Patent application number | Description | Published |
20080231665 | INKJET PRINTHEAD, PRINTING METHOD USING THE SAME, AND METHOD OF MANUFACTURING THE INKJET PRINTHEAD - The inkjet printhead includes substrate having an ink feed hole formed to supply ink, a chamber layer stacked on the substrate, and including a plurality of main ink chambers formed therein with the ink feed hole therebetween and a plurality of compensation ink chambers formed therein between the main ink chambers that face each other; and a nozzle layer stacked on the chamber layer, and including a plurality of main nozzles corresponding to the main ink chambers and a plurality of compensation nozzles corresponding to the compensation ink chambers. | 09-25-2008 |
20080297564 | INKJET PRINTHEAD - An inkjet printhead includes a substrate in which an ink feed hole is formed, a plurality of ejection devices formed on the substrate at sides of the ink feed hole, a chamber layer stacked on the substrate and in which a plurality of ink chambers, which correspond to the ejection devices and in which ink supplied from the ink feed hole is filled, are formed, and a nozzle layer in which a plurality of nozzles corresponding to the ink chambers are formed, wherein the ink feed hole includes a plurality of through holes formed through the substrate in the thickness direction thereof. | 12-04-2008 |
20090001048 | METHOD OF MANUFACTURING INKJET PRINTHEAD - A method of manufacturing an inkjet printhead includes forming a chamber layer, in which a plurality of ink chambers is formed, on a substrate, forming trench to define an island surrounded by the trench on an upper part of the substrate by etching an upper surface of the substrate to a predetermined depth, forming a sacrifice layer on the chamber layer to fill the trenches and the ink chambers, forming a nozzle layer, in which a plurality of nozzles are formed, on the sacrifice layer and the chamber layer, forming an ink feed hole by etching a lower part of the substrate until the sacrifice layer that is filled in the trench is exposed, and removing the sacrifice layer and the island. | 01-01-2009 |
20090047605 | METHOD OF MANUFACTURING PHOTOSENSITIVE EPOXY STRUCTURE USING PHOTOLITHOGRAPHY PROCESS AND METHOD OF MANUFACTURING INKJET PRINTHEAD USING THE METHOD OF MANUFACTURING PHOTOSENSITIVE EPOXY STRUCTURE - Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation. | 02-19-2009 |
20090141083 | INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a silicon on insulator (SOI) substrate including a lower silicon substrate, a middle insulating layer, an upper silicon substrate, and an ink feed hole, the ink feed hole penetrates the SOI substrate to supply ink, an insulating layer stacked on the upper silicon substrate of the SOI substrate, a chamber layer stacked on the insulating layer in which a plurality of ink chambers filled with ink supplied from the ink feed hole is formed, a nozzle layer stacked on the chamber layer in which a plurality of nozzles is formed to correspond to the ink chambers, a plurality of heaters formed on the insulating layer which heats ink in the ink chambers to generate bubbles and eject ink through the nozzles, and a driving circuit region on which a driving circuit is formed to drive the heaters. | 06-04-2009 |
20090194025 | APPARATUS TO SENSE TEMPERATURE OF INK-JET HEAD - An apparatus to sense the temperature of an ink-jet head includes at least one or more CMOS (complementary metal oxide semiconductor) lateral BJTs (bipolar junction transistors) to sense the temperature of the ink-jet head, and a current supply unit to supply a current to the CMOS lateral BJTs. Minimum sized CMOS lateral BJTs are applied to an ink-jet printer head so that precise temperature control can be performed in a shuttle or array type ink-jet printer. | 08-06-2009 |
20090267990 | THERMAL INKJET PRINT HEAD - Provided is a thermal inkjet printhead that includes a substrate, which may comprise an ink feed hole for supplying ink, a chamber layer, which is stacked on the substrate, and which comprises an ink chamber that is filled with the ink supplied from the ink feed hole, a heater, which is prepared inside the ink chamber and heats the ink, an island, which is formed on the substrate, and which is prepared at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, and which comprises a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle. | 10-29-2009 |
20090278898 | METHOD OF MANUFACTURING INKJET PRINTHEAD AND INKJET PRINTHEAD MANUFACTURED USING THE SAME - A method of manufacturing an inkjet printhead includes forming a heater and an electrode on a substrate, forming a flow path forming layer by coating a first negative photoresist composition on the substrate, forming a sacrifice layer, planarizing the flow path forming layer and the sacrifice layer, forming a nozzle layer by coating a second negative photoresist composition on the flow path forming layer, forming an ink feed hole in the substrate, and eliminating the sacrifice layer, wherein the first and second negative photoresist compositions include a prepolymer which comprises one selected from the group consisting of a glycidyl ether functional group, a ring-opened glycidyl ether functional group, and an oxytein functional group in a monomer repeat unit, and one selected from the group consisting of a phenol novolac resin-based backbone, a bisphenol-A-based backbone, a bisphenol-F-based backbone, and an alicyclic backbone; a cationic initiator; a solvent; and a plasticizer. | 11-12-2009 |
20100002036 | APPARATUS FOR AND METHOD OF CONTROLLING JETTING OF INK IN INKJET PRINTER - Provided are an apparatus and method of controlling jetting of ink of an inkjet printer. The apparatus includes at least one print head chip, which includes a temperature sensor for sensing the temperature of the print head chip and a voltage controlled oscillator (VCO) for converting the sensed temperature to a frequency component. The apparatus may also include a counter, which converts the frequency component to a code information using a reference frequency component, and a controller, which controls the ink jetting operation of the at least one print head chip based on the code information and/or the frequency component. | 01-07-2010 |
20100020136 | INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes: a substrate having an ink feed hole extending therethrough; a chamber layer including a plurality of ink chambers above the substrate; a nozzle layer including a plurality of nozzles above the chamber layer; and at least one support beam formed in the substrate to connect inner walls of the ink feed hole. | 01-28-2010 |
20100051580 | METHOD OF MANUFACTURING INKJET PRINTHEAD - A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole. | 03-04-2010 |
20100053272 | INK EJECTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes. | 03-04-2010 |
20100171793 | INK FEEDHOLE OF INKJET PRINTHEAD AND METHOD OF FORMING THE SAME - An ink feedhole of an inkjet printhead and a method of forming the same includes an ink feedhole that penetrates a substrate and has a width that narrows in an upper direction of the substrate, wherein at least one internal wall of the ink feedhole has a plurality of steps and inclines with respect to a surface of the substrate. | 07-08-2010 |
20130092560 | ELECTRODE SYSTEM AND METHOD FOR CALCULATING CHARACTER VALUES OF SOLUTION USING THE SAME - Disclosed is an electrode system capable of more accurately measuring properties of solutions using a porous platinum electrode. The electrode system includes a low porosity platinum electrode in which platinum is deposited in a porous form on the surface of an electrode, and a high porosity platinum electrode having a higher roughness factor than the low | 04-18-2013 |