Patent application number | Description | Published |
20120260851 | METHOD OF MANUFACTURING TRANSPARENT OXIDE THIN FILM - A method of manufacturing a zinc oxide-based thin film for a transparent electrode and a zinc oxide-based thin film manufactured using the method, in which both conductivity and transmittance can be improved. The method includes the step of forming a transparent oxide thin film doped with a dopant on a transparent substrate, and the step of rapidly heat-treating the transparent oxide thin film. | 10-18-2012 |
20120261679 | LIGHT-EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - A light-emitting device and a method of fabricating the same, in which the light emission characteristics of the light-emitting device in the UV range are maximized such that a high-efficiency light-emitting device can be produced at low cost. For this, the method includes the step of forming a zinc oxide light-emitting layer on a base substrate, the zinc oxide light-emitting layer including zinc oxide doped with a dopant; and activating the dopant by rapidly heat-treating the zinc oxide light-emitting layer, so that light emission in an ultraviolet range is increased. | 10-18-2012 |
20120261701 | LIGHT EXTRACTION SUBSTRATE FOR ELECTROLUMINESCENT DEVICE AND MANUFACTURING METHOD THEREOF - A light extraction substrate for an electroluminescent device and a manufacturing method thereof, in which light extraction efficiency is increased. The light extraction substrate for an electroluminescent device includes a substrate and a light extraction layer formed on the substrate. The light extraction layer contains an oxide that has a wide band gap of 2.8 eV or more. The light extraction layer has a texture on the surface thereof. | 10-18-2012 |
20120266952 | METHOD OF MANUFACTURING SUBSTRATE FOR PHOTOVOLTAIC CELL - A method of manufacturing a substrate for a photovoltaic cell, in which the high optical characteristic in a long-wavelength range available for the photovoltaic cell can be maintained, and at the same time, the amount of hazing can be increased. The method includes the step of forming a zinc oxide (ZnO) thin film layer doped with a dopant on a transparent substrate, and the step of controlling the surface structure of the zinc oxide thin film layer by etching the zinc oxide thin film layer using hydrogen plasma. | 10-25-2012 |
20120270013 | ZnO-BASED TRANSPARENT CONDUCTIVE THIN FILM FOR PHOTOVOLTAIC CELL AND MANUFACTURING METHOD THEREOF - A zinc oxide (ZnO)-based transparent conductive thin film for a photovoltaic cell and a manufacturing method thereof, in which the transparent conductive thin film has an excellent textured surface and can be mass-produced. The ZnO-based transparent conductive film is formed on a substrate, is doped with a dopant, and has a textured surface. The textured surface has a plurality of protrusions. The manufacturing method forms the zinc oxide-based transparent conductive film on a substrate by atmospheric pressure chemical vapor deposition (APCVD) involving organic precursor gas and oxidizer gas. | 10-25-2012 |
20130330505 | Light Extraction Substrate For OLED And Method Of Fabricating The Same - A light extraction substrate for an organic light-emitting device (OLED) which can improve the brightness of a display or an illumination system to which an OLED is applied by improving light extraction efficiency and a method of manufacturing the same. The light extraction substrate for an OLED includes an oxide or nitride thin film formed on a substrate body. The oxide or nitride thin film includes a base layer formed on the substrate body, a first texture formed on the base layer, the first texture having a plurality of first protrusions which protrude continuously or discontinuously from the base layer, and a second texture having a plurality of second protrusions which protrude continuously or discontinuously from each outer surface of the first protrusions. | 12-12-2013 |
20140026952 | TRANSPARENT CONDUCTIVE OXIDE THIN FILM SUBSTRATE, METHOD OF FABRICATING THE SAME, AND ORGANIC LIGHT-EMITTING DEVICE AND PHOTOVOLTAIC CELL HAVING THE SAME - A transparent conductive oxide thin film substrate that has a high level of surface flatness, a method of fabricating the same, and an OLED and photovoltaic cell having the same. The transparent conductive oxide thin film substrate that includes a base substrate, a first transparent conductive oxide thin film formed on the base substrate, the first transparent conductive oxide thin film being treated with a first dopant, and a second transparent conductive oxide thin film formed on the first transparent conductive oxide thin film. The second transparent conductive oxide thin film is treated with a second dopant at a higher concentration than the first dopant. The surface of the second transparent conductive oxide thin film is flatter than the surface of the first transparent conductive oxide thin film. | 01-30-2014 |
20140042476 | Metal Oxide Thin Film Substrate, Method Of Fabricating The Same, Photovoltaic Cell And OLED Including The Same - A metal oxide thin film substrate which can increase light trapping efficiency and light extraction efficiency, a method of fabricating the same and a photovoltaic cell and organic light-emitting device (OLED) including the same. The metal oxide thin film substrate includes a base substrate, and a metal oxide thin film formed on the base substrate. The metal oxide thin film has voids which are formed inside the metal oxide thin film to scatter light. | 02-13-2014 |
