OF SELECTIVE APERTURE SHARPENING AND HALO SUPPRESSION USING CHROMA ZONES IN CMOS IMAGERS - A method of suppressing a dark halo in an imager includes the steps of: extracting an edge value from an image; determining a chroma zone associated with the edge value extracted from the image; and modifying the edge value based on the chroma zone associated with the extracted edge value. The modified edge value from the imager is then provided to a user. The step of determining the chroma zone includes determining a chroma value of Cr and Cb in a Y-Cr-Cb color space; and modifying the edge value includes multiplying the edge value by a predetermined gain value, k, depending on the chroma value of Cr and Cb. If the value of Cr is greater than zero, then the gain value k is set close to zero, in order to suppress the dark halo in the modified edge value. On the other hand, if the value of Cr is less than zero, then the gain value k is set close to one, in order to sharpen the modified edge value in the image. | 11-01-2012 |
20120274744 | STRUCTURED LIGHT IMAGING SYSTEM - Structured light imaging method and systems are described. An imaging method generates a stream of light pulses, converts the stream after reflection by a scene to charge, stores charge converted during the light pulses to a first storage element, and stores charge converted between light pulses to a second storage element. A structured light image system includes an illumination source that generates a stream of light pulses and an image sensor. The image sensor includes a photodiode, first and second storage elements, first and second switches, and a controller that synchronizes the image sensor to the illumination source and actuates the first and second switches to couple the first storage element to the photodiode to store charge converted during the light pulses and to couple the second storage element to the photodiode to store charge converted between the light pulses. | 11-01-2012 |
20120274627 | SELF CALIBRATING STEREO CAMERA - A self calibrating stereo camera includes first and second spatial transform engines for directly receiving first and second images, respectively, of an object. The first and second spatial transform engines are coupled to a stereo display for displaying a fused object in stereo. A calibration module is coupled to the first and second spatial transform engines for aligning the first and second images, prior to display to a viewer. The first and second point extracting modules, respectively, receive the first and second images for extracting interest points from each image. A matching points module is coupled to the first and second point extracting modules for matching the interest points extracted by the first and second point extracting modules. The calibration module determines alignment error between the first and second images, in response to the interest point matches calculated by the matching points module. | 11-01-2012 |
20120274568 | COMPLETE DIGITAL HOLOGRAPHIC IMAGE SENSOR-PROJECTOR COMPUTING UNIT - A hologram projecting system includes a coherent light source for emitting a reference beam onto a real object; and an image sensor for receiving the reference beam and a scattered beam reflected from the real object, and recording a Fourier image of the real object. Also included is a modulator for receiving the Fourier image. The reference beam is passed through the modulator, and configured to interact with the Fourier image to form a virtual image of the real object. The image sensor includes an n×m pixel array, where n and m are numbers of rows and columns, respectively. The modulator includes an n×m pixel array corresponding to the n×m pixel array of the image sensor. The pixels in the n×m pixel array of the image sensor control transmissivity of light in corresponding pixels of the n×m pixel array of the modulator. | 11-01-2012 |
20120273908 | STACKED SENSOR PACKAGING STRUCTURE AND METHOD - Disclosed herein is a stacked chip package including an image sensor including a recess formed on a surface thereof, and a digital signal processor chip that is positioned within the recess. Also disclosed herein is a method of fabricating a stacked chip package including the steps of forming a recess on a surface of an image sensor and positioning a digital signal processor in the recess of the image sensor. | 11-01-2012 |
20120273905 | CFA RESIST SILYLATION FOR LIMITING COLOR INTERACTIONS AND IMPROVING CROSSTALK - An electronic imager includes a pixel sensor array, a plurality elements of a color filter array containing pigments forming multiple color filter patterns on the pixel sensor array and a silylating agent formed between at least first and second elements of the multiple color filter patterns. A method for forming a color filter array on a pixel sensor array of an electronic imager includes forming a pixel sensor array on a substrate, forming a first color filter pattern on the pixel sensor array, depositing a silylating agent on the first color filter pattern, disposing elements of a second color filter pattern on the silylating agent between respective elements of the first color filter pattern and disposing elements of a third color filter pattern on the silylating agent between respective elements of the first color filter pattern. | 11-01-2012 |
