Patent application number | Description | Published |
20090231020 | Electrical fuse, semiconductor device and method of disconnecting electrical fuse - An electrical fuse including a polysilicon layer; a silicide layer formed over the polysilicon layer; and a first metal contact and a second metal contact arranged over the silicide layer, while being spaced from each other, the electrical fuse being configured so that the silicide layer, after disconnection, is excluded from a region right under the second metal contact, and from a region between the second metal contact and the first metal contact is provided. | 09-17-2009 |
20090256235 | Semiconductor device - A semiconductor device ( | 10-15-2009 |
20100032798 | Semiconductor device - The semiconductor device includes: a substrate; an electric fuse that includes a lower-layer wiring formed on the substrate, a first via provided on the lower-layer wiring and connected to the lower-layer wiring, and an upper-layer wiring provided on the first via and connected to the first via, a flowing-out portion of a conductive material constituting the electric fuse being formed in a cut-off state of the electric fuse; and a heat diffusion portion that includes a heat diffusion wiring that is formed in the same layer as one of the upper-layer wiring and the lower-layer wiring and is placed on a side of the one of the upper-layer wiring and the lower-layer wiring, the heat diffusion portion being electrically connected to the one of the upper-layer wiring and the lower-layer wiring. | 02-11-2010 |
20100096723 | Semiconductor device - A semiconductor device includes an electric fuse and first and second large area wirings for applying a voltage to the electric fuse. The electric fuse includes a fuse unit which includes an upper-layer fuse wiring, a lower-layer fuse wiring, and a via connecting the upper-layer fuse wiring and the lower-layer fuse wiring, an upper-layer lead-out wiring which connects the upper-layer fuse wiring and the first large area wiring and has a bent pattern, and a lower-layer lead-out wiring which connects the lower-layer fuse wiring and the second large area wiring and has a bent pattern. | 04-22-2010 |
20100096724 | Semiconductor device - A semiconductor device ( | 04-22-2010 |
20100112770 | Semiconductor device and method of manufacturing semiconductor device - The invention provides a method of manufacturing a semiconductor device including a non-volatile memory with high yield, and a semiconductor device manufactured by the method. A method of manufacturing a semiconductor device includes a process of forming a second side wall such that the width of the second side wall, which is formed on the side of a portion of a second gate electrode that does not face dummy gates on a drain forming region side, in a gate length direction is larger than that of the second side wall, which is formed on the side of the second gate electrode on a source forming region side, in the gate length direction, in a non-volatile memory forming region. | 05-06-2010 |
20100133650 | Semiconductor device - A semiconductor device includes an electric fuse formed on a substrate. The electric fuse includes: a first interconnect formed on one end side thereof; a second interconnect formed in a layer different from a layer in which the first interconnect is formed; a first via provided in contact with the first interconnect and the second interconnect to connect those interconnects; a third interconnect formed on another end side thereof, the third interconnect being formed in the same layer in which the first interconnect is formed, as being separated from the first interconnect; and a second via provided in contact with the third interconnect and the second interconnect to connect those interconnects, the second via being lower in resistance than the first via. The electric fuse is disconnected by a flowing-out portion to be formed of a conductive material forming the electric fuse which flows outwardly during disconnection. | 06-03-2010 |
20110019494 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - In a method of manufacturing a semiconductor device, element properties of an element property extraction pattern formed on a semiconductor wafer is extracted as element properties of a current control element corresponding to the element property extraction pattern. A supply energy to the current control element is set which is formed between nodes on the semiconductor wafer, based on the extracted element properties. The set supply energy is supplied to the current control element to irreversible control an electrical connection between the nodes through the device breakdown by the current control element. | 01-27-2011 |
20110108923 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device has a conventional NMOS transistor and an NMOS transistor functioning as an anti-fuse element and having an n type channel region. The conventional NMOS transistor is equipped with an n type extension region and a p type pocket region, while the anti-fuse element is not equipped with an extension region and a pocket region. This makes it possible to improve the performance of the transistor and at the same time improve the characteristics of the anti-fuse element after breakdown of its gate dielectric film. | 05-12-2011 |
20110127591 | METHOD FOR PROGRAMMING AN ANTI-FUSE ELEMENT, AND SEMICONDUCTOR DEVICE - A method for programming an anti-fuse element in which the ratio between current values before and after writing is increased to ensure accuracy in making a judgment about how writing has been performed on the anti-fuse element. The method for programming the anti-fuse element as a transistor includes the steps of applying a prescribed gate voltage to a gate electrode to break down a gate dielectric film, and moving the silicide material of a silicide layer formed on a surface of at least one of a first impurity diffusion region and a second impurity diffusion region, into the gate dielectric film in order to couple the gate electrode with at least the one of the first impurity diffusion region and the second impurity diffusion region electrically through the silicide material. | 06-02-2011 |