20140099443 | ZINC OXIDE PRECURSOR AND METHOD OF DEPOSITING ZINC OXIDE-BASED THIN FILM USING THE SAME - A zinc oxide (ZnO) precursor and a method of depositing a ZnO-based thin film using the same, with which a high-quality and high-purity ZnO-based thin film can be deposited. The ZnO precursor includes a mixture solvent containing at least two organic solvents which are mixed and a source material comprising diethyl zinc or dimethyl zinc which is diluted in the mixture solvent. | 04-10-2014 |
20140103336 | METAL OXIDE THIN FILM SUBSTRATE FOR OLED AND METHOD OF FABRICATING THE SAME - A metal oxide thin film substrate for an organic light-emitting device (OLED) which exhibits superior light extraction efficiency and can be easily fabricated at low cost and a method of fabricating the same and a method of fabricating the same. The metal oxide thin film substrate for an OLED includes a base substrate and a metal oxide thin film formed on the base substrate, the metal oxide thin film being made of a mixture of at least two metal oxides having different refractive indices. | 04-17-2014 |
20140144770 | METHOD OF FABRICATING ZINC OXIDE THIN FILM - A method of fabricating a zinc oxide (ZnO) thin film in which the surface shape of the ZnO thin film can be controlled during deposition of the ZnO thin film. The method includes depositing the ZnO thin film on a substrate by chemical vapor deposition (CVD). The CVD feeds an etching gas that etches the ZnO thin film concurrently with a source gas and an oxidizer gas, thereby controlling the surface shape of the ZnO thin film that is being deposited. | 05-29-2014 |
Patent application number | Description | Published |
20080247175 | Reflection Sheet and Backlight Unit Employing the Same - Provided are a reflection sheet for a backlight unit including: a base sheet; and a flexible coating layer, formed on at least a surface of the base sheet, containing at least one flexible elastomeric bead selected from the group consisting of an elastomeric acrylic bead, an elastomeric nylon bead, and a microcapsule resin bead having a core charged with an air or an organic material, and a backlight unit for a liquid crystal display employing the reflection sheet. The reflection sheet may further include a metal reflection layer The reflection sheet including the flexible coating layer exhibits excellent resistance to friction and impact. The reflection sheet including both the flexible coating layer and the metal reflection layer is excellent in specular reflectivity and brightness as well as in resistance to friction and impact. Therefore, the reflection sheet can be usefully applied to a light guide panel of a backlight unit having a weak surface hardness or requiring a surface protection due to a surface prism pattern. | 10-09-2008 |
20130078425 | METHOD FOR MANUFACTURING HIGH BRIGHTNESS OPTICAL SHEET - The present invention relates to a method for preparing an optical sheet comprising the steps of: (a) preparing a transfer film having a single roughened side by coating one side of a first substrate with resin component comprising 100 parts by weight of binder resin and 70 to 130 parts by weight of spherical organic polymer beads, followed by drying; (b) laminating the transfer film preparing in step (a) with an ultraviolet-curable (UV-curable) resin-coated layer, which prepared by coating one side of a second substrate with UV-curable resin, such that the roughened side of the transfer film is facing the UV-curable resin-coated side of the second substrate; and (c) forming a roughened diffusive layer on the single-side of the second substrate having refractive index of 1.41 to 1.59 by curing the laminate obtained in step (b), followed by separating and removing the transfer film, wherein the roughened side of the transfer film has a segment angle of 130 to 150°. The optical sheet prepared by the method of the present invention has high brightness, which can also provide masking of prism sheet pattern, and is safe from surface stains and interface scratches between the sheet and the polarizing plate positioned underneath, thus, can be used as an optical sheet in backlight unit of LCD. | 03-28-2013 |
Patent application number | Description | Published |
20120167626 | APPARATUS AND METHOD FOR MANUFACTURING PATTERNED TEMPERED GLASS - An apparatus for manufacturing tempered glass. A heating unit heats a glass substrate that is intended to be tempered. A pattern-forming unit forms a pattern on a surface of the glass substrate heated by the heating unit. A dielectric heating unit increases the temperature of the inner portion of the glass substrate, on which the pattern is formed by the pattern-forming unit. A cooling unit cools the glass substrate, the inside temperature of which is increased by the dielectric heating unit. | 07-05-2012 |
20120170040 | APPARATUS FOR MEASURING TRANSMISSIVITY OF PATTERNED GLASS SUBSTRATE - An apparatus for measuring transmissivity of a patterned glass substrate. A beam radiator radiates a laser beam. A collimation lens collimates the laser beam radiated from the laser beam radiator. A beam expander expands a size of the laser beam collimated by the collimation lens. A detector has a light-receiving section, which receives the laser beam that has passed through the patterned glass substrate after having been expanded by the beam expander. A measuring section measures a transmissivity of the patterned glass substrate using the laser beam received by the detector. | 07-05-2012 |
20130233847 | HIGH FREQUENCY HEATING APPARATUS - A high frequency heating apparatus which heats a substrate by applying high frequency waves. The high frequency heating apparatus includes a high frequency generator which generates high frequency to heat the substrate and a reflector which reflects the high frequency generated by the high frequency generator toward the substrate. | 09-12-2013 |
