Patent application number | Description | Published |
20080260025 | CODING RATE CONVERTING APPARATUS, INTEGRATED CIRCUIT, AND METHOD, AND PROGRAM FOR THE SAME - A coding rate converting apparatus according to the present invention re-quantizes first quantized data with a first quantization step size, using a second quantization step size larger than the first quantization step size, and includes: an inverse quantization unit generating orthogonal transform coefficients by inversely quantizing the first quantized data for each of unit blocks; a quantization unit generating second quantized data by quantizing the orthogonal transform coefficients using the second quantization step size; a filter intensity change judging unit judging whether a second filter intensity determined based on the second quantized data is changed from a first filter intensity determined based on the first quantized data; and a coefficient correcting unit generating, in the case of the second filter intensity, third quantized data by correcting the second quantized data so that a third filter intensity determined based on the third quantized data becomes equal to the first filter intensity. | 10-23-2008 |
20080266147 | VARIABLE LENGTH CODE DECODING APPARATUS - A variable length code decoding apparatus according to the present invention includes: an extracting unit which extracts a bit string from a beginning of a bit stream; a first storage unit for storing a plurality of code words in which one piece of data has been coded, and decoded data and code lengths respectively corresponding to the code words; a second storage unit for storing a plurality of code words in which two or more pieces of data have been coded, and decoded data and code lengths respectively corresponding to the code words; a first judging unit which judges whether one of the code words stored in the first storage unit is included in the extracted bit string, and, when judged as being included, outputs the decoded data and the code length of the code word; and a second judging unit which judges whether a code word stored in the second storage unit is included in the extracted bit string, and when judged as being included, outputs the decoded data and the code length of the code word, wherein the extracting unit extracts the bit string to be decoded next in the same cycle as a cycle in which the judgment was made by the first judging unit, and extracts the bit string to be decoded next in a cycle following the cycle in which the judgment was made by the second judging unit. | 10-30-2008 |
20100091842 | CODING RATE CONVERSION APPARATUS, CODING RATE CONVERSION METHOD, AND INTEGRATED CIRCUIT - A plurality of macroblocks constituting coded data are inverse quantized using a first quantization matrix that is used when coding a picture, to obtain a plurality of sets of coefficient data. The first quantization matrix is converted to a second quantization matrix using a first conversion value and a second conversion value, where the first conversion value is for converting a low frequency coefficient corresponding to a frequency lower than a predetermined frequency among a plurality of coefficients shown by the first quantization matrix, and the second conversion value is for converting a high frequency coefficient among the plurality of coefficients and is larger than the first conversion value (Step S | 04-15-2010 |
20100266049 | IMAGE DECODING DEVICE - An image decoding apparatus pertaining to the present invention includes a plurality of decoders. The image decoding apparatus (i) divides image data to decode into a plurality of pieces of partial data, (ii) acquires attribute information pieces each affecting decoding processing time of a corresponding one of the plurality of pieces of partial data, (iii) determines which of the plurality of decoders is caused to decode which of the plurality of pieces of partial data based on the attribute information pieces on the plurality of pieces of partial data and (iv) causes two or more of the plurality of decoders to decode two or more corresponding pieces of the partial data in parallel. | 10-21-2010 |
20120309133 | ELECTRONIC COMPONENT MOUNTING METHOD - A method of mounting an electronic component allows bumps to land onto electrodes via thermosetting flux formed of first thermosetting resin containing a first active ingredient, and brings a resin reinforcing member formed of second thermosetting resin containing a second active ingredient into contact with the electronic component at reinforcement sections, and then heats the substrate to form solder junction sections that bond the bumps to the electrodes. At the same time, the method forms resin reinforcement sections that reinforce the solder junction sections from the surroundings. A mixing ratio of the second active ingredient in the resin reinforcing member is set greater than a mixing ratio of the first active ingredient in the thermosetting flux. | 12-06-2012 |
20140096379 | ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMENT MACHINE, AND ELECTRONIC COMPONENT MOUNTING SYSTEM - An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon. | 04-10-2014 |
20140231492 | ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMENT MACHINE, AND ELECTRONIC COMPONENT MOUNTING SYSTEM - Disclosed is an electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes via the flux; dispensing a thermosetting resin to at least one reinforcement position on the substrate with the first electronic component placed thereon, the at least one reinforcement position corresponding to a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon, to melt the bumps and cure the thermosetting resin, followed by cooling, thereby to join the first electronic component to the substrate. | 08-21-2014 |
20150163903 | ELECTRONIC COMPONENT-MOUNTED STRUCTURE, IC CARD AND COF PACKAGE - Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern. | 06-11-2015 |