20120273854 | GLOBAL SHUTTER PIXEL WITH IMPROVED EFFICIENCY - A global shutter pixel cell includes a serially connected anti-blooming (AB) transistor, storage gate (SG) transistor and transfer (TX) transistor. The serially connected transistors are coupled between a voltage supply and a floating diffusion (FD) region. A terminal of a photodiode (PD) is connected between respective terminals of the AB and the SG transistors; and a terminal of a storage node (SN) diode is connected between respective terminals of the SG and the TX transistors. A portion of the PD region is extended under the SN region, so that the PD region shields the SN region from stray photons. Furthermore, a metallic layer, disposed above the SN region, is extended downwardly toward the SN region, so that the metallic layer shields the SN region from stray photons. Moreover, a top surface of the metallic layer is coated with an anti-reflective layer. | 11-01-2012 |
20120273695 | HIGH RESOLUTION FLUORESCENCE DETECTION SYSTEM - A compact image sensor for imaging radiation emitted by fluorescing objects exposed to excitation light is disclosed. The compact image sensor includes a light guide defining a longitudinal axis for channeling radiation emitted by the fluorescing object; a reflective surface defined on the light guide that is oriented at an angle with respect to the longitudinal axis of the light guide to reflect the excitation light away from a detector of the image sensor; and the detector positioned at an end of the light guide for imaging radiation emitted by the fluorescing object. Also disclosed is a fluorescence imaging system for imaging radiation emitted by a fluorescing object to be imaged by compact image sensor and a method of fluorescence imaging. | 11-01-2012 |
20120273654 | IMAGE SENSOR ARRAY FOR BACK SIDE ILLUMINATION WITH GLOBAL SHUTTER USING A JUNCTION GATE PHOTODIODE - The present invention provides a junction gate photo-diode (JGP) pixel that includes a JGP accumulating charge in response to impinging photons. The JGP is positioned on a substrate and includes a top n layer, a middle p layer and a bottom n layer forming a n-p-n junction, and a control terminal coupled to the top n layer. Also includes is a floating diffusion (FD) positioned on the substrate and coupled to a pixel output line through an amplifier. Also includes is a pinned barrier (PB) and a storage gate (SG) positioned on the substrate between the JGP and the FD. The PB temporarily blocks charge transfer between the JGP and the FD, and the SG stores the accumulated charge from the JGP, and transfers the stored charge to the FD for readout. | 11-01-2012 |
20120273653 | IMAGE SENSOR ARRAY FOR THE BACK SIDE ILLUMINATION WITH JUNCTION GATE PHOTODIODE PIXELS - The present invention relates to a junction gate photo-diode (JGP) pixel that includes a JGP for accumulating charge in response to impinging photons. The JGP is positioned on a substrate and includes a top n layer, a middle p layer and a bottom n layer forming a n-p-n junction, and a control terminal coupled to the top n layer. Also included is a floating diffusion (FD) positioned on the substrate and coupled to a pixel output line through an amplifier. Also included is a pinned barrier (PB) positioned on the substrate between the JGP and the FD, the PB temporarily blocks charge transfer between the JGP and the FD. The accumulated charge is transferred from the JGP to FD by applying a control voltage to the JGP control terminal. | 11-01-2012 |
20120273652 | SYSTEMS AND METHODS FOR IMAGE SENSING - Systems and methods for image sensing are disclosed. An image sensor includes a pixel having an active region and a plurality of reflective interfaces. The active region is configured to convert light absorbed by the pixel into an electrical signal. The plurality of reflective interfaces cause the light absorbed by the pixel to resonate within the active region. A method for converting absorbed light into an electrical signal with an image sensor includes absorbing light with the pixel of the image sensor, and reflecting the absorbed light with a plurality of reflective interfaces embedded in the pixel to generate a resonance within the active region. | 11-01-2012 |
20120273651 | DUAL CONVERSION GAIN PIXEL METHODS, SYSTEMS, AND APPARATUS - Dual conversion gain pixel methods, system, and apparatus are disclosed. Dual conversion gain may be obtained by configuring an active pixel having a storage node, a first connection region, a second connection region, and a capacitor coupled between the storage node and the second connection region to introduce a first conversion gain by connecting the first connection region to a power source and connecting the second connection region to a current bias source and reconfiguring the active pixel to introduce a second conversion gain by connecting the second connection region to the power source and connecting the first connection region to the current bias source. | 11-01-2012 |
