Patent application number | Description | Published |
20080260025 | CODING RATE CONVERTING APPARATUS, INTEGRATED CIRCUIT, AND METHOD, AND PROGRAM FOR THE SAME - A coding rate converting apparatus according to the present invention re-quantizes first quantized data with a first quantization step size, using a second quantization step size larger than the first quantization step size, and includes: an inverse quantization unit generating orthogonal transform coefficients by inversely quantizing the first quantized data for each of unit blocks; a quantization unit generating second quantized data by quantizing the orthogonal transform coefficients using the second quantization step size; a filter intensity change judging unit judging whether a second filter intensity determined based on the second quantized data is changed from a first filter intensity determined based on the first quantized data; and a coefficient correcting unit generating, in the case of the second filter intensity, third quantized data by correcting the second quantized data so that a third filter intensity determined based on the third quantized data becomes equal to the first filter intensity. | 10-23-2008 |
20080266147 | VARIABLE LENGTH CODE DECODING APPARATUS - A variable length code decoding apparatus according to the present invention includes: an extracting unit which extracts a bit string from a beginning of a bit stream; a first storage unit for storing a plurality of code words in which one piece of data has been coded, and decoded data and code lengths respectively corresponding to the code words; a second storage unit for storing a plurality of code words in which two or more pieces of data have been coded, and decoded data and code lengths respectively corresponding to the code words; a first judging unit which judges whether one of the code words stored in the first storage unit is included in the extracted bit string, and, when judged as being included, outputs the decoded data and the code length of the code word; and a second judging unit which judges whether a code word stored in the second storage unit is included in the extracted bit string, and when judged as being included, outputs the decoded data and the code length of the code word, wherein the extracting unit extracts the bit string to be decoded next in the same cycle as a cycle in which the judgment was made by the first judging unit, and extracts the bit string to be decoded next in a cycle following the cycle in which the judgment was made by the second judging unit. | 10-30-2008 |
20100091842 | CODING RATE CONVERSION APPARATUS, CODING RATE CONVERSION METHOD, AND INTEGRATED CIRCUIT - A plurality of macroblocks constituting coded data are inverse quantized using a first quantization matrix that is used when coding a picture, to obtain a plurality of sets of coefficient data. The first quantization matrix is converted to a second quantization matrix using a first conversion value and a second conversion value, where the first conversion value is for converting a low frequency coefficient corresponding to a frequency lower than a predetermined frequency among a plurality of coefficients shown by the first quantization matrix, and the second conversion value is for converting a high frequency coefficient among the plurality of coefficients and is larger than the first conversion value (Step S | 04-15-2010 |
20100266049 | IMAGE DECODING DEVICE - An image decoding apparatus pertaining to the present invention includes a plurality of decoders. The image decoding apparatus (i) divides image data to decode into a plurality of pieces of partial data, (ii) acquires attribute information pieces each affecting decoding processing time of a corresponding one of the plurality of pieces of partial data, (iii) determines which of the plurality of decoders is caused to decode which of the plurality of pieces of partial data based on the attribute information pieces on the plurality of pieces of partial data and (iv) causes two or more of the plurality of decoders to decode two or more corresponding pieces of the partial data in parallel. | 10-21-2010 |
20120309133 | ELECTRONIC COMPONENT MOUNTING METHOD - A method of mounting an electronic component allows bumps to land onto electrodes via thermosetting flux formed of first thermosetting resin containing a first active ingredient, and brings a resin reinforcing member formed of second thermosetting resin containing a second active ingredient into contact with the electronic component at reinforcement sections, and then heats the substrate to form solder junction sections that bond the bumps to the electrodes. At the same time, the method forms resin reinforcement sections that reinforce the solder junction sections from the surroundings. A mixing ratio of the second active ingredient in the resin reinforcing member is set greater than a mixing ratio of the first active ingredient in the thermosetting flux. | 12-06-2012 |
20140096379 | ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMENT MACHINE, AND ELECTRONIC COMPONENT MOUNTING SYSTEM - An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon. | 04-10-2014 |
20140231492 | ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMENT MACHINE, AND ELECTRONIC COMPONENT MOUNTING SYSTEM - Disclosed is an electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes via the flux; dispensing a thermosetting resin to at least one reinforcement position on the substrate with the first electronic component placed thereon, the at least one reinforcement position corresponding to a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon, to melt the bumps and cure the thermosetting resin, followed by cooling, thereby to join the first electronic component to the substrate. | 08-21-2014 |
