Patent application number | Description | Published |
20100038666 | Lens Arrangement and LED Display Device - A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens. | 02-18-2010 |
20100065879 | Optoelectronic Device with Housing Body - A housing body for an optoelectronic component comprises a main surface having a first area region and a second area region. The first area region and the second area region form a step in the main surface. The first area region and the second area region adjoin one another by means of an outer edge. The second area region and the outer edge enclose the first area region. | 03-18-2010 |
20100193815 | Method for the Manufacture of an Optoelectronic Component and an Optoelectronic Component - A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element. | 08-05-2010 |
20100230697 | OPTO-ELECTRONIC SEMICONDUCTOR MODULE AND METHOD FOR THE PRODUCTION THEREOF - An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate. | 09-16-2010 |
20110002587 | Housing for an Optoelectronic Component and Arrangement of an Optoelectronic Component in a Housing - A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component. | 01-06-2011 |
20110186867 | Arrangement Having at Least Two Light-Emitting Semiconductor Components and Method for the Production of Such an Arrangement - An arrangement having at least two light-emitting semiconductor components ( | 08-04-2011 |
20110266559 | Semiconductor Component, Reflected-Light Barrier and Method for Producing a Housing Therefor - The application relates to a semiconductor component, a photo-reflective sensor, and also a method for producing a housing for a photo-reflective sensor, wherein the housing lower part is monolithic and has at least two cavities into which an emitter and a detector are introduced. | 11-03-2011 |
20110266571 | Semiconductor Arrangement - According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof. | 11-03-2011 |
20110266576 | Optoelectronic Semiconductor Component - An optoelectronic semiconductor device at least one radiation-emitting semiconductor chip ( | 11-03-2011 |
20110297999 | Optoelectronic Semiconductor Component - An optoelectronic semiconductor component is provided, having a connection carrier ( | 12-08-2011 |
20120112337 | Optoelectronic Component, and Method for the Production of an Optoelectronic Component - An optoelectronic component ( | 05-10-2012 |
20120113668 | HEADLIGHT COMPRISING A PLURALITY OF LUMINESCENCE DIODE EMITTERS - A headlight includes a plurality of luminescence diode emitters. At least one first group of the luminescence diode emitters is arranged in a matrix having at least two columns and at least two rows, wherein in the first group the electrical connections of a first connection type of the luminescence diode emitters of a column and the electrical connections of a second connection type of the luminescence diode emitters of a row are in each case electrically connected to one another. The electrical connections of the first connection type of different columns and the electrical connections of the second connection type of different rows of the matrix are electrically insulated from one another. | 05-10-2012 |
20120161162 | Optoelectronic Semiconductor Component - An optoelectronic semiconductor device is specified, comprising a multiplicity of radiation-emitting semiconductor chips ( | 06-28-2012 |
20130256862 | Support Device for a Semiconductor Chip and Optoelectronic Component with a Carrier Device and Electronic Component with a Carrier Device - A carrier device for a semiconductor chip includes a bondable and/or solderable metallic carrier having a mounting region for the semiconductor chip and a soldering region. The carrier is at least partly covered with a covering material. A solder barrier is arranged between the soldering region and the mounting region at an interface between the carrier and the covering material. An electronic component and an optoelectronic component are furthermore specified. | 10-03-2013 |