20120249851 | ECLIPSE DETECTION USING DOUBLE RESET SAMPLING FOR COLUMN PARALLEL ADC - An imager includes a column line connected to a pixel array for providing a pixel output signal. The pixel output signal is sampled during reset and readout phases. An analog-to-digital converter (ADC), which is coupled to the column line, samples the pixel output signal and provides a digital output signal. The ADC is configured to sample the pixel output signal twice, during the reset phase, in order to detect eclipse in the pixel output signal. The ADC includes a comparator, sequentially operated by a reset control, for comparing a first pixel output voltage and a second pixel output voltage, respectively, during the reset phase. The comparator is configured to provide an output bit indicating detection of an eclipse, based on a difference between the first and second pixel output voltages. | 10-04-2012 |
20120249842 | CMOS IMAGE SENSOR WITH BUILT IN CORRECTION FOR COLUMN FAILURE - A system for correcting a column line failure in an imager includes a pixel selection circuit configured to receive three adjacent pixel output signals, P(n−1), P(n) and P(n+1), respectively, from three adjacent column lines, (n−1) | 10-04-2012 |
20120249828 | APPARATAUS AND METHOD OF AUTOMATIC COLOR SHADING REMOVAL IN CMOS IMAGE SENSORS - A method of processing an image includes the steps of separating an image into multiple color channels, and dividing the image into multiple zones, in which each zone includes a sub-array of pixels. The method then calculates a color shading profile for each zone. The color shading profile is calculated as a linear function, typically a straight line. If a linear function cannot be determined for that zone, the method interprets a function for that zone using the nearest zone neighbors. The method corrects the color shading using the functions calculated for the respective zones. | 10-04-2012 |
20120243791 | METHOD AND APPARATUS FOR CLASSIFYING IMAGE PIXELS - A method of classifying pixels in an image is described that includes calculating for each target pixel in the image, a functional value based on a median value of a block of pixels including the target pixel and storing the functional value for each pixel. Pixels in the image are then analyzed to determine if they correspond to edges in the image and if so, are classified as edge pixels. Next the stored functional values are analyzed to define a flat area delimiting function for the image. The stored functional values that do not correspond to edge pixels are then analyzed to define an image detail delimiting function and the non-flat area pixels are classified as being either flat area pixels or detail pixels based on the flat area delimiting function and the detail delimiting function. | 09-27-2012 |
20120242665 | CONTRAST MATCHING FOR STEREO IMAGE - Apparatus and a method for matching contrast between images of a stereo image pair. A first contrast value corresponding to first pixel information of first image is determined and a second contrast value corresponding to second pixel information of second image is determined. The first and second contrast values are compared and the image having the lower contrast value is selected for compensation. A tone mapping function is generated and applied to the pixel information corresponding to the selected image for generating compensated image pixel information corresponding to the selected image. | 09-27-2012 |
20120241591 | PUMPED PINNED PHOTODIODE PIXEL ARRAY - The present invention relates to a pumped pixel that includes a first photo-diode accumulating charge in response to impinging photons, a second photo-diode and a floating diffusion positioned on a substrate of the pixel. The pixel also includes a charge barrier positioned on the substrate between the first photo-diode and the second photo-diode, where the charge barrier temporarily blocks charge transfer between the first photo-diode and the second photo-diode. Also included is a pump gate positioned on the substrate adjacent to the charge barrier. The pump gate pumps the accumulated charge from the first photo-diode to the second photo-diode through the charge barrier in response to a pump voltage applied by a controller. Also included is a transfer gate positioned on the substrate between the second photo-diode and the floating diffusion. The transfer gate transfers the pumped charge from the second photo-diode to the floating diffusion in response to a transfer voltage applied by a controller. | 09-27-2012 |
20120195521 | ROW NOISE FILTERING - Apparatus and a method for processing image data where row data is received corresponding to a target row of pixels and to one or more reference rows of pixels. A target row average is generated based on the target row data and a reference row average is generated for each of the one or more reference rows based on each reference row's respective row data. A row correction value is generated based on the target row average of the target row and the reference row average of the one or more reference rows. Corrected target row data is generated by applying the row correction value to the target row data. | 08-02-2012 |
20120188430 | IMAGER PIXEL ARCHITECTURE WITH ENHANCED COLUMN DISCHARGE AND METHOD OF OPERATION - A pixel circuit includes a photosensor and a floating diffusion node. A circuit is coupled to the floating diffusion node, for selectively providing a pixel output signal to a column line. A reset circuit, which resets the floating diffusion node, is configured to be activated by the column line. A pullup circuit is included for controlling the reset circuit through a signal on the column line. A discharge circuit, which is separate from the reset circuit, is used for discharging the pixel output signal on the column line. The discharge circuit includes a transistor having a first source/drain terminal coupled to the column line and a second source/drain terminal coupled to a fixed voltage level. The gate of the transistor activates the discharging of the column line. | 07-26-2012 |