20130233848 | HIGH FREQUENCY HEATING APPARATUS - A high frequency heating apparatus which heats a substrate by applying high frequency waves thereto. The high frequency heating apparatus includes a high frequency generator which generates high frequency to heat the substrate. The distance from the substrate to the high frequency generator is n/2*λ, where n is a natural number ranging from 1 to 6, and λ is the wavelength of the high frequency that is generated by the high frequency generator. | 09-12-2013 |
20140116090 | APPARATUS FOR CHEMICALLY TOUGHENING GLASS AND METHOD OF CHEMICALLY TOUGHENING GLASS USING THE SAME - An apparatus for chemically toughening glass which can toughen the surface of the glass by inducing compressive stress on the glass surface through ion exchange and a method of chemically toughening glass using the same. The apparatus includes a chemical toughening bath which chemically toughens the glass; a transportation part which transports the glass from upstream of the chemical toughening bath through the chemical toughening bath to downstream of the chemical toughening bath; and a microwave generator disposed above the chemical toughening bath, the microwave generator radiating microwaves to the glass. | 05-01-2014 |
20140329180 | Method Of Fabricating Substrate For Organic Light-Emitting Device - A substrate for an organic light-emitting device which can improve the light extraction efficiency of an organic light-emitting device while realizing an intended level of transmittance, a method of fabricating the same, and an organic light-emitting device having the same. Light emitted from the OLED is emitted outward through the substrate. The substrate includes a substrate body and a number of crystallized particles disposed inside the substrate body, the number of crystallized particles forming a pattern inside the substrate body. | 11-06-2014 |
20140334160 | Light Extraction Substrate For OLED, and OLED Including The Same - A light extraction substrate for an organic light-emitting device (OLED) which can improve the light extraction efficiency of an OLED, a method of fabricating the same and an OLED including the same. The light extraction substrate is disposed on one surface of an OLED through which light generated from the OLED is emitted outward. The light extraction substrate includes a base substrate, a light extraction layer disposed on the base substrate, and a number of crystallization particles disposed inside the light extraction layer. The light extraction layer is made of a glass frit that has a composition including ZnO, B | 11-13-2014 |
20140335637 | Method Of Fabricating Light Extraction Substrate For OLED - An organic light-emitting device (OLED) which can improve the light extraction efficiency of the OLED, a method of fabricating the same and an OLED including the same. The light extraction substrate is disposed on one surface of an OLED through which light generated from the OLED is emitted outward, and includes a base substrate and a light extraction layer formed on the base substrate. The light extraction layer has therein a plurality of pores which is formed on the base substrate such that the base substrate forms a bottom surface of the plurality of pores. | 11-13-2014 |
Patent application number | Description | Published |
20080278921 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME, AND PRINTED CIRCUIT BOARD - Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region. The method includes: preparing a PCB, the PCB including a plurality of chip regions and a scribe region; forming isolation regions dividing each of the chip regions into two parts, the isolation regions including inner isolation regions and outer isolation regions, the inner isolation regions being provided in the chip regions, the outer isolation regions being provided at both ends of the inner isolation regions so as to extend toward the scribe region; mounting semiconductor chips on the chip regions; and cutting the PCB along the scribe region to divide the chip regions into at least two parts. | 11-13-2008 |
20080308935 | SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP PACKAGE, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE - Provided are a semiconductor chip package, a semiconductor package, and a method of fabricating the same. In some embodiments, the semiconductor chip packages includes a semiconductor chip including an active surface, a rear surface, and side surfaces, bump solder balls provided on bonding pads formed on the active surface, and a molding layer provided to cover the active surface and expose portions of the bump solder balls. The molding layer between adjacent bump solder balls may have a meniscus concave surface, where a height from the active surface to an edge of the meniscus concave surface contacting the bump solder ball is about a 1/7 length of the maximum diameter of a respective bump solder ball at below or above a section of the bump solder ball having the maximum diameter. | 12-18-2008 |
20090212412 | SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING - Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can be easily stacked on another semiconductor package while the appearance cracks and the warpage defects can be prevented. | 08-27-2009 |
