Patent application number | Description | Published |
20080200102 | Polishing pad, use thereof and method for manufacturing the same - The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; and a buffer layer formed between the base material and an upper surface of the membrane with low permeability and embedded into the fibers of the base material. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. | 08-21-2008 |
20080200105 | Carrier film for mounting polishing workpiece and method for making the same - The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate comprises holes, and the material of the surface substrate comprises elastomer. The buffer substrate comprises holes, and the material of the buffer substrate comprises the elastomer. The surface substrate and the buffer substrate are adhered with adhesive comprising the elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece. | 08-21-2008 |
20080220701 | Polishing Pad and Method for Making the Same - A method for making a polishing pad includes providing a non-woven fabric made of a plurality of fibers. The non-woven fabric is submerged with a polymer resin solution. The polymer resin submerged in non-woven fabric is cured to form a porous polymer having an outer face adapted for polishing a workpiece. The outer face of the porous polymer is finished to form a polishing pad with a plurality of naps on the outer face. The plurality of naps on the outer face have a density ranging from 1.0 to 2.0 g/cm3, and the plurality of naps on the outer face have a length ranging from 50 to 600 μm. | 09-11-2008 |
20080268227 | Complex polishing pad and method for making the same - The present invention relates to a complex polishing pad and method for making the same. The method of the invention comprises the steps of: (a) providing a buffer layer, the buffer layer being continuous-porous material and having a surface; (b) flattening the surface of the buffer layer to form a flattened surface; and (c) disposing a polishing layer on the flattened surface so as to form the complex polishing pad, wherein the polishing layer is used to polish a polishing workpiece. Whereby, the complex polishing pad of the invention has a better flatness, and the buffer layer and the polishing layer have a stronger combination. | 10-30-2008 |
20080287047 | POLISHING PAD, USE THEREOF AND METHOD FOR MAKING THE SAME - The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided. | 11-20-2008 |
20080299879 | POLISHING PAD, THE USE THEREOF AND THE METHOD FOR MANUFACTURING THE SAME - The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head. | 12-04-2008 |
20090258316 | METHOD FOR PATTERNING A COVERING MATERIAL BY USING HIGH-POWER EXCITING BEAM - The present invention relates to a method for patterning a covering material by using a high-power exciting beam. The method includes the steps of (a) providing a base material having a plurality of thin layers, the neighboring thin layers having different colors; and (b) utilizing a high-power exciting beam to form at least one pattern on the base material, in which the pattern has at least one concave portion, so as to expose the thin layers with different colors. As a result, the covering material has a layered visual effect and many colors. Furthermore, the patterning method of the present invention is simple, and can form the pattern on the base material easily Therefore, the manufacturing time of the covering material with the pattern is reduced. | 10-15-2009 |
20090258578 | POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has high unity and flatness. The grinding layer has attenuated structures and a plurality of holes, thus increasing the storage ability of polishing particles distributed in a polishing liquid. In addition, the polishing pad has high compression ratio, so the polishing pad can compactly contact a polishing workpiece, and will not scratch the surface of the polishing workpiece scratched. Therefore, the polishing effect and quality will be improved. | 10-15-2009 |
20090258587 | POLISHING PAD HAVING GROOVE STRUCTURE FOR AVOIDING THE POLISHING SURFACE STRIPPING - The present invention relates to a polishing pad having a groove structure for avoiding the polishing surface stripping. The polishing pad of present invention includes a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. Whereby, the polishing pad of present invention is capable to contain more grinding liquid, and is contributive to clean the small grinded pieces. Furthermore, the grinding layer does not have acute structure and is not easy to peel to form the small grinded pieces. Therefore, the grinding quality and grinding effect can be improved. | 10-15-2009 |
20100099343 | POLISHING PAD HAVING ABRASIVE GRAINS AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad having abrasive grains and a method for making the same. The polishing pad having abrasive grains includes a plurality of fibers, a plurality of abrasive grains and a high polymer. The fibers intersect each other to form a fiber matrix. The abrasive grains are attached to the fibers. The high polymer covers the fibers and the abrasive grains. The abrasive grains will not easily scratch a surface of a workpiece to be polished due to the flexibility of the fibers. | 04-22-2010 |
20100119811 | CONDUCTIVE POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing. | 05-13-2010 |
20100146863 | POLISHING PAD HAVING INSULATION LAYER AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad having an insulation layer and a method for making the same. The polishing pad includes a bottom layer, an insulation layer, and an abrasive layer. The bottom layer includes a fabric layer wrapped in a high polymer. The insulation layer is disposed on the bottom layer. The abrasive layer is disposed on the insulation layer. The abrasive layer is a high polymeric elastomer and has a plurality of columnar-like cells. The insulation layer can prevent the slurry from infiltrating into the bottom layer during the polishing processs to improve the polishing effect and quality. | 06-17-2010 |
20110000141 | Polishing Pad, the Use Thereof and the Method for Manufacturing the Same - The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head. | 01-06-2011 |
20110003536 | Polishing Pad and Method of Producing the Same - The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded into the fabric, and the non-woven fabric comprises a plurality of first long fibers randomly entangled with each other. | 01-06-2011 |
20110011007 | POLISHING MATERIAL HAVING POLISHING PARTICLES AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces. | 01-20-2011 |
20110045744 | Polishing Pad, Use Thereof and Method for Making the Same - The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided. | 02-24-2011 |
20110045751 | CARRIER FILM FOR MOUNTING POLISHING WORKPIECE AND METHOD FOR MAKING THE SAME - The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece. | 02-24-2011 |
20110070814 | Method for Manufacturing Polishing Pad and Polishing Pad - The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also. | 03-24-2011 |
20110177305 | POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad and method for making the same. The polishing pad includes a fabric substrate and a second high polymeric elastomer resin. The fabric substrate is formed by a plurality of cross composite fibers. Each composite fiber has a plurality of fine fibers and a first high polymeric elastomer resin, and the first high polymeric elastomer resin discontinuously encloses the fine fibers. The second high polymeric elastomer resin encloses the composite fibers, and the first high polymeric elastomer resin and the second high polymeric elastomer resin have the same functional group. By adjusting the degree of saturation of the first high polymeric elastomer resin and the second high polymeric elastomer resin, the fine fibers will have smaller size and will not be easily entangled. Therefore, a workpiece to be polished will not be scratched and will have excellent surface quality. | 07-21-2011 |
20110223844 | POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad and method for making the same. The polishing pad comprises a plurality of fibers and a high polymeric elastomer compound. The fibers cross each other to form a fabric substrate. The high polymeric elastomer compound includes a first high polymeric elastomer resin and a second high polymeric elastomer resin. The weight-average molecular weight of the first high polymeric elastomer resin is 100,000 to 300,000. The second high polymeric elastomer resin is a two-component high polymeric elastomer resin, and includes a first component and a second component. The first component is polyol with a molecular weight of 1,500 to 2,500 and 1 wt % to 15 wt %. The second component is polyol with a molecular weight of 3,500 to 4,500 and 85 wt % to 99 wt %. Therefore, the polishing pad has better stiffness, a plurality of communicating holes and active fibers, so that a workpiece to be polished will have excellent surface quality. | 09-15-2011 |