20120188424 | COMMON ELEMENT PIXEL ARCHITECTURE (CEPA) FOR FAST SPEED READOUT - The present invention relates to a common element pixel architecture (CEPA) imager. The CEPA includes a first column of pixels and a second column of pixels. The CEPA also includes a first column line and a second column line. A first group of pixels is arranged including pixels from the first column and the second column coupled to the first column line. A second group of pixels is arranged including other pixels from the first column and the second column coupled to the second column line. | 07-26-2012 |
20120188415 | DIGITALLY GRADED NEUTRAL DENSITY FILTER - Apparatus and a method for performing neutral density filtering in a digital camera. The camera includes a pixel array having rows and columns of pixels. The pixels in the array may be reset and read with variable timing between the reset operation and the read operation. The timing between the reset and read operations is controlled to implement a neutral density filtering operation. | 07-26-2012 |
20120188400 | PIXEL ARRANGEMENT FOR EXTENDED DYNAMIC RANGE IMAGING - The present invention relates to an imager for improving image quality. The imager includes a pixel array of a plurality of pixels arranged in rows and columns. The imager also includes a color filter array (CFA) including a color pattern of a first color filter allowing a first pixel to detect a first color of light, and a second color filter allowing a second pixel to detect a second color of light and a third color of light. Each of the color filters in the color pattern are included in each row of the pixel array. | 07-26-2012 |
20120187936 | SYSTEM AND METHOD FOR BIASING ANALOG CIRCUITRY IN A DISTRIBUTED POWER DELIVERY NETWORK FOR IMAGE SENSORS AND OTHER CIRCUIT STRUCTURES - A distributed power supply delivery network includes an analog biased circuit array having current sources for delivering current to adjacent circuits, and a resistive ladder of resistor elements, where each resistor element is disposed between adjacent current sources. A tuned IR voltage drop network is included to match voltage drops across the resistive ladder. The tuned IR voltage drop network includes series connected resistors and a static current draw to induce the IR drop. The resistors may be matched with respect to the distributed power supply delivery system. The current source providing the static current for the IR drop may be programmed based on the power supply delivery load, in order to adjust the voltage drop across the biasing delivery route and match the voltage drop in the referenced power supply. | 07-26-2012 |
20120186741 | APPARATUS FOR WAFER-TO-WAFER BONDING - An apparatus for bonding semiconductor wafers together including a moveable upper bond head and a resilient member positioned on a surface of the bond head for contacting a first wafer that is positioned at an elevation below the upper bond head. The resilient member is configured to apply a force onto a top side surface of the first wafer thereby compressing the first wafer against a second wafer that is positioned at an elevation below the first wafer. A method of wafer to wafer bonding includes the steps of positioning at least two wafers beneath the moveable upper bond head, positioning the resilient member in physical contact with one of the at least two wafers, and resiliently deforming the resilient member as it is moved into contact with the wafer to facilitate bonding of the wafers. | 07-26-2012 |
20120133794 | SYSTEMS AND METHODS FOR PROVIDING SHIFTABLE COLUMN CIRCUITRY OF IMAGER PIXEL ARRAYS - This is generally directed to systems and methods for providing shiftable column circuitry for a pixel array of an imaging system. Columns of a pixel array can be switchably coupled (e.g., through multiplexers) to their default column circuitry as well as coupled to one or more instances of a neighboring column's column circuitry. In response to an instance of default column circuitry being identified as defective, its corresponding column may “shift” and choose to couple to the neighboring column circuitry. Similarly, all following columns may also shift and couple to a neighboring column circuitry. In some embodiments, the defective column circuitry can be identified during wafer testing and identifying information (e.g., an address) of the defective column circuitry stored in memory. The identifying information may then be accessed from memory and, during an image signal readout phase, used to suitably shift the columns to avoid the defective column circuitry. | 05-31-2012 |
