Patent application number | Description | Published |
20100084467 | RFID Tag and Driving Method Thereof - The wireless tag includes a circuit which receives an AC signal from the outside and detects an envelope, a detection circuit which detects the level of electric power supplied from the outside and outputs a potential corresponding to the detected electric power, a protection circuit which changes an impedance of a circuit receiving the electric power in accordance with the electric power output from the detection circuit, a selection circuit portion which selects whether the electric power output from the detection circuit is input to the protection circuit. | 04-08-2010 |
20120206036 | Lighting Device - The lighting device includes a layer containing a light-emitting organic compound which is provided over a substrate; a first barrier layer covering the layer containing a light-emitting organic compound; a second barrier layer provided over the first barrier layer; a sealant provided between the first barrier layer and the second barrier layer; a resin layer including a desiccant which is surrounded by the first barrier layer, the second barrier layer, and the sealant; and a resin substrate which is provided over the second barrier layer and has a first uneven structure on a surface in contact with the second barrier layer and a second uneven structure on a surface in contact with the air, and the second uneven structure has a larger height difference than the first uneven structure. | 08-16-2012 |
20120223350 | Light-Emitting Device, Lighting Device, Substrate, and Manufacturing Method of Substrate - To provide a substrate which is light and has high reliability and high light extraction efficiency from an organic EL element. To provide a substrate which includes a protective layer in a resin layer, an uneven structure on a light incident surface, and an opening which surrounds the uneven structure and through which the protective layer is exposed. To provide a light-emitting device which includes a resin layer provided with an uneven structure on a light incident surface over a protective layer, and a light-emitting element in the protective layer and a counter substrate which are bonded with a sealant. The protective layer and the resin layer have a property of transmitting visible light. The light-emitting element includes a light-transmitting first electrode over a resin layer, a layer containing a light-transmitting organic compound over the first electrode, and a second electrode over the layer containing a light-transmitting organic compound. | 09-06-2012 |
20130048967 | Light-Emitting Device, Electronic Device, Lighting Device, and Method for Manufacturing the Light-Emitting Device - A light-emitting device in which deterioration of an organic EL element due to impurities such as moisture or oxygen is suppressed is provided. The light-emitting device includes a first substrate and a second substrate facing each other, a light-emitting element provided over the first substrate, a first sealant provided so as to surround the light-emitting element, and a second sealant provided so as to surround the first sealant. One of the first sealant and the second sealant is a glass layer and the other is a resin layer. A dry agent is provided in a first space surrounded by the first sealant, the second sealant, the first substrate, and the second substrate, or in the resin layer. The light-emitting element is included in a second space surrounded by the first sealant, the first substrate, and the second substrate. | 02-28-2013 |
20130049062 | Light-Emitting Device - To provide a highly reliable light-emitting device with less occurrence of cracks in a sealant bonding two facing substrates together. In a light-emitting device, a first substrate including a light-emitting unit, and a second substrate are bonded to each other with glass frit. A wiring in the area overlapping with a sealing material formed by melting and solidifying glass frit may be formed of a conductive material having a linear thermal expansion coefficient close to that of a substrate material. More specifically, the difference in the linear thermal expansion coefficient between the conductive material and the substrate material is 5 ppm/K or less at a temperature of 0° C. to 500° C. | 02-28-2013 |
20130134397 | Sealed Structure, Light-Emitting Device, Electronic Device, and Lighting Device - A sealed structure with high sealing capability, in which a pair of substrates is attached to each other with a glass layer is provided. The sealed structure has a first and second substrates, a first surface of the first substrate facing a first surface of the second substrate, and the glass layer which is in contact with the first and second substrates, defines a space between the first and second substrates, and is provided along the periphery of the first surface of the first substrate. The first substrate has a corner portion. The area of the first surface of the first substrate is smaller than or equal to that of the first surface of the second substrate. In at least one of respective welded regions between the glass layer and the first or second substrate, the width of the corner portion is larger than that of the side portion. | 05-30-2013 |
20130134398 | Sealed Structure, Light-Emitting Device, Electronic Device, and Lighting Device - A sealed structure which has high sealing capability and whose border can be slim is provided. The sealed structure includes a pair of substrates whose respective surfaces face each other with a space therebetween, and a glass layer which is in contact with the substrates, defines a space between the substrates, and has at least one corner portion and side portions in continuity with the corner portion. The width of the corner portion of the glass layer is smaller than or equal to that of the side portion of the same. The sealed structure may comprise a highly reliable light-emitting element including a layer containing a light-emitting organic compound provided between a pair of electrodes. | 05-30-2013 |
20130134570 | Sealed Body, Light-Emitting Module and Method of Manufacturing Sealed Body - A sealed body in which sealing is uniformly performed is provided. A light-emitting module in which sealing is uniformly performed is provided. A method of manufacturing the sealed body in which sealing is uniformly performed is provided. The sealed body comprises a first substrate alternately provided with a high-reflectivity region with respect to the energy ray and a low-reflectivity region with respect to the energy ray so as to overlap with a sealant surrounding a sealed object, and a second substrate capable of transmitting the energy ray. The sealed object is sealed between the first substrate and the second substrate by heating the sealant with irradiation with the energy ray through the second substrate. | 05-30-2013 |
20130300284 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and reliability is provided. Further, a light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and hermeticity is provided. In the light-emitting device in which a light-emitting region including a transistor and a light-emitting element is sealed between a first flexible substrate and a second flexible substrate, an opening is provided in the second flexible substrate around a region overlapping with the light-emitting region, the opening is filled with frit glass containing low-melting glass and bonding the first flexible substrate and the second flexible substrate, and the frit glass is provided so as to be in contact with an insulating layer provided over the first flexible substrate. The second flexible substrate may include an opening in a region overlapping with the light-emitting region. | 11-14-2013 |
20140027743 | Sealing Structure and Organic Electroluminescence Device - A sealing structure with high air-tightness and an organic electroluminescence device with high air-tightness are provided regardless of a pattern of a first metal layer overlapping with glass frit. A second metal layer is provided in a region where a common power supply line overlaps with the glass frit. Since laser light is absorbed or reflected by the second metal layer, the glass frit can be uniformly heated. Therefore, an object to be sealed can be sealed with a low-melting-point glass in which a crack is not easily generated. | 01-30-2014 |
20150069449 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and reliability is provided. Further, a light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and hermeticity is provided. In the light-emitting device in which a light-emitting region including a transistor and a light-emitting element is sealed between a first flexible substrate and a second flexible substrate, an opening is provided in the second flexible substrate around a region overlapping with the light-emitting region, the opening is filled with frit glass containing low-melting glass and bonding the first flexible substrate and the second flexible substrate, and the fit glass is provided so as to be in contact with an insulating layer provided over the first flexible substrate. The second flexible substrate may include an opening in a region overlapping with the light-emitting region. | 03-12-2015 |