20100127381 | Integrated Circuit Devices Having Printed Circuit Boards Therein With Staggered Bond Fingers That Support Improved Electrical Isolation - An integrated circuit substrate includes an integrated circuit chip having a plurality of electrically conductive pads on a surface thereof and a printed circuit board mounted to the integrated circuit chip. The printed circuit board includes an alternating arrangement of first and second electrically conductive bond fingers. These first and second bond fingers are elevated at first and second different heights, respectively, relative to the plurality of electrically conductive pads. The printed circuit board also includes a first plurality of electrically insulating pedestals supporting respective ones of the first electrically conductive bond fingers at elevated heights relative to the second electrically conductive bond fingers. First and second pluralities of electrical interconnects (e.g., wires, beam leads) are also provided. The first plurality of electrical interconnects operate to electrically connect first ones of the plurality of electrically conductive pads to respective ones of the first electrically conductive bond fingers. The second plurality of electrical interconnects electrically connect second ones of the plurality of electrically conductive pads to respective ones of the second electrically conductive bond fingers. | 05-27-2010 |
Patent application number | Description | Published |
20120146425 | WIRELESS POWER TRANSMISSION/RECEPTION APPARATUS AND METHOD - Disclosed herein is a wireless power transmission/reception apparatus. The wireless power transmission/reception apparatus includes a wireless power transmission unit configured to generate a wireless power signal to be transmitted, transmit the wireless power signal using magnetic resonance, receive a reflected wireless power signal from a wireless power reception unit, determine whether a load device is present, and transmit a wireless power signal if it is determined that the load device is present in such a way that impedance and output power depending on variation in a distance to the load device are automatically tracked, and wireless power is supplied to the load device in an optimized state. A wireless to power reception unit is connected to the load device, and configured to receive the wireless power signal, provide the wireless power signal to the load device, and reflect a reflected wireless power signal towards the wireless power transmission unit. | 06-14-2012 |
20120217926 | WIRELESS POWER TRANSFER - Disclosed herein is a wireless power transfer system. The wireless power transfer system includes a wireless power transmitter receiving power input from the outside to generate a wireless power signal to be transmitted in wireless and transmitting the generated wireless power signal in wireless by a magnetic resonance manner using an LC serial-parallel resonance circuit; a wireless power receiver installed in a charging device to receive the wireless power signal transmitted from the wireless power transmitter by the magnetic resonance manner using the LC serial-parallel resonance circuit and output the received wireless power signal; and a charging circuit installed in the charging device to allow the power output from the wireless power receiver to charge an embedded battery, thereby making it possible to efficiently provide power in wireless. | 08-30-2012 |
20120280648 | APPARATUS AND METHOD FOR CHARGING WIRELINE AND WIRELESS POWERS - Disclosed herein are an apparatus and a method for charging wireline and wireless powers. The apparatus for charging wireline and wireless powers includes: a main battery; an auxiliary battery; a wireline charging module providing wireline power to the main and auxiliary batteries; and a wireless charging module connected to the wireline charging module to thereby provide wireless power to the main and auxiliary batteries. Therefore, wireline charging and the wireless charging may be simultaneously performed, thereby making it possible to save a time required to charge power and to improve the convenience for users according to various charging scenarios using the wireline charging and the wireless charging. | 11-08-2012 |
20130099729 | COIL STRUCTURE FOR WIRELESS CHARGING AND WIRELESS CHARGING APPARATUS HAVING THE SAME - The wireless charging apparatus according to the preferred embodiment of the present invention includes a control unit performing a general control of a wireless charging process; a driving unit connected to the control unit to generate a wireless power signal to be transmitted according to the control of the control unit; a transmission coil unit connected to the driving unit as a coil structure in a dumbbel form and transmitting wireless power according to the wireless power signal, the turn loop having a major-axis side of which one side is longer than the other side and at least one area is formed in a form depressed inwardly; and a sensing unit connected between the transmission coil unit and the control unit to detect whether the wireless charging receiver is positioned corresponding to the transmission coil unit and transfer the detected state to the control unit. | 04-25-2013 |
20130099730 | MULTI WIRELESS CHARGING APPARATUS AND METHOD FOR MANUFACTURING THE SAME - The multi wireless charging apparatus of the present invention includes a control unit generally controlling a wireless charging procedure; a plurality of wireless charging units electrically connected to the control unit; and folding units connecting between the wireless charging units, the folding units each having a void therein, which passes through both lateral surfaces thereof, and thereby to be folded up or down. | 04-25-2013 |
20160072340 | MULTI WIRELESS CHARGING APPARATUS AND METHOD FOR MANUFACTURING THE SAME - The multi wireless charging apparatus of the present invention includes a control unit generally controlling a wireless charging procedure; a plurality of wireless charging units electrically connected to the control unit; and folding units connecting between the wireless charging units, the folding units each having a void therein, which passes through both lateral surfaces thereof, and thereby to be folded up or down. | 03-10-2016 |