20120092532 | IMAGING SYSTEMS AND METHODS FOR PROVIDING A SWITCHABLE IMPEDANCE TO GROUND - This is generally directed to a switchable impedance to ground. In particular, a pixel array can be coupled to and surrounded by a ground ring. The ground ring can be coupled to a switchable impedance to ground. During a correlated double sampling (“CDS”) phase of the pixel array, the switchable impedance can be set to a high resistance value. For example, the switchable impedance can be set to 500 ohms. During an analog-to-digital conversion (“ADC”) readout phase of the pixel array, however, the switchable impedance can be set to a low resistance value. For example, the switchable impedance can be set to 1-10 ohms. Setting the switchable impedance to the high impedance value during the CDS phase can prevent imaging errors such as black hole artifacts. Setting the switchable impedance to the low impedance value during the ADC readout phase can, for example, prevent errors due to ground drift. | 04-19-2012 |
20120091317 | IMAGING SYSTEMS AND METHODS INCLUDING PIXEL ARRAYS WITH REDUCED NUMBERS OF METAL LINES AND CONTROL SIGNALS - This is generally directed to systems and methods for reduced metal lines and control signals in an imaging system. For example, in some embodiments a pixel cell of an imaging system can operate without a row select transistor, and therefore can operate without a row select metal control line. As another example, in some embodiments a pixel cell can share its reset transistor control line with a transfer transistor control line of another pixel cell. In this manner, an imaging system can be created that averages a single metal line per pixel cell. In some embodiments, operation of such reduced-metal line imaging systems can use modified timing schemes of control signals. | 04-19-2012 |
20120019669 | SYSTEMS AND METHODS FOR CALIBRATING IMAGE SENSORS - Systems and methods are provided for calibrating image sensors. In some embodiments, a processing module of an image system can automatically perform a self-calibration process after a production unit of an image sensor has been integrated into an end product system. For example, the processing module can calibrate a production unit based on one or more reference pixels of the production unit, where the one or more reference pixels have minimal color filtration. In some embodiments, the processing module may perform local calibrations by correcting specifically for spatial variations in a color filter array (“CFA”). In some embodiments, the processing module can perform global calibrations by correcting for optical density variations in the CFA. In some embodiments, a processing module can determine whether the cause of production variations is related to production variations of a CFA or production variations of an infrared (“IR”) cutoff filter. | 01-26-2012 |
20110317048 | IMAGE SENSOR WITH DUAL LAYER PHOTODIODE STRUCTURE - An image system with a dual layer photodiode structure is provided for processing color images. In particular, the image system can include an image sensor that can include photodiodes with a dual layer photodiode structure. In some embodiments, the dual layer photodiode can include a first layer of photodiodes (e.g., a bottom layer), an insulation layer disposed on the first layer of photodiodes, and a second layer of photodiodes (e.g., a top layer) disposed on the insulation layer. The first layer of photodiodes can include one or more suitable pixels (e.g., green, blue, clear, luminance, and/or infrared pixels). Likewise, the second layer of photodiodes can include one or more suitable pixels (e.g., green, red, clear, luminance, and/or infrared pixels). An image sensor incorporating dual layer photodiodes can gain light sensitivity with additional clear pixels and maintain luminance information with green pixels. | 12-29-2011 |
20110310278 | SYSTEMS AND METHODS FOR ADAPTIVE CONTROL AND DYNAMIC RANGE EXTENSION OF IMAGE SENSORS - Systems and methods are provided for obtaining adaptive exposure control and dynamic range extension of image sensors. In some embodiments, an image sensor of an image system can include a pixel array with one or more clear pixels. The image system can separately control the amount of time that pixels in different lines of the pixel array are exposed to light. As a result, the image system can adjust the exposure times to prevent over-saturation of the clear pixels, while also allowing color pixels of the pixel array to be exposed to light for a longer period of time. In some embodiments, the dynamic range of the image system can be extended through a reconstruction and interpolation process. For example, a signal reconstruction module can extend the dynamic range of one or more green pixels by combining signals associated with green pixels in different lines of the pixel array. | 12-22-2011 |
20110285737 | SYSTEMS AND METHODS FOR LOCAL TONE MAPPING OF HIGH DYNAMIC RANGE IMAGES - This is generally directed to systems and methods for local tone mapping of high dynamic range (“HDR”) images. For example, a HDR image can have its larger dynamic range mapped into the smaller dynamic range of a display device. In some embodiments, to perform the local tone mapping, a RGB to Y converter can be used to convert the input image signal to a luminance signal in the YCgCo color space, a shape adaptive filter can be used to separate the luminance signal into its illumination and reflectance components, contrast compression can be applied to the illumination component, image sharpening can be applied to the reflectance component, and the processed illumination and reflection components can be used to calculate a processed RGB signal. The dynamic range of the processed RGB signal can then be mapped into the dynamic range of the display device. | 11-24-2011 |
