Patent application number | Description | Published |
20090014892 | INTEGRATED CIRCUIT DEVICE - Provided on a chip are a plurality of conductor patterns for forming a coil, and a connection-relationship control device for controlling connection between adjacent conductor patterns. By switching the connection relationship of the conductor patterns by the connection-relationship control device, it is possible to form a coil of a desired shape at a desired position. | 01-15-2009 |
20090196388 | SIGNAL TRANSMISSION SYSTEM AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - Disclosed is a semiconductor integrated circuit device including a transmitting circuit and a receiving coil inductively coupled to a transmitting coil. The transmitting circuit transmits data by supplying a current through the transmitting coil not at the time of transition of data but at every rising edge or falling edge of a clock used in transmission of data. At every rising edge or falling edge of the clock, a receiving circuit captures a voltage induced in the receiving coil due to the current flowing through the transmitting coil, reproduces the transmitted data and outputs the reproduced data. | 08-06-2009 |
20090322383 | SEMICONDUCTOR DEVICE, SIGNAL TRANSMITTER, AND SIGNAL TRANSMISSION METHOD - A semiconductor device is provided with a plurality of semiconductor chips and at least one transmission coil ( | 12-31-2009 |
20100033239 | SEMICONDUCTOR DEVICE - A main chip has a signal processing circuit for executing signal processing; a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and a signal transmitting circuit; and a control circuit for controlling operation/non-operation of the signal transmitting circuits in accordance with signal processing content of the signal processing circuit. Functional chips each have a signal processing circuit for executing auxiliary signal processing different from that of the signal processing circuit; and one or a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and the signal transmitting circuits. The main chip and the functional chips are stacked. The signal transmitting circuits and the signal transmitting circuit are non-contact-type signal transmitting circuits utilizing inductive coupling and are arranged so as to overlap when viewed from the stacking direction. | 02-11-2010 |
20100069000 | SEMICONDUCTOR DEVICE PERFORMING SIGNAL TRANSMISSION BY USING INDUCTOR COUPLING - Disclosed is a semiconductor device which performs signal transmission by using inductor coupling. The semiconductor device comprises one or more transmission and reception coil pair, each pair comprising a single transmission coil and a plurality of reception coils, or a plurality of transmission coils and a single reception coil, or a plurality of transmission coils and a plurality of reception coils. | 03-18-2010 |
20100164053 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor wafer in which semiconductor chip forming regions and a scribe region located between the semiconductor chip forming regions are formed, a plurality of semiconductor chip circuit portions provided over the semiconductor wafer, a plurality of first conductive layers, provided in each of the semiconductor chip forming regions, which is electrically connected to each of the circuit portions, and a first connecting portion that electrically connects the first conductive layers to each other across a portion of the scribe region. An external power supply or grounding pad is connected to any one of the first conductive layer and the first connecting portion. The semiconductor device includes a communication portion, connected to the circuit portion, which performs communication with the outside by capacitive coupling or inductive coupling. | 07-01-2010 |
20100194423 | APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE TO BE TESTED - Provided is a semiconductor testing apparatus which can perform batch test of semiconductor wafers. In the semiconductor testing apparatus, an LSI apparatus for conducting a test and which provided with a circuit and an electrode for transmitting noncontact signals, and a probe card to which a contact-type probe pin is attached are separately arranged. The semiconductor testing apparatus is provided with a recognition unit for precisely aligning the electrodes of the LSI apparatus for conducting a test, the LSI wafer to be tested and the probe card. The LSI apparatus for conducting a test and a probe pin of the probe card are mounted on a stage or a pressurizing head, and contact can be made to sandwich an LSI wafer to be tested, from both the front surface and the rear surface of the LSI wafer to be tested at the same time. | 08-05-2010 |
20100254481 | DATA TRANSMISSION DEVICE AND DATA TRANSMISSION METHOD - A data transmission device comprises a data sending device that includes an electromagnetic signal sending unit. The data sending device is configured to output binary data in such a polarity that an electromagnetic signal, which is output from the electromagnetic signal sending unit, is substantially point symmetric with a point, at which amplitude of the electromagnetic signal crosses 0, as a symmetric point. Binary data is output corresponding to whether a gradient at the symmetric point is positive or negative. | 10-07-2010 |
20100321054 | SEMICONDUCTOR INSPECTING DEVICE AND SEMICONDUCTOR INSPECTING METHOD - A semiconductor inspecting device comprises a probe card for transmitting a signal or power supply to semiconductor wafers having one or more subject chips formed therein, and is constituted such that the first semiconductor wafer faces the first face of the probe card and such that the second semiconductor wafer faces the second face of the probe card on the opposite side of the first face. The probe card includes one or more inspecting chips, which can perform non-contact transmissions with the first subject chip in the first semiconductor wafer and the second subject chip in the second semiconductor wafer. | 12-23-2010 |
20110260747 | SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE SAME - A semiconductor device ( | 10-27-2011 |
20120002771 | RECEIVER, SEMICONDUCTOR DEVICE, AND SIGNAL TRANSMISSION METHOD - A receiver comprises: a reception coil through which flow a current of a polarity corresponding to data is allowed to flow by flowing a current through a transmission coil for every rising edge or falling edge of a clock signal relating to transmission of data, and generates a signal induced by means of electromagnetic induction by flowing the current through the transmission coil; a transition detection circuit which detects a level transition of a signal generated in the reception coil; and a clock recovery circuit which recovers the clock signal based on the detection result of the transition detection circuit. | 01-05-2012 |
20120018726 | SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor wafer in which a plurality of regions, designed to become semiconductor chips are provided in a matrix array with interposition of a dicing line(s) respectively separating the regions. The semiconductor wafer comprises: a plurality of test pads provided in an area(s) of the semiconductor wafer disposed between the semiconductor chips, inclusive of the dicing line(s); an inter-test pad interconnect(s) provided in parallel with the test pads in the area(s) of the semiconductor wafer disposed between the regions to become semiconductor chips; the inter-test pad interconnect(s) being connected to the test pads; and an inter-chip interconnect that interconnects at least two of the regions designed to become semiconductor chips; the inter-test pad interconnect being electrically connected to the inter-chip interconnect. | 01-26-2012 |
20120025790 | ELECTRONIC CIRCUIT, CIRCUIT APPARATUS, TEST SYSTEM, CONTROL METHOD OF THE ELECTRONIC CIRCUIT - An electronic circuit includes: a first power line capable of supplying power; a second power line capable of supplying power independently from the first power line; a main circuit connected to the second power line; a detector that detects the supply of power from the first power line or the second power line; and a controller connected to the first power line and the second power line, wherein the controller controls a voltage or a current supplied from the first power line and supplies the voltage or the current to the main circuit when the detector detects supply of power from the first power line. | 02-02-2012 |