Yu-Fu
Yu-Fu Chen, Tainan City TW
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20130089919 | Biosensor Chip with Nanostructures - A biosensor chip with nano-structures. The biosensor chip includes a RF biosensor, comprising an isolated substrate; a ground plane; a filtering circuit; at least one cell detection area with nano-structures and a protection layer. The RF biosensor can detect the existence of the cancer cells, high frequency biological effects and the cells relationship between transfers by noninvasive method. The RF biosensor according to the invention can provide high accuracy and sensitivity in cancer cells detection. | 04-11-2013 |
Yu-Fu Chen, Taipei City TW
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20150267239 | Biosensor Chip Having Precise Count Function and Method of Sensing Amount of Cells - Disclosure is a biosensor chip having precise count function comprising: a substrate, a plurality of ground wire waveguide layers, a signal waveguide layer and a protective layer. Wherein, the plurality of ground wire waveguide layers are located on two sides of the substrate, the signal waveguide layer is located on the substrate and between the plurality of ground wire waveguide layers, wherein the signal waveguide layer has a recess which forms a cell sensing region; and the protective layer covers a portion of the ground wire waveguide layers and a portion of the signal waveguide layer to expose the recess. | 09-24-2015 |
Yu-Fu Kang, Yangmei City TW
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20130266774 | PACKAGE STRUCTURE AND PACKAGING METHOD - A package structure and a packaging method for manufacturing the package structure are provided. The package structure comprises a cover wafer, a device wafer and a bonding material. The cover wafer has an optical element, and a surface of the cover wafer is defined with a height difference that is greater than 20 micrometers. The bonding material has a width and continuously surrounds the optical device, and is disposed between the cover wafer and the device wafer, in which the width is between 10 micrometers and 150 micrometers. The bonding material hermetically bonds the cover wafer and the device wafer to make a leakage rate of the package structure less than 5e | 10-10-2013 |
Yu-Fu Kuo, Hsinchu TW
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20130318778 | METHOD FOR MANUFACTURING ANTENNA STRUCTURE - A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic. | 12-05-2013 |
Yu-Fu Lin, Hsinchu TW
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20120202156 | CLEANING PROCESS FOR SEMICONDUCTOR DEVICE FABRICATION - A method of making an integrated circuit is provided. The method includes providing a substrate having a photosensitive layer. The photosensitive layer is exposed to a radiation beam. The exposed photosensitive layer is developed in a first chamber. In the first chamber, a cleaning process is performed on the developed photosensitive layer. The cleaning process includes using a rinse solution including at least one of ozone, hydrogen peroxide, and oxalic acid. | 08-09-2012 |
Yu-Fu Lin, Hsinchu City TW
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20150262815 | Method of Fabricating Semiconductor Integrated Circuit - A method of fabricating a semiconductor integrated circuit (IC) is disclosed. A first layer is deposited over a substrate. A plurality of mandrels is formed over the first layer. Guiding-spacers are formed along sidewalls of the mandrels. Then the mandrels are removed. A neutral layer (NL) and a block copolymer (BCP) layer are deposited over the first layer and the guiding-spacers. A anneal is applied to the BCP layer to form a first polymer nanostructure between the guiding-spacers and being surrounded by a second polymer nanostructure. The first polymer nanostructures locate at a same distance from the first layer. Polymer nano-blocks are formed by selectively etching the second polymer nanostructure and the NL. By using the polymer nano-blocks and the guiding spacer as etch masks, the first layer is etched to form openings. The substrate is etched through the openings to form substrate trench and substrate fin. | 09-17-2015 |