20110273546 | SYSTEMS AND METHODS FOR PRESENCE DETECTION - Systems and methods are provided for presence detection using an image system. The image system may be a camera that is integrated into an electronic device. In some embodiments, the image system can accommodate multiple operating modes of the electronic device. For example, when the electronic device is operating in a normal power mode, control circuitry of the image system can detect when a user has left and is no longer using the electronic device. When the electronic device is operating in a power saving mode, the control circuitry can detect user presence (e.g., when a user has come back to the electronic device). In some embodiments, the control circuitry can adjust for both gradual and sudden light changes. | 11-10-2011 |
20110264722 | SYSTEMS AND METHODS FOR AN ADJUSTABLE FILTER ENGINE - Systems and methods are provided for an adjustable filter engine. In particular, an electronic system is provided that can include a focus module, memory, and control circuitry. In some embodiments, the focus module can include an adjustable filter engine and a motor. By using the adjustable filter engine to generate a filter with a large number of filter coefficients, the control circuitry can accommodate a variety of system characteristics. For example, by generating a set of cumulative coefficients and re-arranging the order of the cumulative coefficients, the control circuitry can reduce the bit-width requirements of the adjustable filter engine hardware. For instance, the control circuitry can reduce the number of multipliers required to perform a convolution between an updated filter and one or more input signals. In some embodiments, the updated filter can be generated to reduce oscillations of the motor movement due to a new position request. | 10-27-2011 |
20110182474 | EFFICIENT SYSTEM AND METHOD FOR FACE TRACKING - A method of scanning a scene using an image sensor includes (a) dividing the scene into multiple first portions; and scanning a first portion for presence of objects in an object class. The method further includes continuing the scanning of the multiple first portions for presence of other objects in the scene. The method also selects a second portion of the scene, in response to detecting an object in the first portion; and then tracking the object in the selected second portion. The second portion of the scene is selected based on estimating motion of the object detected in the first portion, so that it may still be located in the second portion. | 07-28-2011 |
20110128407 | SYSTEMS AND METHODS FOR IMAGE RESTORATION - Systems and methods are provided for focus recovery of multi-channel images. Control circuitry of an imaging system can restore an image by removing image blurring introduced by the lens, sensor noise introduced by the sensor, and a signal offset between multiple channels of the image. In some embodiments, the control circuitry can calculate one or more estimates of a signal offset of multiple observed signals. Using statistics generated from offset-removed signals, the control circuitry can generate one or more recovery kernels which can be applied to offset-removed signals to generate recovered signals. In other embodiments, instead of explicitly removing a signal offset from each observed signal, the control circuitry can implicitly remove the signal offset when calculating the first and second order statistics of one or more observed signals. | 06-02-2011 |
20110127628 | ION IMPLANTATION TO CHANGE THE OPTICAL PROPERTIES OF THE PASSIVATION FILMS IN CMOS IMAGER DEVICES - Imager sensor pixels, image sensor and methods for forming image sensors. An image sensor pixel includes a photosensor, a microlens that receives incident light, at least one fabrication layer between the photosensor and the microlens and a passivation layer between the microlens and the at least one fabrication layer. The passivation layer includes a plurality of impurities and passes the incident light from the microlens to the photosensor without substantially redirecting the incident light. | 06-02-2011 |
20110119405 | SYSTEMS AND METHODS FOR ADDRESSING AND SYNCHRONIZING MULTIPLE DEVICES - This is generally directed to systems and methods for control of two or more devices through a shared control bus. For example, the devices can be coupled to a host system through the control bus. In some embodiments, the devices can be configured by the host system through address select pins of the devices. For example, the host system can sequentially program each device to change its default address to a unique address. In some embodiments, an event can be propagated through each device, thus resulting in each device receiving the event at a different time. In some embodiments, configuration by the host system can include programming each device with a value representing its own position in the chain. In this case, a device can use this value to delay its response to the event, thereby allowing all the devices in the chain to respond to the event simultaneously. | 05-19-2011 |