20110272778 | Semiconductor device - A semiconductor device includes an electric fuse and first and second large area wirings for applying a voltage to the electric fuse. The electric fuse includes a fuse unit which includes an upper-layer fuse wiring, a lower-layer fuse wiring, and a via connecting the upper-layer fuse wiring and the lower-layer fuse wiring, an upper-layer lead-out wiring which connects the upper-layer fuse wiring and the first large area wiring and has a bent pattern, and a lower-layer lead-out wiring which connects the lower-layer fuse wiring and the second large area wiring and has a bent pattern. | 11-10-2011 |
20120026810 | SEMICONDUCTOR MEMORY DEVICE AND ANTIFUSE PROGRAMMING METHOD - An antifuse comprised of an NMOS transistor or an NMOS capacitor includes a first terminal coupled to a gate electrode, a second terminal coupled to a diffusion layer, and a gate insulating film interposed between the gate electrode and the diffusion layer. A programming circuit includes a first programming circuit which has first current drive capability and which performs first programming operation and a second programming circuit which has second current drive capability larger than the first current drive capability and which performs second programming operation to follow the first programming operation. In the first programming operation, the first programming circuit breaks down the gate insulating film by applying a first programming voltage between the first terminal and the second terminal. In the second programming operation, the second programming circuit applies a second programming voltage lower than the first programming voltage between the first terminal and the second terminal. | 02-02-2012 |
20120044741 | Semiconductor device having memory unit, method of writing to or reading from memory unit, and semiconductor device manufacturing method - A first semiconductor device is formed over a substrate and includes a first insulation film, a first electrode, and a first diffusion layer. A second semiconductor device is formed over a substrate and includes a second insulation film, a second electrode, and a second diffusion layer. The second electrode is coupled to the first electrode. A control transistor allows one of a source and a drain to be coupled to the first electrode and the second electrode, allows the other one of the source and the drain to be coupled to a bit line, and allows a gate electrode to be coupled to a word line. A first potential control line is coupled to the first diffusion layer and controls a potential of the first diffusion layer. A second potential control line is coupled to the second diffusion layer and controls a potential of the second diffusion layer. | 02-23-2012 |
20120080736 | SEMICONDUCTOR DEVICE - An antifuse whose internal written information cannot be analyzed even by utilizing methods to determine whether there is a charge-up in the electrodes. The antifuse includes a gate insulation film, a gate electrode, and a first diffusion layer. A second diffusion layer is isolated from the first diffusion layer by way of a device isolator film, and is the same conduction type as the first diffusion layer. The gate wiring is formed as one integrated piece with the gate electrode, and extends over the device isolator film. A common contact couples the gate wiring to the second diffusion layer. The gate electrode is comprised of semiconductor material such as polysilicon that is doped with impurities of the same conduction type as the first diffusion layer. The second diffusion layer is coupled only to the common contact. | 04-05-2012 |
20120104544 | SEMICONDUCTOR DEVICE - A semiconductor device adapted such that written information cannot be analyzed even by using a method of analyzing the presence or absence of electric charge, accumulated on a gate electrode, in which a substrate is a first conduction type, for example, p-type semiconductor substrate (for example, silicon substrate), an antifuse has a gate electrode and a second conduction type diffusion layer, the second conduction type diffusion layer is formed in the substrate and has, for example, an n-conduction type, a first contact is connected to the gate electrode, second contacts are formed in a layer identical with the first contact and connected to a region of the substrate in which the second conduction type diffusion layer is not formed, and the second contact is adjacent to the first contact. | 05-03-2012 |
20130033921 | SEMICONDUCTOR DEVICE - A semiconductor device using resistive random access memory (ReRAM) elements and having improved tamper resistance is provided. The semiconductor device is provided with a unit cell which stores one bit of cell data and a control circuit. The unit cell includes n ReRAM elements (n being an integer of 2 or larger). At least one of the ReRAM elements is an effective element where the cell data is recorded. In reading the cell data, the control circuit at least selects the effective element and reads data recorded thereon as the cell data. | 02-07-2013 |
20130058150 | OTP MEMORY - The present invention provides an OTP memory having higher confidentiality. A memory cell has a memory transistor forming a current path between first and second nodes, a selection transistor forming a current path between third and fourth nodes, the third node being coupled to the gate of the memory transistor via a line, and a capacitor coupled to the first node. By applying high voltage which does not break but deteriorates a gate oxide film and increases gate leak current to a memory transistor, data is written. Data can be read by the presence/absence of leak of charges accumulated in the capacitor. Since the position of deterioration in the gate oxide film cannot be discriminated by a physical analysis, confidentiality is high. | 03-07-2013 |