20150163903 | ELECTRONIC COMPONENT-MOUNTED STRUCTURE, IC CARD AND COF PACKAGE - Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern. | 06-11-2015 |
20150373845 | ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT MOUNTING STRUCTURE - In an electronic component mounting structure, a plurality of bumps formed on an electronic component is joined to a plurality of electrodes formed on a substrate by way of joining portions formed with the bumps and solder. Bonding portions bond the electronic component to the substrate and the bonding portions are formed of thermosetting materials obtained by curing thermosetting resins having a curing temperature which is lower than a melting point of the solder between the electronic component and the substrate. The thermosetting materials come in contact with a nearest-neighboring joining portion in the bonding portions. | 12-24-2015 |
Patent application number | Description | Published |
20090047534 | COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE - To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. | 02-19-2009 |
20100000773 | ELECTRONIC COMPONENT MOUNTING STRUCTURE - The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four comers of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well. | 01-07-2010 |
20100089628 | COMPONENT BUILT-IN CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THE SAME - A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate. | 04-15-2010 |
20100206621 | WIRING BOARD WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN COMPONENT - A wiring board with a built-in component includes an insulating board, a first wiring pattern on an upper surface of the insulating board, plural electrodes on the upper surface of the insulating board, a solder resist on the upper surface of the insulating board, plural solders on the electrodes, respectively, an electronic component joined to the electrodes with the solders, a sealing resin provided between the insulating board and the electronic component, a component-fixing layer provided on the upper surface of the insulating board and the first wiring pattern and having an insulating property, a second wiring pattern on the component-fixing layer, and an interlayer wiring connecting the first wiring pattern to the second wiring pattern. The solder resist surrounds the electrodes. The sealing resin entirely covers the solders and the solder resist. This wiring board can be efficiently manufactured by simple processes. | 08-19-2010 |
20110284265 | COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE - To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. | 11-24-2011 |
Patent application number | Description | Published |
20140113797 | DEVICE AND METHOD FOR CUTTING BRITTLE MEMBER AND CUT-OUT BRITTLE MEMBER - A device for cutting a brittle member such as a glass is comprised of a laser oscillator configured to radiate a laser beam through a first space onto a first region on the brittle member; a cooling nozzle configured to expel a cooling medium onto a second region distinct from the first region on the brittle member; a baffle so disposed as to leave a gap between the member and the baffle and to have the first region not enclosed by the baffle, and so directed as to deflect a flow of a splash and a mist originating in the second region away from the first region; and a gas nozzle configured to expel a gas toward the gap. | 04-24-2014 |
20140302732 | OCEANOGRAPHIC INFORMATION COLLECTION SYSTEM - An oceanographic information collection system includes an anchor arranged on a sea bottom, an intermediate buoy connected to the anchor and floating in a sea, a mooring cable connected at one end to the intermediate buoy and at another end to an observation buoy. The observation buoy includes a main body whose longitudinal direction is arranged in a flowing direction of an ocean current. A specific gravity adjuster is arranged in the main body and includes an expandable and shrinkable buoyancy bag, an antenna arranged on the main body and transfers data, and an observation unit arranged in the main body and acquires prescribed oceanographic information. The observation buoy floats upward by expanding the buoyancy bag of the specific gravity adjuster, and sinks by shrinking the buoyancy bag in order to stand by in the sea. The buoy can easily float, sink and stand by in the sea. | 10-09-2014 |
20150239682 | CONVEYANCE DEVICE - A conveyance device for levitating a subject body by a gas and conveying the subject body in a first direction is comprised of a levitation section emitting the gas to apply pressure on the subject body to levitate the subject body; a conveyance section comprising an endless belt elongated in the first direction and a plurality of projections projecting from the belt and capable of coming in contact with the subject body, and being configured to come in contact with and drive the subject body in the first direction; and a suction section elongated adjacent to and in parallel with the conveyance section or aligned with the conveyance section in a single straight line, the suction section applying negative pressure on the subject body to have the subject body in contact with the conveyance section. | 08-27-2015 |