20110054872 | OPTICAL SIMULATOR USING PARALLEL COMPUTATIONS - Systems and methods are provided for performing optical simulations using parallel computations. In some embodiments, the optical simulations can be performed on a computer system using raw image data provided by a camera. The computer system may include a central processing unit (CPU) and a graphics processing unit (GPU), where the GPU may be configured for the parallel computations. The CPU can build a lookup table of lens characterization data, such as point spread function (PSF) data. Using the lookup table, the GPU can perform the optical simulations. For example, the GPU can compute a plurality of convolutions in parallel, each using PSF data and a window of pixels. The result of each convolution may produce a pixel value that approximates the effect of the lens on that pixel. | 03-03-2011 |
20110032413 | AUTO-FOCUSING TECHNIQUES BASED ON STATISTICAL BLUR ESTIMATION AND ASSOCIATED SYSTEMS AND METHODS - This is generally directed to auto-focusing techniques based on statistical blur estimation. An image can be captured at two or more candidate lens positions. The amount of blur of each image can then be determined, and the image containing the least amount of blur can be chosen as the “in-focus” image. In some embodiments, the amount of blur of an image can be determined by identifying how “Gaussian” an image is. Characteristics that are more Gaussian in nature can indicate that the image is more blurry. The Gaussianity of an image can be determined by estimating a generalized Gaussian shape parameter for that image. A smaller shape parameter can indicate the image is less Gaussian in nature. The shape parameter can be estimated in any suitable manner such as, for example, through a 2-d discrete wavelet transform, through a 1-d discrete wavelet transform, or through any other suitable manner. | 02-10-2011 |
20100316254 | USE OF Z-ORDER DATA IN AN IMAGE SENSOR - Systems and methods are provided for detecting objects of an object class, such as faces, in an image sensor. In some embodiments, the image sensor can include a detector with an image buffer. The image buffer can store image data in raster order. The detector can read the data out in Z order to perform object detection. The image data can then compute feature responses using the Z-ordered image data and determine whether any objects of the object class are present based on the feature responses. In some embodiments, the detector can downscale the image data while the object detection is performed and use the downscaled image data to continue the detection process. In some embodiments, the image data can perform detection even if the image is rotated. | 12-16-2010 |
20100315523 | OBJECT DETECTION USING AN IN-SENSOR DETECTOR - Systems and methods are provided for detecting an object of object class, such as faces, in an image sensor. In some embodiments, the image sensor can provide a scan sequence that scans a scene over multiple time intervals. The image sensor can scan, in succession, portions of a scene, where each of the portions covers a different amount or location of the scene. This way, the scanned portions can be saved in an image buffer that is sized significantly smaller than an entire frame. In some embodiments, when the image sensor detects the presence of an object of the object class, the image sensor can store positional information (e.g., location and size of the object) in a region of interest buffer. The image sensor can output the positional information to aid an electronic device, such as a camera, perform various functions, such as automatic exposure and color balancing. | 12-16-2010 |
20100310190 | SYSTEMS AND METHODS FOR NOISE REDUCTION IN HIGH DYNAMIC RANGE IMAGING - This is generally directed to systems and methods for noise reduction in high dynamic range (“HDR”) imaging systems. In some embodiments, multiple images of the same scene can be captured, where each of the images is exposed for a different amount of time. An HDR image may be created by suitably combining the images. However, the signal-to-noise ratio (“SNR”) curve of the resulting HDR image can have discontinuities in sections of the SNR curve corresponding to shifts between different exposure times. Accordingly, in some embodiments, a noise model for the HDR image can be created that takes into account these discontinuities in the SNR curve. For example, a noise model can be created that smoothes the discontinuities of the SNR curve into a continuous function. This noise model may then be used with a Bayer Filter or any other suitable noise filter to remove noise from the HDR image. | 12-09-2010 |
20100303383 | SYSTEMS AND METHODS FOR THE EFFICIENT COMPUTATION OF IMAGE TRANSFORMS - Image transforms that can be performed through a reverse lookup process in which output pixel addresses of an output image are reverse transformed into input pixel addresses. In some embodiments, rather than reverse transforming all output pixel addresses, a subset of output pixel addresses can be reverse transformed to calculate transformed addresses. The reverse transforms of all output pixel address may then be approximately calculated by interpolating the transformed addresses. The approximately transformed addresses can then be used as read addresses to a memory storing the input image. | 12-02-2010 |
20100225243 | METHOD AND SYSTEM FOR CONTROLLING POWER TO PIXELS IN AN IMAGER - A system for controlling power applied to pixels in an imager. A first switch coupling the internal power node of the pixels to the power supply of the imager. A second switch coupling the internal power node of the pixels to a ground potential or low potential. The first and second switches are controlled complimentary to each other during integration and readout of the pixels. A third switch providing a high impedance mode where the internal power node and n+ guard ring are isolated from the operating and ground potentials. | 09-09-2010 |
20100177203 | APPARATUS AND METHOD FOR LOCAL CONTRAST ENHANCED TONE MAPPING - Methods and systems for enhancing an image. Respective local contrast values are determined for selected pixels of the image by, for each selected pixel, adjusting a respective luminance value of the pixel by an average luminance value of neighboring pixels to obtain the local contrast value. Respective tone-mapped values are determined for further selected pixels in the image based on a global luminance value representing the image. The local contrast values and the tone-mapped values are combined, respectively, for the corresponding pixels in the image to produce the enhanced image. | 07-15-2010 |
20100110254 | VLN BIASING SCHEME TO ACHIEVE LOW VERTICAL SHADING FOR HIGH-SPEED AND LARGE-FORMAT CMOS IMAGE SENSORS WITH TOP/BOTTOM READOUT SCHEME - A VLN biasing scheme implemented in an image sensor with top/bottom readout. A first and second current sink coupled to the top of a first column of pixels and a second column of pixels respectively. A third and fourth current sink coupled to the bottom of a first column of pixels and a second column of pixels respectively. During column readout, each current sink sinks an equal amount of current. | 05-06-2010 |
20100110241 | MULTI ILLUMINANT SHADING CORRECTION USING SINGULAR VALUE DECOMPOSITION - Methods and systems for determining shading correction coefficients of an imaging device. An inversion surface is determined based on an image captured by the imaging device. The inversion surface is approximated using the captured image and eigenvectors associated with singular values of the inversion surface, to form multiple reconstruction weights. A polynomial fit is applied to: i) the multiple reconstruction weights to determine a first set of polynomial coefficients and ii) the eigenvectors to determine a second set of polynomial coefficients. The first and second sets of polynomial coefficients are used to form the shading correction coefficients. | 05-06-2010 |
20100014779 | METHOD AND SYSTEM FOR REDUCING ARTIFACTS IN IMAGE DETECTION - An imager captures light reflecting off an object of interest and generates two or more images of the object. A controller identifies one or more non-interpretation regions in one of the captured images and uses the non-interpretation regions to reduce a number of artifacts in a final image. | 01-21-2010 |
20100002126 | SYSTEM AND METHOD FOR FOCUSING A DIGITAL CAMERA - A method of focusing a digital camera module with an image sensor including capturing an image of a test target with the digital camera module, determining a focus quality of the image with the image sensor, outputting a signal related to the focus quality of the image from the digital camera module to a focusing station external to the digital camera module, and determining whether a position of a lens from the image sensor within the digital camera module should be altered to improve a focus quality of subsequently captured images. | 01-07-2010 |
20090207284 | METHOD AND APPARATUS FOR CONTROLLING ANTI-BLOOMING TIMING TO REDUCE EFFECTS OF DARK CURRENT - An electronic imager includes a plurality of pixels having photosensors for accumulating charge corresponding to individual pixel values of a sensed image. Each of the pixels includes an anti-blooming function which allows charge in excess of a predetermined amount to be drained from the photosensor thus reducing the charge from the pixel that migrates to adjacent pixels. The imager also includes circuitry which controls the anti-blooming function in response to image intensity to reduce dark current in the imager caused by the anti-blooming function. | 08-20-2009 |
20090140660 | PULSE-CONTROLLED LIGHT EMITTING DIODE SOURCE - A light-emitting diode array is driven by a digital control. The digital control modulates the pulse width of pulses applied to the light-emitting diode. The intensity of the output is controlled by controlling the width of pulses applied to the light-emitting diode. Since light-emitting diodes have very low inertial energy, this system can be rapidly turned on and turned off. The output is integrated to produce a uniform output. | 06-04-2009 |
20090081822 | OPTICAL ENHANCEMENT OF INTEGRATED CIRCUIT PHOTODETECTORS - A semiconductor integrated circuit structure and method for fabricating. The semiconductor integrated circuit structure includes a light sensitive device integral with a semiconductor substrate, a cover dielectric layer disposed over the light sensitive device, and a lens-formation dielectric layer disposed over the cover dielectric layer. Light is transmittable though the cover dielectric layer, and through the lens-formation dielectric layer. The lens-formation dielectric layer forms an embedded convex microlens. The microlens directs light onto the light sensitive device. | 03-26-2009 |